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Advances in Interconnect Technologies: An International Journal(AITIJ)
Call for papers
Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant
contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis,
modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in
industry and academia. High quality review papers and short communications are also acceptable.
Research areas suitable for publication include, but are not limited to the following fields:

Emerging Materials
CNT/ Graphene Interconnects
Modeling and Simulation
Optical Interconnects
Wireless Interconnects
Microstrip Lines
Analog and Mixed Signals
Dedicated Software and Systems for Developing Interconnect Technology
On-Chip and Off-Chip Interconnects
Fabrication Techniques
Neural Networks
Parasitics Issues
Optimization Techniques

Paper Submission
Authors are invited to submit papers for this journal through E-mail: or Submissions must be original and should not have been published previously or be under
consideration for publication while being evaluated for this Journal.
Important Dates
Submission Deadline
Final Manuscript Due
Publication Date


July 26, 2015

August 26, 2015
September 10, 2015
Determined by the Editor-in-Chief

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