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TPD4E6B06
SLVSCK3 MAY 2014
3 Description
Device Information(1)
PART NUMBER
PACKAGE
2 Applications
TPD4E6B06
Audio Lines
Microphone
Earphone
Speakerphone
SD Interface
SIM Interface
Mobile Keyboard or Other Buttons
Cell Phones
eBook
Portable Media Players
Digital Camera
Tablet PC
Wearables
X2SON (4)
0.80 mm 0.80 mm
4 Simplified Schematic
2
GND
System
Connector
1
1
GND
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPD4E6B06
SLVSCK3 MAY 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
3
7.1
7.2
7.3
7.4
7.5
7.6
3
3
4
4
4
5
10 Layout................................................................... 10
10.1 Layout Guidelines ................................................. 10
10.2 Layout Examples................................................... 10
5 Revision History
DATE
REVISION
NOTES
May 2014
Initial release.
TPD4E6B06
www.ti.com
IO1
IO2
2
GND
IO3
IO4
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
NO
IO1
IO
IO2
IO
IO3
IO
IO4
IO
GND
Ground
7 Specifications
7.1 Absolute Maximum Ratings (1) (2)
over operating free-air temperature range (unless otherwise noted)
Operating Temperature
IEC 61000-4-5 Current (tp 8/20 s)
Peak Pulse
(1)
(2)
(3)
MIN
MAX
UNIT
-40
125
(3)
40
V(ESD)
(1)
(2)
Electrostatic discharge
MIN
MAX
UNIT
65
155
kV
500
500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as 2 kV
may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as 500 V
may actually have higher performance.
TPD4E6B06
SLVSCK3 MAY 2014
www.ti.com
MAX
UNIT
VIO
5.5
5.5
TA
40
125
DPW
UNIT
5 PINS
RJA
291.8
RJC(top)
224.2
RJB
245.8
JT
31.4
JB
245.6
RJC(bot)
195.4
(1)
C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
TEST CONDITION
MIN
VRWM
IIO = 10 A
VBRF
Break-down voltage
IIO to GND = 1 mA
VBRR
Break-down voltage
IGND to IO = 1 mA
ILEAK
Leakage current
VIO = 5 V
VCLAMP
RDYN
Dynamic resistance
CL
IO Capacitance
(1)
(2)
TYP
5.5
MAX
5.5
UNIT
V
V
V
100
nA
10
(1)
I = 5 A, IO to GND, 8/20 s
13
13
(2)
0.75
0.65
4.8
pF
TPD4E6B06
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60
10
50
40
10
Amplitude (dB)
30
20
20
30
10
40
50
10
15
15
30
45
60 75 90
Time (ns)
60
15
10
8
Current (A)
Current (A)
45
60 75 90
Time (ns)
6
5
4
6
5
4
1
0
12
15
18
Voltage (V)
21
24
27
30
G003
12
15
18
Voltage (V)
21
24
27
30
G004
0.0010
4.0
0.0008
3.6
0.0006
3.2
40
0.0004
2.8
35
2.4
30
2.0
25
1.6
20
0.0004
1.2
15
0.0006
0.8
10
0.4
Current (A)
Current (A)
30
RDYN = 0.42
tPW = 100 ns*
tRISE = 10 ns*
15
RDYN = 0.45
tPW = 100 ns*
tRISE = 10 ns*
G001
0.0002
0.0000
0.0002
0.0008
0.0010
10 8
0.0
0
2
4
Voltage (V)
10
12
Current
Power
10
15
20
25
30
Time (s)
35
40
45
50
45
Power (W)
Voltage (V)
0
G006
G005
Figure 5. IV Curve
TPD4E6B06
SLVSCK3 MAY 2014
www.ti.com
45
5.8
3.2
40
5.6
2.8
35
5.4
2.4
30
2.0
25
1.6
20
1.2
15
0.8
10
0.4
Current (A)
0.0
10
15
20
25
30
Time (s)
35
40
45
50
Power (W)
Current
Power
3.6
Capacitance (pF)
50
4.0
5.2
5.0
4.8
4.6
4.4
4.2
4.0
0.5
Loss (dB)
1.5
G007
2
2.5
3
Bias Voltage (V)
3.5
4.5
5
G008
Figure 8. Capacitance
3
0
3
6
9
12
15
18
21
24
27
30
33
100k
1M
10M
100M
Frequency (Hz)
1G
3G
G009
TPD4E6B06
www.ti.com
8 Detailed Description
8.1 Overview
The TPD4E6B06 is a four channel ESD Protection device in an ultra small DPW package. It is the industrys
smallest 4-CH ESD protection device with 0.48-mm pitch. This larger pitch helps save on PCB manufacturing
costs. The device provides IEC61000-4-2 compliance up to 15-kV contact discharge. It has an ESD clamp circuit
with back-to-back diodes for bipolar/bidirectional signal support. The 4.8-pF (Typ) line capacitance is suitable for
a wide range of applications supporting frequencies up to 700 MHz.
IO1
IO2
IO3
IO4
GND
TPD4E6B06
SLVSCK3 MAY 2014
www.ti.com
System
Connector
GND
EXAMPLE VALUE
5.5 V to 5.5 V
Operating Frequency
Up to 700 MHz
TPD4E6B06
www.ti.com
Loss (dB)
1M
10M
100M
Frequency (Hz)
1G
3G
G009
TPD4E6B06
SLVSCK3 MAY 2014
www.ti.com
10 Layout
10.1 Layout Guidelines
= VIA
GND
10
TPD4E6B06
www.ti.com
11.3 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
11
www.ti.com
21-Apr-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
TPD4E6B06DPWR
ACTIVE
DPW
3000
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-1-260C-UNLIM
Op Temp (C)
Device Marking
(4/5)
-40 to 125
B1
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
www.ti.com
21-Apr-2015
Addendum-Page 2
18-Sep-2014
Device
TPD4E6B06DPWR
DPW
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
9.5
Pack Materials-Page 1
0.94
B0
(mm)
K0
(mm)
P1
(mm)
0.94
0.5
2.0
W
Pin1
(mm) Quadrant
8.0
Q1
18-Sep-2014
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPD4E6B06DPWR
X2SON
DPW
3000
184.0
184.0
19.0
Pack Materials-Page 2
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