You are on page 1of 5

GP1A30R

OPIC Photointerrupter with Encoder


GP1A30R Function

■ Features ■ Outline Dimensions ( Unit : mm )


1. 2-phase ( A, B ) digital output Internal connection diagram
2. Possible to use plastic disk 6
1 5

2- φ2.0 ± 0.1
3. High sensing accuracy
2 4
( Disk slit pitch : 0.7mm )

OPIC
3
OPIC
4. TTL compatible output 1 Anode 4 GND
5. Compact and light 2 Cathode 5 V CC
0.8 ± 0.15 2.0 ± 0.15 3 V OB 6 V OA
12.0
■ Applications 7.5 ± 0.1 4 - R2.5 8.0
4 ± 0.15 6.0
1. Electronic typewriters, printers

1.4 ± 0.15
2. Numerical control machines

GP1A30R
6.4 ± 0.15

11.4
10.5MIN. 9.9

6.4
8.0MIN. 4.4

2.5 ± 0.15
4 - R1.3 ± 0.15

(7.25) (1.27) 15.0 ± 0.15


■ Absolute Maximum Ratings ( Ta= 25˚C ) 20.0
3 4
Parameter Symbol Rating Unit 2

3 - (1.27)
Forward current IF 65 mA
(2.54)

* Tolerance :± 0.3mm
*1
Peak forward current I FM 1 A * ( ) : Reference dimensions
Input
Reverse voltage VR 6 V 1
5 6
Power dissipation P 100 mW
Supply voltage VCC 7 V *“ OPIC” ( Optical IC ) is a trademark of the SHARP Corporation.
An OPIC consists of a light-detecting element and signal-
Output Low level output current I OL 20 mA
processing circuit integrated onto a single chip.
Power dissipation PO 250 mW
Operating temperature T opr 0 to + 70 ˚C
Storage temperature T stg - 40 to + 80 ˚C
*2
Soldering temperature Tsol 260 ˚C
*1 Pulse width <= 100µ s, Duty ratio= 0.01 *2 For 5 seconds

■ Electro-optical Characteristics ( Unless otherwise specified, Ta = 0 to + 70˚C )


Parameter Symbol Conditions MIN. TYP. MAX. Unit
Forward voltage VF Ta= 25˚C, I F = 30mA - 1.2 1.5 V
Input
Reverse current IR Ta= 25˚C, V R = 3V - - 10 µA
Operating supply voltage VCC 4.5 5.0 5.5 V
*3
High level output voltage VOH V CC= 5V, I F = 30mA 2.4 4.9 - V
Output *3
Low level output voltage VOL I OL = 8mA, V CC = 5V, I F = 30mA - 0.1 0.4 V
*3*4
Supply current I CC I F = 30mA, V CC= 5V - 5 20 mA
*5 DA V CC= 5V, I F = 30mA, 20 50 80 %
Transfer Duty ratio *3
charac- *5 DB f= 2.5kHz 20 50 80 %
teristics Response frequency f MAX. *3
V CC= 5V, I F = 30mA - - 5 kHz
*3 Measured under the condition shown in Measurement Conditions. *5
*4 In the condition that output A and B are low level. t AH t BH
DA = x 100, DB = x 100
t AP t BP

“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
GP1A30R

■ Output Waveforms

Output A
( VOA)
t AH
t AP

Output B
( VOB)
t AB1 t BH

t BP

Rotational direction: Counterclockwise when seen


from OPIC light detector

Fig. 1 Forward Current vs. Ambient Fig. 2 Output Power Dissipation vs.
Temperature Ambient Temperature
100 300
90
250
Output power dissipation Po ( mW )

80
Forward current I F ( mA )

70
65 200
60

50 150

40
100
30

20
50
10

0 0
0 25 50 70 75 100 0 25 50 70 75 100
Ambient temperature Ta ( ˚C ) Ambient temperature Ta ( ˚C )

Fig. 3 Duty Ratio vs. Frequency Fig. 4 Phase Difference vs. Frequency

0.9 130
VCC = 5V V CC = 5V
0.8 I F = 30mA 120 I F = 30mA
T a = 25˚C T a = 25˚C
Phase differenceθ AB1 ( deg. )

0.7 110
t ABI
0.6 t AH 100 θ AB1 =x 360˚
t AP
t AP ( Output A )
Duty ratio

0.5 90

0.4 80
t BH
( )
t BP Output B
0.3 70

0.2 60

0.1 50
1 2 5 10 20 1 2 5 10 20
Frequency f ( kHz ) Frequency f ( kHz )
GP1A30R

Fig. 5 Duty Ratio vs. Ambient Temperature Fig. 6 Phase Difference vs. Ambient
Temperature
1.0 140
V CC = 5V V CC = 5V
0.9 I F = 30mA 130 I F = 30mA
f = 2.5kHz f = 2.5kHz
0.8 120

Phase difference θ AB1 ( deg. )


t AH
0.7 t AP ( Output A ) 110
t AB1
0.6 t BH 100 θ AB1 = x 360˚
( Output B ) t AP
Duty ratio

t BP
0.5 90
0.4 80

0.3 70

0.2 60

0.1 50
0 40
0 25 50 75 100 0 25 50 75 100
Ambient temperature Ta ( ˚C ) Ambient temperature Ta ( ˚C )

Fig. 7 Duty Ratio vs. Distance ( X direction ) Fig. 8 Phase Difference vs.
Distance ( X direction )
0.9 130
V CC = 5V V CC = 5V
I F = 30mA I F = 30mA
0.8 120
f= 2.5kHz f= 2.5kHz
T a = 25˚C Ta = 25˚C
Phase difference θ AB1 ( deg. )

0.7 110
t AH
t AP ( Output A )
0.6 100 t ABI
t BH θ AB1= x 360˚
( Output B )
Duty ratio

t BP t AP
0.5 90
Reference position
0.4 80 (- ) ( +)

0.3 70
GP1A30R
0.2 60
Disk
0.1 50
- 1.0 - 0.5 0 0.5 1.0 - 1.0 - 0.5 0 0.5 1.0
Distance X ( mm ) ( Shifting encoder ) Distance X ( mm ) ( Shifting encoder )

Fig. 9 Duty Ratio vs. Distance ( Y direction ) Fig.10 Phase Difference vs.
Distance ( Y direction )
0.9 130
V CC = 5V VCC = 5V
I F = 30mA I F = 30mA
0.8 120
f= 2.5kHz f= 2.5kHz
Phase difference θ AB1 ( deg. )

T a = 25˚C T a = 25˚C
0.7 110
t AH
( Output A )
t AP t AB1
0.6 100 θ AB1 = x 360˚
Duty ratio

t BH t AP
( Output B )
t BP
0.5 90
GP1A30R
0.4 80
(+)
Reference
0.3 70 position
(-)
0.2 60
Disk
0.1 50
- 1.0 - 0.5 0 0.5 1.0 - 1.0 - 0.5 0 0.5 1.0
Distance Y ( mm ) ( Shifting encoder ) Distance Y ( mm ) ( Shifting encoder )
GP1A30R

Fig.11 Duty Ratio vs. Distance ( Z direction ) Fig.12 Phase Difference vs.
Distance ( Z direction )
0.9 130
V CC = 5V VCC = 5V
I F = 30mA I = 30mA
0.8 120 F
f= 2.5kHz f= 2.5kHz

Phase difference θ AB1 ( deg. )


T a = 25˚C T = 25˚C
0.7 110 a
t AH
( Output A ) t AB1
t AP θ AB1 =
0.6 100 t AP x 360˚
t BH
( Output B )
Duty ratio

t BP
0.5 90

0.4 80
( Detecting side )
0.3 70 Z
Disk
OPIC
0.2 60
( Emitting side )
0.1 50
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Distance Z ( mm ) ( Shifting encoder ) Distance Z ( mm ) ( Shifting encoder )

■ Measurement Conditions
<Basic Design>
A
R O ( distance between the disk center and half point of a slit ) ,
P ( slit pitch ) , S 1 and S 2 ( installing position of photointer-
4-R1.3
rupter ) will be provided by the following equations.
Slit pitch : P ( slit center )
3
5

N
.4
13

R O= 120 x 13.45 ( mm ) N: number of slits


8
R

GP1A30R
15

20

2x p x RO
P= ( mm )
N
S 1= R O- 1.765 ( mm ) , S 2= S 1+ 6.7( mm )
1.4
Note ) When the number of slits is changed, values in parenthesis
6.4 are also changed according to the number.
S2
Disk center
(18.385)

φ 31.6, 0.1t 11.4


Disk
120 slits
( Ex. ) In the case of
0.3

Enlarged drawing
of A portion N= 200P/R
Slit pitch : P
12

200
7.5

R O= x 13.45 ( mm )
120
0.8 2

= 22.42mm
A
2 x p x 22.42
r2

S1 9.9 P= ( mm )
P 200
(11.685 )
= 0.704mm
■ Precautions for Use
r1

S 1= 22.42- 1.765
( 1 ) This module is designed to be operated = 20.655mm
r1= r2 S 2= 20.655+ 6.7
at I F = 30mA TYP.
= 27.355mm
( 2 ) Fixing torque : MAX. 0.6Nm (6kgf • cm )
( 3 ) In order to stabilize power supply line, Disk center

connect a by-pass capacitor of more than 0.01µF


between Vcc and GND near the device.
( 4 ) As for other general cautions, refer to
the chapter “ Precautions for Use ” .
This datasheet has been download from:

www.datasheetcatalog.com

Datasheets for electronics components.