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# Solved with COMSOL Multiphysics 5.

2

Forced Convection Cooling of an
Enclosure with Fan and Grille
Introduction
This study simulates the thermal behavior of a computer power supply unit (PSU).
Such electronic enclosures typically include cooling devices to avoid electronic
components being damaged by excessively high temperatures. In this application, an
extracting fan and a perforated grille generate an air flow in the enclosure to cool
internal heating.
Air extracted from the enclosure is related to the static pressure (the pressure difference
between outside and inside), information that is generally provided by the fan
manufacturers as a curve representing fluid velocity as a function of pressure difference.
As shown in Figure 1, the geometry is rather complicated and requires a fine mesh to
solve. This results in large computational costs in terms of time and memory.

Figure 1: The complete model geometry.

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FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE

Solved with COMSOL Multiphysics 5.2

Model Definition
Figure 1 shows the geometry of the PSU. It is composed of a perforated enclosure of
14 cm-by-15 cm-by-8.6 cm and is made of aluminum 6063-T83. Inside the
enclosure, only obstacles having a characteristic length of at least 5 mm are
represented.
The bottom of the box represents the printed circuit board (PCB). It has an
anisotropic thermal conductivity of 10, 10, and 0.36 W/(m·K) along the x-, y-, and
z-axes, respectively. Its density is 430 kg/m3 and its heat capacity at constant pressure
is 1100 J/(kg·K). Because the thermal conductivity along the z-axis is relatively low,
and that the PCB and the enclosure sides are separated by a thin air layer, it is not
necessary to model the bottom wall, nor take into account the cooling on these sides.
The capacitors are approximated by aluminum components. The heat sink fins and the
enclosure are made of the same aluminum alloy. The inductors are mainly composed
of steel cores and copper coils. The transformers are made of three materials: copper,
steel, and plastic. The transistors are modeled as two-domain components: a core made
of silicon held in a plastic case. The core is in contact with an aluminum heat sink to
allow a more efficient heat transfer. Air speed is assumed to be slow enough for the
flow to be considered as laminar.
The simulated PSU consumes a maximum of 230 W. Components have been grouped
and assigned to various heat sources as listed in Table 1. The overall heat loss is 41 W,
which is about 82% of efficiency.
TABLE 1: HEAT SOURCES OF ELECTRONIC COMPONENTS

Components

Dissipated heat rate (W)

Transistor cores

25

Large transformer coil

5

Small transformer coils

3

Inductors

2

Large capacitors

2

Medium capacitors

3

Small capacitors

1

The inlet air temperature is set at 30 °C because it is supposed to come from the
computer case in which air has already cooled other components. The inlet boundary
is configured with a Grille boundary condition. This pressure must describe head loss
caused by air entry into the enclosure. The head loss coefficient kgrille is represented

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FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE

89 where α is the opening ratio of the grille. the inductor surfaces. 3 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . is given by 2 ρU ΔP = k grille ----------2 where ρ is the density (kg/m3).2 by the following 6th order polynomial (Ref. and U is the velocity magnitude (m/s). The box.5α + 462. Figure 2: Head loss coefficient as a function of the opening ratio. ΔP (Pa).Solved with COMSOL Multiphysics 5. The head loss. the PCB. 1): 6 5 4 k grille = 12084α – 42281α + 60989α – 46559α 3 (1) 2 + 19963α – 4618. and the heat sink fins are configured as thin conductive layers.

Figure 3 shows that they are significantly cooled by the aluminum heat sinks. Figure 3: Temperature and fluid velocity fields.Solved with COMSOL Multiphysics 5.6 m/s. On the flow side. air avoids obstacles and tends to go through the upper space of the enclosure. Although transistor cores are rather hot. 4 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . The components furthest away from the air inlet are subject to the highest temperature. The printed circuit board has a significant impact as well by distributing and draining heat off. The maximum velocity is about 1.2 Results and Discussion The most interesting aspect of this simulation is to locate which components are subject to overheating. Figure 3 clearly shows that the temperature distribution is not homogeneous. The maximum temperature is about 70 °C and is located at one of the transistor cores.

the fluid flow is impacted by obstacles and yields to local head losses. You just need to provide a few points of a static pressure curve to configure this boundary condition. 5 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . Blevins. Reference 1. Van Nostrand Reinhold. Figure 4: Pressure isosurfaces show the head loss created by electronic components. provided by fan manufacturers. 1984. Applied Fluid Dynamics Handbook. R.Solved with COMSOL Multiphysics 5. which is completely adapted for thin geometries and significantly reduces the number of degrees of freedom in the model.2 Figure 4 shows the head loss created by obstacles encountered by air on its path. COMSOL Multiphysics provides a useful boundary condition for modeling fan behavior. most of the time.D. As shown in Figure 4. These data are. Notes About the COMSOL Implementation To model heat sink fins. enclosure walls and circuit board it is strongly recommended to use the Thin Layer feature.

6 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE .8 8 Click the Plot button. Define an analytic function to represent the polynomial expression of the head loss coefficient (Equation 1). type 12084*OR^6-42281*OR^5+60989*OR^4-46559*OR^3+19963*OR^2-4618. GLOBAL DEFINITIONS Analytic 1 (an1) 1 On the Home toolbar.Solved with COMSOL Multiphysics 5.89. type 1. type m^-4. choose Open. This coefficient is a function of the open ratio OR of the grille. 1 From the File menu.mph. 2 Browse to the application’s Application Library folder and double-click the file electronic_enclosure_cooling_geom. In the Arguments text field. In the Expression text field. 4 In the Arguments text field. type k_grille in the Function name text field. 2 In the Settings window for Analytic. 7 Locate the Plot Parameters section. Start by loading this file. type OR. 5 Locate the Units section. enter the following settings: Argument Lower limit Upper limit OR 0 0. In the table.mph contains a parameterized geometry and prepared selections for the model. 3 Locate the Definition section. click Functions and choose Global>Analytic. 6 In the Function text field.5*OR+ 462.2 Application Library path: Heat_Transfer_Module/ Power_Electronics_and_Electronic_Cooling/ electronic_enclosure_cooling Modeling Instructions ROOT The file electronic_enclosure_cooling_geom.

choose Boundary. select Built-In>Aluminum. locate the Geometric Entity Selection section. 3 From the Selection list. locate the Geometric Entity Selection section. 2 In the tree. under Component 1 (comp1)>Materials click Aluminum 6063-T83 (mat3). ADD MATERIAL 1 Go to the Add Material window. choose Aluminum Boundaries. 8 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . 3 Click Add to Component in the window toolbar.2 MATERIALS Aluminum 6063-T83 (mat3) 1 In the Model Builder window. 2 In the Settings window for Material. MATERIALS Aluminum (mat5) 1 In the Model Builder window. choose Capacitors. ADD MATERIAL 1 Go to the Add Material window. ADD MATERIAL 1 Go to the Add Material window. 3 From the Geometric entity level list. locate the Geometric Entity Selection section. 3 From the Selection list. 2 In the Settings window for Material. 4 From the Selection list. 3 Click Add to Component in the window toolbar. select Built-In>Steel AISI 4340. MATERIALS Steel AISI 4340 (mat4) 1 In the Model Builder window.Solved with COMSOL Multiphysics 5. 2 In the tree. under Component 1 (comp1)>Materials click Steel AISI 4340 (mat4). choose Steel Parts. under Component 1 (comp1)>Materials click Aluminum (mat5). 2 In the Settings window for Material.

3 From the Selection list. 2 In the tree. 3 From the Geometric entity level list. choose Copper Layers.Solved with COMSOL Multiphysics 5. 2 In the Settings window for Material. 2 In the tree. select Built-In>Copper. choose Boundary. MATERIALS Copper (mat6) 1 In the Model Builder window. 3 Click Add to Component in the window toolbar. choose Boundary. under Component 1 (comp1)>Materials click Copper (mat6). locate the Geometric Entity Selection section. under Component 1 (comp1)>Materials click Copper 1 (mat7). ADD MATERIAL 1 Go to the Add Material window. select Built-In>Copper.2 2 In the tree. 2 In the Settings window for Material. 3 Click Add to Component in the window toolbar. MATERIALS FR4 (Circuit Board) (mat8) 1 In the Model Builder window. 4 From the Selection list. locate the Geometric Entity Selection section. MATERIALS Copper 1 (mat7) 1 In the Model Builder window. choose Transformer Coils. 9 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . ADD MATERIAL 1 Go to the Add Material window. 2 In the Settings window for Material. select Built-In>FR4 (Circuit Board). 3 Click Add to Component in the window toolbar. locate the Geometric Entity Selection section. under Component 1 (comp1)>Materials click FR4 (Circuit Board) (mat8). 3 From the Geometric entity level list.

under Component 1 (comp1)>Heat Transfer (ht) click Initial Values 1. select Built-In>Silicon. 2 In the Settings window for Heat Transfer in Fluids. 3 From the Selection list. H E A T TR A N S F E R ( H T ) Heat Transfer in Fluids 1 1 In the Model Builder window. choose Circuit Board. The next steps define the boundary conditions of the model.3} W/(m·K) Basic ADD MATERIAL 1 Go to the Add Material window. expand the Component 1 (comp1)>Heat Transfer (ht) node. locate the Initial Values section. click Add Material to close the Add Material window.2 4 From the Selection list. 10 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . under Component 1 (comp1)>Materials click Silicon (mat9). 2 In the Settings window for Initial Values. then click Heat Transfer in Fluids 1. 10. 3 From the Selection list. In the table. 2 In the tree. Initial Values 1 1 In the Model Builder window. locate the Domain Selection section. 3 In the T text field. 5 Locate the Material Contents section. choose Transistors Silicon Cores. Modify the thermal conductivity of the FR4 material to model anisotropic properties of a printed circuit board. 4 On the Home toolbar. enter the following settings: Property Name Value Unit Property group Thermal conductivity k {10. 0. choose Air. type T0. 2 In the Settings window for Material.Solved with COMSOL Multiphysics 5. MATERIALS Silicon (mat9) 1 In the Model Builder window. 3 Click Add to Component in the window toolbar. locate the Geometric Entity Selection section.

click Domains and choose Heat Source. click Domains and choose Heat Source. Heat Source 1 1 On the Physics toolbar. choose Large Transformer Coil.Solved with COMSOL Multiphysics 5. type Heat Source 1: Transistors in the Label text field. type 25. From the Selection list. 2 In the Settings window for Heat Source. define the heat rate produced by similar groups of components. Click the Overall heat transfer rate button.2 Now. 2 In the Settings window for Heat Source. type 3. 3 Locate the Domain Selection section. choose Inductors. 3 Locate the Domain Selection section. 11 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . Heat Source 3 1 On the Physics toolbar. 3 Locate the Heat Source section. 4 Locate the Heat Source section. type Heat Source 3: Small Transformer Coils in the Label text field. From the Selection list. 2 In the Settings window for Heat Source. 2 In the Settings window for Heat Source. From the Selection list. Click the Overall heat transfer rate button. Click the Overall heat transfer rate button. choose Small Transformer Coils. choose Transistors Silicon Cores. click Domains and choose Heat Source. type Heat Source 4: Inductor in the Label text field. click Domains and choose Heat Source. 4 Locate the Heat Source section. Table 1 summarizes the values chosen for each group. Heat Source 4 1 On the Physics toolbar. 5 In the P0 text field. 5 Locate the Domain Selection section. Heat Source 2 1 On the Physics toolbar. 4 In the P0 text field. type 5. type Heat Source 2: Large Transformer Coil in the Label text field. 4 Locate the Heat Source section. 5 In the P0 text field. Click the Overall heat transfer rate button. From the Selection list. 3 Locate the Domain Selection section.

type Heat Source 6: Medium Capacitors in the Label text field. 2 In the Settings window for Heat Source. From the Selection list. In the T0 text field. 2 In the Settings window for Heat Source. 3 Locate the Domain Selection section. click Boundaries and choose Thin Layer. Temperature 1 1 On the Physics toolbar. choose Large Capacitors. choose Grille. use the Thin Layer boundary condition on thin domains made of aluminum. Heat Source 7 1 On the Physics toolbar. type 2. 4 Locate the Temperature section. choose Small Capacitors. click Boundaries and choose Temperature.Solved with COMSOL Multiphysics 5. 5 In the P0 text field. 5 In the P0 text field. From the Selection list. 3 Locate the Domain Selection section. Click the Overall heat transfer rate button. click Domains and choose Heat Source. To model heat transfer in thin conductive parts of the enclosure. 2 In the Settings window for Heat Source. Thin Layer 1 1 On the Physics toolbar. 5 In the P0 text field. type 3. 4 Locate the Heat Source section. 3 Locate the Domain Selection section. locate the Boundary Selection section. click Domains and choose Heat Source. 3 From the Selection list. 4 Locate the Heat Source section. type Heat Source 7: Small Capacitors in the Label text field. 12 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . Heat Source 6 1 On the Physics toolbar. choose Medium Capacitors. type 1. type T0. click Domains and choose Heat Source. 4 Locate the Heat Source section. From the Selection list. Click the Overall heat transfer rate button. Click the Overall heat transfer rate button. type Heat Source 5: Large Capacitors in the Label text field. Heat Source 5 1 On the Physics toolbar.2 5 In the P0 text field. type 2. 2 In the Settings window for Temperature. copper and FR4.

Outflow 1 1 On the Physics toolbar. choose Air. locate the Boundary Selection section. locate the Boundary Selection section. 2 In the Settings window for Turbulent Flow. click Boundaries and choose Fan. under Component 1 (comp1) click Turbulent Flow. TU R B U L E N T F L O W. the flow can not be regarded as incompressible. 3 From the Selection list. A L G E B R A I C Y P L U S ( S P F ) 1 In the Model Builder window. choose Fins. The thin heat sink fins are represented by interior boundaries in the geometry. Algebraic yPlus.3). choose Fan. locate the Domain Selection section. locate the Boundary Selection section. From the Compressibility list. 3 From the Selection list. type 2[mm]. the fan condition is set up by loading a data file for the static pressure curve. 2 In the Settings window for Outflow. Interior Wall 1 1 On the Physics toolbar. 3 From the Selection list. Fan 1 1 On the Physics toolbar. Since the density variation is not small. choose Conductive Layers. Algebraic yPlus (spf). An interior wall condition is used to prevent the fluid from flowing through these boundaries. 4 Locate the Thin Layer section. Here. Therefore set the flow to be compressible. 3 From the Selection list. 3 From the Selection list. click Boundaries and choose Interior Wall. 5 In the ds text field. choose Fan. choose Conductive. 2 In the Settings window for Interior Wall.Solved with COMSOL Multiphysics 5. choose Compressible flow (Ma<0. From the Layer type list. 13 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE .2 2 In the Settings window for Thin Layer. 2 In the Settings window for Fan. click Boundaries and choose Outflow. 4 Locate the Physical Model section. locate the Boundary Selection section.

txt. 6 Locate the Static Pressure Curve Data section.Solved with COMSOL Multiphysics 5. choose Outlet. 8 Locate the Static Pressure Curve Interpolation section.2 4 Locate the Flow Direction section. From the Flow direction list. 2 In the Settings window for Grille. From the Interpolation function type list. choose Piecewise cubic. 5 Locate the Parameters section. The Graphics window displays an arrow indicating the orientation of the flow through the fan. locate the Boundary Selection section. Proceed to create the corresponding boundary condition. choose Static pressure curve data. Compare with the figure below. From the Static pressure curve list. 3 From the Selection list. Click Load from File. Grille 1 1 On the Physics toolbar. 7 Browse to the application’s Application Library folder and double-click the file electronic_enclosure_cooling_fan_curve. The exhaust fan previously defined extracts air entering from an opposite grille. 14 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . choose Grille. click Boundaries and choose Grille.

locate the Element Size section. 6 In the associated text field. 2 In the Settings window for Mapped. 9 Click the Build Selected button. 5 In the qlc text field.4. locate the Boundary Selection section. locate the Initial Values section.rho/2. under Component 1 (comp1) right-click Mesh 1 and choose More Operations>Mapped. Size 1 1 Right-click Component 1 (comp1)>Mesh 1>Mapped 1 and choose Size. Start by discretizing the surfaces of key components. From the Static pressure curve list. 15 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . type k_grille(OR)*nitf1. 2 In the Settings window for Initial Values. Select the Maximum element size check box. choose Finer. Initial Values 1 1 In the Model Builder window. 3 From the Predefined list. 5 Locate the Element Size Parameters section. Select the Adjust evenly distributed edge mesh check box. 7 Select the Minimum element size check box. type 0. Locate the Advanced Settings section. Mapped 1 1 In the Model Builder window. type 0. Boundary layers at walls are added at the end.2 4 Locate the Parameters section.5. Algebraic yPlus (spf) click Initial Values 1. 3 From the Selection list. 4 Click the Custom button. 3 Specify the u vector as 1 x MESH 1 You now configure the meshing part. choose Wire Group Surface. 4 Click to expand the Advanced settings section. choose Quadratic loss. 2 In the Settings window for Size.Solved with COMSOL Multiphysics 5. 8 In the associated text field. under Component 1 (comp1)>Turbulent Flow. They would drive the tetrahedral mesh of the whole domain.

3 From the Calibrate for list. 3 From the Selection list. 2 In the Settings window for Mapped. type 0. locate the Boundary Selection section. Select the Maximum element size check box. Size 1 1 Right-click Component 1 (comp1)>Mesh 1>Mapped 2 and choose Size. choose Extra fine. 6 Locate the Element Size Parameters section. 7 In the associated text field. Select the Adjust evenly distributed edge mesh check box. locate the Element Size section. right-click Mesh 1 and choose More Operations>Mapped. 16 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . 2 In the Settings window for Size. choose Small Wire Surface.16.Solved with COMSOL Multiphysics 5. 4 Locate the Advanced Settings section. 5 Click the Custom button. 8 Click the Build Selected button. choose Fluid dynamics. 4 From the Predefined list.2 Mapped 2 1 In the Model Builder window.

2 Right-click Convert 1 and choose Build Selected. 11 In the associated text field. 7 In the associated text field. choose Heat Exchange Surface. 2 In the Settings window for Size. 2 In the Settings window for Free Triangular. This is necessary to make it compatible with the tetrahedral elements created a few steps later. type 0. Select the Maximum element size check box. 17 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE .5. 3 From the Selection list. type 1. Size 1 1 Right-click Component 1 (comp1)>Mesh 1>Free Triangular 1 and choose Size. choose Curved Area. This conversion divides the quadrilateral mesh obtained into triangular elements. Free Triangular 2 1 In the Model Builder window. right-click Mesh 1 and choose More Operations>Free Triangular. type 0. 14 Click the Build Selected button. 3 From the Selection list.05. type 1. locate the Element Size section. type 1. 5 In the associated text field. 12 Select the Resolution of narrow regions check box.Solved with COMSOL Multiphysics 5. 13 In the associated text field. Free Triangular 1 1 Right-click Mesh 1 and choose More Operations>Free Triangular. 6 Select the Minimum element size check box. 2 In the Settings window for Free Triangular. 10 Select the Curvature factor check box. locate the Boundary Selection section.2 Convert 1 1 In the Model Builder window. locate the Boundary Selection section. 4 Locate the Element Size Parameters section. 3 Click the Custom button. right-click Mesh 1 and choose More Operations>Convert. 8 Select the Maximum element growth rate check box. 9 In the associated text field.4.

Solved with COMSOL Multiphysics 5.2 Size 1 1 Right-click Component 1 (comp1)>Mesh 1>Free Triangular 2 and choose Size. 3 From the Geometric entity level list. From the Handling of sharp edges list. 5 Click to expand the Corner settings section. locate the Element Size section. 2 In the Settings window for Boundary Layers. 2 In the Settings window for Boundary Layer Properties. Boundary Layer Properties 1 In the Model Builder window. In the Number of boundary layers text field. choose Fluid dynamics. 3 From the Selection list. 2 In the Settings window for Size. Size 1 In the Model Builder window. 18 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . locate the Domain Selection section. choose Air. 4 Locate the Boundary Layer Properties section. type 5. choose Domain. Boundary Layers 1 1 In the Model Builder window. 5 In the Thickness adjustment factor text field. locate the Boundary Selection section. 2 In the Settings window for Size. 4 Click the Build Selected button. right-click Mesh 1 and choose Free Tetrahedral. under Component 1 (comp1)>Mesh 1 click Size. Locate the Corner Settings section. 4 From the Selection list. right-click Mesh 1 and choose Boundary Layers. under Component 1 (comp1)>Mesh 1>Boundary Layers 1 click Boundary Layer Properties. 5 In the Model Builder window. type 3. 3 From the Calibrate for list. choose Trimming. choose Walls. choose Coarse. 3 From the Predefined list. locate the Element Size section.

2 6 Click the Build All button. 5 From the Linear solver list.Solved with COMSOL Multiphysics 5. 2 In the Model Builder window. use direct solvers for the temperature group and for the velocity-pressure group. then click Segregated Step 2. Solution 1 (sol1) 1 On the Study toolbar. 19 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . choose Direct. choose Direct. locate the General section. The default suggestion is a segregated solver. STUDY 1 Now. 7 In the Settings window for Segregated Step. 8 From the Linear solver list. 4 In the Settings window for Segregated Step. 3 In the Model Builder window. locate the General section. For more robustness. 6 In the Model Builder window. edit the solver sequence. click Show Default Solver. expand the Study 1>Solver Configurations>Solution 1 (sol1)>Stationary Solver 2>Segregated 1 node. expand the Solution 1 (sol1) node. under Study 1>Solver Configurations>Solution 1 (sol1)>Stationary Solver 2>Segregated 1 click Segregated Step 3.

Algebraic yPlus>Velocity and pressure>u. From the Line type list. The computation may take a few hours to complete. 12 On the Study toolbar. You are now ready to launch the simulation. RESULTS Temperature (ht) The first default plot shows the temperature field. 3 From the Unit list. From the Selection list.Velocity field. choose Component 1>Turbulent Flow. choose degC. 8 Right-click Results>Temperature (ht)>Streamline 1 and choose Color Expression.Solved with COMSOL Multiphysics 5.w . choose Tube. then click Surface 1. 11 In the Mesh coarsening factor text field. 9 In the Settings window for Color Expression. 1 In the Model Builder window. type 1.Velocity magnitude. 10 In the Settings window for Multigrid. Pressure (spf) The fourth default plot group shows the pressure field plot of Figure 4. From the menu. then click Multigrid 1. click Replace Expression in the upper-right corner of the Expression section. 7 Locate the Coloring and Style section.2 9 In the Model Builder window.U . click Plot. choose Component 1>Turbulent Flow. right-click Temperature (ht) and choose Streamline.v. click Replace Expression in the upper-right corner of the Expression section. click Compute. 20 | FORCED CONVECTION COOLING OF AN ENCLOSURE WITH FAN AND GRILLE . Algebraic yPlus>Velocity and pressure>spf. expand the Study 1>Solver Configurations>Solution 1 (sol1)>Stationary Solver 2>Iterative 1 node. 2 In the Settings window for Surface. proceed as follows. 4 In the Model Builder window. 10 On the Temperature (ht) toolbar. Velocity (spf) The third default plot group shows the air velocity profile through a slice plot. expand the Temperature (ht) node. To reproduce the plot in Figure 3 of the temperature and the air velocity. From the menu. choose Grille. 6 Locate the Selection section.5. 5 In the Settings window for Streamline. locate the General section. locate the Expression section.