Liberty Port ZTE ZXWM M920 Product Description

ZXWM M920
Backbone DWDM Equipment
Product Description
Version:V5.10P01
ZTE CORPORATION
No. 55, Hi-tech Road South, ShenZhen, P.R.China
Postcode: 518057
Tel: +86-755-26771900
Fax: +86-755-26770801
URL: http://support.zte.com.cn
E-mail: support@zte.com.cn
LEGAL INFORMATION
Copyright 2013 ZTE CORPORATION.
The contents of this document are protected by copyright laws and international treaties. Any reproduction or
distribution of this document or any portion of this document, in any form by any means, without the prior written
consent of ZTE CORPORATION is prohibited.
Additionally, the contents of this document are protected by
contractual confidentiality obligations.

All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE
CORPORATION or of their respective owners.
This document is provided as is, and all express, implied, or statutory warranties, representations or conditions
are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose,
title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the
use of or reliance on the information contained herein.
ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications
covering the subject matter of this document. Except as expressly provided in any written license between ZTE
CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter
herein.
ZTE CORPORATION reserves the right to upgrade or make technical change to this product without further notice.
Users may visit ZTE technical support website http://support.zte.com.cn to inquire related information.
The ultimate right to interpret this product resides in ZTE CORPORATION.
Revision History
Revision No.
Revision Date
Revision Reason
R1.1
2013-12-20
Add CX21 subrack, CX31 subrack, EQG2 board and EHG1 board.
R1.0
2012-12-15
First release
Serial Number: SJ-20130318152421-001

Publishing Date: 2013-12-20(R1.1)
SJ-20130318152421-001|2013-12-20(R1.1)
ZTE Proprietary and Confidential
Contents
About This Manual ......................................................................................... I
Chapter 1 Product Orientation and Application ...................................... 1-1
1.1 ZTE WDM Product Family .................................................................................. 1-1
1.2 Networking Application ....................................................................................... 1-2
1.2.1 Point-to-Point Network.............................................................................. 1-2
1.2.2 Chain Network ......................................................................................... 1-2
1.2.3 Ring Network ........................................................................................... 1-2
1.2.4 Ring-Chain Network ................................................................................. 1-3
1.2.5 Tangent Ring Network .............................................................................. 1-3
1.2.6 Cross Network ......................................................................................... 1-4
1.2.7 Mesh Network.......................................................................................... 1-4
1.3 Network Element Type........................................................................................ 1-4
1.3.1 OTM Configurations ................................................................................. 1-4
1.3.2 FOADM Configurations........................................................................... 1-12
1.3.3 ROADM Configurations .......................................................................... 1-16
1.3.4 OLA Configurations ................................................................................ 1-24
Chapter 2 Product Characteristics ........................................................... 2-1

2.1 Technology Characteristics ................................................................................. 2-1
2.1.1 Forward Error Correction Functions ........................................................... 2-1
2.1.2 APSD/APR Function................................................................................. 2-1
2.1.3 Erbium-Doped Fiber Amplifier (EDFA) ...................................................... 2-2
2.1.4 Distributed RAMAN Amplification .............................................................. 2-2
2.1.5 Intelligent ROADM.................................................................................... 2-2
2.1.6 Performance Monitoring Function .............................................................. 2-3
2.1.7 Electrical Cross-Connect Function............................................................. 2-3
2.1.8 RPOA Technology .................................................................................... 2-4
2.2 Upgrade and Maintenance Characteristics ........................................................... 2-4
Chapter 3 System Functions ..................................................................... 3-1

3.1 Line Transmission Function ................................................................................ 3-1
3.1.1 Transmission Capacity.............................................................................. 3-1
3.1.2 Channel Rate........................................................................................... 3-1
3.1.3 Channel Spacings .................................................................................... 3-2
3.1.4 Transmission System Codes..................................................................... 3-2
I
SJ-20130318152421-001|2013-12-20(R1.1)
3.2 Automatic Power Optimization Function............................................................... 3-5

3.2.1 OMS Power Management......................................................................... 3-5
3.2.2 OCH Power Management ......................................................................... 3-6
3.3 IWF Function ..................................................................................................... 3-6
3.4 Wavelength Tunable Function ............................................................................. 3-6
3.5 Performance Monitoring Function ........................................................................ 3-7
3.6 Chromatic Dispersion Compensation ................................................................... 3-8
3.7 Service Functions............................................................................................... 3-8
3.7.1 Service Access Function........................................................................... 3-8
3.7.2 Service Convergence Function.................................................................. 3-9
3.8 Communication and Supervision Function ......................................................... 3-10
3.8.1 Supervisory Channels............................................................................. 3-10
3.8.2 Communication Functions........................................................................3-11
3.9 Alarm Monitoring Function ................................................................................ 3-12
3.9.1 External Alarm Input and Output Function................................................ 3-12
3.9.2 Internal Alarm Monitoring Function .......................................................... 3-12
3.10 Protection Functions ....................................................................................... 3-13
3.10.1 SNP 1+1 Protection .............................................................................. 3-13
3.10.2 Cross-Connect Board 1+1/2:2/4:2 Protection.......................................... 3-13
3.10.3 OMS 1+1 Protection ............................................................................. 3-14
3.10.4 OCH 1+1 Protection ............................................................................. 3-16
3.10.5 Two-Fiber Bidirectional OCH Shared Protection ..................................... 3-16
3.10.6 Chain Network-Based Electrical Layer 1+1 Wavelength Protection .......... 3-17
3.10.7 Ring Network-based Electrical Layer Two-Fiber Bidirectional Channel
Shared Protection ................................................................................. 3-19
3.10.8 Protection Capability for EMS Channel .................................................. 3-20
3.11 Clock Management Function ........................................................................... 3-20
3.12 Clock Time Synchronization Function .............................................................. 3-20
Chapter 4 Hardware Architecture ............................................................. 4-1

4.1 Cabinet.............................................................................................................. 4-1
4.2 Board ................................................................................................................ 4-2
Chapter 5 Software Architecture............................................................... 5-1

5.1 Software Architecture Overview .......................................................................... 5-1
5.2 EMS Software.................................................................................................... 5-1
5.3 NE Control and Processing Software ................................................................... 5-3
5.4 Board Software .................................................................................................. 5-4
5.5 Communication Protocols and Interfaces ............................................................. 5-4
II
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 6 Technical Specifications .......................................................... 6-1

6.1 Requirements on Operating Wavelength.............................................................. 6-1
6.1.1 Allocation of Continuous Wavelengths ....................................................... 6-1
6.1.2 Allocation of Uncontinuous Wavelengths.................................................... 6-5
6.2 Service Access and Convergence Subsystem Specifications ................................ 6-7
6.2.1 Board Types ............................................................................................ 6-7
6.2.2 2.5 G Board Specifications........................................................................ 6-7
6.2.3 10 G Board Specifications......................................................................... 6-8
6.2.4 40G Board Specifications.......................................................................... 6-9
6.2.5 100 G Board Specifications..................................................................... 6-10
6.3 Optical Mux/DeMux Subsystem Specifications ...................................................6-11
6.3.1 SOAD Board Specifications .....................................................................6-11
6.3.2 OMU Board Specifications ...................................................................... 6-12
6.3.3 ODU Board Specifications ...................................................................... 6-14
6.3.4 ODUB Board Specifications .................................................................... 6-14
6.3.5 OCI Board Specifications ........................................................................ 6-15
6.3.6 VMUX Board Specifications .................................................................... 6-16
6.3.7 VMUXB Board Specifications .................................................................. 6-16
6.3.8 SSDM Board Specifications .................................................................... 6-17
6.3.9 SOGMD Board Specifications ................................................................. 6-18
6.3.10 WBU Board Specifications ................................................................... 6-18
6.3.11 WSU Board Specifications .................................................................... 6-19
6.3.12 WBM Board Specifications.................................................................... 6-21
6.3.13 PDU Board Specifications ..................................................................... 6-22
6.4 Optical Amplification Subsystem Specifications ................................................. 6-23
6.4.1 SEOA Board Specifications..................................................................... 6-23
6.4.2 EOA Board Specifications....................................................................... 6-26
6.4.3 DRA Board Specifications....................................................................... 6-31
6.4.4 LAC Board Specifications ....................................................................... 6-32
6.5 Optical Layer Management Subsystem Specifications ........................................ 6-33
6.5.1 OPM Board Specifications ...................................................................... 6-33
6.5.2 EOPM Board Specifications .................................................................... 6-34
6.5.3 OWM Board Specifications ..................................................................... 6-35
6.5.4 EOWM Board Specifications ................................................................... 6-35
6.6 Protection Subsystem Specifications ................................................................. 6-35
6.6.1 SOP Board Specifications....................................................................... 6-35
6.6.2 SOPCS Board Specifications .................................................................. 6-36
III
SJ-20130318152421-001|2013-12-20(R1.1)
6.6.3 SOPMS Board Specifications.................................................................. 6-37

6.7 Supervision Subsystem Specifications............................................................... 6-38
6.7.1 SOSCB Board Specifications .................................................................. 6-38
6.7.2 CCP Board Specifications....................................................................... 6-39
6.8 RPOA Subsystem Specifications....................................................................... 6-39
6.8.1 Applicable Transmission Codes............................................................... 6-39
6.8.2 RPOA Subsystem Optical Specifications ................................................. 6-40
6.9 DCM Technical Specifications ........................................................................... 6-40
6.10 Environment Specifications ............................................................................. 6-42
6.10.1 Power Supply Requirement................................................................... 6-43
6.10.2 Storage Environment ............................................................................ 6-43
6.10.3 Transportation Environment .................................................................. 6-44
6.10.4 Operational Environment ...................................................................... 6-46
6.11 Electro Magnetic Compatibility Requirements ................................................... 6-47
6.12 Weight Power Consumption Dimensions.......................................................... 6-48
6.12.1 Power Consumption Specifications........................................................ 6-48
6.12.2 Dimensions and Weight ........................................................................ 6-51
Appendix A Standards and Recommendations ..................................... A-1

Figures............................................................................................................. I
Tables ............................................................................................................ III
Glossary .......................................................................................................VII
IV
SJ-20130318152421-001|2013-12-20(R1.1)
About This Manual

Purpose
This manual provides information about the ZXWM M920Backbone DWDM Equipment.
The ZXWM M920 system is designed for long-haul transmission in backbone-networks
and supports the 160/192 10 Gb/s or 80/96 40 Gb/s system.
What is in This Manual

This manual contains the following chapters:
Chapter
Summary
1, Product Orientation and
Describes the product Orientation, networking application and
Application
network element type of the ZXWM M920.
2, Product Characteristics
Describes the product characteristics of the ZXWM M920 system,

including technical characteristics, and upgrade and maintenance
characteristics.
3, System Functions
Describes system configuration, networking modes, and configuration

example of the ZXWM M920 equipment.
4, Hardware Architecture
Describes the hardware architecture and functional subsystems of the

ZXWM M920equipment.
5, Software Architecture
Describes the software architecture, including board software, NE

control and processing software, EMS software, communication
protocol, and interfaces of the ZXWM M920 equipment.
6, Technical Specifications
Describes system operating wavelength, technical specifications of

board, environment specifications and weight power consumption
dimensions of the ZXWM M920 equipment.
Appendix A, Standards and
Describes the Standards and Recommendations of the ZXWM M920
Recommendations
equipment.
Conventions
This manual uses the following typographical conventions:
Typeface
Meaning
Italics
Variables in commands. It may also refer to other related manuals and documents.
Bold
Menus, menu options, function names, input fields, option button names, check boxes,
drop-down lists, dialog box names, window names, parameters, and commands.
Constant
Text that you type, program codes, filenames, directory names, and function names.
width
I
SJ-20130318152421-001|2013-12-20(R1.1)
Typeface
Meaning
[]
Optional parameters.
{}
Mandatory parameters.
Separates individual parameters in a series of parameters.

Danger: indicates an imminently hazardous situation. Failure to comply can result in
death or serious injury, equipment damage, or site breakdown.
Warning: indicates a potentially hazardous situation. Failure to comply can result in
serious injury, equipment damage, or interruption of major services.
Caution: indicates a potentially hazardous situation. Failure to comply can result in
moderate injury, equipment damage, or interruption of minor services.
Note: provides additional information about a particular topic.
II
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 1
Product Orientation and

Application
Table of Contents
ZTE WDM Product Family ..........................................................................................1-1
Networking Application ...............................................................................................1-2
Network Element Type ...............................................................................................1-4
1.1 ZTE WDM Product Family

ZTE WDM equipments meet the application requirements of MAN/LAN (from the core
layer, the convergence layer, to the access layer), toll network, and trunk network. They
provide user with transmission solutions with different capability and different transmission
distance.
Figure 1-1 shows the ZTE WDM product family, including ZXWM M920, ZXMP M820,
ZXMP M720 and ZXMP M600.
Figure 1-1 ZTE WDM Product Family
ZXWM M920 is a new-generation optical network product. It combines advanced

transmission technologies, such as trunk network large capacity and long-haul
transmission, with high equipment integration technology. It is applicable to
international, national, inter-province, and intra-province trunk; local switching
network; and various private networks.
1-1
SJ-20130318152421-001|2013-12-20(R1.1)
ZXWM M920 Product Description
ZXMP M820 is an intelligent WDM equipment. It can upload the WSON control
platform. It is applicable to local networks with various scales and the metro core
network.
ZXMP M720 is a multi-transmission platform compact WDM equipment, which is
applicable to the core layer, convergence layer, and access layer of MAN/LAN.
It is applied in the construction of trunk WDM network with small capability and
medium-long transmission distance.
ZXMP M600 is applicable to the convergence layer, access layer of large-scale MAN,
and all layers of small-medium MAN. It is applied in the construction of LAN with the
short distance.
1.2 Networking Application

1.2.1 Point-to-Point Network
For the point-to-point network, see Figure 1-2.
Figure 1-2 Point-to-Point Network Application
1.2.2 Chain Network

For the chain network, see Figure 1-3.
Figure 1-3 Chain Network Application
1.2.3 Ring Network

For the ring network, see Figure 1-4.
1-2
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 1 Product Orientation and Application
Figure 1-4 Ring Network Application
1.2.4 Ring-Chain Network

For the ring-chain network, see Figure 1-5.
Figure 1-5 Ring-chain Network Application
1.2.5 Tangent Ring Network

For the tangent ring network, see Figure 1-6.
Figure 1-6 Tangent Ring Network Application
1-3
SJ-20130318152421-001|2013-12-20(R1.1)
1.2.6 Cross Network

Figure 1-7 shows an application example of cross network consisting of ZXWM M920
FOADM, OLA, and OTM equipment.
Figure 1-7 CROSS NETWORK APPLICATION
1.2.7 Mesh Network

Among network applications, when optical directions supported by node devices are not
fewer than four, the Mesh network mode can be used. When traffic scheduling demand
is available at multiple directions, the Mesh network application can perform automatic
connection configurations to meet cross-direction service protection and multiple-direction
network management.
1.3 Network Element Type

1.3.1 OTM Configurations
Function and Principle Diagram
OTMs are used at terminal nodes of optical lines to add or drop services. The function
diagram is shown in Figure 1-8.
1-4
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-8 OTM Equipment Operating Principle Diagram
Board Configurations
OTM configurations are described as follows by taking a 96channel system as an
example.
l
If SOTU10G boards are used, the OTM equipment is configured with six subracks
and two cabinets. For the subracks and boards configurations, see Figure 1-9 and
Figure 1-10.
1-5
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-9 OTM Equipment Configuration (96-Channel SOTU10G Cabinet 1)
Note:
Parts of optical transponder boards and convergence boards are not contained in the
diagram.
1-6
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-10 OTM Equipment Configuration (96-Channel SOTU10G Cabinet 2)
If EOTU10G boards are used, the OTM equipment is configured with ten subracks
and three cabinets. For the subrack and board configurations, see Figure 1-11, Figure
1-12, and Figure 1-13.
1-7
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-11 OTM Equipment Configuration (96-Channel EOTU10G Cabinet 1)
1-8
SJ-20130318152421-001|2013-12-20(R1.1)
1-9
SJ-20130318152421-001|2013-12-20(R1.1)
Fiber Connections
The fiber connections in a 96-channel OTM equipment are shown in Figure 1-14.
1-10
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-14 Optical Connections in OTM Equipment (96-Channel)
Configuration Description
For the configuration description of the OTM equipment, refer to Table 1-1.
Table 1-1 Configuration Description
Configuration Requirements
Description
To implement the
Each OMU/ODU board occupies 4 slots.
multiplexing/demultiplexing
of channels,
To implement the optical
Each EONA board occupies 4 slots
amplification,
Each SEOBA board occupies 1 slot.

The EOBAH board can be used to replace the SEOBA board to
meet the requirements for high output power.
The EOBAH board occupies 4 slots.
For the 8/16/32/40/48 channel
when SEOBA or SEOPA boards are not configured, the
system,
SSDM board can be used for the multplexing/demultiplexing of

1550/1510 nm wavelengths.
For the 80/96/160/176/192
the OCI board and OBM board are used in the 80/96/160/176/192
channel system,
channel system.
the 80-channel system can also use OMU80/ODU80 boards to
implement wavelength multiplexing/demulitplexing.
1-11
SJ-20130318152421-001|2013-12-20(R1.1)
Description
To implement the OCH/OMS 1+1
if the OCH/OMS 1+1 protection is required, the SOP boards
protection,
should be configured. The configuration positions of SOP boards

and optical fiber connections should be determined according
to the protection types.
To implement the OCH 1:N
if the OCH 1:N protection is required, OMCP boards should be
protection,
configured between the user equipment and OTU boards.
For the dispersion compensation
the DCM plug-in boxes and DCM modules should be configured
after a long-haul transmission,
according to the fiber types and the requirements.
To implement the aggregation,
any OTU (SOTU10G/EOTU10G) board displayed in Figure

1-14 can be replaced by the aggregate board (SRM41, SRM42,
DSAC, DSAF, FCA, MQT3 or SMUB board).
1.3.2 FOADM Configurations

Fixed Optical Add/Drop Multiplexers (FOADMs) are used at intermediate nodes of optical
lines to add/drop part of services and pass through the rest of services. The function
diagram is shown in Figure 1-15.
Figure 1-15 FOADM Equipment Operating Principle Diagram
FOADM nodes can add/drop optical signals with fixed wavelengths.
1-12
SJ-20130318152421-001|2013-12-20(R1.1)
Cabinet and Subrack Configurations

The FOADM equipment is configured with only one cabinet consisting of one master
subrack and three slave subracks.
Cabinet configurations of the FOADM equipment supporting bidirectional add/drop of eight
wavelengths are shown in Figure 1-16 and Figure 1-17.
Figure 1-16 FOADM Equipment Configuration (SOTU10G)
1-13
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-17 FOADM Equipment Configuration (EOTU10G)
Fiber Connections
Fiber connections in the FOADM equipment supporting unidirectional add/drop of eight
wavelengths are shown in Figure 1-18.
1-14
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-18 FOADM Equipment Fiber Connections (Unidirectional Add/Drop of Eight

Wavelengths)
SOGMD boards can also be used in the FOADM equipment to implement the
multiplexing/demultiplexing of a group of wavelengths. The fiber connections are shown
in Figure 1-19.
Figure 1-19 FOADM Equipment Fiber Connections (Configured with SOGMD Boards)
1-15
SJ-20130318152421-001|2013-12-20(R1.1)
For the configuration description of the FOADM equipment, see Table 1-2.
Description
Required Boards
Each SOAD board occupies one slot, and supports the

transmission/receipt of optical signals in only one direction, that
is, both IN and OUT interfaces of an SOAD board are connected
to the same site.
To add/drop more wavelengths,
each SOAD board can add/drop fixed one to four wavelength

signals. If the add/drop function is required for more wavelengths,
SOAD boards and OMU/ODU boards are needed to be
cascaded.
To implement the OCH/OMS
the SOP boards should be installed, and positions and optical
1+1 protection or electrical-layer
connections of the SOP boards should be determined according
service board redundancy 1+1
to the protection mode.
protection,
To implement the OCH 1:N
OMCP boards should be added between user equipment and
protection,
optical transponder boards.
To implement the OMS or OCH
the SOPMS or SOPCS boards should be added, and fiber
ring protection,
connection relations should be determined according to the

protection mode.
For the dispersion compensation
DCM plug-in boxes should be installed, and dispersion
after long-distance transmissions
compensation modules should be configure d as required.
To implement the aggregation,
an OTU board shown in Figure 1-19 should be replaced with an

aggregate board (SRM41, SRM42, DSAC or SAUC board).
1.3.3 ROADM Configurations

Equipment Features
The ROADM equipment supports the following features:
l Wavelength reconstruction in two directions and in multiple directions.
l Adding/dropping local wavelengths: adding/dropping local fixed wavelengths,
adding/dropping any local wavelength at any port, and adding/dropping/broadcasting
any direction-irrelevant wavelength.
Cabinet, Subrack and Board Configuration

The ROADM equipment is configured with only one cabinet consisting of one master
subrack and three slave subracks.
Boards: WBU/WBM/WSU/PDU
1-16
SJ-20130318152421-001|2013-12-20(R1.1)
Fiber Connections
Figure 1-20 illustrates a two-dimension fiber connections diagram of the ROADM
equipment configured with WBM.
Figure 1-20 Fiber Connections in ROADM Equipment (Configured with WBM Boards)

equipment configured with WBU.
Figure 1-21 Fiber Connections in ROADM Equipment (Configured with WBU Boards)
1-17
SJ-20130318152421-001|2013-12-20(R1.1)

equipment configured with WSU.
Figure 1-22 Fiber Connections in ROADM Equipment (Configured with WSU Boards)
Figure 1-23 illustrates a three-dimension fiber connections diagram of the ROADM

equipment.
Figure 1-23 Fiber Connections in ROADM Equipment (Three Dimensions)
Figure 1-24 illustrates a nine-dimension fiber connections diagram of the ROADM

equipment.
1-18
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-24 Fiber Connections in ROADM Equipment (Nine Dimensions)
1. Each SEOBA board occupies one slot. Each EONA board occupies four slots. Each
WBU/WSU/WBM board occupies four slots.
2. If OCH/OMS 1+1 protection or electrical-layer service board redundancy 1+1 protection is required, SOP boards should be added, and positions and optical connections
of the SOP boards should be determined according to the protection mode.
3. If OCH 1:N protection is required, OMCP boards should be added between user
equipment and optical transponder boards.
4. If OMS or OCH ring protection is required, SOPMS or SOPCS boards should be added,
and fiber connection relations should be determined according to the protection mode.
5. If dispersion compensation is required for the OADM equipment after long-haul
transmissions, DCM plug-in boxes should be added, and dispersion compensation
modules should be configured as required.
6. If the SOGMD board is configured in network, the black wavelengths in SOGMD
boards cannot be occupied.
7. When the ROADM equipment is configured, if only the add/drop function is required,
WBU boards should be configured, drop wavelengths should be fixed, and each WBU
board should be configured on direction A and B.
8. When the ROADM equipment is configured, if the add/drop function as well as port
configuration are required, WSUD boards should be configured.
1-19
SJ-20130318152421-001|2013-12-20(R1.1)
9. When the ROADM equipment is configured, if the add/drop function, port configuration,
and service broadcast are required, WSUA boards should be configured.
10. When the ROADM equipment is configured, if the add function and pass-through
function are required, WBM boards should be configured.
11. When the ROADM equipment is configured, if couplers are required for the power
isolation, PDU boards should be configured.
ROADM Network Relevances

For the direction/wavelength correlations, refer to Table 1-3.
Table 1-3 Direction/Wavelength Correlation
Item
Description
Direction relevance
Services in add channels on the local node cannot be sent to any

direction.
Direction irrelevance
Services in add channels on the local node can be sent to any

direction.
Wavelength relevance
Services cannot be sent to an OTU-type board through any drop

channel on the local node.
Wavelength irrelevance
Services can be sent to an OTU-type board through any drop

channel on the local node.
ROADM Network Relevance Implementation Schemes

l
For the implementation of direction relevance and wavelength relevance, see Figure
1-25.
1-20
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-25 Direction Relevance and Wavelength Relevance
For the implementation of direction irrelevance and wavelength relevance, see Figure
1-26.
1-21
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-26 Direction Irrelevance and Wavelength Relevance
For the implementation of direction irrelevance and wavelength irrelevance, see

Figure 1-27.
1-22
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-27 Direction Irrelevance and Wavelength Irrelevance
For the implementation of direction relevance and wavelength irrelevance, see Figure
1-28.
1-23
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-28 Direction Relevance and Wavelength Irrelevance
1.3.4 OLA Configurations

Optical Line Amplifiers (OLAs) are used to compensate optical signals power after
a long-distance transmission. Dispersion Compensation Modules (DCMs) can be
configured as required. The OLA equipment without DCM and with DCM are respectively
shown in Figure 1-29 and Figure 1-30.
1-24
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-29 Function Diagram of OLA Equipment (Without DCMs)
Figure 1-30 Function Diagram of OLA Equipment (With DCMs)
Board configurations of the OLA equipment with single-channel rate are described as
follows:
l
The single-channel rate is 2.5 Gbit/s.

The OLA equipment with single-channel rate at 2.5 Gbit/s is shown in Figure 1-31.
1-25
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-31 OLA Equipment Configuration (2.5 Gbit/s)
The single-channel rate is 10 Gbit/s.

EOLA equipments at 10 Gbit/s always combine EONA boards and DCMs to implement
the amplification and dispersion compensation of optical signals. The OLA equipment
with single-channel rate at 10 Gbit/s is shown in Figure 1-32.
Figure 1-32 OLA Equipment Configuration (10 Gbit/s)
Fiber Connections
l
Fiber connections in the OLA equipment at 2.5 Gbit/s are shown in Figure 1-33.
Figure 1-33 OLA Equipment Fiber Connections (2.5 Gbit/s)
Fiber connections in the OLA equipment at 10 Gbit/s are shown in Figure 1-34.
1-26
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-34 OLA Equipment Fiber Connection (10 Gbit/s)
For the OLA equipment configuration description, refer to Table 1-4.
Configuration
Description
Requirements
Required Boards
Each EONA board occupies four slots.

The EOLAD board can serve as EOLA board
When the transmission rate
DCMs are used to implement dispersion compensation. DCMs should
is 10 Gbit/s or 40 Gbit/s,
be selected according to the fiber type and the actual distance that
needs dispersion compensation.
1-27
SJ-20130318152421-001|2013-12-20(R1.1)
This page intentionally left blank.
1-28
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 2
Product Characteristics
Table of Contents
Technology Characteristics.........................................................................................2-1
Upgrade and Maintenance Characteristics .................................................................2-4
2.1 Technology Characteristics

2.1.1 Forward Error Correction Functions
The ZXWM M920 system uses Forward Error Correction (FEC) technology, which has the
following advantages:
l
l
l
Improves the error-tolerance capability of transmitted signals

Reduces the system requirement on the signal-to-noise ratio
Extends the transmission distance
There are four types of FEC functions: Ordinary FEC , AFEC (Advanced Forward Error
Correction) , HD-FEC (Hard Decision Forward Error Correction) , and SD-FEC (Soft
Decision Forward Error Correction) , refer to Table 2-1.
Table 2-1 FEC List
Item
Description
FEC Type
Ordinary FEC
AFEC
SD-FEC
Frame structure
G.709
G.975
G.709
Traffic rate
2.5 G
2.660 Gbit/s
Unavailable
Unavailable
STM-64
10.709 Gbit/s
10.709 Gbit/s
Unavailable
10 GE
11.100 Gbit/s
11.100 Gbit/s
Unavailable
40 G
43.018 Gbit/s
43.018 Gbit/s
Unavailable
100 G
Unavailable
Unavailable
120.520 Gbit/s
5 dB to 6 dB
7 dB to 9 dB
<12.5 dB
OSNR
2.1.2 APSD/APR Function

The ZXWM M920 system supports two modes of Automatic Power Control (APC)
functions: Automatic Power ShutDown (APSD) and Automatic Power Reduction (APR).
2-1
SJ-20130318152421-001|2013-12-20(R1.1)
When no optical input power is detected by a detection board that has the optical
performance detection function, the detection board sends a message to the SNP
board. The SNP board takes control of the execution board (such as an EOA board) to
automatically reduce or shut down the power, so as to prevent eye injuries by a laser.
After the fault is removed, the original board power can be recovered automatically or
manually.
2.1.3 Erbium-Doped Fiber Amplifier (EDFA)

The ZXWM M920 system uses EDFA technology to improve the transmission distance. It
provides the following benefits:
l
l
Greatly reduces the cost of optical regeneration.

High gain, low noise, large bandwidth, high output power, high pump efficiency, low
insertion loss, and insensitivity for polarization.
2.1.4 Distributed RAMAN Amplification

In the Optical Transport Network (OTN)/Wavelength-Division Multiplexing (WDM) system
with ultra-long-haul transmission distances, using only the EDFA technology to implement
the amplification accumulates spontaneous radiation and restricts the performance of
the system. The ZXWM M920 system uses a Distributed RAMAN Amplification (DRA)
board to effectively improve the optical-amplification performance of the ultra-long-haul
transmission system through the combination of EDFA and DRA technologies (the
combination of EOA board and DRA board).
2.1.5 Intelligent ROADM

The ZXWM M920 system provides an intelligent Reconfigurable Optical Add/Drop
Multiplexer (ROADM). An intelligent ROADM is composed of a Power Distribution Unit
(PDU) and a Wavelength Selective Switch Unit (WSU). The intelligent ROADM improves
the flexibility of the WDM network. Thus, the operator can remotely and dynamically
control the wavelength transmission path, and effectively reduce the operation and
maintenance costs. The detailed functions provided by intelligent ROADM are as follows:
l
l
l
l
Provides add/drop of local optical signals.

Supports service broadcast.
Supports wavelength scheduling from up to nine optical directions.
Supports any combinations between wavelength-relevance (wavelength-related,
wavelength-unrelated)
and
direction-relevance
(direction-related,
direction-unrelated), including:
wavelength-related, direction-related;
wavelength-related, direction-unrelated;
wavelength-unrelated, direction-related;
wavelength-unrelated, direction-unrelated.
2-2
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 2 Product Characteristics
2.1.6 Performance Monitoring Function

l
The ZXWM M920 system provides an optical performance monitoring unit. This unit
is responsible for measuring parameters of each optical channel, including the optical
power, central wavelength and Optical Signal-Noise Ratio (OSNR), and sending these
data to the EMS, in which users can view the performance data in a list or in a graph.
The optical transponder unit supports performance monitoring and overhead
processing function. It can locate the faults and fault types according to the following
access signals:
For OTN signals: detects performance and alarm messages, including Loss
Of Frame (LOF) alarm, Bit Interleaved Parity (BIP-8), the overhead Trail Trace
Identifier (TTI), corrected bit error count, uncorrectable frame count, OTUk-AIS,
ODUk-AIS, ODUk-OCI, ODUk-LCK, PM-BIP8, ODUk-PT.
For SDH signals: monitors RS_BBE(B1) and J0 bytes.
For GE signals: monitors the packet error count, packet error ratio, and Generic
Framing Procedure (GFP) performance.
The boards on the main optical path use the power collection and monitoring
technology with great dynamic range and high accuracy. With the technology, the
power measurement error is less than 1 dB and the system performance can be truly
reflected.
2.1.7 Electrical Cross-Connect Function

The electrical cross-connect function of the ZXWM M920 system is divided into centralized
electrical cross-connect and distributed electrical cross-connect.
Centralized Electrical cross-connect

By using a cross-connect board and the backplane together, the centralized electrical
cross-connect function implements flexible, time-slot cross-connect scheduling of
time-slot frames on the backplane. After the scheduling, one or one group of time-slot
frames are demultiplexed on the service board to restore the service. The centralized
electrical cross-connect system is based on synchronous time division scheduling, which
is applicable to large-scale scheduling systems. The centralized electrical cross-connect
system has the following features:
l
l
l
l
The cross-connect capacity is 0.8 TB, 1.6 TB, and 3.2 TB.
The cross-connect granularities are ODU0, ODU1, ODU2 and ODU3.
This function crossconnects services to different wavelengths and directions.
This function supports the access of 100M to 1.25G, FE/GE/10GE/40GE/100GE,
STM-1/STM-4/STM-16/STM-64/STM-256, FC400/800, FC200/400/800, and ODUk
(where k = 0/1/2/2e/3/3e1/3e2) services.
As an unblocked network, the cross-connect network supports broadcasting and
Ethernet clock-transparent transmission functions.
2-3
SJ-20130318152421-001|2013-12-20(R1.1)
Distributed Electrical cross-connect

By using a backplane, the distributed electrical cross-connect function implements
cross-connect scheduling of frames. After the scheduling, the frame is demultiplexed
on the service board in the distributed cross-connect group to restore the service. The
granularity of the distributed electrical cross-connect system is fine, and the configuration
mode is flexible. The distributed electrical cross-connect system has the following
features:
l
l
l
A single subrack can be configured with up to six distributed cross-connect groups.

The cross-connect capacity and the access capacity of each group are 80 GB.
The cross-connect granularities are ODU0/ODU1.
This function implements access to the service with a rate of 100 Mbit/s to 4.25 Gbit/s
through board combinations.
2.1.8 RPOA Technology

The ZXWM M920 system uses the Remotely Pumped Optical Amplifier (RPOA)
technology, which is an ultra-long-distance transmission technology.
In the RPOA system, a segment of Erbium-Doped Fiber (EDF) is inserted in transmission
optical cables, which provides pumped light at a far-end site to amplify optical signals.
The RPOA system was developed to implement ultra-long, single-span transmission when
no power supply is available in the system.
It usually applies in the following cases:
l
No power supply is available, or regenerator sites cannot be established when optical

cables cross over straits or adjacent seas, or pass through depopulated areas (such
as deserts, marshes and forests).
The construction and maintenance of regenerator sites is difficult in remote areas due
to territorial limits.
RPOA supports the following applications:

l
l
l
Unidirectional pump application through the same fiber

Unidirectional pump application through different fibers
Bidirectional pump application through two fibers
2.2 Upgrade and Maintenance Characteristics

Master and Slave Subracks
The ZXWM M920 system supports the master/slave subrack installation.
One Network Element (NE) of the equipment is installed in only one master subrack. The
master subrack can support multiple slave subracks. For the details of slave subracks
supported by a single master subrack in the ZXWM M920 system, refer to Table 2-2.
2-4
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 2 Product Characteristics
Table 2-2 Maximum Number of Slave Subracks for a Single Master Subrack
Subrack Type
Number of Master Subracks
Maximum Number of Slave Subracks
CX20
15
CX30
15
CX50
15
NX4
15
DX41
15
CX51
15
Supervisory Channel Compatibility

The optical and electrical supervisory channels of the ZXWM M920 system can be
connected to and communicate with those of other OTN equipment.
Smooth Expansion and Scalability

The ZXWM M920 system has the following smooth capacity expansion and scalability:
l
l
A ZXWM M920 system transmitting 100 Gbit/s, 40 Gbit/s, 10 Gbit/s and 2.5 Gbit/s
services can be updated to a 100 Gbit/s system.
A ZXWM M920 system has an architecture that can be updated to a 192 channel
system.
Online Upgrade
The ZXWM M920 system supports online upgrades as follows:
l
l
Online upgrade of the network-element-management software and embedded

software of each board in the ZXWM M920 system without traffic interruption
Online upgrade a system transmitting less than 96 channels to a 96channel system.
Pluggable Optical Module

For service signals at the rate of 40 Gbit/s (STM-256/OTU3), the CFP + MSA300PIN optical
modules are supported.
For service signals at the rate of 10 Gbit/s (STM-64/OC-192/10GE/OTU2), 10Gigabit
Small Form-Fator Pluggable optical modules (XFP) and SFP+ optical modules are
supported.
For service signals with the rate of 2.5 Gbit/s or below, the optical interfaces at the client
side support Small Form-Factor Pluggable optical modules (SFP).
Pluggable-optical modules support the position-detection for optical modules.
2-5
SJ-20130318152421-001|2013-12-20(R1.1)
2-6
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 3
System Functions
Table of Contents
Line Transmission Function........................................................................................3-1
Automatic Power Optimization Function .....................................................................3-5
IWF Function..............................................................................................................3-6
Wavelength Tunable Function ....................................................................................3-6
Performance Monitoring Function...............................................................................3-7
Chromatic Dispersion Compensation..........................................................................3-8
Service Functions.......................................................................................................3-8
Communication and Supervision Function................................................................3-10
Alarm Monitoring Function........................................................................................3-12
Protection Functions.................................................................................................3-13
Clock Management Function ....................................................................................3-20
Clock Time Synchronization Function .......................................................................3-20
3.1 Line Transmission Function

3.1.1 Transmission Capacity
Wavelength Capacity
The ZXWM M920 system can be configured as a transmission system with a maximum
of 96 channels. The wavelength capacity of each channel can reach a maximum of 100
Gbit/s.
Channel Rate
The ZXWM M920 system supports single-channel rates at 100 Gbit/s, 40 Gbit/s, 10 Gbit/s,
and 2.5 Gbit/s.
Channel Spacings
The ZXWM M920 system uses the Dense Wavelength Division Multiplexing (DWDM)
technology. It supports channel spacings of 50 GHz and 100 GHz.
3.1.2 Channel Rate

The ZXWM M920 system supports single-channel rates at 100 Gbit/s, 40 Gbit/s, 10 Gbit/s,
and 2.5 Gbit/s.
3-1
SJ-20130318152421-001|2013-12-20(R1.1)
3.1.3 Channel Spacings

The ZXWM M920 system uses the Dense Wavelength Division Multiplexing (DWDM)
technology. It supports channel spacings of 50 GHz and 100 GHz. In a 10 G/100 G hybrid
transmission system, guard bands may be needed if the transmission distance is long.
3.1.4 Transmission System Codes

The ZXWM M920 system is classified into the following systems:
l 40channel system, at 2.5 Gbit/s
l 40/48channel system, at 10 Gbit/s
For descriptions of the above transmission systems, refer to Table 3-1, Table 3-2, Table
3-3, Table 3-4, Table 3-5, Table 3-6, Table 3-7, Table 3-8, and Table 3-9.
Table 3-1 Transmission System at 102.5 Gbit/s
Transmission Code
Cross-Segment Loss (dB)
Target Distance (km)
-FEC (OSNR>20dB)
136
1144
233
2132
331
3124
1023
1092
141
1164
238
2152
336
3144
2025
20100
141
1180
242
2168
340
3160
2028
20112
FEC-RAMAN (OSNR>15dB)
FEC+RAMAN
(OSNR>15dB)
3-2
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 3 System Functions
Table 3-2 Transmission Codes Supported by the 40/4810 Gbit/s System

Transmission Code
Cross-Segment Loss
Pattern
(dB)
AFEC NRZ
AFEC RZ
Remark
161
1244
RPOA, 4010 Gbit/s
149
1196
DRA, 4010 Gbit/s
157
1228
RPOA, 4810 Gbit/s
148
1192
DRA, 4810 Gbit/s
3022
3088
1230
12120
164
1256
RPOA, 4010 Gbit/s
152
1208
DRA, 4010 Gbit/s
160
1240
RPOA, 4810 Gbit/s
151
1204
DRA, 4810 Gbit/s
5022
5088
1830
18120

Transmission Code
Cross-Segment Loss
Pattern
(dB)
AFEC NRZ
AFEC RZ
Remark
145
1180
DRA, 8010 Gbit/s
144
1176
DRA, 9610 Gbit/s
2022
2088
830
8120
148
1192
DRA, 8010 Gbit/s
147
1188
DRA, 9610 Gbit/s
3022
3088
1230
12120
3-3
SJ-20130318152421-001|2013-12-20(R1.1)

Transmission Code
Cross-Segment Loss
Remark
Pattern
(dB)
AFEC DPSK
147
1188
DRA, 4040 Gbit/s
146
1184
DRA, 4840 Gbit/s
2222
2288
530
5120
1230
12120
DRA

Transmission Code
Cross-Segment Loss
Remark
Pattern
(dB)
AFEC DPSK
144
1176
DRA, 8040 Gbit/s
143
1172
DRA, 9640 Gbit/s
1622
1688
330
3120
630
6120
DRA
Table 3-6 Transmission Codes Supported by the 80100 Gbit/s System (G.652 + DCM)
Transmission Code
Cross-Segment Loss
Pattern
(dB)
Remark
SD+FEC+PM-QPSK
1x45
1x180
DRA, 80x100Gbit/s
16x22
16x88
4x30
4x120
7x30
7x120
DRA
Table 3-7 Transmission Codes Supported by the 80100 Gbit/s System (G.652 - DCM)
Transmission Code
Cross-Segment Loss
Remark
Pattern
(dB)
SD+FEC+PM-QPSK
1x45
1x180
DRA, 80x100Gbit/s
20x22
20x88
4x30
4x120
7x30
7x120
DRA
3-4
SJ-20130318152421-001|2013-12-20(R1.1)
Table 3-8 Transmission Codes Supported by the 80100 Gbit/s System (G.655 + DCM)
Transmission Code
Cross-Segment Loss
Remark
Pattern
(dB)
SD+FEC+PM-QPSK
1x45
1x180
DRA, 80x100Gbit/s
10x22
10x88
3x30
3x120
6x30
6x120
DRA
Table 3-9 Transmission Codes Supported by the 80100 Gbit/s System (G.655 - DCM)
Transmission Code
Cross-Segment Loss
Remark
Pattern
(dB)
SD+FEC+PM-QPSK
1x45
1x180
DRA, 80x100Gbit/s
12x22
12x88
3x30
3x120
6x30
6x120
DRA
3.2 Automatic Power Optimization Function

The ZXWM M920 system uses the Automatic Power Optimization (APO) technology to
provide the automatic power management function at the OMS layer and OCH layer.
l
l
OMS power management: to establish and maintain the optimal status of aggregate
optical power at the OMS layer.
OCH power management: to establish and maintain the equalization of optical power
at the OCH layer.
3.2.1 OMS Power Management

The power management at the OMS layer is based on the power management domain.
A power management domain is a multiplex section, that is, the Optical Multiplex Section
(OMS) between two Optical Terminal Multiplexers (OTMs) , two Fixed Optical Add/Drop
Multiplexers (FOADMs) or Reconfigurable Optical Add/Drop Multiplexer (ROADMs).
The OMS power management function ensures that the difference between gains and
corresponding line losses in the same multiplex section is constant.
In an actual optical channel, when the difference between its gain and line loss meets the
triggering condition specified by the power management function, the power optimization
will start. When the gain-loss difference reaches a value meeting the power requirement,
the power optimization will end.
3-5
SJ-20130318152421-001|2013-12-20(R1.1)
The OMS power management function can only be implemented with the cooperation of
certain boards and the EMS.
3.2.2 OCH Power Management

The ZXWM M920 system provides the power management function at the Optical Channel
(OCH) layer. The OCH layer is the line side of the optical transponder unit, which connects
various signals ( PDH, SDH, and ATM).
There are two types of OCH power management.
l
Fixed power compensation

A fixed equalization filter in an Erbium-Doped Fiber Amplifier (EDFA) is used to ensure
the flatness of gain spectrum.
Dynamic channel power management

Dynamic gain equalization technology and power pre-equalization technology are
used to adjust the optical power of each channel to guarantee the optical power
equalization of each channel at the optical receiving end.
3.3 IWF Function

The frequency drift has little impact on a DWDM system with channel spacing at 100
GHz. But it has an impact on a DWDM system reliability with higher channel rate and
less channel spacing, such as an 80/96 channel system with channel spacing at 50 GHz.
The ZXWM M920 system provides two modes to ensure the system reliability.
l
The system with 100 GHz channel spacing uses automatic power control, temperature
feedback, and internal wavelength feedback, which are implemented by optical
transponder boards.
The system with 50 GHz channel spacing uses internal wavelength feedback and
external wavelength feedback, which improves stability and accuracy of wavelength
control.
Internal wavelength feedback: It is implemented by optical transponder boards.
External wavelength feedback: It is implemented by the Integrated Wavelength

Feedback (IWF) function. The IWF function uses integrated detection and
ordered adjustment to implement the wavelength feedback control. OWM
boards, OMU boards, OTU boards, SNP boards, and EMS work together to
implement the IWF function.
3.4 Wavelength Tunable Function

Traditional DWDM systems use fixed wavelength lasers as light sources, which only
output fixed wavelengths complying with ITU-T G.694.1 recommendation.
Fixed
wavelength lasers cannot be fully utilized when they are used as standby light sources,
3-6
SJ-20130318152421-001|2013-12-20(R1.1)
which causes the operation costs. The development of light source technology uses a
tunable wavelength laser to meet the requirements for multi-wavelength tuning.
The tunable wavelength laser refers to a laser module that can be controlled to output
different wavelengths in a certain bandwidth. The channel quantity and channel spacing
of the output wavelengths meet the specifications of ITU-T G.694.1. With the application
of tunable wavelength lasers, wavelengths can be selected dynamically for signals in a
DWDM system according to the actual application of wavelengths. Especially when the
system uses standby light sources, using tunable wavelength lasers can improve the
utilization ratio of wavelengths.
Some service boards of the ZXWM M920system support both fixed wavelength output
and tunable wavelength output. Table 3-10 lists the boards supporting wavelength tuning
function and their tuning ranges (relationship among operating band, channel quantity and
channel spacing).
Table 3-10 Boards Supporting the Wavelength Tunable Function
Board Type
Operating Band
Channel Quantity @Channel Spacing
100 G board (with FEC or AFEC)

TS4/CS4
Full C band
40 CH@100 GHz
80/96 CH@50 GHz

TD2C/TS2C/LS3/LO2/L-
Full C band
40 CH@100 GHz
Q2/MQA1/MQA2
80/96 CH@50 GHz

EOTU10G/EOTU10GB/
Full C band
40 CH@100 GHz
SOTU10G/SRM41/
80/96 CH@50 GHz
LO2/FCA/FCAG
2.5 G board (with FEC)
SOTU2.5G
C band
4/8/16CH@100 GHz
(Continuous wavelengths)
2.5 G board (without FEC)

SRM42
C band
4/8/16CH@100 GHz
(Continuous wavelengths)
3.5 Performance Monitoring Function

l
The ZXWM M920 system provides an optical performance monitoring unit. This unit
is responsible for measuring parameters of each optical channel, including the optical
power, central wavelength and Optical Signal-Noise Ratio (OSNR), and sending these
data to the EMS, in which users can view the performance data in a list or in a graph.
3-7
SJ-20130318152421-001|2013-12-20(R1.1)
The optical transponder unit supports performance monitoring and overhead

processing function. It can locate the faults and fault types according to the following
access signals:
For OTN signals: detects performance and alarm messages, including Loss
Of Frame (LOF) alarm, Bit Interleaved Parity (BIP-8), the overhead Trail Trace
Identifier (TTI), corrected bit error count, uncorrectable frame count, OTUk-AIS,
ODUk-AIS, ODUk-OCI, ODUk-LCK, PM-BIP8, ODUk-PT.
For SDH signals: monitors RS_BBE(B1) and J0 bytes.
For GE signals: monitors the packet error count, packet error ratio, and Generic
Framing Procedure (GFP) performance.
The boards on the main optical path use the power collection and monitoring
technology with great dynamic range and high accuracy. With the technology, the
power measurement error is less than 1 dB and the system performance can be truly
reflected.
3.6 Chromatic Dispersion Compensation

For the ZXWM M920 system used for 2.5 G-signal transmission, the dispersion tolerance
is 12800 ps (640 km). For the ZXWM M920 system used for 10 G-signal transmission, the
dispersion tolerance is 400 ps/800 ps (20 km/40 km). If the transmission distance is greater
than that mentioned above, the dispersion restriction should be taken into consideration.
40GTDC
The ZXWM M920 system provides dispersion compensation modules in DCM plug-in
boxes to compensate dispersion.
3.7 Service Functions

Service functions of ZXWM M920 system include three aspects: service access function,
service convergence function, and wavelength add/drop function.
3.7.1 Service Access Function

For the services admittable by the ZXWM M920 system, refer to Table 3-11.
Table 3-11 Services Admittable by the ZXWM M920 System
Service
Description
Synchronous Digital Hierarchy (SDH)
STM-1, STM-4, STM-16, STM-64, STM-256, OTU3,
services
OTU3u, OTU3e, and OTU3f
Plesiochronous Digital Hierarchy
E3 and E4
(PDH) Services
Synchronous Optical Network (SONET
OC-3, OC-12, OC-48, OC-192, and OC-768
services
3-8
SJ-20130318152421-001|2013-12-20(R1.1)
Service
Description
Asynchronous Transfer Mode (ATM
VC4, VC4-4c, and VC4-16c
services or Packet Over SONET/SDH

(POS) services
Ethernet services
FE, GE, 10GE, 40GE, 100GE
SAN services
ESCON, FICON, FC1/2/4/8, 2GFC, 4GFC, 10GFC
Other services
Digital Video Broadcasting (DVB), FDDI, Fiber Connection

(FICON), High Definition Television (HDTV), and Enterprise
System Connection (ESCON)
3.7.2 Service Convergence Function

The ZXWM M920 system can multiplex low-rate signals into high-rate signals, and
demultiplex high-rate signals into low-rate signals. For the descriptions of service boards,
refer to Table 3-12.
Table 3-12 ZXWM M920 Service Aggregation Functions
Board
Description
MQA1
Uses the data multiplexing technology to multiplex/demultiplex four channels of

ANY service signals into/from OTU1 signals.
MQA2
Uses the data multiplexing technology to multiplex/demultiplex four channels of

ANY service signals into/from OTU2 signals.
MJA
Uses the data multiplexing technology to multiplex/demultiplex six channels of ANY

service signals into/from the backplane signals.
MOM2
Implements multiple services convergence to OTU boards. It cannot send services

to the backplane client side.
MQT3
Multiplexes/demultiplexes four channels of 10 G service signals (STM-64, OC-192,

10GbE or OTU2) into/from 40 G signals conforming to the ITU-T G.694.1.
ASMA
Multiplexes/demultiplexes 24 channels of GE signals or one channel of 10 GE

signal into/from two channels of OTU2 signals.
SRM42
Multiplexes/demultiplexes four channels of STM-1 or STM-4 signals at each

tributary side into/from STM-16 signals at the aggregate side.
SRM41
Multiplexes/demultiplexes four channels of STM-16 signals at each tributary

side into/from STM-64 signals at the aggregate side. It supports SDH
synchronous convergence or OTN asynchronous convergence and FEC/AFEC
encoding/decoding. In addition, it complies with the ITU-T G.709.
FCA
Multiplexes/demultiplexes two channels of 4G FC, four channels of 2G FC, or eight

channels of FC signals into/from OTU2 signals.
3-9
SJ-20130318152421-001|2013-12-20(R1.1)
3.8 Communication and Supervision Function

3.8.1 Supervisory Channels
The monitoring subsystem of the ZXWM M920 system consists of SNP, CCP, SOSCB
and SEIA1/SEIA2 boards. The monitoring system contains Optical Supervisory Channel
(OSC) and Electric Supervisory Channel (ESC) to transmit the EMS and orderwire
information.
l
For the descriptions of optical supervisory channels, refer to Table 3-13.

Table 3-13 ZXWM M920 Optical Supervisory Channel
Item
Capability
Monitoring rate
100 Mbit/s
Monitoring direction
The monitoring system supports 16 monitoring directions by installing four SOSCB boards, which can satisfy the monitoring
direction requirements.
Each SOSCB board supports monitoring on four directions. Multiple

SOSCB boards can be installed to support more monitoring directions.
When SOSCB boards serve for optical monitoring, slot 3 or slot 5 in

subrack 1 must be installed with an SOSCB board.
Compatibility
The 100 M optical supervisory channels of the ZXWM M920 system can
communicate with the 100 M optical supervisory channels of the ZXMP
M820 system and ZXWM M920 system.
For descriptions of electrical supervisory channels, refer to Table 3-14.

Table 3-14 ZXWM M920 Electrical Supervisory Channel
Item
Capability
Monitoring rate
The actual rate of an electrical supervisory channel depends on both

optical line rate and quantity of General Communication Channels
(GCCs). There are three groups of GCCs named as GCC0, GCC1, and
GCC2. When these three groups are used, the rate of an electrical
supervisory channel is as follows:
If the line rate is 10 G, the electrical supervisory channel rate is 3.9

Mbit/s.
If the line rate is 2.5 G, the electrical supervisory channel rate is 0.95
Mbit/s.
Monitoring direction
The system supports 16 monitoring directions when enough service

boards supporting ESC are installed.
3-10
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Capability
Compatibility
The ESC electrical supervisory channel of the ZXWM M920 system can
communicate with the 100 M optical supervisory channels of the ZXMP
M820 system and the ZXWM M920 system.
3.8.2 Communication Functions

For the communication functions supported by the ZXWM M920 system, refer to Table
3-15:
Table 3-15 Communication Functions of the ZXWM M920 System
Communication
Channel/Inter-
Type
face
Communication
Qx interface
Description
SNP boards report alarms and performances of NEs and
between NEs and
subnetworks to the EMS through Qx interfaces and receive
the EMS
commands and configurations sent from the EMS.
Communication
100 M
The monitoring system uses the 100 M Ethernet technology
among NEs
supervisory
to encapsulate ECC data, orderwire voice data, APS data,
channel
and transparent user channel data into IP data packets, and

then transmits and exchanges the information in Ethernet
data frames.
The monitoring system uses the Open Shortest Path First
(OSPF) protocol. When the network topology is changed,
a new routing table is automatically aggregated and built,
which guarantees smooth monitoring channels.
If the network span is too large and the line loss is too
high, monitoring signals can be accessed to OTU boards
supporting continuous-rate services to support the in-band
monitoring.
Electrical
Information carried by the ESC is transmitted by overheads
supervisory
in OTN service signals to implement the communication
channel
between two NEs in a single span. Service boards

supporting the ESC function are SOTU2.5G and SOTU10G.
Note:
An RJ45 interface on the SEIA1/SEIA2 board can serve as a Qx interface. It is referred to
as J4 on the SEIA1 board front panel and J3 on the SEIA2 board front panel.
3-11
SJ-20130318152421-001|2013-12-20(R1.1)
3.9 Alarm Monitoring Function

3.9.1 External Alarm Input and Output Function
The ZXWM M920 system supports the external alarm input and output functions.
l
External alarm input function

Through the external alarm input interface on the SEIA1 board of the master subrack,
the equipment uses optical coupling isolation signals to access alarms input by the
external monitoring equipment, and displays the alarms on the EMS. The system can
access up to 10 channels of external alarms to monitor alarms, including fans, doors,
and temperature of external environment. The alarm type is configured in the EMS.
External alarm output function

Through the alarm output, ring output, or cabinet indicator interface on the SEIA1
board, the equipment outputs alarm signals to column-head cabinets in the equipment
room, alarm indicator boards, or other monitoring units. The equipment alarm output
signal and ring output signal are the optical coupling isolation signal or the level drive
signal.
3.9.2 Internal Alarm Monitoring Function

The ZXWM M920 system supports monitoring of communication alarms, equipment
alarms, and ambient environment alarms. These alarms are described in Table 3-16.
Table 3-16 Alarm List
Alarm Type
Alarm Item
Communication
Optical power out-of-limit alarms, SDH service alarms, OTN service alarms,
alarm
out-of-lock alarms, service bit error alarms, Trace Identifier Mismatch (TIM)
alarms, high reflection power alarms, high reflectance alarms.
Equipment alarm
Temperature-related alarms
Temperature out-of-limit alarm of lasers, boards and modules.
Current-related alarms
Over-current alarm of lasers and cooler, laser bias current out-of-limit alarm,
pump laser bias over-current alarm.
Board-related alarms
Laser/pump life alarm, laser fault alarm, M-Z modulator bias voltage
out-of-limit alarm, module failure alarm, module communication fault
alarm, DSP operation alarm, high pump reflection power alarm, high pump
reflectance alarm, laser failure alarm, board out-of-position alarm, board
mounting alarm, and fan fault alarm.
3-12
SJ-20130318152421-001|2013-12-20(R1.1)
Alarm Type
Alarm Item
Ambient
Fire alarm, temperature alarm, and equipment room alarm.
environment alarm
This table only provides the alarm overview. Different boards have different alarms. For detailed
information about alarms of each board, refer to the Unitrans ZXWM M920 (V1.10) Intelligent Optical
Transmission Platform Maintenance Manual (Volume II) Alarm and Performance .
Communication alarms refer to the alarms directly affecting service layer. These alarms indicate
communication signals have interruption or degradation on some layer. Equipment alarms refer to
the alarms directly caused by faults of equipment or internal parts of the boards. Ambient environment
alarms refer to the alarms on environment.
3.10 Protection Functions

3.10.1 SNP 1+1 Protection
Protection Principles
The ZXWM M920 system is configured with two SNP boards (master/slave) to implement
the SNP 11 hot backup function.
The slave SNP board does not send data but receives data. When the master SNP
board does not work normally (such as power-off, reset or faults), the slave SNP board
is automatically switched to the master SNP board.
Application Characteristics
Both of the SNP boards work at the same time and they can be switched manually
or through EMS to ensure uninterrupted services, logical seamless upgrade of
cross-connection board, or seamless upgrade of cross-connect hardware.
SNP boards are the core boards for management and control in a ZXWM M920 system.
The ZXWM M920 system provides 1+1 hot backup for SNP boards to implement the
automatic service switching in case of fault occurrence to ensure the system reliability.
The CLK, CCP, PWD, and PWE boards also support the 1+1 protection.
3.10.2 Cross-Connect Board 1+1/2:2/4:2 Protection

Protection Principle
The ZXWM M920 system supports 1+1, 2:2, and 4:2 protections. The cross-connect
boards improve the system security and stability. For the ZXWM M920 system
cross-connect board protection principles, refer to Table 3-17.
3-13
SJ-20130318152421-001|2013-12-20(R1.1)
Table 3-17 ZXWM M920 Cross-Connect Board Protection

Protection Type
Applicable
Description
Subarck
1+1 redundancy
CX20
protection
Two XCA boards are configured in a CX20 subrack to

implement the master/slave protection. The XCA boards
implement the 1+1 redundancy.
2:2 protection
CX30
Four XCA boards are configured in a CX30 subrack to

implement the 2:2 protection. Two XCA boards are in
working status and the other two XCA boards are in
protection status.
4:2 pretection
CX50/CX51
Six XCA boards are configured in a CX50/CX51 subrack

to implement the 4:2 protection. Four XCA boards are
in working status and the other two XCA boards are in
protection status.
Application Features
When a CX20 subrack is configured with two XCA boards, the two XCA boards implement
the 1+1 redundancy. If one of the two XCA boards is faulty, the service cross-connect is
not interrupted.
When a CX30 subrack is configured with four XCA boards, the four XCA boards implement
the 2:2 redundancy. If any two of the four XCA boards are faulty, the service cross-connect
is not interrupted.
When the CX50/CX51 subrack is configured with six XCA boards, the six XCA boards
implement the 4:2 redundancy. If any two of the four XCA boards are faulty, the service
cross-connect is not interrupted.
3.10.3 OMS 1+1 Protection

In the OMS 1+1 protection, lines of each segment are protected in 1+1 mode. According to
locations of amplification boards, OMS 1+1 protection can be classified into amplification
board shared configuration mode and amplification board redundancy configuration mode.
For the protection on a group of services, see Figure 3-1 and Figure 3-2.
3-14
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 3-1 OMS 1+1 Protection (Amplification Board Shared Configuration Mode)
Figure 3-2 OMS 1+1 Protection (Amplification Board Redundancy Configuration Mode)
l
l
SOP boards monitor the main optical path. If the switching conditions are met, the
optical switch of SOP boards performs the protection switching.
SOP board has two types: SOP1 and SOP2.
An SOP1 board can be used to protect a pair of bidirectional service signals.

In OMS 1+1 protection, the quantity of SOP1 boards configured should be
consistent with that of multiplex sections to be protected.
An SOP2 board can be used to protect two pairs of bidirectional service signals.
In OMS 1+1 protection, the quantity of SOP2 boards configured should be
consistent with half of the quantity of multiplex sections to be protected.
3-15
SJ-20130318152421-001|2013-12-20(R1.1)
3.10.4 OCH 1+1 Protection

An SOP board implements the OCH 1+1 protection by selecting the best of the two
transmitted services. Bidirectional service signals are protected by an OTU board
for working channel and an OTU board for protection channel in each direction. This
configuration mode is also called "OTU redundancy configuration mode".
At the transmitting end, the signal is divided into two signals by a coupler in the SOP
board. Then, the two signals are respectively sent to two transmitter OTUs, occupying two
different channels for transmission.
At the receiving end, the selection circuit in the SOP board selects the better signal from
two signals. The protection mode is shown in Figure 3-3 (The protection for a group of
services is used as an example).
Figure 3-3 OCH 1+1 Protection (Chain Network)
Application
An SOP1 board can protect one group of bidirectional service signals. In OCH 1+1
protection, the quantity of SOP1 boards configured should be consistent with the quantity
of channels to be protected. An SOP2 board can protect two groups of bidirectional
service signals. In OCH 1+1 protection, the quantity of SOP2 boards configured should
be half of the quantity of channels to be protected.
Both the protection channel and working channel are carried by the same fiber. Therefore,
the OCH 1+1 protection in a chain network can be used for equipment, but not routes.
3.10.5 Two-Fiber Bidirectional OCH Shared Protection

In a two-fiber bidirectional OCH shared protection ring, the wavelength 1 in the outer ring
works as the working channel while 1 in the inner ring works as the protection channel.
3-16
SJ-20130318152421-001|2013-12-20(R1.1)
Wavelengths of multiple unidirectional services can be reused in different spans in the

working channel, and the protection channel shares all the services in the working channel.
As shown in Figure 3-4, when a span is faulty, the services through this span are damaged.
As a result, the transmitting end executes the switching, and services are transmitted to
the protection route. The services at the receiving end are received through the protection
route.
Figure 3-4 Schematic Diagram of Two-Fiber Bidirectional OCH Shared Protection
The system uses the SOPCS board to control the the add channels by controlling the
access switch, which ensures that multiple services in the same working channel will not
conflict in the protection channel.
3.10.6 Chain Network-Based Electrical Layer 1+1 Wavelength

Protection
The purpose of chain network-based electrical layer 1+1 wavelength protection is to
protect traffic (42.5G) at the wavelength level. Cross connect subsystem boards serve to
implement electrical layer 1+1 wavelength protection. Figure 3-5 illustrates the electrical
layer 1+1 wavelength protection configuration at the line side.
3-17
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 3-5 Electrical Layer 1+1 Wavelength Protection Configuration at Line Side
For the system configurations, refer to Table 3-18.

Table 3-18 Description of Electrical Layer 1+1 Wavelength Protection Configuration
Location
Description
Client side
The protection granularity is the wavelength channel at line side. There is no

special requirement for the service access mode at the client side. Client-side
services are implemented by CO2, CQ2, CS3, CD3, and CS4 boards.
Line side at the
Multiple channels of client service signals are duplicated into two same groups of
transmit end
signals by the XCA board and these two groups of signals are then forwarded to
the corresponding line-side boards, typically to two different LO2, LQ2, LS3, and
LS4 boards at the line side. This configuration is equivalent to dual service boards
configured at the line side in case of 1+1 service protection at the client side.
Intermediate line
At the intermediate node that a service travels by, the cross connect unit can
change the wavelength of the service.
Line side at
Two independent LO2, LQ2, LS3, and LS4 boards are respectively configured as
receiving end
working and protection boards. The working path and the protection path may be
path-correlated (sharing fiber/sharing cable) or path-uncorrelated (respectively
corresponding to the long path and the short path in two directions in a ring
network).
APS controller
The SNP board serves as the APS controller to execute switching and restoration
commands to the APS executor board according to the information collected by
the APS detector board and protection protocols.
APS detector
Line-side LO2, LQ2, LS3, and LS4 boards at the receiving end respectively act as
the APS detector boards for the working path and protection path.
APS executor
The XCA board serves as the APS executor. APS controller board executes
APS commands to both the active and standby XCA boards to implement traffic
protection switching.
Compared with optical layer 1+1 OCH protection, the electrical layer 1+1 wavelength
protection has the following advantage and disadvantage:
3-18
SJ-20130318152421-001|2013-12-20(R1.1)
l
l
Advantage: This protection mode can support the centralized protection of multiple
services bundled in the same wavelength channel.
Disadvantage: The protection switching cannot be triggered by faults generated in a
single sub-wavelength service, that is, it cannot support the protection based on the
service granularity.
3.10.7 Ring Network-based Electrical Layer Two-Fiber Bidirectional

Channel Shared Protection
The two-fiber bidirectional channel shared protection based on the ring network at
the electrical layer supports both the protection based on wavelength granularity or
sub-wavelength (service) granularity. Its protection principle is similar to that of optical
layer two-fiber bidirectional channel shared protection. The optical layer two-fiber
bidirectional channel shared protection is implemented by the OPCS board, while the
electrical layer one is implemented by cross-connect subsystem boards. The combination
of cross connect subsystem boards provides the same logical functions as the OPCS
board. Figure 3-6 shows the principle of electrical layer two-fiber channel shared
protection.
Figure 3-6 Electrical Layer Two-Fiber Bidirectional Channel Shared Ring Network
Protection Configuration
Relationship between working path and protection path

The working path and the protection path are uncorrelated in electrical layer two-fiber
bidirectional channel shared ring. They respectively correspond to the short path and
the long path in the ring network.
Protocol execution
It is necessary to execute the APS protocol in electrical layer two-fiber bidirectional
channel shared ring.
APS controller: The SNP board serves as the APS controller.
APS detector: Line-side LO2, LQ2, LS3, and LS4 boards at the receiving
end respectively act as the APS detector boards for the working path and the
3-19
SJ-20130318152421-001|2013-12-20(R1.1)
protection path. Client-side CO2, CQ2, CS3, CD3, and CS4 boards act as the
detector board for service signals (STM-1/4/16), and the detection signals are
shared by working and protection channels.
APS executor: The SNP board sends APS commands to both the active and
standby XCA boards in the cross-connect subsystem to implement the traffic
protection switching.
Features
Advantage: The protection granularity is flexible, which can be a sub-wavelength

traffic or aggregate wavelength signal. Either line fault or service signal fault can
trigger protection switching. The electrical layer two-fiber bidirectional channel
shared protection can implement cross-span protection with protection channel
shared on the whole ring.
Disadvantage:
complex.
The implementation mechanism of this protection mode is
3.10.8 Protection Capability for EMS Channel

The ZXWM M920 system can configure EMS channel standby route. Standby routes refer
to Ethernet routes connecting SNP boards in NEs and the EMS computer. In practice,
network interfaces of standby routes can be connected to SEIA1/SEIA2 boards to provide
standby routes for monitoring channels. When the optical monitoring channel fails to work,
SNP boards can ensure the transmission and exchange of monitoring messages through
the standby route.
3.11 Clock Management Function

The ZXWM M920 system uses a separate clock board CLK to support the clock transfer
function and generate the system clock. The CLK board supports 1+1 backup, maintains
synchronization between master/slave output clocks and the system clock, and cooperates
with the system to implement seamless switching between the master clock board and the
slave clock board.
The external clock can be accessed from the clock panel or through an external clock
interface board.
l
l
The ZXWM M920 system can extract clock sources from service boards, and use
them as the system clock sources.
CLK clock boards support the three modes specified by ITU-T G.813: free running,
holdover, and automatic lock. The three modes can be configured in the EMS.
3.12 Clock Time Synchronization Function

OTN
3-20
SJ-20130318152421-001|2013-12-20(R1.1)
l
l
IEEE 1588V2
The ZXWM M920 clock synchronization function supports transmitting clock

synchronization signals among subracks and networks. It has the following features:
l
l
l
l
Supports the clock synchronization and the time synchronization to meet the
requirements for time synchronization accuracy.
The physical-layer synchronization mechanism extracts clock from the serial
bit stream in physical channel of transmission link to implement the frequency
synchronization.
The time synchronization complies with the IEEE 1588 V2 protocol. The ZXWM M920
system provides an out-of-band time synchronization interface between 1pps+TOD
and FE to implement the out-of-band time transmission.
Uses the Best Master Clock (BMC) algorithm to select a clock. The BMC algorithm
compares the descriptions of two or more clocks, and selects the better one. The
Ordinary Clock (OC), Boundary Clock (BC ) , and Transparent Clock (TC) are
supported.
Supports processing the Synchronization Status Message (SSM) and the delay
compensation.
Supports the protection switch of active/standby clock sources.
Clock Synchronization
OTN2M BITSSDH
OTN
l
l
OSC
Table 3-19
Table 3-19
CLK
2M BITSSDH
CLK
GE10GESOUT10G
10GEODU2e10GEODU2e
3-21
SJ-20130318152421-001|2013-12-20(R1.1)
OTNSOSCB+TIS
SOSCBTIS
Time Synchronization
OTNOSCIEEE 1588V2
OTNSOSCB+TIS
/SOSCB+TIS SOSCB
3-22
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 4
Hardware Architecture
Table of Contents
Cabinet ......................................................................................................................4-1
Board .........................................................................................................................4-2
4.1 Cabinet
Cabinet Type
The ZXWM M920 system uses a ZTE cabinet with a single front door, which complies
with European Telecommunication Standard Institute (ETSI) standards. For the cabinet
appearance, see Figure 4-1.
Figure 4-1 ZXWM M920 Cabinet
Cabinet Configuration
For the configurations of the ZXWM M920 cabinet, refer to Table 4-1.
4-1
SJ-20130318152421-001|2013-12-20(R1.1)
Table 4-1 ZXWM M920 Cabinet Configuration

Cabinet
Dimensions
(HWD)
mm
Quantity
Power
Distribution
Subrack
NX4/DX41
Box
Module
CX20/C-
CX30/
CX50/C-
X21
CX31
X51
CX4
DCM
Plug-in
Box
2000 600
300
2200 600
300
2600 600
300
l
l
l
-1
Note:
The configuration of the subrack depends on the actual needs.Table 4-1 lists the
maximum numbers of the same type subracks.
The Dispersion Compensation Module (DCM) plug-in box is optional. Table 4-1 lists
the recommended numbers of DCMs.
You can install devices of other manufacturers in the cabinet, such as routers. The
outlines and dimensions of the devices should meet the installation requirements for
ZTE transmission equipment cabinets.
4.2 Board
For boards used in each ZXWM M920 subsystem, refer to Table 4-2.
4-2
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 4 Hardware Architecture
Table 4-2 Subsystem Configurations

Subsystem
Board/Module
Service access and
EOTU10G, EOTU10GB, SOTU10G, TST3, SOTU2.5G, MQT3,
convergence subsystem
ASMA, SRM41/42, FCA/FCAG, ASMB, TD2C, TS2C, TS4, MQA1,

MQA2, MJA, MOM2
Mux/DeMux subsystem
OMU, ODU, ODUB,OCI, SSDM, VMUX, VMUXB, SOAD, SOGMD,

WBU, WSU, WBM, PDU,
Optical amplification
SEOBA, SEOPA, SEOLA, EONA, EOBAH, LAC, DRA
subsystem
Monitoring subsystem
SNP, SCC, SEIA1/SEIA2, CCP, SOSCB, TIS, ETI, EIC
Protection subsystem
SOP, OMCP, SOPMS, SOPCS
Cross-connect subsystem
XCA, CH1, LO2, CO2, LQ2, LD2B, CQ2, CLK, CS3, CD3, LS3,
CS4, LS4, EHG1, EQG2
Optical layer management
OWM, OPM, EOPM, EOWM
subsystem
Power supply subsystem
PWD, FCC, SPWA, SFANA, PWE
RPOA subsystem
RPU, RGU
For the ZXWM M920 system architecture on the basis of functional modules, see Figure
4-2. The ZXWM M920 system is composed of nine functional subsystems. They are
independent from each other but operate in coordination.
Figure 4-2 ZXWM M920 System Architecture
4-3
SJ-20130318152421-001|2013-12-20(R1.1)
Note:
In application, functional modules on each site should be configured as required.
The service flows between functional subsystems are described as follows:

l
After service signals are received in the service access and convergence subsystem,
they are sent to the Mux/Demux subsystem for multiplexing. The multiplexed signals
are then sent to the optical amplifier subsystem for amplification. The amplified signals
are transmitted to the optical-fiber line.
After service signals are received in the service access and convergence subsystem,
they are sent to the optical amplifier subsystem for amplification. The amplified
optical signals are then sent to the Mux/Demux subsystem for demultiplexing. The
demultiplexed signals are sent to the service boards.
To implement the service protection, the protection subsystem must be configured.

The protection subsystem can be located before or after the service access and
convergence subsystem.
To switch services, the cross-connect subsystem must be configured. Client service
signals are accessed, switched, and aggregated at the cross-connect system, and
then sent to the optical-fiber line.
To implement the ultra-long-haul single-span transmission, the RPOA subsystem
must be configured after the optical amplifier subsystem.
4-4
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 5
Software Architecture
Table of Contents
Software Architecture Overview .................................................................................5-1
EMS Software ............................................................................................................5-1
NE Control and Processing Software..........................................................................5-3
Board Software ..........................................................................................................5-4
Communication Protocols and Interfaces ...................................................................5-4
5.1 Software Architecture Overview

The ZXWM M920 software architecture consists of a board software, NE control and
processing software, and EMS software. They are respectively operating on boards,
NE control processor boards, and EMS to implement the management and control for
boards, NEs and the whole network.
According to the hierarchical design, each layer of the ZXWM M920 software supports
specific functions and provides services for the upper layer. The software architecture is
shown in Figure 5-1.
Figure 5-1 ZXWM M920 Software Architecture
5.2 EMS Software

The ZXWM M920 system uses the U3 EMS software to manage and monitor NEs.
The network management software supports the fault management, performance
management, security management, configuration management, maintenance
management, and system management.
5-1
SJ-20130318152421-001|2013-12-20(R1.1)
The EMS structure is shown in Figure 5-2.

Figure 5-2 EMS Structure
Manager
It is also referred to as Server. Compared to Graphical User Interface (GUI), Manager
works as a Server. Through Qx interfaces, Manager sends management commands
to the corresponding NE control and processing software, receives messages from
NE control and processing software, and saves all the network management data
including the basic data of system management, configuration management, and
alarm maintenance in the database. Manager only saves management data in the
local network.
Graphical User Interface (GUI)

It is also referred to as Client. The GUI provides graphical interfaces for users. The
users can implement configuration management, fault management, performance
management, security management, maintenance management and system
management in the GUI. The GUI does not save dynamic network management
data, which are retrieved from Database by Manager when the users use the GUI.
Database
The Database stores data about information query, configuration and alarm for
interfaces and management functional modules. It also implements the processing
of data consistency.
5-2
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 5 Software Architecture
5.3 NE Control and Processing Software

NE control and processing software is located on the Smart Node Processor (SNP) board
to manage, monitor and control the board operation status in the NE. As a communication
service unit between the network management system and boards, it implements control
and management for NEs. For the functions supported by the NE control and processing
software, refer to Table 5-1:
Table 5-1 NE Control and Processing Software Functions
Serial No.
Function
Configures boards during power-on initialization of the NEs.
Monitors alarm and performance status of the operating NE, receives EMS monitoring
and configuration commands from gateway NE through Error Check and Correction
(ECC) interfaces, and reports command results, NE alarms and performance status.
Gateway NEs are connected with the EMS through Ox interfaces.
Controls APS, APR and WASON.
The structure of the NE control and processing software is shown in. For the functional
modules of the NE control and processing software, refer to Table 5-2:
Figure 5-3 Structure of the NE Control and Processing Software
Table 5-2 Functional Modules of the NE Control and Processing Software

Module
Description
Embedded operation system
The embedded operation system platform is responsible for public
platform
resource management, and provides an application environment

independent from hardware.
Fault management module
The fault management module collects and handles alarm.
Performance management
The performance management module collects and handles
module
performance events.
5-3
SJ-20130318152421-001|2013-12-20(R1.1)
Module
Description
Configuration management
The configuration management module handles configuration
module
requirements.
Master/slave switching module
The master/slave switching module implements data

synchronization and switching between the master SNP and the
slave SNP boards to perform the 1+1 hot backup for SNP boards.
APS module
The APS module implements protection switching function

according to the actual application of protection modes and the
equipment.
WASON module
The WASON module controls boards to implement the WASON

function based on actual application of networks and the equipment.
APSD/APR module
The APSD/APR module implements the APSD/APR function

according to the actual application of the equipment.
5.4 Board Software

The board software operates on each board to manage, monitor and control the operation
status of each board. It receives commands sent from the Network Element Management
System (EMS) through an agent on the SNP board, and then responds and takes actions
on the commands. It reports alarm and performance events of the board to the EMS.
The functions of board software include alarm and performance handling, configuration
management, communication management, board software online download, and
functional circuits driven.
5.5 Communication Protocols and Interfaces

For interfaces of the ZXWM M920 software system and their corresponding communication
protocols, refer to Table 5-3.
Table 5-3 ZXWM M920 Software System Interfaces
Interface Name
Description
S interface
It is the interface between the NE control and processing software and

the MCU, that is, the communication interface between the SNP board
and other boards.
5-4
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 5 Software Architecture
Interface Name
Description
Qx interface
It is the interface between the NE control and processing software and the
Manager, that is, the interface between the SNP board and the computer
on which the EMS Server program operates. For the ZXWM M920 system,
Qx interface is located on the SEIA board. It complies with Transfer
Control Protocol (TCP)/Internet Protocol (IP) protocol, International
Telecommunication Union - Telecommunication Standardization Sector
(ITU-T) Q.811 and ITU-T Q.812 recommendations.
ECC interface
It is the communication interface between NEs. The ECC interface uses

an optical monitoring channel for communication and supports the TCP/IP
protocol.
CTI interface
It is the control interface in the NE, and implements APS, APR, and
WASON functions.
5-5
SJ-20130318152421-001|2013-12-20(R1.1)
5-6
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 6
Technical Specifications
Table of Contents
Requirements on Operating Wavelength ....................................................................6-1
Service Access and Convergence Subsystem Specifications .....................................6-7
Optical Mux/DeMux Subsystem Specifications ........................................................6-11
Optical Amplification Subsystem Specifications .......................................................6-23
Optical Layer Management Subsystem Specifications..............................................6-33
Protection Subsystem Specifications ........................................................................6-35
Supervision Subsystem Specifications .....................................................................6-38
RPOA Subsystem Specifications..............................................................................6-39
DCM Technical Specifications ..................................................................................6-40
Environment Specifications ......................................................................................6-42
Electro Magnetic Compatibility Requirements...........................................................6-47
Weight Power Consumption Dimensions ..................................................................6-48
6.1 Requirements on Operating Wavelength

6.1.1 Allocation of Continuous Wavelengths
l
The spacing between wavelengths is 100 GHz when the ZXWM M920 system is
configured as a system with no more than 40 wavelengths in C band. Table 6-1 lists
the wavelengths allocated in a 40-channel system.
Table 6-1 Wavelength Allocation (40 Channels in C Band with Spacing at 100 GHz)
S/N
Central Frequency
Central
(THz)
Wavelength (nm)
192.10
1560.61
192.20
S/N
Central Frequency
Central Wavelength
(THz)
(nm)
21
194.10
1544.53
1559.79
22
194.20
1543.73
192.30
1558.98
23
194.30
1542.94
192.40
1558.17
24
194.40
1542.14
192.50
1557.36
25
194.50
1541.35
192.60
1556.55
26
194.60
1540.56
192.70
1555.75
27
194.70
1539.77
192.80
1554.94
28
194.80
1538.98
192.90
1554.13
29
194.90
1538.19
6-1
SJ-20130318152421-001|2013-12-20(R1.1)
S/N
Central Frequency
Central
(THz)
Wavelength (nm)
10
193.00
1553.33
11
193.10
12
Central Frequency
Central Wavelength
(THz)
(nm)
30
195.00
1537.4
1552.52
31
195.10
1536.61
193.20
1551.72
32
195.20
1535.82
13
193.30
1550.92
33
195.30
1535.04
14
193.40
1550.12
34
195.40
1534.25
15
193.50
1549.32
35
195.50
1533.47
16
193.60
1548.51
36
195.60
1532.68
17
193.70
1547.72
37
195.70
1531.9
18
193.80
1546.92
38
195.80
1531.12
19
193.90
1546.12
39
195.90
1530.33
20
194.00
1545.32
40
196.00
1529.55
S/N
The spacing between wavelengths is 50 GHz when the ZXWM M920 system
is configured as a system with 80 wavelengths in C band. Table 6-2 lists the
wavelengths allocated in the 80-channel system.
Table 6-2 Wavelength Allocation (80 Channels in C Band with Spacing at 50 GHz)
S/N
Central Frequency
Central Wavelength
(THz)
(nm)
196.05
1529.16
196.00
S/N
Central Frequency
Central Wavelength
(THz)
(nm)
41
194.05
1544.92
1529.55
42
194.00
1545.32
195.95
1529.94
43
193.95
1545.72
195.90
1530.33
44
193.90
1546.12
195.85
1530.72
45
193.85
1546.52
195.80
1531.12
46
193.80
1546.92
195.75
1531.51
47
193.75
1547.32
195.70
1531.90
48
193.70
1547.72
195.65
1532.29
49
193.65
1548.11
10
195.60
1532.68
50
193.60
1548.51
11
195.55
1533.07
51
193.55
1548.91
12
195.50
1533.47
52
193.50
1549.32
13
195.45
1533.86
53
193.45
1549.72
14
195.40
1534.25
54
193.40
1550.12
15
195.35
1534.64
55
193.35
1550.52
6-2
SJ-20130318152421-001|2013-12-20(R1.1)
Chapter 6 Technical Specifications
S/N
Central Frequency
Central Wavelength
(THz)
(nm)
16
195.30
1535.04
17
195.25
18
Central Frequency
Central Wavelength
(THz)
(nm)
56
193.30
1550.92
1535.43
57
193.25
1551.32
195.20
1535.82
58
193.20
1551.72
19
195.15
1536.22
59
193.15
1552.12
20
195.10
1536.61
60
193.10
1552.52
21
195.05
1537.00
61
193.05
1552.93
22
195.00
1537.4
62
193.00
1553.33
23
194.95
1537.79
63
192.95
1553.73
24
194.90
1538.19
64
192.90
1554.13
25
194.85
1538.58
65
192.85
1554.54
26
194.80
1538.98
66
192.80
1554.94
27
194.75
1539.37
67
192.75
1555.34
28
194.70
1539.77
68
192.70
1555.75
29
194.65
1540.16
69
192.65
1556.15
30
194.60
1540.56
70
192.60
1556.55
31
194.55
1540.95
71
192.55
1556.96
32
194.50
1541.35
72
192.50
1557.36
33
194.45
1541.75
73
192.45
1557.77
34
194.40
1542.14
74
192.40
1558.17
35
194.35
1542.54
75
192.35
1558.58
36
194.30
1542.94
76
192.30
1558.98
37
194.25
1543.33
77
192.25
1559.39
38
194.20
1543.73
78
192.20
1559.79
39
194.15
1544.13
79
192.15
1560.20
40
194.10
1544.53
80
192.10
1560.61
S/N
The spacing between wavelengths is 100 GHz/50 GHz when the ZXWM M920
system is configured as an extended C-band 48/96-channel system. Table 6-3 lists
the wavelengths allocated in such a system.
6-3
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-3 Wavelength Allocation (48/96 Channels in Extended C Band with Spacing at 100 Ghz/50
Ghz)
S/N
Sub-
Nominal
Nominal Central
Band
Central
Wavelength
Frequency
(nm)
S/N
Sub-
Nominal
Nominal
Band
Central
Central
Frequency
Wavelength
(THz)
(nm)
(THz)
1
C1002
196.05
1529.16
49
C1002
193.65
1548.11
C1001
196.00
1529.55
50
C1001
193.60
1548.51
C1002
195.95
1529.94
51
C1002
193.55
1548.91
C1001
195.90
1530.33
52
C1001
193.50
1549.32
C1002
195.85
1530.72
53
C1002
193.45
1549.72
C1001
195.80
1531.12
54
C1001
193.40
1550.12
C1002
195.75
1531.51
55
C1002
193.35
1550.52
C1001
195.70
1531.9
56
C1001
193.30
1550.92
C1002
195.65
1532.29
57
C1002
193.25
1551.32
10
C1001
195.60
1532.68
58
C1001
193.20
1551.72
11
C1002
195.55
1533.07
59
C1002
193.15
1552.12
12
C1001
195.50
1533.47
60
C1001
193.10
1552.52
13
C1002
195.45
1533.86
61
C1002
193.05
1552.93
14
C1001
195.40
1534.25
62
C1001
193.00
1553.33
15
C1002
195.35
1534.64
63
C1002
192.95
1553.73
16
C1001
195.30
1535.04
64
C1001
192.90
1554.13
17
C1002
195.25
1535.43
65
C1002
192.85
1554.54
18
C1001
195.20
1535.82
66
C1001
192.80
1554.94
19
C1002
195.15
1536.22
67
C1002
192.75
1555.34
20
C1001
195.10
1536.61
68
C1001
192.70
1555.75
21
C1002
195.05
1537
69
C1002
192.65
1556.15
22
C1001
195.00
1537.4
70
C1001
192.60
1556.55
23
C1002
194.95
1537.79
71
C1002
192.55
1556.96
24
C1001
194.90
1538.19
72
C1001
192.50
1557.36
25
C1002
194.85
1538.58
73
C1002
192.45
1557.77
26
C1001
194.80
1538.98
74
C1001
192.40
1558.17
27
C1002
194.75
1539.37
75
C1002
192.35
1558.58
28
C1001
194.70
1539.77
76
C1001
192.30
1558.98
29
C1002
194.65
1540.16
77
C1002
192.25
1559.39
6-4
SJ-20130318152421-001|2013-12-20(R1.1)
S/N
Sub-
Nominal
Nominal Central
Band
Central
Wavelength
Frequency
(nm)
S/N
Sub-
Nominal
Nominal
Band
Central
Central
Frequency
Wavelength
(THz)
(nm)
(THz)
30
C1001
194.60
1540.56
78
C1001
192.20
1559.79
31
C1002
194.55
1540.95
79
C1002
192.15
1560.2
32
C1001
194.50
1541.35
80
C1001
192.10
1560.61
33
C1002
194.45
1541.75
81
C1002
192.05
1561.02
34
C1001
194.40
1542.14
82
C1001
192.00
1561.42
35
C1002
194.35
1542.54
83
C1002
191.95
1561.83
36
C1001
194.30
1542.94
84
C1001
191.90
1562.24
37
C1002
194.25
1543.33
85
C1002
191.85
1562.64
38
C1001
194.20
1543.73
86
C1001
191.80
1563.05
39
C1002
194.15
1544.13
87
C1002
191.75
1563.46
40
C1001
194.10
1544.53
88
C1001
191.70
1563.87
41
C1002
194.05
1544.92
89
C1002
191.65
1564.27
42
C1001
194.00
1545.32
90
C1001
191.60
1564.68
43
C1002
193.95
1545.72
91
C1002
191.55
1565.09
44
C1001
193.90
1546.12
92
C1001
191.50
1565.5
45
C1002
193.85
1546.52
93
C1002
191.45
1565.91
46
C1001
193.80
1546.92
94
C1001
191.40
1566.32
47
C1002
193.75
1547.32
95
C1002
191.35
1566.73
48
C1001
193.70
1547.72
96
C1001
191.30
1567.14
C1001 and C1002 respectively refers to the first and second sub-bands in the extended C band. Each sub-band
contains 48 wavelengths with the spacing at 100 GHz.
6.1.2 Allocation of Uncontinuous Wavelengths

When the Mux/DeMux board is used in the system for wavelength multiplexing and
demultiplexing, some wavelengths cannot be used due to the technical limitation of
filters in the board. These wavelengths are called unavailable wavelengths or black
wavelengths.
In this case, the system works in C band at the spacing of 100 GHz. Although C band
includes 40 wavelengths, only 32 uncontinuous wavelengths of them can be used,
which are divided into four wavelength groups: red-red ribbon (RR), red-blue ribbon
(RB), blue-red ribbon (BR) and blue-blue ribbon (BB) together. Each group includes 8
wavelengths. We also call RR and RB together as red ribbon, BR and BB as blue ribbon.
Figure 6-1 illustrates the allocation of these uncontinuous wavelengths.
6-5
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 6-1 Allocation of Uncontinuous Wavelengths
Note:
21 represents the wavelength with the frequency 192.10 THz.
wavelength with the frequency 192.8 THz, and so on.
28 represents the
The detailed allocation of uncontinuous wavelengths is listed in Table 6-4. Wavelength

of 9, 10, 19, 20, 21, 22, 31 and 32 are marked grey in the table and are unavailable
wavelengths.
Table 6-4 Uncontinuous Wavelengths and Corresponding Central Frequencies
S/N
Central
Central
Frequency
Wavelength
(THz)
(nm)
192.10
1560.61
192.20
S/N
Central
Central
Frequency (THz)
Wavelength (nm)
21
194.10
1544.53
1559.79
22
194.20
1543.73
192.30
1558.98
23
194.30
1542.94
192.40
1558.17
24
194.40
1542.14
192.50
1557.36
25
194.50
1541.35
192.60
1556.55
26
194.60
1540.56
192.70
1555.75
27
194.70
1539.77
192.80
1554.94
28
194.80
1538.98
192.90
1554.13
29
194.90
1538.19
10
193
1553.33
30
195
1537.40
11
193.10
1552.52
31
195.10
1536.61
12
193.20
1551.72
32
195.20
1535.82
13
193.30
1550.92
33
195.30
1535.04
14
193.40
1550.12
34
195.40
1534.25
15
193.50
1549.32
35
195.50
1533.47
16
193.60
1548.51
36
195.60
1532.68
6-6
SJ-20130318152421-001|2013-12-20(R1.1)
S/N
Central
Central
Frequency
Wavelength
(THz)
(nm)
17
193.70
1547.72
18
193.80
19
20
S/N
Central
Central
Frequency (THz)
Wavelength (nm)
37
195.70
1531.90
1546.92
38
195.80
1531.12
193.90
1546.12
39
195.90
1530.33
194
1545.32
40
196
1529.55
6.2 Service Access and Convergence Subsystem

Specifications
6.2.1 Board Types
For the ZXWM M920 system board types, refer to Table 6-5.
Table 6-5 Board Types
Type
Board
2.5 G board
SOTU2.5G/MQA1/MJA/CH1/DSAC/COM/COMB/SAUC/SMUB/SDSA/SR
M42/DSAF/DSAB/DSA/COM/COMB/EHG1
10 G board
EOTU10G/EOTU10GB/SOTU10G/TD2C/TS2C/FCA/FCAG/SRM41/ASMA
/ASMB/MQA2/LO2//LD2B/CO2/CQ2/LQ2/LD2/CD2/EQG2
40 G board
MQT3/TST3/CS3/CD3/LS3
100 G board
TS4/CS4/LS4/MX2
6.2.2 2.5 G Board Specifications

Table 6-6 lists the interface specifications at the line side of the 2.5 G board
Table 6-6 Line-Side Interface Specifications of the 2.5 G Board
Item
Unit
Parameter
dBm
21 PIN
OTURn
Receiver sensitivity
<-28 APD
Receiver reflection
dB
<27
Overload power
dBm
0 PIN
9 APD
6-7
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Unit
Parameter
Wavelength range of input signal
nm
1280 to 1565
nm
0.2EA MSA24pin
0.5DM MSA24pin
1SFP
OTUSn
Spectral
Maximum -20 dB
characteristics
bandwidth
Minimum side mode
dB
35
THz
192.1 to 196.0
GHz
12.5100 GHz
Maximum
dBm
Minimum
dBm
dB
+10EA
8.2DM MSA24pin/SFP
12800EA MSA24pin
6400DM MSA24pin
3600DM SFP
suppression ratio
Central frequency
Nominal central
frequency
Central frequency
offset
Mean output power
Minimum extinction ratio
Dispersion tolerance
ps/nm
Eye diagram
In compliance with ITU T. G.957 or ITU

T. G.959.1 Recommendation
6.2.3 10 G Board Specifications

Table 6-7 lists the interface specifications at the line side of the 10 G board.
Table 6-7 Line-Side Interface Specifications of the 10 G Board
Item
Unit
Parameter
Gbi-
9.953 to 11.318
OTURn
Signal rate
t/s
dBm
14 PIN
21 APD
Receiver reflection
dB
-27
Overload power
dBm
>0 PIN
>9 APD
nm
1280 to 1565
6-8
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Unit
Parameter
nm
<0.3NRZ-DPSK
nm
<0.4RZ-DPSK
dB
30
THz
In compliance with ITU-T G.694.1 Recommendation
GHz
12.5100 GHz
OTUSn
Spectral
Maximum -20 dB
charac-
bandwidth
teristics
Minimum side mode
suppression ratio
Cen-
Nominal central
tral fre-
frequency
quency
Central frequency
offsetEOL
Central frequency
550 GHzOWM
GHz
offsetBOL
Mean
MSA300/XFP
output
NRZ-DPSK
10100 GHz
350 GHzOWM
dBm
3 to 1
dBm
5 to 2
Minimum extinction ratio
dB
8.2
Disper-
ps/
300 to 800
power
MSA300RZ-DPSK
MSA300NRZ-DPSK
sion tolerance
nm
MSA300RZ-DPSK
ps/
400 to 400
nm
Eye diagram
In compliance with ITU-T G.691 or ITU-T G.959.1

Recommendation
6.2.4 40G Board Specifications

Table 6-8 lists the interface specifications at the line side of the 40 G board.
Item
Unit
Parameter
Signal rate
Gbit/s
39.813 to 44.6
Receiver sensitivityEDFA
dBm
15
Receiver reflection
dB
<27
Overload power
dBm
nm
1528 to 1568
OTURn
OTUSn
6-9
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Spectral characteristics
Maximum -20 dB
Unit
Parameter
nm
0.7 P-DPSK
bandwidth
0.6 RZ-DQPSK
Minimum
dB
35
THz
In compliance with ITU-T G.694.1
side mode
suppression ratio
Central frequency
Nominal central
frequency
Recommendation
Central frequency
GHz
5100 GHz
offsetEOL
2.550 GHz
Central frequency
GHz
3100 GHz
offsetBOL
Mean output power
Dispersion tolerance
1.550 GHz
P-DPSK
dBm
5 to 5
RZ-DQPSK
dBm
9 to 3
RZ-DQPSK
ps/nm
TBD
6.2.5 100 G Board Specifications

Table 6-9 lists the interface specification at the line side of the 100 G board.
Item
Unit
Parameter
Signal rate
Gbit/s
111.8 to 125.75
dBm
15
Receiver reflection
dB
<27
Overload power
dBm
dBm
20
(1dB OSNR
ps/nm
70000 PM QPSK
(1dB OSNR
ps
30 PM QPSK
nm
1528 to 1568
OTURn
6-10
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Spectral characteristics
Maximum -20 dB
Unit
Parameter
nm
TBD
nm
TBD
dB
35
THz
In compliance with
bandwidth
Minimum -3dB
bandwidth
Minimum side mode
suppression ratio
Central frequency
Nominal central
frequency
ITU-T G.694.1
Recommendation
Central frequency
GHz
2.5
GHz
1.5
Maximum
dBm
3PM-QPSK
Minimum
dBm
5PM-QPSK
offsetEOL
Central frequency
offsetBOL
Mean output power
6.3 Optical Mux/DeMux Subsystem Specifications

6.3.1 SOAD Board Specifications
For the technical specifications of the SOAD2 board, refer to Table 6-10. For the technical
specifications of the SOAD4 board, refer to Table 6-11.
Table 6-10 Technical Specifications of the SOAD2 Board
Item
Specification
Central frequency range (THz)
191.30 to 196.05 (CE band)
Add/drop channel quantity
1 dB bandwidth (Drop) (nm)
> 0.2
< 1.20
Channel spacing (GHz)
100
Isolation (dB)
IN-D1/D2@ Adjacent channel
> 25
IN-D1/D2@ Non-adjacent channel
> 35
IN-MID1@ Drop channel
> 14
IN-OUT@ Drop channel
> 28
Optical return loss (dB)
> 40
6-11
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Insertion loss (dB)
Specification
Drop wavelength (IN-D1/D2)
<3
Add wavelength (A1/A2-OUT)
<3
Pass-through wavelength
<4
(IN-OUT)
Polarization dependent loss (PDL) (dB)
< 0.2
Polarization mode dispersion (PMD) (ps)
< 0.1
Maximum allowed optical power (mW)
< 500
Table 6-11 Technical Specifications of the SOAD4 Board

Item
Specification
Central frequency range (THz)
191.30 to 196.05 (CE band)
Add/drop channel quantity
> 0.2 nm
<1.20 nm
100 GHz
Isolation (dB)
IN-D1/D2/D3/D4@ Adjacent channel
> 25
IN-D1/D2/D3/D4@ Non-adjacent
> 35
channel
Insertion loss
(dB)
IN-MID1@ Drop channel
> 14
IN-OUT@ Drop channel
> 28
Drop wavelength (IN-D1/D2/D3/D4)
< 4.0
Add wavelength (A1/A2/A3/A4-OUT)
< 4.0
Pass-through wavelength (IN-OUT)
< 5.0
Directivity (dB)
> 60
> 40
< 0.2
< 0.1
Maximum allowed optical power (mW)
< 500
6.3.2 OMU Board Specifications

For the technical specifications of the 8/16/32-channel OMU board, refer to Table 6-12.
For the technical specifications of the 40/48/80-channel OMU board, refer to Table 6-13.
6-12
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-12 Technical Specifications the OMU Board (8/16/32-Channel)

Item
Specification
8Channel
16Channel
32-Channel OMU
OMU
OMU
Coupler
Coupler
Coupler
AWG
TFF
Insertion loss (dB)
< 11
< 14
< 17
< 10
< 10
Maximum insertion loss difference
<3
<3
<3
<3
<3
100
100
> 40
> 40
> 40
> 40
> 40
Operating wavelength range (nm)
1529 to 1561
Polarization Dependent Loss
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.005
between channels (dB)
(PDL) (dB)
Polarization Mode Dispersion
(PMD) (ps)
Temperature characteristic
(nm/)
Table 6-13 Technical Specifications of the OMU Board (40/48/80-Channel)

Item
Specification
40-Channel OMU
48-Channel OMU (80-Channel OMU)
Coupler
AWG
TFF
AWG
Coupler
AWG
Insertion loss (dB)
< 19
< 10
< 10
< 10
< 23
< 10
Maximum insertion loss
<3
<3
<3
<3
< 3.5
<3
100
100
100
50
> 40
> 40
> 40
> 40
> 40
> 40
Operating wavelength
1529 to 1561
1529 to
1529 to 1561
difference between
channels (dB)
range (nm)
Polarization Dependent
1568
< 0.6
< 0.5
< 0.5
< 0.5
< 0.7
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.005
Loss (PDL) (dB)

Polarization Mode
Dispersion (PMD) (ps)
Temperature characteristic
(nm/)
6-13
SJ-20130318152421-001|2013-12-20(R1.1)
6.3.3 ODU Board Specifications

For the technical specifications of the ODU board, refer to Table 6-14.
Table 6-14 Technical Specifications of the ODU Board
Item
Specification
32-Channel ODU
40-Channel ODU
48-Channel
80-Channel
ODU
ODU
AWG
TFF
AWG
TFF
AWG
AWG
Insertion loss (dB)
< 10
< 10
< 10
< 10
< 10
< 10
Maximum insertion
<2
<2
<2
<2
<2
<2
100
100
100
100
50
> 40
> 40
> 40
> 40
> 40
> 40
1529 to 1561
1529 to
1529 to
1529 to
1529 to 1568
1529 to 1561
1561
1561
1561
> 25
> 25
> 25
> 25
> 25
> 25
> 30
> 30
> 30
> 30
> 30
> 30
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
< 0.005
< 0.005
> 0.2
> 0.2
> 0.2
> 0.2
> 0.2
> 0.2
loss difference
between channels
(dB)
Channel spacing
(GHz)
Optical return loss
(dB)
range (nm)
Isolation between
adjacent channels
(dB)
Isolation between
non-adjacent channels
(dB)
Polarization
Dependent Loss (PDL)
(dB)
Polarization Mode
Dispersion (PMD) (ps
)
Temperature
characteristic (nm/)
1 dB bandwidth (nm)
6.3.4 ODUB Board Specifications

For the technical specifications of the ODUB board, refer to Table 6-15.
6-14
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-15 Technical Specifications of the ODUB Board

Item
Specifications (40-Channel)
Insertion loss (dB)
<10
Maximum insertion loss difference between channels (dB)
<2
100
> 40
1529 to 1561
Isolation of adjacent channel (dB)
> 25
Isolation of non-adjacent channel (dB)
> 30
Polarization Dependent Loss (PDL) (dB)
< 0.5
Polarization Mode Dispersion (PMD) (ps)
< 0.5
Temperature characteristics (nm/)
1 dB bandwidth (nm)
> 0.2
6.3.5 OCI Board Specifications

For the technical specifications of the OCI board, refer to Table 6-16.
Table 6-16 Technical Specifications of the OCI Board (50 GHz to 100 GHz)
Item
Specification
Remark
C-band operating wavelength range (nm)
1529 to 1561
CE-band operating wavelength range
1529 to 1568
Input channel spacing (GHz)
100
Multiplexing procedure
Output channel spacing (GHz)
50
Multiplexing procedure
Insertion loss (dB)
< 2.5
Input signal 10 Gbit/s
<3
Input signal 40 Gbit/s
Maximum insertion loss difference (dB)
<1
Isolation (dB)
> 25
Demultiplexing procedure
Return loss (dB)
> 40
< 0.5
< 0.5
(nm)
6-15
SJ-20130318152421-001|2013-12-20(R1.1)
6.3.6 VMUX Board Specifications

For the technical specifications of the VMUX board, refer to Table 6-17.
Table 6-17 Technical Specifications of the VMUX Board
Item
Specification
Channel quantity
40/48
100
40-channel: 1529 to 1561

48-channel: 1529 to 1568
-1 dB bandwidth (nm)
> 0.2
Insertion loss (dB)
< 8 (attenuation is 0)
0.5
0.8
> 40
Channel adjustment range (dB)
0 to 10
VOA adjustment precision (dB)
0.5
6.3.7 VMUXB Board Specifications

For the technical specifications of the VMUXB board, refer to Table 6-18.
Table 6-18 Technical Specifications of the VMUXB Board
Item
Specification
Channel quantity
40
100
40-channel: 1529 to 1561
-1 dB bandwidth (nm)
> 0.2
Insertion loss (dB)
< 8 (attenuation is 0)
0.5
0.8
> 40
Channel adjustment range (dB)
0 to 10
VOA adjustment precision (dB)
0.5
6-16
SJ-20130318152421-001|2013-12-20(R1.1)
6.3.8 SSDM Board Specifications

For the technical specifications of the SSDMT board, refer to Table 6-19. For the technical
specifications of the SSDMR board, refer to Table 6-20.
Table 6-19 Technical Specifications of the SSDMT Board
Item
Specification
CE band
1529 to 1568
INOUT
< 1.5
SINOUT
< 1.5
INOUT (@SIN)
> 12
SINOUT (@IN)
> 20
range (nm)
Insertion loss (dB)
Isolation (dB)
> 40
< 0.2
Loss (PDL) (dB)

Input optical power
< 500
(mW)
6-17
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-20 Technical Specifications of the SSDMR Board

Item
Specification
CE band
1529 to 1568
Insertion loss (dB)
INOUT
< 1.5
INSOUT
< 1.5
INOUT (@SOUT)
> 12
INSOUT (@OUT)
> 40
Isolation (dB)
> 40
Polarization Dependent Loss (PDL)
< 0.2
(dB)
Input optical power (mW)
< 500
6.3.9 SOGMD Board Specifications

For the technical specifications of the SOGMD board, refer to Table 6-21.
Table 6-21 Technical Specifications of the SOGMD Board
Item
Specification
1529 to 1561 (C band)
Insertion loss (dB)
INRRO
< 2.5
INRBO
< 2.5
INBRO
< 2.5
INBBO
< 2.5
RRIOUT
< 2.5
RBIOUT
< 2.5
BRIOUT
< 2.5
BBIOUT
< 2.5
Isolation (dB)
>12
Optical reflectance (dB)
< 40
< 0.4
< 0.15
Maximum optical power (mW)
< 500
6.3.10 WBU Board Specifications

For the technical specifications of the WBU board, refer to Table 6-22.
6-18
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-22 Technical Specifications of the WBU Board

Item
Specification
1529 to 1561 (C band)
100
50
Channel quantity
40 (channel spacing: 100 GHz)

80(channel spacing: 50 GHz)
Insertion loss of
WBU/AD1 (dB)
Insertion loss of
WBU/AD2 (dB)
A1-OUT
<2
IN-D1
<4
EXIN-OUT
< 14
IN-EXOUT
<4
A1-OUT
< 12
A2-OUT
<2
IN-D1
< 12
IN-D2
<2
EXIN-OUT
< 18
IN-EXOUT
< 12
Attenuation adjustment range (dB)
0 to 15
Attenuation adjustment precision (dB)
< (0.5 or 10% of the configured value, select

the larger one)
Blocking extinction ratio (dB)
> 35
Return loss (dB)
> 40
Maximum total optical input power (dBm)
25
Maximum single-channel optical input power
16
(dBm)
6.3.11 WSU Board Specifications

There are two types of WSU boards: WSUD board and WSUA board.
For the technical specifications of the WSUD board, refer to Table 6-23.
Table 6-23 Technical Specifications of the WSUD Board
Item
Specification
Wavelength range (nm)
1529 to 1561 (C band)
6-19
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Specification
100
50
Channel quantity

80(channel spacing: 50 GHz)
Insertion loss
WSUD/MA1
(dB)
WSUD/MA2
A1-OUT
<2
IN-D1-D8
<8
EXIN-OUT
<9
IN-EXOUT
<8
A1-OUT
< 10
A2-OUT
<2
IN-D1-D8
<8
EXIN-OUT
< 16
IN-EXOUT
<8
WSUD/E
<8
0 ~ 15
<1.00 ~ 10 dB
<1.5>10 dB
> 35
Return loss (dB)
> 40
< 25
For the technical specifications of the WSUA board, refer to Table 6-24.
Table 6-24 Technical Specifications of the WSUA Board
Item
Specification
1529 to 1561 (C band)
100
50
Channel quantity

6-20
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Insertion loss
Specification
WSUA/MD1
(dB)
WSUA/MD2
IN-D1
<2
A1-A8-OUT
<8
EXIN-OUT
<8
IN-EXOUT
<9
IN-D1
<2
IN-D2
< 10
A1-A8-OUT
<8
EXIN-OUT
<8
IN-EXOUT
< 16
WSUA/E
<8
0 ~ 15
<1.00 ~ 10 dB
<1.5>10 dB
> 35
Return loss (dB)
> 40
< 25
6.3.12 WBM Board Specifications

For the technical specifications of the WBM board, refer to Table 6-25.
Table 6-25 Technical Specifications of the WBM Board
Item
Specification
1529 to 1561 (C band)
100
Channel quantity
Insertion loss (dB)
An-OUT (n=140)
<8
IN-DROP
<7
EXIN-OUT
< 13
IN-EXOUT
<3
0 to 15
< (0.5 or 10% of the configured value, select the

greater one between them)
Return loss (dB)
> 40
6-21
SJ-20130318152421-001|2013-12-20(R1.1)
6.3.13 PDU Board Specifications

For the technical specifications of the PDU-4-x board, refer to Table 6-26. For the technical
specifications of the PDU-5-x board, refer to Table 6-27. For the technical specifications
of the PDU-8-x board, refer to Table 6-28. For the technical specifications of the PDU-9-x
board, refer to Table 6-29. For the technical specifications of the PDU-16-1 board, refer to
Table 6-30.
Table 6-26 Technical Specifications for the PDU-4-x Board
Item
Specification
1529 to 1568 (CE band)
Insertion loss (dB)
< 8.0
INxOx-1/2/3/4
< 0.4
Return loss (dB)
> 40

Item
Specification
1529 to 1568 (CE band)
Insertion loss (dB)
INxOx-1/2/3/4
< 12.0
INxDx
< 4.0
< 0.5
Return loss (dB)
> 40

Item
Specification
1529 to 1568 (CE band)
Insertion loss (dB)
< 11.0
INxOx-1/2/3/4/5/6/7/8
< 0.5
Return loss (dB)
> 40

Item
Specification
1529 to 1568 (CE band)
Insertion loss (dB)
INxOx-1/2/3/4/5/6/7/8
< 15.0
INxDx
< 4.0
< 0.5
Return loss (dB)
> 40
6-22
SJ-20130318152421-001|2013-12-20(R1.1)

Item
Specification
1529 to 1568 (CE band)
Insertion loss (dB)
< 14.0
INO-1/2/3/4/5/6/7/8
/9/10/11/12/13/14/15/16
< 0.5
Return loss (dB)
> 40
6.4 Optical Amplification Subsystem Specifications

6.4.1 SEOA Board Specifications
SEOBA Board Specifications
For the technical specifications of the SEOBA board with 40/80-channel in the C band,
Table 6-31 Technical Specifications of the 40/80-Channel C-Band SEOBA Board
Item
Specification (40/80-Channel)
SEOBA17/17
40-Channel
SEOBA22/20
80-Channel
40-Channel
80-Channel
1529 to 1561
1529 to 1561
Total input power range (dBm)
32 to 0
32 to 2
Channel input power range (dBm)
32 to 16
32 to 19
32 to 18
32 to 21
Total output power range (dBm)
2 to 17
5 to 17
1 to 20
2 to 20
Maximum total output power
17
20
Noise figure (dB)
<6
<6
Polarization Dependent Loss
< 0.5
< 0.5
Pump leakage at input (dBm)
< 30
< 30
Pump leakage at output (dBm)
< 30
< 30
Input return loss (dB)
> 40
> 40
Output return loss (dB)
> 40
> 40
Nominal gain (dB)
17
22
(dBm)
(PDL) (dB)
6-23
SJ-20130318152421-001|2013-12-20(R1.1)
Item
SEOBA17/17
40-Channel
Maximum allowed input
SEOBA22/20
80-Channel
40-Channel
> 30
> 30
> 30
> 30
Gain flatness (dB)
Gain response time while
< 10
< 10
< 0.5
< 0.5
80-Channel
reflectance (dB)
Maximum allowed output
reflectance (dB)
adding/reducing channels (stable

status) (ms)
(PMD) (ps)
SEOPA Board Specifications

For the technical specifications of the SEOPA board with 40/80-channel in the C band,
Table 6-32 Technical Specifications of the 40/80-Channel C-Band SEOPA Board
Item
SEOPA17/17
SEOPA22/17
SEOPA27/17
40-Cha-
80-Cha-
40-Cha-
80-Chan-
40-Chan-
80-Chan-
nnel
nnel
nnel
nel
nel
nel
1529 to 1561
1529 to 1561
1529 to 1561
35 to 0
35 to 4
35 to 10
range (nm)
Total input power range
(dBm)
Channel input power
35 to
35 to
35 to
range (dBm)
16
19
20
Total output power range
2 to 17
5 to 17
2 to 17
35 to 23
35 to 26
35 to 29
5 to 17
2 to 17
5 to 17
(dBm)
Maximum total output
17
17
17
Noise figure (dB)
< 5.5
< 5.5
< 5.5
< 0.5
< 0.5
< 0.5
< 30
< 30
< 30
power (dBm)
Loss (PDL) (dB)

Pump leakage at input
(dBm)
6-24
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Pump leakage at output
SEOPA17/17
SEOPA22/17
SEOPA27/17
40-Cha-
80-Cha-
40-Cha-
80-Chan-
40-Chan-
80-Chan-
nnel
nnel
nnel
nel
nel
nel
< 30
< 30
< 30
> 40
> 40
> 40
> 40
> 40
> 40
Nominal gain (dB)
17
22
27
> 30
> 30
> 30
> 30
> 30
> 30
Gain flatness (dB)
< 10
< 10
< 10
< 0.5
< 0.5
< 0.5
(dBm)
reflectance (dB)
reflectance (dB)
adding/reducing channels
(stable status) (ms)
Polarization Mode
SEOLA Board Specifications

For the technical specifications of the SEOLA board with 40/80-channel in the C band,
Table 6-33 Technical Specifications of the 40/80-Channel C-Band SEOLA Board
Item
SEOLA22/20
40-Channel
80-Channel
1529 to 1561
Total input power range (dBm)
35 to 2
Channel input power range (dBm)
35 to 18
35 to 21
Total output power range (dBm)
1 to 20
2 to 20
Maximum total output power (dBm)
20
Noise figure (dB)
<6
< 0.5
< 30
< 30
6-25
SJ-20130318152421-001|2013-12-20(R1.1)
Item
SEOLA22/20
40-Channel
> 40
> 40
Nominal gain (dB)
22
Maximum allowed input reflectance (dB)
> 30
Maximum allowed output reflectance (dB)
> 30
Gain flatness (dB)
Gain response time while adding/reducing
< 10
80-Channel
channels (stable status) (ms)

< 0.5
6.4.2 EOA Board Specifications

The EOA board technical specifications are compatible with 2.5 Gbit/s, 10 Gbit/s, 40 Gbit/s
and 100 Gbit/s systems, which enables smooth transition from the 2.5 Gbit/s, 10 Gbit/s
system, and 40 Gbit/s system to the 100 Gbit/s system.
EOBAH Board Specifications

l
40/80-Channel C-band EOBAH board

For the technical specifications of the 40/80-channel C-band EOBAH board, refer to
Table 6-34. The single-channel power of 32-channel EOBAH board is 1 dB higher
than that of the corresponding 40-channel EOBAH board.
Table 6-34 Technical Specifications of the 40/80-Channel C-Band EOBAH Board
Item
EOBAH27/26
40-Channel
Operating wavelength range
EOBAH24/24
80-Channel
40-Channel
80-Channel
1529 to 1561 (C band)
1529 to 1561 (C band)
32 to 2
32 to 3
(nm)
(dBm)
Channel input power range
32 to 17
32 to 13
32 to 13
32 to 16
7 to 13
4 to 10
5 to 11
2 to 8
(dBm)
Channel output power range
(dBm)
6-26
SJ-20130318152421-001|2013-12-20(R1.1)
Item
EOBAH27/26
EOBAH24/24
40-Channel
80-Channel
40-Channel
80-Channel
7 to 26
4 to 26
5 to 24
2 to 24
(dBm)
26
24
Noise figure (dB)
<6
<6
< 0.5
< 0.5
< 30
< 30
< 30
< 30
> 40
> 40
> 40
> 40
Channel gain (dB)
27
24
> 30
> 30
> 30
> 30
Gain flatness (dB)
< 10
< 10
< 0.5
< 0.5
(dBm)
Loss (PDL) (dB)

Pump leakage at input
(dBm)
(dBm)
reflectance (dB)
reflectance (dB)
Polarization Mode
48/96-channel CE-band EOBAH board

For the technical specifications of the 48/96-channel CE-band EOBAH board, refer to
Table 6-35.
6-27
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-35 Technical Specifications of the 48/96-Channel CE-Band EOBAH Board

Item
EOBAH23/21
48-Channel
Operating
EOBAH26/24
96-Channel
48-Channel
EOBAH28/26
96-Channel
48-Channel
96-Channel
1529 to 1568 (CE band)
1529 to 1568 (CE band)
1529 to 1568 (CE band)
32 to 1
32 to 1
32 to 1
wavelength range
(nm)
Total input power
range (dBm)
Channel input power
32 to 16
32 to 19
32 to 16
32 to 19
32 to 16
32 to 19
1 to 7
2 to 4
4 to 10
1 to 7
6 to 12
3 to 9
1 to 21
2 to 21
4 to 24
1 to 24
6 to 26
3 to 26
range (dBm)
Channel output
power range (dBm)
Total output power
range (dBm)
Maximum total
21
24
26
Noise figure (dB)
<6
<6
<6
Polarization
< 0.5
< 0.5
< 0.5
< 30
< 30
< 30
< 30
< 30
< 30
> 40
> 40
> 40
> 40
> 40
> 40
Channel gain (dB)
23
26
28
Maximum allowed
> 30
> 30
> 30
> 30
> 30
> 30
output power (dBm)
Dependent Loss
(PDL) (dB)
Pump leakage at
input (dBm)
Pump leakage at
output (dBm)
Input return loss
(dB)
Output return loss
(dB)
input reflectance
(dB)
Maximum allowed
output reflectance
(dB)
Gain flatness (dB)
6-28
SJ-20130318152421-001|2013-12-20(R1.1)
Item
EOBAH23/21
48-Channel
Gain response
EOBAH26/24
96-Channel
48-Channel
EOBAH28/26
96-Channel
48-Channel
< 10
< 10
< 10
< 0.5
< 0.5
< 0.5
96-Channel
time while
adding/reducing
channels (stable
status) (ms)
Polarization Mode
Dispersion (PMD)
(ps)
EONA Board Specifications

l
40/80-channel C-band EONA board

For the technical specifications of the 40/80-channel C-band EONA board, refer to
Table 6-36. The single-channel power of 32-channel EONA board is 1 dB higher than
that of the corresponding 40-channel EONA board.
Table 6-36 Technical Specifications of the 40/80-Channel C-Band EONA Board

Item
EONA25/20
EONA33/20
40-Chan-
80-Chan-
40-Chan-
nel
nel
EONA27/24
80-Channel
40-Chan-
80-Chan-
nel
nel
nel
1529 to 1561 (C band)
1529 to 1561 (C band)
1529 to 1561 (C band)
35 to 2
35 to 10
35 to 0
(nm)
(dBm)
35 to 18
35 to 21
35 to 26
35 to 29
35 to 16
35 to 19
1 to 7
2 to 4
1 to 7
2 to 4
5 to 11
2 to 8
1 to 20
-2 to 20
1 to 20
-2 to 20
5 to 24
2 to 24
(dBm)
(dBm)
(dBm)
20
20
24
Noise figure (dB)
<6
<6
<6
Polarization dependent loss
< 0.5
< 0.5
< 0.5
< 30
< 30
< 30
(dBm)
(PDL) (dB)
6-29
SJ-20130318152421-001|2013-12-20(R1.1)
Item
EONA25/20
EONA33/20
40-Chan-
80-Chan-
nel
nel
nel
< 30
< 30
< 30
> 40
> 40
> 40
> 40
> 40
> 40
Channel gain (dB)
25
33
27
> 30
> 30
> 30
> 30
> 30
> 30
Gain flatness (dB)
<10
<10
<10
< 0.5
< 0.5
< 0.5
40-Chan-
80-Chan-
40-Chan-
nel
nel
EONA27/24
80-Channel
(dBm)
reflectance (dB)
reflectance (dB)
Polarization Mode
48/96-channel CE-band EONA board

For the technical specifications of the 48/96-channel CE-band EONA board, refer to
Table 6-37.
Table 6-37 Technical Specifications of the 48/96-Channel CE-Band EONA Board

Item
EONA25/21
48-Chan-
EONA33/21
96-Channel
EONA27/24
48-Chan-
96-Chan-
48-Chan-
96-Chan-
nel
nel
nel
nel
nel
1529 to 1568 (CE band)
1529 to 1568 (CE band)
1529 to 1568 (CE band)
35 to 4
35 to 12
35 to 3
(nm)
(dBm)
35 to 21
35 to 24
35 to 29
35 to 32
35 to 19
35 to 22
1 to 7
2 to 4
1 to 7
2 to 4
5 to 11
2 to 8
(dBm)
(dBm)
6-30
SJ-20130318152421-001|2013-12-20(R1.1)
Item
EONA25/21
48-Chan-
EONA33/21
96-Channel
nel
1 to 21
2 to 21
EONA27/24
48-Chan-
96-Chan-
48-Chan-
96-Chan-
nel
nel
nel
nel
1 to 21
2 to 21
5 to 24
2 to 24
(dBm)
21
21
24
Noise figure (dB)
<6
<6
<6
< 0.5
< 0.5
< 0.5
< 30
< 30
< 30
< 30
< 30
< 30
> 40
> 40
> 40
> 40
> 40
> 40
Channel gain (dB)
25
33
27
> 30
> 30
> 30
> 30
> 30
> 30
Gain flatness (dB)
<10
<10
<10
< 0.5
< 0.5
< 0.5
(dBm)
(PDL) (dB)
(dBm)
reflectance (dB)
reflectance (dB)
(PMD) (ps)
6.4.3 DRA Board Specifications

The DRA board uses RAMAN amplifiers to amplify optical signals. For its technical
specifications, refer to Table 6-38.
Table 6-38 Technical Specifications of the DRA Board
Item
Specification
Pump wavelength and quantity (nm/piece)
C band: 2 to 3
CE band: 2 to 3
6-31
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Specification
Pump power (dBm)
29
Total output power (dBm)
12
C/CE band gain (G.652) (dB)
10/10
C/CE band gain (LEAF) (dB)
12/12
C/CE band gain (TW RS) (dB)
13/13
C/CE band equivalent noise figure (G.652) (dB)
0/0
C/CE band equivalent noise figure (LEAF) (dB)
1/1
C/CE band equivalent noise figure (TW RS) (dB)
1.5/1.5
Polarization dependent gain (dB)
< 0.5
Temperature stability (pm/)
< 500
In actual application, both EDFA and RAMAN amplifiers are used to amplify optical signals,
meaning the EOA and DRA boards combine to amplify optical signals. The technical
specifications for the combination of EOA and DRA boards are listed in Table 6-39.
Table 6-39 Technical Specifications of the EOA and DRA Board Combination
Item
Specification
1529 to 1561 (C band)

1529 to 1568 (CE band)
Maximum total output power (dBm)
20
Noise figure (dB)
<3
< 0.5
< 30
> 40
> 40
Maximum allowed input reflectance (dB)
> 30
Maximum allowed output reflectance (dB)
> 30
Gain flatness (dB)
Gain response time while adding/reducing channels
<10

< 0.5
6.4.4 LAC Board Specifications

For the technical specifications of the LAC board, refer to Table 6-40.
6-32
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-40 Technical Specifications of the LAC Board

Item
Unit
Specification
Wavelength range (band) (nm)
nm
1529 to 1561 (C band)

1529 to 1568 (CE band)
Optical input power detection range (dBm)
dBm
-30 ~ 0 / -30 ~ +20
Optical output power detection range (dBm)
dBm
-30 ~ 0 / -30 ~ +18
dB
0.5
Attenuation adjustment step length (dB)
dB
0.2
dB
20
Attenuation adjustment rate (dB/s)
dB/s
10
6.5 Optical Layer Management Subsystem

Specifications
6.5.1 OPM Board Specifications
For the technical specifications of the OPM board with channel spacing of 50 GHz, refer
to Table 6-41. For the technical specifications of the OPM board with channel spacing of
100 GHz, refer to Table 6-42.
Table 6-41 Technical Specifications of the OPM Board (50 GHz)
Item
Specification
1529 to 1561 (C band)

1529 to 1568 (CE band)
Wavelength detection precision (nm)
0.05
Input power range (dBm)
45 to 15
Power detection precision (dBm)
1.5
OSNR range (dB)
25
OSNR detection precision (dB)
1.5
30
Table 6-42 Technical Specifications of the OPM Board (100 GHz)

Item
Specification
1529 to 1561 (C band)

1529 to 1568 (CE band)
6-33
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Specification
Wavelength detection precision (nm)
0.1
45 to 15
1.5
OSNR range (dB)
25
1.5
30
6.5.2 EOPM Board Specifications

For the technical specifications of the EOPM board with channel spacing of 50 GHz, refer
to Table 6-43. For the technical specifications of the EOPM board with channel spacing of
100 GHz, refer to Table 6-44.
Table 6-43 Technical Specifications of the EOPM Board (50 GHz)
Item
Specification
1529 to 1561 (C band)

1570 to 1605 (L band)
1529 to 1568 (CE band)
Wavelength detection range (nm)
0.05
45 to 15
1.5
OSNR range (dB)
25
1.5
30
Signal detection time (s)
Table 6-44 Technical Specifications of the EOPM Board (100 GHz)

Item
Specification
1529 to 1561 (C band)

1570 to 1605 (L band)
1529 to 1568 (CE band)
0.1
45 to 15
0.5
6-34
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Specification
OSNR range (dB)
25
1.5
30
Signal detection time (s)
6.5.3 OWM Board Specifications

For the technical specifications of the OWM board, refer to Table 6-45.
Table 6-45 Technical Specifications of the OWM Board
Item
Specification
1529 to 1561 (C band)

1529 to 1568 (CE band)
Optical input power of single wavelength (dBm)
45 to 15
Wavelength offset capture range (GHz)
10 to +10
Wavelength offset control precision (GHz)
> 5
6.5.4 EOWM Board Specifications

For the technical specifications of the EOWM board, refer to Table 6-46.
Table 6-46 Technical Specifications of the EOWM Board
Item
Specification
1529 to 1561 (C band)

1529 to 1568 (CE band)
Optical input power (dBm)
45 to 15
Wavelength offset capture range
10 to +10
(GHz)
Wavelength offset alarm range (GHz)
> 5
6.6 Protection Subsystem Specifications

6.6.1 SOP Board Specifications
For the technical specifications of the SOP board, refer to Table 6-47.
6-35
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-47 Technical Specifications of the SOP Board

Item
Specification
Operating wavelength Range (nm)
1280 to 1625
Insertion Loss (dB)
1510 to 1625
1280 to 1510
T1_IT1_O1
< 4.4
< 5.0
T2_IT2_O1
< 4.4
< 5.0
T1_IT1_O2
< 4.4
< 5.0
T2_IT2_O2
< 4.4
< 5.0
R1_I1 R1_O
< 2.1
< 2.7
R2_I1 R2_O
< 2.1
< 2.7
R1_I2 R1_O
< 2.1
< 2.7
R2_I2 R2_O
< 2.1
< 2.7
Return loss (dB)
> 40
Polarization dependent loss (dB)
< 0.2
Optical input power (mW)
< 200
Switching time (ms)
50
6.6.2 SOPCS Board Specifications

For the technical specifications of the SOPCS board, refer to Table 6-48.
Table 6-48 Technical Specifications of the SOPCS Board
Item
Unit
Specification
nm
1260-1620
Insertion loss
1510-1620nm
1260-1510nm
API BPO
dB
<2.1
<2.7
APIBOUT
dB
<2.7
<3.3
AWIAOUT
dB
<2.1
<2.7
AIN AWO
dB
<4.4
<5.0
AINBPO
dB
<5.1
<5.7
BIN BWO
dB
<4.4
<5.0
BINAPO
dB
<5.1
<5.7
BWIBOUT
dB
<2.1
<2.7
BPIAOUT
dB
<2.7
<3.3
6-36
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Unit
Specification
dB
<2.1
Return loss
dB
>40
dB
<0.3
Optical input power
mW
<200
Switching time
ms
<50
BPIAPO
<2.7
Table 6-49
Item
(nm)
1260 to 1620
1510 to 1620
1260 to 1510
API BPO
< 2.1
< 2.7
APIBOUT
< 2.7
< 3.3
AWIAOUT
< 2.1
< 2.7
AIN AWO
< 4.4
< 5.0
AINBPO
< 5.1
< 5.7
BIN BWO
< 4.4
< 5.0
BINAPO
< 5.1
< 5.7
BWIBOUT
< 2.1
< 2.7
BPIAOUT
< 2.7
< 3.3
BPIAPO
< 2.1
< 2.7
(dB)
> 40
(dB)
< 0.3
(mW)
< 200
(ms)
< 50
6.6.3 SOPMS Board Specifications

For the technical specifications of the SOPMS board, refer to Table 6-50.
Table 6-50 Technical Specifications of the SOPMS Board
Item
Unit
Specification
nm
1510 to 1610
6-37
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Unit
Specification
APIBPO
dB
<3.2
AWIAOUT
dB
<1.7
BWIBOUT
dB
<1.7
BPIAPO
dB
<3.2
AINAWO
dB
<1.7
BINBWO
dB
<1.7
APIAWO
dB
<3.2
AWIAPO
dB
<3.2
AINBPO
dB
<1.7
BPIAOUT
dB
<1.7
BWIBPO
dB
<3.2
BPIBWO
dB
<3.2
BINAPO
dB
<1.7
APIBOUT
dB
<1.7
Return loss
dB
>40
dB
<0.3
Optical input power
mW
<200
Switching time
ms
<50
Insertion loss
6.7 Supervision Subsystem Specifications

6.7.1 SOSCB Board Specifications
The SOSCB board supports 100-Mbps optical supervisory channels. For the technical
specifications of the SOSCB board, refer to Table 6-51.
Table 6-51 Technical Specifications for the SOSCB Board
Item
Specification
Optical signal type
100BASE-FX
Operating wavelength (nm)
151010
Signal code pattern
4B/5B
Supervision rate (Mbit/s)
100
Signal transmit power (dBm)
5 to 0
1 to 6
+4
Minimum receiver sensitivity (dBm)
34
35
43
6-38
SJ-20130318152421-001|2013-12-20(R1.1)
6.7.2 CCP Board Specifications

For the CCP board technical specifications, refer to Table 6-52.
Table 6-52 CCP Board Technical Specifications
Item
Specification
Optical signal type
1000BASE-FX
Working wavelength (nm)
1310
Signal code pattern
8B/10B
Supervision rate (Mbit/s)
1000
Optical signal transmit power (dBm)
-8`-2
Minimum receiver sensitivity (dBm)
20
6.8 RPOA Subsystem Specifications

6.8.1 Applicable Transmission Codes
The RPOA subsystem is designed for ultra-long-haul transmission. It only supports the
transmission over a single span because the Signal-to-Noise Ratio (SNR) of the system
decreases greatly if fibers are too long.
Because the amplification range of the EDF does not include 1510-nm wavelength and the
supervisory information cannot be transmitted over a long distance, the RPOA subsystem
needs an independent service wavelength to transfer supervision signals.
Table 6-53 describes the transmission codes supported by RPOA subsystem over a single
span. Note that the system capacity listed in the table already includes a supervisory
channel.
Table 6-53 Transmission Codes Supported by the RPOA Subsystem (over a Single
Span)
Fiber Type
Single-Span Line Attenuation (dB)
Maximum System Capacity

(Gbit/s)
G.652 fiber
73
4 2.5
72
8 2.5
69
16 2.5
63
40 2.5
67
4 10
67
8 10
67
16 10
63
40 10
6-39
SJ-20130318152421-001|2013-12-20(R1.1)
Fiber Type
Single-Span Line Attenuation (dB)
Maximum System Capacity

(Gbit/s)
G.655 fiber
68.5
4 2.5
67
8 2.5
64
16 2.5
63
40 2.5
66
4 10
66
8 10
66
16 10
63
40 10
6.8.2 RPOA Subsystem Optical Specifications

For the RPOA subsystem optical specifications, refer to Table 6-54.
Table 6-54 RPOA Subsystem Optical Specifications
Item
RPOA Subsystem with a GFF
RPOA Subsystem without GFF
Amplification range (nm)
1529 to 1561
1546 to 1561
Noise figure (dB)
< 7 (within the amplification range)
< 7 (within the amplification range)
Gain (dB)
> 17
> 17
Gain flatness (dB)
<2
<2
Optical input power (dBm)
-44 to -18
-44 to -18
Optical output power (dBm)
-30 to +2
-34 to 8
Operating temperature
-40 to 65 (RGU), -10 to 60 (RPU)
-40 to 65 (RGU), -10 to 60 (RPU)
-40 to 85
-40 to 85
range (C)
Storage temperature range
(C)
The RPOA subsystem without Gain Flatness Filter (GFF) meets the requirements of the system with up to 16 wav
elengths, while the RPOA subsystem with a GFF meets the requirements of systems with up to 40 wavelengths.
6.9 DCM Technical Specifications

DCM optical modules are classified into two types according to different principles: DCM
based on Dispersion Compensation Fiber (DCF) and DCMs based on fiber brag grating.
For descriptions for DCM technical specifications, refer to Table 6-55 and Table 6-56.
6-40
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-55 DCM Technical Specifications (G.652 Optical Fiber)
Type
Typical
Maximum
Disper-
Polar-
Polariza-
Maximum
Working
Compen-
Insertion
sion
ization
tion De-
Input
Wave-
sation
Loss (dB)
Slope
Mode dis-
pendent
Optical
length
Distance
Compen-
persion
Loss (dB)
Power
Range
(km)
sation
(ps)
(dBm)
(nm)
20
1525 to
Ratio
DCM for
10
G.652(10
90% to
0.3
0.5
110%
1565
km)
DCM for
20
G.652(20
90% to
0.4
0.5
20
110%
1525 to
1565
km)
DCM for
40
G.652(40
90% to
0.6
0.5
20
110%
1525 to
1565
km)
DCM for
60
G.652(60
90% to
0.7
0.5
20
110%
1525 to
1565
km)
DCM for
80
G.652(80
90% to
0.8
0.5
20
110%
1525 to
1565
km)
DCM for
100
G.652(10
90% to
0.9
0.5
20
110%
1525 to
1565
0km)
DCM for
120
11
G.652(12
90% to
1.0
0.5
20
110%
1525 to
1565
0km)
1. Maximum input optical power refers to the maximum input optical power that the module can bear
when it is not damaged.
Table 6-56 DCM Technical Specifications (G.655 LEAF Optical Fiber)
Type
Typical
Maximum
Disper-
Polar-
Polariza-
Maximum
Working
Compen-
Insertion
sion
ization
tion De-
Input
Wave-
sation
Loss (dB)
Slope
Mode dis-
Optical
length
6-41
SJ-20130318152421-001|2013-12-20(R1.1)
Distance
Compen-
persion
pendent
Power
Range
(km)
sation
(ps)
Loss (dB)
(dBm)
(nm)
0.45
0.3
20
1525 to
Ratio
DCM for
20
G.655
80% to
120%
1565
LEAF(20
km)
DCM for
40
G.655
80% to
0.6
0.3
20
120%
1525 to
1565
LEAF(40
km)
DCM for
60
G.655
80% to
0.75
0.3
20
120%
1525 to
1565
LEAF(60
km)
DCM for
80
G.655
80% to
0.8
0.3
20
120%
1525 to
1565
LEAF(80
km)
DCM for
100
G.655
80% to
0.9
0.3
20
120%
1525 to
1565
LEAF(100
km)
DCM for
120
G.655L-
80% to
1.0
0.3
20
120%
1525 to
1565
EAF(120
km)
DCM for
240
G.655
80% to
1.5
120%
0.25
23
1528 to
1568
LEAF
FBG(240
km)
1. Maximum input optical power refers to the maximum input optical power that the module can bear
when it is not damaged.
6.10 Environment Specifications

The environment requirements for the ZXWM M920 equipment can be classified into three
aspects: storage environment, transportation environment, and operational environment.
6-42
SJ-20130318152421-001|2013-12-20(R1.1)
6.10.1 Power Supply Requirement

For the power supply requirements of the ZXWM M920 system, refer to Table 6-57.
Table 6-57 Power Supply Requirements
Input voltage:
Allowable fluctuation range:
48 VDC
60 VDC to 40 VDC
60 VDC
70 VDC to 50 VDC
6.10.2 Storage Environment

Climate Requirement
The climate requirements for the ZXWM M920 equipment are described in Table 6-58.
Table 6-58 Climate Requirements (Storage Environment)
Item
Specifications
Altitude
4000 m
Air pressure
70 kPa to 106 kPa
Temperature
40 to +70
Temperature variance ratio
1 /min
Relative humidity
5% to 100%
Solar radiation
1120 W/s2
Heat radiation
600 W/s2
Wind speed
20 m/s
Waterproof Requirement
l
l
Keep the equipment indoors.

Ensure that there is no water on the storage room floor, so that the water will not leak
on the packing container of the equipment. Furthermore, the storage position should
be far away from leaking surfaces such as automatic fire fighting equipment and the
heating system.
If the equipment must be stored outside, the requirements are listed as follows:
Ensure that the packing box of the equipment is in good condition without any
damage.
Waterproofing measures should be taken to prevent rain from leaking into the
packing box of the equipment.
Ensure that there is no water on the floor where the equipment is placed.
Do not expose the packing box to direct sunlight.

6-43
SJ-20130318152421-001|2013-12-20(R1.1)
Ecological Environment
l
l
Avoid the propagation of microorganism, such as fungi or mould.

Ensure that no rodents (such as mouse) enter the equipment.
Air Cleanness Requirement

l
l
l
There should be no explosive, electrically conductive, magnetically conductive or

corrosive dust in the equipment room.
The concentrations of mechanical activity materials are described in Table 6-59.
The concentrations of chemical activity materials are described in Table 6-60.
Table 6-59 Concentrations of Mechanical Activity Materials (Storage Environment)

Mechanical Activity Material
Content
Suspended dust
5.00 mg/m3
Degraded dust
20.0 mg/m2h
Sand
300 mg/m3
Table 6-60 Concentrations of Chemical Activity Materials (Storage Environment)

Chemical Activity Material
Content
SO2
0.30 mg/m3
H2S
0.10 mg/m3
NO2
0.50 mg/m3
NH3
1.00 mg/m3
Cl2
0.10 mg/m3
HCI
0.10 mg/m3
HF
0.01 mg/m3
O3
0.05 mg/m3
6.10.3 Transportation Environment

Climate Requirement
The climate requirements for the ZXWM M920 equipment are described in Table 6-61.
Table 6-61 Climate Requirements
Item
Specifications
Altitude
4000 m
Air pressure
70 kPa to 106 kPa

6-44
SJ-20130318152421-001|2013-12-20(R1.1)
Item
Specifications
Temperature
40 to +70
1 /min
Relative humidity
5% to 100%
Solar radiation
1120 W/s2
Heat radiation
600 W/s2
Wind speed
20 m/s
Water-Proof Requirement
l
l
l
Ensure that the packing box of the equipment is in good condition without any
damages.
Waterproofing measures should be taken to prevent rain from leaking into the packing
box of the equipment.
Ensure that there is no water in the transportation tools.
l
l

Prevent rodents (such as mouse) from entering the equipment.

l
l
l

Table 6-62 Concentrations of Mechanical Activity Materials (Transportation

Environment)
Content
Suspended dust
No special requirements
Degraded dust
3.0 mg/m2h
Sand
100 mg/m3
Table 6-63 Concentrations of Chemical Activity Materials (Transportation Environment)

Content
SO2
0.30 mg/m3
H2S
0.10 mg/m3
NO2
0.50 mg/m3
NH3
1.00 mg/m3
6-45
SJ-20130318152421-001|2013-12-20(R1.1)
Content
Cl2
0.10 mg/m3
HCI
0.10 mg/m3
HF
0.01 mg/m3
O3
0.05 mg/m3
6.10.4 Operational Environment

Climate Requirements
The climate requirements for the ZXWM M920 equipment are described in Table 6-64 and
Table 6-65.
Table 6-64 Requirements for Temperature and Humidity (Operational Environment)
Item
Specification
Ambient temperature
Long term operation: 0 C to +45 C

Short term operation: 5 C to +50 C
Relative humidity (35 C)
Long term operation: 10% to 90%

Short term operation: 5% to 95%
The temperature and humidity are measured 1.5 m above the floor and 0.4 m in front of the equipm
ent.
Short term operation means that the equipment operates continuously for no more than 96 hours and
operates for no more than 15 days in one year.
Table 6-65 Requirements for Other Climate Factors (Operational Environment)

Item
Specifications
Altitude
4000 m
Air pressure
70 kPa to 106 kPa
30 /h
Solar radiation
700 W/s2
Heat radiation
600 W/s2
Wind speed
5 m/s
l
l

Prevent rodents (such as mouse) from entering the equipment.
6-46
SJ-20130318152421-001|2013-12-20(R1.1)

l
l
l

Table 6-66 Concentrations of Mechanical Activity Materials (Operational Environment)

Content
Suspended dust
0.2 mg/m3
Degraded dust
15 mg/m2h
Sand
100 mg/m3
Dust particle
3105 /m3
Table 6-67 Concentrations of Chemical Activity Materials (Operational Environment)

Content
SO2
0.30 mg/m3
H2S
0.10 mg/m3
NO2
0.50 mg/m3
NH3
3.00 mg/m3
Cl2
0.10 mg/m3
HCI
0.10 mg/m3
HF
0.01 mg/m3
O3
0.05 mg/m3
NOx
0.5 mg/m3
6.11 Electro Magnetic Compatibility Requirements

Electro-Magnetic Compatibility
For the Electro-Magnetic Compatibility (EMC) specifications of the ZXWM M920 system,
Table 6-68 EMC Specifications
Test Item
Standard
Electrostatic discharge immunity
GB/T 17626.2 or IEC 61000-4-2
Immunity to radiation from radio
GB/T 17626.3 or IEC 61000-4-3
frequency electromagnetic field

6-47
SJ-20130318152421-001|2013-12-20(R1.1)
Test Item
Standard
Electrical fast transient burst immunity
GB/T 17626.4 or IEC 61000-4-4
Surge immunity
GB/T 17626.5 or IEC 61000-4-5
Radio frequency filed conductivity
GB/T 17626.6 or IEC 61000-4-6
immunity
Radiation Interference
GB 9254 or CISPR 22
Conducted Interference
GB 9254 or CISPR 22
Electro-Magnetic Interference
Electro-magnetic Interference (EMI) specifications of the ZXWM M920 system include
conducted disturbance and radiated disturbance, which comply with CISPR 22 (A-level
ITE).
6.12 Weight Power Consumption Dimensions

6.12.1 Power Consumption Specifications
For the power consumption specifications of boards and units of the ZXWM M920system,
Table 6-69 Boards and Unit Power Consumption
Board/Unit
Maximum Power
Maximum Power Consumption
)
Consumption (25
) (W)
(55
(W)
Board
ASMA
80
85
ASMB
80
85
CQ2
85
91
CLK
15
17
CO2
90
98
CH1
55
61
TD2C
28
30
TS2C
18
20
CCP
20
23
EONA
25
38
EOBAH
30
45
EOTU10G
28
39
EOTU10GB
28
39
6-48
SJ-20130318152421-001|2013-12-20(R1.1)
Board/Unit
Maximum Power
)
Consumption (25
) (W)
(55
(W)
FCAG
40
50
FCA
40
50
DSA
25
38
DSAF
22
33
SRM42
20
30
SRM41
33
50
SAUC
32
38
SMUBC
40
48
SMUBL
40
48
FCC
10
LO2
90
98
LQ2
85
91
LD2B
53
64
LACG/LACT
MQT3
120
150
COMB
35
38
COM
32
38
CSUB
12
14
LD2
28
39
CD2
28
39
CS3
68
80
CD3
101
111
LS3 (2slot)
84 (DPSK)
92 (DPSK)
93 (DQPSK)
102 (DQPSK)
80 (DPSK)
88 (DPSK)
86 (DQPSK)
95 (DQPSK)
EHG1
105
120
EQG2
95
110
CS4
115
135
LS4
140
151
TS4
179
189
MQA1
38
40
LS3 (1slot)
6-49
SJ-20130318152421-001|2013-12-20(R1.1)
Board/Unit
Maximum Power
)
Consumption (25
) (W)
(55
(W)
MQA2
38
40
MJA
38
40
MOM2
53
70
MX2
175
185
OPM
OMCP
OWM
EOWM
10
12
EOPM
10
12
OMU
3 (TFF or coupler)
4 (TFF or coupler)
13.2 (AWG)
16 (AWG)
3 (TFF)
4 (TFF)
13.2 (AWG)
16 (AWG)
OCI
PWD
10
15
PDU
SOTU2.5G
24
27
SOTU10G
25
30
SOPCS
SOPMS
SRM42
20
30
SRM41
33
50
SOGMD
SOAD2
SOAD4
SEOBA
14
20
SEOPA
11
15
SEOLA
14
20
SSDM
SOP
SFANA
10
20
ODU
6-50
SJ-20130318152421-001|2013-12-20(R1.1)
Board/Unit
Maximum Power
)
Consumption (25
) (W)
(55
(W)
Fan plug-in box
SPWA
28
55
PWE
10
11
SNP
10
12
SOSCB
17
18
SCC
10
12
TIS
15
20
ETI
11.5
12
EIC
10
SEIA
TST3
90
117
VMUX
30
36
VMUXB
30
36
WBU
15
18
WSU
15
18
WBM
29
35
RPU
45
75
XCA
96
106
52
100
6.12.2 Dimensions and Weight

For the dimensions and weight of each ZXWM M920 system component, refer to Table
6-70 and Table 6-71.
Table 6-70 Dimensions and Weight of ZXWM M920 Components
Component
Dimensions (mm)
Weight (kg)
CX20 subrack
447 (H) 535 (W) 275 (D)
16.00
CX21 subrack
447 (H) 535 (W) 275 (D)
16.00
CX30 subrack
897 (H) 535 (W) 275 (D)
26.00
CX31 subrack
897 (H) 535 (W) 275 (D)
26.00
CX50 subrack
1347 (H) 535 (W) 275 (D)
35.00
NX4 subrack
422 (H) 533 (W) 286 (D)
12.50
6-51
SJ-20130318152421-001|2013-12-20(R1.1)
Component
Dimensions (mm)
Weight (kg)
NX5 subrack
422 (H) 473 (W) 286 (D)
11.00
CX4 subrack
577 (H) 482.6 (W) 269.5 (D)
12.00
DX41 subrack
447 (H) 535 (W) 275 (D)
16.00
CX51 subrack
1347 (H) 535 (W) 275 (D)
35.00
Power distribution box
88.10 (H) 535 (W) 240.10 (D)
6.50
DCM plug-in box
42.40 (H) 495 (W) 261.20 (D)
5.60
Conversion bracket
29.60 (H) 345.60 (W)
0.30
Fan unit
30 (H) 122.90 (W) 276.80 (D)
0.68
42 (H) 492 (W) 250 (D)
3.50
SPWA board
235.20 (H) 43.30 (W) 212.50 (D)
1.80
SEIA board
Front panel: 95.20 (H) 87.10 (W) 210 (D)
0.45
The subrack dimensions include the dimensions of mounting flanges and the front door of the subrack. The subrack
weight is that of an empty subrack.
Table 6-71 Board Weights

Board Code
Weight (kg)
SNP
0.60
SCC
0.47
SOTU2.5G
0.60
SOTU10G
0.70
SOGMD
0.60
SOAD4
0.60
SOP
0.60
SOPCS
0.60
SOPMS
0.60
DSAF
1.40
SRM42
1.25
SRM41
1.25
SSDM
0.60
SAUC
0.60
SMUBC
1.30
SMUBL
1.30
SPWA
1.80
6-52
SJ-20130318152421-001|2013-12-20(R1.1)
Board Code
Weight (kg)
SEIA
0.45
SFANA
0.68
TST3 (with DPSK)
3.50
TST3 (with RZ-DQPSK)
3.30
EOTU10G
1.65
EOTU10GB
1.65
EOWM
0.90
EOPM
0.96
EQG2
1.80
ASMA
0.60
SRM42
1.25
SRM41
1.25
FCA
1.50
MQT3 (with DPSK)
3.25
MQT3 (with RZ-DQPSK)
3.005
SEOBA
0.60
SEOPA
0.60
SEOLA
0.60
EOBAH
0.60
EONA
2.00
LAC
1.10
OMU
1.60
ODU
1.60
OCI
1.95
VMUX
2.10
VMUXB
2.10
PDU
1.40
RPU
2.50
WBU
2.60
WSU
2.60
WBM
2.10
OMCP
1.25
OPM
1.15
6-53
SJ-20130318152421-001|2013-12-20(R1.1)
Board Code
Weight (kg)
OWM
1.10
FCAG
1.45
COM
1.31
COMB
1.31
CCP
0.70
CLK
0.70
XCA
1.85
FCC
0.20
PWD
0.80
CO2
2.0075
LO2
2.0075
LD2B
1.95
CQ2
1.259
EHG1
2.10
LQ2
1.259
CH1
1.10
TD2C
0.60
TS2C
0.60
CS3
1.40
CD3
2.33
LS3
3.25 (occupying two slots)

2.23 (occupying one slot)
CS4
2.20
LS4
2.20
TS4
5.50
TS4R
5.00
MQA1
0.50
MQA2
0.50
MJA
0.60
MOM2
1.50
MX2
3.50
SFANA
0.68
6-54
SJ-20130318152421-001|2013-12-20(R1.1)
Board Code
Weight (kg)
PWE
0.80
SOSCB
0.50
TIS
0.50
ETI
0.66
EIC
0.50
6-55
SJ-20130318152421-001|2013-12-20(R1.1)
6-56
SJ-20130318152421-001|2013-12-20(R1.1)
Appendix A
Standards and
Recommendations
For standards and recommendations with which the ZXWM M920 system complies, refer
to Table A-1.
Table A-1 Standards and Recommendations with Which the ZXWM M920 Complies
Standard/Recom-
Description
mendation
ITU-T G.661
Definition and test methods for the relevant generic parameters of optical fibre
amplifiers
ITU-T G.662
Generic characteristics of optical fiber amplifier devices and subsystems
ITU-T G.663
Application related aspects of optical fibre amplifier devices and subsystems
ITU-T G.652
Characteristics of a single-mode optical fibre and cable
ITU-T G.653
Characteristics of a dispersion-shifted single-mode optical fibre and cable
ITU-T G.655
Characteristics of a non-zero dispersion-shifted single-mode optical fibre and

cable
ITU-T G.825
The control of jitter and wander within digital networks which are based on the
synchronous digital hierarchy (SDH)
ITU-T G.783
Characteristics of Synchronous Digital Hierarchy (SDH) equipment functional

blocks
ITU-T G.664
Optical safety procedures and requirements for optical transport systems
ITU-T G.665
Definitions and Test Methods for Generic Characteristics of Raman Amplifiers

and Raman Amplified Subsystems
ITU-T G.691
Optical interfaces for single channel STM-64 and other SDH systems with
optical amplifiers
ITU-T G.693
ITU-T G.694.1
Optical interfaces for intra-office systems

Spectral grids for WDM applications: Dense Wavelength Division Multiplexing
(DWDM) frequency grid
ITU-T G.694.2
Spectral Grids for WDM Applications: Coarse Wavelength Division Multiplexing

(CWDM) wavelength Grid
ITU-T G.696.1
Optical transport network physical layer interfaces
ITU-T G.697
Optical monitoring for DWDM systems

A-1
SJ-20130318152421-001|2013-12-20(R1.1)
Standard/Recom-
Description
mendation
ITU-T G.709
Interfaces for the Optical Transport Network
ITU-T G.798
Characteristics of optical transport network hierarchy equipment functional

blocks
ITU-T G.8201
Error performance parameters and objectives for multi-operator international

paths within the Optical Transport Network (OTN)
ITU-T G.8251
The control of jitter and wander within the Optical Transport Network (OTN)
ITU-T G.873.1
The Automatic Protection Switching (APS) protocol and protection switching

operation for the linear protection schemes for the Optical Transport Network at
the Optical Channel Data Unit (ODUk) level
ITU-T G.874
Management aspects of the Optical Transport Network Element containing

transport functions of one or more of the layer networks of the optical transport
network
ITU-T G.957
Optical interfaces of equipments and systems relating to the synchronous

digital hierarchy
ITU-T G.959.1
Optical transport network physical layer interfaces specifications for optical

networks which may use Wavelength Division Multiplexing (WDM)
ITU-T G.975
Forward error correction for submarine systems
ITU-T G.975.1
Forward error correction for high bit rate DWDM submarine systems
IEEE Std 802.3
Carrier Sense Multiple Access with Collision Detection (CSMA/CD) access

method and physical layer specification
IEC 60825-1
Safety of laser productsPart 1: equipment classification, requirements and

users guide
IEC 60825-2
YD/T 1273-2003
Safety of laser productsPart 2: Safety of optical fiber communication systems

Technical specification for terminal equipments of optical Wavelength Division
Multiplexing (WDM)1610 Gb/s and 3210gb/s parts
YD/T 1274-2003
Technical specification for optical wavelength Division Multiplexing (WDM)

system16010gb/s and 8010gb/s parts
YD/T 1159-2001
Test methods of optical Wavelength Division Multiplexing (WDM) system
GB/T 2423.1-2001
Environmental testing for electric and electronic productsPart 2: Test

methodsTests A: Cold
GB/T 2423.2-2001

methodsTests B: Hot
GB/T 2423.22-
2002
methodsTest N: Change of temperature
GB/T 2423.9-2001

methodsTest Cb: Damp heat, steady state, primarily for equipment
A-2
SJ-20130318152421-001|2013-12-20(R1.1)
Appendix A Standards and Recommendations
Standard/Recom-
Description
mendation
GB/T 2423.10-
1997
methodsTest Fc and guidance: Vibration (Sinusoidal)
GB/T 2423.11-
1997
methodsTest Fd: Random vibration wide bandGeneral requirements
GB/T 17618-1998
Information technology equipmentImmunity characteristicsLimits and

methods of measurement
GB 9254-1998
Information technology equipmentRadio disturbance characteristicsLimits

and methods of measurement
GB 4943-2001
Safety of information technology equipment
GB 7247.1-2001
Safety of laser productsPart 1: Equipment classification, requirements and

users guide
GB/Z 18461-2001
Safety of laser productsManufacturers checklist for radiation safety of laser

products
A-3
SJ-20130318152421-001|2013-12-20(R1.1)
A-4
SJ-20130318152421-001|2013-12-20(R1.1)
Figures
Figure 1-1
ZTE WDM Product Family ....................................................................... 1-1
Figure 1-2
Point-to-Point Network Application ........................................................... 1-2
Figure 1-3
Chain Network Application ....................................................................... 1-2
Figure 1-4
Ring Network Application ......................................................................... 1-3
Figure 1-5
Ring-chain Network Application ............................................................... 1-3
Figure 1-6
Tangent Ring Network Application............................................................ 1-3
Figure 1-7
CROSS NETWORK APPLICATION ......................................................... 1-4
Figure 1-8
OTM Equipment Operating Principle Diagram......................................... 1-5
Figure 1-9
OTM Equipment Configuration (96-Channel SOTU10G Cabinet 1) ........... 1-6
Figure 1-10
OTM Equipment Configuration (96-Channel SOTU10G Cabinet

2) ............................................................................................................ 1-7
Figure 1-11
OTM Equipment Configuration (96-Channel EOTU10G Cabinet

1) ............................................................................................................ 1-8
Figure 1-12

2) ............................................................................................................ 1-9
Figure 1-13

3) .......................................................................................................... 1-10
Figure 1-14
Optical Connections in OTM Equipment (96-Channel) ......................... 1-11
Figure 1-15
FOADM Equipment Operating Principle Diagram ................................ 1-12
Figure 1-16
FOADM Equipment Configuration (SOTU10G) ................................... 1-13
Figure 1-17
FOADM Equipment Configuration (EOTU10G) ................................... 1-14
Figure 1-18
FOADM Equipment Fiber Connections (Unidirectional Add/Drop of

Eight Wavelengths)............................................................................... 1-15
Figure 1-19
FOADM Equipment Fiber Connections (Configured with SOGMD

Boards)................................................................................................. 1-15
Figure 1-20
Fiber Connections in ROADM Equipment (Configured with WBM

Boards)................................................................................................. 1-17
Figure 1-21
Fiber Connections in ROADM Equipment (Configured with WBU

Boards)................................................................................................. 1-17
Figure 1-22
Fiber Connections in ROADM Equipment (Configured with WSU

Boards)................................................................................................. 1-18
Figure 1-23
Fiber Connections in ROADM Equipment (Three Dimensions)............. 1-18
Figure 1-24
Fiber Connections in ROADM Equipment (Nine Dimensions)............... 1-19
Figure 1-25
Direction Relevance and Wavelength Relevance ................................ 1-21

I
SJ-20130318152421-001|2013-12-20(R1.1)
Figure 1-26
Direction Irrelevance and Wavelength Relevance ............................... 1-22
Figure 1-27
Direction Irrelevance and Wavelength Irrelevance ............................... 1-23
Figure 1-28
Direction Relevance and Wavelength Irrelevance ............................... 1-24
Figure 1-29
Function Diagram of OLA Equipment (Without DCMs) ......................... 1-25
Figure 1-30
Function Diagram of OLA Equipment (With DCMs) .............................. 1-25
Figure 1-31
OLA Equipment Configuration (2.5 Gbit/s) ........................................... 1-26
Figure 1-32
OLA Equipment Configuration (10 Gbit/s) ............................................ 1-26
Figure 1-33
OLA Equipment Fiber Connections (2.5 Gbit/s).................................... 1-26
Figure 1-34
OLA Equipment Fiber Connection (10 Gbit/s) ..................................... 1-27
Figure 3-1
OMS 1+1 Protection (Amplification Board Shared Configuration

Mode) ................................................................................................... 3-15
Figure 3-2
OMS 1+1 Protection (Amplification Board Redundancy Configuration

Mode) ................................................................................................... 3-15
Figure 3-3
OCH 1+1 Protection (Chain Network) .................................................... 3-16
Figure 3-4
Schematic Diagram of Two-Fiber Bidirectional OCH Shared

Protection ............................................................................................. 3-17
Figure 3-5
Electrical Layer 1+1 Wavelength Protection Configuration at Line

Side ...................................................................................................... 3-18
Figure 3-6
Electrical Layer Two-Fiber Bidirectional Channel Shared Ring Network

Protection Configuration ....................................................................... 3-19
Figure 4-1
ZXWM M920 Cabinet............................................................................... 4-1
Figure 4-2
ZXWM M920 System Architecture ........................................................... 4-3
Figure 5-1
ZXWM M920 Software Architecture ......................................................... 5-1
Figure 5-2
EMS Structure ......................................................................................... 5-2
Figure 5-3
Structure of the NE Control and Processing Software .............................. 5-3
Figure 6-1
Allocation of Uncontinuous Wavelengths................................................. 6-6
II
SJ-20130318152421-001|2013-12-20(R1.1)
Tables
Table 1-1
Configuration Description ........................................................................ 1-11
Table 1-2
Table 1-3
Direction/Wavelength Correlation ............................................................ 1-20
Table 1-4
Table 2-1
FEC List .................................................................................................... 2-1
Table 2-2
Maximum Number of Slave Subracks for a Single Master Subrack............ 2-5
Table 3-1
Transmission System at 102.5 Gbit/s ...................................................... 3-2
Table 3-2
Transmission Codes Supported by the 40/4810 Gbit/s System................ 3-3
Table 3-3
Table 3-4
Table 3-5
Table 3-6
Transmission Codes Supported by the 80100 Gbit/s System (G.652 +

DCM) ....................................................................................................... 3-4
Table 3-7
Transmission Codes Supported by the 80100 Gbit/s System (G.652 DCM) ....................................................................................................... 3-4
Table 3-8
Transmission Codes Supported by the 80100 Gbit/s System (G.655 +

DCM) ....................................................................................................... 3-5
Table 3-9
Transmission Codes Supported by the 80100 Gbit/s System (G.655 DCM) ....................................................................................................... 3-5
Table 3-10
Boards Supporting the Wavelength Tunable Function.............................. 3-7
Table 3-11
Services Admittable by the ZXWM M920 System .................................... 3-8
Table 3-12
ZXWM M920 Service Aggregation Functions........................................... 3-9
Table 3-13
ZXWM M920 Optical Supervisory Channel ............................................ 3-10
Table 3-14
ZXWM M920 Electrical Supervisory Channel........................................ 3-10
Table 3-15
Communication Functions of the ZXWM M920 System ......................... 3-11
Table 3-16
Alarm List .............................................................................................. 3-12
Table 3-17
ZXWM M920 Cross-Connect Board Protection ...................................... 3-14
Table 3-18
Description of Electrical Layer 1+1 Wavelength Protection

Configuration ......................................................................................... 3-18
Table 3-19
.......................................................................... 3-21
Table 4-1
ZXWM M920 Cabinet Configuration .......................................................... 4-2
Table 4-2
Subsystem Configurations......................................................................... 4-3
Table 5-1
NE Control and Processing Software Functions ........................................ 5-3

III
SJ-20130318152421-001|2013-12-20(R1.1)
Table 5-2
Functional Modules of the NE Control and Processing Software................ 5-3
Table 5-3
ZXWM M920 Software System Interfaces ................................................. 5-4
Table 6-1
Wavelength Allocation (40 Channels in C Band with Spacing at 100

GHz) ....................................................................................................... 6-1
Table 6-2
Wavelength Allocation (80 Channels in C Band with Spacing at 50 GHz)

................................................................................................................ 6-2
Table 6-3
Wavelength Allocation (48/96 Channels in Extended C Band with

Spacing at 100 Ghz/50 Ghz) ................................................................... 6-4
Table 6-4
Uncontinuous Wavelengths and Corresponding Central

Frequencies ............................................................................................. 6-6
Table 6-5
Board Types .............................................................................................. 6-7
Table 6-6
Line-Side Interface Specifications of the 2.5 G Board ................................ 6-7
Table 6-7
Line-Side Interface Specifications of the 10 G Board ................................. 6-8
Table 6-8
Line-Side Interface Specifications of the 40 G Board ................................. 6-9
Table 6-9
Line-Side Interface Specifications of the 100 G Board ............................. 6-10
Table 6-10
Technical Specifications of the SOAD2 Board ....................................... 6-11
Table 6-11
Technical Specifications of the SOAD4 Board ........................................ 6-12
Table 6-12
Technical Specifications the OMU Board (8/16/32-Channel) .................. 6-13
Table 6-13
Technical Specifications of the OMU Board (40/48/80-Channel) ............ 6-13
Table 6-14
Technical Specifications of the ODU Board ........................................... 6-14
Table 6-15
Technical Specifications of the ODUB Board ........................................ 6-15
Table 6-16
Technical Specifications of the OCI Board (50 GHz to 100 GHz) ........... 6-15
Table 6-17
Technical Specifications of the VMUX Board ........................................ 6-16
Table 6-18
Technical Specifications of the VMUXB Board ...................................... 6-16
Table 6-19
Technical Specifications of the SSDMT Board ...................................... 6-17
Table 6-20
Technical Specifications of the SSDMR Board ...................................... 6-18
Table 6-21
Technical Specifications of the SOGMD Board ..................................... 6-18
Table 6-22
Technical Specifications of the WBU Board .......................................... 6-19
Table 6-23
Technical Specifications of the WSUD Board ........................................ 6-19
Table 6-24
Technical Specifications of the WSUA Board ........................................ 6-20
Table 6-25
Technical Specifications of the WBM Board .......................................... 6-21
Table 6-26
Technical Specifications for the PDU-4-x Board ..................................... 6-22
Table 6-27
Table 6-28
Table 6-29
Table 6-30
Technical Specifications for the PDU-16-x Board ................................... 6-23
IV
SJ-20130318152421-001|2013-12-20(R1.1)
Tables
Table 6-31
Technical Specifications of the 40/80-Channel C-Band SEOBA

Board ..................................................................................................... 6-23
Table 6-32
Technical Specifications of the 40/80-Channel C-Band SEOPA

Board ..................................................................................................... 6-24
Table 6-33
Technical Specifications of the 40/80-Channel C-Band SEOLA

Board ..................................................................................................... 6-25
Table 6-34
Technical Specifications of the 40/80-Channel C-Band EOBAH

Board ..................................................................................................... 6-26
Table 6-35
Technical Specifications of the 48/96-Channel CE-Band EOBAH

Board ..................................................................................................... 6-28
Table 6-36
Technical Specifications of the 40/80-Channel C-Band EONA

Board ..................................................................................................... 6-29
Table 6-37
Technical Specifications of the 48/96-Channel CE-Band EONA

Board ..................................................................................................... 6-30
Table 6-38
Technical Specifications of the DRA Board ............................................ 6-31
Table 6-39
Technical Specifications of the EOA and DRA Board Combination ........... 6-32
Table 6-40
Technical Specifications of the LAC Board............................................. 6-33
Table 6-41
Technical Specifications of the OPM Board (50 GHz) ............................ 6-33
Table 6-42
Technical Specifications of the OPM Board (100 GHz) .......................... 6-33
Table 6-43
Technical Specifications of the EOPM Board (50 GHz) .......................... 6-34
Table 6-44
Technical Specifications of the EOPM Board (100 GHz) ........................ 6-34
Table 6-45
Technical Specifications of the OWM Board .......................................... 6-35
Table 6-46
Technical Specifications of the EOWM Board ....................................... 6-35
Table 6-47
Technical Specifications of the SOP Board ........................................... 6-36
Table 6-48
Technical Specifications of the SOPCS Board ....................................... 6-36
Table 6-49
.............................................................................................................. 6-37
Table 6-50
Technical Specifications of the SOPMS Board....................................... 6-37
Table 6-51
Technical Specifications for the SOSCB Board ...................................... 6-38
Table 6-52
CCP Board Technical Specifications...................................................... 6-39
Table 6-53
Transmission Codes Supported by the RPOA Subsystem (over a

Single Span) .......................................................................................... 6-39
Table 6-54
RPOA Subsystem Optical Specifications ............................................... 6-40
Table 6-55
DCM Technical Specifications (G.652 Optical Fiber) .............................. 6-41
Table 6-56
DCM Technical Specifications (G.655 LEAF Optical Fiber) .................... 6-41
Table 6-57
Power Supply Requirements ................................................................. 6-43
Table 6-58
Climate Requirements (Storage Environment) ....................................... 6-43
V
SJ-20130318152421-001|2013-12-20(R1.1)
Table 6-59
Concentrations of Mechanical Activity Materials (Storage

Environment) ......................................................................................... 6-44
Table 6-60
Concentrations of Chemical Activity Materials (Storage

Environment) ......................................................................................... 6-44
Table 6-61
Climate Requirements ........................................................................... 6-44
Table 6-62
Concentrations of Mechanical Activity Materials (Transportation

Environment) ......................................................................................... 6-45
Table 6-63
Concentrations of Chemical Activity Materials (Transportation

Environment) ......................................................................................... 6-45
Table 6-64
Requirements for Temperature and Humidity (Operational

Environment) ......................................................................................... 6-46
Table 6-65
Requirements for Other Climate Factors (Operational

Environment) ......................................................................................... 6-46
Table 6-66
Concentrations of Mechanical Activity Materials (Operational

Environment) ......................................................................................... 6-47
Table 6-67
Concentrations of Chemical Activity Materials (Operational

Environment) ......................................................................................... 6-47
Table 6-68
EMC Specifications ............................................................................... 6-47
Table 6-69
Boards and Unit Power Consumption .................................................... 6-48
Table 6-70
Dimensions and Weight of ZXWM M920 Components........................... 6-51
Table 6-71
Board Weights....................................................................................... 6-52
Table A-1
Standards and Recommendations with Which the ZXWM M920

Complies..................................................................................................A-1
VI
SJ-20130318152421-001|2013-12-20(R1.1)
Glossary
AFEC
- Advanced Forward Error Correction
APC
- Automatic Power Control
APO
- Automatic Power Optimization
APR
- Automatic Power Reduction
APS
- Automatic Protection Switching
APSD
- Automatic Power Shutdown
ATM
- Asynchronous Transfer Mode
AWG
- Array Waveguide Grating
BC
- Boundary Clock
BITS
- Building Integrated Timing Supply
BMC
- Best Master Clock
CWDM
- Coarse Wavelength Division Multiplexing
DCF
- Dispersion Compensation Fiber
DCM
- Dispersion Compensation Module
DRA
- Distributed RAMAN fiber Amplifier
DVB
- Digital Video Broadcasting
DWDM
- Dense Wavelength Division Multiplexing
VII
SJ-20130318152421-001|2013-12-20(R1.1)
ECC
- Embedded Control Channel
ECC
- Error Check and Correction
EDF
- Erbium Doped Fiber
EDFA
- Erbium Doped Fiber Amplifier
EMC
- Electro Magnetic Compatibility
EMI
- Electromagnetic Interference
EMS
- Element Management System
ESCON
- Enterprise System Connection
FEC
- Forward Error Correction
FICON
- Fiber Connection
FOADM
- Fixed Optical Add/Drop Multiplexer
GCC
- General Communication Channel
GFP
- Generic Framing Procedure
GUI
- Graphical User Interface
HD-FEC
- Hard Decision Forward Error Correction
HDTV
- High Definition Television
IP
- Internet Protocol
ITU-T
- International Telecommunication Union - Telecommunication Standardization
Sector
IWF
- Integrated Wavelength Feedback
VIII
SJ-20130318152421-001|2013-12-20(R1.1)
Glossary
LAN
- Local Area Network
LOF
- Loss of Frame
MAN
- Metropolitan Area Network
NE
- Network Element
OC
- Ordinary Clock
OCH
- Optical Channel
OLA
- Optical Line Amplifier
OMS
- Optical Multiplex Section
OSC
- Optical Supervision Channel
OSNR
- Optical Signal-to-Noise Ratio
OSPF
- Open Shortest Path First
OTM
- Optical Terminal Multiplexer
OTN
- Optical Transport Network
PDH
- Plesiochronous Digital Hierarchy
PDL
- Polarization Dependent Loss
PMD
- Polarization Mode Dispersion
POS
- Packet Over SONET/SDH
ROADM
- Reconfigurable Optical Add/Drop Multiplexer
RPOA
- Remotely Pumped Optical Amplifier
IX
SJ-20130318152421-001|2013-12-20(R1.1)
SD-FEC
- Soft Decision Forward Error Correction
SDH
- Synchronous Digital Hierarchy
SFP
- Small Form-factor Pluggable
SNR
- Signal to Noise Ratio
SONET
- Synchronous Optical Network
SSM
- Synchronization Status Message
TC
- Transparent Clock
TCP
- Transmission Control Protocol
TFF
- Thin Film Filter
TIM
- Trace Identifier Mismatch
TTI
- Trail Trace Identifier
VOA
- Variable Optical Attenuator
WDM
- Wavelength Division Multiplexing
XFP
- 10-Gigabit Small Form-Factor Pluggable
X
SJ-20130318152421-001|2013-12-20(R1.1)

Liberty Port ZTE ZXWM M920 Product Description

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Liberty Port ZTE ZXWM M920 Product Description

Uploaded by

Copyright:

Available Formats

ZXWM M920

Backbone DWDM Equipment

Additionally, the contents of this document are protected by

contractual confidentiality obligations.

Serial Number: SJ-20130318152421-001

ZTE Proprietary and Confidential

Chapter 2 Product Characteristics ........................................................... 2-1

Chapter 3 System Functions ..................................................................... 3-1

ZTE Proprietary and Confidential

3.2 Automatic Power Optimization Function............................................................... 3-5

Chapter 4 Hardware Architecture ............................................................. 4-1

Chapter 5 Software Architecture............................................................... 5-1

ZTE Proprietary and Confidential

Chapter 6 Technical Specifications .......................................................... 6-1

ZTE Proprietary and Confidential

6.6.3 SOPMS Board Specifications.................................................................. 6-37

Appendix A Standards and Recommendations ..................................... A-1

ZTE Proprietary and Confidential

About This Manual

What is in This Manual

1, Product Orientation and

Describes the product Orientation, networking application and

network element type of the ZXWM M920.

Describes the product characteristics of the ZXWM M920 system,

Describes system configuration, networking modes, and configuration

Describes the hardware architecture and functional subsystems of the

Describes the software architecture, including board software, NE

Describes system operating wavelength, technical specifications of

Appendix A, Standards and

Describes the Standards and Recommendations of the ZXWM M920

ZTE Proprietary and Confidential

Separates individual parameters in a series of parameters.

ZTE Proprietary and Confidential

Product Orientation and

1.1 ZTE WDM Product Family

ZXWM M920 is a new-generation optical network product. It combines advanced

ZTE Proprietary and Confidential

ZXWM M920 Product Description

1.2 Networking Application

1.2.2 Chain Network

1.2.3 Ring Network

ZTE Proprietary and Confidential

Chapter 1 Product Orientation and Application

Figure 1-4 Ring Network Application

1.2.4 Ring-Chain Network

1.2.5 Tangent Ring Network

ZTE Proprietary and Confidential

ZXWM M920 Product Description

1.2.6 Cross Network

1.2.7 Mesh Network

1.3 Network Element Type

ZTE Proprietary and Confidential

Chapter 1 Product Orientation and Application

Figure 1-8 OTM Equipment Operating Principle Diagram

ZTE Proprietary and Confidential

ZXWM M920 Product Description

Figure 1-9 OTM Equipment Configuration (96-Channel SOTU10G Cabinet 1)

ZTE Proprietary and Confidential

Chapter 1 Product Orientation and Application

Figure 1-10 OTM Equipment Configuration (96-Channel SOTU10G Cabinet 2)

ZTE Proprietary and Confidential

ZXWM M920 Product Description

Figure 1-11 OTM Equipment Configuration (96-Channel EOTU10G Cabinet 1)

ZTE Proprietary and Confidential