You are on page 1of 21

Course Curriculum and Detail Syllabus of Master of

Technology
IN (VLSI & EMBEDDED SYSTEM)

Department of ELECTRONICS & INSTRUMENTATION


ENGINEERING
(Effective from 2011-13)

Institute of Technical Education & Research


Siksha OAnusandhan University, Bhubaneswar
(Faculty of Engineering & Technology)

MTECH (VLSI & EMBEDDED SYSTEMS)


2011-2013 Batch
First Year
Second Year

Subject
code
EC521T
EC541T
EC522T

EC541P
EC542P

1st Semester
Subject name

L-t-p

Credit

SEMICONDUCTOR
DEVICES,
MODELLING &
SIMULATION
DIGITAL VLSI DESIGN
VLSI FABRICATION
TECHNOLOGY
ELECTIVE-I

4-0-0

ELECTIVE-I I

EC543T

Subject
Code
EC641T

EC641P
EC642P
EC643P

Credit

LOGIC SYNTHESIS AND


OPTIMIZATION

4-0-0

EMBEDDED SYSTEM
ELECTIVE-III

4-0-0
4-0-0

4
4

4
4

4-0-0

ELECTIVE-IV

4-0-0

4-0-0

ELECTIVE-V

4-0-0

0-0-3

EMBEDDED SYSTEMS LAB

0-0-3

ELECTIVE LAB II

0-0-3

TOTAL CREDIT

PRACTICAL/SESSIONALS
2
2

24

L-T-P

ANALOG VLSI DESIGN 4-0-0


Elective-VI
4-0-0
(Any One)
Practical/Sectionals
Project
0-0-3
Seminar-II
0-0-3
Comp. Viva-II
0-0-3
Total Credit

EC542T

L-t-p

4-0-0
4-0-0

PRACTICAL/SESSIONALS
VLSI DESIGN AND
0-0-3
SIMULATION LAB
MICROPROCESSOR & 0-0-3
MICROCONTROLLER
LAB

3rd Semester
Subject Name

Subject
code

2nd Semester
Subject name

Credit
4
4

10
2
2
22

EC543P

EC545P
EC546P

Subject
Code

SEMINAR-I
COMP. VIVA-I
TOTAL CREDIT
4th Semester
Subject Name

2
2
28
L-T-P

Project

20

EC644P

Total Credit

Credit

20

Elective Theory

Sl.No
1
2
3
4
5
6
7
8
9

CODE
EC525T
EC547T
PH511T
EC526T
EC527T
EC549T
EC517T
EC509T
EC548T

Elective I, II, III, IV, V


VLSI AND MEMS PACKAGING
MICRO ELECTRO MECHANICAL SYSTEMS
INTRODUCTION TO NANO TECHNOLOGY
VLSI PHYSICAL DESIGN
LOW POWER CIRCUITS & SYSTEMS
MICROPROCESSOR AND MICROCONTROLLER
SOFT COMPUTING
ADAPTIVE SIGNAL PROCESSING
ADVANCED PROCESS CONTROL & INSTRUMENTATION

Credit
4
4
4
4
4
4
4
4
4

Sl.No
10
11

CODE
EC642T
EC643T

Elective VI
SIGNAL PROCESSING APPLICATION IN VLSI DEVICES
ASIC MODELING

Credit
4
4

Elective Labs
Sl.No

CODE

EC501P

EC544P

Elective Lab II

ADVANCED DSP LAB.


ADVANCED PROCESS CONTROL &
INSTRUMENTATION LAB

Credit
2
2

EC521T SEMICONDUCTOR DEVICES, MODELLING & SIMULATION


(4-0-0)
CREDITS: 4
Metal-Oxide-Semiconductor FET (MOSFET) Transistor:
Basic MOSFET transistor operation, current voltage relation, linear and saturation regions,
small signal equivalent circuit, channel length modulation, Incremental model including back
gate effect, and capacitive elements; intrinsic high frequency limitations of MOSFETs, MOSFET
scaling, Large signal switching characteristics.
Metal-Oxide-Semiconductor FET (MOSFET) Capacitor:
MOS structure: Energy band diagrams, work function difference, Depletion layer thickness ,
Flat band voltage, threshold voltage, charge distribution, MOS Capacitance voltage
characteristics
Metal Semiconductor Contact:
Energy diagram of Metal semiconductor contact, Schottky barrier junction and its I-V
characteristics, Non-ideality of Schottky barrier junction, Application of M-S contact, Junction
field effect transistor
III-V Semiconductor Devices:
Compound semiconductors binaries, III-V's, II-IV's, Alloy semiconductors, Ternaries &
Quarternaries, lattice matching and epitaxy, Hetero-junctions, GaAs MESFET's and MODFET's,
Hetero-junction Bipolar Transistor, Tunnel diode, IMPATT diodes, Light emitting diode, Laser
diode, Quantum wells, wires, and dots, multiple quantum well devices, resonant tunneling
diodes, HEMT , Ion-Sensitive Field-Effect Transistor (ISFET) and Semiconductor-Controlled
Rectifier (Thyristor):
MOST Parameter Measurements:
LEVEL1 Model Parameters, LEVEL2 Model (Long-Channel) Parameters, LEVEL2 Model (ShortChannel) Parameters, LEVEL3 Model Parameters, Measurements of Capacitance, BSIM Model
Parameter Extraction
Text Books:
1. Fundamentals of Semiconductor Devices by M K Achuthan and K N Bhat, Tata McGraw
Hill, 2007, ISBN:007061220.
2. Solid State Electronic Devices Y Ben G Streetman and Sanjay Banerjee, 5th Edition, Pearson
Education
Reference Books :
1. B. L. Anderson and R. L. Anderson, Fundamentals of Semiconductor Devices, McGraw-Hill.
2. Semiconductor Devices: Physics and Technology by S.M. Sze, John Wiley and Sons, Inc,
2001, ISBN:0471333727
3. Compound Semiconductor Device Physics by Sandip Tiwari, Academic Press, 1992,
ISBN:0126917406

EC541T DIGITAL VLSI DESIGN (4-0-0)


CREDITS: 4
Introduction, Design Metrics and Manufacturing Process:
A Historical Perspective, Issues in Digital Integrated Circuit Design, Quality Metrics of a Digital
Design, Introduction to Manufacturing Process, Manufacturing CMOS Integrated Circuits,
Design Rules The Contract between Designer and Process Engineer, Packaging Integrated
Circuits, CMOS transistor, long channel IV characteristics, Capacitances in MOS transistor,
short channel effects like velocity saturation, mobility degradation, hot carrier gate depletion,
etc.
CMOS Inverter Design:
Basic MOS inverters, characteristics, inverters with resistive load and with n-MOSFET load,
CMOS inverter, Switching characteristics and interconnect effects, Delay time definition and
calculations, inverter design with delay constraints, estimation of parasitic, switching power
dissipation of CMOS inverters
CMOS Combinational Logic:
NMOS and CMOS Logic, Static and transient responses of NOR and NAND gates, Complex
Logic Circuits, Combinational Logic Gate design, Euler Path, Sequential Logic, SR Latch, D
Latch, Edge Triggered Flip-flops
Pass Transistor and Transmission Gate Logic:
Principles of operation of Pass transistor logic, high Z state, Complimentary Pass transistor
logic, CPT Full Adder, Cascading of PT logic, Principles of operation of transmission gate logic,
Examples of TG logic, Differential TG Logic
Complex Combinational Logic: Half and Full Adder, Mirror and Ripple Adder, Multipliers,
Modulator, Demodulator or decoder, PT and TG implementation of complex logic
Dynamic Logic: Basic principles of dynamic logic gate, Pass transistor dynamic logic, voltage
boot strapping, synchronous logic, Dynamic shift register, Ratio less synchronous dynamic
logic, Transmission gate dynamic logic, CMOS dynamic logic, Cascading of dynamic logic,
Charge sharing, charge leakage, Back gate coupling, Clock feed through, power consumption in
dynamic gates
High Performance Dynamic Logic:
Domino CMOS logic, NORA CMOS logic, Differential Domino Logic, Zipper CMOS logic,
DCVS logic, Comparison of logic technologies
Memories: Semiconductor Memories, Memory architecture, Dynamic RAM 3 transistors and 1
transistor, SRAM 6 transistor, Cell sizing, ROM, Flash Memory
Text Books :
1. Digital Integrated Circuits A Design Perspective by J M Rabaey, Anantha Chandrakasan
and Borivoje Nikolic, Prentice Hall India, 2003, 2nd edition. ISBN:8120312449.
2. Fundamentals of Logic Design by Charles H. Roth, 6th Edition, Jaico, 2004, ISBN:
8172242352
Reference Books :
1. CMOS Logic Circuit Design by John P. Uyemura, Springer publications, Springer,
International Edition.
2. VLSI Design Techniques for Analog & Digital Circuits by R.L. Geiger, Philip E Allen, Noel
R. Strader, McGraw Hill International Edition.
3. CMOS Digital Integrated Circuits: Analysis and Design by S. Kang. Y Leblebici., Tata
McGraw Hill Edition.
4. Semiconductor Devices: Physics and Technology by S.M. Sze, John Wiley and Sons, Inc

EC522T VLSI FABRICATION TECHNOLOGY (4-0-0)


CREDITS: 4
Introduction:
Moores Law and material processing, Defects in crystals, Eutectic phase diagram, Solid
solubility, Homogeneous nucleation, Heterogeneous Nucleation, Growth processes
Crystal Growth:
Necking and dislocation free CZ crystal growth, Maximum growth rate and diameter control,
Segregation of impurities along length and diameter, Defects in CZ crystals, FZ Crystal growth
Epitaxy:
Vapour phase epitaxy, LPE, MBE, CVD deposition of Polysilicon, SILOX Process
Diffusion:
Constant & limited source diffusion, Concentration dependent diffusion, Field assisted
diffusion, Junction depth, Open tube and closed tube diffusion, Diffusion sources
Ion Implantation:
Basic process, Ion Implantation Systems, Ion penetration and profile, Ion Implantation Damage,
Annealing
Oxidation:
Purpose, Dry and wet oxidation, Deal-Grove model, Oxidation system, Properties of oxides
Masking and charges in oxides
Deposition Processes:
Fundamentals of vacuum systems, Vacuum evaporation of thin films, DC and RF Sputtering of
thin films, Interconnects, Contacts and dielectrics in IC Fabrication, Deposition of Silicon
Nitride, Silicides and insulating layers
Lithography:
Pattern generation and mask making, Optical Lithography Contact, Proximity and Projection
Printing, Photoresists Negative, Positive, Lift-off process, Electron beam and X-ray
lithographic techniques.
Etching:
Wet Etching, Isotropic and Anisotropic Etching, Plasma Etching, Reactive Ion Beam Etching.
IC Process Integration:
Bipolar Transistor Fabrication, Isolation techniques, P-MOS, N-MOS and C-MOS processes, IC
Fabrication Process Integration, MEMS Fabrication, IC Packaging
Process Yield and Reliability
Text Books :
1. VLSI Fabrication Principles: Silicon and Gallium Arsenide S.K.Gandhi, Wiley International,
2nd Edition (1994) ISBN: 0471580058.
2. The Science and Engineering of Microelectronics Fabrication by S.A.Campbell, Oxford
University Press, ISBN: 0195105087.
3. VLSI Technology by S.M.Sze, Tata McGraw Hill, 1983, ISBN:0070582912.
Reference Books :
1. Silicon VLSI Technology by J. Plummer, M. Deal and P. Griffin, Prentice Hall, 2000, ISBN:
0130850373.
2. Principles of Growth and Processing of Semiconductors S.Mahajan, McGraw Hill
International Book Company, 1999, ISBN: 0070396051.

EC543T LOGIC SYNTHESIS & OPTIMIZATION (4-0-0)


CREDITS: 4
Introduction:
introduction to designing digital systems, Key steps in the design process, CAD tools to
automate design of digital systems, Computer aided design algorithm
Logic Circuit Design Basics:
Basics of logic circuit, Boolean algebra, Hardware description languages, Introduction to VHDL
- data objects, operators, entity, package, subcircuit, concurrent assignment, sequential
assignment, sequential circuits
Combinational Logic Circuit Design:
Synthesis of combinational circuits, initial design and optimization, encoder, decoder, and
multiplexer circuits and their implementation using VHDL, Flip flops, Registers, Counters and
their design using VHDL
Arithmetic Operations:
Arithmetic operations, numbers representation in digital systems, number manipulation using
logic circuits, Design of ALU and a simple processor using VHDL
Sequential Circuits:
Synchronous and asynchronous sequential circuits, Finite state machines, VHDL code for
Moore type FSM, Serial adder design using FSM, FSM as an Arbiter circuit, Algorithm State
Machine chart, Practical design techniques for both manual and automated design using VHDL
Digital System Design:
Shift register design, SRAM design, Shift and Add multiplier, Divider, ALU, Clock
synchronization, Design of Microprocessor using VHDL, CAD tools high level synthesis
technique, netlist generation and gate optimization, Physical design, placement, routing and
timing analysis modeling, scheduling and binding, CPLD, FPGA, synthesis and optimization
for PLD architectures,
Testing:
Logic simulation, fault sources and models, fault simulation, testing process, combinational and
sequential circuit testing, testing for stuck at fault, fault simulation, functional testing, Dalgorithm and PODEM, design for testability, compression techniques, BIST, self testing circuits
and systems, memory and processor testing, automatic test pattern generation, boundary scan
testing (JTAG).
Text Books:
1. Fundamentals of Digital Logic with VHDL Design by Stephen Brown, Tata McGraw Hill,
2002, ISBN:007047432X.
2. Circuit Design with VHDL by V A Pedroni, Prentice Hall of India Pvt. Ltd., 2005 Edition,
ISBN:8120326830
Reference Books :
1. Basic VLSI Design by Douglas A. Pucknell And Kamran Eshraghian, Prentice Hall of India
Pvt. Ltd., 2005 Edition, ISBN:8120309863.

EC542T EMBEDDED SYSTEM (4-0-0)


CREDITS: 4
Introduction: Features of Embedded Systems, Design Metrics, Embedded System Design flow,
Other target Architecture, Digital signal processors, FPGA, ASIC etc.
Interfacing H/W with Embedded Systems
Serial peripheral Interface (SPI), Inter Integrated Circuit (I2C), RS 232, RS 422, RS 485, Universal
Serial Bus (USB), Infrared Communication (IrDA), Control Area Network (CAN), Bluetooth.
Real Time Operating System
Types of Real time Task, Task Periodicity, Task scheduling, Classification of Scheduling
Algorithm, Clock driven scheduling, Event driven Scheduling, Recourse Sharing, Commercial
RTOS: Windows CE, Lynux OS, Jbed, pSoS.
Specification Technique
Introduction, State Chart, Specification and Description language (SDL), Petri Nets, Unified
Modelling language (UML).
Hardware-Software Co-design
Hardware-Software Co-simulation, Hardware-Software Partitioning: Partitioning using Integer
Programming, Extended Kernighan- Lin Heuristic, Partitioning using Genetic Algorithm,
Partitioning using Particle Swarm Optimization (PSO), Functional Partitioning, High level
Optimization.
Low power Embedded System Design
Sources of power dissipation: Dynamic and Static power dissipation, Power Reduction
Technique: Algorithmic power minimization, Architectural power minimization, Logic and circuit
level power minimization, Control Logic power minimization, System level power Management.
Text Book:
Embedded System Design- Santanu Chattopadhay, PHI, 2010, ISBN: 978-81-203-4024-4
Reference Books:
1. Embedded System Architecture and Programming by RajKamal, TMH, 2003.
2. Designing Embedded Hardware- John Catsoulis, OREILLY Publication, 2005.

EC641T ANALOG VLSI DESIGN (4-0-0)


CREDITS: 4
Introduction:
Need for Analog IC's, CMOS based Analog IC's, Their applications, General concepts of Analog
Design
Resistor, Capacitors and Switches: Integrated Resistors, Integrated Capacitors, Analog
Switches, Layout of Switches
MOS Transistor
The MOS structure: Energy band diagrams, Depletion layer thickness, work function difference,
Flat band voltage, threshold voltage, charge distribution, Capacitance voltage characteristics,
The basic MOSFET operation, current voltage relation, Frequency limitation: small signal
equivalent circuit, MOS device models, SPICE models
Single Stage Amplifiers
Current Sink and Current Source, Basic MOS amplifiers, Common Source Amplifiers with
various loads and their small signal models and analysis, Source Follower, Common Gate
Amplifier
Differential Amplifier
Basic Differential amplifier, Its input output characteristics, Differential and Common mode
operation, Half circuit concept, Small signal analysis
Current Mirrors
Current Mirror, Cascode Stage, Folded Cascode stage, Cascode Current Mirror, Active Current
Mirror Its small and large signal analysis and common mode properties
Properties of Amplifiers
Frequency response and noise of Common Source, Source Follower, Common Gate and
Cascode and Differential Amplifiers, Feedback circuits, types of feedback, effect of loading on
feedback and noise
Operational Amplifiers
Single stage and two stage Operational Amplifiers, Gain boosting, Common mode feedback,
slew rate and noise, Stability and frequency compensation, Non-linearity and mismatch
Oscillators and Phase Locked Loop
Ring Oscillator, LC Oscillator, Voltage Controlled Oscillator, Simple PLL, Charge pump PLLs,
Non-ideal effects in PLL, Applications of PLL
Text Books:
1. Design of Analog CMOS Integrated Circuits Behzad Razavi, Tata McGraw Hill, 2002,
ISBN:0072380322
2. Analysis and Design of Analog Integrated Circuits by Paul R. Gray, Paul J. Hurst, Stephen
H. Lewis and Robert G. Meyer, 4th Edition, John Wiley and Sons, 2001, ISBN: 9780471321682.

EC643T ASIC MODELLING (4-0-0)


CREDITS: 4
Introduction:
What is ASIC, Types of ASIC, Economics of ASIC, ASIC Design Tools and Cell Libraries
Review of Digital IC Design:
Use of transistors as switches, Difference between a flip-flop and a latch, Meaning of setup time
and hold time, Pipelines and latency, Difference between datapath, standard-cell, and gatearray logic cells, Strong and weak logic levels, Pushing bubbles, Ratio of logic, Resistance per
square of layers and their relative values in CMOS, Design rules and lamda
ASIC Library Design:
Transistor as resistor and capacitance, Logical effort, Delay Prediction, Logical Effort and
Efficiency, Multi-stage Cells, Library Cell Design, Library Architecture, Gate Array Design,
Standard Cell Design, Datapath Cell Design
Programmable ASIC's:
Anti-fuse, EPROM and EEPROM technology, FPGA programming technology - basic logic cells,
I/O logic cells, Programmable interconnects, Software to design and program the FPGA , Xilinx
FPGA technology
Programmable ASIC Logic Cells:
Use of multiplexers, look-up tables, and programmable logic arrays, Difference
between fine-grain and coarse-grain FPGA architectures, Worst-case timing design,
Flip-flop timing, Timing models, Components of power dissipation in programmable ASIC's ,
Deterministic and nondeterministic FPGA architectures
Programmable ASIC I/O Cells:
Outputs assource or sink, DC or AC load, Input buffers - hysteresis floating input, Clamp
diodes, Inputs and outputs - registered or direct, I/O registers - in the I/O cell or in the core,
Metastability with asynchronous inputs
Programmable ASIC Interconnects:
Antifuse FPGA architectures, SRAM architectures with nested structures of interconnect
resources, Complex PLD architectures with long interconnect lines and deterministic routing,
Estimation of interconnect delay, Elmores constant
Programmable ASIC Design:
FPGA design flow: design entry, simulation, physical design, and programming, Schematic
entry, hardware design languages, logic synthesis, Verilog, and VHDL as vendor-independent
netlist standards, Schematic entry using a cell library, Cells and cell instances, nets and ports,
Bus naming, vectored instances in datapath, Hierarchy
Editing cells, PLD languages: ABEL, PALASM, and CUPL, Logic minimization, functions of
EDIF, CFI representation, Logic synthesis, Simulation, Verification
ASIC Construction:
Physical Design, System partitioning, Floor planning, Placement , Routing, Power Dissipation,
CAD Tools
Text Books :
1. Application-Specific Integrated Circuits by Michael J. S. Smith, Addison Wesley Longman,
ISBN:0201500221
Reference Books:
1. http://spectra.eng.hawaii.edu/~msmith/ASICs/HTML/ASICs.htm

EC525T VLSI AND MEMS PACKAGING (4- 0- 0)


CREDITS: 4
Introduction:
Basics of Electronic Packaging, Packaging Hierarchy in Electronic Systems, Functions of
Packaging
Electric Considerations for Electronic Packaging:
Electric Field Interference, Magnetic Field Interference, Noise performance due to passive
components - Cabling, Shielding and Grounding/filtering/shielding/screening and surge
protection/suppression, noise suppression
Thermal Considerations for Electronic Packaging:
Heat generation and modes of heat transfer in electronic components and packages,
Selection/Design of Heat Sinks, Ventilation, Forced cooling, Heat pipes for electronic cooling
applications, cooling of power intensive components
IC Packaging:
Integrated Circuit Packages, Solder bumps, Direct Chip Attach, Multi-chip modules, Microvia
technology, Introduction to LTCC .
Testing and Reliability of Electronic Packages:
Design for Test, Adhesive and Its Application, Thermal Management, Testing and Inspection,
Package/Enclosure, Electronics Package Reliability and Failure Analysis, Product Safety and
Third-Party Certification
PCB Fabrication and Design:
PCB technology trends, multi-layer boards, Design CAD tool for PCB design, artwork and
layout, general rules, design rules for PCBs for digital circuits, high frequency, analog and
mixed signal circuits, power and microwave applications, Surface mount Technology
Hybrid Electronic Packaging:
Advantages of Hybrid packaging, Hybrid Fabrication Technology: Screen printing, conducting,
resistive, dielectric and solder pastes, drying and firing, Hybrid assemblies
MEMS Packaging:
MEMS Packaging Issues, Die Level Packaging, Wafer Level Packaging, Micro assembled caps,
Sealing
Text Books:
1. Glenn R. Blackwell, The Electronic Packaging Handbook, CRC Press, 2000, ISBN 0849385911
2. John H. Lau, Electronic Packaging: Design, Materials, Process, and Reliability, McGraw-Hill,
1998, ISBN 0070371350
Reference Books:
1. Clyde F. Coombs, Printed Circuits Handbook, McGraw-Hill, 2001, ISBN 0071350160
2. Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, (Eds), Microelectronics
Packaging Handbook: Technology Drivers, Vol. 1, Kluwer Academic Publishers, Second
Edition, January 1997, ISBN: 0412084317
3. Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, (Eds), Microelectronics
Packaging Handbook: Semiconductor Packaging, Vol. 2, Kluwer Academic Publishers, Second
Edition, January 1997, ISBN: 0412084414
4. Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, (Eds), Microelectronics
Packaging Handbook: Technology, Vol. 3, Kluwer Academic Publishers, Second Edition,
January 1997, ISBN: 0412084511 PCB Design & Technology- Waller C. Bosshart, Tata McGrawHill

EC547T Micro Electro Mechanical Systems (MEMS) (4-0-0)


CREDITS: 4
Introduction:
MEMS, MEMS Processing, Micromachining, Wafer Bonding, LIGA, MEMS Examples, Scaling
Laws
MEMS Materials:
MEMS Materials, Silicon, Crystal Defects, Mechanical Properties of Materials, Beams and
structures, Piezoelectric Materials, Piezoresistive Materials
MEMS Fabrication Processes:
Review of VLSI Processing, Micro machining, Bulk Micro machining, Surface Micro machining,
Deep RIE, Advanced Lithography, LIGA Process
MEMS Sensor:
Resistive and Capacitive methods, Strain gauges, Piezoresistivity, MEMS Capacitive Sensors,
MEMS Pressure sensor, MEMS Accelerometer, MEMS Gyroscope, MEMS Gas Sensors,
Cantilever Sensors
MEMS Actuator:
Electrostatic MEMS actuators, Comb drives, MEMS RF resonator, Scratch drive, Inchworm
motor, Piezoelectric MEMS actuators, Thermal MEMS actuators, Magnetic MEMS actuators,
Optical MEMS
Micro-fluidics, Chemical and Bio MEMS:
Microfluidics Fluid flow, Electro-osmotic flow, Electrophoresis, Micropumps, Microvalves,
Lab-on-a-Chip, -TAS, Inkjet Printer Head, DNA Analysis & DNA Chip, Medical Applications
MEMS Packaging:
MEMS Packaging Issues, Die Level Packaging, Wafer Level Packaging, Micro assembled caps,
Sealing
Text Books:
1. Fundamentals of Microfabrication by Marc J.Madou, Publishers: CRC Press (2002), ISBN:
0849308267
2. Microsystem Design by Stephen D. Senturia, Publishers: Kluwer Academic / Springer, 2nd
Edition (2005), ISBN: 0792372468
Reference Books :
1. http://www.memsnet.org
2.http://www.sandia.gov/mstc/technologies/micromachines/techinfo/technologies/summit5.html
3. http://www.latech.edu/tech/engr/bme/gale_classes/mems.htm
4. http://www.spectrum.ieee.org/WEBONLY/publicfeature/aug04/0804tube.html

PH511T INTROCUCTION TO NANO-TECHNOLOGY (4-0-0)


CREDITS: 4
Introduction:
Why nanostructures, Molecular building blocks, Nanoscaled biomolecules nucleic acids and
proteins, molecular switches, Top down and bottom up approaches to nanotechnology
Properties of Nanoscale Structures:
Effect of nanoscale on electronic structure, band gap, conduction, magnetic properties,
mechanical properties, chemical properties, optical properties of nanostructures, quantum size
effect.
Nanoscale Fabrication And Characterization:
Chemical Approaches to fabrication of nano-structured materials, Thin film deposition,
Nanolithography, Micro-contact printing, Nano-transfer printing, Self-Assembly, Langmuir
Blodgett Film, and Scanning Probe Microscopies and Positional assembly, Biominutics
Nanomaterials and Nanostructures:
Nanopowders, Nanowires, Nanolayers, Nanocomposites, Fullerenes, quantum dots and
aerogels
Nanoscale Electronics:
Shrinking transistor size problems of leakage current, hot electrons, doping fluctuations, etc.,
high- k dielectrics, double-gate devices, single electron transistors, carbon nanotubes transistors,
Molecular electronics - transport through alkanes, molecular transistors and DNA, Neuron
transistor.
Nano-magnetics:
Controlled spin states, Giant magnetoresistive effect, Operation of spin valves, and issues in
magnetic scaling, Nano-supermagnetics
Nanoscale Systems:
Integration of sensing, computation, communication and actuation, Centipede memory system,
Nanoscale optoelectronics, describes quantum dots, organic optoelectronics, and photonic
crystals, Drug delivery through nanopowders, Medical diagnostics application of quantum
dots, biomimetics, biomolecular motors, and nanofluidics, DNA Computing and Quantum
computation
TEXT BOOKS:
1. Principles of Nanotechnology by G. Ali Mansoori, World Scientific (2005), 360 pp. ISBN: 981256-205-2.
2. Nanotechnology: Basic Science and Emerging Technologies by Mick Wilson, Kamali
Kannangara, Geoff Smith, Michelle Simmons, Burkhard Raguse, Chapman and Hall, ISBN:
1584883391
REFERENCE BOOKS:
1. Springer Handbook on Nanotechnology edited by Bharat Bhushan, Springer Verlag (2003),
ISBN: 3-540-01218-4

EC526T VLSI Physical Design (4-0-0)


CREDITS: 4
VLSI Physical Design Automation:
VLSI Design Cycle, Physical Design Cycle, Design Styles, System Packaging Styles, Historical
Perspectives, Existing Design Tools
Design and Fabrication of VLSI Devices:
Fabrication Materials, Transistor Fundamentals, Fabrication of VLSI Circuits, Design Rules,
Layout of Basic Devices
Fabrication Process and its Impact on Physical Design:
Scaling Methods, Status of Fabrication Process, Issues Related to the Fabrication Process, Future
of Fabrication Process, Solutions for Interconnect Issues, Tools for Process Development
Data Structure and Basic Algorithms:
Basic Terminology, Complexity Issues and NP-hardness, Basic Algorithms, Basic Data
Structures, Graph Algorithm for Physical Design
Partitioning:
Problem Formulation, Classification of Partitioning Algorithms, Group Migration Algorithm,
Simulated Annealing and Evolution, Other Partitioning Algorithms, Performance Driven
Partitioning
Floor Planning and Pin assignment:
Floor Planning, Chip Planning, Pin Assignment, Integrated Approach
Placement:
Problem Formulation, Classification of Placement Algorithms, Simulation Based Placement
Algorithms, Partitioning Based Placement Algorithms, Other Placement Algorithms,
Performance Driven Placement
Over-the-Cell Routing and Via Minimisation, Clock and Power Routing:
Over-the-Cell Routing, Via Minimisation, Clock Routing, Power and Ground Routing
Physical Design Automation of FPGAs:
FPGA Technologies, Physical Design Cycle for FPGAs, Partitioning, Routing
Physical Design Automation of MCMs:
MCM Technologies, MCM Physical Design Cycle, Partitioning, Placement, Routing
Text Books:
1. Naved A. Sherwani, Algorithms for VLSI Physical Design Automation, 3rd Edn., Springer
(India) Pvt. Ltd., 2005, ISBN: 0792383931

EC527T Low Power Circuits & Systems (4-0-0)


CREDITS: 4
Low-Power CMOS VLSI Design:
Introduction, sources of power Dissipation, Static Power Dissipation, Transistor leakage
mechanisms, Channel engineering for leakage reduction, Active Power Dissipation, shortcircuit dissipation, switching dissipation, Circuit techniques for low-Power design:
Introduction, designing for low power, circuit techniques for leakage power reduction, standby
leakage control using transistor stacks, Multiple & Dynamic Vth technique, Supply voltage
scaling technique, Leakage reduction techniques for cache(SRAM)
Low Voltage Low Power Adders and Multipliers:
Introduction, Standard Adder Cells, Half adders, full adders and their various schematic
configurations, CMOS Addrers architectures: BICMOS Adder: PT-BICMOS Gate, Low-Voltage
Low-power Design techniques: Trends of technology and power supply voltage, Low-voltage
low power logic styles. Low Voltage Low Power Multipliers: Introduction, Overview of
multiplication, Types of Multiplier architectures, Braun Multipliers, Braugh wooley Multiplier,
Booth Multiplier, Wallace Tree Multiplier.
Low-Voltage Low-Power Memories:
Introduction, Types of ROM, Low-Voltage Low Power Static Random-Access memories:
Introduction, Basics of SRAM, memory Cell: The race between 6T and 4T memory cells, Lowvoltage low-power (LVLP) SRAM cell designs, Precharge and Equalization Circuit, Decoder:
Dynamic & Static decoder, Address Transition Detection(ATD), Sense Amplifier: Voltage sense
amplifier, Current sense amplifier, Output Latch, Low-Power SRAM technologies: Sources of
SRAM power, Development of of low-power circuit techniques,Low-Voltage Low-Power
Dynamic Random-Access memories: Introduction, Types of DRAM, Basics of DRAM: Basic
architecture, Read and Write Operation,. Self-refresh Circuit: General mechanism, Reference
Signal Generator(RSG), Test memory cell, The nMOS differntal amplifier, CMOS differential-todigital converter.
Text Books:
1. Low-Voltage, Low-power VLSI subsystems-Kiat-Seng Yeo, Kaushik Roy-Tata McGraw Hill
Education Private limited.
2. Kaushik Roy and Sharat C. Prasad, Low-Power CMOS VLSI Design, Wiley-

Interscience, 2000
3. A. Bellamour, and M. I. Elmasri, Low Power VLSI CMOS Circuit Design, Kluwer Academic
Press, 1995
4. Anantha P. Chandrakasan and Robert W. Brodersen, Low Power Digital CMOS Design,
Kluwer Academic Publishers, 1995

EC549T MICROPROCESSOR AND MICROCONTROLLER (3-1-0)


CREDITS: 4

An Introduction to Microcontrollers (8051)


8051 basic Features, Memory Organization, Basic registers, Special Function Registers (SFR),
Addressing Modes, Program Flow, Instruction Set, Embedded C Programming, I/O Port
Programming, Timer programming, Serial communication programming, Interrupts
Programming.
8051 Interfacing :
Interfacing to external memory, Interfacing with 8255, LCD, Keyboard, ADC, DAC and sensor
interfacing, RTC Interfacing and programming, Relay, PWM, DC and stepper motor Control.
ARM : An Advanced Microcontroller
ARM Microcontroller, A Brief History, ARM pipeline, Instruction Set, Architecture, Registers,
Data types, Thumb Instructions, Exception in ARM, ARM Programming. Pin Connect block,
GPIO, UART0/UART1, I2C Interface, SPI Interface, Timer0/Timer1, PWM, Real time Clock, Watch
Dog Timer, C Development.
Advanced Microprocessor: 80386
Salient Features of 80386DX, Architecture and Signal Description, Register Organization,
Addressing Modes, Data Types, Real address Mode, Protected Mode, Segmentation, paging,
Virtual Mode, Enhanced Instruction Set, assembly language Programming, The Co-Processor
80387.
Text Books:
1. The 8051 Microcontroller and Embedded Systems Using Assembly and C- Muhammad
Ali Mazidi, Janice Gillispie Mazidi, Rolin D. McKinlay, 2e,PHI.
2. Philips Semiconductors Preliminary User Manual LPC2119/2129/2194/2292/2294 ARMbased Microcontroller, 2003.
3. Advanced microprocessors and Peripherals by Ray and Bhurchandi, 2e, TMH, 2006.
Reference Books:
1. The 8051 Microcontroller Architecture, Programming and applications by Kenneth J.
Ayala
2. Advanced microprocessor and Interfacing by Bary B Brey, Pearson Education.

EC642T Signal Processing Application in VLSI Devices (4-0-0)


CREDITS: 4
Typical Signal Processing Algorithms, Overview of VLSI Architectures, Representations of DSP
Algorithms. Iteration Bound, Pipelining, Parallel Processing, Definitions and Properties,
General Methodology, Unfolding Algorithm, Critical Path, Unfolding, and Retiming, Folding
Transformation, Register Minimization. Overview, Design Methodology, Matrix Operations
and 2D Systolic Array Design, Parallel Algorithm Expressions, Canonical Mapping
Methodology, Generalized Mapping. Carry-Look ahead Addition, Prefix Computations, CarrySave Addition, Multiplication and Convolution. Important Features, DSP Processors for Mobile
and Wireless Communications, Processors for Multidimensional Signal Processing
Text Books:
1. Keshab K. Parhi, VLSI Digital Signal Processing Systems, Design and Implementation,
John Wiley, 1999.

EC548T ADVANCED PROCESS CONTROL INSTRUMENTATION


(4-0-0) CREDITS: 4
Module-1 (12 hours)
Introduction: Review of basics of Process Control, Control objective and benefits, Control
system elements. Review of first and higher order systems, closed and open loop response.
Transient response. Design and types of Control valves (linear, equal percentage and quick
opening valve).
Advanced Control Techniques:
Cascade control, ratio control, feedback-feed forward control, adaptive control, selective
controls, Split range control, computing relays, Smith predictor.
Module-2 (12 hours)
Multivariable Process control: Multivariable Control Analysis of multivariable systems,
Interaction, Bristol arrays, Design of multivariable controllers, Internal Model controller
(IMC): Concept, IMC design Procedure. MPC: General Principles, Model forms, Case study:
Design of Fuzzy-Logic based controller. Case study: Design of Neural Network based
controller.
Module-3 (16 hours)
Programmable logic controller (PLC):
Definition, overview of PLC systems, General PLC programming procedures, PLC Basic
Functions, PLC intermediate functions: Arithmetic functions, number comparison functions,
Skip and MCR functions, data move systems. PLC Advanced intermediate functions:
Utilizing digital bits, sequencer functions, matrix functions. PLC Advanced functions:
Alternate programming languages, System integration: computers with PLCs, Creating
ladder diagrams from process control descriptions.
TEXT BOOKS:
1. D.R. Coughanour, Process Systems analysis and Control, Mc.Graw Hill, II Edition, 1991.
2. Curtis D. Johnson, Process Control Instrumentation Technology, Fourth edition, Prentice
Hall of India, New Delhi, 1999.
3. B.G. Liptak, Handbook of Instrumentation- Process Control , CRC Press.
REFERENCES BOOKS:
1. Principle and Practice of Automatic Process Control, C.A.Smith and A.B.Corripio, John
Wiley and Sons, 1985.
2. Les A. Kane, Handbook of Advanced Process Control Systems and Instrumentation,
Springer.
3. P.B Deshpande and R.H Ash, Elements of Process Control Applications, ISA Press, New York,
1995.

EC509T ADAPTIVE SIGNAL PROCESSING (4-0-0)


CREDITS: 4
Adaptive systems : Examples and applications.
Adaptive linear combiner : the performance function, gradient and minimum mean square
error, alternative expression of gradient, LMS, NLMS, sign-error, sign-data and FXLMS
algorithms, transform domain LMS,
Recursive least square algorithm, windowed RLS, computational complexity, Block adaptive
filter(time and DFT domains), adaptive lattice filters,
IIR adaptive filter : equation error form. Adaptive filtering, adaptive channel equalization,
Adaptive line enhancement and adaptive system identification. Hardware implementation of
digital adaptive filter.
Applications of adaptive filter : 50hz Interference In Electrocardiography, Cancellation Of
Donor-Heart Interference, Cancellation Of Maternal Ecg In Electrocardiography, Cancellation
Noise In Speech Signals, Adaptive Echo Cancellation In Long Distance Telephone Line, Self
Tunning Filter.
Adaptive control systems : Model Inverse And Model Reference Controls. Introduction of
Adaptive Array and Adaptive Beam Forming. Recent Advances in Adaptive Filtering.
Text Books:
1. Simon Haykin and Thomas Kailath, Adaptive Filter Theory, Pearson Education, 4th Edition,
2005.
2. Bernard Widrow and Samuel D. Sterns, Adaptive Signal Processing, Pearson Education, 2nd
Indian reprint, 2002.
EC517T SOFT COMPUTING (4-0-0)
CREDITS: 4
Fundamental Concepts: Introduction to Artificial Neural Networks (ANN).
Learning Process: errorcorrection learning, Hebbian learning, competitive learning, Boltzmann
learning, the credit-assignment problem, supervised learning, and other learning techniques.
Single neuron/ Perceptron networks: training methodology, typical application to linearly
separable problems.
Multilayer Perceptron: Back propagation algorithm, virtues and limitation of BP algorithm,
modifications to back-propagation.
Radial-basis function Networks interpolation problem, Covers theorem, regularization
networks, applications. Recurrent Networks.
Introduction to Fuzzy systems, Membership function, Fuzzy relational operation, fuzzy IF
THEN rules, Sugeno and Mamdani type systems, Adaptive Neuro-Fuzzy Sytems, Training
Methods
Application of ANN and Fuzzy Systems To Non-Stationary Time Series Prediction; Pattern
Classification; Control; Communication Engineering; System Identification And Pattern
Classification.
Text Books:
1. S. Haykin, Neural Networks - A Comprehensive Foundation; Pearson Education, India (The book
is also published by Prentice Hall of India), 200.
2. Martin T. Hagan, Howard B. Demuth, Mark H. Beale; Neural Network Design; (ISBN: 09717321-0-8); Thomson 2002
3. Jang, Sun and Mizutani; Neuro-Fuzzy and Soft-Computing A computational approach to
learning and machine intelligence; Prentice Hall of India
Reference Books:
1. Satish Kumar; Neural Networks: A Classroom approach, Tata McGraw Hill, 2004, ISBN:
9780070482920

EC541P VLSI Design & Simulation Lab (0-0-3)


CREDITS : 2
Front end designs
1. Design of Half Adder and Design of Full Adder Circuits.
2. Design of 16x1 multiplexer Circuits using 4x1 Multiplexer.
3. Design of 4-bit parallel adder and n-bit parallel adder Circuit.
4. Design of SR flip-flop, JK flip-flop, D flip-flop and T Flip-flop.
5. Design of 4-bit Shift Register and 4-bit Ripple Counter.
Back end designs
1. Layout of a CMOS Inverter, CMOS NAND Gate and CMOS NOR Gate.
2. Layout of an Ex-OR Gate and a Half adder Circuit.
3. Layout of a Full adder Circuit.
4. Layout of a 4x1 multiplexer Circuit.
5. Layout of 4 bit parallel adder circuit.

EC543P EMBEDDED SYSTEMS LAB (0-0-3)


CREDITS : 2
LIST OF EXPERIMENTS
1. Interfacing of Traffic Light Controller with 89C51.
2. Interfacing of Elevator Controller with 89C51.
3. Interfacing of Temperature Sensor with 89C51.
4. Interfacing of Musical Sound Card with 89C51.
5. Interfacing of Real Time Clock with 89C51.
6. Implementation of 8-bit Calculator with 89C51.
7. Study of ARM-9 Processor.
8. Interfacing of Temperature Sensor with ARM-9 Processor.
9. Study of STM-32 Microcontroller.
10. Structured Approach And Developing An Embedded System (Mini Project)
Initial Planning
Detailed Hardware Planning
Software Development
Instruction Details
Future Improvements

EC542P MICROPROCESSOR & MICROCONTROLLER LAB (0-0-3)


CREDITS: 2
1. Addition, Subtraction, Multiplication & Division using 8086 Microprocessor
2. Interfacing of Traffic Light Controller using 8086 Microprocessor
3. Interfacing of 8259 with 8086 Microprocessor
4. Interfacing of Stepper Motor with 8086 Microprocessor
5. Interfacing of DAC with 8086 Microprocessor for generation of Sine wave
6. Interfacing of 8279 with 8086 Microprocessor
7. Generation of square wave using 8051 Microcontroller
8. Interfacing of LCD module with 89C51 Microcontroller

EC501P ADVANCED DSP LAB (0-0-3)


CREDITS: 2
Experiments Using MATLAB Simulation
2. Design of an FIR filter using windowing technique.
3. Design of IIR filters using
(a) Impulse Invariant Method
(b) Bilinear Transformation Method.
3. Simulation of Power Spectrum Estimation.
4. Simulation of adaptive filters (LMS based)
5. Simulation of a Channel Equalizer
6. Simulation of System Identification
7. Study of Interpolation & Decimation and its effects on signals
8. Implementation of filters using
(a) Direct Structures
(b) Cascaded Structures
(c) TDF-I and TDF-II Structures
Experiments using DSP kit
1. Architecture and Instruction set of C06X processor
2. Addressing Mode: Direct Addressing practice and Indirect Address Practice
3. Implementation of linear convolution and correlation
4. Implementation of FIR and IIR filters

EC546P Advanced Process Control & Instrumentation Lab (0-0-3)


CREDITS: 2
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.

To study the characteristics and working principle of control valve.


To study the performance of ON/OFF, P, PI controller on flow process station.
To study the performance of P, PI, PID controller on multi process station.
Designing of Computerized Cascade control loop, Ratio control loop.
Designing of Computerized Feed-forward loop.
Implementation of Adder, Subtractor, Multiplier using ladder logic diagram
Designing of timer, counter using PLC.
PLC based Stepper motor control.
PLC Based Level Control.
PLC Based Pressure Control.
Designing of Fuzzy-Logic based controller.
Design of Neural Network based controller.