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8, AUGUST 2014
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AbstractThis paper presents a bandwidth enhancement technique for broadband Darlington amplifiers. A detailed analysis
of the high-frequency performance of the Darlington amplifier
and the effect of bandwidth enhancement is provided. A design
procedure is also given for broadband feedback Darlington
amplifiers with bandwidth enhancement and gain flattening. A
single- and a three-stage feedback amplifier with the proposed
improvements are designed and implemented in a 0.25- m AlGaAsInGaAs pHEMT technology. The single-stage amplifier
provides 6 0.4 dB of small-signal gain in the frequency band
of 130 GHz. The three-stage amplifier features 17.8
0.8 dB of
small-signal gain in the frequency band of 229 GHz. It provides
a gain-bandwidth product of 217 GHz, which is 3.3 times larger
than the unity gain frequency
of the process.
Index TermsBandwidth enhancement, broadband amplifiers,
Darlington amplifier, feedback amplifiers, monolithic microwave
integrated circuit (MMIC).
I. INTRODUCTION
Fig. 1. (a) Darlington amplifier and (b) circuit model used for calculation of
unity current gain frequency of the amplifier.
fiers [7], [9], transimpedance amplifiers [10], and power amplifiers [11]. Several circuit techniques have been proposed to improve the performance of the Darlington amplifier. In [2], a Darlington cascode amplifier with active self-bias and a linearizing
circuit has been proposed to improve the linearity-bandwidth
performance. In [12], a mirror-doubler has been used to extend
bandwidth of the amplifier. The inductive peaking techniques
have also been used to improve bandwidth [14]. Moreover, the
triple Darlington amplifier has been proposed to improve the
gain-bandwidth product (GBW) of the amplifier [17].
In this paper, a bandwidth enhancement technique is proposed for the Darlington amplifier. A detailed analysis of
high-frequency performance of the Darlington amplifier is
given in Section II. In Section III, the proposed technique to
improve bandwidth of the Darlington amplifier is presented.
In Section IV, a design procedure is given for the feedback
Darlington amplifier employing the bandwidth enhancement
and gain flattening techniques. Measurement results of the
implemented monolithic microwave integrated circuit (MMIC)
broadband amplifiers are presented in Section V.
II. HIGH-FREQUENCY ANALYSIS OF DARLINGTON AMPLIFIER
The Darlington amplifier can be considered as a transconductance stage. Here, its high-frequency parameters including unity
current gain frequency
, transconductance transfer function
, input/output admittances, as well as the feedback admittance between the input and output terminals of the amplifier are
derived and compared with that of a single transistor.
The schematic of a Darlington amplifier is shown in Fig. 1(a).
The current gain of the amplifier, using the equivalent circuit
shown in Fig. 1(b), is derived as
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(1)
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 62, NO. 8, AUGUST 2014
where
is the unity current gain frequency of the
transistors. Here, drainsource capacitance, gatedrain capacitance, and output resistance of the transistors are neglected. The
transistors are conventionally biased at the gatesource voltage
that maximizes their transconductance. If the two transistors
are biased at the same gatesource voltages, then
, where
denotes the width of transistors. Thus,
of the two devices are identical.
Applying the condition
to (1) leads to the
following equation:
(2)
where
denotes the unity gain frequency of the Darlington
amplifier. The above equation can be solved to derive the unity
current gain frequency as
(3)
Therefore,
of the Darlington amplifier is about twice of the
unity current gain frequency of a single transistor. The presented
analysis provides a proof for the commonly known fact that the
Darlington structure can be regarded as a single transistor with
twice [9].
The triple Darlington amplifier, shown in Fig. 2, is also employed in design of broadband amplifiers [17]. The current gain
of the amplifier is derived as
(4)
Assuming identical
dition
Fig. 3. (a) Darlington amplifier with main parasitic capacitances. (b) Two-port
equivalent model.
High-frequency behavior of the amplifier cannot be completely described by its unity current gain frequency. Thus,
the admittance parameters of the Darlington amplifier are
derived. The schematic of the Darlington amplifier with main
parasitic capacitances is shown in Fig. 3(a), where the resistor
provides the bias current path for
. It also affects the
high-frequency performance of the amplifier. The gatedrain
capacitance and output resistance of the transistors are neglected to simplify the analysis. The amplifier can be modeled
by a two-port network shown in Fig. 3(b). The main advantage of using this model is that the amplifier behavior can
be easily compared with that of a single transistor, which is
mostly used as the transconductance block. Using the circuit
model of Fig. 3(b) for a single transistor, it is found that the
transconductance is given by
(7)
where
(5)
(10)
(11)
(12)
(13)
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(14)
(15)
where
Fig. 4. Effect of the width ratio of transistors on transconductance of the Darlington amplifier. (a) Frequency response of the transconductance transfer function. (b) Low-frequency transconductance. (c) Locations of the poles and zero
of the transconductance transfer function. (d) Ratio of bandwidth of the Darlington amplifier to bandwidth of a single transistor.
, a third pole at
, and a zero at
(18)
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 62, NO. 8, AUGUST 2014
and
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Here,
,
, and
are parameters that can be set by the designer, while
and
are process-dependent parameters. The third-order polynomial in the denominator
of (22) has the same form as the series peaking bandwidth
enhancement technique conventionally used in broadband amplifiers [18], [19]. Thus, it is expected that frequency response
of the amplifier have some common properties with the series
peaking technique. Simulations indicate that the parameters
and have an insignificant effect on the frequency response.
The effect of other parameters is illustrated in Fig. 9.
For the 0.25- m pHEMT process that is used for implementation of amplifiers,
and
. Fig. 9(a) indicates
that there is a dip and a peak in the frequency response. The frequency and magnitude of these points can be controlled by the
parameter
. This behavior is also observed in
the series peaking technique [18], [19]. Using a larger
ratio, as shown in Fig. 9(b), reduces the bandwidth when inductance
is not used
. However, in the presence of
,
the peak frequency is almost unchanged while gain variations in
the frequency band are increased. It should be noted that losses
present in the circuit suppress magnitudes of the dip and peak
in the frequency response. It is also possible to derive other admittance parameters of the amplifier. However, the results are
complicated and cannot provide useful insights about the amplifier performance.
The effect of different values of
on the transconductance
is illustrated in Fig. 10. These results are derived using circuit
simulations. There is an optimum value of
that the transconductance exhibits the lowest roll-off with frequency. If
is
excessively large, the transconductance exhibits large peaking
and sharply falls at the end of frequency band. In Fig. 11, 3-dB
bandwidth of the transconductance is depicted in terms of the
inductance
. The bandwidth is improved by a factor of 1.58
for
with
nH, and 1.91 for
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 62, NO. 8, AUGUST 2014
Fig. 12. Triple Darlington amplifier with the proposed bandwidth enhancement
method.
and
fF,
on the transconductance of
fF,
mS,
with
nH. For the case
, the bandwidth
is improved by a factor of 1.48 (with
nH), which is
lower than the previous cases (not shown). Therefore, the inductance
should be optimized based on the width ratio of the
two transistors, parasitic capacitances, and the frequency band
of interest.
The proposed bandwidth enhancement can also be adopted
in the triple Darlington amplifier, as shown in Fig. 12. The
two inductances
and
separate the drain terminals of
the transistors. Their values should be optimized to minimize
the transconductance roll-off with frequency. In Fig. 13, the
transconductance of the triple Darlington amplifier is plotted
Fig. 14. Shunt-feedback amplifier with input and output impedance matching
networks.
expected to operate in the frequency band of 130 GHz. A design procedure for the amplifier is provided in Sections IV-AE.
A. Feedback Network
The amplifier low-frequency transconductance
and the
feedback resistance
are determined based on
the closed-loop voltage gain and the input/output impedance
matching conditions of the feedback amplifier. Using the circuit
shown in Fig. 14 and neglecting output resistance of the transistors and loss of the input/output matching networks, it can be
shown that the voltage gain and input/output impedances at low
frequencies are given by
(23)
(24)
(25)
where
and
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only the gain and bandwidth should satisfy a set of given conditions, the two transistors should be biased at a current density that maximizes their transconductance. Thus, a small width
can be chosen for
. This improves bandwidth and lowers
power consumption of the amplifier. The width of
is determined from the ratio
optimized based on the gain-bandwidth tradeoff addressed in Section II. However, if noise or linearity of the amplifier should satisfy given constraints, the width
of
should be determined based on these considerations. In
this design, there is no limitation on noise of the amplifier, but
the output 1-dB compression point (
) of the amplifiers
should be better than 10 dBm. The width of transistors are
selected as
m and
m. Both
are biased at
V, leading to bias currents of 16
and 34 mA, respectively. The resulting transconductances are
mS and
mS. The resistance
is determined based on bias current of the transistor
and stability
condition for the Darlington amplifier. It is derived to be 50
in this design. The total transconductance, using (16), is derived
to be
mS.
C. Impedance-Matching Networks
The conditions given by (26) and (27) ensure impedance
matching only at low frequencies. However, the parasitic capacitances of the transistors degrade the impedance matching
at high frequencies. In the Darlington amplifier, the impedance
matching is commonly achieved in narrower bandwidth
compared to gain [20]. To provide input/output impedance
matching at high frequencies, ladder-type networks are used at
the input and output of the amplifier. The parasitic capacitances
of the transistors are absorbed in these matching networks
to achieve impedance matching in the desired bandwidth.
A circuit simulation tool such as Agilent Technologies Advanced Design System (ADS) can be used for synthesis of the
impedance-matching networks.
D. Gain Flattening
The feedback impedance
can be designed to extend
bandwidth and improve flatness of the gain response. An inductor
can be used in the feedback path to further improve bandwidth [1]. This inductance can also represent the
unwanted parasitic inductance of the line connecting the feedback network between the input and output of the amplifier. The
feedback amplifier employing a Darlington amplifier with bandwidth enhancement and gain flattening is shown in Fig. 15. The
inductance
can be determined by the method described in
Section III to improve bandwidth while maintaining gain flatness. Both
and
introduce peaking in the gain response at
high frequencies. The feedback resistance can be partially bypassed at high frequencies using capacitance
to compensate the peaking introduced by the inductances and flatten the
gain response. The gain of the feedback amplifier is depicted in
Fig. 15 for three cases. In the conventional case, the Darlington
amplifier is adopted with the purely resistive shunt feedback.
The bandwidth-enhanced case refers to the circuit with inductances
and
, where the bandwidth is improved compared
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 62, NO. 8, AUGUST 2014
to the conventional amplifier, but large peak and dip are also introduced in the gain frequency response. In the bandwidth-enhanced/gain-flattened case, the peak is suppressed by partial bypassing of the feedback resistance and a flat gain response is
achieved. This would lead to a small degradation in the bandwidth due to the added capacitance
.
E. Complete Amplifier Design
The complete schematic of the designed single-stage amplifier is shown in Fig. 16. The inductors are implemented using
microstrip transmission lines. The capacitors
provide
dc block. The resistor
is used to decrease the amplifier gain
at very low frequencies and improve its stability. The capacitor
is inserted in parallel with
to reduce its equivalent
impedance at high frequencies and avoid unnecessary degradation of gain at these frequencies. The resistors
are used
to provide the gate bias for the transistors. The inductor
is used to enable operation of the amplifier at low frequencies.
It is implemented using a bond-wire with 10-mm length to provide about 10-nH inductance. The resistor
is used to improve stability. It is noteworthy that the total feedback resistance
is close to the calculated value of
200 in Section IV-A.
In the three-stage amplifier, three identical stages similar to
the single-stage amplifier are cascaded to achieve a voltage
The designed amplifiers are implemented in an AlGaAsInGaAs pHEMT technology with 0.25- m gate length on a
100- m-thick substrate. The unity gain frequency
and
the maximum oscillation frequency of the process are 65
and 190 GHz, respectively. The peak transconductance of
transistors is 340 mS/mm, obtained at the bias voltages of
V and
V(110-mA/mm current density).
The process offers two metal layers with 1- and 4- m thickness, air bridges, and ground back-vias. Moreover, metalinsulatormetal (MIM) SiN capacitors with 650-pF mm density,
thin film and mesa resistors with 50- and 160sheet resistances are available in the process. The MMIC chips and test
boards are assembled in aluminum housing. The backside of the
chip is attached to the housing using a conductive epoxy. The
chips are connected to the external board using gold bond wires
with 18- m diameter. The test board provides adjustable bias
voltages and RF input/output access through 50- microstrip
lines. Effects of the test board parasitic components have been
de-embedded from the measurement results.
In Fig. 17, the die microphotographs of the two amplifiers and
the three-stage amplifier mounted on the test board are shown.
The RF choke
is realized using bond wires. The input
and output of the amplifier are connected to the test board using
four bond wires in parallel to reduce their inductance (
and
). The external elements
and
are inserted in the gate
bias paths to improve the amplifier stability. The amplifiers are
biased at
V,
V, and
V.
The small-signal -parameters of the two amplifiers are
shown in Figs. 18 and 19. The single-stage amplifier provides
6-dB average small-signal gain with 0.4-dB variation in the
frequency band of 130 GHz. The 3-dB bandwidth of the
amplifier spans from 0.8 to 32.7 GHz. The three-stage amplifier
provides 17.8-dB average small-signal gain with 0.8-dB variation in the frequency band of 229 GHz. The 3-dB bandwidth
ranges from 1.5 to 29.5 GHz.
of the amplifiers is shown in Fig. 20. Its value measured at the frequency of 5 GHz is 15.5 dBm for the single-stage
and 15.3 dBm for the three-stage amplifier. It is noticed that
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Fig. 17. (top) Die microphotograph of the single-stage amplifier. (middle) Die
microphotograph of the three-stage amplifier. (bottom) Three-stage amplifier
mounted on the test board.
Fig. 20.
degrades at higher frequencies. This is a typical behavior of the Darlington amplifier that originates from departure
of the phase at the output of the amplifier from 180 as frequency
increases [2].
In Table I, performance of the designed amplifiers is compared with the state-of-the-art broadband Darlington amplifiers.
The three-stage amplifier provides the highest GBW compared
to the listed designs. This higher GBW can be partially due
to using more amplifier stages compared to other designs.
However, it should be noted that although higher GBW can be
achieved using more amplifier stages, the gain flatness over the
frequency band cannot be easily maintained. The gain flattening
technique described before helps to improve the gain flatness
of the amplifier. The ratios
and
have
been used as figure-of-merits to compare GBW performance of
the amplifiers implemented in different technologies.
It should be noted that the broadband amplifiers should not
be compared merely based on their GBW performance. Using
smaller transistors leads to higher GBW at high frequencies, at
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 62, NO. 8, AUGUST 2014
TABLE I
PERFORMANCE COMPARISON OF THE DESIGNED AMPLIFIERS WITH STATE-OF-THE-ART BROADBAND DARLINGTON AMPLIFIERS
REFERENCES
[1] I. J. Bahl, Fundamentals of RF and Microwave Transistor Amplifiers. New York, NY, USA: Wiley, 2009.
[2] K. W. Kobayashi, Linearized Darlington cascode amplifier employing
gaas PHEMT and GaN HEMT technologies, IEEE J. Solid-State Circuits, vol. 42, no. 10, pp. 21162122, Oct. 2007.
[3] D. A. Hodges, Darlingtons contributions to transistor circuit design,
IEEE Trans. Circuits Syst. I, Fundam. Theory Appl., vol. 46, no. 1, pp.
102104, Jan. 1999.
[4] K. W. Kobayashi, R. Esfandiari, M. E. Hafizi, D. C. Streit, A. K. Oki,
L. T. Tran, D. K. Umemoto, and M. E. Kim, GaAs HBT wideband matrix distributed and Darlington feedback amplifiers to 24 GHz, IEEE
Trans. Microw. Theory Techn., vol. 39, no. 12, pp. 20012009, Dec.
1991.
[5] K. Schnider et al., Comparison of InP/InGaAs DHBT distributed amplifiers as modulator drivers for 80-Gbit/s operation, IEEE Trans. Microw. Theory Techn., vol. 53, no. 11, pp. 33783387, Nov. 2005.
[6] S. Mohammadi, J.-W. Park, D. Pavlidis, J.-L. Guyaux, and J. C. Garcia,
Design optimization and characterization of high-gain GaInP/GaAs
HBT distributed amplifiers for high-bit-rate telecommunication, IEEE
Trans. Microw. Theory Techn., vol. 48, no. 6, pp. 10381044, Jun.
2000.
[7] K. W. Kobayashi, D. K. Umemoto, T. R. Block, A. K. Oki, and D. C.
Streit, A novel monolithic LNA integrating a common-source HEMT
with an HBT Darlington amplifier, IEEE Microw. Guided Wave Lett.,
vol. 5, no. 12, pp. 442444, Dec. 1995.
[8] S. Trotta et al., An 84 GHz bandwidth and 20 dB gain broadband
amplifier in SiGe bipolar technology, IEEE J. Solid-State Circuits,
vol. 42, no. 10, pp. 20992106, Oct. 2007.
[9] J. Lee and J. D. Cressler, Analysis and design of an ultra-wideband
low-noise amplifier using resistive feedback in SiGe HBT technology,
IEEE Trans. Microw. Theory Techn., vol. 54, no. 3, pp. 12621268,
Mar. 2006.
[10] C. H. Fields et al., 110+GHz transimpedance amplifier in InP-HBT
technology for 100 Gbit ethernet, IEEE Microw. Wireless Compon.
Lett., vol. 20, no. 8, pp. 465467, Aug. 2010.
[11] K. W. Kobayashi, Y. C. Chen, I. Smorchkova, R. Tsai, M. Wojtowicz,
and A. Oki, 1-Watt conventional and cascoded GaN-SiC Darlington
MMIC amplifiers to 18 GHz, in IEEE RFIC Symp., Jun. 2007, pp.
585588.
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