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bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
3 Description
2 Applications
Device Information(1)
PART NUMBER
bq24308
PACKAGE
WSON (8)
5 CE
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
4
5
6
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (November 2009) to Revision B
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Changed the location of the ESD information from the ABS MAX table to the news ESD Ratings table ............................ 4
Moved Figures 1 through 10 from Typical Characteristics to Application Curves section .................................................. 14
Page
Changed Units from V to A for Input and Output Current spec in Absolute Maximum Ratings table.................................... 4
Changed QEXT device symbol in the Input Reverse-Polarity Protection schematic. ........................................................... 14
bq24308
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MARKING
MEDIUM
QUANTITY
PACKAGE
bq24308DSGR
DAS
3000
2.00 mm 2.00 mm
WSON
bq24308DSGT
DAS
250
2.00 mm 2.00 mm
WSON
IN 1
8 OUT
VSS 2
7 ILIM
bq24308
6 VBAT
PGATE 3
5 CE
NC 4
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
CE
Chip enable input. Active low. When CE = High, the input FET is off. Internally pulled down.
ILIM
Input overcurrent threshold programming. An optional external resistor can be used to increase input
overcurrent threshold. Connect a resistor to VSS to increase the OCP threshold.
IN
Input power, connect to external DC supply. Connect external 0.1F (minimum) ceramic capacitor to VSS.
NC
Do not connect to any external circuit. This pin may have internal connections used for test purposes.
OUT
Output terminal to the charging system. Connect external 1-F capacitor (minimum) ceramic capacitor to
VSS.
PGATE
VBAT
Battery voltage sense input. Connect to pack positive terminal through a resistor.
VSS
Thermal Pad
Ground terminal
There is an internal electrical connection between the exposed thermal pad and the VSS pin of the device.
The thermal pad must be connected to the same potential as the VSS pin on the printed-circuit board. Do
not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at
all times.
bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Input voltage
Input current
Output current
MIN
MAX
0.3
30
0.3
12
0.3
UNIT
V
IN
OUT
PGATE
mA
Junction temperature, TJ
40
150
65
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
UNIT
2000
(2)
Electrostatic Charged-device model (CDM), per JEDEC specification JESD22-C101
discharge
Air Discharge
IN (IEC 61000-4-2) (3)
Contact
V(ESD)
(1)
(2)
(3)
(1)
500
15000
8000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
With IN bypassed to the VSS with a 1-F low-ESR ceramic capacitor
IIN
IOUT
RILIM
TJ
Junction temperature
MIN
NOM MAX
3.3
26
UNIT
V
1.5
1.5
31
40
A
k
125
(1)
DSG (WSON)
UNIT
8 PINS
RJA
58.6
C/W
RJC(top)
67.9
C/W
RJB
29.7
C/W
JT
1.2
C/W
JB
30.3
C/W
RJC(bot)
7.6
C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
bq24308
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IN
VUVLO
2.5
2.7
2.8
VHYS-UVLO
Hysteresis on UVLO
200
260
300
mV
tDGL(PGOOD)
IDD
Operating current
ISTDBY
Standby current
ms
410
500
65
95
45
75
mV
6.1
6.3
6.5
VHYS-OVP
Hysteresis on OVP
20
60
110
mV
tPD(OVP)
0.2
tON(OVP)
ms
Output voltage
4.85
5.15
630
700
770
mA
630
1500
mA
IOCP
KILIM
tBLANK(OCP)
tREC(OCP)
TJ = 0C to 125C
10%
TJ = 40C to 125C
13%
25000
CE= Low
ms
CE = Low
64
ms
4.3
4.35
4.40
VHYS-BOVP
Hysteresis on BVOVP
200
275
320
mV
IVBAT
10
nA
tDGL(BOVP)
176
THERMAL PROTECTION
TJ(OFF)
TJ(OFF-HYS)
140
150
20
C
C
VIN > 17 V
13
15
17
bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LOGIC LEVELS ON CE
VIL
VIH
1.4
IIL
IIH
0.4
V
V
VCE = 1.8 V
15
2.75
2.7
60
VIN Increasing
VIN = 5 V
50
VDO @ 250 mA - mV
VUVLO, VHYS-UVLO - V
2.65
2.6
2.55
2.5
40
30
20
VIN Decreasing
2.45
2.4
-50
10
-30
-10
10
30
50
70
Temperature - C
90
110
0
-50
130
50
Temperature - C
100
150
6.34
6.32
VOVP VHYS-OVP - V
VO - Output Voltage - V
5.05
5.03
5.01
6.3
VIN Increasing
6.28
6.26
6.24
VIN Decreasing
4.99
6.22
4.97
-50
50
Temperature - C
100
150
6.2
-50
50
Temperature - C
100
150
bq24308
www.ti.com
4.4
690
4.35
BVOVP (VVBAT Increasing)
685
4.3
BVOVP - V
IOCP - mA
680
675
4.25
4.2
670
4.15
665
4.1
660
655
-50
50
Temperature - C
100
4.05
-50
150
-30
-10
10
30
50
70
Temperature - C
90
110
130
1200
2.5
CE = L
1000
IDD, ISTDBY - mA
IVBAT - nA
800
1.5
600
400
CE = H
200
0.5
0
0
-50
-200
50
Temperature - C
100
150
10
15
20
25
30
35
VIN - V
VPGATE - V
12
10
8
6
4
2
0
0
10
15
20
25
30
35
VIN - V
bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
www.ti.com
8 Detailed Description
8.1 Overview
The bq24308 device is a highly integrated circuit designed to provide protection to Li-ion batteries from failures of
the charging circuit. The device continuously monitors the input voltage, the input current, and the battery
voltage. In case of an input overvoltage condition, the device immediately removes power from the charging
circuit by turning off an internal switch. In the case of an overcurrent condition, it limits the current to a safe value
for a blanking duration before turning the switch off. Additionally, the device also monitors its own die
temperature and switches off if it becomes too hot.
The input and overcurrent threshold is user-programmable. The device can be controlled by a processor using
the CE pin.
IN
Charge Pump,
Bandgap,
Bias Gen
OUT
V REF
VISNS
VREF
VREF
VO(REG)Loop
V REF
ILIM
OFF
OCP Comparator
VREF -
tBLANK(OCP)
VI SNS
VIN
VVLIM
CONTROL
AND STATUS
OVP Comparator
tBLANK(OVP)
VIN
VREF
CE
tDGL(PGOOD)
UVLO
VBAT
PGATE
level shift
THERMAL
VREF
SHUTDOWN
tDGL(BOVP)
VIN
VGCLMP
VSS
bq24308
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(1)
bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
www.ti.com
10
bq24308
www.ti.com
Any State
If VIN < VUVLO,
go to Power Down
Power Down
All IC functions OFF
No
Yes
Reset
Timers reset
Q1 off
Turn on PGATE
No
CE = Low ?
Yes
Turn off Q1
No
Yes
I < IOCP ?
Turn off Q1
No
Wait tREC(OCP)
Yes
Turn off Q1
No
Yes
TJ < TJ(OFF) ?
No
Turn off Q1
Yes
Turn on Q1
11
bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
www.ti.com
CIN
IN
OUT 8
1 mF
COUT
1 mF
Charging
Circuit
bq24308
SYSTEM
ILIM
VSS
CE
VBAT 6
RILIM
Optional
EXAMPLE VALUE
Supply Voltage
5V
INILIM
1A
bq24308
www.ti.com
Choosing RBAT in the range from 100 K to 470 k is a good compromise. In the case of a device failure, with
RBAT equal to 100 k, the maximum current flowing into the battery would be (30 V 3 V) 100 k = 270 A,
which is low enough to be absorbed by the bias currents of the system components. RBAT equal to 100 k would
result in a worst-case voltage drop of RBAT IVBAT = 1 mV. This is negligible compared to the internal tolerance of
50 mV on the BVOVP threshold.
If the Bat-OVP function is not required, the VBAT pin should be connected to VSS.
9.2.2.2 Selection of RCE
The CE pin can be used to enable and disable the device. If host control is not required, the CE pin can be tied
to ground or left unconnected, permanently enabling the device.
In applications where external control is required, the CE pin can be controlled by a host processor. As in the
case of the VBAT pin (see previous discussion), the CE pin should be connected to the host GPIO pin through
as large a resistor as possible. The limitation on the resistor value is that the minimum VOH of the host GPIO pin
less the drop across the resistor should be greater than VIH of the bq24308 device's CE pin. The drop across the
resistor is given by RCE IIH.
9.2.2.3 Selection of Input and Output Bypass Capacitors
The input capacitor CIN in Figure 12 and Figure 13 is for decoupling and serves an important purpose. Whenever
there is a step change downwards in the system load current, the inductance of the input cable causes the input
voltage to spike up. CIN prevents the input voltage from overshooting to dangerous levels. It is strongly
recommended that a ceramic capacitor of at least 1 F be used at the input of the device. It should be located in
close proximity to the IN pin.
COUT in Figure 12 and Figure 13 is also important: If a very fast (< 1 s rise-time) overvoltage transient occurs at
the input, the current that charges COUT causes the devices current-limiting loop to kick in, reducing the gatedrive to FET Q1. This results in improved performance for input overvoltage protection. COUT should also be a
ceramic capacitor of at least 1 F, located close to the OUT pin. COUT also serves as the input decoupling
capacitor for the charging circuit downstream of the protection device.
AC Adapter
VDC
GND
CIN
IN
OUT 8
1 mF
COUT
1 mF
Charging
Circuit
bq24308
ILIM
SYSTEM
VSS
CE
VBAT 6
RILIM
Optional
13
bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
www.ti.com
QEXT
AC Adapter
VDC
GND
100 K
CIN
1
IN
1 F
OUT 8
COUT
1 F
3 PGATE
bq24080
Charger IC
bq24308
SYSTEM
100 K
VBAT 6
RBAT
7 ILIM
VSS
47 K
RILIM
Optional
CE 5
RCE
VIN
VIN
VOUT
tDGL(PGOOD)
VOUT
IOUT
IOUT
VIN = 0 V to 12 V
VIN = 0 V to 6 V
14
tR = 50 s
tR = 20 s
Figure 15. Power-On with Input Overvoltage
bq24308
www.ti.com
8.4V
VIN < VUVLO
VIN
IN
VIN
6.4V
5.92V
VOUT
VOUT
VOUT
tR = 3 s
VIN = 5 V to 8 V
VIN
VVININ
tON(OVP)
VOUT
tREC(OCP)
IOUT
tBLANK(OCP)
VIN = 8 V to 5 V
tF = 100 s
ROUT = 16W
VOUT
ROUT = 2.8W
V
VOUTOUT
ROUT = 2.8W
IOUT
15
bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
www.ti.com
VVOUT
OUT
VVBAT
tDGL(BOVP)
VOUT
IOUT
16
bq24308
www.ti.com
11 Layout
11.1 Layout Guidelines
This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages.
Potentially, high voltages may be applied to this device. It must be ensured that the edge-to-edge clearances
of PCB traces satisfy the design rules for the high voltages. See Figure 24.
The device uses WSON packages with a thermal pad. For good thermal performance, the thermal pad must
be thermally coupled with the PCB ground plane (GND). This requires a copper pad directly under the device.
This copper pad must be connected to the ground plane with an array of thermal vias.
CIN and COUT should be located close to the device. Other components like RILIM (optional) and RBAT must
also be located close to the device.
GND
VOUT
GND
GND
BAT+
VBAT
VIN
To GATE of FET
Figure 24. Layout Example Recommendation
17
bq24308
SLUS977B SEPTEMBER 2009 REVISED AUGUST 2015
www.ti.com
12.2 Trademarks
E2E is a trademark of Texas Instruments.
Bluetooth is a trademark of Bluetooth SIG, Inc..
All other trademarks are the property of their respective owners.
12.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
18
www.ti.com
10-Jun-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
BQ24308DSGR
ACTIVE
WSON
DSG
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 125
DAS
BQ24308DSGT
ACTIVE
WSON
DSG
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 125
DAS
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
www.ti.com
10-Jun-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
10-Jun-2015
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ24308DSGR
WSON
DSG
3000
179.0
8.4
2.2
2.2
1.2
4.0
8.0
Q2
BQ24308DSGT
WSON
DSG
250
179.0
8.4
2.2
2.2
1.2
4.0
8.0
Q2
Pack Materials-Page 1
10-Jun-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ24308DSGR
WSON
DSG
3000
195.0
200.0
45.0
BQ24308DSGT
WSON
DSG
250
195.0
200.0
45.0
Pack Materials-Page 2
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