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Amp

Seed

High control

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3
High-power
output pulse with
characteristics
determined
by seed

Amp

High gain

High Gain &


High power

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Square input

Seed

Non-square
output
Amp

Amp

As the pulse output energy approaches the


saturation energy the amplifier inversion (gain)
varies across the pulse duration, leading to
significant pulse distortion.
This distortion produces pulse shaping with
preferential gain at the leading edge, giving
higher peak-power
Pulse duration and gain shaping can be
tailored to application needs
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Approx 20ns
Approx 200ns

Pulse Duration, Repetition Rate and Pulse Peak Power


can be independently selected and controlled
High Peak Powers can be achieved at High PRF
by deliberately shortening seed pulse duration
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20W Q-Switched
Fiber laser

20W Seeded MOPA


New Waveforms 20W

16

16.0

25 kHz

14.0

15

20 kHz
30 kHz
40 kHz
60 kHz
80 lHz

14
13
12

peak power (kW)

12.0

Power (kW)

10.0

8.0

80 kHz

6.0

4.0

11
10
9

20 kHz

8
7
6
5
4

80 kHz

3
2.0

2
1

0.0
-50

50

100

150

200

250

300

Time (s)

Reducing pulse duration as PRF is


increased holds peak-power high

50

100

150

200

250

300

time (ns)

Peak-power decays
significantly as PRF is
increased

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350

Marking & Micromachining with ns Pulsed Lasers

....SMART Laser.but how does it benefit my applications?

Reproduction or distribution forbidden without written consent of SPI Lasers

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EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

SPI Pulsed MOPA Fiber Laser

Preconfigured beam source with Waveform Selection on Demand


Waveforms stored within the control FPGA
Selectable on demand and on the fly
RS232 switching or External Hardware (Digital TTL)
Average Power, Peak Power, Repetition Rate independently variable
Extensive process space from a single source
Reproduction or distribution forbidden without written consent of SPI Lasers

Tailored Beam Quality & Pulse Energy


The right tool for every job!

Series

SM

RM/HS

HM

M2

<1.3

<2

~3.2

Key attribute

Fine feature
<25micron

Multi purpose
35-80micron

Wider lines >60micron

Application

Scribing &
fine marking

General marking and


micro-machining

Wide marks deep


engrave area/logo

Reproduction or distribution forbidden without written consent of SPI Lasers

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2+
2

1.8

35kHz, wfm 11
37kHz, wfm 12

1.6

220ns pulse-on time

39kHz, wfm 13
44kHz, wfm 14

1.4

48kHz, wfm 15

0.6mJ / pulse, 35kHz


= 20W Ave power

1.2

Voltage (V)

1
0.8

7kW
peak
power

51kHz, wfm 16
55kHz, wfm 17
60kHz, wfm 18
63kHz, wfm 19

45ns FWHM

68kHz, wfm 20
72kHz, wfm 21

0.6

80kHz, wfm 22

0.4

90kHz, wfm 23
105kHz, wfm 24

0.2

125kHz, wfm 25
170kHz, wfm 26

0
-0.2
-5.00E-08

270kHz, wfm 27
290kHz, wfm 28

0.00E+00

5.00E-08

1.00E-07

1.50E-07

2.00E-07

Time (s)

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2.50E-07

=" >1 "

For Applications requiring higher precision and finer lines particularly for solar
scribing

M2 < 1.3

Reproduction or distribution forbidden without written consent of SPI Lasers

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Feature Quality (Hole diameter & Depth)


Hole size 15% smaller than with M2 < 2 HS laser
Hole depth 30% deeper than with HS laser
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DE )'2

@ 10W
Entry hole
<40m

@ 20W
Entry hole
<50m

SM hole is 30% smaller than with M2 < 2 HS Laser


Images courtesy of Cambridge University
EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

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1.8

35kHz, wfm 11
37kHz, wfm 12

1.6

39kHz, wfm 13

1.4
1.2

Voltage (V)

1
0.8

44kHz, wfm 14

25ns pulse-on time

48kHz, wfm 15
51kHz, wfm 16

80J / pulse, 250kHz


= 20W Ave power

5kW
peak
power

55kHz, wfm 17
60kHz, wfm 18
63kHz, wfm 19
68kHz, wfm 20
72kHz, wfm 21

15ns FWHM

0.6

80kHz, wfm 22

0.4

90kHz, wfm 23
105kHz, wfm 24

0.2

125kHz, wfm 25
170kHz, wfm 26

0
-0.2
-5.00E-08

270kHz, wfm 27
290kHz, wfm 28

0.00E+00

5.00E-08

1.00E-07

1.50E-07

2.00E-07

Time (s)

Each trace is a different wfm at PRF0


EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

2.50E-07

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Array of spots with SM Laser


6W Average Power

Mark geometry and uniformity


evidence pulse stability

4-

5-5

Line scan, 250kHz PRF


50 m line spacing, 2m/s scan

On

Off

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On

20W M2 < 2 HS & 40W M2 ~ 3.2 HM Pulses


20W HS

40W HM

16.0
25kHz

15.0

26kHz

14.0

12.0
11.0

29kHz
32kHz

M2 < 2

9.0

Peak Power
>12kW @ 25kHz

7.0
6.0

20

41kHz

15

45kHz
50kHz

5.0

57kHz

4.0

66kHz
78kHz

3.0

97kHz

2.0

1.25mJ/pulse
@ 30kHz
M2 ~ 3.2

33.5kHz
38kHz

8.0

25

28kHz
30.5kHz

10.0
Power (kW)

27kHz

0.8mJ/pulse
@ 25kHz

13.0

10

Peak Power >20kW


& >10kW at 200kHz

135kHz

1.0

35.5kHz

0.0
-50

50

100

150

200

250

300

Time (ns)

Higher Pulse Energy and Peak Power


from Low-Moded Fibers traded against increased M2
Reproduction or distribution forbidden without written consent of SPI Lasers

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Marking of ferritic stainless steel engineering parts


Part numbers
Single pass
Filled fonts
Outline fonts

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No Spot Overlap
visible mark
poor resolution
dotted-line

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<5% Spot Overlap


improved mark
low resolution
scallop edge

>60% Spot Overlap


desired mark
high resolution
smooth line edge

EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

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* Image courtesy of Miyachi Unitek

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* Image courtesy of LMco

EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

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* Image courtesy of A&P Instruments Co Ltd

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* Image courtesy of Electrox

EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

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Sample courtesy of Electrox Ltd

At high magnification the line scan


base of the image can be seen.
Fill patterns and edging to enhance
strong colour block definition is
employed.

EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

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Requirement for absolute removal of thin film


from coated display glass for subsequent metallisation
- High repetition rate, high peak-power, high-speed scan
provides reliable cost-effective solution

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EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

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Detailed stamp engraved with 20W HS


Image courtesy of ACSYS GmbH

Multi pass engrave with 30W


HM utilising 2 high pulse
energy passes and a 3rd
smoothing pass at high reprate (top line of image only)
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EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

H2)
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=
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10mm

EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

-5

-5
6
-

Images courtesy of Miyachi Unitek

Copper

Aluminium

Stainless

EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers

IN SUMMARY

FLEXIBLE TOOL, DIVERSE


APPLICATIONS!
Tailored Pulse characteristics give
processing flexibility for multiple
application / materials / targeted
features

Images and samples courtesy of: Miyachi Unitek, Electrox, LMCo & Orotig
Reproduction or distribution forbidden without written consent of SPI Lasers