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PROFORMA OF BOND TO BE EXECUTED IN THE FORM OF AN AGREEMENT ON NON

JUDICIAL STAMP PAPER OF APPROPRIATE VALUE BY AN EMPLOYEE OF THE


HPGCL BEFORE PROCEEDING TO A FOREIGN COUNTARY ON A PRIVATE VISIT
An Bond made this ______________________ day of ___________________ between
Shri______________________________________ son of Shri_______________________
hereinafter called the Employee which term included his heirs, executors, administrators
successor-in-interest and legal representatives in favour of the Haryana Power Generation
Corporation Ltd., a body corporate under the provisions of Haryana State Electricity Reform
Act, 1997, successor of Haryana State Electricity Board which was created under section 5
of Indian Electricity (Supply) Act 1948, now in exercise of the powers conferred by sub
section (3) of Section 23 of Haryana State Electricity Reforms Act 1997 (Haryana Act 10 of
1998) herein after called the HPGCL' which term includes its successor in office and
assigns of the other part.
Whereas the HPGCL' in exercise of its powers as enshrined under Section79 of the Indian Electricity (Supply) Act, 1948 read with Haryana State Electricity Reforms
Act, 1997 to frame its Rules and Regulations to conduct its business and to govern the
services of its employees, in its meeting held on dated 17.08.98, has adopted all rules and
regulations order of HSEB therefore in view of decision dated 28.10.92 taken by erstwhile
HSEB to the effect that while granting permission to its employees to avail of pass port
facilities, the concerned employee should be asked to furnish bond that if he proceeds to
any Foreign Country without getting the leave sanctioned, he will render himself liable to
dismissal from the service and will forfeit his claim of pension, gratuity etc.
Whereas Shri________________________ son of Shri_________________
is employed in the HPGCL as _________________________ (Name of post) and presently
posted in ___________________________________ (Name of office).
Whereas permission of the HPGCL has been sought by the above named
employee vide his application dated _____________ for availing of the passport facility on
his private visit to _____________________________ (Name of the foreign country).
And whereas the employee has agreed to abide himself by the above terms
and conditions of the permission to be granted to him and inconsideration there of the
employee has agreed to execute this agreement.
NOW THESE PRESENT WITNESS AND THE PARTIES HERETO HEREBY
AGREES AS FOLLOWS:i)

The said employee will abide by the terms and conditions of his foreign visit

as laid down in erstwhile HSEB Memo No. Ch-63/HE/P-17-49/L dated 16.11.93 (duly
adopted by HPGCL) which has been examined thoroughly by the employee before
executing this agreement.
ii)

Now withstanding any thing contained in his letter of appointment and other

conditions of service applicable to him, the said employee Shri_______________________


do not get his leave sanctioned (As per leave rules of the HPGCL) from the competent

authority before his proceeding on private visit to ____________________ (Name of the


country) or in the event of non joining his duties after the expiry of leave sanctioned/to be
sanctioned to him, or accepting employment in the said foreign country without prior
permission of the HPGCL during the period of sanctioned leave, he will be deemed to have
severe relations with the HPGCL and shall liable himself to be dismissed from HPGCL's
service and forfeit his all claim for pension and gratuity etc. etc. as may, otherwise be
admissible to him under the pension rules of the HPGCL and all other benefits under the
rules of the HPGCL.
iii)

The said employee further agrees that he will refund to the HPGCL any

amount found outstanding against him as and when demanded by the HPGCL.
In witness where in the parties here to have signed this agreement the day
respectively mentioned against their signatures.

Place :Employee (Signature with


Name and Designation/date)
Witness (with full address)
1.

_____________________________
_____________________________

2.

_____________________________
_____________________________