OM01

Optical Mouse Sensor
Data Sheet

Index
1. General description Page 1
2. Features Page 1
3. Pin configurations (package) and descriptions Page 1
4. Absolute maximum rating Page 3
5. Electrical characteristics Page 3
6. Application circuit Page 5

0 volt power supply z Power down pin (PD) for USB suspend mode operation z On chip oscillator requiring only an external resistor (No resonator required) z 16-pin staggered dual inline package (ASDIP-16 / I-DIP-16) z Hibernation/suspend mode 3. 13 V DD . The tracking resolution is specified at 400 counts per inch (cpi) at rates of motion up to 12 inches per second (ips). and then digitally processed. Using an optical navigation technology. 16 TIO O △X and △Y axis quadrature outputs TCLK 1 Y1. Pin configurations (package) and descriptions (We define as ASDIP-16 and Agilent® define as I-DIP-16 which are 16-pin inter-digitated DIP) Front View Symbol I/O Description X1. 1 (Revision Date: 2004/2/10) .Internal reference REFA 7 PD I Power down pin.On chip oscillator frequency control Y1 4 ROSCB 12 GND Y2 5 VDD . General description This optical CMOS sensor provides a non-mechanical tracking engine for implementing a computer mouse. It offers a quadrature output mode for interface flexibility. digitized. it provides a complete and compact tracking engine.X2. OM01 Optical Sensor 1. the sensor measures changes in position by optically acquiring sequential surface images (frames) and mathematically determining the direction and magnitude of movement. This optical tracking engine has no moving parts and requires no precise optical alignment. Features z Superior precision and motion tracking by new optical navigation technology z Non-mechanical surface-tracking engine z Complete 2D motion sensor z Smooth surface navigation z Single 5. images are captured. it enables high volume system assembly.LED output control X1 3 ROSCA. Thus. The sensor is mounted in a plastic optical package and is designed to be used with a high intensity LED. On the CMOS IC chip. Hence. REFB .System ground XY_LED 6 10 GND REFA.Y2 15 PD X2 2 XY_LED O LED control 14 RBIN RBIN . active high ROSCB REFB 8 9 TCLK I Serial port clock for testing mode TIO I/O Serial data for testing mode This specification may change without further notice.0 volt DC power supply 11 ROSCA GND . 2.5.

38 0.54 (lead pitch) 12 6 1.15 mm.42 0.25 4.0 9. OM01 Optical Sensor Bottom View 22.1 mm.0 1.30 1 16 2 15 3 14 13.17 12.0.34 Note: 5° z Dimension in millimeter. z Lead pitch tolerance is +/.50 (lead width) 4 3.38 7. 2 (Revision Date: 2004/2/10) .15 9 1.15 mm.18 6. z Dimension tolerance is +/. z Chamfer (25º X 2) on the taper side of the lead. 0.1 mm.3º.02 1.27 (lead offset) 13 5 2.10 11 ψ0.80 0. zModule Structure (Dimension in millimeter) LENS θ 10. z Cumulative pitch tolerance is +/.5mm~0.4 2 8 5.2 mm.25 Surface is 0 ref.55 6.0. z Angular tolerance is +/.2 5 7 10 3. z Maximum flash is +0. z Coplanarity of leads is 0.0.8mm This specification may change without further notice.

6mm below Lead solder Temperature .5 V PD.15 g Source Current Mode (RBIN tied R1 10 .1 2.2 2.5 VDD +0. TCLK Angle of incidence θ 30 45 degree 5. Max. 191 Ω to VDD) Bin Resistor Source Current Mode (RBIN tied R2 8. 10 mW/m2 onto IC 5-2. Max. 33 KΩ to R2 to GND) Distance from Lens Reference A 2. 2 KV All pins. 1. 260 ℃ seating plane.4 5. Electrical characteristics 5-1.000 LED Light onto IC IRRINC mW/m2 λ = 875nm 100 . 12 in/sec Acceleration A . 30. 0 .75 V REFB Voltage VREFB . . . . . 3 (Revision Date: 2004/2/10) . Unit Notes Oscillator Resistor ROSC 43 51 56 KΩ Speed S 0 . Supply Voltage VDD 4. TIO. -0. V ROSCA Voltage VROSCA 0. Recommended operating conditions Parameter Symbol Min Typ.5 V ESD . Unit Notes Clock Frequency FCLK 13 16 19 MHz Frame Rate fframe 1400 1700 2000 frames/sec REFA Voltage VREFA 3.3 mm Plane to Surface λ = 639nm 80 . 25.6*VDD V ROSCB Voltage VROSCB . human body model Input Voltage .25 3. Max Unit Notes Storage Temperature Range TSTR -40 85 ℃ Operating Temperature Range TOPR 0 40 ℃ For 10 seconds. VDD . 0. OM01 Optical Sensor 4.000 Unintended External Light IRREXT . V This specification may change without further notice.5*VDD 0.4*VDD 0.5 3.2 . Absolute maximum ratings Parameter Symbol Min. DC electrical characteristics Parameter Symbol Min Typ.

6 V (RBIN tied to VDD) XY_LED High Sink Current Output Current Typ. . ns With LED This specification may change without further notice.0 mA LED current. . Y2 Output High Voltage VOH 3. OM01 Optical Sensor Mouse Active IDDAVG . .4 V IOL = 0. Power Up from VDD↑ tPU . . 0. ns With LED XY_LED Fall Time tf .8 V TCLK. . Y2 Fall Time tf . V IOH = 0. . 20 37 mA Rise Time tr . . 0.5mA X1. ns CL = 30 pF Rise Time tr .5mA Output High Voltage VOH 3. 4 (Revision Date: 2004/2/10) . DC Standby IDDSB . Y2. .5 3. 13 mA No load on X1. X2. + Typ. 100 .5mA Mouse Active . 200 ms Transient Supply Current IDDT . μs When the mouse is Power Up from PD↓ tPUPD . . 0. Y1. ns CL = 30 pF TIO Fall Time tf . TIO. X2. X2. Max. AC electrical characteristics Parameter Symbol Min Typ. V PD Output Low Voltage VOL .5mA Output Low Voltage VOL . 60% LED Duty Standby . 5% Cycle Power Down . Excluding Supply Current Power Down IDDPD . . Y1. Unit Notes Power Down Pulse Width Pulse width to initiate tPDW 720 . . 300 ms fully active again. 600 .5 . μs the power down mode. Input Low Voltage VIL . Power Down from PD↑ tPD . ns CL = 30 pF Rise Time tr . 0. ns CL = 30 pF X1. V IOH = 0.4 V IOL = 0. . 100 . 5 . . . . 10 mA Y1. 3.1 6 mA VOH = 0. 100 . 5 . - (RBIN tied to R2 to ILEDHSINK -510/R2 mA VOH = VDD – 2 V 35% 35% GND) High Sink Current I -1 0 1 μA R2 < 5KΩ (RBIN short to GND) LEDHSINK 5-3. Input High Voltage VIH 3 . 100 .5 .20% Low Output Current ILEDL -1 0 1 μA High Source Current ILEDHSRC 1.

PD Pin Timing z Pulse width to initiate the power down mode. X1 X2 Example: Quadrature Output Waveform (+X motion) 5-4-2.5 KHz. OM01 Optical Sensor 5-4. Timing diagrams 5-4-1. The quadrature signals can change at a maximum rate of 12. z When the mouse is fully active again. 5 (Revision Date: 2004/2/10) . Y2 quadrature signals. Quadrature Output Waveform The 2 channel quadrature outputs are 5V signals. tPUPD (Power Up from PD) maximum time is 300ms. tPDW (Power Down Pulse Width) minimum time is 720μs. X2 and Y1. PD ID D t PD t PUPD tPDW PD Timing Normal Mode This specification may change without further notice. The △X and △Y counts are used to generate the X1.

1uF 4. Application circuit 6-1.7uF X1 18 3 REFB 7 VS S X1 10 Y1 16 4 GND Y1 30PF 15 5 12 9 O SC I Y2 Y2 GND O SC O IR_C 30PF 6MHz 10 2 1. R3 open for 400dpi.1 10 ~ 113 10 ~ 137 10 ~ 169 10 ~ 191 EFT Level Rp Ru Cosc C1 & C3 C2 C0 & C4 Cp Cu 3.8 10 ~ 78.7uF DATA X1 X1 REFB 51K Ω 16 14 4 10 O SC R Y1 Y1 GND 8 15 5 12 V SS Y2 Y2 GND Elan EM 84510F OM 01 (PS/2 M ouse C ontroller) Optical M ouse Sensor C 3 and C4 direct connect to C 1 and C2 direct connect to M C U pin #7 and #11 sensor pin #12 and #13 C osc Ru C3 C4 C1 C2 USB Rosc R1 R C0 Cu 13 11 4 11 V R3 RO SC A V DD DD 6 14 V 5 13 D + D _SEL RBIN D D 9 High Light D+ RO SC B Lens LED -2 1 12 D .7 10 ~ 93.5KΩ OM 01 2N 3904 Elan eKM 8022A Optical M ouse Sensor US B & PS /2 M ouse C ontroller This specification may change without further notice. 1 1 LED D.1uF 4. Application type 1 (Compatible with Agilent® HDNS-2000) (where Rosc is 43KΩ. 6 (Revision Date: 2004/2/10) .2KV Class C) PS/2 C 3 and C4 direct connect to C 1 and C2 direct connect to C osc Connector M C U pin #1 and #8 sensor pin #12 and #13 5 6 C3 C4 C1 C2 Panasonic EVQ Rosc 4 Series Encocder 1 13 11 R1 R 3 3 11 14 V D D RO SC A Z1 VDD L RBIN 9 Hight Light 1 2 Rp 4 RO SC B LED -2 10 1 LED Z2 M T C LK 4 9 16 C0 Cp R T IO VDD Lens Surface T exture 2N 3904 3 7 2 15 6 V SS O PT O SC .O UT PD XY _LED 5 5 13 2 7 C LK C LK X2 X2 REFA DATA 1 6 12 3 8 0.3V 6 14 XY _LED M 15 3 PD 7 Panasonic EVQ Z1 REFA X2 17 2 Series Encocder 4 Z2 X2 8 0. short for virtual 800dpi.1uF 1.7uF 5 16 2N 3904 8 V R T IO Surface T exture Shield 3.0KV Class A 10Ω 10uF 10Ω 1nF 0. L T C LK VSS 3 4. OM01 Optical Sensor 6. LED-2 is for shining only) LED BIN K/L/M/N P Q R S T U R1 Value (Ω) 10 ~ 69.2KV Class B 100uF 10uF 22uF Don’t Care Short Open Short Open Open (1.

2 ~ 33 EFT Level Rp Ru Cosc C1 & C3 C2 C0 & C4 Cp Cu 3.2 ~ 18 8.2 ~ 15 8. LED-2 is for shining only) LED BIN K/L/M/N/P Q R S T U R2 Value (KΩ) 8.2KV Class B 100uF 10uF 22uF Don’t Care Short Open Short Open Open (1.1uF 4.2 ~ 22 8.3V 6 14 X Y _LED M 15 3 PD 7 Pan asonic EV Q Z1 R E FA X2 17 2 X Series En cocder 4 Z2 2 8 0.2 ~ 27 8.1uF 4. R3 open for 400dpi.OU T 16 TIO Lens 5 5 Surface Texture C LK C LK X 2 13 2 X2 X Y _LED 6 1 6 3 D ATA D ATA X 12 1 X1 7 51K Ω R E FA 16 4 O SC R Y 1 14 Y1 8 0.7uF 5 16 8 V R TIO Surface Texture Shield 3. 1 1 L TC LK V SS 3 4.2 ~ 12 8. 1 12 D . Application type 2 (Compatible with Agilent® ADNS-2051) (where Rosc is 43KΩ.1uF 1.2KV Class C) C3 and C4 direct connect to C1 and C2 direct connect to PS/2 Connector M CU pin #1 and #8 sensor pin #12 and #13 C osc R 5 6 Panasonic E V Q C 3 C4 C1 C2 4 Series Encocder 1 3 3 11 11 R osc Z1 V DD L 1 2 Rp 4 R O SC A 10 13 Z2 M V DD 15 9 H igh t Light LED -2 4 9 PD R O SC B C0 Cp R LED V DD 1 3 7 2 TC LK V SS O PT O SC . 7 (Revision Date: 2004/2/10) .7uF R E FB 8 5 V SS Y 2 15 Y2 10 GN D 14 12 Elan EM 84510F R B IN GN D (PS/2 M ouse Controller) OM 01 R2 Optical M ouse Sensor C3 and C4 direct connect to C1 and C2 direct connect to M CU pin #7 and #11 sensor pin #12 and #13 R C osc Ru C3 C4 C1 C2 U SB Rosc C0 Cu 13 11 4 11 V R3 R2 14 R O SC A V DD DD 6 V H igh Light 5 13 D + D _SE L R B IN D D 9 LED -2 D+ R O SC B Lens LED D. short for virtual 800dpi. OM01 Optical Sensor 6-2.0KV Class A 10Ω 10uF 10Ω 1nF 0.5KΩ 2N 390 4 OM 01 Elan eKM 8022A Optical M ouse Sensor USB & PS/2 M ouse Controller This specification may change without further notice.7uF X1 18 3 X R E FB 7 V SS 1 10 Y1 16 4 Y1 GN D 30PF 15 5 12 9 O SC I Y2 Y2 GN D 6MHz O SC O IR _C 30PF 10 2 1.