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LCD TV
SERVICE MANUAL
CHASSIS : LL01B

MODEL : 37LD460 37LD460-MA

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL62886412 (1005-REV00) Printed in Korea

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................12

EXPLODED VIEW .................................................................................. 19

SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC Do not use a line Isolation Transformer during this check.
power line. Use a transformer of adequate power rating as this Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
protects the technician from accidents resulting in personal injury between a known good earth ground (Water Pipe, Conduit, etc.)
from electrical shocks. and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
It will also protect the receiver and it's components from being with 1000 ohms/volt or more sensitivity.
damaged by accidental shorts of the circuitry that may be Reverse plug the AC cord into the AC outlet and repeat AC voltage
inadvertently introduced during the service operation. measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
If any fuse (or Fusible Resistor) in this TV receiver is blown, 0.5mA.
replace it with the specified. In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
When replacing a high wattage resistor (Oxide Metal Film Resistor, repaired before it is returned to the customer.
over 1W), keep the resistor 10mm away from PCB.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer, AC Volt-meter

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
shock. such as WATER PIPE,
To Instrument’s CONDUIT etc.
0.15uF
Leakage Current Cold Check(Antenna Cold Check) exposed
With the instrument AC plug removed from AC source, connect an METALLIC PARTS
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc. When 25A is impressed between Earth and 2nd Ground
If the exposed metallic part has a return path to the chassis, the for 1 second, Resistance must be less than 0.1 Ω
measured resistance should be between 1MΩ and 5.2MΩ.
*Base on Adjustment standard
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes

b. Some solder General Servicing Precautions removal devices not classified as "anti-static" can generate 1. Unless specified otherwise in this service manual. (Otherwise harmless motion such as 3. to the chassis or circuit assembly into which the device will be installed. Removing or reinstalling any component. read and follow the 2. obtain and wear a commercially available discharging wrist strap device. or comparable conductive material). Use only a grounded-tip soldering iron to solder or unsolder ES Remember: Safety First. SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service unit under test.) electrical contacts only by applying the following mixture to the contacts with a pipe cleaner. LGE Internal Use Only Only for training and service purposes .5 inch. CAUTION: Work quickly to avoid overheating the circuit CAUTION: Do not connect the test fixture ground strap to any board printed foil. Unless specified otherwise in this service manual. to prevent electrostatic charge buildup or following servicing precautions and any of the safety precautions on exposure of the assembly. touch the protective material explosion hazard. Inc. Immediately before removing the protective material from the installation of electrolytic capacitors may result in an leads of a replacement ES device. Minimize bodily motions when handling unpackaged Do not test high voltage by "drawing an arc". replacement ES devices. Allow the soldering iron tip to reach a normal temperature Electrostatically Sensitive (ES) Devices (500°F to 600°F) Some semiconductor (solid-state) devices can be damaged easily b. source before. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam. foot from a carpeted floor can generate static electricity 4. chassis ground before connecting the test receiver positive (500°F to 600°F) lead. 8. Use a grounded-tip. Such components commonly are called the component lead until the solder melts. which should be removed to prevent potential shock reasons prior to applying power to the Copyright LG Electronics. range or 500°F to 600°F. cotton-tipped stick or comparable General Soldering Guidelines non-abrasive applicator. Always connect the test receiver ground lead to the receiver a. Alternatively. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your assemblies. aluminum foil capacitor in the receiver. other electrical connection. circuit board electrical charges sufficient to damage ES devices. drain off any electrostatic d. c. correctly installed. Quickly move the soldering iron tip to the junction of the devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil. 10% (by volume) Acetone and 90% (by 1. Use a mall wire- 6. Allow the soldering iron tip to reach normal temperature. electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners. Thoroughly clean the surfaces to be soldered. 2. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it. Use the following soldering technique. CAUTION: Work quickly to avoid overheating the circuit 1. Heat the component lead until the solder melts. and observe all other safety precautions. Use the following unsoldering technique 7. Do not remove a replacement ES device from its protective b. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit. CAUTION: A wrong part substitution or incorrect polarity 7. First. Immediately before handling any semiconductor component or board printed foil. -4. Use an appropriate gauge of RMA resin-core solder composed contacts in not required. Use only an anti-static type solder removal device. Examples of typical ES c. low-wattage soldering iron and appropriate volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the CAUTION: This is a flammable mixture. Do not apply AC power to this instrument and/or any of its bristle (0. voltage meter or other voltage measuring device (DVM. devices. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices. Keep the soldering iron tip clean and well tinned. splashed solder with a small wire-bristle brush. manual and its supplements and addenda. heat sink in this receiver. hold the soldering iron tip and solder the strand against by static electricity. These can generate a. receivers covered by this service manual might be equipped. Electrostatically Sensitive (ES) Devices. or 1. Do not defeat any plug/socket B+ voltage interlocks with which 3. Quickly draw the melted solder with an anti-static. lubrication of 2. All right reserved. Closely inspect the solder area and remove any excess or charge on your body by touching a known earth ground. 4. The following techniques only until the solder flows onto and around both the should be used to help reduce the incidence of component component lead and the foil. clean sufficient to damage an ES device. 4. devices. 5. of 60 parts tin/40 parts lead. FETVOM. module or any other receiver assembly. damage caused by static by static electricity. 3. 5. a. and hold it there semiconductor "chip" components. Do not use freon-propelled chemicals. always follow the safety precautions. suction- 8. service manual. 6. 5. place the assembly on a conductive surface such as NOTE: If unforeseen circumstances create conflict between the aluminum foil. Always remove the test receiver ground lead last. semiconductor-equipped assembly. After removing an electrical assembly equipped with ES SAFETY PRECAUTIONS on page 3 of this publication. 6. (Most replacement ES devices are packaged with leads c.25cm) brush with a metal handle. page 3 of this publication. etc) equipped with a suitable high voltage probe.

3. Trace along the copper pattern from both sides of the pattern Removal/Replacement break and locate the nearest component that is directly 1. Power Output. If they are not shiny. solder removal device (or with solder braid) before removing the IC. Bend the two remaining leads perpendicular y to the circuit board. Draw away the melted solder with an anti-static suction-type connections). (Remove only as much copper as absolutely necessary). Bend into a "U" shape the replacement transistor leads. Observing diode polarity. 5. this condition is encountered. 2. Solder each transistor lead. Replace heat sink. 3. side of the circuit board. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. Carefully crimp and solder the connections. at connections other than IC Pins. Inc. carefully scratch away the solder resist and acrylic coating (if 2. 4. wrap each lead of the new diode around the corresponding lead on the circuit board. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. use the standard technique following guidelines and procedures should be followed whenever as outlined in paragraphs 5 and 6 above. 2. Remove at least 1/4 inch of copper. Remove the defective copper pattern with a sharp knife. Copyright LG Electronics. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. Transistor Device 2. Insert new transistor in the circuit board. Solder the overlapped area and clip off any Removal/Replacement excess jumper wire. 2. Connect the replacement transistor leads to the corresponding board. Removal At IC Connections 1. Remove the defective transistor by clipping its leads as close as possible to the component body. -5. reheat them and if necessary. Clean the soldered areas with a small wire-bristle brush. and clip off excess lead. to ensure that a hazardous condition will not exist if the jumper wire opens. When working with board causing the foil to separate from or "lift-off" the board. the following technique board will weaken the adhesive that bonds the foil to the circuit should be used to remove and replace the IC. LGE Internal Use Only Only for training and service purposes . Solder the connections. it does not touch components or sharp edges. The boards using the familiar round hole. solder it. 1. Securely crimp each connection and solder it. Solder the IC connection. 4. connected to the affected copper pattern. Securely crimp the leads of replacement component around notch at stake top. 1. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good "Small-Signal" Discrete Transistor copper pattern. At Other Connections 2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern. 1. leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder 1. of the nearest component on the other side. 5. 2.IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit circuit foil. Connect insulated 20-gauge jumper wire from the lead of the 3. This technique involves the 3. Fuse and Conventional Resistor Removal/Replacement 1. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead board. 4. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern on the circuit board. apply additional solder. 3. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern melts. Carefully insert the replacement IC in the circuit board. Carefully remove the damaged copper pattern with a sharp Replacement knife. each connection. When holes are the slotted type. carefully crimp it around the IC pin. All right reserved. Bend a small "U" in one end of a small gauge jumper wire and 3. 3. Clip each fuse or resistor lead at top of the circuit board hollow stake. CAUTION: Be sure the insulated jumper wire is dressed so the 6. (It is not necessary to reapply acrylic coating to the areas). installation of a jumper wire on the component side of the circuit 4. Heat and remove all solder from around the transistor leads. (Use this technique only on IC 2. Remove the heat sink mounting screw (if so equipped).

4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. Requirement for Test Each part is tested as below without special appointment. Application range This specification is applied to the 32”/37”/42”/47” LCD TV used LL01B chassis. 1. 2. LGE Internal Use Only Only for training and service purposes .Safety: CE / ICE specification EMI: CE / ICE Copyright LG Electronics. SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement. Test method 1) Performance: LGE TV test method followed 2) Demanded other specification . CST : 40ºC ± 5 ºC 2) Relative Humidity : 65 ± 10 % 3) Power Voltage : Standard input voltage (100-240V~50/60Hz) * Standard Voltage of each products is marked by models. Inc. All right reserved. 3. 5) The receiver must be operated for about 5 minutes prior to the adjustment. -6. 1) Temperature : 25 ºC ± 5 ºC (77 ºF ± 9 ºF).

Contrast Ratio CR 4000 5000 All white/ All black White WX 0. Luminance Variation .25 3. All right reserved. Module optical specification *** LGD module Uniformity Measurement Position*** : Measurement position (5 point) 1H/4 P1 P2 2H/4 P3 3H/4 P4 P5 1W/4 2W/4 3W/4 4.1. Typ. 1.4.072 1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25 °C ± 2 °C 2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.0.144 Yb 0.1. CIE Color Coordinates Yr 0.278 WY Typ 0. Max. LGE Internal Use Only Only for training and service purposes .607 Blue Xb 0. Inc. 32” LCD Module (SHARP) LK315D3LA57 No.03 4.285 Typ RED Xr .280 Yg 0. -7. Viewing Angle<CR>10> Right/Left/Up/Down 70 88 CR > 10 Luminance (cd/m2) 360 450 2. Remark 1.641 +0. Item Specification Min.03 0. Chroma& Brightness 4.344 Green Xg 0. Copyright LG Electronics.1.

Luminance Variation .1. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m2) 400 500 2.3 3.334 Green Xg 0.607 Blue Xb 0. Contrast Ratio CR 1100 1500 All white/ All black White WX 0. Item Specification Min.292 Typ RED Xr . 4.0. CIE Color Coordinates Yr 0. -8. Typ.1.2. 4. 37” LCD Module (LGD) LC370WUG-SCA1 No. LGE Internal Use Only Only for training and service purposes . Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m2) 400 500 2.03 0.3.606 Blue Xb 0.146 Yb 0.065 1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C 2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.3 3.642 +0.145 Yb 0. Copyright LG Electronics. 32” LCD Module (LGD) LC320WUG-SCA1 No. Contrast Ratio CR 1000 1400 All white/ All black White WX 0. Max. Item Specification Min. CIE Color Coordinates Yr 0. Remark 1. Typ.292 Typ RED Xr .056 1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C 2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.279 WY Typ 0. 1. Remark 1.289 Yg 0.0.279 WY Typ 0. 1.334 Green Xg 0.03 4. Inc.03 4. Luminance Variation . All right reserved. Max.292 Yg 0.03 0.639 +0.

Contrast Ratio CR 1100 1500 All white/ All black White WX 0.0.279 WY Typ 0. 4. Max. Copyright LG Electronics. 1. Remark 1. LGE Internal Use Only Only for training and service purposes .291 Yg 0.5.603 Blue Xb 0. Contrast Ratio CR 1100 1500 All white/ All black White WX 0.146 Yb 0.292 Typ RED Xr .292 Typ RED Xr .03 0.0. Luminance Variation . CIE Color Coordinates Yr 0. Luminance Variation . 1.334 Green Xg 0. Typ.3 3.03 4.639 +0. 4. All right reserved.290 Yg 0.335 Green Xg 0.058 1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C 2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.1. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m2) 400 500 2. 42” LCD Module (LGD) LC420WUG-SCA1 No.146 Yb 0. Item Specification Min. -9.03 0. Typ.3 3. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m2) 400 500 2. CIE Color Coordinates Yr 0. 47” LCD Module (LGD) LC470WUG-SCA1 No.4. Remark 1. Max. Item Specification Min.636 +0. Inc.606 Blue Xb 0.1.061 1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C 2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.03 4.279 WY Typ 0.

1920x1080 33. 720*400 31. 1024*768 48.331 5.DVD 480i 2.63 59.269 0. CR/PR) Specification No Remark Resolution H-freq(kHz) V-freq(Hz) 1.DVD 480i 3.X axis 0.94 HDTV 1080i 13. 720x576 31.72 59.94 25.002 for Adjustment.Y axis 0.43/67.75 60. 720x480 15. 1920x1080 33.75 WXGA 7.08 28. 720x480 15.00 HDTV 720p 10.50 60.0 108.8 84.321 For only DOS mode Input 848*480 60Hz.73 60.285 0.00 60. Item Min Typ Max Remark 1.00 SDTV.X axis 0. 1920x1080 28.875 SXGA FHD model 8.96 59.275 White (85IRE) 2. 1920*1080 66.00 SDTV.468 70.00 VESA 4.595 60. 1920x1080 67.94 HDTV 720p 9.Y axis 0. Cool White Balance. 1360*768 47.311 0.315 W50 -> Warm White Balance. 1280x720 44. Warm White Balance. 720x480 31.except “RGB PC Mode PSM: Standard. 640*480 31.313 0.72 59.94 SDTV. Medium White Balance.00 65. RGB (PC) Specification No Proposed Remark Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz) 1. 720x576 15.287 Color Temp : C50 -> Cool White Balance. 1280x720 45.291 0.10 .47 59.015 PSM: Vivid.469 59. 1280*768 47. 852*480 60Hz 2.50 50.DVD 625 Line 6.625 50.87 79. .X axis 0.267 0. Color Temperature:Medium” ** The W/B Tolerance is ±0.879 60.00 VESA(XGA) 5.78 59.283 0. All right reserved.94 480p 4.271 DQA : ±0.273 0. 720x480 31.250 50 HDTV 1080p 14.363 60.625 WUXGA FHD model Copyright LG Electronics. 1280x720 37.17 VESA -> 640*480 60Hz Display 3.Y axis 0.293 0.00 HDTV 1080i 12. CB/PB. LGE Internal Use Only Only for training and service purposes .00 HDTV 720p 8. but for DQA ±0.271 0.00 HDTV 1080i 11. White Balance.587 59. Component Video Input (Y.94/60 HDTV 1080p 6. Inc.4. Chroma (Vivid) .327 0.25 50. 800*600 37. 1280*1024 63.2.93 138. 1920x1080 56.00 HDTV 576p 7.015 No.5 WXGA 6.31 40.5 59.295 0 -> Medium 3.329 0.125 50.00 480p 5.

7.716 / 33.25 HDTV 720P 4. 1280*720 44. 1920*1080 56.94 / 60 74.25 50 54 SDTV 576P 3.5 59. 1920*1080 67.94 25.25 HDTV 1080I 6.50 HDTV 1080P 7.469 /31.97 / 27 23.5 WUXGA HDCP Copyright LG Electronics. 1280*768 47.00/27. All right reserved.321 HDCP 2.97 / 24 74.75 WXGA HDCP 7.11 .96 / 45 59.25 HDTV 1080P 8. 1920*1080 33. 720*480 31.43 / 67.94 / 60 148.94 / 60 74.875 SXGA HDCP 8.94 / 60 27. 640*480 31.5 60 148.5 59. 1920*1080 67.17/ 74.75 59.72 / 33.5 WXGA HDCP 6.87 79.250 50 148. Inc. PC Mode No Resolution H-freq(kHz) V-freq.595 60.78 59.25 HDTV 720P 5. 1920*1080 26.976 / 30.31 40.5 HDTV 1080P 10. 1280*1024 63. 1920*1080 28. 1280*720 37.72 59.1. DTV Mode No Resolution H-freq(kHz) V-freq. 720*576 31.468 70.363 60.17/ 74.17/ 74.00 VESA(XGA) HDCP 5.75 29.879 60. LGE Internal Use Only Only for training and service purposes . 1920*1080 33.08 28.03 SDTV 480P 2.17 VESA HDCP 3. .8 84.(Hz) Pixel clock(MHz) Proposed Remark 1.0 108.469 59.500 50 74. 1360*768 47.2. 720*400 31. 1024*768 48. HDMI Input (PC/DTV) 7.00 65.25 HDTV 1080I 7.00 74.25 HDTV 1080P 9. 800*600 37.(Hz) Pixel clock(MHz) Proposed Remark 1.00 74.00 VESA HDCP 4.125 50.35/148.

Copyright LG Electronics. (6) Click “Run”. Push “I n-stop” key. (2) Set as below. Push “Power on” key To use speed between 4. filexxx.After Manual-Insert. Application Range This specification sheet is applied to all of the LCD TV with (4) LL01A/B chassis.bin (6) (8) ………. Function inspection from 200KHz to 400KHz 5. Push (5) Click “Auto” tab and set as below “In-stop” key at first. 2. jig. check 4) Input signal Unit: Product Specification Standard connection between computer. Main PCB check process (7) * APC . Push “Power on” key for turning it on.bin) by clicking “Read”. TV set will recover channel information by itself.12 . filexxx. DDC Adjustment Jig equipment. All right reserved. and set. After downloading S/W by USB. Push “In-stop” key. (7) After downloading. 5) Reserve after operation: Above 5 Minutes (Heat Run) Temperature : at 25 ºC ± 5 ºC (1) (3) Relative humidity : 65 ± 10% Input voltage : 220V. After function inspection. (5) 3. 60Hz 6) Adjustment equipments: Color Analyzer (CA-210 or CA- 110).For memory initialization. (3) Click “Read” tab. -> If you push “Power on” key. . and then click “Auto Detect” and check “OK” message. 2) Power Adjustment: Free Voltage 3) Magnetic Field Condition: Nil.. and set. according to the plan which can be changed only on agreeing. Inc. Check connection between computer. TV set will reboot automatically 2. executing APC * Boot file Download (1) Execute ISP program “Mstar ISP Utility” and then click “Config” tab. If “Error” is displayed. If “Can’t” is displayed. SVC remote controller 7) Push The “IN STOP KEY” .OK 3. Case2 : Function check at the assembly line 1. When TV set is entering on the assembly line. ADJUSTMENT INSTRUCTION 1.bin 2. and then load download file (XXXX. check “OK” message. After function inspection. LGE Internal Use Only Only for training and service purposes . (2) OK Case1 : Software version up 1. Push “In-stop” key Please Check the Speed : 3. jig. Pattern Generator(MSPG-925L or Equivalent). (4) Click “Connect” tab. Designation 1) The adjustment is according to the order which is designated and which must be followed.

(Each model has their number. (Each model has their number.. 3. Push "IN-START" key in service remote controller. LGE Internal Use Only Only for training and service purposes . All right reserved. check your updated version and Tool option. In this case. Punch in the number. Select "Area Option" and Push “OK” button. USB data is automatically detecting Model Tool option1 Tool option2 Tool option3 Tool option4 Tool option5 (3) Show the message “Copying files from memory” 22LE5300-MA(LGD) 8417 8714 51236 28940 3104 26LE5300-MA(LGD) 12513 18954 51236 28940 3104 32LD460-MA(LGD) 17121 10774 51204 28940 32 i TV Software Upgrade 42LD460-MA(LGD) 25313 10774 51204 28940 32 Copying files from memory Do not remove the memory card from the pc 37LD460-DA(LGD) 21217 10774 51204 23940 32 Do not plug off! 47LD460-DA(LGD) 33505 10774 51204 28940 32 32LE5300-MA(AUO) 16616 27926 55340 28940 32 37LE5300-MA(LGD) 20704 27926 55340 28940 32 (4) Updating is staring.) it didn’t work. 26LE6500-MA(LGD) 13513 18954 51236 28940 3104 63% Do not plug off! 4. If all channel data is cleared. (2) Automatically detecting update file in USB Stick. Copyright LG Electronics. (6) If TV turns on. (refer to the next page about tool option) * If downloading version is higher than your TV have. (5) After updating is complete. you didn’t have a DTV/ATV test on production line.If your downloaded program version in USB Stick is Low. Push "ADJ" key in service remote controller. Inc. 1. .. Completed selecting Tool option.13 . . TV can lost all channel data. 3. 2. (1) Put the USB Stick to the USB socket. The TV will restart automatically. you have to channel recover. Punch in the number. Select "Tool Option 1" and Push “OK” button. * Have to adjust Area code.epk file download) * After downloading. But your downloaded version is High. have to adjust Tool Option again. 42LE5300-MA(LGD) 24800 27926 55340 28940 32 47LE5300-MA(LGD) 32992 27926 55340 28940 32 55LE5300-MA(LGD) 45280 27926 55340 28940 32 i TV Software Upgrade 22LE6500-MA(LGD) 9057 8714 51236 28940 3104 Upgrading.) Upgrading COMPLETED 100% The TV will restart after seconds.* USB DOWNLOAD(*. i TV Software Upgrade 2. 1.

002) <Test Signal> Medium 9.2. Adjustment Preparation • Enter Internal ADC mode by pushing “G” key at “6. work instructions) 1) TV 2) AV (CVBS) 3) COMPONENT (480i) 4) RGB (PC : 1024 x 768 @ 60hz) 5) HDMI 6) PC Audio In * Display and sound check is executed by remote control. ADC Process 4.300k ºK X=0.269(±0. Copyright LG Electronics.002) Y=0. (“power on” key of adjust remote control) Cool 13. Total Assembly line process (1) ADC • Enter Service Mode by pushing “ ADJ” key 4.002) • In case of Edge LED module. ADC · W/B Equipment condition Calibration” CA210 : CH 9.313(±0. Test signal : Inner pattern (85IRE) · Above 5 minutes H/run in the inner pattern. LGE Internal Use Only Only for training and service purposes . so you have to use the below table. the color coordinates is * Caution: Using ‘power on’ button of the Adj. Function Check (1) Check display and sound .273(±0.85IRE) Warm 6.002) (216gray.002) Inner pattern Y=0.500k ºK X=0.285(±0.1.3.14 .002) Y=0.329(±0.1. . All right reserved.000k ºK X=0.Check Input and Signal items.293(±0. R/C.Adjust Sequence • aa 00 00 [Enter Adjust Mode] 4 10-19min 274 282 290 302 313 332 • xb 00 40 [Component1 Input (480i)] 5 20-35min 273 279 289 299 312 329 • ad 00 10 [Adjust 480i Comp1] 6 36-49min 270 276 287 296 310 326 • xb 00 60 [RGB Input (1024x768)] • ad 00 10 [Adjust 1024x768 RGB] 7 50-79min 269 273 286 293 308 323 • aa 00 90 [End Adjust Mode] 8 Over 80 min 269 273 285 293 308 323 * Required equipment : Adjustment R/C 3. (cf. changing by aging. Cool Medium Warm * ADC Calibration Protocol (RS232) H/R Time(Min) x y x x y x No. Inc. Item CMD1 CMD2 Data0 269 273 285 293 313 329 1 Enter Adjust Mode A A 0 0 1 0-2 min 280 291 296 311 319 340 2 ADC Adjust A D 0 0 2 3-5min 278 288 294 308 317 338 3 6-9min 276 285 292 305 315 335 . power on TV.

All right reserved. . check the back light on.1.1.1. R/C (On Automatic control) Inside PATTERN is used when W/B is controlled. Connecting picture of the measuring instrument 4. Press “In-start” button and compare 4. (illumination is less than 10ux). ON 7. Warm. 2) Adhere closely the Color Analyzer (CA210) to the module If it is not same. Inc. auto controller or push Adjustment R/C POWER ON -> Enter • Enter White Balance by pushing “G” key at “6. ADC Calibration B-Cut 64 6. power supply) and heat-run over 15minutes.Using ‘no signal’ or ‘full white pattern’ or the others.4. Sub B/C * After done all adjustments. keep the power on (no suspension of inspection. 4. Tool Option1 White Balance 1. Tool Option3 R-Gain 172 G-Gain 172 3.(80~100°). Test Pattern Reset To set 8. and adjust other two lower than C0. Connect to • After enter Service Mode by pushing “ADJ” key. . keep it with the surface of the cable. LGE Internal Use Only Only for training and service purposes . the pattern will come out Balance” EZ ADJUST 0.3. Auto adjustment Map (RS-232C) RS-232C COMMAND MIN CENTER MAX [CMD ID DATA] (DEFAULT) Cool Mid Warm Cool Mid Warm R Gain jg Ja jd 00 172 192 192 255 G Gain jh Jb je 00 172 192 192 255 B Gain ji Jc jf 00 192 192 172 255 R Cut 64 64 64 128 G Cut 64 64 64 128 B Cut 64 64 64 128 **Caution ** Color Temperature : COOL. Auto-control interface and directions Tool option and Area option 1) Adjust in the place where the influx of light like floodlight value with its BOM.2. Manual W/B process using adj. (when R/G/B Gain are all C0.1.2. Tool Option2 Color Temp. Cool Full White Pattern CA-210 2. Country Group R-Cut 64 TYPE: CA-210 G-Cut 64 5. Medium.15 . White the mode of White-Balance. White Balance Test-Pattern. Module and Color Analyzer’s Prove vertically. EDID D/L RS-232C Communication 9. cable. 3) Aging time * Push The “IN STOP KEY” after completing the function . One of R Gain/G Gain/ B Gain should be kept on 0xC0. Tool Option4 B-Gain 192 COLOR ANALYZER 4. then correct it same with BOM and unplug AC less than 10cm distance. it is the FULL Dynamic Range of Module) Copyright LG Electronics. if it is correctly same then unplug the AC around is blocked. For correct it to the model’s module from factory JIG model.After aging start.

D-sub to D-sub DVI-D to HDMI or HDMI to HDMI · Check whether written EDID data is correct or not. Tool Option2 HDMI2 NG 2. Sub B/C EDID D/L HDMI1 OK HDMI2 OK HDMI3 OK RGB OK Start Reset Copyright LG Electronics. * Caution · Write EDID DATA to EEPROM (24C02) by using DDC2B 1) Use the proper signal cable for EDID Download protocol.Analog EDID : Pin3 exists · Check whether written EDID data is correct or not. 3) Use the proper cables below for EDID Writing. Country Group 5. 4. Process in advance. LGE Internal Use Only Only for training and service purposes . Tool Option3 HDMI3 NG 3.5 EDID DATA 1) All Data : HEXA Value 2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 Item Condition Data(Hex) ***:Year : Controlled Manufacturer ID GSM 1E6D ****:Check sum Version Digital : 1 01 . Tool Option1 HDMI1 NG 1. DDC EDID Write (RGB 128Byte ) . HDMI2 separately because each data is 4. .Auto Download Revision Digital : 3 03 EZ ADJUT EDID D/L 0.Manual Download · Connect D-sub Signal Cable to D-Sub Jack. ADC Calibration Start Reset 6.Digital EDID : Pin3 exists * For SVC main Ass’y. All right reserved. Inc. For Analog EDID For HDMI EDID · Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.3. Tool Option4 RGB NG 4.16 . 4) Download HDMI1. EDID D/L 9. EDID have to be downloaded to Insert 2) Nerver connect HDMI & D-sub Cable at the same time. * For SVC main Ass’y. White Balance 7. . . Test Pattern 8. · Connect HDMI Signal Cable to HDMI Jack.4.4 DDC EDID Write (HDMI 256Byte) different. EDID have to be downloaded to Insert Process in advance.

. Inc. LGE Internal Use Only Only for training and service purposes . All right reserved. (1) FHD RGB EDID Data (CS : 1D) (5) HD HDMI1 EDID Data (CS : 7AD5) (2) FHD HDMI EDID Data (CS : D739) (6) HD HDMI2 EDID Data (CS : 7AD5) (3) FHD HDM2 EDID Data (CS : D739) (7) HD HDMI3 EDID Data (CS : 7AB5) (4) HD RGB EDID Data (CS : 93) (8) ASCII Code Copyright LG Electronics.17 .

LGE Internal Use Only Only for training and service purposes . In t e r f a ce Con t rol si gnal Volta ge Y Da t a I n p u t So urce D r i v e I C S T Column Line Pane l Gat e Driv e IC E Power Po w e rInput I nput Po w e r V COM Blo ck M CLC CST Liquid Crys tal V COM Row Li ne TFT V COM .Why need Vcom adjustment? .5 kV(dc) or 2. All right reserved.(This PIP key is hot key to enter the VCOM adjusting mode) (Or After enter Service Mode by pushing “ADJ” key.G. Inc. Circuit Block 4.8.) · Push the “OK” key to store value. · Press the exit key to finish VCOM adjustment. Then the message “Saving OK” is pop. (Must not AC power OFF during blinking) -> Liquid Crystal need for Polarity Change with every frame. V-COM Adjust(Only LGD(M+S) Module) 4.7.6. Red LED A The Vcom (Common Voltage) is a Reference Voltage of are blinked alternatively.Adjust sequence · Press the PIP key of th ADJ remote control.B ) & Ga mma Confirm whether is normal or not when between power Con t rol si gnal Re f e r e nce V o ltage Ti m i n g Data (R . . then Enter V-Com Adjust mode by pushing “G” key at “10. Liquid Crystal Driving. (Visual Adjust and control the Voltage level) · V-COM default value is different from module.G.4. Outgoing condition Configuration .B ) & C ont ro l s ignal board’s ac block and GND is impacted on 1.When pressing IN-STOP key by SVC remocon. And then Automatically turn off. Internal pressure Data (R . (If there is no flicker at default value.18 . and find the V-COM value which is no or minimized the Flicker. Press the exit key and finish the VCOM adjustment.2 S Gamm a Reference Co nt r o ll e r kV(dc) for one second. V- Com” · As pushing the right or the left key on the remote control. 1) 32LD460 : 417 2) 37LD460 : 432 3) 42LD460 : 433 4) 47LD460 : 447 5) 37LE5300 : 378 5) 42LE5300 : 450 5) 47LE5300 : 460 5) 55LE5300 : 444 Copyright LG Electronics.

These parts are identified by in the Schematic Diagram and EXPLODED VIEW. Shock. or other Hazards. . Do not modify the original design without permission of manufacturer. LGE Internal Use Only Only for training and service purposes . Fire. Inc. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION. EXPLODED VIEW IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. All right reserved.19 . 400 LV2 900 LV1 521 540 800 810 910 530 A10 200 A5 A4 500 120 A21 A2 510 300 Copyright LG Electronics.

7K 0.) PCM_D5 /PF_CE0 9 40 MIPS_EJ2_NOR8 : 4’h5 (MIPS as host.3 ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.9K 1K L : 8 bit 4 45 AR101 S7M_DIVX & MS10 NC_5 I/O7 PCM_A[7] 5 44 PCM_D[0] U22 N21 PCM_D0 GPIO143/TCON0 5V_DET_HDMI_1 NC_6 I/O6 PCM_A[6] PCM_D[1] T21 M21 R109 6 43 R107 PCM_D1 GPIO145/TCON2 5V_DET_HDMI_2 R/B I/O5 PCM_A[5] <T3 CHIP Config> PCM_D[2] T22 L22 PCM_D2 GPIO147/TCON4 5V_DET_HDMI_4 /F_RB 7 42 (AUD_SCK.1uF VCC_1 VCC_2 PCM_A[1] V21 L20 for ETHERNET PHY 12 37 PCM_A1 GPIO39 FRC_RESET PCM_A[2] Y22 M20 +3.2uF OPT AF6 NC_58 NC_58 AE11 NC_69 AF6 AF6 NC_58 AD19 NC_69 NC_69 AF6 I2C_SCL E1 WP AE6 NC_53 TCON3/OE/GOE/GCLK2 TCON15/SCAN_BLK1 AE19 AE6 TCON3/OE/GOE/GCLK2 AD19 AE19 AE6 TCON3/OE/GOE/GCLK2 AD19 AE19 NC_69 TCON3/OE/GOE/GCLK2 AD19 I2C_SCL A2 3 6 SCL R128 22 2 7 AF11 NC_74 TCON18/CS7/GCLK5 AD21 AF11 NC_53 TCON15/SCAN_BLK1 AD21 AF11 NC_53 TCON15/SCAN_BLK1 AD21 AE6 NC_53 TCON15/SCAN_BLK1 AE19 AD6 AD12 AE5 AF12 NC_37 NC_43 NC_52 NC_75 TCON19/CS8/GCLK6 TCON11/CS5/HCON TCON10/CS4/OPT_N TCON9/CS3/OPT_P AE21 AF21 AD20 AE20 AD6 AD12 AE5 AF12 NC_74 NC_37 NC_43 NC_52 TCON18/CS7/GCLK5 TCON19/CS8/GCLK6 TCON11/CS5/HCON TCON10/CS4/OPT_N AE21 AF21 AD20 AE20 AD6 AD12 AE5 AF12 NC_74 NC_37 NC_43 NC_52 TCON18/CS7/GCLK5 TCON19/CS8/GCLK6 TCON11/CS5/HCON TCON10/CS4/OPT_N AE21 AF21 AD20 AE20 AF11 AD6 AD12 AE5 NC_74 NC_37 NC_43 NC_52 TCON18/CS7/GCLK5 TCON19/CS8/GCLK6 TCON11/CS5/HCON TCON10/CS4/OPT_N AD21 AE21 AF21 AD20 LD650 Scan AF5 AF20 NC_75 TCON9/CS3/OPT_P NC_75 TCON9/CS3/OPT_P AF12 AE20 AF5 AF20 AF5 AF20 VSS NC_68 TCON16/WPWM NC_75 TCON9/CS3/OPT_P NEC_SDA 5 SDA AE12 AF19 NC_68 TCON16/WPWM NC_68 TCON16/WPWM AF5 AF20 4 E2 3 A0’h 6 SCL R111 22 I2C_SCL AE10 AF7 AD11 NC_59 NC_57 NC_70 TCON12/DPM TCON1/STV/GSP/VST TCON5/TP/SOE TCON14/SACN_BLK AD18 AE18 AF18 AE12 AE10 AF7 NC_59 NC_57 NC_70 TCON12/DPM TCON1/STV/GSP/VST TCON5/TP/SOE TCON14/SACN_BLK AF19 AD18 AE18 AF18 AE12 AE10 AF7 NC_59 NC_57 NC_70 TCON12/DPM TCON1/STV/GSP/VST TCON5/TP/SOE TCON14/SACN_BLK AF19 AD18 AE18 AF18 AE12 AE10 AF7 NC_68 NC_59 NC_57 TCON16/WPWM TCON12/DPM TCON1/STV/GSP/VST TCON5/TP/SOE AF19 AD18 AE18 AF18 NEC_SCL SCAN_BLK2 R158 100 FRC_PWM1 NC_42 AD11 AD11 NC_70 TCON14/SACN_BLK R129 22 I2C_SDA AD7 AD10 AE7 NC_38 NC_41 TCON21/CS10/VGH_ODD AB22 AB23 AD7 AD10 NC_42 NC_38 NC_41 TCON21/CS10/VGH_ODD AB22 AD7 AD10 NC_42 NC_38 NC_41 TCON21/CS10/VGH_ODD AB22 AD11 AD7 AD10 NC_42 NC_38 AB22 OPT NC_54 TCON20/CS9/VGH_EVEN AE7 AB23 AE7 AB23 NC_41 TCON21/CS10/VGH_ODD AF10 AC23 NC_54 TCON20/CS9/VGH_EVEN NC_54 TCON20/CS9/VGH_EVEN AE7 AB23 NC_73 TCON13/LEDON AF10 AC23 AF10 AC23 NC_54 TCON20/CS9/VGH_EVEN VSS 4 5 SDA R112 22 AD8 NC_39 TCON17/CS6/GCLK4 AC22 AD8 NC_73 NC_39 TCON13/LEDON TCON17/CS6/GCLK4 AC22 AD8 NC_73 NC_39 TCON13/LEDON TCON17/CS6/GCLK4 AC22 AF10 AD8 NC_73 NC_39 TCON13/LEDON TCON17/CS6/GCLK4 AC23 AC22 R159 100 FRC_PWM0 I2C_SDA NC_26 AB16 AA14 NC_26 AB16 AA14 NC_26 AB16 AA14 AB16 NC_19 NC_30 AC15 NC_19 AC15 NC_19 AC15 NC_26 NC_19 AA14 AC15 SCAN_BLK1/OPC_OUT OPT C104 C106 NC_15 Y16 AC16 NC_30 NC_15 Y16 AC16 NC_30 NC_15 Y16 AC16 NC_30 Y16 NC_31 NC_15 AE8 AC14 AC16 8pF 8pF Y11 NC_55 NC_29 AA16 AE8 Y11 NC_55 NC_31 NC_29 AC14 AA16 AE8 Y11 NC_55 NC_31 NC_29 AC14 AA16 AE8 NC_55 NC_31 NC_29 AC14 NC_12 NC_21 Y19 AA15 NC_12 NC_21 NC_12 NC_21 Y11 AA16 OPT OPT GND_105 NC_20 NC_11 Y10 Y19 GND_105 NC_20 AA15 Y10 Y19 GND_105 NC_20 AA15 Y10 Y19 NC_12 GND_105 NC_21 NC_20 AA15 AA11 NC_11 NC_11 Y10 NC_17 AA11 AA11 NC_11 NC_17 NC_17 AA11 NC_17 AB15 NC_25 AB15 AB15 AB14 NC_25 NC_25 AB15 NC_24 AB14 AB14 NC_25 NC_24 NC_24 AB14 NC_24 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. AE15 AD2 AD16 NC_62 NC_33 LVA3P/LLV7P/BLUE[1] LVA3N/LLV7N/BLUE[0] W24 Y26 Y25 AE15 AD2 NC_65 NC_62 NC_33 LVA2N/LLV5N/BLUE[4] LVA3P/LLV7P/BLUE[1] LVA3N/LLV7N/BLUE[0] W24 Y26 AE15 AD2 NC_65 NC_62 NC_33 LVA2N/LLV5N/BLUE[4] LVA3P/LLV7P/BLUE[1] LVA3N/LLV7N/BLUE[0] W24 Y26 AF2 AE15 AD2 NC_65 NC_62 LVA2N/LLV5N/BLUE[4] LVA3P/LLV7P/BLUE[1] V24 W24 Y26 R140 R141 R142 3.3V_Normal AD3 AF15 AF2 NC_34 NC_77 NC_65 LVA1N/LLV4N/BLUE[6] LVA2P/LLV5P/BLUE[5] LVA2N/LLV5N/BLUE[4] V26 V25 V24 AD3 AF15 AF2 NC_45 NC_34 NC_77 LVA1P/LLV4P/BLUE[7] LVA1N/LLV4N/BLUE[6] LVA2P/LLV5P/BLUE[5] V26 V25 V24 AD3 AF15 AF2 NC_45 NC_34 NC_77 LVA1P/LLV4P/BLUE[7] LVA1N/LLV4N/BLUE[6] LVA2P/LLV5P/BLUE[5] V26 V25 V24 AD14 AD3 AF15 NC_45 NC_34 NC_77 LVA1P/LLV4P/BLUE[7] LVA1N/LLV4N/BLUE[6] LVA2P/LLV5P/BLUE[5] U24 V26 V25 Addr:10101-. Internal SPI flash secure boot with scarmble) PCM_D7 GPIO36/UART3_RX WIRELESS_DL_RX C102 NC_8 NC_23 10uF L23 for WIRELESS READY OPT PCM_A[0] GPIO37/UART3_TX WIRELESS_DL_TX C101 11 38 +3.1uF PCM_A[3] PCM_A2 GPIO40 SC1/COMP1_DET R125 13 36 R123 AA22 G20 R117 R120 R115 PCM_A[4] PCM_A3 GPIO41 ERROR_OUT OPT 1K R105 NC_9 NC_22 OPT1K R22 G19 1K OPT1K 1K 1K 14 35 PCM_A4 GPIO42 MODEL_OPT_0 PCM_A[5] R21 NC_10 NC_21 AUD_LRCH PCM_A5 M_REMOTE OPT 15 34 PCM_A[6] T23 F20 22 R148 PCM_A[7] PCM_A6 GPIO50/UART1_RX M_REMOTE_RX CLE NC_20 AUD_SCK T24 F19 22 R149 16 33 M_REMOTE_TX /PF_CE1 AR102 PCM_A[8] PCM_A7 GPIO51/UART1_TX R104 AA23 M_REMOTE 10K OPT ALE I/O3 PCM_A[3] AUD_MASTER_CLK 17 32 PCM_A[9] PCM_A8 PF_ALE Y20 E7 PWM1 PCM_A[10] PCM_A9 GPIO6/PM0/INT0 USB1_OCD +3. EJ use PAD1.199 1 8 AE9 NC_56 RLV4P/RED[5] RLV4N/RED[4] AD22 AE9 RLV4P/RED[5] AF23 AD22 AE9 RLV4P/RED[5] AF23 AD22 NC_40 RLV2N/RED[8] RLV4P/RED[5] AF23 7 WP AF9 AE22 NC_56 RLV4N/RED[4] NC_56 RLV4N/RED[4] AE9 AD22 2 R127 4. EJ use PAD2.3K R144 2. Byte mode NAND flash. IC102 HY27UF082G2B-TPCB NAND FLASH MEMORY +3. Byte mode NAND flash.7K AE11 NC_72 NC_58 RLV5P/RED[3] RLV5N/RED[2] AF22 AF9 AE11 NC_72 RLV5P/RED[3] RLV5N/RED[2] AE22 AF22 AF9 AE11 NC_72 RLV5P/RED[3] RLV5N/RED[2] AE22 AF22 AF9 NC_56 NC_72 RLV4N/RED[4] RLV5P/RED[3] RLV5N/RED[2] AE22 AF22 I2C_SDA 2.3K R143 3. Byte mode NAND flash. Internal SPI flash secure boot.2K R145 2. PWM0) PCM_D[3] AB18 L21 5V_DET_HDMI_3 RE I/O4 PCM_A[4] PCM_D3 GPIO149/TCON6 PCM_D[4] AC18 P21 /PF_OE 8 41 MIPS_no_EJ_NOR8 : 4’h3 (MIPS as host.3V_Normal AE3 AD14 NC_64 NC_50 LVA0P/LLV3P/BLUE[9] LVA0N/LLV3N/BLUE[8] U25 U24 AF1 AE3 AD14 NC_78 NC_64 NC_50 LVACLKN/LLV6N/BLUE[2] LVA0P/LLV3P/BLUE[9] LVA0N/LLV3N/BLUE[8] U26 U25 U24 AF1 AE3 AD14 NC_78 NC_64 NC_50 LVACLKN/LLV6N/BLUE[2] LVA0P/LLV3P/BLUE[9] LVA0N/LLV3N/BLUE[8] U26 U25 U24 AF1 AE3 NC_78 NC_64 LVACLKN/LLV6N/BLUE[2] LVA0P/LLV3P/BLUE[9] U26 U25 NC_45 LVA1P/LLV4P/BLUE[7] NC_50 LVA0N/LLV3N/BLUE[8] HDCP EEPROM +3. WHEN SERVICING IF IS GP2_Saturn7M Ver. FILRE AND ELECTRICAL SHOCK HAZARDS. FLASH/EEPROM/GPIO 1 . no scramble) PCM_D6 PCM_A[0-14] PCM_D[7] AC21 K21 R108 1K 10 39 B51_Sesure_scramble : 4’hc (8051 as host.1uF AE14 AE13 NC_44 NC_61 LVB2N/RLV8N/GREEN[6] LVB3P/LLV1P/GREEN[3] AC24 AD26 AE14 NC_44 LVB2N/RLV8N/GREEN[6] AC24 AE14 NC_44 LVB2N/RLV8N/GREEN[6] AC24 AD13 AE14 NC_44 LVB2P/RLV8P/GREEN[7] LVB2N/RLV8N/GREEN[6] AB24 AC24 IC103 IC104 NC_60 LVB3N/LLV1N/GREEN[2] LVB4P/LLV0P/GREEN[1] AD25 AD24 AE13 NC_61 NC_60 LVB3P/LLV1P/GREEN[3] LVB3N/LLV1N/GREEN[2] AD26 AD25 AE13 NC_61 NC_60 LVB3P/LLV1P/GREEN[3] LVB3N/LLV1N/GREEN[2] AD26 AD25 AE13 NC_61 NC_60 LVB3P/LLV1P/GREEN[3] LVB3N/LLV1N/GREEN[2] AD26 AD25 R157 100 CAT24WC08W-T AE4 LVB4N/LLV0N/GREEN[0] LVB4P/LLV0P/GREEN[1] LVB4N/LLV0N/GREEN[0] AD24 LVB4P/LLV0P/GREEN[1] LVB4N/LLV0N/GREEN[0] AD24 LVB4P/LLV0P/GREEN[1] AD24 PWM_DIM PWM2 C107 M24M01-HRMN6TP AD5 AF4 NC_51 NC_36 NC_67 RLV3P/RED[7] AD23 AE4 AD5 AF4 NC_51 NC_36 AD23 AE4 AD5 AF4 NC_51 NC_36 AD23 AE4 AD5 NC_51 NC_36 LVB4N/LLV0N/GREEN[0] R113 AD4 NC_35 RLV3N/RED[6] AE23 AE26 AD4 NC_67 RLV3P/RED[7] AE23 AD4 NC_67 RLV3P/RED[7] AE23 AF4 AD4 NC_67 RLV3P/RED[7] AD23 AE23 4.3V_Normal U21 K20 PCM_A0 GPIO38 ET_RXER 0. PWM1.) PCM_D4 GPIO151/TCON8 SIDEAV_DET 22 PCM_D[5] AC19 CE NC_25 MIPS_EJ1_NOR8 : 4’h4 (MIPS as host.1uF AE2 RLV0P/LVSYNC AE25 AE2 NC_35 RLV3N/RED[6] RLV0P/LVSYNC AE26 AE25 AE2 NC_35 RLV3N/RED[6] RLV0P/LVSYNC AE26 AE25 NC_35 RLV3N/RED[6] AE26 AMP_SDA A0 1 NC_49 RLV0N/LHSYNC RLV0P/LVSYNC R155 8 VCC AF26 NC_49 RLV0N/LHSYNC NC_49 RLV0N/LHSYNC AE2 AE25 RLV1N/LCK AF26 AF26 NC_49 RLV0N/LHSYNC AF25 RLV1N/LCK RLV1N/LCK AF26 AF25 AF25 NC VCC AF8 AD9 NC_71 NC_40 RLV2P/RED[9] RLV1P/LDE RLV2N/RED[8] AE24 AF24 AF23 AF8 AD9 NC_71 RLV2P/RED[9] RLV1P/LDE AE24 AF24 AF8 AD9 NC_71 RLV2P/RED[9] RLV1P/LDE AE24 AF24 AF8 AD9 NC_71 RLV1N/LCK RLV2P/RED[9] RLV1P/LDE AF25 AE24 AF24 AMP_SCL 0 NC_40 RLV2N/RED[8] NC_40 RLV2N/RED[8] C111 A1 $0. AUD_MASTER_CLK.3K W22 E9 R102 E 22 27 /PCM_REG PCM_REG_N PM_SPI_WP1/GPIO13/PM7 /FLASH_WP F7 NC_14 NC_17 PM_SPI_WP2/GPIO14/PM8/INT2 MODEL_OPT_2 23 26 AA17 F6 /PCM_OE PCM_OE_N GPIO15/PM9 TUNER_RESET NC_15 NC_16 V22 D8 24 25 /PCM_WE PCM_WE_N PM_SPI_CS2/GPIO16/PM10 DEMOD_RESET +5V_Normal W21 G12 /PCM_IORD PCM_IORD_N GPIO17/PM11/INT3 AV_CVBS_DET Y21 F10 /PCM_IOWR PCM_IOWR_N GPIO18/PM12/INT4 R132 AA20 D9 33 R147 10K /PCM_CE PCM_CE_N PM_SPI_CK/GPIO1 SPI_SCK V23 D11 /PCM_IRQA PCM_IRQA_N GPIO0/PM_SPI_CZ /SPI_CS R133 P23 E10 10K /PCM_CD PCM_CD_N PM_SPI_DI/GPIO2 SPI_SDI for SERIAL FLASH R23 D10 33 R151 /PCM_WAIT PCM_WAIT_N PM_SPI_DO/GPIO3 SPI_SDO S7M_DIVX & DD P22 IC101-*1 LGE107DB-LF-1 (S7M Divx_Non RM/MS10) PCM_RST C109 PCM_RESET C108 CI_TS_CLK AE1 AF16 FRC_DDR3_A0/DDR2_NC ACKP/RLV3P/RED[3] W26 W25 AR104 0. 1.) PCM_D[6] AC20 NC_7 NC_24 B51_Secure_no scramble : 4’hb (8051 as host.1uF 0.3V_Normal NC_1 NC_29 LGE107D (S7M Divx_Non RM) 1 48 /PF_CE0 2GBIT H : Serial Flash NC_2 NC_28 2 47 <T3 CHIP Config(AUD_LRCH)> L : NAND Flash NC_3 NC_27 PCM_A[0-7] IC101 /PF_CE1 3 46 Boot from SPI flash : 1’b0 H : 16 bit PCM_D[0-7] NC_4 NC_26 Boot from NOR flash : 1’b1 3.3V_Normal +3.3V_Normal IC101-*8 S7_NON_DIVX & MS10 S7_NON_DIVX & DD LGE101D (S7 Non_Tcon/RM) IC101-*9 IC101-*10 LGE101DB-LF-1 (S7 Non_Tcon/RM/MS10) LGE101 (S7 NON_TON/DiX/RM) IC101-*11 EEPROM AE1 AF16 NC_48 NC_78 LVACLKP/LLV6P/BLUE[3] LVACLKN/LLV6N/BLUE[2] W26 W25 AE1 AF16 NC_48 LVACLKP/LLV6P/BLUE[3] W26 W25 AE1 AF16 NC_48 LVACLKP/LLV6P/BLUE[3] W26 W25 LGE101B-LF-1(S7 Non_Tcon/Divx/RM/MS10) AE1 NC_48 LVACLKP/LLV6P/BLUE[3] W26 DIMMING AF1 U26 AF16 W25 +3.5V_ST WE I/O2 PCM_A[2] AB17 D7 R103 /PF_WE 18 31 PCM_A10 GPIO7/PM1/PM_UART_TX USB1_CTL PCM_A[11] AA21 E11 0 WP I/O1 PCM_A[1] PWM0 PCM_A[12] PCM_A11 GPIO8/PM2 HP_DET 19 30 U23 G9 0 R150 R101 3.2K NC_47 LVA4P/LLV8P AD16 Y25 AD16 Y25 NC_33 LVA3N/LLV7N/BLUE[0] AD15 Y24 NC_47 LVA4P/LLV8P NC_47 LVA4P/LLV8P AD16 Y25 NC_46 LVA4N/LLV8N AD15 Y24 AD15 Y24 NC_47 LVA4P/LLV8P AE16 NC_46 LVA4N/LLV8N NC_46 LVA4N/LLV8N AD15 Y24 NC_63 AE16 AE16 NC_46 LVA4N/LLV8N NC_63 NC_63 AE16 NC_63 1K 1K AC26 LVBCLKP/LLV0P/GREEN[5] AC26 AC26 AC25 LVBCLKP/LLV0P/GREEN[5] LVBCLKP/LLV0P/GREEN[5] AC26 LVBCLKN/LLV0N/GREEN[4] AC25 AC25 LVBCLKP/LLV0P/GREEN[5] AA26 LVBCLKN/LLV0N/GREEN[4] LVBCLKN/LLV0N/GREEN[4] AC25 AF3 LVB0P/RLV6P/RED[1] AA25 AF3 LVB0P/RLV6P/RED[1] AA26 AA25 AF3 LVB0P/RLV6P/RED[1] AA26 AA25 LVBCLKN/LLV0N/GREEN[4] AA26 R156 10K C105 AF14 AD1 NC_66 NC_76 NC_32 LVB0N/RLV6N/RED[0] LVB1P/RLV7P/GREEN[9] LVB1N/RLV7N/GREEN[8] AA24 AB26 AB25 AF14 AD1 NC_66 NC_76 LVB0N/RLV6N/RED[0] LVB1P/RLV7P/GREEN[9] AA24 AB26 AF14 AD1 NC_66 NC_76 LVB0N/RLV6N/RED[0] LVB1P/RLV7P/GREEN[9] AA24 AB26 AF3 AF14 AD1 NC_66 NC_76 LVB0P/RLV6P/RED[1] LVB0N/RLV6N/RED[0] LVB1P/RLV7P/GREEN[9] AA25 AA24 AB26 A_DIM PWM0 NC_32 LVB1N/RLV7N/GREEN[8] NC_32 LVB1N/RLV7N/GREEN[8] LVB2P/RLV8P/GREEN[7] AB25 AB25 NC_32 LVB1N/RLV7N/GREEN[8] AD13 AB24 LVB2P/RLV8P/GREEN[7] LVB2P/RLV8P/GREEN[7] AB25 AD13 AB24 AD13 AB24 0. No EJ PAD.3K 1K OPT R118 R121 R124 R126 CONTROL_ATTEN OPT 1K OPT R116 C NC_11 I/O0 PCM_A[0] PCM_A[13] PCM_A12 GPIO9/PM3 R106 Y23 F9 0 R110 20 29 PCM_A13 GPIO10/PM4 MODEL_OPT_6 PCM_A[14] 1K W23 C5 1K B Q101 1K 1K /PF_WP NC_12 NC_19 22 PCM_A14 GPIO11/PM5/PM_UART_RX/INT1 MODEL_OPT_1 KRC103S 21 28 E8 33 R146 OPT NC_13 NC_18 PM_SPI_CS1/GPIO12/PM6 3.1uF IC102-*1 IC102-*2 AF1 FRC_DDR3_A1/DDR2_A6 ACKM/RLV3N/RED[2] U26 AA9 CI_TS_VAL HY27US08121B-TPCB NAND01GW3B2CN6E AE3 AD14 AD3 FRC_DDR3_A2/DDR2_A7 FRC_DDR3_A3/DDR2_A1 FRC_DDR3_A4/DDR2_CASZ A0P/RLV0P/RED[9] A0M/RLV0N/RED[8] A1P/RLV1P/RED[7] U25 U24 V26 OPT TS0_CLK from CI SLOT AF15 FRC_DDR3_A5/DDR2_A10 A1M/RLV1N/RED[6] V25 AC17 AA5 CI_TS_SYNC AF2 AE15 AD2 FRC_DDR3_A6/DDR2_A0 FRC_DDR3_A7/DDR2_A5 FRC_DDR3_A8/DDR2_A2 A2P/RLV2P/RED[5] A2M/RLV2N/RED[4] A3P/RLV4P/RED[1] V24 W24 Y26 /PF_CE0 PCM_PF_CE0Z TS0_VLD AD16 AD15 FRC_DDR3_A9/DDR2_A9 FRC_DDR3_A10/DDR2_A11 FRC_DDR3_A11/DDR2_A4 A3M/RLV4N/RED[0] A4P/RLV5P/GREEN[9] A4M/RLV5N/GREEN[8] Y25 Y24 /PF_CE1 AB20 AA10 CI_TS_DATA[0-7] AE16 FRC_DDR3_A12/DDR2_A8 PCM_PF_CE1Z TS0_SYNC BCKP/TCON13/GREEN[1] AC26 AC25 /PF_OE AA18 NC_1 NC_28 NC_1 NC_29 BCKM/TCON12/GREEN[0] AA26 PCM_PF_OEZ 1 512MBIT 48 1 48 AF3 FRC_DDR3_BA0/DDR2_BA2 B0P/RLV6P/GREEN[7] B0M/RLV6N/GREEN[6] AA25 22 AB21 AB5 CI_TS_DATA[0] 1GBIT AF14 AD1 FRC_DDR3_BA1/DDR2_ODT FRC_DDR3_BA2/DDR2_A12 B1P/RLV7P/GREEN[5] B1M/RLV7N/GREEN[4] AA24 AB26 /PF_WE AR103 NC_2 NC_27 NC_2 NC_28 AD13 B2P/RLV8P/GREEN[3] AB25 AB24 PCM_PF_WEZ TS0_D0 CI_TS_DATA[1] AE14 AE13 FRC_DDR3_MCLK/DDR2_MCLK FRC_DDR3_CKE/DDR2_RASZ B2M/RLV8N/GREEN[2] B3P/TCON11/BLUE[9] AC24 AD26 PF_ALE AB19 AC4 2 47 2 47 FRC_DDR3_MCLKZ/DDR2_MCLKZ B3M/TCON10/BLUE[8] AD25 PCM_PF_ALE TS0_D1 AE4 B4P/TCON9/BLUE[7] B4M/TCON8/BLUE[6] AD24 AD17 Y6 CI_TS_DATA[2] NC_3 NC_26 NC_3 NC_27 AD5 FRC_DDR3_ODT/DDR2_BA1 FRC_DDR3_RASZ/DDR2_WEZ /PF_WP 3 46 3 46 AF4 AD4 FRC_DDR3_CASZ/DDR2_CKE CCKP/LLV3P AD23 AE23 PCM_PF_AD[15] TS0_D2 CI_TS_DATA[3] AE2 FRC_DDR3_WEZ/DDR2_BA0 FRC_DDR3_RESETB/DDR2_A3 CCKM/LLV3N C0P/LLV0P/BLUE[5] C0M/LLV0N/BLUE[4] AE26 AE25 /F_RB AA19 AA6 NC_4 NC_25 NC_4 NC_26 C1P/LLV1P/BLUE[3] AF26 AF25 22 PCM_PF_RBZ TS0_D3 CI_TS_DATA[4] AF8 AD9 FRC_DDR3_DQSL/DDR2_DQS0 C1M/LLV1N/BLUE[2] C2P/LLV2P/BLUE[1] AE24 AF24 W6 4 45 4 45 FRC_DDR3_DQSLB/DDR2_DQSB0 C2M/LLV2N/BLUE[0] AF23 TS0_D4 AE9 AF9 FRC_DDR3_DQSU/DDR2_DQS1 FRC_DDR3_DQSUB/DDR2_DQSB1 C3P/LLV4P C3M/LLV4N C4P/LLV5P AD22 AE22 AF22 AA7 CI_TS_DATA[5] NC_5 I/O7 NC_5 I/O7 AE11 C4M/LLV5N TS0_D5 5 44 5 44 AF6 AE6 FRC_DDR3_DML/DDR2_DQ7 FRC_DDR3_DMU/DDR2_DQ11 DCKP/TCON5 AD19 AE19 R134 22 M23 Y9 CI_TS_DATA[6] AF11 AD6 FRC_DDR3_DQL0/DDR2_DQ6 FRC_DDR3_DQL1/DDR2_DQ0 DCKM/TCON4 D0P/LLV6P AD21 AE21 S7_TXD UART_TX2/GPIO65 TS0_D6 CI_TS_DATA[7] NC_6 I/O6 NC_6 I/O6 AD12 AE5 FRC_DDR3_DQL2/DDR2_DQ1 FRC_DDR3_DQL3/DDR2_DQ2 D0M/LLV6N D1P/LLV7P AF21 AD20 R135 22 N23 AA8 6 43 6 43 AF12 AF5 FRC_DDR3_DQL4/DDR2_DQ4 FRC_DDR3_DQL5/DDR2_NC D1M/LLV7N D2P/LLV8P AE20 AF20 S7_RXD UART_RX2/GPIO64 TS0_D7 AE12 FRC_DDR3_DQL6/DDR2_DQ3 D2M/LLV8N AF19 FE_TS_CLK R/B 7 42 I/O5 RB 7 42 I/O5 AE10 AF7 FRC_DDR3_DQL7/DDR2_DQ5 FRC_DDR3_DQU0/DDR2_DQ8 D3P/TCON3 D3M/TCON2 D4P/TCON1 AD18 AE18 AF18 FE_TS_VAL_ERR Internal demod out AD11 FRC_DDR3_DQU1/DDR2_DQ14 FRC_DDR3_DQU2/DDR2_DQ13 D4M/TCON0 for SYSTEM/HDCP R136 22 M22 AC5 RE I/O4 R I/O4 AD7 AD10 AE7 AF10 FRC_DDR3_DQU3/DDR2_DQ12 FRC_DDR3_DQU4/DDR2_DQ15 FRC_DDR3_DQU5/DDR2_DQ9 GPIO0/TCON15/HSYNC/VDD_ODD GPIO1/TCON14/VSYNC/VDD_EVEN AB22 AB23 AC23 I2C_SDA R137 22 N22 DDCR_DA/GPIO71 TS1_CLK AC6 FE_TS_SYNC /External demod in 8 41 8 41 AD8 FRC_DDR3_DQU6/DDR2_DQ10 FRC_DDR3_DQU7/DDR2_DQM1 GPIO2/TCON7/LDE/GCLK4 GPIO3/TCON6/LCK/GCLK2 AC22 EEPROM&URSA3 I2C_SCL DDCR_CK/GPIO72 TS1_VLD FE_TS_DATA[0-7] FRC_GPIO0/UART_RX AB16 AA14 AB6 CE NC_24 E NC_25 FRC_GPIO1 FRC_GPIO3 AC15 TS1_SYNC 9 40 9 40 FRC_GPIO8 Y16 AC16 R138 22 A5 AE8 FRC_DDR3_NC/DDR2_DQM0 FRC_GPIO9/UART_TX FRC_GPIO10 AC14 RGB_DDC_SDA DDCA_DA/UART0_TX FE_TS_DATA[0] NC_7 NC_23 NC_7 NC_24 Y11 Y19 FRC_REXT FRC_I2CM_DA AA16 AA15 R139 22 B5 AC10 10 39 10 39 FRC_TESTPIN FRC_I2CM_CK RGB_DDC_SCL DDCA_CK/UART0_RX TS1_D0 FRC_I2CS_DA FRC_I2CS_CK Y10 AA11 AB10 FE_TS_DATA[1] NC_8 PRE NC_8 NC_23 AB15 TS1_D1 11 38 11 38 FRC_PWM0 FRC_PWM1 AB14 AC9 FE_TS_DATA[2] VCC_1 VCC_2 VDD_1 VDD_2 TS1_D2 FE_TS_DATA[3] PWM0 K23 AB9 12 37 12 37 PWM0/GPIO66 TS1_D3 K22 AC8 FE_TS_DATA[4] VSS_1 VSS_2 VSS_1 VSS_2 PWM1 PWM1/GPIO67 TS1_D4 13 36 13 36 G23 AB8 FE_TS_DATA[5] PWM2 PWM2/GPIO68 TS1_D5 FE_TS_DATA[6] NC_9 14 35 NC_22 NC_9 14 35 NC_22 & MS10 :Region that support MS10(ex:DTV Country) SC_RE2 G22 PWM3/GPIO69 TS1_D6 AC7 G21 AB7 FE_TS_DATA[7] NC_10 NC_21 NC_10 NC_21 & DD :Region that support only Dolby Digital(ex:AISA Analog/KOREA) TO SCART1 SC_RE1 PWM4/GPIO70 TS1_D7 15 34 15 34 CLE NC_20 CL NC_20 16 33 16 33 C6 D12 ALE I/O3 AL I/O3 DSUB_DET SAR0/GPIO31 MPIF_CLK 17 32 17 32 B6 D14 S7T_DIVX & DD S7T_NON_DIVX & MS10 MODEL_OPT_3 SAR1/GPIO32 MPIF_CS_N /PIF_SPI_CS WE I/O2 W I/O2 S7M_NON_DIVX & MS10 S7M_NON_DIVX & DD S7T_DIVX & MS10 S7T_NON_DIVX & DD C8 18 31 18 31 IC101-*6 LGE105 (S7-Tcon Non_Divx/RM) IC101-*7 PCM_5V_CTL R160 IC101-*2 LGE107 (S7M Non Divx/RM) IC101-*3 LGE107B-LF-1 (S7M Non Divx/RM/MS10) IC101-*4 LGE105D(S7-Tcon Divx_ Non_RM) IC101-*5 LGE105DB-LF-1 (S7-Tcon Divx_ Non_RM/MS10) LGE105B-LF-1 (S7-Tcon Non_Divx/RM/MS10) SAR2/GPIO33 1K AE1 W26 C7 E14 WP I/O1 WP I/O1 AE1 W26 AE1 W26 AE1 W26 AE1 W26 AF16 AF1 NC_43 NC_73 RLV3P RLV3N W25 U26 AE1 AF16 NC_43 RLV3P W26 W25 /RST_PHY SAR3/GPIO34 MPIF_BUSY 19 30 19 30 AF16 AF1 AE3 FRC_DDR3_A0/DDR2_NC FRC_DDR3_A1/DDR2_A6 FRC_DDR3_A2/DDR2_A7 ACKP/RLV3P/RED[3] ACKM/RLV3N/RED[2] A0P/RLV0P/RED[9] W25 U26 U25 AF16 AF1 AE3 FRC_DDR3_A0/DDR2_NC FRC_DDR3_A1/DDR2_A6 FRC_DDR3_A2/DDR2_A7 ACKP/RLV3P/RED[3] ACKM/RLV3N/RED[2] A0P/RLV0P/RED[9] W25 U26 U25 AF16 AF1 AE3 NC_43 NC_73 NC_59 RLV3P RLV3N RLV0P W25 U26 U25 AF16 AF1 AE3 NC_43 NC_73 NC_59 RLV3P RLV3N RLV0P W25 U26 U25 AE3 AD14 NC_59 NC_45 RLV0P RLV0N U25 U24 AF1 AE3 NC_73 NC_59 RLV3N RLV0P U26 U25 A6 AD14 FRC_DDR3_A3/DDR2_A1 A0M/RLV0N/RED[8] U24 AD14 FRC_DDR3_A3/DDR2_A1 A0M/RLV0N/RED[8] U24 AD14 NC_45 RLV0N U24 AD14 NC_45 RLV0N U24 AD3 AF15 NC_40 NC_29 RLV1P RLV1N V26 V25 AD14 AD3 NC_45 NC_40 RLV0N RLV1P U24 V26 /RST_HUB SAR4/GPIO35 NC_11 I/O0 NC_11 I/O0 AD3 AF15 FRC_DDR3_A4/DDR2_CASZ FRC_DDR3_A5/DDR2_A10 A1P/RLV1P/RED[7] A1M/RLV1N/RED[6] V26 V25 AD3 AF15 FRC_DDR3_A4/DDR2_CASZ FRC_DDR3_A5/DDR2_A10 A1P/RLV1P/RED[7] A1M/RLV1N/RED[6] V26 V25 AD3 AF15 NC_40 NC_29 RLV1P RLV1N V26 V25 AD3 AF15 NC_40 NC_29 RLV1P RLV1N V26 V25 AF2 AE15 NC_72 NC_60 RLV2P RLV2N V24 W24 AF15 AF2 NC_29 NC_72 RLV1N RLV2P V25 V24 E12 20 29 20 29 AF2 AE15 AD2 FRC_DDR3_A6/DDR2_A0 FRC_DDR3_A7/DDR2_A5 FRC_DDR3_A8/DDR2_A2 A2P/RLV2P/RED[5] A2M/RLV2N/RED[4] A3P/RLV4P/RED[1] V24 W24 Y26 AF2 AE15 AD2 FRC_DDR3_A6/DDR2_A0 FRC_DDR3_A7/DDR2_A5 FRC_DDR3_A8/DDR2_A2 A2P/RLV2P/RED[5] A2M/RLV2N/RED[4] A3P/RLV4P/RED[1] V24 W24 Y26 AF2 AE15 AD2 NC_72 NC_60 NC_57 RLV2P RLV2N RLVCKP V24 W24 Y26 AF2 AE15 AD2 NC_72 NC_60 NC_57 RLV2P RLV2N RLVCKP V24 W24 Y26 AD2 AD16 NC_57 NC_28 RLVCKP RLVCKN Y26 Y25 AE15 AD2 NC_60 NC_57 RLV2N RLVCKP W24 Y26 MPIF_D0 AD16 FRC_DDR3_A9/DDR2_A9 A3M/RLV4N/RED[0] Y25 AD16 FRC_DDR3_A9/DDR2_A9 A3M/RLV4N/RED[0] Y25 AD16 NC_28 RLVCKN Y25 AD16 NC_28 RLVCKN Y25 AD15 AE16 NC_42 NC_41 RLV4P RLV4N Y24 AD16 AD15 NC_28 NC_42 RLVCKN RLV4P Y25 Y24 F12 NC_12 NC_19 NC_12 NC_19 AD15 AE16 FRC_DDR3_A10/DDR2_A11 FRC_DDR3_A11/DDR2_A4 A4P/RLV5P/GREEN[9] A4M/RLV5N/GREEN[8] Y24 AD15 AE16 FRC_DDR3_A10/DDR2_A11 FRC_DDR3_A11/DDR2_A4 A4P/RLV5P/GREEN[9] A4M/RLV5N/GREEN[8] Y24 AD15 AE16 NC_42 NC_41 RLV4P RLV4N Y24 AD15 AE16 NC_42 NC_41 RLV4P RLV4N Y24 NC_58 AC26 AE16 NC_41 NC_58 RLV4N MPIF_D1 21 28 21 28 FRC_DDR3_A12/DDR2_A8 BCKP/TCON13/GREEN[1] AC26 AC25 FRC_DDR3_A12/DDR2_A8 BCKP/TCON13/GREEN[1] AC26 AC25 NC_58 WPWM AC26 AC25 NC_58 WPWM AC26 AC25 WPWM OPTP/FLK2 AC25 AA26 WPWM AC26 AC25 D13 RLV5P OPTP/FLK2 NC_13 NC_18 NC_13 NC_18 AF3 BCKM/TCON12/GREEN[0] B0P/RLV6P/GREEN[7] AA26 AA25 AF3 BCKM/TCON12/GREEN[0] B0P/RLV6P/GREEN[7] AA26 AA25 AF3 OPTP/FLK2 RLV5P AA26 AA25 AF3 OPTP/FLK2 RLV5P AA26 AA25 AF3 AF14 NC_61 RLV5N AA25 AA24 AF3 RLV5P AA26 AA25 MPIF_D2 AF14 FRC_DDR3_BA0/DDR2_BA2 B0M/RLV6N/GREEN[6] AA24 AF14 FRC_DDR3_BA0/DDR2_BA2 B0M/RLV6N/GREEN[6] AA24 AF14 NC_61 RLV5N AA24 AF14 NC_61 RLV5N AA24 AD1 NC_71 NC_27 RLV6P RLV6N AB26 AB25 AF14 AD1 NC_61 NC_71 RLV5N RLV6P AA24 AB26 E13 22 27 22 27 AD1 AD13 FRC_DDR3_BA1/DDR2_ODT FRC_DDR3_BA2/DDR2_A12 B1P/RLV7P/GREEN[5] B1M/RLV7N/GREEN[4] B2P/RLV8P/GREEN[3] AB26 AB25 AB24 AD1 AD13 FRC_DDR3_BA1/DDR2_ODT FRC_DDR3_BA2/DDR2_A12 B1P/RLV7P/GREEN[5] B1M/RLV7N/GREEN[4] B2P/RLV8P/GREEN[3] AB26 AB25 AB24 AD1 AD13 NC_71 NC_27 RLV6P RLV6N RLV7P AB26 AB25 AB24 AD1 AD13 NC_71 NC_27 RLV6P RLV6N RLV7P AB26 AB25 AB24 AD13 AE14 NC_39 RLV7P RLV7N AB24 AC24 AD13 NC_27 RLV6N RLV7P AB25 AB24 MPIF_D3 NC_56 OPTN/FLK3 NC_39 RLV7N FRC_DDR3_MCLK/DDR2_MCLK B2M/RLV8N/GREEN[2] FRC_DDR3_MCLK/DDR2_MCLK B2M/RLV8N/GREEN[2] NC_39 RLV7N NC_39 RLV7N AE13 AD26 AE14 AC24 AE14 AC24 AE14 AC24 AE14 AC24 AE14 AC24 NC_55 FLK NC_56 OPTN/FLK3 AD25 AE13 AD26 NC_14 NC_17 NC_14 NC_17 AE13 FRC_DDR3_CKE/DDR2_RASZ FRC_DDR3_MCLKZ/DDR2_MCLKZ B3P/TCON11/BLUE[9] B3M/TCON10/BLUE[8] AD26 AD25 AE13 FRC_DDR3_CKE/DDR2_RASZ FRC_DDR3_MCLKZ/DDR2_MCLKZ B3P/TCON11/BLUE[9] B3M/TCON10/BLUE[8] AD26 AD25 AE13 NC_56 NC_55 OPTN/FLK3 FLK AD26 AD25 AE13 NC_56 NC_55 OPTN/FLK3 FLK AD26 AD25 AE4 GCLK6 GCLK5 AD24 NC_55 FLK GCLK6 AD25 AD24 23 26 23 26 AE4 AD5 FRC_DDR3_ODT/DDR2_BA1 B4P/TCON9/BLUE[7] B4M/TCON8/BLUE[6] AD24 AE4 AD5 FRC_DDR3_ODT/DDR2_BA1 B4P/TCON9/BLUE[7] B4M/TCON8/BLUE[6] AD24 AE4 AD5 NC_46 GCLK6 GCLK5 AD24 AE4 AD5 NC_46 GCLK6 GCLK5 AD24 AD5 AF4 NC_46 NC_31 AD23 AE4 AD5