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Silicon Controlled Rectifiers (SCR) Speci…
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Home > Semiconductors > Discrete > Thyristors > Silicon Controlled Rectifiers (SCR) > Specifications

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Silicon Controlled Rectifiers (SCR) Specifications
What do you want to do? Show All Silicon Controlled Rectifiers (SCR) Companies Learn more about Silicon Controlled Rectifiers (SCR) Search By Specification

Performance

V RRM Search Logic: I T(RMS)

Peak repetitive reverse voltage (VRRM) is the maximum peak reverse voltage that can be applied continuously to the main terminals (anode, cathode) of the thyristor. User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. IT(RMS) is the maximum root mean square (RMS) current for a specified case temperature. It is the RMS value of the principal current when the device is in the on state. User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. Peak I cycle surge on-current (ITSM) is the non-repetitive peak on-state current. It is the maximum on-state current of short duration that can be applied to the thyristor for one full-cycle of conduction without performance degradation. User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. Gate trigger current (IGT) is the minimum current required to switch the thyristor from the off state to the on state at the specified off-state voltage and temperature. This is the minimum gate current required to maintain the thyristor in the on state. User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. Gate trigger voltage (VGT) is the gate voltage that is required to produce the gate trigger current. User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. IH is the holding current required to maintain a steady state condition in the device. It is the minimum principal current that is required to maintain the device in the on state. User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. Repetitive peak controllable on-state voltage (VTM). User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. Rising ratio of off-voltage (dv/dt) is the rate-of-rise of off-state voltage. This is the minimum value of the rate-of-rise of the principal voltage that will cause switching from the off state to the on state. User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. Temperature junction (TJ) is the full-required range of ambient operating temperatures. User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

Search Logic: I TSM

Search Logic: I GT

Search Logic: V GT Search Logic: IH

Search Logic: V TM Search Logic: dv/dt

Search Logic: TJ Search Logic:

Standards and Certifications
RoHS Compliant Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. End of Life Vehicles (ELV) is an EU directive that required certain automotive products to be free (except for trace

Search Logic: ELV Directive

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impurities) of mercury, cadmium and lead by July 1, 2003. Lead can still be used as an alloying additive in copper, steel and aluminum, and in solderable applications.

Search Logic:

"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

Packaging Specifications
IC Package Type Your choices are... DIP / CDIP / PDIP Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. DPAK D2PAK IPAK I2PAK MELF Discrete package or deca-watt (DPAK). D2PAK is large surface mounted package that include a heat sink. Integrated package (IPAK). I2PAK is a plastic package with three leads. Metal electrode leadless face (MELF) component diodes have metallized terminals at each end of a cylindrical body. MELF components are designed to fit the same footprints as flat components. MELF packages are available on plastic tape and reel. Power packaging (PPAK). DO-15 is a diode outline (DO) package. DO-35 is a diode outline (DO) package. Small outline diode (SOD) package. TO-3 is a transistor outline (TO) package with three leads. TO-3P is a transistor outline (TO) package with three leads. TO-39 is a transistor outline (TO) package. SOT3 is a small outline transistor (SOT) package. SOT223 is a plastic, surface mounted, small outline transistor (SOT) package with four leads and a heat sink. Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is onethird the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. Thin shrink small outline L-leaded package (TSSOP). Thin small outline J-leaded package (TSOJ). TO-92 is a transistor outline (TO) package. TO-202 is a transistor outline (TO) package. TO-220 is a transistor outline (TO) package. Other unlisted, specialized or proprietary packages. All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. The number of physical connection points (e.g., pins, pads, balls) on the package. User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. The number of diodes embedded in the chip (package). User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

PPAK DO-15 DO-35 SOD TO-3 TO-3P TO-39 SOT3 SOT223 TSOP

TSSOP TSOJ TO-92 TO-202 TO-220 Other Search Logic: Pin Count Search Logic: Number of Thyristors in Package Search Logic:

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