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® TN12, TS12 and TYNx12 Series

SENSITIVE & STANDARD 12A SCRS

Table 1: Main Features A

Symbol Value Unit
IT(RMS) 12 A G

VDRM/VRRM 600 to 1000 V K

IGT 0.2 to 15 mA A
A

K A
DESCRIPTION G
K A
Available either in sensitive (TS12) or standard G

(TN12 / TYN) gate triggering levels, the 12A SCR DPAK D2PAK
series is suitable to fit all modes of control, found (TN12-B / TS12-B) (TN12-G)
in applications such as overvoltage crowbar A
A
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits...
K K
A A
G G
Available in through-hole or surface-mount
IPAK TO-220AB
packages, they provide an optimized performance
(TN12-H / TS12-H) (TYNx12RG)
in a limited space area.

Table 2: Order Codes
Part Numbers Marking
TN1215-x00B TN1215x00
TN1215-x00B-TR TN1215x00
TN1215-x00G TN1215x00G
TN1215-x00G-TR TN1215x00G
TN1215-x00H TN1215x00
TS1220-x00B TS1220x00
TS1220-x00B-TR TS1220x00
TS1220-x00H TS1220x00
TYNx12RG TYNx12
TYNx12TRG TYNx12T

October 2005 REV. 5 1/11

3 ms 145 115 ITSM Non repetitive surge peak on. 6 mA dV/dt VD = 65 % VDRM RGK = 220 Ω Tj = 125°C MIN.40 to + 150 °C Tj Operating junction temperature range . tr ≤ 100 ns F = 60 Hz 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125°C 4 A PG(AV) Average gate power dissipation Tj = 125°C 1 W Tstg Storage junction temperature range . IRRM Tj = 125°C 2 mA 2/11 .8 V VGD VD = VDRM RL = 3. 0. 1.85 V Rd Dynamic resistance Tj = 125°C MAX. 200 µA VD = 12 V RL = 140 Ω VGT MAX. unless otherwise specified) ■ SENSITIVE Symbol Test Conditions TS1220 Unit IGT MAX. 0. Tj = 25°C state current tp = 10 ms 140 110 A I ²t I²t Value for fusing tp = 10 ms Tj = 25°C 98 60 A2S Critical rate of rise of on-state dI/dt Tj = 125°C current IG = 2 x IGT . 5 mA IL IG = 1 mA RGK = 1 kΩ MAX. 30 mΩ IDRM Tj = 25°C 5 µA VDRM = VRRM RGK = 220 Ω MAX.TN12.40 to + 125 VRGM Maximum peak reverse gate voltage (for TN12 & TYN12 only) 5 V Tables 4: Electrical Characteristics (Tj = 25°C. 0. 8 V IH IT = 50 mA RGK = 1 kΩ MAX. TS12 and TYNx12 Series Table 3: Absolute Ratings (limiting values) Value Symbol Parameter TN12-G TN12-B/H Unit TYN12 TS12-B/H IT(RMS) RMS on-state current (180° conduction angle) Tc = 105°C 12 A IT(AV) Average on-state current (180° conduction Tc = 105°C 8 angle) A tp = 8.6 V Vt0 Threshold voltage Tj = 125°C MAX. 5 V/µs VTM ITM = 24 A tp = 380 µs Tj = 25°C MAX.1 V VRG IRG = 10 µA MIN.3 kΩ RGK = 1 kΩ Tj = 125°C MIN.

11 α = 180° 10 12 9 10 8 α = 180° 7 8 6 5 6 4 4 3 360° 2 2 1 IT(AV)(A) Tcase(°C) α 0 0 0 1 2 3 4 5 6 7 8 9 0 25 50 75 100 125 3/11 .5 2 IGT mA VD = 12 V RL = 33 Ω MAX.C.3 V VGD VD = VDRM RL = 3. on-state current versus average on-state current versus case temperature P(W) IT(AV)(A) 12 14 D.2 IGT MAX. IRRM Tj = 125°C 2 mA Table 6: Thermal resistance Symbol Parameter Value Unit Rth(j-c) Junction to case (DC) 1. 30 mΩ IDRM Tj = 25°C 5 µA VDRM = VRRM MAX.6 V Vt0 Threshold voltage Tj = 125°C MAX. 1. 15 5 15 VGT MAX.2 V IH IT = 500 mA Gate open MAX. 200 40 200 V/µs VTM ITM = 24 A tp = 380 µs Tj = 25°C MAX. 0. 80 60 30 60 mA dV/dt VD = 67 % VDRM Gate open Tj =125°C MIN.3 °C/W S = 0. 2 0. Figure 1: Maximum average power dissipation Figure 2: Average and D. 0. TS12 and TYNx12 Series ■ STANDARD TN1215 TYN Symbol Test Conditions Unit B/H G x12T x12 MIN. 40 30 15 30 mA IL IG = 1.5 cm² DPAK 70 S = 1 cm² D2PAK 45 Rth(j-a) Junction to ambient (DC) °C/W IPAK 100 TO-220AB 60 S = Copper surface under tab. 1. TN12.85 V Rd Dynamic resistance Tj = 125°C MAX.C.3 kΩ Tj = 125°C MIN.

2 Tj(°C) 0.0 2.0 2.0 0.5 α = 180° DPAK 1. 2.0 1.0 2. TS12 and TYNx12 Series Figure 3: Average and D.4 0.IL[Tj] / IGT.0 0.IH.0 1.IL[Tj] / IGT.0 1.8 IH & IL 0.00 2.C.8 IGT 3.5 1.1 0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 Figure 5: Relative variation of thermal Figure 6: Relative variation of gate trigger impedance junction to ambient versus pulse current and holding current versus junction duration (recommended pad layout.8 1.4 1.IH.2 0.2 2.6 1.5 1. on-state current Figure 4: Relative variation of thermal versus ambient temperature (device mounted impedance junction to case versus pulse on FR4 with recommended pad layout) (DPAK) duration IT(AV)(A) K=[Zth(j-c)/Rth(j-c)] 3.6 1.5 0.2 4.4 Tj = 25°C 2.2 0.0 4.2 tp(s) Tj(°C) 0.5 D.IL[Tj=25°C] 1.01 0.10 TO-220AB / IPAK 1.IH.5 1.0 IH & IL 0.IH. FR4 PC temperature for TS8 series board for DPAK) K=[Zth(j-a)/Rth(j-a)] IGT.0 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 -40 -20 0 20 40 60 80 100 120 140 Figure 7: Relative variation of gate trigger Figure 8: Relative variation of holding current current and holding current versus junction versus gate-cathode resistance (typical temperature for TN8 & TYN08 series values) for TS8 series IH[RGK] / IH[RGK=1kΩ] IGT.0 1E-2 1E-1 1E+0 1E+1 4/11 .6 0.0 D2PAK 0.4 3.5 2.0 RGK(kΩ) -40 -20 0 20 40 60 80 100 120 140 0.0 1.0 0.8 RGK = 1kΩ 0.5 0.6 DPAK IGT 1.5 Tamb(°C) tp(s) 0.4 D2PAK 1.IL[Tj=25°C] 5.0 0.C.TN12.

0 4. copper thickness: 35µm) (DPAK and D2PAK) ITM(A) Rth(j-a)(°C/W) 200 100 Tj max.0 2. TS12 and TYNx12 Series Figure 9: Relative variation of dV/dt immunity Figure 10: Relative variation of dV/dt immunity versus gate-cathode resistance (typical versus gate-cathode capacitance (typical values) for TS8 series values) for TS8 series dV/dt[RGK] / dV/dt[RGK=220Ω] dV/dt[CGK] / dV/dt[RGK=220Ω] 10.5 RGK = 220Ω 3.5 1.00 10.0 0 200 400 600 800 1000 1200 0 25 50 75 100 125 150 Figure 11: Surge peak on-state current versus Figure 12: Non-repetitive surge peak on-state number of cycles current for a sinusoidal pulse with width tp < 10 ms.: 100 Vt0=0.0 4.0 3.0 1.01 0.5 1. and corresponding values of I²t ITSM(A) ITSM(A).0 2.5 5.5 4.0 1.0 2.85V Rd=30mΩ 80 60 Tj=max DPAK 10 Tj=25°C 40 D2PAK 20 VTM(V) S(cm²) 1 0 0. TN12.00 Figure 13: On-state characteristics (maximum Figure 14: Thermal resistance junction to values) ambient versus copper surface under tab (epoxy printed circuit board FR4.0 0.0 0.1 0.67 x VDRM VD = 0. I2t (A2s) 150 2000 140 Tj initial = 25°C 130 1000 ITSM 120 tp=10ms TN12 / TYN12 110 TN12 / TYN12 One cycle 100 Non repetitive 90 Tj initial=25°C dI/dt limitation TS12 80 TS12 70 TN12 / TYN12 60 100 I2t 50 40 TS12 30 Repetitive 20 TC=105°C 10 Number of cycles tp(ms) 0 10 1 10 100 1000 0.5 3.0 Tj = 125°C VD = 0.5 2.5 1.67 x VDRM Tj = 125°C 3.0 0 2 4 6 8 10 12 14 16 18 20 5/11 .10 1.5 RGK(kΩ) CGK(nF) 0.

TS12 and TYNx12 Series Figure 15: Ordering Information Scheme (TN8 series) TN 12 15 .600 B (-TR) Standard SCR series Current 12 = 12A Sensitivity 15 = 15mA Voltage 600 = 600V 800 = 800V 1000 = 1000V Package B = DPAK G = D2PAK H = IPAK Packing mode Blanck = Tube -TR = Tape & Reel (DPAK and D2PAK) Figure 16: Ordering Information Scheme (TS8 series) TS 12 20 .TN12.600 B (-TR) Sensitive SCR series Current 12 = 12A Sensitivity 20 = 200µA Voltage 600 = 600V 700 = 700V Package B = DPAK H = IPAK Packing mode Blanck = Tube -TR = Tape & Reel Figure 17: Ordering Information Scheme (TYN08 series) TYN 6 12 T RG Standard SCR series Voltage 6 = 600V 8 = 800V 10 = 100V Current 12 = 12A Sensitivity Blanck = 30mA T = 15mA Packing mode RG = Tube 6/11 .

039 V2 V2 0° 8° 0° 8° Figure 19: DPAK Foot Print Dimensions (in millimeters) 6.204 0.043 L2 A2 0.2 mA DPAK TS1220-xxxH X X 0. Max.10 0.20 0.017 0.018 0.001 0.80 typ.023 0.3 1.90 0.23 0.6 7/11 .3 6.45 0.20 5.023 L4 C2 0.086 0.40 6. L4 0. TN12.397 0.20 2.259 G 4.35 10. Max Min.244 G C E 6.031 typ. 0. Millimeters Inches Min.009 B 0.7 3 3 1.2 mA IPAK TYNx12 X X X 15 mA TO-220AB TYNx12T X X X 5 mA TO-220AB Figure 18: DPAK Package Mechanical Data DIMENSIONS REF.60 MIN. E A A 2.48 0.251 0.6 2.40 0.60 0.03 0.60 0.7 2.035 0.00 6.368 0.212 H R C 0.023 B A1 R D 6.035 D B2 5.60 1. TS12 and TYNx12 Series Table 7: Product Selector Voltage (xxx) Part Numbers Sensitivity Package 600 V 700 V 800 V 1000 V TN1215-xxxB X X 15 mA DPAK TN1215-xxxG X X X 15 mA D2PAK TN1215-xxxH X X 15 mA IPAK TS1220-xxxB X X 0.40 4.60 0.236 0.40 0.64 0.181 A2 H 9.00 0.094 B2 C2 A1 0. L2 0.90 1.10 0.025 0.60 0.173 0.

192 0.27 1.106 A2 0.21 1.23 0. Min.28 0.00 10.050 0.098 0.055 FLAT ZONE L3 1.45 0.30 3.169 0. Max.40 0.055 L3 C 0.03 0.35 0.047 0.60 0.70 8.90 8/11 .027 0.30 5.93 0.624 A2 2mm min.054 B2 C R D 8.95 9.393 0. Typ. L2 1. TS12 and TYNx12 Series Figure 20: D2PAK Package Mechanical Data DIMENSIONS REF.017 0.037 L B2 1.009 D B 0.069 R 0.28 0.88 5.016 V2 V2 0° 8° 0° 8° Figure 21: D2PAK Foot Print Dimensions (in millimeters) 16.85 0.024 A1 C2 1.40 0. E C2 A 4.40 1.048 0.36 0.405 G G 4. Typ.055 0.70 0.90 10.590 0.TN12. Millimeters Inches A Min.001 0.368 B E 10.40 0.00 15. Max.25 1.60 0.69 0.181 L2 A1 2.30 4.08 1.49 2.208 L 15.352 0.75 0.

106 F 6.20 0.511 0.40 6.85 0.90 1.173 0.035 B2 L2 B2 5.48 0.10 0.20 5.95 0.00 0.90 0.019 0.181 a1 c2 c1 0.30 0.031 0.252 0.75 3.23 1.60 0.32 0.80 16. TS12 and TYNx12 Series Figure 22: IPAK Package Mechanical Data DIMENSIONS REF.40 2.10 0.60 0.598 0.034 I4 b2 1.30 0.72 0. Typ.64 0.116 l2 1. Typ.260 V1 e 2.244 L B A1 E 6.244 0.102 9/11 .40 0.60 0.14 1.393 0.409 A b1 0.035 D C 0. Typ.70 0.00 10.086 0.8 1.61 0.151 b1 c1 e I4 15.60 0. TN12.107 a2 e 2.212 B3 0. Typ.173 0. Millimeters Inches B C Min.80 0.70 0.70 1.634 e B5 C L 9 9.80 1 0.236 0. Max.625 a1 3.023 C2 0.044 0.40 0. Min. Max. ØI b2 A 15. A 2.40 2.051 l3 C 4.181 H 16.035 0.051 E C2 B 0.28 0. Millimeters Inches Min.40 16.40 4.20 0.043 A A3 0.40 0.027 0.95 0.044 0.025 0.60 0.40 0.60 0.019 0.370 G A3 L1 0.027 l2 c2 2.65 2.039 V1 10° 10° Figure 23: TO-220AB Package Mechanical Data DIMENSIONS REF. Max.90 0.024 0.090 G 4.031 0. Min.14 1.037 B5 0.622 0.094 0.023 H L1 B3 D 6 6.066 M 2.104 0.20 15.20 6.094 0.00 14.147 0.88 0.094 A1 0.40 4.551 B 10.147 L F a2 13.354 0.70 0.60 0.661 L 2. Max.047 L2 0.20 2.259 M ØI 3.45 0.646 0.066 l3 1.70 0.49 0.75 0.017 0.204 0.048 0.

in compliance with JEDEC Standard JESD97. The category of second level interconnect is marked on the package and on the inner box label.3 g 2500 Tape & reel TN1215-x00G TN1215x00G D2PAK 1. Table 8: Ordering Information Ordering type Marking Package Weight Base qty Delivery mode TN1215-x00B TN1215x00 DPAK 0.com. Changed sensitivity values in Table 7 for TYNx12 (30 to 14-Oct-2005 5 15 mA) and TYNx12T ( 15 to 5 mA). The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. These packages have a Lead-free second level interconnect . Added ECOPACK statement 10/11 .TN12.3 g 75 Tube TN1215-x00B-TR TN1215x00 DPAK 0.st.3 g 75 Tube TS1220-x00B-TR TS1220x00 DPAK 0.3 g 2500 Tape & reel TS1220-x00H TS1220x00 IPAK 0.3 g 50 Tube Note: x = voltage Table 9: Revision History Date Revision Description of Changes Sep-2000 3 Last update. ECOPACK specifications are available at: www. 25-Mar-2005 4 TO-220AB delivery mode changed from bulk to tube.5 g 50 Tube TN1215-x00G-TR TN1215x00G D2PAK 1. ST offers these devices in ECOPACK® packages.5 g 1000 Tape & reel TN1215-x00H TN1215x00 IPAK 0.3 g 50 Tube TYNx12TRG TYNx12T TO-220AB 2.3 g 75 Tube TS1220-x00B TS1220x00 DPAK 0. TS12 and TYNx12 Series In order to meet environmental requirements.3 g 75 Tube TYNx12RG TYNx12 TO-220AB 2.

No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. TN12.United Kingdom . This publication supersedes and replaces all information previously supplied.France .India .st.Finland .Japan - Malaysia .Belgium . The ST logo is a registered trademark of STMicroelectronics.Canada .All rights reserved STMicroelectronics group of companies Australia . All other names are the property of their respective owners © 2005 STMicroelectronics .Brazil . However.China . Specifications mentioned in this publication are subject to change without notice.United States of America www.com 11/11 .Germany .Israel .Sweden . STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.Italy .Hong Kong .Switzerland . TS12 and TYNx12 Series Information furnished is believed to be accurate and reliable.Morocco .Spain .Malta .Singapore .Czech Republic . STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.