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Module Secondary SMT

User Guide

LCC Module Series

Rev. Module_Secondary_SMT_User_Guide_V2.1

Date: 2013-12-19

www.quectel.com
LCC Module Series
Module Secondary SMT User Guide

Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.


Room 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233
Tel: +86 21 5108 6236
Mail: info@quectel.com

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Or our local office, for more information, please visit:
http://www.quectel.com/support/salesupport.aspx

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For technical support, to report documentation errors, please visit:

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http://www.quectel.com/support/techsupport.aspx

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GENERAL NOTES
QUECTEL OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

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PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN ARE SUBJECT TO

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CHANGE WITHOUT PRIOR NOTICE.

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COPYRIGHT

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THIS INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL CO., LTD. TRANSMITTABLE, REPRODUCTION, DISSEMINATION AND EDITING OF THIS
DOCUMENT AS WELL AS UTILIZATION OF THIS CONTENTS ARE FORBIDDEN WITHOUT
PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS
ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL
OR DESIGN.

Copyright Quectel Wireless Solutions Co., Ltd. 2013. All rights reserved

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About the Document

History
Revision Date

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Description

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1.0 2012-08-28 Gavin HOU Initial

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Added the description of stencil-making in

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2.0 2013-08-26 Gavin HOU

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Chapter 4.2.
Modified Figure 3: Inward Shrinking and

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2.1 2013-12-19 Gavin HOU
Outward Moving.

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Content

About the Document ................................................................................................................................... 2


Content ......................................................................................................................................................... 3
Figure Index ................................................................................................................................................. 4

1 Introduction .......................................................................................................................................... 5

2 Information about Modules ................................................................................................................. 6


2.1. Package Type .............................................................................................................................. 6
2.2. Packing Methods.......................................................................................................................... 6

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3 Requirements on Chip Mounter ......................................................................................................... 7

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3.1. Mounter ........................................................................................................................................ 7

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3.2. Soldering Equipment .................................................................................................................... 7

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4 Attentions for Manufacturing ............................................................................................................. 8

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4.1. MSL and Moisture-proof Requirement ......................................................................................... 8

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4.2. Stencil Design Requirement......................................................................................................... 9

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4.3. Mounting Process ...................................................................................................................... 10
4.3.1. Load Materials .................................................................................................................. 10

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4.3.2. Automatic Placement ....................................................................................................... 10
4.4. Reflow ........................................................................................................................................ 12

5 Disassembly ....................................................................................................................................... 13

6 Appendix Reference .......................................................................................................................... 15

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Figure Index

FIGURE 1: TRAY PACKING AND REEL PACKING ............................................................................................ 6


FIGURE 2: HUMIDITY INDICATOR .................................................................................................................... 8
FIGURE 3: INWARD SHRINKING AND OUTWARD MOVING ........................................................................... 9
FIGURE 4: STEP-UP STENCIL AREA .............................................................................................................. 10
FIGURE 5: AUTOMATIC PLACEMENT ............................................................................................................. 11
FIGURE 6: MOUNTED PICTURE ...................................................................................................................... 11
FIGURE 7: RAMP-SOAK-SPIKE REFLOW PROFILE...................................................................................... 12
FIGURE 8: REMOVE MODULE ........................................................................................................................ 13

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FIGURE 9: MODULE SOLDERING .................................................................................................................. 14

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1 Introduction
This document describes the process of Quectel modules secondary SMT and disassembly. It is
applied for all Quectel modules in LCC package.

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2 Information about Modules

2.1. Package Type

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LCC type.

2.2. Packing Methods

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Quectel provides the following packing types:

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Tray Packing

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Reel Packing

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Figure 1: Tray Packing and Reel Packing

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3 Requirements on Chip Mounter

3.1. Mounter

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Component feeder: Support auto-tray feeder and auto-reel feeder

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Image processing: Optical plummet centering

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Diameter of nozzle: Select the suitable nozzle according to the module size

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NOTE

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The recommended diameter of nozzle should be not less than 40% of the modules shorter side. Such as

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module size: 25mm 20mm. Nozzle diameter should be more than 8mm.

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3.2. Soldering Equipment

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Support Hot-air soldering.

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4 Attentions for Manufacturing

4.1. MSL and Moisture-proof Requirement

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Quectel SMD module is sensitive to moisture absorption. According to IPC-JEDEC standard, the MSL of

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Quectel SMD modules are defined as 4.

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To prevent SMD module from permanent damage, baking before reflow is required in following cases:

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Humidity indicator card: At least one circular indicator is no longer blue.
The seal is opened and the module is exposed to air for more than 72 hours.

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Figure 2: Humidity Indicator

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NOTES

1. If the color of the indication card is turned to pink, bake the module for 48 hours under 125.
2. Take out the module from the package and put it on the high temperature fixture. All modules must be
mounted within 24 hours after finishing baking, otherwise put them in the dry box.

4.2. Stencil Design Requirement

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To ensure the solder paste is enough and soldering reliability, the stencil should be partly stepped-up on
the top surface. The differences are shown in the table below.

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Module Stencil-making Requirements

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The stencil, where module is placed, should be

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stepped-up to 0.2mm.

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M10/M12/M72/M80/M85/M95
The hole of the stencil, relative to the host PCB
UC20/UC15

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footprint of the module, is shrunken inward by
0.1mm and moved outward by 0.2-0.3mm.

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The stencil, where module is placed, should be
stepped-up to 0.13mm.
L10/L16/L20/L26/L30/L50/L70/L76/L80 The hole of the stencil, relative to the host PCB
footprint of the module, is shrunken inward by
0.1mm and moved outward by 0.3-0.5mm.

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h1: The hole of the stencil is shrunken inward by 0.1mm.
h2: The hole of the stencil is moved outward by 0.2-0.3mm or 0.3-0.5mm according to different module

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type.

Figure 3: Inward Shrinking and Outward Moving

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Step-up Stencil Area

Figure 4: Step-up Stencil Area

NOTES

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1. The hole of stencils components, which has a distance about 5mm away from the edge of the

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module, should be shrunken by 10%~30% of the actual hole size.

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2. You can optimize stencil-making depending on the actual situation.

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3. Inward shrinking and outward moving are relative to the host PCB footprint of the module. For

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details on the recommended footprint, please refer to the Hardware Design of the

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corresponding modules.

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4.3. Mounting Process

4.3.1. Load Materials n


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For tray packing, to ensue mounting accuracy, dedicated tray fixture is recommended when placing the
module.

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4.3.2. Automatic Placement

Select the suitable nozzle according to the module size. To keep modules stability, please ensure that the
nozzle is placed in the center of gravity center when mounting the module. Modules pad should be put on
the solder paste of motherboard PCBs pad after module is mounted.

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Figure 5: Automatic Placement

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Figure 6: Mounted Picture

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4.4. Reflow

Refer to the recommended ramp-soak-spike reflow profile in the Figure 7.


Preheat Heating Cooling
250

Liquids Temperature
217

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200 200
40s~60s

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160
150

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70s~120s

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100

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Between 1~3/S

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50

0 50 100 150 200 250 300 s

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Time(s)

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Figure 7: Ramp-soak-spike Reflow Profile

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NOTE

You can optimize ramp-soak-spike reflow profile based on the actual situation.

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5 Disassembly
Please use the SMD Rework Station to heat the pads of the module in the host board. The temperature of
the SMD Rework Station should be about 350 in order to release enough heat. The wind speed should
be adjusted according to actual situation.

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When the host board is heated, the distance between the host board and the wind outlet should be from

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1cm to 3.5cm. Move the wind outlet along the edge of the module in uniform rotation. When all of the

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solder are melted, take off the module along the diagonal direction with tweezers. The time of the whole
process should be no more than 250 seconds.

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After disassembly, wait a moment until the module and the host board cool down. When the module has
been removed, please guarantee that the solder paste on the host board must be smooth and there is no
short circuit between two pins.

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Figure 9: Module Soldering

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6 Appendix Reference

Table 1: Terms and Abbreviations

Abbreviation Description

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LCC Leadless Chip Carriers

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SMT Surface Mount Technology

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