1 PRINTED CIRCUIT BOARDS

Aircraft electronic systems necessitate the interconnection of many components;
in the past this was done by soldered or crimped terminations. With the
development of circuit technology and micro miniaturisation, weight saving and
simplification of installation and maintenance became needful and these needs
were met by the development of the printed circuit board.

1.1 CONSTRUCTION

Printed circuit board is a laminated paper or fibreglass board coated on one side
with a thin layer of copper. The areas of copper, called 'lands', required to
connect the components are marked out by painting over the copper, and the
remaining copper is etched away by a solution of ferric chloride. Holes are then
drilled in the board for the component leads. The advantage is that the copper
strips can be any shape and few additional wires are required. Industry can
produce printed circuit boards in large numbers very cheaply so they have
become the standard circuit construction method. Figure 1 shows the front face
of a PCB, with Figure 2 showing the rear face.

BASE
BOARD
FRONT

Printed Circuit Board
Figure 1

G. SIGNAL IC1 IC2 IC5 SELECTOR) CIRCUIT REFERENCE C2 IC3 IC4 INTEGRATED CIRCUIT CHIPS IC6 FINGER OR REAR EDGE CONNECTOR Printed Circuit Board Figure 2 .CIRCUIT MODULE DESIGNATION (E.

Module 5 details procedures for handling “Static Sensitive Devices”. and to provide for the interconnection of integrated circuits (which are a feature of a large majority of electronic equipment) the relevant circuits are assembled as a multi-layer moulded package. care must always be taken in handling techniques. leads or edge connectors of circuit boards unnecessarily.1. d) Pay strict attention to stores procedures to ensure that protective packaging is not removed during any goods-inwards inspection.3 HANDLING PRINTED CIRCUIT BOARDS Since various types of semi-conductor components are mounted on printed circuit boards. 1.2 MULTI-LAYER CIRCUITS In order to save weight and space. This consists of three or more single and/or double-sided printed boards and insulating layers of ‘impreg’ material. shorting plugs. bands or wire when provided or prescribed by the relevant aircraft Maintenance Manual. General techniques are as follows: - a) Do not remove or replace units with electrical power applied. b) Do not touch the connectors. c) Use conductive packaging. .

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JAR 66 CATEGORY B1 MODULE 4.2 MODULE 4 PRINTED CIRCUIT uk ELECTRONIC FUNDAMENTALS BOARDS engineering .