Professional Documents
Culture Documents
Advantages Disadvantages
Low temperature Poor thickness uniformity
treatment on complex components
High hardness Hydrogen embrittlement
Low friction Not applicable to
insulating substrates
Applicable to a wide
range of metal Possible environmental
concerns with plating
substrates
baths
Thick layers possible
Chemical Coatings
Advantages Disadvantages
Low temperature treatment
More corrosion resistant than More expensive than
electrodeposited chromium electroplated
Can coat complex shapes
uniformly chromium
Hard particles can be Heat treatment is
incorporated to increase
hardness needed to develop
PTFE can be incorporated to optimum properties
reduce friction
Can coat most metals and some
insulators
Conversion Coatings
Filaments Boats
Crucible
Heaters
Boa
ts
Filaments Boats
Introduction
Ref n
Method (-cm) (cm-3) (cm2/v.sec)
Spray
Pyrolysis 47 1.46x10-3 0.80x1021 10
CVD
48 1.42x10-3 6.00x1020 7.8
RF Sputtering
49 2 1.60x1018 1.1
Re active
evaporation 50 7.20x10-3 9.00x1019 9.6
Electron beam
evaporation 51 7.00x10-2 7.70x1019 11.6
Reactive electron
beam evaporation 52 7.50x10-4 3.20x1020 26
Merits and demerits of various thin films deposition method
Mostly used method at low deposition Difficult to accommodate multiple targets. In-
Sputtering temperatures. No post deposition heat treatment situ masking not possible. Complex operation.
required. Fine thickness control. Easy to dope
with noble metals.
Often used. Reasonable uniformity over large Post deposition heat treatment is necessary.
Electron beam evaporation areas. Reasonable thickness control. Easy to Few way to control the quality of the films.
accommodate multiple boats. In-situ masking is
possible, easy operation .excellent to dope with
noble metals.
Often used.reasonable uniformity.is possible. No thickness control. Difficult to dope with
Resistive evaporation noble metals.post deposition heat treatments is
necessary.
Scarcely used. Tachometric films at low Complex operations. Difficult to dope with
Activated reactive temperature.reasonable uniformity noble metals.in-situ masking difficult.no
evaporation thickness control.
Cheap and easy technique no post deposition No thickness control. Poor uniformity. Difficult
Spray pyrolysis / CVD heat treatment. to dope metals. No in-situ masking.
K-Cell
Back
Molecular Beam epitaxy
K-Cell
Schematic MBE
Annealing through UHV Condition
Annealing through UHV Condition
Back
Schematic Electron beam
Schematic Sputtering
Back
Thanks
Thin Film Characterization - Overview
What do we want to know ? How do we find this out ?
What does the sample look like ?
optical microscopy
on a macroscopic scale
scanning electron microscopy (SEM)
on a microscopic scale
transmission electron microscopy (TEM)
on an atomic scale
scanning probe microscopies (STM, AFM ...)
Sputtering process
Atoms into gas state
at target:
target atoms ejected
momentum transfer process
target ions ejected (1 - 2 %) involves top 10
electrons emitted model as hard sphere collisions
helps keep plasma going good for energies < 50 keV
Ar+ ions reflected as Ar neutrals 95 % of incident energy goes into target
=> COOL the target
Ar buried in target 5 % of incident energy is carried off by target atoms
photons emitted typical energies of 5-100 eV
We are most interested in the first of target atoms come off with a non-uniform distribution
these: target atoms going into the more atoms normal to the surface
gas phase cosine distribution (like surface source
Characterize process by sputter yield (S)
for normal incidence sputtering:
S = number ejected / number
incident
S depends on
target material
binding energy
mass of atoms
sputtering gas
mass of atoms (S increases for
heavier gasses)
incident energy (S increases for
higher energies)
geometry
most efficient 20-30 degrees
from glancing