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HDI Microvia Standard

Design Guide
HDI Microvia Standard Design Rules

microvia (for impedance stacked microvia standard microvia outer layer layout
controlled PCBs) pad 300 m
dielectric pad 550 m distance pad / track 100 m
pad 325 m
thickness track width 100 m
fin a l 100 m 58 70 m
final 100 m final 200 / 250 m
Cu filled distance track / track 100 m
up to max. 4 layers
dielectric
thickness dielectric thickness
85 110 m 58 70 m (layer 1-2)
dielectric thickness
55 68 m (layer 2-3)

microvia
aspect ratio = 1 : 0.8
(diameter / depth) core material core material 100 m

prepreg 100 m
prepreg buried pth
via

microvias layer 1 to 3
solder mask clearance 50 - 65 m track width 100 / 125 m

pitch 400 m
max. 55 m BGA pad 350 m
max. 18 m m
max. 50 m

0.75 mm pitch
distance track / track 100 m inner layer
final 125 m pitch 300 m final 200 / 250 m inner layer track width 100 m
pad 350 m pad 550 m pad 550 m distance pad / track 100 m inner layer
staggered microvias inner layer distance pad / pad 100 m inner layer
inner layer clearance 550 m
inner layer layout (up to 35 m Cu thickness)

BGA 0.80 mm pitch BGA 0.75 mm pitch BGA 0.65 mm pitch

0.65 mm pitch

solder mask
clearance 35 m
Var. 1: Dogbone with through- Var. 2: Dogbone with microvias Var. 3: Microvia in pad solder pad
hole vias 275 m
solder mask clearance 50 - 65 m track width 100 / 125 m

Var. 1 Var. 2 Var. 3


BGA solder pad max. 400 m - max. 500 m
BGA pad 350 m
Solder mask clearance 50 m 50 m 50 m m
Via pad size BGA area 500 m - -
Microvia pad outer layers - 300 / 350 m 300 / 350 m BGA pad 350 m
Microvia pad inner layers - 300 / 350 m 300 / 350 m
0.75 mm pitch track width 90 / 100 m
Track width/spacing outer layers 100 m 100 m 100 m
solder mask clearance 50 m
Track width/spacing inner layers 100 m 100 m 100 m

BGA 0.50 mm pitch QFP 0.40 mm pitch BGA 0.40 mm pitch

solder mask web 70 m

solder mask
clearance 35 m blue = outer layer
solder mask clearance 62 / 50 m green = solder mask
solder pad track width 100 m red = layer 2
275 m black = layer 3
violet = layer 4
pad 300 m

solder pad
microvia pad
Var.1: Via in pad Var. 2: Dogbone Var. 3: Via in pad on layer 1

0.65 mm pitch
microvia pad
Var. 1 Var. 2 Var. 3 300 m
BGA solder pad 300 - 330 m 240 m 275 m on layer 2

Solder mask clearance 50 m 40 m 35 m


Microvia pad outer layers 300 m 275 m 275 m microvia pad
300 m
Microvia pad inner layers 275 m 275 m 275 m on layer 3
Track width/spacing outer layers 100 m 80 / 90 m 75 m
Track width/spacing inner layers 75 m 75 m 75 m microvia pad
300 m
on layer 4
0.40 mm pitch
solder pad 200 m

BGA pad 350 m


blue = outer layer
track width 90 / 100 m green = solder mask
red = layer 2
solder mask clearance 50 m black = layer 3
violet = layer 4

www.we-online.com Version 1.2 / December 2016