BONDING TO TOOTH

STRUCTURE
 Bonding Approaches to Tooth Structure

Macro-mechanical attachment
Chemical bonding
Micro-mechanical attachment
Interpenetration (Hybrid layer)
ADHESIVE
BONDING
 Clinical Applications

Bonded resin composite restorations.

Bonded amalgam restoration.

Cementing indirect ceramic restorations.

Root canal posts and direct resin core build-ups.

Glass ionomer restoration and cementation.

Bonding of orthodontic brackets.

Application of pits and fissures sealant.

 Difficulties

Heterogeneous composition of tooth structure

Wet tissues
Presence of saliva
Tubular nature of the dentin
Irregularities of cut enamel and dentin surfaces
Presence of debris layer (smear layer)

1. Northwest Dentistry - Journal of the Minnesota Dental Association

2. www.answers.com/topic/smear-layer
3. www.forp.usp.br/bdj/bdj12(3)/trab13123/t13123.html
ADHESIVE BONDING
TO TOOTH ENAMEL
 Adhesive Bonding to Tooth Enamel
Chemical Bonding
Both PAA or phosphates-containing bonding agents can achieve
chemical bond to HA

Micro-mechanical retention (Acid etching)

Benefits of acid etching
1. Creating surface micro-irregularities
2. Increases the bonding surface area
3. Removes surface debris and stains
4. Increase the surface free energy

Types of acids to be used

30-50% phosphoric acid (liquid or gel)
10% Maleic acid
2.5% Nitric acid
18% Hydrochloric acid
www.nordiskadental.se/ana_etchi...composite
Steps of acid etching
Application of the nominated acid for 15-60s
Rinsing with water-air spray for 15s
Air Drying for 15s

Enamel surface should have a white frosted appearance

This procedure is then followed with application of liquid adhesive
The restorative material (composite) should only applied after hardening
(curing) of the adhesive takes place

priory.com/den/resin.htm
Enamel Bonding Agents
Diluted Bis-GMA or TEG-DMA resins.
Hydrophobic.. Bond only to dry enamel surfaces
New formulations have hydrophilic resins (HEMA) to be used for
both enamel and dentin bonding
 ADHESIVE BONDING
TO TOOTH DENTIN

Yoshiyama et al., J. Appl. Oral Sci. 2004

 Chemical Bonding

Bonding to the HA (Ca++)

o NPG-GMA (N-phenyl glycine glycidyl methacrylate)
o Polymerizing phosphates (glycerophosphoric acid dimethacrylate)
o Poly alkenoic acid (polycarboxylic acid)

Bonding to collagen
o Glutaraldehyde reacts with collagen forming a charged compounds that
reacts with HEMA molecule.
o 4-META (4- methyloxy ethyl trimellitic anhydride) can be used as a
potential coupling agent to collage

Micro-mechanical attachment
Retention of resin adhesive could be achieved to irregular dentin surfaces
(inter-tubular dentin) and to the walls of opened dentinal tubules (intra-
tubular dentin).
 Interpenetration attachment
Hydrophilic resin adhesive is required to penetrate the wet
collagen. e.g. HEMA , PAA and NPG-GMA (N-phenyl glycerol
glucidyl methacrylate)

Dentin Bonding Agents (DBA) should Have both hydrophilic and

hydrophobic resin components.
oThe hydrophilic part is to displace the dentinal fluids and wet the surface.
oThe hydrophobic part is responsible for bonding to composite filling materials.
 Development of Dentin Bonding Systems

G Characteristics Bond Commercial

strength examples
1st - 1 component 2 MPa - Cervident
- Very weak adhesion to dentin - Cosmic Bond
2nd - 2 components 2-8 MPa - Bond Lite
- Weak adhesion to dentin - Scotchbond
- Prone to water-degradation - Dentin Adhesit
3rd - 2 component (primer +adhesive) 8-15 - Prisma UB
- Bonding to metal MPa - Scotchbond II
- Reduced sensitivity - Tenure
- Gluma
- X-R Bond
4th Generation
(3 Steps)
1. Etchant
2. Primer (could be B&C)
3. Adhesive (could be B&C)
Total etch (E&D)
Formation of hybrid layer
Acceptable bond strength (17-25 MPa)

Compobond LCM
Scotchbond MP
Syntac

1. www.solutions.3m.com.
2. www.promedica.de/products/compblcm.htm
5th Generation
(2 Steps)
1. Etchant
2. single component
(Primer + Adhesive)

Total etch (E&D)

Wet bonding
Formation of hybrid layer
Acceptable bond strength (20-24 MPa)

Exite
Single-Bond
one-step
6th Generation
(2-3 steps)
1. Self-etch primer
(etchant + primer)
2. Adhesive

Total etch (E&D)

Formation of hybrid layer
Acceptable bond strength (18-23 MPa)

Prompt L-Pop
SE Bond
Liner bond
7th Generation
(1 step)
1. Self-etch Adhesive

Total etch (E&D)

Formation of Nano-hybrid layer
Acceptable bond strength (18-25 MPa)

I- Bond
G-Bond
VivaPen