Types of Materials

Metals:
Strong, ductile
high thermal & electrical conductivity
opaque

Polymers/plastics: Covalent bonding

sharing of es
Soft, ductile, low strength, low density
thermal & electrical insulators
Optically translucent or transparent.

Ceramics: ionic bonding (refractory)

compounds of metallic & non-metallic elements
(oxides, carbides, nitrides, sulfides)
Brittle, glassy, elastic
non-conducting (insulators)
 Metal Classification

Metal Alloy
Ferrous Nonferrous
Cast Iron Steel
Low Alloy
Low Carbon
Medium Carbon
High Carbon
High Alloy
 Ceramic Classification

Ceramics

Advanced
Glasses Clay Refractory Abrasives Cements
ceramics

Glasses Glass
ceramics
 Polymer Classification

Polymers

Coating,
Adhesive, Advanced
Plastics Elastomers Fibers
Foam, polymers
Film
 Composite classification

Composite

Particle- Fiber- Structural

reinforced reinforced

Large particle Dispersion Continuous Discontinuous Laminates Sandwich

strengthened panels

Aligned

Random
Material Density
Material Stiffness
Material Resistance to Fracture
Material Electrical Conductivity
 The Materials Selection Process
Composition Structure Processes
Mechanical Shape
Electrical
Thermal
Optical Materials
Etc.

Environment Properties
Load

Applications
Functions
 Structure, Processing, & Properties
Properties depend on structure
ex: hardness vs structure of steel

(d) Steel with 0.4 wt% C

6 00
d) Martensite
Hardness (BHN)

30 mm
5 00 (c)
4 00 (b) c) Martensite
(a)
4 mm (tempered at 371 C)
3 00
30 mm
2 00 30 mm b) Fine pearlite
100
0.01 0.1 1 10 100 1000 a) Spheroidite
Cooling Rate (C/s)
Processing can change structure
ex: structure vs cooling rate of steel
 ELECTRICAL
Electrical Resistivity of Copper:
6
5
Resistivity, r
(10-8 Ohm-m)

4
3
2
1
0
-200 -100 0 T (C)
Adding impurity atoms to Cu increases resistivity.
Deforming Cu increases resistivity.
 THERMAL
Space Shuttle Tiles:
--Silica fiber insulation
offers low heat conduction. Thermal Conductivity
of Copper:
--It decreases when
you add zinc!

400

Thermal Conductivity
300

(W/m-K)
200

100
0
0 10 20 30 40
Composition (wt% Zinc)

100 mm
 MAGNETIC
Magnetic Storage: Magnetic Permeability
--Recording medium vs. Composition:
is magnetized by --Adding 3 atomic % Si
recording head. makes Fe a better
recording medium!

Magnetization
Fe+3%Si

Fe

Magnetic Field
 OPTICAL
Transmittance:
--Aluminum oxide may be transparent, translucent, or
opaque depending on the material structure.

polycrystal: polycrystal:
single crystal low porosity high porosity
 DETERIORATIVE
Stress & Saltwater... Heat treatment: slows
--causes cracks! crack speed in salt water!

crack speed (m/s)

10-8 as-is
held at
160C for 1 hr
before testing
10-10 Alloy 7178 tested in
saturated aqueous NaCl
solution at 23C

increasing load

4 mm
--material:
7150-T651 Al "alloy"
(Zn,Cu,Mg,Zr)
 Properties From Bonding: Tm
Bond length, r Melting Temperature, Tm
Energy
r

Bond energy, Eo ro
r
Energy smaller Tm

unstretched length
ro larger Tm
r
Eo = Tm is larger if Eo is larger.
bond energy
 Properties From Bonding : a
Coefficient of thermal expansion, a
length, L o coeff. thermal expansion
unheated, T1
DL DL
= a (T2 -T1)
heated, T 2 Lo

a ~ symmetry at ro
Energy
unstretched length
ro
r a is larger if Eo is smaller.

E
Larger a
o
E Smaller a
o
 Summary: Primary Bonds
Ceramics Large bond energy
(Ionic & covalent bonding): large Tm
large E
small a

Metals Variable bond energy

(Metallic bonding): moderate Tm
moderate E
moderate a

Polymers Secondary bonding dominates

(Covalent & Secondary): small Tm
small E
large a
Brief of Metal
 The Periodic Table
Columns: Similar Valence Structure

H He
Li Be O F Ne
Na Mg S Cl Ar
K Ca Sc Se Kr
Rb Sr Y Te I Xe
Cs Ba Po At Rn
Fr Ra
 Energy and Packing
Non dense, random packing Energy

typical neighbor
bond length

typical neighbor r
bond energy

Dense, ordered packing Energy

typical neighbor
bond length

typical neighbor r
bond energy

Dense, ordered packed structures tend to have

lower energies.
 Materials and Packing
Crystalline materials...
atoms pack in periodic, 3D arrays
typical of: -metals
-many ceramics
-some polymers crystalline SiO2

Si Oxygen
Noncrystalline materials...
atoms have no periodic packing
occurs for: -complex structures
-rapid cooling
"Amorphous" = Noncrystalline noncrystalline SiO2
 Types of Imperfections

Vacancy atoms
Interstitial atoms Point defects
Substitutional atoms

Dislocations Line defects

Grain Boundaries Area defects

 Point Defects
Vacancies:
-vacant atomic sites in a structure.

Vacancy
distortion
of planes

Self-Interstitials:
-"extra" atoms positioned between atomic sites.

self-
interstitial
distortion
of planes
 Point Defects in Alloys
Two outcomes if impurity (B) added to host (A):
Solid solution of B in A (i.e., random dist. of point defects)

OR

Substitutional solid soln. Interstitial solid soln.

(e.g., Cu in Ni) (e.g., C in Fe)
Solid solution of B in A plus a new phase (usually for a larger
amount of B)
Second phase particle
--different composition
--often different structure.
 Line Defects
Dislocations:
are line defects,
slip between crystal planes result when dislocations move,
produce permanent (plastic) deformation.

Schematic of Zinc (HCP):

before deformation after tensile elongation

slip steps
 Imperfections in Solids
Edge Dislocation
 Imperfections in Solids
Screw Dislocation
Screw Dislocation

b
Dislocation
line
Burgers vector b (b)
(a)
Edge, Screw, and Mixed Dislocations
Mixed

Edge

Screw
 Dislocations & Crystal Structures
Structure: close-packed view onto two
planes & directions close-packed
planes.
are preferred.
close-packed directions
close-packed plane (bottom) close-packed plane (top)

Comparison among crystal structures:

HCP: few slip systems/directions;
FCC: many slip systems/directions;
BCC: the most slip systems/directions

Specimens that Mg (HCP)

were tensile
tested. tensile direction
Al (FCC)
 Planar Defects in Solids
External Surfaces
The most obvious
Grain Boundary
Different crystal twin boundary (plane)
orientation between Essentially a reflection of
grains atom positions across the
twin plane.
Stacking faults
For FCC metals an error in
ABCABC packing
sequence
Ex: ABCABABC
Phase boundary
In multiphase materials
 Polycrystalline Materials

Grain Boundaries
regions between crystals
transition from lattice of
one region to that of the
other
slightly disordered
low density in grain
boundaries
high mobility
high diffusivity
high chemical reactivity