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TAS5614A

www.ti.com SLAS712B JUNE 2010 REVISED MARCH 2011

150W STEREO / 300W MONO PurePath HD DIGITAL-INPUT POWER STAGE


Check for Samples: TAS5614A

1FEATURES APPLICATIONS
23 PurePath HD Enabled Integrated Feedback Home Theater Systems
Provides: AV Receivers
Signal Bandwidth up to 80kHz for High DVD/Blu-ray Receivers
Frequency Content From HD Sources Mini Combo Systems
Ultralow 0.03% THD at 1W into 4 Active Speakers and Subwoofers
Ultralow 0.01% THD at 1W into 8
Flat THD at all Frequencies for Natural DESCRIPTION
Sound The TAS5614A is a high performance digital input
80dB PSRR (BTL, No Input Signal) Class D amplifier with integrated closed loop
feedback technology (known as PurePath HD) with
>100dB (A weighted) SNR the ability to drive up to 150W (1) Stereo into 4 to 8
Click and Pop Free Startup Speakers from a single 36V supply.
Pin compatible with TAS5631, TAS5616 and PurePath HD technology enables traditional
TAS5612 AB-Amplifier performance (<0.03% THD) levels while
Multiple Configurations Possible on the Same providing the power efficiency of traditional class D
PCB With Stuffing Options: amplifiers.
Mono Parallel Bridge Tied Load (PBTL) Unlike traditional Class D amplifiers, the distortion
Stereo Bridge Tied Load (BTL) curve only increases once the output levels move into
clipping. PurePath HD Power PAD
2.1 Single Ended Stereo Pair and Bridge
Tied Load Subwoofer PurePath HD technology enables lower idle losses
making the device even more efficient.
Total Output Power at 10%THD+N
300W in Mono PBTL Configuration TOTAL HARMONIC DISTORTION+NOISE
VS

150W per Channel in Stereo BTL


OUTPUT POWER
10

Configuration 4Ohm (6kHz)

4Ohm (1kHz)

Total Output Power in BTL Configuration at


tal Harmonic Distortion - %

1%THD+N 1

160W Stereo into 3


125W Stereo into 4 0,1

85W Stereo into 6


THD+N - Total

65W Stereo into 8 0,01

>90% Efficient Power Stage With 60-m


Output MOSFETs TC = 75 C
CONFIG = BTL

Self-Protection Design (Including 0,001


0,01 1 100
Undervoltage, Overtemperature, Clipping, and PO - Output Power - W

Short-Circuit Protection) With Error Reporting


EMI Compliant When Used With
Recommended System Design
Two Thermally Enhanced Package Options: (1) Achievable output power levels are dependent on the thermal
configuration of the target application. A high performance
PHD (64-Pin QFP) thermal interface material between the package exposed
DKD (44-Pin PSOP3) heatslug and the heat sink should be used to achieve high
output power levels.
1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PurePath, Power PAD are trademarks of Texas Instruments.
3 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright 20102011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TAS5614A
SLAS712B JUNE 2010 REVISED MARCH 2011 www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

DEVICE INFORMATION

Terminal Assignment
Both package types contains a heat slug that is located on the top side of the device for convenient thermal
coupling to the heat sink.
PHD PACKAGE DKD PACKAGE
(TOP VIEW) (TOP VIEW)
PSU_REF

GVDD_B
GVDD_A

PVDD_A
PVDD_A
GND_A
OUT_A
OUT_A
BST_A
GND
GND
VDD

NC
NC
NC
NC

PSU_REF 1 44 GVDD_AB
VDD 2 43 BST_A
OC_ADJ 3 42 PVDD_A
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
RESET 4 41 PVDD_A
OC_ADJ 1 48 GND_A 44 pins PACKAGE
RESET C_STARTUP 5 40 OUT_A
2 47 GND_B (TOP VIEW)
C_STARTUP 3 46 GND_B INPUT_A 6 39 OUT_A
INPUT_A 4 45 OUT_B INPUT_B 7 38 GND_A
INPUT_B 5 44 OUT_B VI_CM 8 37 GND_B
VI_CM 6 43 PVDD_B
GND 7 42 PVDD_B GND 9 36 OUT_B
AGND 8 41 BST_B AGND 10 35 PVDD_B
VREG 9 40 BST_C VREG 11 34 BST_B
INPUT_C 10 39 PVDD_C
INPUT_D 11 38 PVDD_C INPUT_C 12 33 BST_C
TEST 12 37 OUT_C INPUT_D 13 32 PVDD_C
NC 13 36 OUT_C TEST 14 31 OUT_C
NC 14 35 GND_C
15 34 GND_C
_ NC 15 30 GND_C
SD 64-pins QFP package
OTW1 16 33 GND_D NC 16 29 GND_D
26
17
18
19
20
21
22
23
24
25

27
28
29
30
31
32

SD 17 28 OUT_D
OTW 18 27 OUT_D
READY 19 26 PVDD_D
OTW2

READY
M1
M2
M3
GND
GND
CLIP

GVDD_C
GVDD_D
BST_D
OUT_D
OUT_D
PVDD_D
PVDD_D
GND_D

M1 20 25 PVDD_D
M2 21 24 BST_D
M3 22 23 GVDD_CD

PIN ONE LOCATION PHD PACKAGE

Electrical Pin 1

Pin 1 Marker
White Dot

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MODE SELECTION PINS


MODE PINS OUTPUT
PWM INPUT (1) DESCRIPTION
M3 M2 M1 CONFIGURATION
0 0 0 2N 2 BTL AD mode
0 0 1 Reserved
0 1 0 2N 2 BTL BD mode
0 1 1 1N 1 BTL +2 SE AD mode
1 0 0 1N 4 SE AD mode
INPUT_C (2) INPUT_D (2)
2N
1 0 1 1 PBTL 0 0 AD mode
1N
1 0 BD mode
1 1 0
Reserved
1 1 1

(1) The 1N and 2N naming convention is used to indicate the number of PWM lines to the power stage per channel in a specific mode.
(2) INPUT_C and D are used to select between a subset of AD and BD mode operations in PBTL mode

PACKAGE HEAT DISSIPATION RATINGS (1)


PARAMETER TAS5614APHD TAS5614ADKD
RJC (C/W) 2 BTL or 4 SE channels 3.2 2.1
RJC (C/W) 1 BTL or 2 SE channel(s) 5.4 3.5
RJC (C/W) 1 SE channel 7.9 5.1
(2) 2
Pad Area 64mm 80mm2

(1) JC is junction-to-case, CH is case-to-heat sink


(2) RCH is an important consideration. Assume a 2-mil thickness of thermal grease with a thermal conductivity of 2.5 W/mK between the
pad area and the heat sink and both channels active. The RCH with this condition is 1.1C/W for the PHD package and 0.44C/W for
the DKD package.

Table 1. ORDERING INFORMATION (1)


TA PACKAGE DESCRIPTION
0C70C TAS5614APHD 64 pin HTQFP
0C70C TAS5614ADKD 44 pin PSOP3

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.

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ABSOLUTE MAXIMUM RATINGS


(1)
over operating free-air temperature range unless otherwise noted
TAS5614A UNIT
VDD to GND 0.3 to 13.2 V
GVDD to GND 0.3 to 13.2 V
PVDD_X to GND_X (2) 0.3 to 53 V
OUT_X to GND_X (2) 0.3 to 53 V
(2)
BST_X to GND_X 0.3 to 66.2 V
BST_X to GVDD_X (2) 0.3 to 53 V
VREG to GND 0.3 to 4.2 V
GND_X to GND 0.3 to 0.3 V
GND to AGND 0.3 to 0.3 V
OC_ADJ, M1, M2, M3, OSC_IO+, OSC_IO-, FREQ_ADJ, VI_CM, C_STARTUP, PSU_REF 0.3 to 4.2 V
to GND
INPUT_X 0.3 to 7 V
RESET, SD, OTW1, OTW2, CLIP, READY to GND 0.3 to 7 V
Maximum continuous sink current (SD, OTW1, OTW2, CLIP, READY) 9 mA
Maximum operating junction temperature range, TJ 0 to 150 C
Storage temperature, Tstg 40 to 150 C
Human body model (3) (all pins) 2 kV
Electrostatic discharge
Charged device model (3) (all pins) 500 V

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) These voltages represents the DC voltage + peak AC waveform measured at the terminal of the device in all conditions.
(3) Failure to follow good anti-static ESD handling during manufacture and rework will contribute to device malfunction. Make sure the
operators handling the device are adequately grounded through the use of ground straps or alternative ESD protection.

RECOMMENDED OPERATING CONDITIONS


over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
PVDD_x Half-bridge supply DC supply voltage 18 36 38 V
Supply for logic regulators and gate-drive
GVDD_x DC supply voltage 10.8 12 13.2 V
circuitry
VDD Digital regulator supply voltage DC supply voltage 10.8 12 13.2 V
RL(BTL) 3.5 4
Output filter according to schematics in
RL(SE) Load impedance 2.8 3
the application information section.
RL(PBTL) 1.6 2
Output filter according to schematics in
the application information section. ROC =
RL(BTL) Load impedance 2.8 3
22k, add Schottky diodes from OUT_X
to GND_X.
LOUTPUT(BTL) 7 10
LOUTPUT(SE) Output filter inductance Minimum output inductance at IOC 7 15 H
LOUTPUT(PBTL) 7 10
FPWM PWM frame rate 352 384 500 kHz
CPVDD PVDD close decoupling capacitors 2 F
ROC Over-current programming resistor Resistor tolerance = 5% 22 30 k
ROC_LATCHED Over-current programming resistor Resistor tolerance = 5% 47 64 k
TJ Junction temperature 0 125 C

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PIN FUNCTIONS
PIN
FUNCTION (1) DESCRIPTION
NAME PHD NO. DKD NO.
AGND 8 10 P Analog ground
BST_A 54 43 P HS bootstrap supply (BST), external 0.033F capacitor to OUT_A required.
BST_B 41 34 P HS bootstrap supply (BST), external 0.033F capacitor to OUT_B required.
BST_C 40 33 P HS bootstrap supply (BST), external 0.033F capacitor to OUT_C required.
BST_D 27 24 P HS bootstrap supply (BST), external 0.033F capacitor to OUT_D required.
CLIP 18 O Clipping warning; open drain; active low
C_STARTUP 3 5 O Startup ramp requires a charging capacitor of 4.7nF to GND
TEST 12 14 I Connect to VREG node
GND 7, 23, 24, 57, 58 9 P Ground
GND_A 48, 49 38 P Power ground for half-bridge A
GND_B 46, 47 37 P Power ground for half-bridge B
GND_C 34, 35 30 P Power ground for half-bridge C
GND_D 32, 33 29 P Power ground for half-bridge D
GVDD_A 55 P Gate drive voltage supply requires 0.1F capacitor to GND
GVDD_B 56 P Gate drive voltage supply requires 0.1F capacitor to GND
GVDD_C 25 P Gate drive voltage supply requires 0.1F capacitor to GND
GVDD_D 26 P Gate drive voltage supply requires 0.1F capacitor to GND
GVDD_AB 44 P Gate drive voltage supply requires 0.22F capacitor to GND
GVDD_CD 23 P Gate drive voltage supply requires 0.22F capacitor to GND
INPUT_A 4 6 I Input signal for half bridge A
INPUT_B 5 7 I Input signal for half bridge B
INPUT_C 10 12 I Input signal for half bridge C
INPUT_D 11 13 I Input signal for half bridge D
M1 20 20 I Mode selection
M2 21 21 I Mode selection
M3 22 22 I Mode selection
NC 5962 No connect, pins may be grounded.
NC 13, 14 15, 16 No connect, pins may be grounded.
OC_ADJ 1 3 O Analog overcurrent programming pin requires resistor to ground.
OTW 18 O Overtemperature warning signal, open drain, active low.
OTW1 16 O Overtemperature warning signal, open drain, active low.
OTW2 17 O Overtemperature warning signal, open drain, active low.
OUT_A 52, 53 39, 40 O Output, half bridge A
OUT_B 44, 45 36 O Output, half bridge B
OUT_C 36, 37 31 O Output, half bridge C
OUT_D 28, 29 27, 28 O Output, half bridge D
PSU_REF 63 1 P PSU Reference requires close decoupling of 4.7F to GND
Power supply input for half bridges A requires close decoupling of 2F capacitor to
PVDD_A 50, 51 41, 42 P
GND_A
Power supply input for half bridges B requires close decoupling of 2F capacitor to
PVDD_B 42, 43 35 P
GND_B
Power supply input for half bridges C requires close decoupling of 2F capacitor to
PVDD_C 38, 39 32 P
GND_C
Power supply input for half bridges D requires close decoupling of 2F capacitor to
PVDD_D 30, 31 25, 26 P
GND_D
READY 19 19 O Normal operation; open drain; active high
RESET 2 4 I Device reset Input; active low
SD 15 17 O Shutdown signal, open drain, active low
Power supply for digital voltage regulator requires a 47F capacitor in parallel with a
VDD 64 2 P
0.1F capacitor to GND for decoupling.
VI_CM 6 8 O Analog comparator reference node requires close decoupling of 4.7F to GND

(1) I = Input, O = Output, P = Power


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PIN FUNCTIONS (continued)


PIN
FUNCTION (1) DESCRIPTION
NAME PHD NO. DKD NO.
VREG 9 11 P Digital regulator supply filter pin requires 0.1F capacitor to GND

TYPICAL SYSTEM BLOCK DIAGRAM


Caps for
System External
microcontroller Filtering
and
AMP RESET (2) Startup/Stop

I2C

/OTW1, /OTW2, /OTW


/SD

/CLIP

READY

VI_CM

PSU_REF

C_STARTUP
TAS5518/ *NOTE1
TAS5508/
TAS5086 RESET
VALID BST_A
Bootstrap
BST_B Caps

PWM_A INPUT_A OUT_A 2nd Order


Left- L-C Output
Input Output 2
Channel PWM_B Filter for
INPUT_B H-Bridge 1 H-Bridge 1 OUT_B
Output each
2
H-Bridge

2-CHANNEL
H-BRIDGE
BTL MODE

PWM_C INPUT_C OUT_C


2nd Order
Right- Input Output L-C Output
2
Channel PWM_D INPUT_D H-Bridge 2 H-Bridge 2 OUT_D
Filter for
Output each
2
H-Bridge
M1
GVDD_A, B, C, D

BST_C
PVDD_A, B, C, D

Hardwire
GND_A, B, C, D

M2 Bootstrap
Mode
M3 BST_D Caps
OC_ADJ

Control
VREG

AGND

TEST
VDD
GND

8 8 4

PVDD PVDD GVDD, VDD, Hardwire


36V
50V Power Supply Over-
and VREG
Decoupling Current
SYSTEM Power Supply
Power Decoupling Limit
Supplies
GND
GND
GVDD (12V)/VDD (12V)
12V

VAC

(1) Logic AND is inside or outside the micro controller.

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FUNCTIONAL BLOCK DIAGRAM

CLIP

READY

OTW1

OTW2

SD

M1

PROTECTION & I/O LOGIC


M2 VDD

M3
POWER-UP
UVP VREG VREG
RESET
RESET
AGND
TEMP GVDD_A GVDD_C
STARTUP SENSE
GND
CONTROL GVDD_B GVDD_D
C_STARTUP

OVER-LOAD CURRENT
CB3C OC_ADJ
PROTECTION SENSE

4
PVDD_X
4
PPSC OUT_X
4
GND_X

GVDD_A

PWM
ACTIVITY BST_A
DETECTOR

PVDD_A

PWM TIMING
CONTROL GATE-DRIVE OUT_A
RECEIVER CONTROL

GND_A

PSU_REF
GVDD_B
VI_CM

ANALOG - BST_B
LOOP FILTER
INPUT_A +
PVDD_B

PWM TIMING
ANALOG + RECEIVER
CONTROL
CONTROL
GATE-DRIVE OUT_B
LOOP FILTER
INPUT_B -
ANALOG COMPARATOR MUX

GND_B
ANALOG INPUT MUX

4
PVDD_X GVDD_C
AGC
GND

BST_C

INPUT_C
ANALOG - PVDD_C
LOOP FILTER
+ PWM TIMING
CONTROL GATE-DRIVE OUT_C
RECEIVER CONTROL

INPUT_D
ANALOG + GND_C
LOOP FILTER
-
GVDD_D

BST_D

PVDD_D

PWM TIMING
CONTROL GATE-DRIVE OUT_D
RECEIVER CONTROL

GND_D

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AUDIO CHARACTERISTICS (BTL)


Audio performance is recorded as a chipset consisting of a TAS5518 PWM Processor (modulation index limited to 97.7%)
and a TAS5614A power stage. PCB and system configurations are in accordance with recommended guidelines. Audio
frequency = 1kHz, PVDD_X = 36V, GVDD_X = 12V, RL = 4, fS = 384 kHz, ROC = 30k, TC = 75C,
Output Filter: LDEM = 7H, CDEM = 680nF, MODE = 000, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RL = 3, 10% THD+N (ROC = 22k, add Schottky
200
diodes from OUT_X to GND_X.)
RL = 4, 10% THD+N 150
PO Power output per channel W
RL = 3, 1% THD+N (ROC = 22k, add Schottky
160
diodes from OUT_X to GND_X.)
RL = 4, 1% THD+N 125
1 W, RL = 4 0.03%
THD+N Total harmonic distortion + noise
1 W, RL = 8 0.01%
Vn Output integrated noise A-weighted, TAS5518 Modulator 125 V
|VOS| Output offset voltage No signal 8 25 mV
SNR Signal-to-noise ratio (1) A-weighted, TAS5518 Modulator 103 dB
A-weighted, input level 60 dBFS using TAS5518
DNR Dynamic range 103 dB
modulator
Power dissipation due to Idle losses
Pidle PO = 0, 4 channels switching (2) 2.6 W
(IPVDD_X)

(1) SNR is calculated relative to 1% THD-N output level.


(2) Actual system idle losses also are affected by core losses of output inductors.

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AUDIO CHARACTERISTICS (PBTL)


Audio performance is recorded as a chipset consisting of a TAS5518 PWM Processor (modulation index limited to 97.7%)
and a TAS5614A power stage. PCB and system configurations are in accordance with recommended guidelines. Audio
frequency = 1kHz, PVDD_X = 36V, GVDD_X = 12V, RL = 2, fS = 384kHz, ROC = 30k, TC = 75C,
Output Filter: LDEM = 7H, CDEM = 1F, MODE = 101-00, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RL = 2, 10%, THD+N 300
RL = 3, 10%, THD+N 200
RL = 4, 10%, THD+N 160
PO Power output per channel W
RL = 2, 1% THD+N 250
RL = 3, 1% THD+N 160
RL = 4, 1% THD+N 130
THD+N Total harmonic distortion + noise 1W 0.03%
Vn Output integrated noise A-weighted, TAS5518 Modulator 128 V
SNR Signal to noise ratio (1) A-weighted, TAS5518 Modulator 103 dB
A-weighted, input level 60 dBFS using
DNR Dynamic range 103 dB
TAS5518 modulator
(2)
Pidle Power dissipation due to idle losses (IPVDD_X) PO = 0, 4 channels switching 2.4 W

(1) SNR is calculated relative to 1% THD-N output level.


(2) Actual system idle losses are affected by core losses of output inductors.

ELECTRICAL CHARACTERISTICS
PVDD_X = 36V, GVDD_X = 12V, VDD = 12V, TC (Case temperature) = 75C, fS = 384kHz, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INTERNAL VOLTAGE REGULATOR AND CURRENT CONSUMPTION
Voltage regulator, only used as reference
VREG VDD = 12V 3 3.3 3.6 V
node, VREG
VI_CM Analog comparator reference node, VI_CM 1.5 1.75 1.9 V
Operating, 50% duty cycle 20
IVDD VDD supply current mA
Idle, reset mode 20
50% duty cycle 10
IGVDD_x Gate-supply current per half-bridge mA
Reset mode 1.5
50% duty cycle without output filter or
16.8 mA
IPVDD_x Half-bridge idle current load
Reset mode, No switching 620 A
OUTPUT-STAGE MOSFETs
Drain-to-source resistance, low side (LS) TJ = 25C, excludes metallization 60 100 m
RDS(on) resistance,
Drain-to-source resistance, high side (HS) GVDD = 12V 60 100 m

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ELECTRICAL CHARACTERISTICS (continued)


PVDD_X = 36V, GVDD_X = 12V, VDD = 12V, TC (Case temperature) = 75C, fS = 384kHz, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I/O PROTECTION
Vuvp,G Undervoltage protection limit, GVDD_x, VDD 9.5 V
(1)
Vuvp,hyst 0.6 V
OTW1 (1) Overtemperature warning 1 95 100 105 C
OTW2 (1) Overtemperature warning 2 115 125 135 C
Temperature drop needed below OTW
(1)
OTWhyst temperature for OTW to be inactive after 25 C
OTW event.
Overtemperature error 145 155 165 C
OTE (1)
OTE-OTW differential 30 C
(1) A reset needs to occur for SD to be released
OTEHYST 25 C
following an OTE event
OLPC Overload protection counter fPWM = 384kHz 2.6 ms
Resistor programmable, nominal peak
14
current in 1 load, ROCP = 30k

IOC Overcurrent limit protection Resistor programmable, nominal peak A


current in 1 load, ROCP = 22k
18
(With Schottky diodes from OUT_X to
GND_X.)
Resistor programmable, nominal peak
14
current in 1 load, ROCP = 64k

IOC_LATCHED Overcurrent limit protection Resistor programmable, nominal peak A


current in 1 load, ROCP = 47k
18
(With Schottky diodes from OUT_X to
GND_X.)
Time from application of short condition to
IOCT Overcurrent response time 150 ns
Hi-Z of affected half bridge
Connected when RESET is active to
Internal pulldown resistor at output of each
IPD provide bootstrap charge. Not used in SE 3 mA
half bridge
mode.
STATIC DIGITAL SPECIFICATIONS
VIH High level input voltage 1.9 V
INPUT_X, M1, M2, M3, RESET
VIL Low level input voltage 0.8 V
Ilkg Input leakage current 100 A
OTW/SHUTDOWN (SD)
Internal pullup resistance, OTW1 to VREG,
RINT_PU 20 26 33 k
OTW2 to VREG, SD to VREG
Internal pullup resistor 3 3.3 3.6
VOH High level output voltage V
External pullup of 4.7k to 5V 4.5 5
VOL Low level output voltage IO = 4mA 200 500 mV
Device fanout OTW1, OTW2, SD, CLIP,
FANOUT No external pullup 30 devices
READY

(1) Specified by design.

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TYPICAL CHARACTERISTICS, BTL CONFIGURATION


TOTAL HARMONIC+NOISE OUTPUT POWER
vs vs
OUTPUT POWER SUPPLY VOLTAGE
10 250
TC = 75C TC = 75C
THD+N - Total Harmonic Distortion + Noise - %

3W
THD+N 10%
4W
200 3W
1 6W
4W

PO - Output Power - W
8W
6W
150
8W
0.1

100

0.01
50

0.001 0
0.01 0.1 1 10 100 1000 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
PO - Output Power - W PVDD - Supply Voltage - V

Figure 1. Figure 2.

UNCLIPPED OUTPUT POWER SYSTEM EFFICIENCY


vs vs
SUPPLY VOLTAGE OUTPUT POWER
200 100
TC = 75C
90

6W 4W
80 8W
3W
150
70
PO - Output Power - W

4W
Efficiency - %

6W 60
8W
100 50

40

30
50
20
TC = 25C
10 THD+N = 10%

0 0
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 0 50 100 150 200 250 300 350 400
PVDD - Supply Voltage - V 2 Channel Output Power - W

Figure 3. Figure 4.

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TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued)


SYSTEMS POWER LOSS OUTPUT POWER
vs vs
OUTPUT POWER CASE TEMPERATURE
30 250
TC = 25C THD+N = 10%
3W
THD+N = 10%
4W
200
4W

PO - Output Power - W
20
Powr Loss - W

150
6W
6W

100
10
8W

8W 50

0
0
0 50 100 150 200 250 300 350 400 20 30 40 50 60 70 80 90 100
2 Channel Output Power - W TC - Case Temperature - C
Figure 5. Figure 6.

NOISE AMPLITUDE TOTAL HORMONIC DISTORTION+NOISE


vs vs
FREQUENCY FREQUENCY
0 10
TC = 75C, RL = 4 W ,
-20 REF = 25.46 V, TC = 75C,
THD+N - Total Harmonic Distortion - %

Sample Rate = 48 kHz, Toroidal Output Inductors


FFT Size = 16384
-40 1
Noise Amplitude - dB

-60

-80 0.1

-100
1W
-120 0.01
4W
-140
21 W (1/8 Power)
-160 0.001
0 5 10 15 20 10 100 1k 10k 100k
f - Frequency - kHz f - Frequency - Hz
Figure 7. Figure 8.

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TAS5614A
www.ti.com SLAS712B JUNE 2010 REVISED MARCH 2011

TYPICAL CHARACTERISTICS, PBTL CONFIGURATION


TOTAL HARMONIC+NOISE OUTPUT POWER
vs vs
OUTPUT POWER SUPPLY VOLTAGE
10 400
TC = 75C 2W TC = 75C
THD+N - Total Harmonic Distortion + Noise - %

350 THD+N = 10%


3W
2W
4W
1 300 3W

PO - Output Power - W
6W
4W
8W 250
6W
0.1 200
8W

150

0.01 100

50

0.001 0
0.01 0.1 1 10 100 1000 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
PO - Output Power - W PVDD - Supply Voltage - V

Figure 9. Figure 10.

OUTPUT POWER
vs
CASE TEMPERATURE
400
THD+N = 10% 2W
350

300
3W
PO - Output Power - W

250
4W
200

6W
150

100

8W
50

0
20 30 40 50 60 70 80 90 100
TC - Case Temperature - C
Figure 11.

Copyright 20102011, Texas Instruments Incorporated Submit Documentation Feedback 13


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TAS5614A
SLAS712B JUNE 2010 REVISED MARCH 2011 www.ti.com

APPLICATION INFORMATION

PCB MATERIAL RECOMMENDATION


FR-4 Glass Epoxy material with 2oz. (70m) is recommended for use with the TAS5614A. The use of this
material can provide for higher power output, improved thermal performance, and better EMI margin (due to
lower PCB trace inductance.

PVDD CAPACITOR RECOMMENDATION


The large capacitors used in conjunction with each full-bridge, are referred to as the PVDD Capacitors. These
capacitors should be selected for proper voltage margin and adequate capacitance to support the power
requirements. In practice, with a well designed system power supply, 1000F, 50V support more applications.
The PVDD capacitors should be low ESR type because they are used in a circuit associated with high-speed
switching.

DECOUPLING CAPACITOR RECOMMENDATION


To design an amplifier that has robust performance, passes regulatory requirements, and exhibits good audio
performance, good quality decoupling capacitors should be used. In practice, X7R should be used in this
application.
The voltage of the decoupling capacitors should be selected in accordance with good design practices.
Temperature, ripple current, and voltage overshoot must be considered. This fact is particularly true in the
selection of the 0.1F that is placed on the power supply to each half-bridge. It must withstand the voltage
overshoot of the PWM switching, the heat generated by the amplifier during high power output, and the ripple
current created by high power output. A minimum voltage rating of 50V is required for use with a 36V power
supply.

SYSTEM DESIGN RECOMMENDATIONS


The following schematics and PCB layouts illustrate best practices in the use of the TAS5614A.

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GVDD/VDD (+12V)

R30 PVDD
C64
3.3R
R31 1000uF
C40
33nF
3.3R
C25 C26 L10
10uF 100nF 7uH GND
C30 C31 OUT_LEFT_P
100nF 100nF

GND GND C60 R70


C23
2uF 3.3R
GND GND
C50 C70
VREG 680nF 1nF
4.7uF C74
GND 10nF
R19 +

NC
NC
NC
NC
R18 47k

VDD
GND
GND
BST_A
/RESET

OUT_A
OUT_A
GND_A

PVDD_A
PVDD_A

GVDD_B
GVDD_A
-

PSU_REF
100R C18 C75 GND

Copyright 20102011, Texas Instruments Incorporated


100pF R20 GND 10nF
GND OC_ADJ GND_A
30k C51 C71
GND C20 /RESET GND_B 680nF 1nF R71
R10
GND L11 3.3R
IN_LEFT_P C_STARTUP GND_B GND 7uH
100R 4.7nF
INPUT_A OUT_B OUT_LEFT_M

C21 INPUT_B OUT_B C61 C41


R11
GND 2uF 33nF
IN_LEFT_N VI_CM PVDD_B
100R 4.7uF PVDD
GND PVDD_B
C68 R74
C22 VREG GND AGND U10 BST_B 1000uF 1000uF 47uF C69 3.3R
R12 C65 C66
GND TAS5614APHD 63V 2.2uF
IN_RIGHT_P VREG BST_C
GND
100R 100nF C78
INPUT_C PVDD_C 10nF
GND GND GND GND
VREG INPUT_D PVDD_C C62 C42 GND
R13
2uF 33nF
R_RIGHT_N TEST OUT_C GND
100R OUT_RIGHT_P
NC OUT_C
7uH R72
NC GND_C L12 3.3R
/SD GND_C GND
C52 C72
/OTW1 GND_D 680nF 1nF C76
10nF

Product Folder Link(s): TAS5614A


/OTW2
/CLIP
READY
M1
M2
M3
GND
GND
GVDD_C
GVDD_D
BST_D
OUT_D
OUT_D
PVDD_D
PVDD_D
GND_D

C77 GND -
10nF
/SD
GND
/OTW1
C63 C53 C73 R73
/OTW2
2uF 680nF 1nF 3.3R
L13
/CLIP
GND 7uH
READY
OUT_RIGHT_R
VREG
PVDD
C43 C67
33nF 1000uF

R32
GND
3.3R GND
R33
GVDD/VDD (+12V)
3.3R

C33 C32
100nF 100nF

GND GND

Figure 12. Typical Differential (2N) BTL Application With BD Modulation Filters

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SLAS712B JUNE 2010 REVISED MARCH 2011
TAS5614A

15
16
TAS5614A

3.3R
VDD (+12V) GVDD (+12V)
3.3R
PVDD

100nF 100nF 3.3R


10uF 100nF 33nF 7uH
1000uF 47uF 2.2uF

10nF
GND GND GND GND
VREG

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2uF
4.7uF
GND GND GND GND GND
SLAS712B JUNE 2010 REVISED MARCH 2011

47k GND
100R
/RESET

64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
100pF GND
1000uF

NC
NC
NC
NC

VDD
GND
GND
BST_A
OUT_A
OUT_A
GND_A

PVDD_A
PVDD_A

GVDD_B
GVDD_A

PSU_REF
GND 30k
GND
100R 1 48
OC_ADJ GND_A
IN_P 4.7nF
GND 2 47
/RESET GND_B
OUT_LEFT_P
3 46
C_STARTUP GND_B GND 7uH
GND 4 45
INPUT_A OUT_B
3.3R
100R 5 44
INPUT_B OUT_B 1uF
4.7uF 2uF
IN_N 33nF
6 43
VI_CM PVDD_B
7 42 1nF 10nF
GND GND PVDD_B
100nF VREG 8 41 +
GND AGND BST_B
9 TAS5614APHD 40
VREG BST_C
VREG -
GND 10 39 GND 1nF 10nF GND
INPUT_C PVDD_C
11 38
VREG INPUT_D PVDD_C 2uF 1uF
33nF
12 37
GND TEST OUT_C 7uH
3.3R
13 36
NC OUT_C
14 35
NC GND_C
15 34 OUT_LEFT_M
/SD GND_C
GND
16 33
/OTW1 GND_D

Product Folder Link(s): TAS5614A


/OTW2
/CLIP
READY
M1
M2
M3
GND
GND
GVDD_C
GVDD_D
BST_D
OUT_D
OUT_D
PVDD_D
PVDD_D
GND_D

1000uF

17
18
19
20
21
22
23
24
25
26
28
29
30
31
32

27

2uF GND

/SD PVDD
GND GND
1000uF
/OTW1
VREG 7uH
/OTW2
33nF
/CLIP
3.3R GND
READY
3.3R
GVDD (+12V)

100nF 100nF

GND GND

Figure 13. Typical (2N) PBTL Application With BD Modulation Filters


www.ti.com

Copyright 20102011, Texas Instruments Incorporated


www.ti.com

GVDD (+12V)
1.5R

PVDD
100nF 100nF

1000uF
VDD (+12V)
GND

10uF 100nF 7uH GND


OUT_LEFT_P

GND GND
3.3R
VREG 680nF
GND

4.7uF

Copyright 20102011, Texas Instruments Incorporated


1nF 10nF
47k
1 44 +
/RESET PSU_REF GVDD_AB
100R 2 43
100pF VDD BST_A
-
3 42 33nF GND 1nF 10nF GND
GND OC_ADJ PVDD_A
30k 4 41
GND /RESET PVDD_A 680nF
GND 5 C_STARTUP OUT_A 40
IN_LEFT_P 2uF
3.3R
100R 4.7nF 6 39
INPUT_A OUT_A
7 38 7uH
INPUT_B GND_A

GND 8 37 OUT_LEFT_M
IN_LEFT_N VI_CM GND_B GND
100R 4.7uF 9 36
GND OUT_B PVDD
VREG 10 35
GND AGND PVDD_B 3.3R
GND 33nF 1000uF 1000uF
11 34 2uF 47uF 2.2uF
IN_RIGHT_P VREG BST_B
100nF
100R 12 TAS5614ADKD 33 10nF
INPUT_C BST_C
33nF
13 32 2uF GND
INPUT_D PVDD_C
VREG
14 31 GND GND GND GND
IN_RIGHT_N TEST OUT_C
GND
100R 15 30 7uH
NC GND_C
OUT_RIGHT_P
16 NC GND_D 29

17 28
/SD OUT_D GND
3.3R
18 /OTW OUT_D 27
2uF 680nF
19 26
READY PVDD_D
20 25 1nF 10nF
M1 PVDD_D

Product Folder Link(s): TAS5614A


VREG
21 24 +
M2 BST_D
22 23 33nF
M3 GVDD_CD
-
GND 1nF 10nF GND

GND
/SD 680nF
/OTW
3.3R
READY
7uH

OUT_RIGHT_M
PVDD

1.5R 1000uF

100nF 100nF
GND
GVDD (+12V)

GND

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Figure 14. Typical Differential Input BTL Application with BD Modulation Filters DKD Package
SLAS712B JUNE 2010 REVISED MARCH 2011
TAS5614A

17
TAS5614A
SLAS712B JUNE 2010 REVISED MARCH 2011 www.ti.com

THEORY OF OPERATION

POWER SUPPLIES
To facilitate system design, the TAS5614A needs only a 12V supply in addition to the (typical) 36V power-stage
supply. An internal voltage regulator provides suitable voltage levels for the digital and low-voltage analog
circuitry. Additionally, all circuitry requiring a floating voltage supply, e.g., the high-side gate drive, is
accommodated by built-in bootstrap circuitry requiring only an external capacitor for each half-bridge.
To provide outstanding electrical and acoustical characteristics, the PWM signal path including gate drive and
output stage is designed as identical, independent half-bridges. For this reason, each half-bridge has separate
gate drive supply (GVDD_X), bootstrap pins (BST_X), and power-stage supply pins (PVDD_X). Furthermore, an
additional pin (VDD) is provided as supply for all common circuits. Although supplied from the same 12 V source,
it is highly recommended to separate GVDD_A, GVDD_B, GVDD_C, GVDD_D, and VDD on the printed-circuit
board (PCB) by RC filters (see application diagram for details). These RC filters provide the recommended
high-frequency isolation. Special attention should be paid to placing all decoupling capacitors as close to their
associated pins as possible. In general, inductance between the power supply pins and decoupling capacitors
must be avoided. (See reference board documentation for additional information.)
For a properly functioning bootstrap circuit, a small ceramic capacitor must be connected from each bootstrap pin
(BST_X) to the power-stage output pin (OUT_X). When the power-stage output is low, the bootstrap capacitor is
charged through an internal diode connected between the gate-drive power-supply pin (GVDD_X) and the
bootstrap pin. When the power-stage output is high, the bootstrap capacitor potential is shifted above the output
potential and thus provides a suitable voltage supply for the high-side gate driver. In an application with PWM
switching frequencies in the range from 300kHz to 4000kHz, it is recommended to use 33nF ceramic capacitors,
size 0603 or 0805, for the bootstrap supply. These 33-nF capacitors ensure sufficient energy storage, even
during minimal PWM duty cycles, to keep the high-side power stage FET (LDMOS) fully turned on during the
remaining part of the PWM cycle.
Special attention should be paid to the power-stage power supply; this includes component selection, PCB
placement, and routing. As indicated, each half-bridge has independent power-stage supply pins (PVDD_X). For
optimal electrical performance, EMI compliance, and system reliability, it is important that each PVDD_X pin is
decoupled with a 2F ceramic capacitor placed as close as possible to each supply pin. It is recommended to
follow the PCB layout of the TAS5614A reference design. For additional information on recommended power
supply and required components, see the application diagrams in this data sheet.
The 12V supply should be from a low-noise, low-output-impedance voltage regulator. Likewise, the 36V
power-stage supply is assumed to have low output impedance and low noise. The power-supply sequence is not
critical as facilitated by the internal power-on-reset circuit. Moreover, the TAS5614A is fully protected against
erroneous power-stage turn on due to parasitic gate charging. Thus, voltage-supply ramp rates (dV/dt) are
non-critical within the specified range (see the Recommended Operating Conditions table of this data sheet).

SYSTEM POWER-UP/POWER-DOWN SEQUENCE

Powering Up
The TAS5614A does not require a power-up sequence. The outputs of the H-bridges remain in a
high-impedance state until the gate-drive supply voltage (GVDD_X) and VDD voltage are above the undervoltage
protection (UVP) voltage threshold (see the Electrical Characteristics table of this data sheet). Although not
specifically required, it is recommended to hold RESET in a low state while powering up the device. This allows
an internal circuit to charge the external bootstrap capacitors by enabling a weak pulldown of the half-bridge
output.

Powering Down
The TAS5614A does not require a power-down sequence. The device remains fully operational as long as the
gate-drive supply (GVDD_X) voltage and VDD voltage are above the undervoltage protection (UVP) voltage
threshold (see the Electrical Characteristics table of this data sheet). Although not specifically required, it is a
good practice to hold RESET low during power down, thus preventing audible artifacts including pops or clicks.

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TAS5614A
www.ti.com SLAS712B JUNE 2010 REVISED MARCH 2011

ERROR REPORTING
The SD, OTW, OTW1 and OTW2 pins are active-low, open-drain outputs. Their function is for protection-mode
signaling to a PWM controller or other system-control device.
Any fault resulting in device shutdown is signaled by the SD pin going low. Likewise, OTW and OTW2 goes low
when the device junction temperature exceeds 125C and OTW1 goes low when the junction temperature
exceeds 100C (see the following table).

OTW2,
SD OTW1 DESCRIPTION
OTW
0 0 0 Overtemperature (OTE) or overload (OLP) or undervoltage (UVP)
Overload (OLP) or undervoltage (UVP). Junction temperature higher than 100C (overtemperature
0 0 1
warning)
0 1 1 Overload (OLP) or undervoltage (UVP)
1 0 0 Junction temperature higher than 125C (overtemperature warning)
1 0 1 Junction temperature higher than 100C (overtemperature warning)
1 1 1 Junction temperature lower than 100C and no OLP or UVP faults (normal operation)

Note that asserting RESET low forces the SD signal high, independent of faults being present. TI recommends
monitoring the OTW signal using the system micro controller and responding to an overtemperature warning
signal by, e.g., turning down the volume to prevent further heating of the device resulting in device shutdown
(OTE).
To reduce external component count, an internal pullup resistor to 3.3V is provided on both SD and OTW
outputs. Level compliance for 5V logic can be obtained by adding external pullup resistors to 5V (see the
Electrical Characteristics table of this data sheet for further specifications).

DEVICE PROTECTION SYSTEM


The TAS5614A contains advanced protection circuitry carefully designed to facilitate system integration and ease
of use, as well as to safeguard the device from permanent failure due to a wide range of fault conditions such as
short circuits, overload, overtemperature, and undervoltage. The TAS5614A responds to a fault by immediately
setting the power stage in a high-impedance (Hi-Z) state and asserting the SD pin low. In situations other than
overload and overtemperature error (OTE), the device automatically recovers when the fault condition has been
removed, i.e., the supply voltage has increased.
The device will function on errors, as shown in the following table.

BTL Mode PBTL Mode SE Mode


Local Error In Turns Off Local Error In Turns Off Local Error In Turns Off
A A+B A A+B+C+D A A+B
B B B
C C+D C C C+D
D D D

Bootstrap UVP does not shutdown according to the table, it shuts down the respective halfbridge.

PIN-TO-PIN SHORT CIRCUIT PROTECTION (PPSC)


The PPSC detection system protects the device from permanent damage if a power output pin (OUT_X) is
shorted to GND_X or PVDD_X. For comparison, the OC protection system detects an over current after the
demodulation filter where PPSC detects shorts directly at the pin before the filter. PPSC detection is performed at
startup i.e. when VDD is supplied, consequently a short to either GND_X or PVDD_X after system startup will not
activate the PPSC detection system. When PPSC detection is activated by a short on the output, all half bridges
are kept in a Hi-Z state until the short is removed, the device then continues the startup sequence and starts
switching. The detection is controlled globally by a two step sequence. The first step ensures that there are no
shorts from OUT_X to GND_X, the second step tests that there are no shorts from OUT_X to PVDD_X. The total
duration of this process is roughly proportional to the capacitance of the output LC filter. The typical duration is

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<15 ms/F. While the PPSC detection is in progress, SD is kept low, and the device will not react to changes
applied to the RESET pins. If no shorts are present the PPSC detection passes, and SD is released. A device
reset will not start a new PPSC detection. PPSC detection is enabled in BTL and PBTL output configurations, the
detection is not performed in SE mode. To make sure not to trip the PPSC detection system it is recommended
not to insert resistive load to GND_X or PVDD_X.

OVERTEMPERATURE PROTECTION
The two different package options has individual over temperature protection schemes.

PHD Package
The TAS5614A PHD package option has a three-level temperature-protection system that asserts an active-low
warning signal (OTW1) when the device junction temperature exceeds 100C (typical), (OTW2) when the device
junction temperature exceeds 125C (typical) and, if the device junction temperature exceeds 155C (typical), the
device is put into thermal shutdown, resulting in all half-bridge outputs being set in the high-impedance (Hi-Z)
state and SD being asserted low. OTE is latched in this case. To clear the OTE latch, RESET must be asserted.
Thereafter, the device resumes normal operation.

DKD Package
The TAS5614A DKD package option has a two-level temperature-protection system that asserts an active-low
warning signal (OTW) when the device junction temperature exceeds 125C (typical) and, if the device junction
temperature exceeds 155C (typical), the device is put into thermal shutdown, resulting in all half-bridge outputs
being set in the high-impedance (Hi-Z) state and SD being asserted low. OTE is latched in this case. To clear the
OTE latch, RESET must be asserted. Thereafter, the device resumes normal operation.

UNDERVOLTAGE PROTECTION (UVP) AND POWER-ON RESET (POR)


The UVP and POR circuits of the TAS5614A fully protect the device in any power-up/down and brownout
situation. While powering up, the POR circuit resets the overload circuit (OLP) and ensures that all circuits are
fully operational when the GVDD_X and VDD supply voltages reach stated in the Electrical Characteristics table.
Although GVDD_X and VDD are independently monitored, a supply voltage drop below the UVP threshold on
any VDD or GVDD_X pin results in all half-bridge outputs immediately being set in the high-impedance (Hi-Z)
state and SD being asserted low. The device automatically resumes operation when all supply voltages have
increased above the UVP threshold.

DEVICE RESET
When RESET is asserted low, all power-stage FETs in the four half-bridges are forced into a high-impedance
(Hi-Z) state.
In BTL modes, to accommodate bootstrap charging prior to switching start, asserting the reset input low enables
weak pulldown of the half-bridge outputs. In the SE mode, the output is forced into a high impedance state when
asserting the reset input low. Asserting reset input low removes any fault information to be signaled on the SD
output, i.e., SD is forced high. A rising-edge transition on reset input allows the device to resume operation after
an overload fault. To ensure thermal reliability, the rising edge of reset must occur no sooner than 4 ms after the
falling edge of SD.

SYSTEM DESIGN CONSIDERATION


A rising-edge transition on reset input allows the device to execute the startup sequence and starts switching.
Apply only audio when the state of READY is high that will start and stop the amplifier without having audible
artifacts that is heard in the output transducers. If an overcurrent protection event is introduced the READY signal
goes low, hence, filtering is needed if the signal is intended for audio muting in non micro controller systems.
The CLIP signal is indicating that the output is approaching clipping. The signal can be used to either an audio
volume decrease or intelligent power supply controlling a low and a high rail.
The device is inverting the audio signal from input to output.
The VREG pin is not recommended to be used as a voltage source for external circuitry.

20 Submit Documentation Feedback Copyright 20102011, Texas Instruments Incorporated

Product Folder Link(s): TAS5614A


TAS5614A
www.ti.com SLAS712B JUNE 2010 REVISED MARCH 2011

PRINTED CIRCUIT BOARD RECOMMENDATION


Use an unbroken ground plane to have good low impedance and inductance return path to the power supply for
power and audio signals. PCB layout, audio performance and EMI are linked closely together. The circuit
contains high fast switching currents; therefore, care must be taken to prevent damaging voltage spikes. Routing
the audio input should be kept short and together with the accompanied audio source ground. A local ground
area underneath the device is important to keep solid to minimize ground bounce.
Netlist for this printed circuit board is generated from the schematic in Figure 12.

Note T1: PVDD decoupling bulk capacitors C60-C64 should be as close as possible to the PVDD and GND_X pins,
the heat sink sets the distance. Wide traces should be routed on the top layer with direct connection to the pins and
without going through vias. No vias or traces should be blocking the current path.
Note T2: Close decoupling of PVDD with low impedance X7R ceramic capacitors is placed under the heat sink and
close to the pins.
Note T3: Heat sink needs to have a good connection to PCB ground.
Note T4: Output filter capacitors must be linear in the applied voltage range preferable metal film types.

Figure 15. Printed Circuit Board - Top Layer

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Note B1: It is important to have a direct low impedance return path for high current back to the power supply. Keep
impedance low from top to bottom side of PCB through a lot of ground vias.
Note B2: Bootstrap low impedance X7R ceramic capacitors placed on bottom side providing a short low inductance
current loop.
Note B3: Return currents from bulk capacitors and output filter capacitors.

Figure 16. Printed Circuit Board - Bottom Layer

SPACER

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TAS5614A
www.ti.com SLAS712B JUNE 2010 REVISED MARCH 2011

REVISION HISTORY

Changes from Original (June 2010) to Revision A Page

Changed TJ Max from 150C to 125C in Recommended Operating Conditions table. ...................................................... 4
Changed |VOS| TYP and MAX specs from 20mV and 40mV respectively, to 8mV and 25mV respectively, in the
Audio Characteristic (BTL) spec table. ................................................................................................................................. 8

Changes from Revision A (November 2010) to Revision B Page

Changed I/O PROTECTION, first row from GVDD_x to GVDD_x, VDD and Typ value from 10 to 9.5 ............................ 10

Copyright 20102011, Texas Instruments Incorporated Submit Documentation Feedback 23


Product Folder Link(s): TAS5614A
PACKAGE OPTION ADDENDUM

www.ti.com 10-Jul-2014

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

TAS5614ADKD ACTIVE HSSOP DKD 44 29 Green (RoHS CU NIPDAU Level-4-260C-72 HR 0 to 70 TAS5614A


& no Sb/Br)
TAS5614ADKDR ACTIVE HSSOP DKD 44 500 Green (RoHS CU NIPDAU Level-4-260C-72 HR 0 to 70 TAS5614A
& no Sb/Br)
TAS5614APHD ACTIVE HTQFP PHD 64 90 Green (RoHS CU NIPDAU Level-3-260C-168 HR 0 to 70 TAS5614A
& no Sb/Br)
TAS5614APHDR ACTIVE HTQFP PHD 64 1000 Green (RoHS CU NIPDAU Level-3-260C-168 HR 0 to 70 TAS5614A
& no Sb/Br)
TAS5614PHD NRND HTQFP PHD 64 90 Green (RoHS CU NIPDAU Level-3-260C-168 HR 0 to 70 TAS5614
& no Sb/Br)
TAS5614PHDR NRND HTQFP PHD 64 1000 Green (RoHS CU NIPDAU Level-3-260C-168 HR 0 to 70 TAS5614
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1
PACKAGE OPTION ADDENDUM

www.ti.com 10-Jul-2014

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
PACKAGE MATERIALS INFORMATION

www.ti.com 7-May-2016

TAPE AND REEL INFORMATION

*All dimensions are nominal


Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TAS5614ADKDR HSSOP DKD 44 500 330.0 24.4 14.7 16.4 4.0 20.0 24.0 Q1
TAS5614APHDR HTQFP PHD 64 1000 330.0 24.4 17.0 17.0 1.5 20.0 24.0 Q2
TAS5614PHDR HTQFP PHD 64 1000 330.0 24.4 17.0 17.0 1.5 20.0 24.0 Q2

Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com 7-May-2016

*All dimensions are nominal


Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TAS5614ADKDR HSSOP DKD 44 500 367.0 367.0 45.0
TAS5614APHDR HTQFP PHD 64 1000 367.0 367.0 45.0
TAS5614PHDR HTQFP PHD 64 1000 367.0 367.0 45.0

Pack Materials-Page 2
PACKAGE OUTLINE
DKD0044A SCALE 1.000
PowerPAD TM SSOP - 3.6 mm max height
PLASTIC SMALL OUTLINE

C
14.5 SEATING PLANE
TYP
13.9
A 0.1 C
PIN 1 ID AREA
42X 0.65
44
1

EXPOSED
THERMAL PAD
12.7 2X
16.0 12.6
13.65
15.8
NOTE 3

22
23
0.38
44X
(2.95) 0.25
0.12 C A B
5.9
5.8
11.1
B
10.9
NOTE 4
(0.15)
EXPOSED THERMAL PAD

3.6
3.1

(0.28) TYP
SEE DETAIL A
0.35
GAGE PLANE

1.1 0.3
0 -8 0.8 0.1

DETAIL A
TYPICAL

4218846/A 07/2016
PowerPAD is a trademark of Texas Instruments.
NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. The exposed thermal pad is designed to be attached to an external heatsink.

www.ti.com
EXAMPLE BOARD LAYOUT
DKD0044A PowerPAD TM SSOP - 3.6 mm max height
PLASTIC SMALL OUTLINE

44X (2) SEE DETAILS


SYMM
1
44

44X (0.45)

42X (0.65)

SYMM

(R0.05) TYP

22 23

(13.2)

LAND PATTERN EXAMPLE


SCALE:6X

SOLDER MASK METAL UNDER


SOLDER MASK METAL
OPENING SOLDER MASK
OPENING

0.05 MAX 0.05 MIN


AROUND AROUND

NON SOLDER MASK SOLDER MASK


DEFINED DEFINED

SOLDER MASK DETAILS


NOT TO SCALE
4218846/A 07/2016
NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.


6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
EXAMPLE STENCIL DESIGN
DKD0044A PowerPAD TM SSOP - 3.6 mm max height
PLASTIC SMALL OUTLINE

44X (2)
SYMM
1
44

44X (0.45)

42X (0.65)

SYMM

(R0.05) TYP

22 23

(13.2)

SOLDER PASTE EXAMPLE


BASED ON 0.125 MM THICK STENCIL
SCALE:6X

4218846/A 07/2016
NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

www.ti.com
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