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IMPACT

Pro ject ID: IST-2000-30016


Funded under: FP5-IST

Integratio n o f micro wave perfo rmance into advanced CMOS techno lo gy

Fro m 2001-09-01 t o 2004-11-30 | IMPACT We bs ite

Pro ject details

T ot al cost : T opic(s):

EUR 10 747 473 2000-4.8.2 - Application-s pe cific microe le ctronics

EU cont ribut ion: Funding scheme:

EUR 5 667 887 CSC - Cos t-s haring contracts

Coordinat ed in:

Be lgium

Objective

Characte ris ation and optimis ation of a 100nm CMOS te chnology for MMIC de s ign of microwave front-e nd blocks . The
applications targe tte d by this te chnology are radio communications in 5-20 GHz range . The proje ct will have a s trong
e mphas is on the inte raction be twe e n the s ys te ms / de s ign re alis ation, and the te chnology and mode lling capabilitie s .
Characte ris ation and optimis ation of a 100nm CMOS te chnology for MMIC de s ign of microwave front-e nd blocks . The
applications targe tte d by this te chnology are radio communications in 5-20 GHz range . The proje ct will have a s trong
e mphas is on the inte raction be twe e n the s ys te ms / de s ign re alis ation, and the te chnology and mode lling capabilitie s .

OBJECTIVES
The IMPACT proje ct aims at pus hing CMOS te chnology for its us e in products ope rating we ll into the microwave radio
fre que ncie s (5-20 GHz ). This will be achie ve d by fabricating de mons trator de vice s and circuits within advance d 100nm
CMOS proce s s te chnology. The ove rall te chnological re s ult from this proje ct will be the re alis ation of an e arly
knowle dge and de ve lopme nt bas is for future high-fre que ncy CMOS applications . The ke y te chnical and s cie ntific
obje ctive s of IMPACT are :
1) to e valuate the adde d value of CMOS te chnology for microwave circuits in the 5 to 20 GHz fre que ncy range ;
2) to de ve lop and imple me nt analogue compact mode ls for active and pas s ive compone nts for fre que ncie s up to 50
GHz and;
3) to de ve lop and inte grate active and pas s ive de vice s s uite d for high-fre que ncy applications in advance d CMOS
te chnology.

DESCRIPTION OF WORK
The prime obje ctive of IMPACT is the de s ign and fabrication of microwave circuits within advance d 100nm CMOS
proce s s te chnology. Re alis ing this proje ct goal re quire s activitie s in thre e ke y are as . Firs t, de s ign work is ne e de d to
de fine de mons trator de vice s and circuits that re pre s e nt the application domain of microwave CMOS te chnology. Se cond,
in orde r for this de s ign activity to be s ufficie ntly accurate and pre dictive , compact mode ls ne e d to be de ve lope d that
prope rly de s cribe the high-fre que ncy be haviour of all circuit e le me nts . And third, active and pas s ive de vice s ne e d to
be de fine d and inte grate d, not only to e le ctrically te s t the validity and accuracy of the compact mode ls , but als o to
fabricate the de mons trator circuits . In orde r to capture this natural s ubdivis ion of the proje ct, thre e workpackage s have
be e n de fine d: circuit de s ign, mode lling, and proce s s optimis ation. At the s tart of this proje ct, e xis ting 100nm front-e nd
te chnology will be us e d to obtain mode l parame te rs for active de vice s . Similarly, a firs t mode l de s cription of pas s ive
de vice s will be drive d from e arlie r inte gration and mode lling e xpe rie nce . Us ing this information, and in s ucce s s ive
ite rative loops , the CMOS te chnology will be optimis e d us ing the input obtaine d from the de s ign and mode lling groups .
At the e nd of the proje ct, an optimis e d CMOS te chnology for microwave fre que ncy ope ration will be available toge the r
with improve d mode ls for active and pas s ive de vice s and optimis e d de s ign me thodologie s for microwave circuits and

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INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW Be lgium


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CHALMERS TEKNISKA HOEGSKOLA AKTIEBOLAG Swe de n


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Subjects

Ele ctronics and Microe le ctronics - Information Proce s s ing and Information Sys te ms - Innovation and Te chnology Trans fe r

Last updat ed o n 2005-06-13


Ret rieved o n 2017-09-16

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