BASIC ELECTRONICS ENGINERING

PROF. HEMANT T. INGALE

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COURSE STRUCTURE

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BASIC ELECTRONICS ENGINERING

UNIT-I

PROF. HEMANT T. INGALE

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 ELECTRONICS AND ITS EVOLUTION
-1930 : LARGE VACCUME TUBES
-1940 : SOLID STATE DIODE
-1945 : BIPOLAR JUNCTION TRANSISTOR
-1958 : INTEGRATED CIRCUITS - ANALOG ICs LIKE OP-AMPS, TIMERS, PLL
- DIGITAL ICs – BASIC GATES, MULTIPLEXERS, DEMULTIPLEXERS, ENCODERS,
- DECODERS etc
- SEQUENTIAL DIGITAL ICs – FLIP-FLOPS, COUNTERS AND SHIFT REGISTERS etc
-1960 : ALU, MICROPROCESSOR, MICROCONTROLLER
- ASIC (APPLICATION SPECIFIC INTEGRATED CIRCUITS)
- SOC (SYSTEM ON CHIP) (40 million transistors)
- SOP (SYSTEM ON PACKAGE)
- SOB (SYSTEM ON BOARD)
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- SON (SYSTEM ON NETWORK) (Huge
 ATOMIC STRUCTURE

Particle Charge
Proton +1
Neutron 0
Electron -1

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- Electrons revolves round the nucleus in definite discrete and fixed
orbits.
- These orbits are named as K, L, M, N, O, P etc starting from nucleus
onwards. The nearest orbit or shell is called K, then L and onwards.

- Many atoms of different elements do not have outermost orbit

completely filled i.e they have less than 8 electrons.
- The electrons in the outermost orbit or shell of an atom are called
valence electrons.

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PERMITTED ORBITS

Orbit Quantum Number Number of

n Electrons
K 1 2
L 2 4
M 3 8
: : :

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Atomic Number :- The number of protons in an atom is referred to
as the atomic number of the atom.

e.g. The atom of Silicon has 14 protons and 14 neutrons in its

nucleus, therefore the atomic number of silicon is 14.

Atomic Weight :- Atomic Weight is approximately equal to the

total number of protons and neutrons in the nucleus of the atom.

e.g. The atomic Weight of Silicon is 28.

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PERIODIC TABLE

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 BONDING IN SOLIDS
ATOMS ARE LINKED OR BONDED TO OTHER ATOMS IN SOME MANNER AS A
RESULT OF INTER ATOMIC FORCES.

BONDS ARE MADE UP OF ATTRACTIVE AND REPULSIVE FORCES THAT TENDS TO

HOLD ATOMS.

CLASSIFIED AS PRIMARY AND SECONDARY BONDS.

PRIMARY BONDS ARE INTER ATOMIC BONDS .

SECONDARY BONDS ARE INTER MOLECULAR BONDS.

PRIMARY BONDS ARE STRONGER THAN THE SECONDARY BONDS.

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 IONIC BOND
Ionic Bonding: This bond exists between two atoms when one of the atoms is negative (has an
extra electron) and another is positive (has lost an electron). Then there is a strong, direct
Coulomb attraction. Basically ionic bonds are non-directional in nature. An example is NaCl. In
the molecule, there are more electrons around Cl, forming Cl- and fewer electrons around Na,
forming Na+. Ionic bonds are the strongest bonds. In real solids, ionic bonding is usually exists
along with covalent bonding.

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 COVALENT BOND
Covalent Bonding: In covalent bonding, electrons are shared between the atoms, to saturate
the valency. The simplest example is the H2 molecule, where the electrons spend more time in
between the nuclei of two atoms than outside, thus producing bonding. Covalent bonds are
stereo-specific i.e. each bond is between a specific pair of atoms, which share a pair of electrons
(of opposite magnetic spins). Typically, covalent bonds are very strong, and directional in nature.
The hardness of diamond is a result of the fact that each carbon atom is covalently bonded with
four neighboring atoms, and each neighbor is bonded with an equal number of atoms to form a
rigid three-dimensional structure.

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 METALLIC BOND
Metallic Bonding: Metals are characterized by high thermal and electrical conductivities. Thus,
neither covalent nor ionic bondings are realized because both types of bonding localize the
valence electrons and preclude conduction. However, strong bonding does occur in metals. The
valence electrons of metals also are delocalized. Thus metallic bonding can be viewed as metal
containing a periodic structure of positive ions surrounded by a sea of delocalized electrons. The
attraction between the two provides the bond, which is non-directional.

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CLASSIFICATION OF SOLIDS

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ENERGY BAND DESCRIPTION OF MATERIALS

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ASSIGNMENT NO 1

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THANK YOU!

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