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Session 5

December 20, 2017


Chair :
Dr. Amrit Ambirajan
SCI/ENG - G, Head - Experimental Heat Transfer Section at ISAC, ISRO

Thermal Management using Micro Channel Heat Sink


- Dr. Liang Gong
China University of Petroleum, China

10:30 - 11:45
Thermal Management of Electronics using Pulsating Heat Pipe
- Dr. K Rama Narasimha
Professor and Head, Dept. Of ME, KS Institute of Technology, Bangalore

11:45 - 13:00
Tailoring of Surface-Thermal-Fluid Interactions for Managing Heat in
Electronics
- Dr. Krishna Kota
New Mexico State University, USA

Dr. Amrit Ambirajan


SCI/ENG - G, Head - Experimental Heat Transfer Section at ISAC, ISRO

Sri. Amrit Ambirajan received his B.Tech and M.S in Mechanical Engineering
from Indian Institute of Technology, Chennai. Later, he took his Ph.D. in
Mechanical Engineering from the University of Missouri, Rolla in 1997. After a one
year stint as a post-doctoral researcher at Penn State University, he joined the
ISRO Satellite Centre (ISAC) in 1998. His initial assignment at ISAC was as a
member of the thermal design and analysis team for INSAT-3A. Presently, he is a
Senior Scientist/Engineer “G” at ISAC and heads the Experimental Heat Transfer
Section of Thermal Systems Group(TSG), ISRO Satellite Centre, Bangalore. His
engineering research interests include thermal property measurements, contact
conduction, radiation heat transfer, thin-film evaporation, loop heat pipes and
pulse tube cryo-coolers. He has co-authored more than 50 papers in various
journals and conferences. He has guided 4 Scientists/Engineers of TSG, ISAC
for their doctoral (Ph.D) degree submission at IISc, Bangalore.
Thermal Management using Micro Channel Heat Sink
The challenging thermal problem of significantly increased localized and average heat
fluxes per chip footprint area has been an obstacle to the development of electronic
devices. Efficient dissipation method for the generated waste-heat has been a crucial
requirement for the normal operation and lifespan of electronic devices. Liquid cooled
Micro-channel heat sink is an efficient solution for dissipating the waste-heat generated
by electronic component.
In this presentation, we present an overview of our recent advances in investigations
of fluid flow and heat transfer in micro-channel heat sinks. Firstly, the micro-channel heat
sinks with several specially designed configurations, including wavy channel heat sink,
dimple heat sink and wavy-dimple heat sink, for improving the heat transfer and
reducing pressure drop of fluid flowing through the channel, are introduced in detail.
Subsequently, we mainly focus on the heat transfer enhancement of high powered
microprocessors by employing the novel metal foam heat sink. The metal foam heat
sinks with various configurations, such as Bi-porous metal foam heat sink, non-uniform
metal foam heat sink, metal foam and solid fin compound fin heat sink, and metal foam
heat sink with solid fins are verified. Finally, we present some results regarding the basic
MCM-BGA model with “hotspot”, which is linked to the overall packaging of electronics.

Dr. Liang Gong


China University of Petroleum, China

Liang Gong is an Associate Professor and the vice director of Department of


Energy & Power Engineering in China University of Petroleum (East china). He
received his Ph.D degree in thermal power engineering from Xi’an Jiaotong
University in 2011 and was with Georgia Institute of Technology as visiting
scholar from 2008 to 2010. He is also the Committee Member of the Youth
Committee for Heat & Mass Transfer of China, the Committee Member of the
University Research Association for Engineering Thermophysics of China and the
Committee Member of American Society of Thermal and Fluids Engineers. His
current areas of interest are numerical study on fluid flow and thermal
management in microsystem, multi-physics modeling of the transport
phenomena in porous media, et al. He has published more than 70 journal and
conference papers as the author/co-author and held 8 Chinese patents. He is
the guess editor of Journal of Natural Gas Science and Engineering, Open
Physics, and is a peer reviewer of Scientific Reports, Energy, International
Journal of Heat & Mass Transfer, Applied Thermal Engineering, Energy
Conversion & Management, et al.
Thermal Management of Electronics using Pulsating
Heat Pipe
Heat Pipe is being explored for electronic cooling devices with promising results. Even
though the conventional heat pipes are excellent heat transfer devices but their
application is mainly confined to transferring small amount of heat over relatively short
distances. Pulsating Heat Pipes (PHPs) have proved to transport heat for longer
distances, helping in placing the condenser away from compact cabinets. A PHP
consists of a small diameter tube that crosses a condenser and evaporator region
multiple times. The tube is filled with a working fluid such that only the fluid and its
vapour phase exist. The tube’s inner diameter must also be small enough for the
capillary forces of the fluid to create vapour bubbles (plugs) and liquid slugs. Thus the
vapour plugs completely block the flow of the liquid. This keeps the plugs and slugs in a
linear arrangement within the tube. Heat transfer in a PHP is associated with liquid and
vapour motions induced by the pressure difference. Evaporation at a higher temperature
in the evaporator produces a higher vapour pressure. The same is the case for the
condenser where condensation and reduced temperature at the condenser cause a
decrease in pressure. The pressure imbalance in PHP forces the hot vapour and liquid
from the evaporator to the condenser. Subsequently, the cool vapour and liquid flows
from the condenser to the evaporator, resulting in an oscillating motion. The heat
transfer and fluid flow in a PHP are influenced by the diameter of the tube, number of
turns, orientation, fill ratio, working fluid and heat load. The experimental and theoretical
research on the study of fluid flow and heat transfer characteristics of PHP has
contributed to the thermal management of electronics substantially.

Dr. K Rama Narasimha


Professor and Head, Dept. of ME, KS Institute of Technology

Dr. K. Rama Narasimha obtained his Ph.D. from VTU. He is presently working as
the Professor & Head in the Department of Mechanical Engineering at K.S.
Institute of Technology, Bangalore. He has more than 20 years of teaching
experience at Graduate level of Engineering. Dr. Rama Narasimha has published
twelve papers in International Journals and few in International and National
conferences. He has received the award of most impressive paper of the year for
2011 from Emerald Publications for one his publications. He is the consultant
and is associated with many of the industries like M/S TUV Rheiland, a German
Certification company and M/s Avasarala Automation Ltd. He is working with
these organizations for many projects like development of Sodium Heat Pipe, the
development of hybrid solar – wind power generation. He is also a referee in an
international Journal by name Journal of Applied Fluid Mechanics. His areas of
interests are Heat Pipes, Solar and Wind Energy, CFD and Heat Exchangers.
Tailoring of Surface-Thermal-Fluid Interactions for
Managing Heat in Electronics
Convective heat transfer, either with or without phase change, involves momentum and
thermal based interactions between a surface and a fluid. Significant enhancements can
be achieved in convective cooling of electronics by tailoring these surface-thermal-fluid
interactions. This topic focuses on some of the recent and emerging developments in
engineered surfaces with tailored roughness and/or geometrical features, manufacturing
of these surfaces and their impact on convective cooling of electronics.

Dr. Krishna Kota


New Mexico State University, USA

Krishna Kota is an Assistant Professor in the Department of Mechanical and


Aerospace Engineering at the New Mexico State University. Prior to this
appointment, he worked in industry as a Research Scientist at Bell Labs and as
a Postdoctoral Research Fellow at the Georgia Institute of Technology. He
obtained a Doctor of Philosophy in Mechanical Engineering from the University of
Central Florida. His research interests are in fundamental study and tailoring of
surface-thermal-fluid interactions for enhancing single-phase and phase change
thermal transport, with applications in electronics thermal management, energy
systems, space transportation, and water.