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Circuitry designed by LAGUISMA ELECTRONICS, Baguio City.

The values are for any power rating from 50 watts to 150 watts (rms) at 8Ω load .
R1 33 kΩ R15 100 Ω R29 10 Ω 1w D4 9.1v Zener (optional)
R2 2.7 kΩ R16 100 Ω C1 2.2-4.7 μF/50v N.P. D5 9.1v Zener (optional)
R3 120 Ω R17 27 kΩ C2 390-680 pF Q1 BC327 / A992
R4 120 Ω R18 7.5 kΩ C3 220 μF/10-25v Q2 BC327 / A992
R5 68 Ω R19 820 Ω C4 120 pF Q3 2N4401 / S8050
R6 68 Ω R20 1kΩ “trimpot” C5 0.1 μF Q4 2N4401 / S8050
R7 390 Ω R21 220 Ω C6 0.1 μF Q5 A562 / BC327
R8 9.1 kΩ R22 150 Ω C7 0.1 μF /100v mylar Q6 ED1802 / BC327
R9 18 kΩ R23 620 Ω C8 1.0 μF /50-100v Q7 2N5551
R10 33 kΩ R24 330 Ω C9 1.0 μF /50-100v Q8 2N5401
R11 1.2 kΩ R25 330 Ω C10 7-10 pF Q9 2N5551
R12 220 Ω R26 2pcs 0.5 Ω 1w D1 LED (any color) Q10 H9013 / 2N4401
R13 220 Ω R27 2pcs 0.5 Ω 1w D2 1S2471 Q11 2N5401
R14 820 Ω R28 10 Ω ½ w D3 1N4003-1N4007 Q12, Q13 (see notes below)
Note: Unless otherwise indicated, all resistors are ¼ watt, 5% tolerance. Coil L1 is made up
of 15-20 turns #18AWG magnet wire wound on a 5/16-inch diameter coil form.

Power transistors Q12 and Q13 are any N-Channel MOSFET, or IGBT devices with
a current capacity of at least 15 Amperes and a breakdown voltage not less than 200
volts. Some examples are: 2SK2837, IRFP460, 5020BN, ON32N25, SKW15N60.
The power supply may have the same rating as the popular SERIES 2 amplifier.

Note: The PCB is so designed that the terminal leads of type TO-3Px (TO-218
or TO-247) MOSFET or IGBT power transistors, such as 2SK2837, IRFP460,
5020BN, or SKW15N60 may be mounted directly on the board. This will
minimize “flying leads” for the power mosfets which may cause oscillations.
1. Mount the correct parts following the layout
guide. Do not connect the power
2. Connect the circuit board to the power supply
made for it. See to it that the input ground
connection is not left out. The output ground
does not have to be connected in the adjustment procedure. Never connect a
jumper between input and output ground.
3. Apply power, and check for abnormal warming of components. Only Q8 and
Q9 should be slightly warm.
4. Measure the output offset voltage (DC voltage between ground and the output
terminal). Readings should be less than +/-50 mV. If the reading is greater than
50 mV but less than 300 mV, check for errors at the differential circuit stage.
(Try interchanging Q1 and Q2). If the readings are high (bordering in volts),
mistakes in component or the PCB board are apparent.
5. If the offset voltage is less than 50 mV, proceed to adjust R20. Connect a
voltmeter so as to read the VCE of Q10. Adjust R20 until a reading of about 3.5
to 4.0 volts is obtained. At this point, it is safer not to exceed four volts.
6. Put off the power supply and connect the MOSFET transistors. If the MOSFETS
cannot be mounted directly on the module, see to it that wires connecting the
pins to the module be as short as possible, otherwise instability may occur. It is
imperative that the MOSFET transistors be mounted to an appropriate-sized
heatsink. Check also that the transistors are insulated from the heatsink
especially if the heatsinks are directly mounted on the chassis.
7. With the MOSFET transistors mounted, reapply power and check that a voltage
drop of about 2.0 to 3.0 volts is present across R23.
8. Finally, readjust R20 to insure that less than 5 mV is read across R26 or R27.
This finishes the adjustment.
For best performance, the amplifier may be readjusted for minimum crossover distortion.
Follow the procedures below:
1. Play music for about 10 to 15 minutes at moderately loud levels. This will heat up the
power MOSFETS to a normally warm temperature.
2. Cut off the sound and connect a voltmeter across R26 and R27 (0.5 ohms total
3. Adjust R20 until a reading of about 10 to 20 mV is attained. This sets an idle current of
the power MOSFETS of about 20 to 40 mA. The presence of an idle current in the
output transistors will decrease the crossover distortion, which will make the sound of
the amplifier cleaner especially the high frequencies. Do not increase the idle current
too high, as the power MOSFETS will easily become hot unless they are mounted in a
large heatsink or equipped with cooling fans.

PCB size is 2.25” x 4.0” (57mm x 100mm)

Actual size foil pattern.

Cut out the foil pattern and tape its edge securely to an equal size PCB. With a
center punch (a sharp nail will do), mark the holes for the components by punching
through the foil pattern. This insures the accurate position of the components.
Remove the foil pattern, and with a waterproof pentel pen, connect the appropriate
mark for the holes, copying the foil pattern as guide. The PCB is now ready for
etching. Finally after drilling, apply a thin coat of plastic varnish.


The component parts, especially the transistors, were dictated by the availability of
these items here in the Philippines. They can be found in any electronics store here
and are quite cheap.
The small signal transistors may be replaced with any number in your country as
long as they have high enough breakdown voltage and an hfe not less than 100.
With the exception of the neutralizing capacitors C4 and C10, the other capacitors
may have values near the suggested values. C5 and C6 are best using low voltage
tantalums. C7 may be mylar or polystyrene. C8 and C9 may have any value from
0.1uF to 10 uF and a voltage rating not less than the supply voltage
Resistors R26 and R27 are flame-proof type and may have any value up to 0.5 ohms,
2 to 5 watts. Do not use wire-wound types as they are inductive, not suitable for the
power mosfets.

To increase the power rating of this circuit, consult

Baguio City, Philippines

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