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DCY2.782.

7700WC/E-A00

CTS-7700
Digital Ultrasound Imaging System

SERVICE MANUAL

SHANTOU INSTITUTE OF ULTRASONIC INSTRUMENTS, INC.


SHANTOU, CHINA
CONTENTS

1. System Composition and Technical Specifications…………….…….… 1-1

1.1 System Composition….…………………………………………………………………………… 1-1

1.2 Technical Specifications….………………………..………..……………………………………. 1-1

2. System Working Principle…...…………………………..………………………………... 2-1

2.1 Brief Introduction of Working Principle……………………..…………………………………… 2-1

2.2 Introduction of PCB……………………..……..…..……..……. ……………………………….. 2-3

2.2.1 Control Panel………………………………………….……………………………………… 2-3

2.2.2 Digital Processing Board..…………………………………..………………………………. 2-6

2.2.3 Order and Amplification Board.……………………………..……………………………… 2-13

2.2.4 Probe Interface Board………………………………………..……………………………… 2-19

2.3 Interconnection Signal List Between PCBs…...………………………………………………... 2-25

2.3.1 Probe Interface Board………………………………………..………………………………. 2-25

2.3.2 Order and Amplification Board……………………………..……………………………….. 2-27

2.3.3 Industrial Control Board..…………..………..………………………………………………. 2-29

2.4 Connection Diagram Between PCBs……………………………………………………………. 2-30

2.5 Disassemble Instruction..………………………………………………………………………… 2-31

2.5.1 General………………………………………………………………………………………… 2-31

2.5.2 Disassemble Plastic Housing..……………………………………………………………… 2-32

2.5.3 Disassemble Keyboard…..………………………………………………………………….. 2-34

2.5.4 Disassemble Rear Panel….………………………………………………………………… 2-35

2.5.5 Disassemble industrial control board……...……………………………………………….. 2-36

2.5.6 Disassemble PR board and RVA board……………………………………………………. 2-37

2.5.7 Disassemble Power Supply and Hard Disk…...…………………………………………… 2-38

2.5.8 Disassemble MONIT Board…………………………………………………………………. 2-39

2.5.9 Disassemble FEP Board…………………………………………………………………….. 2-42

2.5.10 Assemble Schematic of Main Unit………………………………………………………….. 2-42

2.6 Installation Instruction for Computer Main Board (Industrial Control Board).. ……………… 2-48

I
2.6.1 Appearance of Computer Main Board..…………………………………………………… 2-48

2.6.2 Interface Position Map..…………………………………………………………………….. 2-48

2.6.3 Installation of System Memory….…………………………………………………………. 2-49

2.6.4 USB Port……………………………………………………………………………………… 2-49

2.6.5 IDE Port……..……………………………………………………………………………….. 2-50

2.6.6 Floppy Disk Port…..…………………………………………………………………………. 2-51

2.6.7 Display Port...………………………………………………………………………………... 2-52

2.6.8 Network Port…………………………………………………………………………………. 2-52

2.6.9 Keyboard and Mouse Port..……….……………………………………………………….. 2-53

2.6.10 Power Supply Port.…….…………………………………………………………………… 2-53

2.6.11 Fan Port..……….……………………….…………………………………………………… 2-55

2.6.12 Status Indication Port……………………………………………………………………….. 2-55

2.6.13 TV Output Port……………………………………………………………………………….. 2-56

3. Troubleshooting………………………………………………..……………..…..….…….. 3-1

3.1 PCB Function and Potential Failure……………………………………………………………... 3-1

3.1.1 Main Function and Potential Failure of Probe Interface Board…………………………... 3-1

3.1.2 Main Function and Potential Failure of Order and Amplification Board………………… 3-2

3.1.3 Main Function and Potential Failure of Digital Processing Board……………………….. 3-4

3.1.4 Main Function and Potential Failure of Power Supply Module………………………….. 3-7

3.1.5 Main Function and Potential Failure of Control Panel …………………………………… 3-8

3.1.6 Main Function and Potential Failure of Computer Main Board…………………………... 3-11

3.2 Common Failure and Troubleshooting………………………………………………………….. 3-12

3.2.1 System Cannot Start Up……………………………………………………………………... 3-12

3.2.2 Lowered Image Quality………………………………………………………………………. 3-14

3.2.3 Abnormal Image………………………………………………………………………………. 3-14

3.2.4 Failure Analysis on Monitor………………………………………………………………….. 3-16

3.2.5 Other Common Failures and Troubleshooting…………………………………………….. 3-20

4. Software Maintenance....…….……………………………………………………….……. 4-1

4.1 System Update...…….……………………………………………………………………………. 4-1

II
4.1.1 Update System Online.………………………………………………………………………. 4-1

4.1.2 Update System from USB disk……………………………………………………………… 4-3

4.1.3 Network Setup.……………………………………………………………………………….. 4-3

4.2 Software and System Recovery.…….…………………………………………………………… 4-4

4.2.1 Software Recovery..…….……………………………………………………………………. 4-4

4.2.2 System Recovery and Backup..…….………………………………………………………. 4-5

4.3 Creation of USB Startup Disk and Batch File.…….…………………………………………… 4-17

4.3.1 Creation of USB Startup Disk………………………………………………………………... 4-17

4.3.2 Create Batch File ( AUTOEXEC.BAT)……………………………………………………… 4-20

4.4 Troubleshooting...…….…………………………………………………………………………… 4-21

4.5 Collect Information...…….………………………………………………………………………... 4-26

III
System Composition & Technical Specifications

Chapter 1
System Composition & Technical Specifications

1.1 System Composition

The system as shown below consists of a main unit, an operation panel, probes and

peripheral devices. The main unit includes Probe Interface Board, Order and Amplification

Board, Digital Processing Board, Control Platform, Monitor and Power Supply.

Main Unit
Ultrasound Monitor
Receive/Transmit
Probe 1
Order Front-end
and Image Data
Probe Digital USB Port
Ampli- Control
Interface Processing Platform
fication Board Control
Probe 2 Board Network Port
Board

Video
Output
Operation
Power Panel

Fig. 1-1 Block Diagram of System Composition

1.2 Technical Specifications

For detailed system specifications, please refer to the system operation manual.

1-1
System Working Principle

Chapter 2
System Working Principle

2.1 Brief Introduction of Working Principle

The fundamental working principle of the main unit is as follows:

The Probe Interface Board receives transmit excitation signals from the Digital Processing

Board and generates transmit high-voltage pulse through high-voltage drive circuit. The

high-voltage pulse then is sent to the working elements of the probe to generate

ultrasound through the Probe Interface Board. The echo from the ultrasound during

propagation in human body is received by the same group of working elements and

converted into feeble echo electric signals, which will be sent to the Order and

Amplification Board through pre-amplification. There are two probe connectors available

on the Probe Interface Board, to which two probes can be connected at the same time.

The T/R control FPGA on the Digital Processing Board yields transmit excitation signals of

the current transmission based on control signals. This group of signals is then sent to the

Probe Interface Board. The pre-amplified echo signals from the Probe Interface Board is

ordered, and sent to the Digital Processing Board after two-step TGC amplification.

The echo signals are converted into digital signals via ADC by the Digital Processing

Board, and further into digital image signals after a series of processing, including beam

focusing, aperture control, dynamic apodization and beam forming, dynamic filtering,

dynamic range conversion, demodulation, persistence processing and scan conversion

and sent to the Ultrasound Control Platform through the Digital Processing Board.

The Digital Processing Board on one hand transmits the digital image signals to the

Control Platform, on the other hand receives control information from the Control Platform

2-1
System Working Principle

and generates corresponding control data to achieve control of the front end.

The Control Platform is the management center of the whole system control, which

receives operation commands from the control panel to manage the whole system control

in accordance with the current system state. The other functions the Control Platform

fulfills also include measurement and calculation, interface display and video processing,

management of patient data and images, control of storage, printing and communication.

The wiring diagram of the whole system is shown below:

24cm
Monito
r tube

23

22

CH5
CH4
12 Monito CH8
r boar
d
CH6

20
14 4
13 XS1 Key XS8 Adjus
board tin g plate
XS3 XS2
XS2
17
d

XS4
ar
bo

XS1 21
e
ob
pr
3
6

XS18
5

XS8
XS
XS

ar ol l
XS

bo ntr tria
d
ar

co d u s
bo
d

4
ar

In
g
PR

XS

15 10
in
bo

digital Hard di
ify

board sk
e

pl

19
ul

Am
XS
od
m
er

3
w

XS

11
Po

16
7
XS11
XS10 8
XS12 4P p o
wer
XS9 ATX po
20P p wer
ower

Rear pa
nel
6

2
1 5
3

18

1— Internal AC Wire 7— PS/2 and Start-up Wire 13— +12V Fan Wire 19— ±5V, ±12V, HVC Power Wire
2— Extended Network Card Wire 8— COM2 Wire 14— +5V, +12V Power Wire 20— Contrast & Brightness Adjust Control Wire
3— Extended USB Wire 9— Print Control Wire 15— ±60V Power Wire 21— Contrast & Brightness Adjust DIsplay Wire
4— Extended VGA Wire 10— Front-end Data Wire 16— Hard Disk Data Wire 22— Deflecting Coil Connecting Wire
5— Power Indicator Wire 11— Hard-disk Data Wire 17— Keyboard Data Wire 23— Monitor Tube High-voltage Wire
6— Video Print Wire 12— +15, +30V Power Wire 18— External AC Power Wire

Fig. 2-1 Wiring Diagram for Whole System

2-2
System Working Principle

2.2 Introduction of PCB

2.2.1 Control Panel

2.2.1.1 Functional Description

The Control Panel as shown below in Fig. 2-2 consists of a keyboard (KB), a silicon-gel

membrane of the keyboard, a keyboard interface board (KBIF) and a trackball.

Trackball

Industrial
ADC0809
Control Board
8 Gain control
potentiometers Single chip
Micro-
ADC0809
Computer
Control
logic
Encoder 1 Decoder 1

Additional Serial
Encoder n Decoder n FEP Board
logic Interface
circuit

Key Array Scanning


Toggle Switch Logic
FPGA

Operation Panel Main Unit

Fig. 2-2 Diagram of Control Panel

The keyboard mainly includes a printed circuit board (PCB) key array. Two key contact

points that are directly formed by exposed copper with gold plating on the printed circuit,

and an LED on each key for backlight. The keyboard button silicon gel membrane covers

on the keyboard. When the key on the silicon gel membrane is pressed, the conductive

silicon under the keys will connect the two contact points on the PCB to complete the key

operation for other circuit inspection.

The Keyboard Interface Board is the primary connection of control knobs, TGC adjust

potentiometers, and the required control circuit for the control panel. The primary task of

the Keyboard Interface Board is to monitor all the actions on the receiving panel, converts

them into established protocols and sends them to the main unit. Meanwhile, it receives

various control signals from the main unit and controls the related circuits on the Keyboard

2-3
System Working Principle

Interface Board.

The displacement signals directly outputted from the trackball are PS/2 protocol signals,

which will be combined with other signals to XS4 via XS8 plug on the Keyboard Interface

Board. XS4 plug is connected to the FEP board via a 34-core cable, and XS10 plug on the

FEP board is connected to the PS/2 port on the Industrial Control Board via another cable.

There are several control knobs and subsection gain controls on the keyboard. Configure

an FPGA (XCS10XL-TQ100) as a logic interface, a single chip microcomputer (also called

micro controller unit, MCU) AT89C51-24JI as the overall control and protocol conversion,

and RS-232 as the communication interface. Use an MAX232 as switchover between TTL

level and RS-232 level.

The MCU of the keyboard controls the FPGA to output line-scanning signals, reads array

signals from P1 on the MCU to obtain key information, converts it into established

protocols and sends it to the main unit. All the line and array signals on the Interface Board

are connected to the keyboard via XS1.

All the interfaces are connected to the FEP board through XS4 on the Interface Board,

and XS4 also provides the power supply for the keyboard board. The power input is +5V,

and the measuring point is +5V. All kinds of signals are connected to the corresponding

ports on computer main board via the FEP board.

Because the working voltage of FPGA is +3.3V, the voltage converting circuit is configured

to convert the voltage from +5V to +3.3V required by the FPGA. The converting

component adopted is MIC39100.

The control knobs are placed on the keyboard panel. Using encoder OAK-700, 5 pairs of

orthogonal signals outputted from 5 encoders are connected to the FPGA for decoding.

The encoder actions are converted into enumerated data by using the FPGA built-in

decoder as an interface. The enumerated results are read in by the MCU, converted into

established protocols and sent to the main unit via the serial interface.

The subsection gain controls use sliding potentiometers, which are installed on the

2-4
System Working Principle

interface board directly. The sliding end voltages of the 8 potentiometers are connected to

ADC0809 and converted into digital signals. Then the signals are read in by the MCU and

converted into established protocols and sent to the main unit via the serial interface.

2.2.1.2 Introduction of ADC0809

ADC0809 is an 8-bit A/D converter with an 8-channel analog switch, which has a universal

microprocessor interface. The 8-channel analog switch selects any channel of input and

connects to the converter via a 3-bit address decoder. The time needed for each A/D

conversion is about 100us. FPGA generates control signals to control ADC0809 to convert

the voltage input of the 8-channel TGC alternatively and saves the decoded results in the

FPGA temporarily, which will be read in for comparison by the MCU if required.

On the other hand, various control orders are sent as per the established protocols to the

keyboard via the serial port, light control and button sound for example. The light control is

placed on the keyboard panel, with the control signals (high for off, low for on) from the

71st pin of the FPGA sent to the voltage regulation circuit to control the output voltage of

LM1084IS-ADJ, which will be transmitted to the LED on the keyboard panel via XS1 to

control on/off of the backlight; The buzzer is placed on the Keyboard Interface Board. The

level signal from the 9th pin of the FPGA after being driven by D11 (74F14) controls the

buzzer.

The pin encapsulation drawing of the major components is displayed below:

2-5
System Working Principle

LM1084IS-ADJ

AT89C51

ADC0809CN

Fig. 2-3 Pin Encapsulation of major Components

2.2.2 Digital Processing Board

The primary functions of the Digital Processing Board (DPB) include transmitting and

receiving controls, A/D conversion, digital beam forming, dynamic filtering, tissue imaging

processing, digital scan conversion, system control, PCI bus interface and also circuit for

voltage transform. The DPB receives multi-channel analog ultrasound echo signals from

the front-end processing module, goes through A/D conversion, and forms a channel of

digital signals through digital beam-forming in combination with control signals from the

Control Interface Module. After signal processing such as dynamic filtering and tissue

imaging, these signals then will be sent to the DSC part and converted into corresponding

display frame shape. Finally, the image will be sent to the Control Interface Module frame

2-6
System Working Principle

by frame. The Control Interface Module is a bridge between the Computer Module and the

Ultrasound Part. For the computer module at the upper level, it receives all kinds of data

from computer software via PCI bus, decomposes and distributes them to modules and

simultaneously yields control signals per requirements to control working of the whole

Ultrasound Part; for the Ultrasound Part at the lower level, it receives full frame image

signals from the DSC module and sends the image signals to the Computer Module via

PCI bus.

Based on Y_SYNC signals from the system control module and a series of parameters,

the T/R Control Module will configure the states of high voltage switch and folding matrix

switch at the front end according to related parameters when Y_SYNC is at low level.

When Y_SYNC signals turn high from low level, multi-channel transmit pulses are

outputted from FPGA and converted into high-voltage pulse excitation probe via the

high-voltage exciting circuit on the Probe Interface Board, thus to achieve an ultrasound

transmission. The ultrasonic signals reflected from tissues are amplified through the

pre-amplifier on the Probe Interface Board, and transmitted through two-level time gain

compensation amplification circuit on the Amplification Board, and the output echo signals

after symmetric folding are sent to the Digital Processing Board.

Having been sent to the Digital Processing Board, the multi-channel analog echo signals

are converted into multi-channel digital signals via A/D conversion, and sent to the

Beam-forming Module. As per relevant control parameters, the multi-channel digital

signals are delayed and added by the Beam-forming Module to achieve focusing function

of ultrasound receiving.

One essential problem of ultrasound diagnosis is that the relationship between

parenchyma (soft tissue) ultrasound attenuation and frequency is approximately in

linearity. Because the probes used for the system are broad-brand, center frequency of

transmit excitation signals will shift down as ultrasonic pulse transmits deeper. In order to

improve image quality, the near field receives high-frequency echoes only to improve

resolution, while the far field only receives low-frequency echoes to improve S/N ratio. A

time-variable band-pass filter is required, thus a Dynamic Filter Module is configured to

2-7
System Working Principle

achieve this function.

The data going through dynamic filtering are sent to the Tissue Imaging Processing

Module, the functions of which are to optimize ultrasound images. The functions, including

dynamic range conversion, logarithm compression, gray scale mapping, smoothness

enhancement and lateral filtering, significantly improve ultrasound image display quality,

which are conducive to better clinical diagnosis. There is an additional transmit voltage

control signal D/A output on the Dynamic Filter Module. The Dynamic Filter receives 8-bit

control information from the system Control Module and outputs it to the D/A part, sends to

the Power Module to control the transmit voltage outputted from the Power Module.

Meanwhile, Time Gain Compensation curve is sent out from the same module. After D/A

conversion and buffering, it is sent to the Amplification Board to control the corresponding

time gain compensation circuit.

Having been processed by the Tissue Imaging Processing Module, the ultrasonic signals

are sent to the Digital Scan Conversion Module in the form of scanning lines. The Digital

Scan Conversion Module coverts the image signals in line form to images in the same

geometric shape of the actual ultrasound scanning range (e.g. sector image of the convex

probe, rectangular image of the linear probe), as per the current probe and other control

parameters. At the same time, the image will be processed with interpolation when

required. Finally, an image is acquired for display.

The system Control Module receives image signals from the Digital Scan Conversion

Module and buffers them before sending them to the PCI Interface Module frame by frame

at an appropriate time. Meanwhile, the system Control Module receives and processes

the control parameters from the PCI Interface Module and yields the overall control

signals for ultrasound scanning and distributes some of the parameters to the modules

that need these parameters.

The PCI Interface Module is an important bridge in the whole ultrasound system. It via the

communicates with the computer via the PCI bus and acquires all kinds of settings and

control commands from the computer system; at the same time it reads in various state

2-8
System Working Principle

information from the Digital Processing Board and sends them to the computer via the PCI

bus. The most important task of it is to receive image signals from the system Control

Module and send them to the computer via the PCI cable, and to obtain a real-time

ultrasound image in the computer. The ultrasound image will be displayed on the screen

after being processed in the computer application.

The power supply changeover circuit transforms the inputted +5V voltage on the Power

Module into +3.3V and +2.5V for low-voltage parts like FPGA or SRAM on circuit boards.

The power changeover adopted is TPS76833QPWP and TPS76825QPWP manufactured

by TI. The schematic is shown below.

Fig. 2-4 Schematic of Power Supply Changeover Circuit

Indicators for the major power supplies on the circuit boards are for indicating whether the

voltages are proper or not. If any of the indicators is off, please use a multimeter to

measure the corresponding measured points to verify if the voltage meets the rated

values.

2-9
104
104
104

C157

104
C87

104
C142
C158
C159

R5 103

104
C52

104
C56
104
C160

104
104
104 103 R8 R451

104
R69

C131
472

103
C132 C234 R231

104
202

C145
C84
C29
104
104 202

C161

C28
R68

R22
C233
R232 202 C78

156/25V
104
C80
104 202

C53
C236 104

104
C128 R27

104
C26
104

104
C51 C235 104

C162

C144
104
C136 104

C48
101

104
104

104
C55
104
104

C126
R67
R21 511
681 R463 331
C241

104
104 C243

C129
472 R10 104 681 R464 R31

C79
R35 472 R51 681 C127 R241 104
202 472 R9 681

104
681 R131 156/25V

C141 104
C147
R34 472 R52 681 104 C134 C27 104 681 R465
202 R242 472

R474

472 472
R32

R33 R30
681 R132 C471 222 C473
R48 472 C379 C33 C49 R25
681 681 104 C245 681
R133 156/25V 104
104 104 C36 156/25V

152
101
104 C244

R472
R471

C383
R53 156/25V

104
C138 104 104 202 104
C54 101 R75 C242 R473
C137 C149 104 152
Component composition:

202

C472

470
156/25V

152
152
101
222 C483

C232
R76
R72
R70
470 470
681 104
R47 472 104

C381

152
R477 R487
R475 C481
C140 152 104 156/25V

C382
R482
R481
104

R71
156/25V 102
104 104 C151 R74 C231
R485

152 R73
R78

C146
C380 R77

102 104 102 R484

104
104 C35 220uH 156/25V
C34 104 C12

104
C86 C491

101 104 C482


152 152 R483

C85
104 104 104 C493

L1 C92

104
103
C143

472
R83
The layout of major components:

104 C47

R6
220uH 156/25V

C64
C501
104 104 C503

L2 C94
C58 104

104
104

C125
104
C11
C88

104
C62 220uH 156/25V

C511
104

C60
L3 C95

C10
104 104 C513
472 R12 R411 681
104 C124

104
C44
104
R412 681 220uH 156/25V

104
472 R11

C521

C121
104 C46
472 R40

104
681

L4 C96
104 104 C523

C122
C15 104 R413
parts, SRAM part, resistors and capacitors.

R29 681 R161


220uH 156/25V

104

104
R7 103
C150 C152
C531
472 681 R162
R28 472 C69 104

L5 C97
104 104 C533

104
C89
R46 472 681 R163
C45 104

2-10
220uH 156/25V

C63
C541

C61 104
C68 C66

104
L6 C98
104 104 C543

C37
104
104 104

C14 104
R44 472

C13 104
681 R223 220uH 156/25V

104
C551

104
R19 472

R1 470
R2 470
R3 470
R4 470
R66 470
R65 470
681 R222

104
C114
R20 472

C67
681 R221 104 104 C553

L7 C99

C59
104 C139

C57
R18 472 R421 681

104
R79 R17 472 R422 681 220uH 156/25V
C561

512 R43 472

104
104

C30
C110
681

104
104 512 104 104 C563
C115 R85 104 R423
C18 220uH 156/25V

C38
C571

C116 104 104 C573

104

Fig. 2-5 FEP Welding Surface


104

104
C65

C50
220uH 156/25V

156/25V
C73
C581

104
C154
104 C39 C70 104 104 C583
104 104

104
220 R89

C17
C16 104

C72 220uH 156/25V


C591

104
104 C43

C153
104 104 C593
104 C130 R431 681
104 C120 R16 472
C71 104

R15 472 R432 681 220uH 156/25V


C601

R42 472
C25 681 104 104 C603
L8 C100 L9 C101 L10 C102 L11 C104 L12 C105

104 C133 104 R433


C117 104 R84 000

104

104
C40

C42
201 R101 104 C119 R49 R36
201 R102 R64 000 000 000
104 C135 R37
000
R80 R63 000 000 000 R38
104 C103 R50
R62 000 R54 000 000
R26 472 C118 681 R211 R61 000 R55 000 000
R24 472 104 681 R212 R60 000 R56 000 R39
104 C82
R45 472 681 R213 104 C148 R57 000
201 R91
104
C155

R58 000
201 R92 104

C81
156/25V
R59 000
104 C93 C41

C4

R81 201 104 C91 104 C163


R82 201

156/25V
C83 104 104 C164

C111 156/25V
C6
C8

104
201 R87

156/25V
331 R88
The components on the Digital Processing Board mainly include power supply

changeover, A/D converter part, FPGA part and its configured FLASH ROM, signal drive
System Working Principle

156/25V
C5

104 C90 473/500V X 3


C3
C2
C1

104
104
104

201
331
201
331
C7

156/25V
156/25V

156/25V

C112
R121
R122
C123
R111
R112
C113

C9 C21
System Working Principle

1A 5 10 15 20 25A 1A 5 10 15 20 25A WW17-215 X 6

V11
V10

V12
V8

V9

V7
DHB-RB100-S13NN DHB-RB100-S13NN

D1 5 10 15 20 D25 D1 5 10 15 20 D25
XS4 XS5

U72 U71 U70 U69


XS3 XS2
D25 20 15 10 5 D1 D25 20 15 10 5 D1 74LVC245A 74LVC245A

74LVC245A 74LVC245A
DHB-RB100-S13NN DHB-RB100-S13NN

74LVC245A

U67
25A 20 15 10 5 1A 25A 20 15 10 5 1A
U46
GND

74LVC245A
AD712JR AD712JR

U48

U47

U66
101 R601
104 C604
104 C602

101 R591
104 C594
104 C592

101 R581
104 C584
104 C582

101 R571
104 C574
104 C572

101 R561
104 C564
104 C562

101 R551
104 C554
104 C552

101 R541
104 C544
104 C542

101 R531
104 C534
104 C532

104 C522

101 R511
104 C514
104 C512

101 R501
104 C504
104 C502

101 R491
104 C494
104 C492
101 R521
104 C524

74LVC245A
XC2S200-5PQ208

U65
NS-1*2
XS6
AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057
U60 U59 U58 U57 U56 U55 U54 U53 U52 U51 U50 U49
U41
U43 U42 GND

NS-1*2
XS11

XS13
1
C32

1
XS8

2
U68
XS12
104
NF3 473

1 XCF02S
XC2S200-5PQ208 XC2S200-5PQ208 XC2S200-5PQ208
C23
104
473

AT27C1024-70JI
NF4 AT27C020-70JI
JS-1001-14
JS-1001-11

C22
104

LH-34R
NF5 NF1 NF2

473 D45
D40
1
473 U34 U36 U35 U81 U33 U31 U73 1
XCF02S XCF02S XCF02S IDT74FCT3807 XCF02S XCF02S 74LVC245A
473 V13 GND
11 14
HZ5C1
C31 104 1

WW17-215 X 6
U25 IS63LV1024L-12H IS63LV1024L-12H DAC0800LCM DAC0800LCM
U18 U17 U20 U19 U75 LIGHT1 U27 U26
1 50.0000MHz U24 U23
74LVC245A 74LVC245A 74LVC245A LIGHT2
V4
JS-1001-10
BH-10S

33
34
74LVC245A 74LVC245A V3 U13
V2

NS-1*2
XS15
V1
GND IS63LV1024L-12H
AD712JR
XS9 U21 U16 U2

U15
IS61LV12816L

10 XC2S200-5PQ208
XS10
U28

XS14

6
NS-1*2

DAC0800LCM
XC2S200-5PQ208 XC2S200-5PQ208 XC2S200-5PQ208
U11 U3

IS63LV1024L-12H

JS-1001-6
GND

XS18
LM1084

U14
XCF02S
U5

XS16
NS-1*2
IS61LV12816L

U30
U12 U22

1
GND
U29
LM1084

IS63LV1024L-12H
U76 U32 U6
74LVC245A XCF02S XCF02S XC2S200-5PQ208

U1
A1 A49 A61

RJB60DCHN-S578
U4 U8 U9 U10

B2 B48 B62
74LVC245A 74LVC245A
LM1084 LM1084 LM1084 LM1084 XS1 U74 U7
XS7

1 JS-1001-6 6

Fig. 2-6 FEP Component Surface

2-11
System Working Principle

Fig. 2-7 Silk-Screen Diagram of FEP (1174E) Board

Sockets and Connection:

The Digital Processing Board (DPB) also works as the connection bridge for the whole

system. The Probe Interface Board is connected to the DPB via sockets XS4 and XS5;

The Order and Amplification Board is connected to the DPB via sockets XS2 and XS3; the

Industrial Control Board of the Computer Module is connected to PCI socket on the DPB

via PCI socket XS1; The Keyboard Board is connected to the DPB via a 34-core socket

XS8; the power from the system Power Module is inputted to the DPB via sockets XS11

and XS12 before it is distributed to other ultrasonic circuits. Some of the signals from the

keyboard send keyboard information to the Industrial Control Board via sockets XS9 and

XS10 on the DPB as well at the same time.

2-12
System Working Principle

For the specific sockets, other circuit boards or modules, please refer to Fig. 2-1.

2.2.3 Order and Amplification Board

2.2.3.1 General

The Order and Amplification Board consists of the impedance transform circuit 3904, the

order folding matrix switch circuit MT8816 or CD22M3494, the two-step TGC amplification

circuit AD602, the drive and amplitude control circuit AD817 and the control signal

interface circuit SN74LVC245. The diagram for the Order and Amplification Board is

shown below in Fig. 2-8. After the echo signals are sent from the Pre-amplification Circuit

on the Probe Interface Board and before the signals enter the Folding Circuit, the emitter

made up of primary 3904 audion follows the circuit, in order to enhance loading capacity

of the Pre-amplification Circuit output, which also serves for impedance transform.

Resettle
Impedance -ment
Preamp AD602 ADC
Transform Echos and
Echos Array Echos Driver RF Echos
Folded
Output
3904 Circuit
TGC AD817 Output
Audion
Amplifier Array
Array MT8816
Array

Control signals

Fig. 2-8 Circuit Diagram of Order and Amplification Board

The power voltages on the Order and Amplification Board are ±5 and ±12V. The

voltages of MT8816 or CD22M3494 and AD602 are ±5V. The voltages of 3904 and

AD817 are ±12V. The voltage of the Bus Interface Circuit SN74LC245 is +5V.

The channel parallel echo signals on the Probe Interface Board, after being pre-amplified

are ordered, with channel symmetry superposed and amplified, are finally sent to the

Digital Processing Board for A/D and following processing.

2.2.3.2 Order and Folding Circuit

The circuit adopted by the Order and Folding Circuit is CD22M3494E-MQ or MT8816

manufactured by INTERSIL, the chip of which has 16×8=128 analog switches. Its

2-13
System Working Principle

appearance is shown below in Fig. 2-9. The chip has 44 pins, which is very convenient for

connection. It can be connected with 16 inputs and 8 outputs, or 8 inputs and 16 inputs.

The input and output pins are controlled separately. AX0~3 control pins X0~15, and

AY0~2 control pins Y0~Y7. The DATA pin can be disconnected against access. When

DATA is “0”, the addressed switch is disconnected. When DATA is “1”, the addressed

switch is connected. The RESET signal can reset all the switches. When RESET is high,

all the switches are disconnected.

Fig. 2-9 Outside Drawing of CD22M3494E-MQ

2-14
System Working Principle

Fig.2-10 Sequence Chart of CD22M3494E-MQ

The configured sequence chart of CD22M3494E-MQ or MT8816 chip is shown above in

Fig. 2-10.

And the truth tables are showed below in Table 2-1.

2-15
System Working Principle

Table 2-1 Truth Table of CD22M3494E-MQ or MT8816

As the central element for each transmission varies with the difference in each line, the

task of order and folding is to link echoes of the Amplification Circuit corresponding to the

current transmitted central elements to the channel center, to link the echoes of the

Amplification Circuit corresponding to echoes of the current transmitted edge elements to

the edge channel, and the rest may be deduced by analogy. The channels not to be

compounded are linked to pin XX12, which is linked to 0.1uF capacitance to ground.

Finally, the output signals from CD22M3494E-MQ or MT8816 chip are the channel echo

signals going through channel symmetric superposition and ordering.

2.2.3.3 Two-step TGC Amplification Circuit

The output signals of the echo signals from the folding circuit are pre-amplified by the

two-step TGC Amplification Circuit composed of AD602 part array.

The internal block diagram of one channel of AD602 is shown below in Fig. 2-11.

2-16
System Working Principle

Fig. 2-11 Internal Block Diagram of AD602

Table2-2 Pin Definition of AD602

2-17
System Working Principle

The pin definition of AD602 is shown above in Table 2-2.

a) Main features of AD602:

z Each AD602 has two independent channels, namely two amplifiers;

z The gain dB value of each channel is in direct proportion to the control voltage;

z Low input noise 1.4nV/ Hz ;

z High bandwidth, with -3dB bandwidth at DC~35MHz;

z Each channel consists of a precise passive input attenuator and a fixed gain

amplifier (31dB);

z The input attenuator is controlled by control voltage (CHI-CLO), the control

sensitivity is: 31.25mV/dB;

z Power consumption of each channel is 125mW;

z Gain control range of each channel is: -10dB~+30dB.

b) Calculation equation ofAD602 gain control:

Gain (dB)=32Vg+10

Vg (V)=CHI-CLO

Range of Vg: -625mv ~ +625mv

If: CHI1=0V~1.35V

CHI2= 0.312V~1.35V

When CLO is about 0.625V, the gain that first-step AD602 acquires is about

–10dB~+31.07dB, and the gain that the second-step AD602 acquires is about

0~+31.07dB. The second control voltage works only if the gain in the first stage runs out.

Including pre-amplification, in theory the maximum gain of the entire channel can reach

82.14dB, and the gain variable range is -10dB~62.14dB. Due to the resistance between

steps, the gain may decrease several dB.

2-18
System Working Principle

After processed by the folding circuit and the two-step TGC, the RF echoes are driven by

high speed operational amplifier comprised by AD817, the output echo range is limited

below 1.2 V p − p to meet requirements of the latter analog parts.

2.2.3.4 Input Power Supply

a) +5VA:

+5V analog power supply for AD602, interface circuit and CD22M3494E-MQ or MT8816

b) –5VA:

–5VA analog power supply for AD602 and CD22M3494E-MQ or MT8816

c) ±12V: For AD817 chip circuit.

2.2.4 Probe Interface Board

2.2.4.1 Introduction of the Probe Interface Board (PIB)

The Probe Interface Board provides connectors between the transducers and the main

unit. Two probe connectors are available on the PIB of CTS-7700. Each connector has a

corresponding high-voltage switch, which is HV232 or like products from Hitachi. Each

PIB has a SIUI912x2 pre-amplification and high-voltage pulse drive thick- film circuit.

There are several power voltages on the PIB:+5, ±12V, high-voltage switch power over

±60V and +HV. +5V voltage is used for logical configuration of high voltage switch, ±

12V for SIUI912x2 T/R circuit, +HV for transmit high voltage, the value of which is variable

between 0V~60V and above. The main unit provide excitation high-voltage pulse to

piezoelectric crystal array of the probe via the high-voltage switch array on the PIB,

pre-amplifies the ultrasound from the probe, and sends it to the Order and Amplification

Board. Another function of the high-voltage switch is selection of the current working

probe.

The top-level connection block diagram of the PIB is follows:

2-19
System Working Principle

156Pin High Voltage


Drive and
Connector Array A DIND0-3 DIN0-3
Echo A SN74LVC245
Probe A HV232

PROBE1

Preamp and ECHO


156Pin High Voltage HV Drive and Echo
Drive and HV generator
Connector Array B
Echo B SIUI912X2
Probe B HV232 HV Drive
Array
Two
PROBE2 100
Pin
PROBE1-2 PRS1-2
Sockets
PIDSEL1-2 SN74LVC245 PIDS1-2

PID0-7
SN74LVC245 PIDSEL2

DC Power DC Power
DC Power
Output Input
PIDSEL1 Filter
SN74LVC245

Fig.2-12 Schematic of Probe Interface Board

2.2.4.2 High-Voltage Switch Circuit

The high-voltage switch adopted for CTS-7700 is HV232 manufactured by Supertex or the

same chip type with the same encapsulation manufactured by Hitachi. Each probe

connector is linked to a high-voltage switch and independent to its corresponding

high-voltage switch array.

Each high-voltage switch has 8 channels, which are connected to 8 elements, with the

8-channel outputs merged in parallel into 2-channel outputs

The configured sequence diagram of HV232 high-voltage switch is shown below:

2-20
System Working Principle

Fig. 2-13 Configured Sequence Diagram of HV232 High-voltage Switch

Each high-voltage switch has 48 pins. Definitions for the pins are as follows:

a) Ultrasonic Signal Pin:

Pins 1, 3, 5, 8, 10, 12,14, 16, 18, 20, 22, 39, 41, 43, 45, 47 are signal pins

connected to element SWx.

b) Parameter Setup Pin:

Pin 33 is parameter input pin Din.

Pin 37 is parameter output pin Dout.

c) Power Connection Pin:

Pin 24 is connected to over +60V.

Pin 25 is connected to over -60V.

Pin 29 is connected to +5V.

Pins 27 and 28 are grounded.

2-21
System Working Principle

d) Control Signal Pin:

Pin 36 is connected to chip selection signal CLR. When connecting this pin to “0” is

selected, Pin36 of the high-voltage switches corresponding to each probe are

connected together as a select signal for the working probe.

Pin 35 is a logical input enabled port/LE. When “1” is connected, parameter setup

this chip for is allowed.

Pin 34 is a logical input clock. The control data series shifts 1 bit whenever a clock

comes.

e) Void Pin:

Pins 2, 4, 6, 7, 9, 11, 13, 15, 17, 19, 21, 23, 26, 30, 31, 32, 38, 40, 42, 44, 46, 48

are void, which are suspended.

The internal logical circuit of HV232 is shown below in Fig. 2-14:

Fig. 2-14 Internal Logic Circuit of HV232

2-22
System Working Principle

The working process of high-voltage switches:

The parameter setup pins of each group of high-voltage switches are in serial connection.

DOUT of the first high-voltage switch is linked to DIN of the second high-voltage switch.

The working state of the high-voltage switches should be preset for the preset period of

each line transmission. When the corresponding data of this channel is “1”, the input of

this channel is connected to output. When the corresponding data of this channel is “0”,

this channel is disconnected with output.

The maximum clock setup of high-voltage switch is 5MHz, namely 200ns. The

high-voltage switch control data is 4 bits, namely D0~D3. DIN of the first high-voltage

switch in each group is linked to one of these bits. For example: D0 is linked to DIN of the

first high-voltage switch in the first group, D1 to DIN of the first high-voltage switch in the

second group, D2 to DIN of the first high-voltage switch in the third group, and D3 to DIN

of the first high-voltage switch in the fourth group. The parameters are outputted from the

DIN of Pin 16 of the first high-voltage switch in each group, and DOUT of Pin 20 serial

shifted to DIN of the next switch. The rest may be deduced by analogy. All the current

work state setups are completed via 32 shift clocks. What shall be closed are closed,

and what shall be ducted are ducted.

The truth table of HV232 is shown below in Table 2-3.

Table 2-3 Truth Table of HV232

2-23
System Working Principle

2.2.4.3 Transmit Drive and Echo Pre-amplification

In the CTS-7700, the yield of transmit drive high-voltage pulse and the echo

pre-amplification are processed in the SIUI912x2 array. A piece of MOS field-effect tube in

each transmit circuit serves as a switch, with one end connected to transmit high voltage

and the drive pulse of which is 0~12V. This tube is ducted as drive pulse comes, and

forms high-voltage pulse, which will connect to probe elements via high-voltage switch.

The ultrasound received is also from the same path. The echo will have about 20dB

amplification in the pre-amplification Circuit SIUI912x2. Then the echo signals are sent to

the subsequent TGC Amplification Circuit for amplification.

2.2.4.4 Interface Circuit of the Probe Interface Board (PIB)

The Interface Circuit on the PIB consists of two pieces of SN74LVC245. U18 is for driving

probe select signals PRS1~2 and probe code select signals PIDS1~2. The driven

PROBE1~2 are linked respectively to Pin 36 of two groups of high-voltage switches as

selection signals of the working probe, and the driven PIDSEL1~2 is linked respectively to

Pin19 of U19 and U20 as the probe code gating circuit for the two probes. When any of

the signals of PIDSEL1~2 is at low level, the probe code of SN74LVC245 is sent to the

bus, otherwise the output of it is at high resistance. U17 is for driving high-voltage switch

data DIND0~DIND3, clock STROBEP and enabling signal LED.

Description of input and output signals on the PIB: There are two 100-pin sockets on the

PIB linking to 2 corresponding sockets on the Digital Board.

Description of input power

a) VCC:

+5V analog power to Pin29 on high-voltage switch;

b) ±12V:

To Pin7 and Pin8 on SIUI912x2 respectively;

c) Above ±60V:

2-24
System Working Principle

To Pin24 and P25 on high-voltage switch respectively;

d) +HV:

Variable input high voltage, varying from above 0V~60V, linked to Pin2 of SIUI912X2 for

generating transmit high-voltage pulse.

2.3 Interconnection Signal List Between PCBs

2.3.1 Probe Interface Board

Table 2-4 Interconnection Signal List for Probe Interface Board XS4

Probe Interface Board XS4 (XS4)


Pin Signal Pin Signal Pin Signal Pin Signal
A25 GND B25 GND C25 GND D25 GND
A24 GND B24 GND C24 GND D24 GND
A23 +5VA B23 +5VA C23 +5VA D23 +5VA
A22 +5VA B22 +5VA C22 +5VA D22 +5VA
A21 GND B21 GND C21 GND D21 GND
A20 GND B20 GND C20 GND D20 GND
A19 -12V B19 -12V C19 -12V D19 -12V
A18 -12V B18 -12V C18 -12V D18 -12V
A17 GND B17 GND C17 GND D17 GND
A16 GND B16 GND C16 GND D16 GND
A15 +12V B15 +12V C15 +12V D15 +12V
A14 +12V B14 +12V C14 +12V D14 +12V
A13 GND B13 GND C13 GND D13 GND
A12 -NV B12 -NV C12 -NV D12 -NV
A11 -60V B11 -60V C11 -60V D11 -60V
A10 -NV B10 -NV C10 -NV D10 -NV
A9 GND B9 GND C9 GND D9 GND
A8 +PV B8 +PV C8 +PV D8 +PV
A7 +60V B7 +60V C7 +60V D7 +60V
A6 +PV B6 +PV C6 +PV D6 +PV
A5 GND B5 GND C5 GND D5 GND
A4 GND B4 GND C4 GND D4 GND
A3 +PV B3 +PV C3 +PV D3 +PV
A2 +HV B2 +HV C2 +HV D2 +HV
A1 +HV B1 +HV C1 +HV D1 +HV

2-25
System Working Principle

Table 2-5 Interconnection Signal List for Probe Interface Board XS5

Probe Interface Board XS5 (XS5)


Pin Signal Pin Signal Pin Signal Pin Signal
A25 GND B25 PID0 C25 GND D25 PID1
A24 GND B24 PID2 C24 GND D24 PID3
A23 GND B23 PID4 C23 GND D23 PID5
A22 GND B22 PID6 C22 GND D22 PID7
A21 GND B21 STROBEP C21 GND D21 LE
A20 GND B20 PRS1 C20 PRS3 D20 DIN0
A19 GND B19 PRS2 C19 PIDS3 D19 DIN1
A18 GND B18 PIDS1 C18 GND D18 DIN2
A17 GND B17 PIDS2 C17 GND D17 DIN3
A16 GND B16 DH2 C16 GND D16 DH1
A15 GND B15 DH4 C15 GND D15 DH3
A14 GND B14 DH6 C14 GND D14 DH5
A13 GND B13 DH8 C13 GND D13 DH7
A12 GND B12 DH10 C12 GND D12 DH9
A11 GND B11 DH12 C11 GND D11 DH11
A10 GND B10 DH14 C10 GND D10 DH13
A9 GND B9 DH16 C9 GND D9 DH15
A8 GND B8 DH18 C8 GND D8 DH17
A7 GND B7 DH20 C7 GND D7 DH19
A6 GND B6 DH22 C6 GND D6 DH21
A5 GND B5 DH24 C5 GND D5 DH23
A4 GND B4 DH26 C4 GND D4 DH25
A3 GND B3 DH28 C3 GND D3 DH27
A2 GND B2 DH30 C2 GND D2 DH29
A1 GND B1 DH32 C1 GND D1 DH31

2-26
System Working Principle

2.3.2 Order and Amplification Board

Table 2-6 Interconnection Signal List for Order and Amplification Board XS2

Order and Amplification Board XS2 (XS2)


Pin Signal Pin Signal Pin Signal Pin Signal
A25 GND B25 GND C25 GND D25 NC
A24 GND B24 RF8 C24 GND D24 NC
A23 GND B23 RF8 C23 GND D23 NC
A22 GND B22 GND C22 GND D22 NC
A21 GND B21 RF7 C21 GND D21 NC
A20 GND B20 RF7 C20 GND D20 GND
A19 NC B19 -5V C19 NC D19 -5V
A18 GND B18 RF6 C18 NC D18 -5V
A17 GND B17 RF6 C17 GND D17 GND
A16 NC B16 +5VA C16 NC D16 +5VA
A15 GND B15 RF5 C15 NC D15 +5VA
A14 GND B14 RF5 C14 GND D14 GND
A13 GND B13 GND C13 GND D13 GND
A12 GND B12 RF4 C12 GND D12 GND
A11 GND B11 RF4 C11 GND D11 GND
A10 -12V B10 -12V C10 -12V D10 -12V
A9 GND B9 RF3 C9 -12V D9 -12V
A8 GND B8 RF3 C8 GND D8 GND
A7 GND B7 GND C7 GND D7 GND
A6 GND B6 RF2 C6 GND D6 GND
A5 GND B5 RF2 C5 GND D5 GND
A4 +12V B4 GND C4 +12V D4 +12V
A3 GND B3 RF1 C3 +12V D3 +12V
A2 GND B2 RF1 C2 GND D2 GND
A1 TGC1 B1 GND C1 GND D1 TGC2

2-27
System Working Principle

Table 2-7 Interconnection Signal List for Order and Amplification Board XS3

Order and Amplification Board XS3 (XS3)


Pin Signal Pin Signal Pin Signal Pin Signal
25A GND B25 RF10 C25 GND D25 DCS4
24A GND B24 RF16 C24 GND D24 DCS3
23A GND B23 RF16 C23 GND D23 DCS3
22A GND B22 RF10 C22 GND D22 DCS2
21A GND B21 RF15 C21 GND D21 DCS2
20A GND B20 RF15 C20 GND D20 DCS1
19A GND B19 RF10 C19 GND D19 DCS1
18A GND B18 RF14 C18 GND D18 DAX3
17A GND B17 RF14 C17 GND D17 DAX3
16A GND B16 RF10 C16 GND D16 DAX2
15A GND B15 RF13 C15 GND D15 DAX2
14A GND B14 RF13 C14 GND D14 DAX1
13A GND B13 RF10 C13 GND D13 DAX1
12A GND B12 RF12 C12 GND D12 DAX0
11A GND B11 RF12 C11 GND D11 DAX0
10A GND B10 RF10 C10 GND D10 DAY2
9A GND B9 RF11 C9 GND D9 DAY2
8A GND B8 RF11 C8 GND D8 DAY1
7A GND B7 RF10 C7 GND D7 DAY1
6A GND B6 RF10 C6 GND D6 DAY0
5A GND B5 RF10 C5 GND D5 !TGATE
4A GND B4 GND C4 GND D4 RESSET
3A GND B3 RF9 C3 GND D3 DDATA
2A GND B2 RF9 C2 GND D2 STROBE
1A GND B1 GND C1 GND D1 STROBE

2-28
System Working Principle

2.3.3 Industrial Control Board

Table 2-8 Interconnection Signal List for Industrial Control Board

Industrial Control Board (XS1)


Pin Signal Pin Signal
A1 +5VP 1B NC
A2 NC 2B GND
A3 +5VP 3B GND
A4 +5VP 4B NC
A5 +5VP 5B +5VP
A6 INTA 6B NC
A7 NC 7B NC
A8 NC 8B NC
A9 NC 9B NC
A10 NC 10B REQ
A11 NC 11B NC
A12 GND 12B GND
A13 GND 13B GND
A14 GNT 14B NC
A15 RST 15B GND
A16 NC 16B CLK
A17 NC 17B GND
A18 GND 18B NC
A19 NC 19B NC
A20 AD30 20B AD31
A21 NC 21B AD29
A22 AD28 22B GND
A23 AD26 23B AD27
A24 GND 24B AD25
A25 AD24 25B NC
A26 NC 26B C_BE3
A27 NC 27B AD23
A28 AD22 28B GND
A29 AD20 29B AD21
A30 GND 30B AD19
A31 AD18 31B NC
A32 AD16 32B AD17
A33 NC 33B C_BE2
A34 FRAME 34B GND
A35 GND 35B IRDY
A36 TRDY 36B NC
A37 GND 37B DEVSEL

2-29
System Working Principle

Industrial Control Board (XS1)


Pin Signal Pin Signal
A38 STOP 38B GND
A39 NC 39B NC
A40 NC 40B PERR
A41 NC 41B NC
A42 GND 42B SERR
A43 PAR 43B NC
A44 AD15 44B C_BE1
A45 NC 45B AD14
A46 AD13 46B GND
A47 AD11 47B AD12
A48 GND 48B AD10
A49 AD9 49B GND
A50 NC 50B NC
A51 NC 51B NC
A52 C_BE0 52B AD8
A53 NC 53B AD7
A54 AD6 54B NC
A55 AD4 55B AD5
A56 GND 56B AD3
A57 AD2 57B GND
A58 AD0 58B AD1
A59 NC 59B NC
A60 NC 60B NC
A61 NC 61B NC
A62 NC 62B NC

2.4 Connection Diagram Between PCBs

For the connection diagram between PCBs, please refer to Fig. 2-1. The Industrial Control

Board diagram is shown below in Fig. 2-15:

2-30
System Working Principle

From main board

XS10

VGA wire
To print control plug

CH8
3
XS3 of the rear panel
2 7
4 To monitor CH8
From rear panel

Color
patch 3 S-start-up wire
8
wire
To main board
Color patch wire VGA1
KM1
LAN1
USB2
COM2
1
FP1

80-cores hard disk wire

Color patch wire

IDE1 11 To hard disk

4P-ATX

ATXPWR

6
J2

XS7
To video plug XS7
of the rear panel

Wire from ATX power

2 Network card wire 7 PS/2 and start-up wire


3 USB wire 8 COM2 wire
4 VGA wire 11 Hard disk data wire
6 Video print wire

Fig. 2-15 Connection Diagram for Industrial Control Board

2.5 Disassemble Instruction

2.5.1 General

2.5.1.1 This instruction covers disassembly of the system only. On how to assemble the

system, please follow the reverse procedures of disassembly.

2.5.1.2 The expression and meaning of all the screws involved in this instruction are

shown in the following examples:

Example 1: countersunk head screws, spec M3, metric length 6 mm, expressed as:

countersunk head screws M3X6.

2-31
System Working Principle

Example 2: screws assemblies, spec M4, expressed as: screws assemblies M4.

2.5.1.3 All the screws for disassembling are Phillips screws, so the operator of the

disassembly shall use corresponding Philips screwdrivers. Due to the heads of Phillips

screws have two types: shallow and deep, to avoid any damage to the screws and

consequent failure of screw disassembling, please select appropriate screwdrivers for the

screws when disassembling the screws. A small slotted screwdriver may be required

when disassembling some special parts.

Note: Generally, the screws we use are M3 or under M3 pan screws, as well as

under M3 (excluding M3) cheese head screws, whose Philips head are

shallow, while the others are deep.

2.5.1.4 Before disassembly, make sure that the power cable is unplugged, and all the

probes are disconnected and laid aside properly.

2.5.1.5 When unplugging the cables from the system, please mark the corresponding

plugs and sockets to facilitate plugging the plugs into the right sockets during reassembly.

2.5.1.6 During disassembly, the exterior plastic parts and the keyboard silicon-gel

buttons demounted shall be placed upon a bubble wrap bag or a PE foam, keeping them

away from the work area as far as possible to avoid any disfigurement caused by

disassembling other structural parts.

2.5.1.7 Due to updates of system parts and consequent structure changes, there might

be some tiny differences in disassembly of systems from different lots. This instruction

may not cover all these differences.

2.5.2 Disassemble Plastic Housing

2.5.2.1 Disassemble lower cover of back housing from main unit

The lower cover shall be disassembled following the steps below:

a) Unclench the left, right rubber stoppers on the back enclosure cover with a slotted

screwdriver. Remove two M4X8 pan screws fixing the back enclosure cover, and

2-32
System Working Principle

then remove the back enclosure cover.

Note: The left and right rubber stoppers are not symmetric. Please be

cautious to distinguish the left and the right ones for the sake of

reassembling them properly.

b) Turn the main unit 180 degrees to show its bottom up.

Note 1: Before turning over the main unit, lay a pad such as bubble wrap bag

or PE foam on worktable to avoid any damage to the plastic housing.

Note 2: For the upper cover of back housing of main unit, the side with no

probe connectors is vulnerable to pressure. Please pay special

attention when tuning the main unit over.

c) Remove six M4X8 pan screws fixing the lower cover of the back housing, and then

remove the lower cover of back housing.

d) After removing the lower cover of back housing, remove the front, left and right

cover for ventilation openings, and clean the dust off the dustproof nets.

2.5.2.2 Disassemble upper cover of back housing from main unit

After completing the operation in Section 3.2.1 (disassemble lower cover of back housing

from main unit), the upper cover of back housing shall be disassembled following the

steps below:

a) Turn the main unit 180 degrees to show its top up.

b) Remove two M4X6 pan screws on both sides of the upper cover of handle, and

remove the upper cover of handle;

c) Remove two M4X16 pan screws fixing the handle, and the reinforcing plate and the

lower cover of handle.

d) Unclench the left, right rubber stoppers at the back of the upper cover of back

housing with a slotted screwdriver. Remove two M4X8 pan screws and the back

enclosure cover.

2-33
System Working Principle

Note: The left and right rubber stoppers are not symmetric. Please be cautious to

distinguish the left and the right ones for the sake of reassembling them

properly.

2.5.3 Disassemble Keyboard

2.5.3.1 Disassemble keyboard form main unit

The disassembly of the keyboard from the main unit shall follow the steps below:

a) Unfold the keyboard by pressing the buttons at the top of the front frame and lay it

down horizontally. Unclench the two rubber stoppers at the top of the keyboard

upper housing with a slotted screwdriver, and remove two M3X12 cheese head

screws.

b) Turn the keyboard 45 degrees proximately. Hold on the projection of the lower

cover of the keyboard tightly. Press upon the left and right edge of the upper cover

of keyboard with two thumbs, and draw the lower cover of keyboard toward the

operator to displace it from the upper cover of keyboard. And then unclench the

fixing buckles on the left and the right with a slotted screwdriver to remove the

lower cover of the keyboard.

c) Turn the keyboard vertically. Remove three M3X10 screw assemblies at the bottom

left, then withdraw the left turning shaft.

d) Unplug all the flat cables connecting to the main unit, withdraw the left side of the

keyboard slightly, remove the right turning shaft from the right supporting fixture of

keyboard, and then remove the keyboard.

2.5.3.2 Disassemble parts from the keyboard

After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),

the parts of the keyboard shall be disassembled following the steps below:

a) Unplug the cable of the trackball. Remove two M3X8 screw assemblies fixing the

trackball to remove the trackball.

2-34
System Working Principle

b) Remove five knobs and eight slides on the keyboard with a slotted screwdriver, and

seven M3×20 screw assemblies of the KBIF board at the back of the keyboard.

Then remove the KBIF board.

Note: Please be cautious not to scratch the knobs or the keyboard surface

when unclenching the keyboard knobs. After the KBIF board is

removed, keep the seven braces of the KBIF board in place for

reassembly.

c) Having finished steps a) & b), remove all M3×6 screw assemblies on the KB board

at the back of the keyboard to remove the KB board.

Note: During disassembling the KB board, when splitting the positioning

nails at the back of the silicon-gel buttons embedded in the KB board,

special attention shall be paid to avoid breaking the positioning gel

nails.

d) Having removed the KB board, withdraw the silicon-gel buttons through the holes

on the plastic housing carefully.

Note: To prevent any scratch, the silicon-gel surface of the keyboard shall be

placed with the buttons upward.

2.5.4 Disassemble Rear Panel

2.5.4.1 Disassemble rear panel from main unit

After completing the operation in Section 2.5.2 (disassemble plastic housing), the rear

panel shall be disassembled following the steps below:

a) Remove six M3X6 screw assemblies in the right, left and upper parts.

b) Unplug all the cables connecting the real panel with the main unit, then

disassemble the real panel.

2.5.4.2 Disassemble platelets of the rear panel

After completing the operation in Section 2.5.4.1 (disassemble rear panel from main unit),

2-35
System Working Principle

all the platelets on the real panel shall be disassembled following the steps below:

a) Unplug the plug connecting the Fan Patch Board. Remove two M3×6 screw

assemblies and then remove the Fan Patch Board;

b) Unplug the plug connecting the Net Port Board. Remove two M3×6 screw

assemblies and then the Net Port Board;

c) Unplug the plug connected to the USB board. Remove four M3X6 screw

assemblies, and then take out USB board.

d) Unplug the plug connected the LED board. Remove M3X6 screw assembly, and

then take out LED board.

e) Unplug the plug connecting the Print Control Interface Board. Remove two M3X6

screw assemblies and then remove the Print Control Interface Board.

2.5.5 Disassemble Industrial Control Board

2.5.5.1 Solution 1:

After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),

follow the steps below to disassemble the Industrial Control Board:

a) Unplug all plugs on the top of the Industrial Control Board connecting to other

components;

b) Remove four M3×6 screw assemblies fixing the Industrial Control Board shield

enclosure, then remove the shield enclosure.

c) Unplug all plugs connecting to the Industrial Control Board.

d) To withdraw the Industrial Control Board from the slot, remove two M3×6 screw

assemblies fixing both corners of the Industrial Control Board.

2.5.5.2 Solution 2:

After completing the operation in Section 2.5.2 (Disassemble plastic housing), follow the

steps below to disassemble the Industrial Control Board:

2-36
System Working Principle

a) Unplug all plugs on the top of the Industrial Control Board connecting to other

components;

b) Remove four M3×6 screw assemblies fixing the Industrial Control Board shield

enclosure, then remove the shield enclosure.

c) Unplug all plugs connecting to the Industrial Control Board.

d) To withdraw the Industrial Control Board from the slot, remove two M3×6 screw

assemblies fixing both corners of the Industrial Control Board.

2.5.6 Disassemble PR Board and RVA Board

After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),

follow the steps below to disassemble the PR Board and the RVA Board:

a) Remove two M2.5×6 screw assemblies and three M3×8 screw assemblies fixing

the lower housing of the installation sleeve, then remove the lower housing of the

installation sleeve;

b) Remove eight M3X6 screw assemblies fixing the probe press board, and then

remove the probe press board.;

c) Remove the linking wires between the PR Board and the RVA Board, and withdraw

the RVA Board along the sliding guides from the FEP board;

d) Remove six M3×6 screw assemblies fixing the probe cover board to take out the

probe cover board;

e) Having finished step d), withdraw the PR Board along the sliding guide from the

FEP board;

Note 1: Given that the printed board cannot be removed easily due to tight

binding, the screws fixing the back of the shield plate shall be loosened

appropriately.

Note 2: Having removed four M2.5X6 countersunk head screws on the earth

board, the earth board can be removed from the PR Board.

2-37
System Working Principle

2.5.7 Disassemble Power Supply and Hard Disk

2.5.7.1 Disassemble hard disk

After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),

follow the steps below to disassemble the hard disk:

a) Unplug all the plugs connecting to the hard disk;

b) Remove two M3×6 screw assemblies fixing the Hard Disk Fixture to withdraw the

hard disk together with the fixture;

c) To remove the IDE interface board, remove two M3×6 screw assemblies;

d) Remove four M3×8 screw assemblies on both sides to take out the hard disk from

the fixture.

2.5.7.2 Disassemble power supply module from main unit

After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),

follow the steps below to disassemble the power supply:

a) Unplug all the plugs connecting to the power supply module and the plugs

connecting to the FEP Board;

b) Remove two M3×6 screw assemblies through the gap at the top of the Monitor

Board Fixture, and two M3×6 screw assemblies on the left of the frame through two

holes on the Industrial Control Board shield enclosure. Withdraw the power supply

module from the main unit.

Note: If it is too tight between the power supply module and the frame, loosen four
screw assemblies fixing the monitor back supporting board, then to withdraw
the power supply module from the frame.

2.5.7.3 Disassemble ATX power supply

After completing the operation in Section 2.5.7.2 (Disassemble power supply from main

unit), follow the steps below to disassemble the ATX power supply:

2-38
System Working Principle

a) Unplug all the plugs connecting the ATX power supply with the PW board;

b) Follow the process in Section 2.5.7.1(Disassemble hard disk) to withdraw the hard

disk together with the fixture from the hard disk box.

c) Remove three M3×6 screw assemblies to disassemble the fan and the fan fixture;

d) Remove four M3×6 screw assemblies and two M3×6 countersunk head screws of

the hard disk box to disassemble the ATX power supply cover;

e) Remove four M3×6 screw assemblies to withdraw the ATX power supply.

2.5.7.4 Disassemble PW board

After completing the operation in Section 2.5.7.2 (Disassemble power supply module from

main unit), follow the steps below to disassemble the PW board:

a) Remove eight M3×6 screw assemblies at the front and the back to disassemble the

power supply frame cover board and the hard disk box;

b) Remove four M3×6 screw assemblies and a M3×6 pan head screw on the right

side, then withdraw the PW board.

2.5.8 Disassemble MONIT Board

2.5.8.1 Disassemble front frame

2.5.8.1.1 Disassemble color filter

The color filter shall be disassembled as the following:

Unfold the keyboard and then level it. Toggle up the right and left buckles locking the top

of the color filter on the front frame, when the buckles are in place, the top of the color filter

will be ejected automatically with the bounce of the post at the top of the color filter. Then

draw out the whole color filter from the top.

Note: The operator shall wear gloves during the whole disassembly process. Dust

or fingerprint on the surface of the color filter, if any, could be wiped off with

lens cleaning paper. Attention shall be paid to prevent any scratch upon the

color filter.

2-39
System Working Principle

2.5.8.1.2 Disassemble front frame from main unit

After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),

the front frame shall be disassembled following the steps below:

a) Remove six M3X10 screw assemblies fixing the front frame on the left and right

sides.

b) Draw out the front frame a little bit, and unplug the cables connecting the back of

the front frame with the contrast platelet. Then remove the whole front frame.

Note: Attention shall be paid to prevent any scratch upon the color filter after

disassembly of the front frame.

2.5.8.1.3 Disassemble contrast adjust platelet

After completing the operation in Section 2.5.8.1.2 (disassemble front frame from main

unit), remove three M3X8 screw assemblies to take out the contrast adjust platelet.

Note: After disassembling the contrast adjust platelet, take out four adjust knobs

and polyester plates, then place them aside properly for reassembly.

2.5.8.2 Disassemble MONIT board and monitor tube

2.5.8.2.1 Disassemble MONIT board

After completing the operation in Section 2.5.6 (disassemble PR Probe Board and RVA

Board), the MONIT board shall be disassembled following the steps below:

a) Remove four M3×6 screw assemblies, then remove the probe shield board on the

right side of the main unit.

b) Remove two M3×6 screw assemblies and two M3×6 countersunk head screws,

then remove the front board of the probe shied board.

c) Unclench the anode cap of the monitor tube carefully.

d) Remove four M4X8 screw assemblies and then rear arm of the handle.

e) Remove two M3X6 screw assemblies and turn the MONIT board to the vertical

2-40
System Working Principle

position.

f) Remove a M4X8 screw assembly on the front arm of the MONIT board to loosen

the earth cable.

g) Take out the mounting plate at the tail of monitor tube.

h) Unplug all the plugs connecting the MONIT board.

i) Draw out the tail of the rotation-supporting axis at the fixture tail of the monitor

board from the slot of the back supporting plate, then draw out the whole MONIT

board fixture backward.

j) Remove four M3X6 screw assemblies and then take out the MONIT board.

2.5.8.2.2 Disassemble monitor tube

After completing the operation in Section 2.5.8.2.1(Disassemble MONIT board), follow the

steps below to disassemble the Video Tube:

a) Remove four M4×8 screw assemblies on the top to disassemble the front

supporting piece of the handle.

b) Hold on the bottom of the monitor tube, remove six M4×8 screw assemblies on the

left and the right to withdraw the monitor tube together with the fixing structure

forward slowly.

Note: When drawing out the monitor tube, attention shall be paid to prevent

any collision with the tail of the tube. After the monitor tube is drawn

out, it shall be placed upon spacer such as bubble wrap bag with the

surface of the tube downward to avoid any scratch upon the surface of

the tube.

c) Remove four M4×8 screw assemblies and the fixing structure. Then remove the

monitor tube.

2-41
System Working Principle

2.5.9 Disassemble FEP Board

After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),

2.5.5 (Disassemble Industrial Control Board) and 2.5.6 (Disassemble PR Board and RVA

Board), follow the steps below to disassemble the FEP board:

a) Unplug all the plugs linking to the FEP board;

b) Remove two screw assemblies and six countersunk head screws fixing the frame

and the base to separate the frame from the base;

c) Remove twelve M3×6 screw assemblies to take out the FEP board.

2.5.10 Assemble Schematic of Main Unit

The assemble schematics of the main unit of the main unit are shown in Fig. 2-16 and Fig.

2-17, which can be used as an auxiliary reference chart for disassemble and assemble

process.

2-42
System Working Principle

Fig. 2-16 Assemble Schematic of CTS-7700 Main Unit (1)

(Please refer to Table 2-9 for the corresponding numbers and descriptions)

2-43
System Working Principle

Fig. 2-17 Assemble Schematic of CTS-7700 Main Unit (2)

(Please refer to Table 2-9 for the corresponding numbers and descriptions)

2-44
System Working Principle

Table 2-9 Checklist for numbers and descriptions of main unit assembly

No. Description Quantity


1 Monitor tube 1

2 Spacer 2

3 Supporting fixture of keyboard shaft (left) 1

4 Supporting fixture of keyboard shaft (right) 1

5 Supporting fixture of keyboard shaft (front) 1

6 Supporting fixture of keyboard shaft (back) 1


7 Base 1
8 Industrial control board shield enclosure 1
9 Industrial control board 1
10 Handle arm (rear) 1
11 Display board joint (rear) 1
12 Display board joint (front) 1
13 Base plate for display board 1
14 Ground board 1
15 Fixing bracket of monitor 1
16 Probe board cover plate 1
17 Shield board (front) 1
18 Shield board (middle) 1
19 Shield board (back) 1
20 Shield board press board 1
21 PR board 1
22 RVA board 1
23 Hard disk fixture 1
24 Locating pin bracket 2
25 Plank 1
26 Hard disk 1
27 IDE patch panel 1
28 PW board 1
29 ATX power supply 1
30 Fan rack 1
31 Soleplate of power supply rack 1
32 Cover plate of power supply rack 1
33 Cover plate of ATX power supply 1
34 Hard disk mounting deck 1
35 Rear panel 1
36 Hard disk fixture 1
37 Fan 1

2-45
System Working Principle

Table 2-9 (Continued)


No. Description Quantity
38 Fan cover 1
39 Power socket 1
40 Fan socket strips 1
41 LED board 1
42 USB board 1
43 Net port board 1
44 Print control port board 1
45 Switch 1
46 Fuse holder 2
47 Video output 1
48 Ground pole 1
49 MONIT board 1
50 Panel fixture (left) 1
51 Panel fixture (right) 1
52 Frame 1
53 Handle fixture (front) 1
54 KB board 1
55 KBIF board 1
56 Trackball 1
57 Reversal seating (left) 1
58 Reversal seating (right) 1
59 Slider 8
60 Keyboard knob 5
61 Keyboard silicon-gel button panel 1
62 Keyboard panel stopper 2
63 Keyboard sleeve 7
64 Keyboard housing (upper) 1
65 Keyboard housing (lower) 1
66 Color filter 1
67 Dustproof net 1
68 Dustproof net 2
69 Front frame 1
70 Cover for ventilation opening (left) 1
71 Cover for ventilation opening (right) 1
72 Cover for ventilation opening (front) 1
73 Button 2 4
74 Button 1 1
75 Hook 1
76 Hook fixing press board 1
77 Polyester spacer 1
78 Contrast adjust board 1

2-46
System Working Principle

Table 2-9 (Continued)


No. Description Quantity
79 Pin (fixed) 1
80 Pin (removable) 1
81 FEP board 1
82 Reinforcing plate of handle 1
83 Upper cover of handle 1
84 Lower cover of handle 1
85 Upper cover of back housing 1
86 Lower cover of back housing 1
87 Back enclosure cover 1
88 Lower housing of sleeve 1
89 Stopper of back housing (right) 1
90 Stopper of back housing (left) 1
91 Stopper of back enclosure cover (right) 1
92 Stopper of back enclosure cover (left) 1
93 Amplification board fan cover 1
94 Fan 1
95 Fan 1
96 Fan fixture 4
97 Torsion spring 1
98 Dual probe sleeve 1
99 Hard disk mounting deck cover board 1
100 Fan brace 4

2-47
System Working Principle

2.6 Installation Instruction for Computer Main Board (Industrial

Control Board)

2.6.1 Appearance of Computer Main Board

Unit: mm
Fig. 2-18 Appearance of Computer Main Board

2.6.2 Interface Position Map

Fig. 2-19 Interface Position Map

2-48
System Working Principle

2.6.3 Installation of System Memory

2.6.3.1 Please pay attention to the following when installing memory bank:

a) To install the memory bank, match the gap of DIMM memory bank and DIMM Slot,

then press down DIMM memory bank in place.

b) The 184Pin SO-DIMM memory module adopted for the Computer Main Board

(Industrial Control Board) shall be compliant with DDR 266/DDR333 specifications,

with the maximum capacity up to 1GMB.

2.6.4 USB Port

USB1 provides two standard USB ports, and USB2 is a set of 2×5 Pin USB device pin.

USB2 needs a conversion cable to connect the USB port signal to a standard USB port.

The pin definitions of USB ports are shown in Table 2-10 and Table 2-11:

Table 2-10 Pin Definition of USB1 Port

USB1 Signal

1 +5V

2 USB Data-

3 USB Data+

4 GND

Table 2-11 Pin Definition of USB2 Port

Pin Signal Pin Signal

1 +5V 2 +5V

3 USB Data- 4 USB Data-

5 USB Data+ 6 USB Data+

7 GND 8 GND

9 VOID 10 GND

2-49
System Working Principle

2.6.5 IDE Port

This single-chip computer provides a set of 40-pin IDE port. Please be noted for the

following when installing IDE devices:

a) Two IDE devices can be connected to the IDE port: one is a Master, and the other a

Slave. Connection method: the Master shall be connected to the end of the cable,

and the Slave to the middle of the cable.

b) When connecting to Ultra100 or Ultra66 hard disk, It is recommended to use a

80-line special flat cable (The pin on the IDE cable marked in red is first pin).

See Table 2-12 for the pin definitions.

Table 2-12 Pin Definition of IDE Port

Pin Signal Pin Signal


1 Reset IDE 2 Ground
3 Data7 4 Data8
5 Data6 6 Data9
7 Data5 8 Data10
9 Data4 10 Data11
11 Data3 12 Data12
13 Data2 14 Data13
15 Data1 16 Data14
17 Data0 18 Data15
19 Ground 20 Key
21 DRQ0 22 Ground
23 IOW 24 Ground
25 IOR 26 Ground
27 IOCHRDY 28 Host ALE
29 DACK0 30 Ground
31 IRQ14 32 No connect
33 Address 1 34 No connect
35 Address 0 36 Address 2
37 Chip select 0 38 Chip select 1
39 Activity 40 Ground

2-50
System Working Principle

2.6.6 Floppy Disk Port

The CPU card provides a set of 34-pin floppy drive port, which can be connected to at

most two 3.5-inch or 5.25-inch floppy disk drives. Please pay attention to the orientation of

the cables and the sockets during connection (The pin on the floppy drive cable marked in

red is first pin). See Table 2-13 and Table 2-14 for pin definition of the ports COM1, COM2,

COM3 and COM4.

Table 2-13 Pin Definition of Port COM1

Pin Signal
1 DCD, Data Carrier Detection
2 RXD, Receive Data
3 TXD, Transmit Data
4 DTR, Data Terminal Ready
5 GND, Ground
6 DSR, Data Set Ready
7 RTS, Request To Send
8 CTS, Clear To Send
9 RI, Ring Indicator

Table 2-14 Pin Definition of Port COM2/ COM3/COM4

Pin Signal
1 DCD, Data Carrier Detection
2 RXD, Receive Data
3 TXD, Transmit Data
4 DTR, Data Terminal Ready
5 GND, Ground
6 DSR, Data Set Ready
7 RTS, Request To Send
8 CTS, Clear To Send
9 RI, Ring Indicator
10 Not used

2-51
System Working Principle

2.6.7 Display Port

A 15-core model D VGA monitor socket can be connected to any monitor with standard

VGA port.

Table 2-15 Pin Definition of Display Port

Pin Signal Pin Signal


1 Red 2 Green
3 Blue 4 Pull up to +5V
5 GND 6 GND
7 GND 8 GND
9 +5V 10 GND
11 Pull up to +5v 12 DDCDATA
13 HSYNC 14 VSYNC
15 DDCCLK

2.6.8 Network Port

LAN1 is a 10/100Mbps Ethernet port on the Main Board. LILED and ACTLED are the

green and the yellow LEDs on both sides of the Ethernet port, which indicates LAN activity

and transmitting status. Please refer to the following status description of each LED:

Fig. 2-20 Network Port

TD+,TD-:Positive/Negative Transmitting Data Signal

RD+,RD-:Positive/Negative Receiving Data Signal

ACTLED:Network Activity Indicator

LILED:Network Link Indicator

LILED
On: Network line available
(Green Light) Off: Network line not available

Indication State

2-52
System Working Principle

ACTLED
On: Transmitting or Receiving Data
(Yellow Light) Off: No Data being transmitted or received

Indication State

2.6.9 Keyboard and Mouse Port

KM1 is a 6-pin mini DIN socket for the keyboard and the mouse, which can be connected

to a PS/2 keyboard directly. A 1 to 2 PS/2 keyboard mouse cable configured with the

single-chip computer is required for connecting the keyboard and the mouse at the same

time.

Table 2-16 Pin Definition of KM1

Pin Signal

1 Keyboard data

2 Mouse data

3 GND

4 +5V

5 Keyboard clock

6 Mouse clock

2.6.10 Power Supply Port

Note:

a) To avoid any damage to the CPU card, please use the 12V (4P to 2xP standard

port) power switchover cable (attached with the CPU card) to connect the PW2

(+12V power outlet) on the CPU card with the 4P power cable of the power supply,

or connect the special power cable on P4 power supply with PW2, so as to ensure

sufficient power supply to the CPU card.

b) Before using the ATX power supply, unplug AC power (100/200V), then plug the

ATX power supply plug into the ATX power supply socket tightly. Connect other

2-53
System Working Principle

related accessories properly before connecting AC power (110/220V) to the AC

power socket.

1) ATX Power Supply Port

Table 2-17 Pin Definition of ATX Power Supply

Pin Signal Pin Signal

1 +3.3V 11 +3.3V

2 +3.3V 12 -12V

3 GND 13 GND

4 +5V 14 PS-ON (power

switch control)

5 GND 15 GND

6 +5V 16 GND

7 GND 17 GND

8 Power Good 18 -5V

9 +5V SB (backup +5V) 19 +5V

10 +12V 20 +5V

2) +12V Power Supply Port

Table 2-18 Pin Definition of +12V Power Supply Port

Pin Signal

1 GND

2 GND

3 +12V

4 +12V

2-54
System Working Principle

2.6.11 Fan Port

The CPU card provides two sets of standard fan sockets [FAN1 (CPU fan), FAN2

(Housing fan)]. Please pay attention to the following 3 points when using the fan sockets:

a) The current for the fan shall be less than 350mA (4.2W, 12V).

b) Ensure that the connection of the fan matches the fan socket. The power wire

(normally in red) is in the middle, and the others are ground wire (normally in black)

and fan rotation speed output pulse signal wire (in other color). Some fans do not

have rotation speed detection, but this wire has an output as high as 12V, which

might damage the CPU card, and this is not a standard connection wire. It is

recommended to use a fan with rotation speed detection.

c) The direction of the fan air current shall be adjusted to exhaust heat from the

cabinet.

Table 2-19 Pin Definition of Fan Port

Pin Signal

1 GND

2 +12V

3 Rotation speed pulse

2.6.12 Status Indication Port

Pin definition of FP1 is shown below:

Table 2-20 Pin Definition of FP1

Pin Signal Pin Signal

1 Power Button 2 VCC5SB

3 GND 4 RESET

5 IDELED 6 IDELED1

2-55
System Working Principle

Pin definition of FP2 is shown below:

Table 2-21 Pin Definition of FP2

Pin Signal
1 Speaker out
2 NC
3 GND
4 +5V

Pin definition of FP3 is shown below:

Table 2-22 Pin Definition of FP3

Pin Signal
1 Power LED+
2 NC
3 GND

2.6.13 TV Output Port

a) J2:TV-OUT Port is shown below:

Table 2-23 Pin Definition of J2: TV-OUT Port

Pin Signal
1 GND
2 TVCVB

b) CN1: S-VIDEO Port is shown below:

Table 2-24 Pin Definition of CN1: S-VIDEO Port

Pin Signal
1 Chroma signal C
2 GND
3 Brightness signal Y

2-56
Troubleshooting

Chapter 3
Troubleshooting

3.1 PCB Function and Potential Failure

As shown in Fig. 1-1 Block Diagram of System Composition, the system consists of 8

modules. In practice, it consists of 9 PCBs. They are: 1) Probe Interface Board (PBSW

Board); 2) Order and Amplification Board (RVA Board); 3) Digital Processing Board (FEP

Board); 4) Power Supply Module (ATX power supply); 5) Power Module (DC-DC power

supply); 6) Control Panel (KB Board); 7) Control Panel (KBIF Board); 8) Computer Main

Board (Industrial Control Board); and 9) Monitor Board. Here is a detailed introduction to

the main functions and potential failures of the PCBs.

3.1.1 Main Function and Potential Failure of Probe Interface Board (PBSW Board)

The main functions of the Probe Interface Board include probe interface, probe switching,

T/R pre-amplification circuit, and T/R element select.

If any failure occurs on this PCB, the following (but not limited to the following) failures

may be found:

a) The probe cannot be switched; the screen prompts no probe, or cannot identify the

probe, or probe code identification error;

b) One or more black strip(s) in the ultrasound image;

c) One or more white strip(s) in the ultrasound image;

d) Multiple echo signals are displayed when using a coin to inspect (one echo signal

only in normal situation).

3-1
Troubleshooting

Fig. 3-1 Silk Screen Diagram of Probe Interface Board

3.1.2 Main Function and Potential Failure of Order and Amplification Board (RVA

Board)

The main functions of the Order and Amplification Board include: order folding circuit and

its control, two-section TGC amplification circuit.

If any failure occurs on this PCB, the following (but not limited to the following) failures

may be found:

a) Many black strip(s) in the ultrasound image;

b) Many white strip(s) in the ultrasound image;

c) Black strip(s) in the echo signal when using a coin to inspect (no black strip in

normal echo signals).

3-2
C94 R101
C237 C238 R269
R52 C305 C96 R314
C269 C15

R196
104 C17 C28 473 100 C201 C202 R290 C203 C204

181
511 R34 C25

R102
R53 181 102 226/16 226/16 226/16 226/16 R106 C99

U36
U35
511 R33 R212 C241 C239
C29 473 102 0R0 R180

473
152
R263
100 102 104 102 104 C33 C134

C27
R100 R51 R35
104 C16 R103 C273
R105
R197

100
R55 C306 103 101 101 473 332 101 101 473 181 R54

R213

C270

SN74LVC245APW
SN74LVC245APW
C35 473 100

181
104 104 152 104 104 681

473
104
101

181
C11 104

102
510
103
102
510
R56 181 102

C274

R107
R228 103 102 102 103 C98 R104 102 R36

C7
681
C37 473 102 0R0 R181

C13
104 104 473 201 104 104 473
R108

101

C93 R99 C26


R59 C307 C97 C95 0R0 473 C32 C135 C100 C31

R229
C36 473 100 C205 C206 R179 C207 C208

C14
R112 C138

181
R118 C139

R113
R60 181 102 226/16 226/16 C243 C240 226/16 226/16
R214 C141 R215 C244 C242

C8 473
104
C42 473 102 0R0 R182 C276 C142
C12 104

R111
R198
100 102 104 100 102 104 C277
R117
R199

R115 C34 C40


R61 C308 103 101 101 473 103 101 101 473 181 R58 R1 681

C278
R57
C41 473 100 C20 103 R2 681
101 104 104 181 101 104 104 681

181
102
510
102
510

C279 R231

R62 181 102 103 R3 681

R114
R230 103 102 681 103 102 R38

GND
C136 R109
C44 473 102 0R0 R183 R4 681
C137 R110

R37 C271
104 104 473 104 104 473 C24

473
C5
R116 R5 681
C9 104 R76 C313 C143 C133 C39 C144 C140 C43 473 R6 681
156/25V C63 473 100 C209 C210 R141 C166 C211 C212 R146 C171 R7 681

181
C254 C253 C256 C255

R142
R77 181 102 226/16 226/16 C168 226/16 226/16 C173

Q12
R8 681

Q11

U12
AD602JR AD602JR R220 C289 R221 C291

2
R140
R204

1
C64 473 102 0R0 R188

U27
U28
156/25V
R145
R205

XS3
R9 681

C124 C123
AD817AR 100 102 104 C62 100 102 104 C66

3904
3904
R143 R75
R79 C314 103 101 101 473 181 103 101 101 473 181 R10 681

C290
R78
C68 473 100 R11 681
156/25V 101 104 104 681 101 104 104 681 R44

DHB-PA100-R13NN
C10 104

C122
181
102
510
102
510

C292 R237

R80 181 102 R12 681

473
C6
R43

R147
22uH 22uH 22uH 22uH R236 103 102 103 102

L22
L23
L24

U11
L21
C170 R144

C165 R139

C69 473 102 0R0 R189 R13 681


156/25V 104 104 473 104 104 473
AD817AR R148 R14 681
R83 C315 C169 C167 C61 C174 C172 C65
R15 681

S3
C72 473 100 C272 C21 103
C213 C214 R152 C177 C215 C216 R158 C178
156/25V R16 681

181
C259 C257 C260 C258 103
R153

R84 181 102 226/16 226/16 226/16 C182


R222 226/16 C181 R223

U10
C294

Q10

Q9
C74 473 102 0R0 R190 C293
R157
R207

R151
R206

AD602JR AD602JR 100 102 104 100 102 104 C30

U25
U26
156/25V C67 C71
R155

1
AD817AR 473

3904
3904
R85 C316 103 101 101 473 181 103 101 101 473 181 R82

BH-34R
R81

C73 473 100

MT8816AP
101 104 104 681 101 104 104 681
181

156/25V
102
510
102
510

C296 R239

R86 181 102


C295 R154

R238 103 102 R45 103 102 R46


C175 R149

U9
C176 R150

22uH 22uH 22uH 22uH C76 473 102 0R0 R191

L20

L17
L18
L19
104 104 473 104 104 473 R17 681
156/25V R156

XS1
AD817AR R64 C309 C183 C179 C70 C184 C180 C75 R18 681
C47 473 100 C217 C218 C219 C220 R19 681
R121 C146

3-3
R126 C151
181
R122

156/25V R65 181 102 226/16 226/16 C246 C245 226/16 226/16 C248 C247 R20 681
R216 C148 R217 C153
C48 473 102 0R0 R184 C281 C283 R21 681

U8
R120
R200

GND
R125
R201

Q7
Q8
100 102 104 C46 100 102 104 C50
156/25V AD602JR AD602JR R123 R22 681

U23
U24
AD817AR R67 C310 103 101 101 473 103 101 101 473 181 R66 C22 103
R63

3904
3904
R23 681

S2
C52 473 100 103
101 104 104 181 101 104 104 681
181

R24 681
102
510
102
510

C284 R233

181 102

XS2
R68 R232 R40 C275
C282 R127

156/25V

2
103 102 681 103 102

XS4
C150 R124

C53 473 102 0R0 C38


R185 R39
C145 R119

U7
22uH 22uH 22uH 22uH 104 104 473 104 104 473 473

L13
L14
L15
L16
R128

1
156/25V R71 C311 C149 C147 C45 C154 C152 C49
AD817AR
C56 473 100 C221 C222 C223 C224 R138 C158
R132 C157

MT8816AP
C252 C250
181

C251 C249
R133

R72 181 102 226/16 226/16 226/16 226/16 C162


156/25V R218 C161 C286
R219

C121 C120 C119 C118 C117 C116 C115 C114 C113 C112
R137
R203

C58 473 102 0R0 R186 C285


R131
R202

476/16V

C2
100 102 104 C51 100 102 104

U6
C55

Q5
Q6
R135
AD602JR AD602JR R73 C312 103 101 101 473 103 101 101 473

U22
156/25V

U21
R69
AD817AR C57 473 100

3904
3904
101 104 104 181 101 104 104 181 R70

-5V
181

223Q
102
510
102
510

C288 R235

R74 181 102 R234


C287 R134

103 102 681 103 102 681 R42


156/25V
C156 R130

C60 473 102 0R0 R187


C155 R129

104 104 473 R41 104 104 473

Z2 Z1
U5
22uH 22uH 22uH 22uH R136

BH-34R

L10
L12

L11
C163 C159 C54 C164 C160 C59

GND
223Q 156/25V

L9

C111 C110 C109


AD817AR

VCC
S1
Fig. 3-2 RVA Board Welding Surface
476/16V 156/25V

C1

Fig. 3-3 Component Side of RVA Board


U4
Q3
Q4
1
AD602JR AD602JR

Z3
156/25V

U20

U19

C108 C107
AD817AR

3904
3904
223Q

MT8816AP

-12V

DHB-PA100-R13NN
156/25V

VCLO
476/16V

C4
U3
L6
L7
L8
22uH 22uH 22uH 22uH
156/25V

L5

C106 C105
AD817AR L44 L46

L45

Z4
223Q 156/25V

102K
102K
102K

U2
Q2
156/25V AD602JR AD602JR C18 103 103 C19

U17
U18

C104 C103
476/16V AD817AR

3904

Q1
3904

+12V
C3
156/25V

C102
U1
102K
102K
102K
22uH 22uH 22uH 22uH
156/25V
AD817AR

C101
L1 L2 L42 L41 L43 L3 L4
Troubleshooting
Troubleshooting

Fig. 3-4 Silk Screen Diagram of RVA

3.1.3 Main Function and Potential Failure of Digital Processing Board (FEP Board)

The main functions of the Digital Processing Board include: A/D conversion, digital beam

forming, dynamic filtering, tissue imaging processing, digital scan conversion (DSC),

transmit pulse generation, probe switch control, and T/R element select control.

If any failure occurs on this PCB, the following (but not limited to the following) failures

may be found:

a) No ultrasound image is displayed;

b) The ultrasound image is mal-positioned, or only half of the image is displayed;

c) Black strip in the echo signal when using a coin to inspect (no black strip in normal

3-4
104
104
104

C157

104
C87

104
C142
C158
C159

R5 103

104
C52

104
C56
104
C160

104
104
104 103 R8 R451

104
R69

C131
472

103
C132 C234 R231

104
202

C145
C84
C29
104
104 202

C161

C28
R68

R22
C233
R232 202 C78

156/25V
104
C80
104 202

C53
C236 104

104
C128 R27

104
C26
104

104
C51 C235 104

C162

C144
104
C136 104

C48
101

104
104

104
C55
104
104

C126
R67
R21 511
681 R463 331
C241

104
104 C243

C129
472 R10 104 681 R464 R31

C79
R35 472 R51 681 C127 R241 104
202 472 R9 681

104
681 R131 156/25V

C141 104
C147
R34 472 R52 681 104 C134 C27 104 681 R465
202 R242 472

R474

472 472
R32

R33 R30
echo signal);

681 R132 C471 222 C473


R48 472 C379 C33 C49 R25
681 681 104 C245 681
R133 156/25V 104
104 104 C36 156/25V

152
101
104 C244

R472
R471

C383
R53 156/25V

104
C138 104 104 202
C54 104 101 R75 C242 R473
C137 C149 104 152
202

C472

470
156/25V

152
152
101
222 C483

C232
R76
R72
R70
470 470
681 104
R47 472 104

C381

152
R477 R487
R475 C481
C140 152 104 156/25V

C382
R482
R481
104

R71
156/25V 102
104 104 C151 R74 C231
R485

152 R73
R78

C146
C380 R77

102 104 102 R484

104
104 C35 220uH 156/25V
C34 104 C12

104
C86 C491

101 104 C482


152 152 R483

C85
104 104 104 C493

L1 C92

104
103
C143

472
R83
104 C47

R6
220uH 156/25V

C64
C501
104 104 C503

L2 C94
C58 104

104
104

C125
104
C11
C88

104
C62 220uH 156/25V

C511
104

C60
L3 C95

C10
104 104 C513
472 R12 R411 681
104 C124

104
C44
104
R412 681 220uH 156/25V

104
472 R11
C521

C121
104 C46
472 R40

104
681

L4 C96
104 104 C523

C122
C15 104 R413
R29 681 R161
220uH 156/25V

104

104
R7 103
C150 C152
C531

472 681 R162


R28 472 C69 104

L5 C97
104 104 C533

104
C89
R46 472 681 R163
C45 104
220uH 156/25V

C63
C541

3-5
C61 104
C68 C66

104
L6 C98

104 104 C543

C37
104
104 104

C14 104
R44 472
C13 104

681 R223 220uH 156/25V

104
104
C551
e) Many black strips in the ultrasound image.

R19 472

R1 470
R2 470
R3 470
R4 470
R66 470
R65 470
681 R222

104
C114
R20 472

C67
681 R221 104 104 C553
L7 C99

C59
104 C139

C57
R18 472 R421 681
R79 104 R422 681 220uH 156/25V
R17 472
C561

512 R43 472

104
104

C30
C110
681

104
104 512 104 104 C563
C115 R85 104 R423
C18 220uH 156/25V

C38
C571

C116 104 104 C573


104

104

104
C65

C50
220uH 156/25V

156/25V
C73
C581
d) The whole ultrasound image is too dark or too bright;

104
C154
104 C39 C70 104 104 C583
104 104
104

220 R89
C17
C16 104

C72 220uH 156/25V

Fig. 3-5 FEP Board Welding Surface


C591

104
104 C43
C153

104 104 C593


104 C130 R431 681
104 C120 R16 472
C71 104

R15 472 R432 681 220uH 156/25V


C601

R42 472
C25 681 104 104 C603
L8 C100 L9 C101 L10 C102 L11 C104 L12 C105

104 C133 104 R433


C117 104 R84 000

104

104
C40

C42
201 R101 104 C119 R49 R36
201 R102 R64 000 000 000
104 C135
000

R63 000 000 000 R37


R80

104 C103 R50 R38


R62 000 R54 000 000
R26 472 C118 681 R211 R61 000 R55 000 000
R24 472 104 681 R212 R60 000 R56 000 R39
104 C82
R45 472 681 R213 104 C148 R57 000
201 R91
104
C155

R58 000
201 R92 104

C81
156/25V
R59 000
104 C93 C41

C4

R81 201 104 C91 104 C163


R82 201

156/25V
C83 104 104 C164

C111 156/25V
C6
C8

104
201 R87

156/25V
331 R88
156/25V
C5

104 C90 473/500V X 3


C3
C2
C1
Troubleshooting

104
104
104

201
331
201
331
C7

156/25V
156/25V

156/25V
C112
R121
R122
C123
R111
R112
C113

C9 C21
Troubleshooting

1A 5 10 15 20 25A 1A 5 10 15 20 25A WW17-215 X 6

V11
V10

V12
V8

V9

V7
DHB-RB100-S13NN DHB-RB100-S13NN

D1 5 10 15 20 D25 D1 5 10 15 20 D25
XS4 XS5

U72 U71 U70 U69


XS3 XS2
D25 20 15 10 5 D1 D25 20 15 10 5 D1 74LVC245A 74LVC245A

74LVC245A 74LVC245A
DHB-RB100-S13NN DHB-RB100-S13NN

74LVC245A

U67
25A 20 15 10 5 1A 25A 20 15 10 5 1A
U46
GND

74LVC245A
AD712JR AD712JR

U48

U47

U66
101 R601
104 C604
104 C602

101 R591
104 C594
104 C592

101 R581
104 C584
104 C582

101 R571
104 C574
104 C572

101 R561
104 C564
104 C562

101 R551
104 C554
104 C552

101 R541
104 C544
104 C542

101 R531
104 C534
104 C532

104 C522

101 R511
104 C514
104 C512

101 R501
104 C504
104 C502

101 R491
104 C494
104 C492
101 R521
104 C524

74LVC245A
XC2S200-5PQ208

U65
NS-1*2
XS6
AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057
U60 U59 U58 U57 U56 U55 U54 U53 U52 U51 U50 U49
U41
U43 U42 GND

NS-1*2
XS11

XS13
1
C32

1
XS8

2
U68
XS12
104
NF3 473

1 XCF02S
XC2S200-5PQ208 XC2S200-5PQ208 XC2S200-5PQ208
C23
104
473

AT27C1024-70JI
NF4 AT27C020-70JI
JS-1001-14
JS-1001-11

C22
104

LH-34R
NF5 NF1 NF2

473 D45
D40
1
473 U34 U36 U35 U81 U33 U31 U73 1
XCF02S XCF02S XCF02S IDT74FCT3807 XCF02S XCF02S 74LVC245A
473 V13 GND
11 14
HZ5C1
C31 104 1

WW17-215 X 6
U25 IS63LV1024L-12H IS63LV1024L-12H DAC0800LCM DAC0800LCM
U18 U17 U20 U19 U75 LIGHT1 U27 U26
1 50.0000MHz U24 U23
74LVC245A 74LVC245A 74LVC245A LIGHT2
V4
JS-1001-10
BH-10S

33
34
74LVC245A 74LVC245A V3 U13
V2

NS-1*2
XS15
V1
GND IS63LV1024L-12H
AD712JR
XS9 U21 U16 U2

U15
IS61LV12816L

10 XC2S200-5PQ208
XS10
U28

XS14

6
NS-1*2

DAC0800LCM
XC2S200-5PQ208 XC2S200-5PQ208 XC2S200-5PQ208
U11 U3

IS63LV1024L-12H

JS-1001-6
GND

XS18
LM1084

U14
XCF02S
U5

XS16
NS-1*2
IS61LV12816L

U30
U12 U22

1
GND
U29
LM1084

IS63LV1024L-12H
U76 U32 U6
74LVC245A XCF02S XCF02S XC2S200-5PQ208

U1
A1 A49 A61

RJB60DCHN-S578
U4 U8 U9 U10

B2 B48 B62
74LVC245A 74LVC245A
LM1084 LM1084 LM1084 LM1084 XS1 U74 U7
XS7

1 JS-1001-6 6

Fig. 3-6 Component Side of FEP Board

3-6
Troubleshooting

Fig. 3-7 Silk Screen Diagram of FEP (1174E) Board

3.1.4 Main Function and Potential Failure of Power Supply Module (ATX power

supply and DC-DC power supply)

The main function of the power supply module is: to transform AC power input into

different DC powers required by the system. The system consists of computer part and

ultrasound part, both of which have their own special requirements, so the power supply is

also divided into ATX power supply and DC-DC power supply. ATX power supply is for the

computer part, one +12V DC power from ATX power supply is for DC-DC power, and the

DC-DC power is transformed to different voltages required by the ultrasound part and

supplied to it. The main output voltages from DC-DC power are: +5VD, +5VA, -5V, +12V,

-12V, +60V, -60V, and HV (controllable high voltage).

If any failure occurs on this PCB, firstly check if voltage of each group is normal. If it is

abnormal, check if the abnormal situation comes from power output itself or from

3-7
Troubleshooting

abnormal loading. The following (but not limited to the following) failures may be found:

a) The system cannot start up (failure comes from ATX power supply);

b) The system can start up, but restart and shut off after starting up;

c) The system can start up, but no display on the screen;

d) The screen has display, but no ultrasound image;

e) Sensitivity of the ultrasound image is very low.

Fig.3-8 Silk Screen Diagram of Power Supply Board

3.1.5 Main Function and Potential Failure of Control Panel (KB Board and KBIF

Board)

The main function of the Control panel is to serve as an end-user operation interface,

providing operation objects such as keys, trackball, knobs and TGC slider. When the user

operates these objects, the control panel will detect these actions, convert them into

agreed signals and send them to the computer module for corresponding processing. On

the other hand, the backlight and the buzzer on the control panel are controlled by

3-8
Troubleshooting

software: When the software sends control commands, the control panel receives these

commands and thus controls the backlight or the buzzer.

If any failure occurs on this PCB, the following (but not limited to the following) failures

may be found:

a) All the operations (including knobs) do not work;

b) Some of the keys do not work;

c) TGC controls do not work;

d) The trackball does not work;

e) The screen has display, but no ultrasound image.

R135

R134
R11
R15

R14

R13

R12

R10
510

510

510

510

510

510

510

510

510

510

510

510

510

510

R1
R9

R8

R7

R6

R5

R4

472
R21

R19

R18

R17

R16
R30

R29

R28

R27

R26

R25

R24

R23

R22

R20
510

510

510

510

510

510

510

510

510

510

510

510

510

510

510
R41

R31
R45

R44

R42

R39

R38

R36

R35

R33

R32
510

510

510

510

510

510

510

510

510

510

510
510 R43 510 R40 510 R37 510 R34
R51
R60

R59

R58

R57

R56

R55

R54

R53

R52

R50

R49

R48

471

471
510

510

510

510

510

510

510

510

510

510

510

510

510

R2

R3
R71

R61
R76

R75

R74

R72

R69

R68

R66

R65

R63

R62
510

510

510

510

510

510

510

510

510

510

510

510
510 R73 510 R70 510 R67 510 R64
R91

R81
R93

R92

R90

R89

R88

R87

R85

R84

R83

R82

R80

R78

R77
510

510

510

510

510

510

510

510

510

510

510

510

510

510

510
R86 510 510 R79

R136 R137 R133 R47 R46 R98 R97 R96 R95 R94
510 510 510 510 510 510 510 510 510 510

203S-3C/B-2X20P-8.5/3.0
R101

R100
510

510

XS1
510 R110

510 R99
510 R112

510 510
R103 R102
R126

R125
510

510
R127

R124
510

510
R111
510

R128

R123
510

510

510 R105
510 R114

510 R113

510 R104

R129 R122
510 R115

510 R116

510 R107

510 510

510 510
R106
510

R130 R121

R131 R120
510 R117

510 R109

510 R108

510 510
R118

R132 R119
510

510 510

Fig. 3-9 Welding Surface of KB Board

3-9
V31 V16
V77 V61 V3

V32
V78 V62
V2
V17
V94
V106 V99 V63
V33
V108 V104
V95 V79

102
102
102
102
102
102
102
102
V48
V18
V1

V109

104
104
104
104
104
104
104
104
V80 V64
104 C26

102
V34

R11
C8
C7
C6
C5
C4
C3
C2
C1
V49
V107
V19
V105 V102
V81 V65
V35
V82 V50
V96 V20

102
R21
V134
V66
V135
V97 V36

102
R27
V51

V103 V83 V21


V119 V120
V67

V122
V37

V121
V52

104
V4

C28

R9
102
V84
V22
V5
V68
V38

V123
V98
V85 V53
V23
V46
V124
V69

101
C41

102
R19
104 102 104 V39
C40 V6
R 36 V86 V54

330 104
C22

R26 C27
V7

3-10
V24
V125

V70
V87
C 37 V40
C 36 104 V55

104
104
C38
V126

V25
C 35 104 104 C 39 V71

102
V8

R10
V47 V41
C 34 104 V9
V88 V56
V26

104 C33
V133

104
C29
102
102

R30
R29
V127

V89 V72
V42
C24
V57
V128

102
104

R20
V27
V10
104 V90 V73
V11
C23

104 C31
104 C30
V43
V130

V91
V129

V58
V110
V28

Fig. 3-10 Component Side of KB Board


C 25 V132 V131

Fig. 3-11 Welding Surface of KBIF Board


V74
104 V137 V44

102
R13
R25 513 V92 V59 V12
104 C32 V75 V29
V111 V136
V13
V60
102 R28 V30
C 21 104 V93 V76 V45

V100

102
R23
V101
151 R 31 V14
V117
V15
V116 V113

V118

102
R12
C9 V115 V114 V112
C11 104
104 R 18
R16 151 510
R 24 510 151 R17
R14 102

102
R22
R15 102 104 C10
Troubleshooting
Troubleshooting

BH-34R
+3.3V RP1
+5V 2 34
KNH21473-3AA
1 33

NF1
XS4 RS30111A602N
LVC245APW 100
D11 D10 D5 D2
OBO-13240

XC17S10XLPD8C
C20
BP1 D7

N74F14D-T
1 RP2

C16
15uF/25v
+

15uF/25V

MAX232
15uF/25v
RS30111A602N
D9 D1

C19
D12 C13 12 34 15uF/25v
AT89C51-24JI
D4 D8
LM1084IS-ADJ RP3

MAX709
NS-1*2 XCS10XL-4VQ100C C17
XS5

MMBT3904
LVC245APW

C18
V1 50 15uF/25v 15uF/25v RS30111A602N
1

MIC39100
15uF/25V

126-16000
XS6 D3
B1 23 RP4

D6
C12
NS-1*2
8 ADC0809CCV 22
GND RS30111A602N

C14
15uF/25V 15uF/25V

C15
GND
(SMD) 11.0592MHz
15 RP5

RP12 RP13 RP10 RP9 RP11


DISP DEPTH MGain BGain VALUE RS30111A602N

RP6

RS30111A602N

RP7

RS30111A602N

RP8

RS30111A602N

XS8 XS3 XS1


VFUNC
JS-1001-4 1 JS-1001-6 1 201S-DL-2x20P(H=5.08)

Fig. 3-12 Component Side of KBIF Board

Fig.3-13 Silk Screen Diagram of KBIF Board

3.1.6 Main Function and Potential Failure of Computer Main Board (Industrial

Control Board)

The main functions of Computer Main Board (Industrial Control Board) include: receive,

conversion and processing of control panel signals, data transmission, image display

measurement & calculation function, storage function, etc. The computer module is the

running platform of the whole system, which is why ultrasound systems in this form being

called “PC based ultrasound system”. The generality of computer module enables easy

communication with peripheral devices like memory, monitor, printer, keyboard and

mouse. All these devices can be connected to universal ports on a computer. With control

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Troubleshooting

of Windows operating system on these devices, various functions, such as image

measurement & calculation, storage and printing, are achieved conveniently. For the

wiring diagram of the Industrial Control Board, please refer to Fig.2-15.

If any failure occurs on this PCB, firstly verify if voltage of each group of power supply is

normal. If it is abnormal, check if the abnormal situation comes from power output or

loading (similar to Section 3.1.4). The following (but not limited to the following) failures

may be found:

a) The system cannot start up;

b) The system can start up, but it restart and shut off after starting up;

c) The system can start up, but has no display;

d) The system can start up and enter Windows, but cannot enter ultrasound interface

(firstly check if it is a software problem);

e) No ultrasound image is displayed;

f) Sensitivity of ultrasound image is very low.

3.2 Common Failure and Troubleshooting

Due to complexity of the system, certain failures might occur inevitably. Here is an

introduction to some troubleshooting methods and basic consideration, though they may

not cover all the problems. Whenever any failure occurs, it is important to record the

working environment, the working state and the problem of the system with failure. Then

follow the instruction in the manual to deal with the problem. If it does not work, to shoot

the problem as soon as possible, please contact SIUI service team immediately.

3.2.1 System Cannot Start Up

Generally, when such failure occurs, firstly check if the external power supply is normal,

the main power switch of the main unit is on, and the fuse in the main unit is normal. If the

power input requirement is AC220V(230V), then the input power voltage shall be AC220V

3-12
Troubleshooting

(230V)±10%; if the power input requirement is AC110V (120V), then the input power

voltage shall be AC110V (120V)±10%. Over high voltage may damage the system

(including fuse breakdown), over low voltage may not be sufficient to start up the system.

If the voltage and the fuse are in normal condition, and power supply main switch is on,

follow the steps below to do further inspection:

a) Check if the power indicator is on and the fan is working.

If the indicator is on, inspect if the sound “toot, toot” is heard after system powerup

for a while (the sound indicates that the Computer Main Board has passed

self-check and the system starts up properly). If the sound is heard, then go to the

next step for further inspection. If you cannot hear the sound, the problem may

come from the Computer Main Board (Industrial Control Board), or if you hear

continuous “toot, toot, toot…” sound, the problem may come from the memory

bank of the Computer Main Board.

b) Check if the ATX voltage is normal

If any abnormal situation occurs, please check if the problem comes from ATX itself

or loading.

When it is not loaded, measure the ATX power supply port. Connect Pin14 PS-ON

to ground short circuit, and switch on the main power. The ATX power supply starts

to work. Test the voltage of each pin on the port, as shown in Table 2-17 and 2-18.

If there is no voltage or abnormal voltage, it means the failure is in ATX power

supply.

c) Check if each group of DC-DC output is normal. When doing this, because the

input of DC-DC power is from ATX power supply, it is necessary to ensure ATX

power supply works normally and all the wires are connected properly.

If any abnormal situation occurs, please check if the problem comes from DC-DC

itself or loading.

d) If all the voltages are normal, the failure might be in the Computer Main Board

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Troubleshooting

(Industrial Control Board) or the hard disk.

3.2.2 Lowered Image Quality

Because ultrasound front-end has direct relation with ultrasound image quality of the

system, if image quality is lowered, it is probably resulted from ultrasound front-end. The

situations of lowered image quality are mainly as follows:

a) Image pixel getting Coarse

The main reason that image pixel getting coarse may be degraded performance of

the amplifier on the ultrasound front-end board. When such problem occurs, it may

be RVA or FEP Board failure.

b) Image Depth decreased

Possible reasons for decreased image depth: decreased imaging channels,

abnormal transmit pulse, lowered transmitting voltage. If the image depth is

decreased, use a small metal stick (small screw driver or coin) to slide along the

surface of the probe to do the test. Under normal situation, a moving left-right

symmetric acute triangle will be shown on the screen. If the acute triangle is

complete except that the depth gets shallower, it may be due to lowered transmit

voltage, failure in a certain level of the amplification circuit on the front-end board,

or abnormal transmit pulse (less than normal pulse number). Check if the transmit

voltage is normal (over +60V) or not, so as to determine where the problem is: in

DC-DC board, PBSW Board, RVA Board or FEP Board; if a certain part in the acute

triangle is lost (black strip), the failure may come from some part of the front-end

board, including PBSW Board, RVA Board or FEP Board. In addition, the problem

in the probe is also possible. if there is any part missing in the acute triangle, and

the missing part varies as the acute triangle moves, the problem may be from RVA

Board.

3.2.3 Abnormal Image

If there is any problem with the ultrasound system, usually it can be found in the image. An

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Troubleshooting

abnormal image usually has the following symptoms:

a) Fixed dark strip in the image;

There are many possible reasons that dark strips are found in the ultrasound image.

The main reasons are: failure in PBSW Board, RVA Board, FEP board or the probe.

There are a few situations that dark strips are found in the image: a black strip

appears at a fixed position in the image; several black strips appear repeatedly in

the image.

As the probe is a precision device, improper use might damage the probe.

Therefore, when black strips appear in the image, first of all please check if the

problem is due to probe damage. It is very easy to figure out. Connect another

good probe (It is not necessarily of the same model) to the system to see if there is

any similar problem in the image. If the problem is still there, the failure is from the

system; otherwise it is the probe problem. Please replace the probe. If the problem

is in the system, usually it is due to the front-end system. Usually breakdown in

high voltage switch of the PBSW board or the pre-amplifier in the front-end system

may result in such failure. Try to replace the PBSW Board first. If the problem still

exists, try to replace the RVA Board. If it does not work, further replace the FEP

Board.

b) Noise in the Image

There are many reasons that may cause noises in the image, for example: external

electromagnetic interference, power interference and interference from system

failure. Therefore, when interference is found in the screen, check if there is any

external interference before further inspection. External electromagnetic

interference generally lead to interference in the whole screen (but not limited to

the ultrasound imaging area). Interference due to front-end system failure usually is

found in the ultrasound imaging area only. Based on this characteristic, we can

distinguish whether the interference source is the external electromagnetic

interference. External power interference may also lead to noises in the ultrasound

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Troubleshooting

imaging area. If external power interference is found, check if the ground terminal

of the system is well connected. In addition, please try to keep away from the

power interference source. It is recommended to use a well-grounded stabilized

voltage supply, so as to reduce power interference effectively.

If the system failure is due to noise, the failure position can be determined roughly

based on the noise features:

1) If there is one or more noise(s) in acute triangle shape, usually the problem is in

the pre-amplifier, the high-voltage switch or the relay of the PBSW Board.

Please replace the PBSW board.

2) If the noise is in irregular shape and appears in the whole ultrasound imaging

area at random, usually the problem is in the amplification circuit of the

Front-End Board. Please replace the PBSW board or the RVA board.

3) If the noise is in geometric form and regular, such as black strip, bright line,

black mass, or bright mass. The problem might not be from the front-end. The

failure inspection focus shall be in FEP board, computer part (Industrial Control

Board), and RAM.

In addition to the problems listed above, other failures might occur due to complexity of

the system.

3.2.4 Failure Analysis on Monitor

3.2.4.1 Inspection when the monitor display is not normal

For inspection on the main unit, please refer to other sections in this manual. For

inspection on video output signals, if possible, connect video out of the main unit to an

external monitor to check if the video output signals from the main unit is normal.

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Troubleshooting

Fig. 3-14 Silk Screen Diagram of Monitor Board (1074H)

To determine the failure of monitor assembly, follow the instructions below to perform the

inspection.

Note: Due to high-voltage circuit inside the monitor assembly, all the inspection

shall be performed by a professional engineer.

a) Inspect the circuit board and its components to see if there is any abnormity, burn

or peculiar smell; if any wire is broken; if any connector comes off or gets loose.

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Troubleshooting

Fig. 3-15 Inside View of Wiring

b) Power-up check the power input connector CH6. Measure voltage input +15V (in

yellow) and +30V (in red) with a multimeter. If the voltage is not normal, unplug the

connector, and measure the connector voltage with zero loading. If it is still not

normal, the initial identification is that it is the Power Board failure.

Fig. 3-16 The Picture of the Power Input Interface

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Troubleshooting

c) If the power input and the video out signals of the main unit are working properly,

the initial identification is that it is the Monitor Board failure.

3.2.4.2 Common monitor failures and troubleshooting

a) No display: Adjust brightness and contrast potentiometers on the front panel to see

if there is any change or any scanning grating. If there is grating, usually the failure

is in the video amplification channel; check if the monitor tube filament is on: use a

multimeter to measure the voltage between pin 3 and 4 at the back of the monitor

tube and see if it is DC15V. If it is the normal value 15V, while the filament is off, a

possible cause of the failure is filament blowout or bad contact between the

monitor-end platelet and the monitor tube.

b) Asynchronous display line: Try to adjust the potentiometer 4VR2. If it does not work,

the failure is in the circuit.

c) Asynchronous display field: Try to adjust the potentiometer 5VR1. If it does not

work, the failure is in the circuit.

d) Abnormal brightness: adjust the brightness control potentiometer on the front panel,

or the assistant brightness control potentiometer 4VR4 on the main circuit board. If

it does not work, the failure is in the circuit.

e) Abnormal contrast: adjust the contrast control potentiometer on the front panel, or

the assistant contrast control potentiometer 1VR1 on the main circuit board. If it

does not work, the failure is in the circuit.

f) Improper grating size: adjust the potentiometer 5VR2 to adjust image size in

vertical direction; adjust the magnetic core of loop 4L2 to adjust image size in

horizontal direction.

g) Fuzzy focus in the image: adjust the potentiometer 4VR3 to see if there is any

change in the image focusing effect.

If the failure is identified from circuit board, if possible, perform corresponding circuit

troubleshooting with reference to circuit schematics and block diagram; otherwise, return

3-19
Troubleshooting

the board to us for service.

3.2.5 Other Common Failures and Troubleshooting

a) If the system can start up and enter Windows operation interface , but cannot enter

ultrasound software interface, inspect the connection between the Industrial

Control Board and the FEP board to see if it is normal, or any bad contact due to

connector dislocation; it may also due to oxidation of the contact point on the PCI

port of the Industrial Control Board, which results in bad contact. Use an eraser to

clear off the oxide on contact point surface.

b) If the screen stays in the BIOS initialization screen or Windows logging screen after

system startup, try to recover the system with GHOST. If it does not work, check if

the hard disk data wire and the hard disk power wire get loose, if the data wire is

damaged due to pressure. Lastly, if system recovery and data wire replacement do

not work, it can identified as a hard disk failure. Please replace the hard disk.

3-20
Software Maintenance

Chapter 4
Software Maintenance

4.1 System Update

System update includes Update System Online and Update System from USB disk.

Press Menu. Select Update System and press Enter. The window below will appear.

Move the trackball up or down to select.

Fig. 4-1 Update System Menu

4.1.1 Update System Online

Select Update System Online and press Enter. The following message will be displayed

on the screen:

Connecting, please waiting…

a) If network connection is failed, the following message will be displayed on the

screen:

Network Error! Please press ESC to return menu.

1) Press Esc to return to Fig. 4-1 window and enter Network Setup to check

whether the setting of IP and Port is correct. Then make sure the system is well

connected to the network (e.g. check the connection of netcable);

2) Select Update System Online again. If it still prompts Network Error, it may

be due to the server failure for file download. Please contact SIUI.

b) If network connection is successful, the following message will be displayed on the

4-1
Software Maintenance

screen:

Network connect successfully.

Please press Enter to copy file or press ESC to return menu.

1) Cancel system update: Press ESC to return to Fig. 4-1 window;

2) Copy file: Press Enter. The window below will appear, and it starts copying

update files. During copying, only Esc key is valid.

Copying files 9%

Press ESC to cancel

Fig. 4-2 Copy file window

3) Cancel copy: Press Esc to cancel copy. The following message will be

displayed on the screen:

Please press Enter to cancel copy or press ESC to return.

Press Esc key to continue copy, or press Enter to cancel copy, and the

following message pops up:

Copy Blackout! Please press ESC to return menu.

4) Copy completes: the following message pops up when copy completes:

The files download successfully.

Please press Enter to update system or press ESC to return menu.

If the user does not want to update the system, press Esc to return to the

window in Fig. 4-1.

5) Update system: If the user wants to update the system, press Enter, and the

system will automatically install the new software and be rebooted to achieve

update.

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Software Maintenance

4.1.2 Update System from USB disk

Copy the .exe file required for system update to the root directory in the USB disk. Plug in

the USB disk and select Update System from USB Disk.

a) Select Update System From USB disk from the menu and press Enter;

b) If a USB disk containing system update files is plugged in the system, the following

message will be displayed on the screen:

The Udisk file is ready.

Please press Enter to update or press ESC to return menu.

c) Press Enter and the system will install the new software and be rebooted

automatically. System update is successful;

d) If the user does not want to update the system, press Esc to return to Fig. 4-1

window;

e) If a USB disk is not plugged in the system or there is no update file in the disk, the

following message will be displayed on the screen:

The Udisk file is not ready.

Please press ESC to return menu.

Press Esc to return to Fig. 4-1 window. Ensure that a USB disk is plugged in and it

contains update files. Press Enter key again to update the system.

4.1.3 Network Setup

a) This option is for setting server IP and port for downloading update files. The

system is set up well before delivery. Usually the user does not need to change

the setup.

Correct IP: 218.16.250.64

Port: 1234

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Software Maintenance

b) If any modification is required, select Network Setup and press Enter. The

window below will appear:

Fig. 4-3 Upgrade server setup window

c) Move the cursor to IP or Port. Use Backspace to delete the original IP or Port.

Enter new IP or Port and move the cursor to select OK. Press Enter to return to

Fig. 4-1 window;

d) If Initialize is selected and Enter is pressed, then IP and Port are initialized to

factory setup;

e) If IP or Port is not modified, press Esc to return to Fig. 4-1 window.

4.2 Software and System Recovery

4.2.1 Software Recovery

Because the keyboard of the system is locked in default, an external USB keyboard via

the USB port is required for the following operation.

a) Exit the software to Windows interface:

z Method 1: Press Ctrl+Alt+Delete to pop up Windows Task Manager,

select Processes | 7700.exe |End Process to return to Windows interface as

shown in Fig. 4-4.

z Method 2: Press Alt+F4 to close the software directly and return to Windows

interface.

b) Copy CD folder under the root directory of D drive to the folder Ultrasound under

the root directory of C drive. Software recovery is completed.

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Software Maintenance

Fig. 4-4 Windows Task Manager Window

4.2.2 System Recovery and Backup

4.2.2.1 System Recovery

The software Ghost is required for system recovery. Ghost is a tool for system, data

backup and recovery released by Symantec, which can be downloaded from Internet.

There are two system recovery methods available for user selection: automatic and

manual recovery.

a) Boot up via USB Startup Disk and Automatic System Recovery

Plug the USB startup disk in the USB port, and press F7 when the system is

booting up. The screen as shown in Fig. 4-5 is displayed.

Select First Boot Device

USB RMD-FDD: Sigmatel MSCM


IDE-0: Maxtor6e030L0

Up/Dn: Select RETURN: Boot ESC: Cancel


Fig. 4-5 Startup Selection Menu

Use the up/down direction keys to select USB RMD-FDD: Sigmatel MSCM to boot

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Software Maintenance

up the system (The descriptions following USB RMD-FDD and IDE-0 are

dependant to the actual situation).

If the USB startup disk contains a batch file (AUTOEXE.BAT) for automatic

recovery, the system will be recovered automatically after successful startup, and

then restart.

b) Manual System Recovery

Follow step a) to start up from the USB startup disk. If there is no batch file

(AUTOEXE.BAT) for automatic recovery in the USB disk, after successful startup

the system will go to DOS prompt A:\>. Input the commands below to enter Ghost

interface as shown in Fig. 4-6:

A:\D: (press Enter)

D:\ghost (pre

ss Enter)

Fig. 4-6 Startup Screen of Ghost8.0

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Software Maintenance

Fig. 4-7 Select Recovery Menu

1) Select Local |Partition| From Image (Shown in Fig. 4-7) and press Enter to

confirm and go to the screen shown in Fig. 4-8.

Fig. 4-8 Select Partition of Image File

2) Select the partition of the image file. The image file SIUI.GHO is saved in the

root directory in D drive (the second partition of the first disk). Select D:1:2 []

FAT drive and press Enter.

3) After selecting the partition, the directory and files of this partition are displayed

in the second box (the biggest one). Use the direction keys to select the image

4-7
Software Maintenance

file SIUI.GHO, and press Enter to confirm. See Fig. 4-9. It displays backup

information of the selected image file when performing backup. Select OK to

confirm.

Fig. 4-9 Backup Information of the Selected Image File

4) Select to restore the image file to the hard disk. Since there is only one hard

disk available on the system, press Enter key directly and it displays Fig. 4-10.

Fig. 4-10 Select Destination Drive

5) Select the destination partition for recovery. The image file is to be recovered to

C drive (the first partition). Select the first item (the first partition). The display is

as shown in Fig. 4-11.

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Software Maintenance

Fig. 4-11 Select Destination Partition

6) After selecting the destination partition for recovery, press OK. A prompt

message pops up: Proceed with partition restore? Destination partition will

be permanently overwritten. See Fig. 4-12.

Fig. 4-12 Prompt Message

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Software Maintenance

7) Select Yes to start restoring. See Fig. 4-13.

Fig. 4-13 System Restoring

8) When the system is restored successfully, it displays as shown in Fig.4-14.

Press Enter to restart the system and finish recovery.

Fig. 4-14 Recovery Succeeds

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Software Maintenance

4.2.2.2 System Backup

a) Select Local| Partition| To Image as shown in Fig. 4-15, and press Enter key.

Fig. 4-15 Select Backup Menu

b) It pops up a hard disk select window as shown in Fig. 4-16. There is only one hard

disk available in the system, so press Enter directly.

Fig. 4-16 Select Source Drive

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Software Maintenance

c) Use the direction keys to select the first partition (C drive) as the backup partition.

See Fig. 4-17.

Fig. 4-17 Select Source Partition for Backup

d) Then select OK to confirm. It displays as shown in Fig. 4-18.

Fig. 4-18 Dialog Box

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Software Maintenance

e) Select the desired storage partition, directory path and input the image file name.

First select the partition for storing the image file: Use Tab key to switch to Look in

box and use the direction keys to select desired partition as shown in Fig. 4-19.

Fig. 4-19 Switch to Look in Box

f) Use the down direction key to select D:1:2[]FAT drive (the second partition of the

first disk), the color of which will turn white (see Fig. 4-20).

Fig. 4-20 Select Desired Partition for Storing Image File

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Software Maintenance

g) Having selected the desired partition, press Tab key to switch to image file name

input box (see Fig. 4-21).

Fig. 4-21 Switch to Image File Name Input Box

h) Input the image file name. To back up the system, input the image file name

SIUI.GHO as shown in Fig. 4-22.

Fig. 4-22 Input Image File Name

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Software Maintenance

i) Having inputted the image file name, press Save, and it displays Compress image

file? See Fig.4-23.

Fig. 4-23 Query on Whether to Compress Image File

Three options are available for selection: No means no compression; Fast means

fast backup speed with a low percentage of compression (Recommended); High

means slow backup speed with a high percentage of compression. Use the right

direction key to select High. See Fig. 4-24.

Fig. 4-24 Select High

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Software Maintenance

j) Having selected compression percentage, press Enter key to start backup. The

When it completes, it displays as shown in Fig. 4-25.

Fig. 4-25 Backup Completed

k) It prompts that the operation is completed. Press Enter key to return to the

program main screen. See Fig. 4-26.

Fig. 4-26 Exit to Program Main Interface

l) To exit Ghost, use the down direction key to select Quit and press Enter key. See

Fig. 4-27. It queries: Are you sure you want to quit? Select Yes to exit Ghost and

go back to DOS prompt A:\ >. Press Ctrl + Alt +Del to restart the system. So

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Software Maintenance

far the system backup is completed.

Fig. 4-27 Exit Ghost

4.3 Creation of USB Startup Disk and Batch File (AUTOEXEC.BAT)

4.3.1 Creation of USB Startup Disk

The software HP USB Disk Storage Format Tool (HUDSFT) is required for the creation of

USB Startup Disk. It is recommended to back up information in the USB disk before

creating the USB startup disk.

a) Plug the USB disk in the computer and run HUDSFT. After starting up, it displays

as in Fig. 4-28.

Fig. 4-28 HUDSFT Running Screen

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Software Maintenance

b) Select Create a DOS startup disk, and the followed Using DOS system files

located at ::will be activated. See Fig. 4-29.

Fig. 4-29

c) If you click Start, the following message will show up: Missing location of DOS

system files…See Fig. 4-30.

OK

Fig. 4-30 Error Message

d) The files COMMAND.COM and IO.SYS are required for DOS system files, which
are usually stored under the root directory of system drive (C drive). Input “C:\” in
the input box, and click Start. See Fig. 4-31.

Fig. 4-31 Select Directory of DOS System File

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Software Maintenance

e) Having clicked Start key, if COMMAND.COM and IO.SYS files are missing from

the root directory of system drive C drive, the message will display: There are no

valid DOS system files at the specified location. See Fig. 4-32.

Fig. 4-32

f) If COMMAND.COM and IO.SYS files are not missing, it will prompt: All data on

the USB flash drive will be lost! Do you really want to proceed with format?

Fig. 4-33

g) Click Yes to continue creation of startup disk. The process is shown in Fig. 4-34.

Fig. 4-34

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Software Maintenance

h) When formatting is completed, it prompts the following message (see Fig. 4-35).

Now the USB startup disk is created.

Fig. 4-35

Note: The software in use in the above case is for reference only. The user can

download the software from Internet, or use other software.

4.3.2 Create Batch File ( AUTOEXEC.BAT)

a) Click the right button of the mouse, and select New| Text Document to create a

new text document. Double click the document to open it. Add the following

command in the document: (See Fig. 4-36 and Fig. 4-37)

GHOST -clone, mode=pload,src=1:2\siui.GHO,dst=1:1 –fx –sure –rb

Fig. 4-36

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Software Maintenance

Fig. 4-37

b) Save the text document as AUTOEXEC.BAT. Save as type shall be All Files (see

Fig. 4-38).

Fig. 4-38

c) Copy AUTOEXEC.BAT file to the root directory of the USB startup disk.

4.4 Troubleshooting

4.4.1 After Windows starts up, ultrasound software cannot start up

Solution: Select Start |Programs |Startup, and check if there is an item Shortcut to 7700

in the startup menu as shown in Fig. 4-39.

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Software Maintenance

Fig. 4-39

If there is no Shortcut to 7700 in the startup menu, create a shortcut to 7700 under the

startup menu as shown in Fig. 4-40.

Fig. 4-40

4.4.2 After Windows starts up, ultrasound software enters its interface but returns

to Windows interface immediately

Solution: Select Start |Settings |Control Panel |System. Select Hardware and click

Device Manager to open Device manager to open it (see Fig. 4-41, Fig. 4-42 and Fig.

4-43).

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Software Maintenance

Fig. 4-41

Fig. 4-42 Control Panel

Fig. 4-43 System Properties

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Software Maintenance

Check if there is an item SIUI PCITest: PCITest Driver,checked build under Sound,

video and game controller menu, and if this item works properly (Fig. 4-44).

Fig. 4-44 Device Manager

If the driver was not installed successfully, or the contact between the Industrial Control

Board and the slot is not good, it may result in failure.

If the failure is due to unsuccessful installation of the driver, reinstall the driver and restart

the system.

If the failure is due to poor contact between the Industrial Control Board and the slot,

follow the procedure described in Chapter 2 to open the system housing, re-plug the

Industrial Control Board an ensure that it is fixed properly.

4.4.3 Error message pops up when running ultrasound software (see Fig. 4-45)

Fig. 4-45 Error Message

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Software Maintenance

Solution: The error may be due to lack of the file 2k8HdCrlInit.dat, or lack of a data file

matching the corresponding probe type. To fix this issue, copy the lacked file to the

corresponding directory.

The file 2k8HdCrlInit.dat is backed up in the directory: D:\CD\7700\. Just copy the file

2k8HdCrlInit.dat to the directory for starting up the ultrasound software.

Fig. 4-46

Fig. 4-47

To open the directory of the startup ultrasound software, follow the procedure in Fig. 4-46

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Software Maintenance

to open the properties of the startup software and click Find Target (Fig. 4-47).

Each probe has its corresponding folder (see Table 4-1). Each folder usually has three

files: data0.dat, data1.dat and data2.dat. An error message will show up when these files

are missing (see Fig. 4-45). To fix this issue, please copy the corresponding probe files to

the matched folder.

Table4-1
Probe Corresponding Folder
C3L60B D:\C3I60F\
L7I50B D:\L7I50F\
C3I20B D:\C3I20F\
V6L11B D:\V6I11F\
U5L50B D:\U5I50F\
C3L40B D:\C3I40F\
L7I38B D:\L7I38F\
C5I20B D:\C5I20F\
V5I11WB D:\V5I11F\

4.5 Collect Information

In order to provide good and fast service to fix the possible failures, whenever a failure

occurs, please collect relevant information and send to us.

a) Mark down the time when the failure occurred. It would be better to mark down the

failure time as accurate as minute, and see if the clock in the system stops.

b) If there is any sound like “di, di” from the probe, record the situation in details.

c) Press Freeze and Probe Select respectively to check if there is any

improvement or any new status, and record the situation in details.

d) Unplug the probe, observe the system; re-plug the probe and observe the system

again. Record the system status in details, and see if the failure is improved or

fixed.

e) Send us one copy of the file Error.ini under the folder C:\ Ultrasound\ Cd\ 7700\

files\ and the folder D:\test\.

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Shantou Institute of Ultrasonic Instruments

SIUI Service Link

Mailing: Shantou Institute of Ultrasonic Instruments (SIUI)

77 Jinsha Road, Shantou, Guangdong 515041, China

Tel: 86-754-88250150 Fax: 86-754-88251499

E-mail: siui@siui.com or service@siui.com

October, 2004