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Gallium nitride
Gallium nitride is the material of choice for solid-state light emitters covering the UV, blue, and green parts of the
spectrum. With the help of phosphors white light can also be produced. Gallium nitride devices are finding their way
into mass-markets, but the technology is yet in its infancy and there is considerable scope for performance improve-
ments. We collaborate with academic and industrial partners to advance the technology.
Device design
The team has designed and fabricated resonant cavity LEDs, address-
able LED arrays, and LEDs with enhanced light extraction efficiency.
For the development of resonant cavity (RC) LEDs it coordinated a
European research consortium called “AGETHA”. This consortium
developed RC-LEDs for data communications through plastic optical
fibre (POF).
Above: TEM cross section of a Pd-Ag The development of addressable LED arrays involved the integration
contact on p-type GaN (TEM courtesy of silicon driver circuitry with a gallium nitride LED array. The LED
of dr. Marie-Antoinette Poisson, Thales) array was flip-chip mounted onto the silicon. The silicon driver chips
Above: Integrated assembly (LED array and silicon were fabricated in the silicon fabrication facility within Tyndall.
driver circuitry)
The team is also involved in the design and fabrication of Schottky
diodes and laser diodes. The Schottky diodes are developed for the
European Space Agency, to be used as shunt diodes on solar panels.
Defect reduction
www.tyndall.ie
From Atoms to Systems
Ohmic contacts
Facilities
TEM cross-section of a PdAg contact on p-type GaN, the
insert showing a depth profile
The team utilises the central fabrication facilities at Tyndall for
its device fabrication. These facilities include optical and electron
beam lithography, separate electron beam evaporation systems for
metals and for optical coatings; PECVD deposition for dielectric
layers, ICP etching, rapid thermal annealing, wafer thinning
and polishing, wafer scribing and dicing, and device packaging.
Test facilities comprise a probe station for automated L-I-V
measurements, a camera system for near field measurements, a
communications signal analyser for bandwidth measurements, an
integrating sphere, and several spectrometers. Tyndall colleagues
provide access to characterisation techniques such as AFM, XRD,
micro-Raman, ellipsometry, and also access to reliability assessment
techniques such as temperature/humidity cycling, salt spray
testing, and highly accelerated stress testing (HAST). Tyndall has
furthermore relevant expertise in photonics theory and in thermal Above: Solder balls deposited with the solder dispense
modelling. system
Above: Results of a thermal simulation of a flip-chip LED assembly. a) top view. b) Side view. c) Temperature scale. White boxes show the outline
of the LED chip. Heat dissipation: 2W into a 20 μm wide periphery of the p-contact.
Brian Corbett
E: brian.corbett@tyndall.ie
T: +353 21 4904380