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曜凌光電股份有限公司

住址: 42878 台中縣大雅鄉科雅路 25 號 5F WEB: http://www.Raystar-Optronics.com 5F, No.25, keya Rd. Daya Township, Taichung E-mail: sales@raystar-optronics.com Tel:886-4-2565-0761 Fax:886-4-2565-0760 County, Taiwan

RC1602B-BIW-ESX

SPECIFICATION CUSTOMER:

APPROVED BY PCB VERSION DATE
FOR CUSTOMER USE ONLY

SALES BY

APPROVED BY

CHECKED BY

PREPARED BY

ISSUED DATE:

Page 1 , Total 28 Pages

RC1602B-BIW-ESX

Contents
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. Revision History General Specification Module Coding System Interface Pin Function Outline dimension & Block Diagram Display Control Instruction Character Generator ROM Pattern Instruction Table Timing Characteristics Initializing of LCM Optical Characteristics Absolute Maximum Ratings Electrical Characteristics Backlight Information Reliability Inspection specification Precautions in use of LCD Modules Material List of Components for RoHs Page 3 4 5 6 7 8 11 12 13 15 17 18 18 19 20 21 25 26

Page 2 , Total 28 Pages

06. Total 28 Pages . Note First issue Page 3 . Revision History DATE 2008.17 VERSION 1 REVISED PAGE NO.1.

95 mm2 LCD type: STN Negative.) mm3 View area: 66.0 x 36.0 x 16.55 x 5. Duty: 1/16 View direction: 6 o’clock Backlight Type: LED white Page 4 .0 x 13.60 x 0.20 x 11. General Specification The Features is described as follow: Module dimension: 80.0 mm2 Active area: 56.2 (max.55 mm2 Character pitch: 3.2.70 mm2 Character size: 2. Blue Transmissive. Total 28 Pages .65 mm2 Dot pitch: 0.95 x 5.5 mm2 Number of Characters: 16 characters x 2 Lines Dot size: 0.55 x 0.

White O:LED. U. Orange 5 LCD Polarizer Type. N. T. U. 3 4 Serials code P:TN Positive. Special code X: Without Negative Voltage. T.T.T.T. W. Total 28 Pages . 6:00 5:Transmissive. 6:00 3:Reflective.6:00 G:Reflective. 12:00 0:Reflective. W. White C:Transmissive. Yellow Green A:LED. W. Module Coding System R 1 C 2 1602 3 B 4 B 5 I 6 W 7 ESX 8 Item Description R:Raystar Optronics Inc. 6 Temperature range. T. View direction 7 Backlight 8 F:CCFL.12:00 H:Transflective.T.12:00 2:Transmissive. Page 5 .T.T. 12:00 B:Transflective. Blue green T:EL.6:00 F:Transmissive. 6:00 K:Transflective. 1 C:Character Type 2 Display G:Graphic Type Number of dots:Character 16 words. 6:00 L:Transmissive. White G:LED. W. U. 2 Lines. Blue F:FSTN Positive T:FSTN Negative A:Reflective. 12:00 1:Transflective. Yellow Green B:STN Negative. Green D:EL. N.12:00 I:Transmissive. N.6:00 E:Transflective.6:00 N:Without backlight P:EL.T. W. T. U. Amber W:LED.12:00 J:Reflective.T. Gray N:TN Negative. G:STN Positive. T. N.T. T. Green ES: English and European standard font.12:00 Y:LED. N.T. U.3.T. U. 6:00 4:Transflective.12:00 D:Reflective. W.T. Gray Y:STN Positive. N.

L: Instruction code H: Read(MPU→Module) L: Write(MPU→Module) Chip enable signal Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line LED + LED- Description (Variable) Operating voltage for LCD Page 6 . Interface Pin Function Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol VSS VDD VO RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K Level 0V 5. Total 28 Pages .4.0V H/L H/L H.H→L H/L H/L H/L H/L H/L H/L H/L H/L - - Ground Supply Voltage for logic H: DATA.

5.55 2.08 A 4-O1.0 PTH 1 80. Total 28 Pages . Optional Character located DDRAM address DDRAM address N.54*15=38.55 0.95 5.0 PAD 1.2 16.95 0.5.5 8. Outline Dimension &Block Diagram 4.0(VA) 56.Vss.0 2.V.55 4.6 LED B/L 0.0 P2.0 3.55 75. 0.45 8.3 5.0 0.4 DOT SIZE SCALE 5/1 MPU 80 series or 68 series RS R/W E DB0~DB7 Com1~16 Controller/Com Driver HD44780 or Equivalent 16X2 LCD Seg1~40 Seg41~80 VR 10K~20K Vdd Vo Vss Bias and Power Circuit D M CL1 CL2 Vdd.6 2 16 K 36.5 40.5 71.6 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Vss Vdd Vo RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K 12.8 16-O1.1 3.95 7.55 10.V1~V5 Seg Driver External contrast adjustment.2 66.5(AA) 5.5 PTH 4.3 The non-specified tolerance of dimension is 5.0 0.2(AA) 13.7 15.65 31.0 0.2Max 2.0(VA) 11.5 25.7 0. Generator 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F Page 7 .2.3mm.76 18.6 0.0 1.55 12.

the controller LSI is in the internal operation mode. then data is stored into the DR from DDRAM or CGRAM. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC0 1 0 0 1 1 1 0 Page 8 . Its extended capacity is 80×8 bits or 80 characters. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM. Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. the controller has two 8-bit registers. the busy flag is output to DB7. When RS=0 and R/W=1. these two registers can be selected. and the next instruction will not be accepted. Total 28 Pages . etc. The IR stores instruction codes. The next instruction must be written after ensuring that the busy flag is 0. Display Control Instruction The LCD display Module is built in a LSI controller. The DR temporarily stores data to be written or read from DDRAM or CGRAM. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. an instruction register (IR) and a data register (DR). When address information is written into the IR. By the register selector (RS) signal. such as display clear and cursor shift.6. The IR can only be written from the MPU. and address information for display data RAM (DDRAM) and character generator (CGRAM).) Read busy flag (DB7) and address counter (DB0 to DB7) Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR) Busy Flag (BF) When the busy flag is 1. RS 0 0 1 1 R/W 0 1 0 1 Operation IR write as an internal operation (display clear.

and for 5×10 dots. Page 9 .Display position DDRAM address 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 2-Line by 16-Character Display Character Generator ROM (CGROM) The CGROM generate 5×8 dot or 5×10 dot character patterns from 8-bit character codes. Total 28 Pages . eight character patterns can be written. four character patterns can be written. To show the character patterns stored in CGRAM. Character Generator RAM (CGRAM) In CGRAM. the user can rewrite character by program. Write into DDRAM the character code at the addresses shown as the left column of table 1. See Table 2. For 5×8 dots.

Character Codes (DDRAM) and Character patterns Table 1. Total 28 Pages .Relationship between CGRAM Addresses. F o r 5 * 8 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 4 3 2 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * * * * * * 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C h a ra c te r p a tte rn ( 2 ) C h a ra c te r p a tte rn ( 1 ) H ig h Low 0 0 0 0 * 0 0 0 0 0 0 0 * 0 0 1 Low 0 0 0 0 0 1 0 1 0 0 0 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 0 0 1 1 0 1 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1 H ig h * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * Low 0 0 0 0 0 0 C u rs o r p a tte rn 0 C u rs o r p a tte rn 0 0 0 0 * 1 1 1 * * * F o r 5 * 1 0 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 0 0 0 0 0 0 0 0 1 1 1 1 4 3 2 0 0 0 0 1 1 1 1 0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * 6 * * * * * * * * * * * * 5 4 3 0 0 0 0 0 0 0 0 0 * 2 Low 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 * C h a ra c te r p a tte rn 0 0 0 1 0 H ig h Low Low H ig h * 0 * 0 * * * * * * * * * 0 * * 0 0 0 0 * 0 0 0 0 0 C u rs o r p a tte rn : " H ig h " Page 10 .

Upper 4 bit Lower 4 bit LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH LLLL CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8) CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8) LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH Page 11 . Character Generator ROM Pattern Table 2.7. Total 28 Pages .

Set interface data length (DL:8-bit/4-bit). The contents of DDRAM are not changed. cursor (C). Total 28 Pages . Set cursor moving and display shift Description Execution time (fosc=270Khz) 1. Assign cursor moving direction and enable the shift of entire display. Set DDRAM address in address counter. without changing of DDRAM data. The contents of address counter can also be read. Whether during internal operation or not can be known by reading BF. Set display (D). Read data from internal RAM (DDRAM/CGRAM).53ms 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 D I/D C SH B 39µs 39µs 0 0 0 0 0 1 S/C R/L - - control bit. and the direction. 39µs 0 0 0 0 1 DL N F - - 39µs 0 0 0 0 0 1 1 AC5 AC4 AC3 AC2 AC1 AC0 39µs 39µs AC6 AC5 AC4 AC3 AC2 AC1 AC0 0 1 BF AC6 AC5 AC4 AC3 AC2 AC1 AC0 0µs 1 1 0 1 D7 D7 D6 D6 D5 D5 D4 D4 D3 D3 D2 D2 D1 D1 D0 D0 43µs 43µs Page 12 . Instruction Table Instruction Code Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Clear Display Return Home Entry Mode Set Display ON/OFF Control Cursor or Display Shift Function Set Set CGRAM Address Set DDRAM Address Read Busy Flag and Address Write Data to RAM Read Data from RAM 0 0 0 0 0 0 0 0 0 1 Write “00H” to DDRAM and set DDRAM address to “00H” from AC Set DDRAM address to “00H” from AC and return cursor to its original position if shifted. and blinking of cursor (B) on/off control bit. display font type (F:5×11 dots/5×8 dots) Set CGRAM address in address counter.8.53ms 0 0 0 0 0 0 0 0 1 - 1. numbers of display line (N:2-line/1-line)and. Write data into internal RAM (DDRAM/CGRAM).

R/W to E) Address hold time Data set-up time Data hold time Symbol TC TPW TR.0V Item Enable cycle time Enable pulse width Enable rise/fall time Address set-up time (RS.9. Total 28 Pages . VDD=5. Timing Characteristics 9.1 Write Operation Ta=25℃.TF tAS tAH tDSW tH Min 1200 140 - 0 10 40 10 Typ - - - - - - - Max - - 25 - - - - Unit ns ns ns ns ns ns ns Page 13 .

R/W to E) Address hold time Data delay time Data hold time tAH tDDR tH 10 - 10 - - - - 100 - ns ns ns Symbol TC TPW TR. VDD=5V Item Enable cycle time Enable pulse width (high level) Enable rise/fall time Address set-up time (RS.9.2 Read Operation Ta=25℃.TF tAS Min 1200 140 - 0 Typ - - - - Max - - 25 - Unit ns ns ns ns Page 14 . Total 28 Pages .

10. RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 1 0 * * * * 0 0 N F * 0 * * * * * 0 Wait for more than 39 µs Function set RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 * * * Function set 0 1 0 * 0 0 0 * * * 0 0 N F * * * Wait for more than 37us BF can not be checked before this instruction. Initializing of LCM Power on Wait for more than 40 ms after VDD rises to 4.5 V BF can not be checked before this instruction. RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 1 1 0 * * * * Wait for more than 39us BF can not be checked before this instruction. Total 28 Pages . RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control * * * 0 0 * 0 0 0 0 * * * 0 * 1 D C B 0 Wait for more than 37 µs RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 * * 0 * 0 0 * 0 0 0 * * * 0 1 0 * 0 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 * * * 0 0 * 0 * * * 0 1 0 0 I/D SH * Initialization ends 4-Bit Ineterface Page 15 .

53ms ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Initialization ends 8-Bit Ineterface Page 16 .5 V ait BF can not be checked before this instruction. RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 39us ait BF can not be checked before this instruction.Power on W for more than 40 ms after VDDrises to 4. Total 28 Pages . RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 37us ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 0 1 B C D W for more than 37 µs ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0 0 0 0 0 1 W for more than 1.

Optical Characteristics Item View Angle Contrast Ratio Response Time Symbol (V)θ (H)φ CR T rise T fall Condition CR≧2 CR≧2 - - - Min 20 -30 - - - Typ - - 3 150 150 Max 40 30 - 200 200 Unit deg deg - ms ms Definition of Operation Voltage (Vop) Definition of Response Time ( Tr . Total 28 Pages .11. 1/a bias Definition of viewing angle(CR≧2) θb θf φ= 180° θl θr φ= 270° φ= 90° φ= 0° Page 17 . Tf ) Intensity 100% Selected Wave Non-selected Conition Intensity Selected Conition Non-selected Conition Non-selected Wave 10% Cr Max Cr = Lon / Loff 100% 90% Vop Driving Voltage(V) Tr Tf [positive type] [positive type] Conditions : Operating Voltage : Vop Viewing Angle(θ,φ) : 0°, 0° Frame Frequency : 64 HZ Driving Waveform : 1/N duty .

Absolute Maximum Ratings Item Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD Symbol TOP TST VI VDD-VSS VDD-V0 Min -20 -30 VSS -0. Total 28 Pages .5 5.3 -0.2 - - VDD 0. Electrical Characteristics Item Supply Voltage For Logic Supply Voltage For LCD Input High Volt. Input Low Volt. Output Low Volt.6 - 0.2 0.0 - 3.0V Min 4. Supply Current Symbol VDD-VSS Condition - Ta=-20℃ VDD-V0 Ta=25℃ Ta=70℃ VIH VIL VOH VOL IDD - - - - VDD=5.4 1.7 - - - - - 1.5 - - 3.5 Unit V V V V V V V V mA Page 18 .3 Typ - - - - - Max +70 +80 VDD 7 13 Unit ℃ ℃ V V V 13.0 Typ 5.2 Max 5. Output High Volt.7 VDD VSS 3.9 - 1.12.

14. Total 28 Pages . 2.5V - - CONDITION Supply Current ILED Supply Voltage V Reverse Voltage VR Luminous Intensity - - - - ILED≦32mA 25℃.300 0. - - 0. 6 Chromaticity x y Life Time (For Reference - only) Color White - 30K - Hr.8 3.7 5 UNIT mA V V TEST V=3. Backlight Information Specification PARAMETER SYMBOL MIN 28.Drive from pin15. (Note 1) Note: The LED of B/L is drive by current only.50-60%RH. drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum).310 - - 30 - 7 CD/M2 ILED=32mA TYP 32 3.pin16 pin15 pin16 R R A K B/L LCM (Will never get Vee output from pin15) Page 19 .5 - MAX 40 3.3 - 24 IV 5.

Reliability Content of Reliability Test (wide temperature. Note3: Vibration test will be conducted to the product itself without putting it in a container. The module should be allowed to stand at 60℃. 1.Y.Z for Each 15 minutes VS=800V.90%RH max For 96hrs under no-load condition excluding the polarizer. Endurance test applying the electric stress under temperature for a long time.RS= Static electricity test Endurance test applying the electric stress to the terminal.15.90%RH 96hrs Note 2 1. The sample should be allowed stand the following 10 cycles of operation -20℃ Thermal shock resistance 30min 5min 1 cycle fixed amplitude: 15mm Vibration.2 Note1: No dew condensation to be observed. and the thermal stress to the element for a long time. -20℃~70℃) Environmental Test Test Item High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation time. Frequency: Vibration test Endurance test applying the vibration during transportation and 10~55Hz. time. Then taking it out and drying it at normal temperature. Note2: The function test shall be conducted after 4 hours storage at the normal temperature and humidity after remove from the test chamber.2 1 Endurance test applying the high storage temperature for a long 80℃ Endurance test applying the high storage temperature for a long -30℃ Endurance test applying the electric stress (Voltage & Current) 70℃ 1.5kΩ CS=100pF 1 time —— 3 30min 25℃ 70℃ -20℃/70℃ 10 cycles - Content of Test Condition 200hrs 200hrs 200hrs low -20℃ 200hrs 60℃. One cycle 60 seconds to 3 directions of X. Page 20 . Total 28 Pages . using.

Inspection specification NO Item Criterion 1. Total 28 Pages .02<W≦0.03<W≦0.02 0.1 White and black spots on display ≦0.03 0. contaminatio n 3. not easy to find.00<Φ Total Q TY 04 Polarizer bubbles 2.05<W 03 Acceptable Q TY Accept no dense 2 As round type Acceptable Q TY Accept no dense 3 2 0 3 2. 1.4 No function or no display.8 Contrast defect.6 LCD viewing angle defect.1 Round type : As following drawing Φ=( x + y ) / 2 2. white spots.50 0.3 Display malfunction. 1. dot or icon.2 Densely spaced: No more than two spots or lines within (display only) 3mm 3.5 Page 21 .5 Size Φ Φ≦0.50<Φ≦1.5 2. AQL 01 Electrical Testing 0.05 0.2 Missing character.20<Φ≦0.2 Line type : (As following drawing) (non-display) Length Width --L≦3.1 Missing vertical. 1.5 LCD black spots. W≦0.0 L≦2.5 --If bubbles are visible.00 1.16. on LCD 2.25mm.5 Current consumption exceeds product specifications.20 0.65 02 2. must check in specify direction. 1. 1. horizontal segment. segment contrast defect. 1.7 Mixed product types. no more Black or white spots than three white or black spots present. judge using black spot specifications. 1.

x is the total length of each chip. 6. z: Chip thickness Z≦1/2t Page 22 .5 y: Chip width x: Chip length Not over viewing x≦1/8a area Not exceed 1/3k 1/2t<z≦2t x≦1/8a ☉If there are 2 or more chips.1 General glass chip : 6.2 Corner crack: z: Chip thickness Z≦1/2t 2. Total 28 Pages .3 LCD black spots. contamination AQL Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 Chip on panel surface and crack between panels: 06 Chipped glass y: Chip width x: Chip length Not over viewing x≦1/8a area Not exceed 1/3k 1/2t<z≦2t x≦1/8a ☉If there are 2 or more chips. x is total length of each chip. white spots.NO 05 Item Scratches Criterion Follow NO.1.1.

☉If the product will be heat sealed by the customer. y: width y≦1/3L x: length x≦a y: Chip width x: Chip length Page 23 .2.2 Non-conductive portion: z: Chip thickness 0 < z≦t 06 Glass crack 2.3 Substrate protuberance and internal crack.2 Protrusion over terminal : 6. the alignment mark not be damaged.NO Item Criterion AQL Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2.2. 6.5 z: Chip thickness y≦ L x≦1/8a 0 < z≦t ☉If the chipped area touches the ITO terminal.1 Chip on electrode pad : y: Chip width x: Chip length y≦0. Total 28 Pages . over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications.5mm x≦1/8a 6.

1 Illumination source flickers when lit.6 Parts on PCB must be the same as on the production characteristic chart. 10.NO 07 Item Cracked glass Backlight elements Criterion The LCD with extensive crack is not acceptable. missing solder connections. 8.5 2.2 COB seal surface may not have pinholes through to the IC. And there should be no more than three places. 10.2 Spots or scratched that appear when lit must be judged. 10. stains or other contamination.2 Bezel must comply with job specifications.65 11 Soldering 11.4 There may not be more than 2mm of sealant outside the seal area on the PCB. 11. zebra pad or screw hold pad.65 2.1 No un-melted solder paste may be present on the PCB.65 2.5 2.5 0.3 No residue or solder balls on PCB.5 0. 10. 10.7 The jumper on the PCB should conform to the product characteristic chart. 9. 10. make sure it is smoothed down. missing parts or excess parts.4 No short circuits in components on PCB.65 2.65 0. Using LCD spot. oxidation or icicle.5 0. 10.5 2.5 0. 11.5 08 09 Bezel 10 PCB、COB X * Y<=2mm2 2.1 COB seal may not have pinholes larger than 0.5 2. 10. be deformed or have fingerprints. Total 28 Pages .3 Backlight doesn’t light or color wrong.5 0. LED pad. 11. 9.5 No oxidation or contamination PCB terminals. There should be no wrong parts.1 Bezel may not have rust.5 0.3 The height of the COB should not exceed the height indicated in the assembly diagram.9 The Scraping testing standard for Copper Coating of PCB X Y AQL 2. 8.2 No cold solder joints. 10.5 2.2mm or contamination.65 2.65 2. Page 24 . 8. lines and contamination standards.8 If solder gets on bezel tab pads.

Total 28 Pages .5 2. Don’t make extra holes on the printed circuit board.5 2. 5. 6.11 Product dimension and structure must conform to product specification sheet. 12. Don’t drop.65 0. 12.65 0. 12. circuits.65 2. Soldering: only to the I/O terminals. 12. 12. bend or twist LCM. Avoid applying excessive shocks to the module or making any alterations or modifications to it.8 Pin type must match type in specification sheet.1 No oxidation. solder residue or solder balls on product. Page 25 . Don’t disassemble the LCM.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it causes the interface pin to sever. 12. Precautions in use of LCD Modules 1.65 0.7 Sealant on top of the ITO circuit has not hardened. curves or. Don’t operate it above the absolute maximum rating.5 2.4 The IC on the TCP may not be damaged. 12. contamination. modify its shape or change the components of LCD module.10 Product packaging must the same as specified on packaging specification sheet.5 0. 4. AQL 2.5 0.9 LCD pin loose or missing pins.3 No contamination. 12.5 2. Storage: please storage in anti-static electricity container and clean environment. 2. 7. bends on interface Pin (OLB) of TCP. 3. 12.NO Item Criterion 12. 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color.65 12 General appearance 17.2 No cracks on interface pin (OLB) of TCP.

:235±5℃; Recommended customer’s soldering temp. the LCM. including. (2) Heat-resistance temp. max.: Reflow:250℃. but not limited to. Page 26 . hereby declares that all of or part of products. curve of reflow. Material List of Components for RoHs 1. Total 28 Pages . of connector:280℃. 30 seconds Max. 10 seconds max. accessories or packages. 3 seconds. RAYSTAR Optronics Co. Process for RoHS requirement: (1) Use the Sn/Ag/Cu soldering surface the surface of Pb-free solder is rougher than we used ; before. Temp. Exhibit A:The Harmful Material List Material Limited Value (Cd) 100 ppm (Pb) 1000 ppm (Hg) 1000 ppm (Cr6+) 1000 ppm PBBs 1000 ppm PBDEs 1000 ppm Above limited value is set up according to RoHS. Ltd. manufactured and/or delivered to your company (including your subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations. 2.; Connector soldering wave or hand soldering:320℃.18. (3) Temp.. including the following substances.

□ NG .B/L Color: 3. 5. Connector: □ Pass □ NG .Hole size of □ Pass □ NG . □ NG . □ NG . □ Pass □ NG . □ NG . □ NG . 4. 4. Panel Type: □ Pass 2.Pitch of Connector: 2.B/L Type: □ Pass □ NG .Mounting Hole Type: □ Pass □ Pass □ NG . Height of Frame to □ Pass PCB: □ Pass 9. 5. Thickness of PCB: 8. 2. 1.Others: 2、Mechanical Specification: □ Pass 1.Backlight Position: □ Pass 7. □ NG .Page: 1 LCM Sample Estimate Feedback Sheet Module Number: 1、Panel Specification: □ Pass 1. View Area: □ Pass 5.Connector Position: □ Pass 5. □ NG .Others: □ NG . 6.Others: 4、Backlight Specification: □ Pass □ NG . □ NG . □ NG .Operating □ Pass Temperature: 7. □ NG . PCB Size: □ Pass 2. 1. View Direction: □ Pass 3.B/L Driving Current: □ Pass □ NG . 7.Height of Module: □ Pass 10. 3.B/L Driving Voltage (Reference for LED Type):□ Pass □ NG . □ NG .Materal of Frame: □ Pass 4. □ NG . Active Area: 6.B/L Solder Method: □ Pass □ NG . Total 28 Pages . Numbers of Dots: □ Pass 4.Mounting Hole size: □ NG . □ NG .Others: >> Go to page 2 << Page 27 .Frame Size: □ Pass 3.Brightness of B/L: □ Pass □ NG . □ NG .Storage Temperature: □ Pass 8. □ NG . 3、Relative Hole Size: □ Pass □ NG . □ NG .Fix Hole Position: □ Pass 6.

Output: □ Pass □ NG .Input Voltage: □ Pass □ NG .LCD Uniformity: □ Pass □ NG .Driving Voltage for LCD: □ Pass □ Pass □ NG .B/L Driving Method: 6. 5. 10.Page: 2 Module Number: 5、Electronic Characteristics of Module: □ Pass □ NG .Contrast for LCD: □ Pass □ NG . 4.ESD test: □ Pass □ NG .Interface Function: □ Pass □ NG . 2. 9. 8.Others: 6、Summary: Sales signature: Customer Signature: Date: / / Page 28 . 7. 3. Total 28 Pages .Supply Current: □ NG . 1.Negative Voltage □ Pass □ NG .