Professional Documents
Culture Documents
Cooling is aimed at removing unwanted heat. It is thus a major concern for industrial, electronic
and power generation systems. The cooling method can be either active or passive [1]. For the
active cooling method, there is electrical or mechanical power input (macro-cooling, for example
fan used to cool a room). On the other hand, a passive cooling system (micro-fin cooling system)
does not use any power but rather uses natural laws to enhance cooling.
The technology employed in passive cooling system includes use of fins. Heat transfer is
enhanced through increasing exchanging surface. There are two types of fins that can be used in
In modern world design of micro-scaled products has increased with the technology of micro-
cooling for example use of micro-fins. This technology requires less space, few materials and is
faster in its performance [2]. This technology is mostly used in electronic cooling, LED
applications and in generation of solar power to remove heat waste that they generate. The
cooling mechanism need to be highly cost effective and efficient. Also, micro-fins are more
reliable as they are not prone to cooling failures as compared to active cooling systems which
As such micro-fins can solve the problem of space and volume when compared to macro-cooling
systems. The convective heat transfer needs to be applied in order to optimize heat transfer using
micro-fins. Both heat sink geometric and heat transfer coefficient has to be investigated. For a
heat sink with micro-fins arranged vertically upwards, it is found that radiation contributes in
part of the heat transfer (around 22%) [2]. As such, radiative exchange should be considered
when designing micro-scale cooling system. Other researchers have proved that it is impossible
From the previous work by other authors, it has been found that micro-fin arrays with height
ranging between 0.1 to 0.2 mm could produce thermal exchange up to 10%. It has also, been
found that the effect of orientation can be neglected for the horizontal and vertical micro-fin
arrays. In addition, it has also been found that convective thermal exchange increases with
decreasing the micro-fin height while fin spacing is kept constant [1].
An array of micro-fins is used to enhance heat transfer rate from the base surface. This
technology increases the surface area where heat transfer takes place. The micro-fin arrays and
geometries help create turbulence in the flowing fluid which further improves heat transfer
coefficient [4]. However, this method results in pressure drop, a critical condition for high
performance applications. It can therefore be said that optimized fin array and geometry are
conciliation of pressure drop, performance, size and weight. The micro-fin material is usually of
high thermal conductivity. The fins enhance convective heat transfer by creating difference in
temperature between the object and its environment. Aluminium is the preferred material
Other researchers have proposed many techniques through numerical, analytical and
experimental analysis for the effectiveness of micro-fins heat exchanger. They have also tried to
find out how the shape and size of the micro-fins affect heat transfer in the system.
From the research conducted by Isak Kotcioglu1 et [5], heat transfer rate in the system depends
cooling rate of air temperature at the inlet. However, the effect decreases with increase in Reynolds
number. The figure below shows that hexagonal fin arrays have a higher heat transfer rate because
of higher turbulence than circular fin and square pin-fins. The presence of recirculation zones helps
in mixing of the fluid at the boundary layer thus promoting convective heat transfer [5].
There are various shapes of fins that can be used in in micro-scale cooling system such as the
rhombic, elliptic, cylindrical, stepped, tapered and combination of these or other geometries. From
the work done by Kwang-Yong Kim [6], when the cross -sectional area of the fins is changed from
circular to another shape the overall heat transfer increases while the pressure drops. Thus, the size
and shape of the fins will compromise between pressure loss and heat transfer.
From the research done by Natarajan et al [8], they found that thickness of the fins does not offer
significant effect on heat transfer. This is because thicker fins would cause heat losses through
conduction as well as suppress heat losses through convection between fins. Bar-Cohen et al [7]
come up with a method of designing heat sink to minimize weight while maximizing heat transfer.
Later Do et al [10] proved relation between micro-fin geometries, angle of tilt and coefficient of
heat transfer. Leonardo et al [2] come up with a correlation between thermal behavior and fin
geometries. In this case, it was found that coefficient of heat transfer increases with decrease in fin
height, increase in fin spacing and also with increase in fin thickness.
From the work done by Sidy et al [10], it is again found that heat transfer can be increased by
adding enhancement surfaces. The enhancement surfaces increase the heat transfer area as well as
heat transfer coefficients by interrupting boundary layers, flow mixing and interrupting turbulent
transport. In the study of Sidy et al [10] micro-fin circular array was used as the surface
enhancement. Their micro-fins had area enhancement equal to Atotal/Abase = 2.44. The respective
dimensions of the pins were: diameter 0.125 mm, height 0.23 mm and pitch of 0.25 mm.
The figure below shows heat transfer coefficeint for enhanced and smooth surfaces being
compared.
Figure 2: heat transfer coeficient for enhanced (using micro-fins) and smooth surfaces [10].
From the work done by Sidy [10], there is high enhancement factor of 3.03 in the heat trasnfer
coefficient. The enhancement of heat transfer (3.03) is larger compared to the area enhancement
(2.44). for paraller micr-fins, the enhancement heat transfer will be higher than 3.03. This suggest
that the shape and size of the micro-fins will play a key role in improving heat transfer of the
system.
From the previous work done by Bogdan et al [11], rate of heat transfer can be increased by
increasing flow turbulence. However, the turbulence flow cannot reach it maximum strength
because of the viscous sublayer. This layer is situated near the no-slip boundary. At this boundary
flow velocity starts decreasing changing the flow to laminar. As the flow changes to laminar, heat
transfer decreases. The presence of micro-fins helps to disturb the viscous sublayer thus creating
turbulence which then increases heat transfer. The strength of the turbulence depends on the
geometry, size and shape of the micro-fins used. When smooth micro-fins and tetrahedral fins are
compared, the tetrahedral fins will offer a higher heat transfer because of their shape and geometry.
The main objective of this research work is to find the size, geometry and shape to be used in
From this research work the improved design will constitute certain size parameters to help
optimize heat transfer. The prescribed design parameters are height, area and spacing. The micro-
fin height is to be 0.2 mm. This will help in disturb the viscous sublayer thus creating turbulence
responsible for higher heat transfer. From the previous research work by Bogdan [10] the height
was in range of 0.3 to 0.4 mm. From the research sources decreasing the height will increase the
heat transfer thus the height is reduced to 0.2mm. The section of the duct pipe will be 25 mm in
length while its area should be at least 600 mm2. The spaces between the micro-fins will be 0.4
mm and it will be equal for the whole design. The proposed shape for the micro-fins is 45 degree
tetrahedral. This shape was preferred because from the previous research work it offered the
highest heat transfer compared to other shapes such as augmented egg crate, egg crate, double
References
1. Abbas Jassem Jubear and Ali A. F. Al- Hamadani, Mechanical Engineering Department,
Wasit University, Kut-Wasit-Iraq, the effect of fin height on free convection heat transfer
Cornwall, UK
3. Hossein Shokouhmand, Ali Ahmadpour, Heat Transfer from a Micro Fin Array Heat Sink
by Natural Convection and Radiation under Slip Flow Regime, Proceedings of the World
Congress on Engineering 2010 Vol II WCE 2010, June 30 - July 2, 2010, London, U.K.
4. Saroj Yadav, Krishna Murari Pandey, A Parametric Thermal Analysis of Triangular Fins
Silchar, India.
5. Isak Kotcioglu1, Gokhan Omeroglu1 and Sinan Caliskan, Thermal Performance and
8. Natarajan SK, Mallick TK, Katz M, Weingaertner S. Numerical investigations of solar cell
temperature for photovoltaic concentrator system with and without passive cooling
arrangements.
9. Do KH, Kim TH, Han Y-S, Choi B-I, Kim M-B. General correlation of a natural convective
heat sink with plate-fins for high concentrating photovoltaic module cooling
10. Sidy Ndao, Hee Joon Lee, Yoav Peles, Michael K. Jensen. Heat transfer enhancement from
micro pin fins subjected to an impinging jet, Department of Mechanical, Aerospace, and
11. Bogdan, Ryan, Mike, Sierra. Heat Transfer Optimization in a Microfin Array final report,
Kansas State University, College of Engineering and Computer Science April, 2018.