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ST: Sensors and Connectivity for IoT

Solutions

Francesco Furnari
IoT Devices
2
ST products partitioning
32-bit ULP
MCUs Display Power
Supplies and
Drivers
Signal
transducers Audio
Analog amplifiers
User interface
front-end
Bluetooth
Switches Microcontroller SMART

Analog Sub 1 GHz


MCU Connectivity
MEMS
sensors
microphones Wi-Fi
Modules

Motion and
environmental Digital Power NFC & RFID
MEMS sensors sensors management Protections

ESD Protections
EMI Filters &
RF-IPD

Power Battery management


management ICs & monitoring ICs

Current
Smart reset
sensing
IoT - Connectivity 3

Connectivity
Narrowband PLC
(M&M, PRIME, IPv6, G3)
Broad Band PLC
(Home Plug GP/AV)
RF
Sub-GHz
PLC 150MHz  915MHz
(6LoWPAN)
(WMBUS)

RF
RFID 2.4 GHz
NFC
WiFi Module
NFC/RFID Reader BT 3.0/4.0 Module
DUAL Ifs EEPROM BT Low Energy
RFID/NFC TAG

Positioning
GSM
GPRS M2M GPS/GLONASS
GALILEO/BeiDou
Secure MCU
M2M Smart Card
SPIRIT Family
RF Sub-1GHz Transceivers
WIDE APPLICATION COVERAGE 5

HOME/BUILDING AUTOMATION

SMART METERING

ALARM SYSTEMS

INDUSTRIAL MONITORING & CONTROL


SPIRIT1 – Sub 1GHz RF Transceiver
• Frequency bands: 150-174MHz, 300-348 MHz, 387-470 MHz, 779-956 MHz
• Modulation schemes: FSK, GFSK, MSK, OOK and ASK
• Air data rate from 1 to 500 kbps
• Programmable output power: from -30dBm to +16dBm (boost mode)
• RX sensitivity: -118dBm @1.2kbps PER=1%
• Low current consumption
• Shutdown: 2.5nA
• Stand-by: 650nA
• Sleep: 950nA
• RX: 9mA
• TX: 21 mA @+11dBm

• Programmable channel spacing (12.5 kHz min).


• Frequency Hopping, Antenna diversity algorithm
• AES 128-bit encryption co-processor
• Automatic acknowledgement, retransmission, and timeout protocol
engine
• Embedded packet handler
• Wireless M-BUS, 6LowPAN
• EN 300 220, FCC CFR47 15 (15.205, 15.209, 15.231, 15.247, 15.249), and
ARIB STD T-67, T-108 compliant QFN20

6
Operation lifetime increases 7
RX CURRENT

22mA

SENSITIVITY
60%
-110dBm
16mA - RX Current consumption cut
13mA >30%
30%

9mA
- Sensitivity performances are not
-105dBm
sacrificed

SPIRIT1 COMP. A COMP. B COMP. C


37mA

TX current
34mA

+11dBm
43%
29mA

+11dBm
26mA

28%

+11dBm
21mA
20mA

+11dBm
TX Current consumption cut
>28% @ max o/p power 9mA 10mA

0dBm

0dBm
0dBm
0dBm

SPIRIT1 COMP. A COMP. B COMP. C


Operating Modes/Consumption 8

SHUTDOWN
[2.5nA] Mode Description

Shutdown Off, no register retention


1ms
Standby SPI On, register retention
1s 230s
Sleep SPI on, register retention,
STAND-BY READY SLEEP Wakeup timer on
[650nA] [400uA] [950nA]
230s 1s
Ready SPI on, XTAL on
51s <1s <1s <1s RX SPI on, XTAL on, RF Synth
on
RX/TX TX SPI on, XTAL on, RF Synth
LOCK
[9mA/21mA on
[5mA]
@+11dBM]
6s

Built-in main controller handles operating mode transitions


SPIRIT1: key features 9

Packet handler and Link Layer features Peripherals & Support Functions

• Integrated packet handler supporting: • AES 128-bit encryption co-processor is available


• BASIC [general purpose/flexible packet format] for secure data transfer
• Wireless M-BUS
• Separate 96-byte RX/TX FIFOs, accessible via the
• STack
SPI interface for host processing
• Support for Automatic acknowledgment of • Integrated temperature sensor
received packets, retransmission and time-out
protocol. • Battery indicator and low battery detector

CSMA/CA Engine Antenna Diversity Algorithm


• The CSMA/CA engine is a channel access • An external switch is controlled to
select the antenna with the highest
mechanism based on the rule of sensing the channel RSSI

EXT SWITCH
before transmitting. This avoids the simultaneous
use of the channel by different transmitters. • While receiving the preamble, the
antennas are repeatedly switched
until the RSSI> threshold.

SPIRIT1
• The switch is then disabled and
the selected antenna is used.
SPIRIT1 Balun:BALF-SPI-01D3 10

BALF-SPI-D103
Balun + Matching + Filter network can be replaced
by single 2.0 x 1.4 mm component:
• Saving PCB size
• Saving cost
• Making easier and more reliable PCB design
Development Tools and Support 11

http://www.st.com/web/catalog/sense_power/FM1968/CL1976/SC1845/PF253167?s_searchtype=partnumber#

• Programmable through GUI Application Notes and User Manual

• Highly portable drivers available


• Examples
• Documentation
• User manual

• HARDWARE:
• Development Kits
• Daughter Boards • SOFTWARE

• USB Dongles • Wireless M-BUS

• PCB documentation
• Supported Platforms: STM32L and STM8L
• Schematics
• Gerber files
Spirit1 IP mesh 12

Solution 1 : Weptech module


AT commands

Host MCU STM32 Spirit1


(app)
Cloud
SP1ML

• ST as module provider
• Weptech as SW IP integrated on module
• Customer application hosted in external µC

Solution 2 : Wi6labs

SW API App layer


SPIRIT PHY
STM32L
Spirit
SPIRIT1

• ST as RF chipset / µC provider
• Wi6Labs as SW IP integrated in µC of ctm PCB
• SW API to store ctm app inside the on-board µC
• Proof of Concept available on Nucleo L1 board
BlueNRG Family - Bluetooth® SMART
Network and Application Processors
vs Classic Bluetooth® 14

Feature Bluetooth® Classic Mode Bluetooth® Low energy Mode

Power Consumption
Between 1mA and 30mA Between 1µA and 15mA
Range

Over the air data rate 1–3 Mbit/s 1 Mbit/s

Range (typical) 30 m 50 m

+20 dBm (class 1)


Max TX power +10 dBm
+4 dBm (class 2)
RF Channels 79 40
Connection Time 100 ms 3 ms
Max packet Size 2875 µs = 1021 Bytes 328 µs = 27 Bytes
Encryption Safer+ AES-128

Lower data-rate + Shorter connection time + less channels + smaller packet size

 Bluetooth Smart® aims at saving current consumption !


BlueNRG Bluetooth® Smart Network
processor 15

System Partitioning: Network


processor
Supports Bluetooth Low Energy network protocol
leaving application in a separate MCU

Qualified Master and Slave stack


Supports Central and Peripheral without changing
the firmware

Superior Battery Life


Integrated DCDC converter enables ultra low power
operation:
• RX 7.3mA
• TX 8.2mA @0dBm
• Sleep 1.7µA
• Shut Down 2.5nA

Embedded Flash
Enables firmware upgraded on the field

CSP package option


In addition to QFN32 5x5x1mm, the WCSP34
2.66x2.56x0.5mm solution is available for saving
PCB space
BlueNRG-MS 16

MP MP
Dec 2013 Q1 2015

BlueNRG • Pin to pin compatible BlueNRG-MS


• Same flash based • Bluetooth Low Energy 4.1 Network
• Bluetooth Low Energy 4.0 architecture Processor Master and Slave
Master and Slave qualified • Same radio simultaneously running feature
Network Processor performance managing up to 8 peripherals

BlueNRG-MS

Bluetooth Low Energy 4.1 Compliant


Standard

Embedded Flash
Enables firmware upgrade on the field

Superior Battery Life


Integrated DC-DC converter enables ultra low
power operation
Extended Voltage Operative Range
Minimum operative Voltage: 1.7V
CSP package option
WCSP34 2.66x2.56x0.5mm available for saving
PCB space
BlueNRG-MS - Specific use case 17

BLE 4.1 feature: Master and Slave simultaneously role supported

• Master toward smart-shoe/Slave


• Slave toward smartphone/Master

added value
Master

Slave

Reduced latency is the added value against the same applicative


scenario using BLE 4.0.

All trademarks and logos are the property of their respective owners. All rights reserved. They are used here only as conceptual examples
BlueNRG-1 Single Mode Bluetooth® SMART
Application Processor 18
 Single mode Bluetooth® SMART 4.2 System on Chip
 Dedicated package QFN32 for Automotive Grade qualification
BLE Network Processor
 ST Bluetooth Low Energy Stack, Profiles and Application support
BlueNRG-1
 SMART power management: DC-DC / Linear Voltage regulator
 Operating supply voltage from 1.7 up to 3.6V GPIO

 Extended Temperature Range: up to 105⁰C


 16MHz or 32MHz Crystal Oscillator 10 Bit ADC

 Low Frequency Crystal Oscillator or Integrated Ring Oscillator


 Up to 32 MHz M0 Core Communication Peripherals

 24 kB Ultra Low Leakage RAM


 160 kB Flash memory ULL RAM FLASH

 SPI Master and Slave,I2C Master and Slave, UART, PDM Input I/F PWM
M0 Core
 GPIOs 15
Eng. samples
 10 Bit ADC availability:
Q3 2015 Application and Profiles
 BlueNRG based radio
 RX 7.3 mA
Mass production: BLE Protocol stack
 TX 8.2 mA @ 0 dBm Q4 2015
 Sleep 1µA
Link Layer
 Best in Class Output Power Level: +8dBm
 Receiver sensitivity -88dBm
2.4 GHz BlueNRG Radio
 Package WCSP34 2.65x2.65mm, QFN32 5x5 mm.
BlueNRG family Software partitioning 19
19

• BlueNRG devices embed all the


Bluetooth® Smart protocol stack

• Application & associated BLE


profiles remains in the host MCU

• BLE profiles are not mandatory


and can be implemented
through applications directly
BlueNRG-MS Balun: BALF-NRG-01D3 16

BALF-NRG-D103
Balun + Matching + Filter network can be replaced
by single 1.4 x 0.85 mm component:
• Saving PCB size
• Saving cost
• Making easier and more reliable PCB design
BlueNRG family current consumption 21

Current Consumption by state @ Vin=3.0V

Parameter Test Condition Typ. Value Unit


DCDC active
Reset No RAM retention 5 nA
Sleep RAM retention, 32 kHz XO
1.7 µA
Slave small GATT DB
Sleep RAM retention, 32 kHz XO
2.4 µA
Master or Slave big GATT DB
TX @+8dBm @ Antenna Level 15.1 mA
TX @+2dBm @ Antenna Level 9 mA
RX Sensitivity Level 7.3 mA
BlueNRG FAMILY Development Tools
22
• BlueNRG HW
• STEVAL-IDB002V1
• 1 Evaluation STM32-based Mother Board
• 1 BlueNRG RF module
• 1 Antenna

• STEVAL-IDB003V1 USB Dongle

• BlueNRG-MS HW
• STEVAL-IDB005V1
• 1 Evaluation STM32-based Mother Board
• 1 BlueNRG RF module
• 1 Antenna
• STEVAL-IDB005V1D ( coming soon )
• 1 BlueNRG RF module
• 1 Antenna
• STEVAL-IDB006V1 USB Dongle ( coming soon )

• Programmable through GUI


• Highly portable drivers available
• Examples
• Documentation
• User manual
BlueNRG family software development kit 23

• The BlueNRG STSW-BLUENRG-DK is a


comprehensive package including all the
necessary software information to develop
applications based on BlueNRG family devices.

• Key features
• Complete software package to support BlueNRG
family devices evaluation and development.
• Comprehensive GUI to support detailed device
evaluation and configuration.
• Script language to support device evaluation.
• Supports all the BlueNRG family hardware
evaluation kits.
• BlueNRG firmware libraries for STM32L MCU to
allow development of BlueNRG family applications.
• Rich set of firmware and application examples to
facilitate customer development
• Beacon demonstration
• Over-the-air firmware upgrade demonstration.

STSW-BLUENRG-DK @ http://www.st.com/web/en/catalog/tools/PF261967
BlueNRG-MS Sensor Profile Demo
24

• The STEVAL-IDB005V1 is
preprogrammed with Sensor Profile
Demo Firmware
• Set and establish a connection with a
smartphone (iOS7 and Android 4.3 or later)

• Sensor Profile demo


• It implements a proprietary Bluetooth profile.
• This example is useful for building new profiles and
applications that use the BlueNRG network
processor.

• This profile exposes two services:


• Acceleration Service
• Acceleration characteristic value
• Free Fall characteristic
• Environmental Service
• Temperature characteristic

Please visit http://software.g-maps.it and download iOS or Android application, to be used in conjunction with ST’s
BlueNRG-MS evaluation kit (STEVAL-IDB005V1), and then access all sensor’s data directly from your mobile device via
the Bluetooth® low energy protocol.
BLUENRG family Current Consumption
Estimation Tool 25

• ST provides a Current
Consumption Estimation Tool
• It enables the user to estimate
the average current consumption
and the battery lifetime in the
applicative cases

• The user can select:


• General:
• Supply voltage
• TX output power
• Master/Slave sleep clock
accuracy
• Retention RAM
• Connection Advertising or
Scanning Interval
• Data length
• DC-DC converter active or not
BlueNRG shield for STM32 Nucleo 26

Ready-to-go ecosystem
BENEFITS:
• Enable seamless portability of user code across
the full STM32 product range

• Fast prototyping of user applications, start


hands-on coding in 1-day

• Compatible with both STM32 / Arduino


communities (open source drivers and
software, support, blogs, forums, etc.)

• No Bluetooth connectivity/RF specialist


required
Next Demo for Smart Street Lighting.. 27

FW Communication Protocol:
• Anti-collision
• Repetition mechanism
STM32
MCU Cortex M3/4 Concentrator

SPIRIT1
RF Sub 1 GHz Transceiver

ST75xx STarGRID
Power Line Modem Communication

M24SR
DUAL IFs Interface (RFID/NFC<->I2C)

STPM3x
ICs Energy Power Monitoring

STLUX
HID and LED 100W Solution

LAMP NODE
Next Solution for Smart Home Lighting.. 28

STM32L0:
MCU Cortex M0+ Ultra low power
HVLED
LED Driver
SPIRIT1
RF Sub 1 GHz Transceiver with MESH
BlueNRG
Bluetooth Low Energy
Wi-Fi
RF 2.4 GHz Wi-Fi Module

Remote Home LED Light Control


Energy Saving
Dimming
Energy Power Monitoring

Under development
ST Modules
Why ST’s connectivity module? 30

We care about our customer business success


• Plug & play solution
Reduce time-to-market We care about your customer satisfaction
Free your time to focus on your application start from quality !
• Easy to use
Easy and quick integration less 1 hour! • Robust manufacturing
We care about your design time Our target: ZERO return from the field.

• One stop shop • Environmental compliance


Source one module from one manufacturer Material Declaration on web
All inclusive price no extra cost, no roy fee …
• Minimize your assistance cost
• RF certified,
• Fully automated and integrated
It is not required specific RF knowledge
Assembly and testing production line
We take care of certification for you
Low development cost • Traceability
Very low integration risk The module ID card

• Bluetooth® end product qualified,


It is not required investment on Radio,
BT stack and profile comprehension

• Secure
Your connectivity is secure from the first installation.
Fully traceability of every single module
ST Connectivity Modules Portfolio Summary 31

Consumer Healthcare Home &


Internet Of Smart
Remote Control Sport Building
Things Energy
Cable Replacement Wellness Automation

Sub-1GHz

Bluetooth® 3.0 Bluetooth® WiFi Sub 1GHz


www.st.com/bluemodules 4.0
BLUE MODULES Bluetooth® Smart Spirit1 series

SPBT series BlueNRG series WiFi series

Full Production New Development Full Production Full Production

All trademarks and logos are the property of their respective owners. All rights reserved. They are used here only as conceptual examples
RF SubGHz Modules
SP1ML and SPSGRF
SP1ML

SP1ML-868 and 915 modules


Add wireless capability to any electronic device
without requiring RF experience

SPIRIT1 Modules for 868MHz and 915MHz


Module based on:
13.4 mmm
o SPIRIT1 low power subGHz transceiver
o STM32L151RBH6 MCU
• 16Kb RAM – 128Kb FLASH
o BALF-SPI-01D3 868/915MHz IPD balun and filter
Supports 868MHz SRD and 915MHz ISM bands
14 mmm
Surface Mounted antenna
1.8 V to 3.6 V supply - Low power consumption
Output power up to +11.6dBm
Air data rates up to 500kbps
Modulation schemes: 2-FSK, GFSK, MSK, GMSK, OOK, ASK
Operating temperature: -40 °C to 85 °C
CE compliant
SP1ML-915 is FCC certified (FCC ID S9NSP1ML)
www.st.com/subghzmodules
Standard FW with AT Command set interface via UART for
configuration and cable replacement model

Standard FW can be replaced by user applications running on


the STM32L with full access to SPIRIT1 features
SP1ML

SP1ML – Firmware
• AT Commands - Firmware
• SP1ML is provided with wireless serial cable replacement FW
• UART host interface allows simple connection to an external host microcontroller
• Host microcontroller GPIOs to control SP1ML (shutdown mode, switch from command
to operation mode, FW upgrade)

HW implementation AT command example

Host UART

micro
GPIOs

• Open Platform - Application Processor


• SP1ML standard FW could be replaced by a user application, enabling use as a
wireless application module where no external microprocessor system is
required.

www.st.com/subghzmodules
SP1ML

SP1ML footprint
AT command firmware

LED for TX/RX status indication. SWD Interface


Shutdown
BOOT and RESET
Switch between command UART for AT
and operating modes Command IFs

www.st.com/subghzmodules

SP1ML

Host UART

micro GPIOs
SP1ML

SP1ML - AT Commands 36

Command reference

ATO Enter operating mode

AT/V Read module version information

ATIn Read an information register

ATSnn? Read a configuration register(*)

ATSnn=x Write a configuration register(*)

AT/S Read all configuration registers

AT/C Store the current configuration

ATZ Restart the module (*) Configuration registers

AT/SRnn? Read a SPIRIT1 radio register • S00 BAUD_RATE • S12 CRC_MODE


• S01 FREQUENCY • S13 WHITENING
AT/SRnn=xx Write a SPIRIT1 radio register
• S02 DATA_RATE • S14 FEC
AT/Tn Set RF test mode • S03 MODULATION • S15 SOURCE_ADDR
• S04 OUTPUT_POWER • S16 DESTINATION_ADDR
• S05 FREQ_DEVIATION • S17 MULTICAST_ADDR
• S06 RX_FILTER • S18 BROADCAST_ADDR
• S07 CS_MODE • S19 FILTER_xxx
• S08 RSSI_THRESHOLD • TXRX_LED
MCU
• S09 PREAMBLE_LEN • HW_FLOW_CTRL
HOST
• S10 SYNC_LENGTH • ESCAPE_SEQ
AT Commands
• S11 SYNC_VALUE

www.st.com/subghzmodules
SP1ML

SP1ML – Evaluation tool


• USB dongle STEVAL-SP1ML868 and STEVAL-SP1ML915
• STEVAL-SP1ML868 and 915 demonstration board allows to evaluate
SP1ML-868 and 915 module in a quick and simple way.

• USB connector is used to connect the dongle with a PC, to access


the SubGiga module and to supply the dongle
• UM1889 - User manual SP1ML modules getting started guide FW
upgrade & simple communication setup

www.st.com/subghzmodules
SPSGRF

SPSGRF RF Sub-GHz Module 38

without MCU
SPIRIT1 Modules for 868MHz and 915MHz
Module based on:
o SPIRIT1 low power subGHz transceiver
o BALF-SPI-01D3 balun and filter
o Surface Mount antenna
SPSGRF-868 for 863-870 MHz
Tiny size: 13.5 x 11.5cm
SPSGRF-915 for 902-928 MHz 500Kbps data rate
Temp. range from -40 °C to 85 °C
Receiver sensitivity: -118 dBm
Output power up to +11.6 dBm
RX: 9mA, Tx: 21mA @ +11dBm
Shut Down: 2.5nA
SPI host interface
CE compliant
SPSGRF-915 is an FCC certified module (FCC ID:
S9NSPSGRF)

www.st.com/subghzmodules
SPSGRF

SPSGRF Nucleo Expansion

Sub-GHz expansion board based on SPIRIT1


SPSGRF module for STM32 Nucleo

Scalable solution, can cascade multiple


boards for larger systems
Equipped with Arduino UNO R3 connectors
RoHS compliant
Example Firmware*:
o Point-to-Point simple communication demo
o WMBus Standalone application for Automatic
Meter Reading system

x-NUCLEO-IDS01A4 based on SPSGRF-868 ( 868 MHz ETSI certified module )


x-NUCLEO-IDS01A5 based on SPSGRF-915 ( 915 MHz FCC certified module )

*developed for NUCLEO-F401RE or NUCLEO-L053R8.


RF Sub-GHz USB dongle

USB dongle based on board SPSGRF


o Modulation: 2-FSK, GFSK, MSK,
GMSK, OOK and ASK
o Air data rate: from 1 to 500 kbps
Full compliant in terms of firmware and
GUI with the SPIRIT1 development kits
On board:
o STM23L low power MCU
o Debug connector
o USB interface
RoHS compliant

STEVAL-IDS001V4M USB Dongle based on SPSGRF-868 ( 868 MHz ETSI certified module )
STEVAL-IDS001V5M USB Dongle based on SPSGRF-915 ( 915 MHz FCC certified module )

Available in 15Q3
ST Bluetooth® Solutions 41

BT 3.0 Classic BT 4.1 Smart

ST Products Profiles

SPBT2632C2A.AT2 SPP/IAP
SPBT2632C1A.AT2

www.st.com/bluemodules
Bluetooth® module roadmap 42

Bluetooth 3.0 module Bluetooth 4.1 module


• SPBT2632C2A • SPBT3.0DP Module • SPBTLE-RF Module
• Embedded Bluetooth Classic module
• SPBT2632C1A • Bluetooth Smart Master/Slave low power
module
• ST STM32F4 micro and STLC2690
• Embedded Bluetooth Classic modules radio • ST BlueNRG-MS radio and balun
• ST STM32F1 micro and STLC2690 radio • Onboard antenna • Onboard antenna
• Onboard antenna • AT Command set interface via UART • SPI interface
• AT Command set interface via UART • SPP and iAP2 embedded • BQE certified
• SPP and iAP1 embedded • BQE End product certified • RF fully certified
• BQE End product certified • RF fully certified
• RF fully certified • Additional profiles available for Audio,
HID,…
• Application-made FW available upon
request

Mat 30
Mass production from Q4 2015
Fully running in mass production

2015
Bluetooth® 3.0 Classic Micro-sized modules
43

Product portfolio Bluetooth® Classic BT V3.0


SPBT2632C2A Class 2 embedded and fully certified module

SPBT2632C1A Class 1 embedded and fully certified module

Key features Key benefits Targeted applications


Compliant with Bluetooth® Classic 3.0 Enhanced security, easier pairing, supporting Wireless cable replacement
version communication with Apple products
M2M
BQE end product certified QDID available for customer product declaration
without further BQE approval process Smartphones communication
Embedded FW, including BT stack and Easier integration in final application Service diagnostic
profile, SPP and iAP and a simple, easy to not requiring further Bluetooth® qualification not
use interface AT command set requiring external driver
Data acquisition equipment
RF design fully integrated in a unique Highly reliable solution,
device easier design saves development resources and
RF certified according to : time,
CE, FCC, IC, TELEC shortens time-to-market
Low-power mode supported Reduces power consumption, increasing final
application’s battery life
SPBT3.0DP modules
SPBT3.0DP 44
Supply Voltage
Hardware architecture outlook
GPIOs
Voltage
regulator µP

Flash

Bandpass Bluetooth
RAM
UART
filter radio
Antenna

Crystal

Recommend land pattern


LPO clock 11.6 mm x 13.5 mm
SPBT4.0DP module is:
compatible with SPBT2632C2A,
Mechanical
Same footprint, except LPO
dimensions
Same dimension

SPB2632C2A and SPBT3.0DP pin connection diagram


Bluetooth® 3.0 modules on the web 45
support tools
Order codes
Order code Description

SPBT2632C2A.AT2 Bluetooth® V3.0, Class2, antenna, AT2 command FW

SPBT2632C1A.AT2 Bluetooth® V3.0, Class1, antenna, AT2 command FW

Evaluation boards
Order code Description

STEVAL-SPBT3ATV3 USB dongle, evaluation board for SPBT2632C2A.AT2

STEVAL-SPBT4ATV3 USB dongle, evaluation board for SPBT2632C1A.AT2

Other tools Technical Promotional Technical support


Documentation Documentation
Datasheets Marketing presentation on st.com Contact us @
onlinesupport@st.com
Application note Product briefcase on MyST
AT command user manual Brochure
User guide
Eval board data brief

All in 1click, visit www.st.com/bluemodules


Bluetooth® 3.0 modules characteristics 46

SPBT2632C2A.AT2 SPBT2632C1A.AT2
Key features

Core devices STM32 ARM-Cortex-M3 MCU + STLC2690 Bluetooth® IC

Class Class 2, typ output 0dBm Class 1, typ output 10dBm

BT standard Bluetooth 3.0 Bluetooth® 3.0

Low power mode with external LPO 


Pin count 16 24

Form factor Micro-sized: 11.6 x 13.5 mm Small: 15 x 27 mm

Supply voltage 2.5 V 2.5 V

Industrial operating temperature - 40 ÷ 85 ºC - 40 ÷ 85 ºC

High Speed CPU Mode 32 MHz Average Values

ACL data 115KBaud UART at max throughput (Master) 23 mA 23 mA

ACL data 115KBaud UART at max throughput (Slave) 27.5 mA 27.5 mA

Sensitivity Level (BER<.001 with DH5) -86 dBm -90 dBm


I 2C Only for Apple code processor Only for Apple code processor
(not available with AT FW version) interface interface
Bluetooth® V4.1
Smart modules
SPBTLE-RF module
overview 48

Product portfolio Bluetooth® Smart Ready 4.1 Status


SPBTLE-RF RF module, based on BlueNRG-MS Release mat 30: Q3 2015

Key features Key benefits


Compliant with latest Bluetooth® Supporting the Bluetooth® Low Energy Standard Targeted applications
Smart 4.0 version
Wearable
BQE end product certified QDID available for customer product declaration
without further BQB approval process; Smart Home

Based on BlueNRG-MS Operating with several host to ensure high Industrial building
flexibility to Customer application

RF design fully integrated in a unique Highly reliable solution,


device easier design saves development resources and
RF certified according to to: time, shortens time-to-market
CE, FCC, IC, TELEC
SPBTLE-RF module
49
Hardware architecture outlook
SPBTLE-RF

Draft schematic 11.5 mm x 13.5 mm x 2.0 mm

Mechanical Recommend land pattern


dimensions
SPBTLE-RF module
50
Example of host and application System partitioning
Profile Specific Code FLASH RAM
(bytes) (bytes)
STM8 (16kF/4kB) External MCU Alert Notification Client 1648 76
• Wireless sensor Alert Notification Server 3868 92
Application Blood Pressure 1676 40
Find Me Locator 952 32
Find Me Target 728 32
BLE profiles Hearth Rate 2516 52
STM32L HID OVER GATT (HOGP) 6588 6552
• Battery operated wireless Application controller Phone Alert 1320 40
Proximity Monitor 2292 56
sensor hub interface Proximity Reporter 1784 44
Time Client 2352 165
Time Server 2864 73
STM32F4 BLE standard profiles are not mandatory
• Battery operated wireless
• ST can provide example of proprietary application
sensor hub with high end
sensor fusion algorithms • Host processor memory footprint:
- Library 9KB
- Profiles 1 to 2kB
BLE network - Left KB for the application
Application Controller
Interface links the Host MCU SPI processor
with BlueNRG-MS through BlueNRG-MS
SPI bus.
Application
controller interface
a
BlueNRG embeds all
n
B Blue BLE protocol stack the Bluetooth® Smart
t
A
e
L NRG- protocol stack
n Link layer
n
F MS
a
2.4 GHz radio

Clear SW partitioning between BlueNRG and Host MCU


Bluetooth® 4.1 smart modules on the web 51
support tools
Order codes
Order code Description

SPBTLE-RF Bluetooth® V4.1, antenna,

Evaluation boards
Order code Description

STEVAL-IDB003V1M USB dongle for SPBTLE-RF

X-NUCLEO-IDB01A5 Expansion board for SPBTLE-RF

Other tools Technical Promotional Technical support


Documentation Documentation
Datasheets Marketing presentation on st.com Contact us @
onlinesupport@st.com
Application note Product briefcase on MyST
AT command user manual Brochure
User guide
Eval board data brief All in 1click
Hands on www.st.com/bluemodules
Wi-Fi Module 52

RF Plug&Play and Cost-Effective Solutions Pre-certified RF 2.4 GHz IEEE 802.11b/g/n modules

CW1100 and STM32F103 based


SPWF01SA.11/SC.11
UART/SPI
/I2C/GPIO Serial-To-Wi-Fi module with integrated antenna or Integrated
802.11 U.Fl.
b/g/n
AT Full Stack Features

HTML WebServer, Post Data, HTTP client, Socket mode


WiFi Modules Offering Roadmap 53

SPWF01SX21
WiFi 802.11 b/g/n modules
Tx: +18dm at antenna
SPWF01SX11 Sensitivity: -97dBm
TCP/IP on board system
Based on STM32F4
WiFi 802.11 b/g/n modules In module full application
Tx: +18dm at antenna
Sensitivity: -97dBm
TCP/IP Coprocessor
Based on STM32F1
Rich AT command set for host I/f
DHCP and DNS, TSL/SSL, Web SPWF01S Series
server
Wireless security (WEP, www.st.com/wifimodules
WPA/WPA2-PSK)
Field update via WiFi and

Q4 14 Q1 15 Q2 15 Q4 15
MP ES ES ES
ST Sensors overview
MEMS & Sensor Focus & New Products 55

Available products Q1 - 2015 Q2 - 2015

Motion
MEMS
Accelerometer Magnetometer
LIS2DH12 – 2x2 LGA-12 LIS3MDL - Standalone IMU Accel.
LIS2HH12 high precision LSM303C - e-compass
LSM6DS3
H3LIS331 High g in 3x3 LIS2DS12
AIS328DQ– Automotive 3A+3G
Inertial Motion Unit embedded
Ultra low
algorithms
Gyroscope LSM9DS1 3A+3G+3M power
L3GD20H – Low power INEMO-M1 Module

Environ
Temperature UV
mental Pressure Humidity STTS751 Pressure UVIS25
HTS221
LPS25H LPS25HB
Humidity & Timing Fully molded
260-1260 mbar
Temperature Humidity
M41T83 - Accuracy
compensated HTS221E
2x2x0.9 M41T62LC6- Tiny

Micro
phones Microphone
MP23ABW01 Microphone
MEMS Microphones differential out MP23DB01MM
MP23AB02B – Tiny Analog
Multi Mode
MP34DT01-M – Digital MP34DT04 digital
MP34DB01 – Digital bottom Digital
64dB SNR
ST Accelerometer Products Evolution 56

+
LIS2DS12
= • Bigger FIFO
LIS2HH12
• 14 bit resolution
• Performances
LIS3DSH vs. power
• High consumption
• 14 bit resolution performances increased
• High • FIFO, Self test
LIS2DH12 performances • Very low noise
• Low
LIS3DH • up to 12 bit • FIFO, Self test temperature • Embedded
Algorithms
• up to 12 bit resolution • Program impact
resolution • FIFO, Self test embedded State • Low noise • Sensor Hub
• 2µA in Low Machine 150µg/√Hz
• FIFO, Self test • Standard pinout
power mode • Low noise • 2x2 package
• 11µA @50Hz 150µg/√Hz
• 11µA @50Hz
• 3x3 package • 3x3 package
• 2x2 package

Cost effective Low power Embedded features Pinout compatibility


14bit Accelerometer – LIS2DS12 57

• 3-Axis Digital SPI/I2C Accelerometer from ±2 to ±16 g Full Scale


• Up to 14 bit resolution
• High number of embedded features (movement recognition Algorithms,
256steps FIFO, Temperature sensor, Self-Test), Sensor HUB
• Very low power:

• 2.5µA in Low Power Mode (1Hz)


• 150µA in High Resolution Mode (6.4KHz)
• 12.5µA/150µA in LPM/HRM (100Hz)
• 0.5µA in Power down mode

Key Features
10 to 14-bit resolution
Embedded Algos and HUB
Down to 2.5 µA in LPM
LIS2DS12 – Embedded Smart Features 58

• Embedded Smart Features:


• Pedometer & motion detection algorithms
• FIFO: 256 (if x, y, z data stored) / 768 level (if acceleration module stored)
• Sensor HUB allows acquiring data (up to 6 acquisitions) from 1 external sensor

Accelerom X
Y
eter data Z
Acceleration
Module
𝑥 2 + 𝑦 2 +𝑧 2

Data Ready Data Ready

External SENSOR Algo I2C / MCU /


HUB Engine SPI AP
SENSOR I2C
(I2C Master) (Slave)
I2C/SPI

LIS2DS12
LIS2DS12: Interrupt Engine Architecture
59

Input Data Embedded Smart Features


x, y, z
Free Fall
Wake-Up CFG Regs
Tap - DoubleTap SRC Regs
I2C
Active - Inact
SPI
Portrait/Landscape

Acceleration
module

Step Counter Int pad

Step Detector

Significant Motion

Tilt function
LIS2DS12 vs LIS2DH12
Parameter LIS2DS12 LIS2DH12

Resolution 14-bit / 12-bit / 10-bit 12-bit / 10-bit / 8-bit

FS range ±2g, ±4g, ±8g, ±16g dynamically selectable ±2g, ±4g, ±8g, ±16g dynamically selectable
0.244mg/LSB @2g; 0.488mg/LSB @4g; From 1mg/LSB to 192mg/LSB depending on FS & HR
So
0.976mg/LSB @8g; 1.952mg/LSB @16g mode
Off ±30mg ±40mg
TCSo (typ) vs. temp ±0.01%/°C ±0.01%/°C
TyOff (typ) vs. temp ±0.3 mg/°C ±0.5 mg/°C
Acceleration noise 140µg/√Hz @ODR=50Hz, FS=2g 220µg/√Hz @ODR=100Hz, FS=2g
Power consumption in Low Power mode 2.5µA @1Hz, 12.5µA @100Hz, 80µA @800Hz 2µA @1Hz, 10µA @100Hz, 185µA @5.3KHz
Power consumption in High Resolution
150µA from 12.5 up to 6.4kHz 2µA @1Hz, 185µA @400Hz
mode
Power consumption in Sleep mode 0.5µA 0.5µA
Supply voltage 1.62 to 1.98 V 1.71 to 3.6 V

ODR 1Hz – 6.4kHz 1Hz – 5.4kHz

Yes (with possibility to disable antialiasing filter


Anti-alias filter No
in LPM for power saving)
256 level FIFO (14b), 768 level (if module
FIFO 32 Level FIFO (10b), 3 modes
only), 5 modes
Self-Test, Sleep to Wake mode, Step
Embedded functions detector/counter, motion function, Tilt function, Self-Test, Sleep to Wake mode
Sensor Hub
2x ITs: FF, WU, Tap/double Tap, 6D/4D, Fifo, 2x ITs: FF, WU, Tap/double Tap, 6D/4D, Fifo, Drdy
Other
Drdy, SD, SMF, Soft reset, HPF HPF
Temperature sensor Embedded, 8-bit, 1 LSB/°C Embedded, 8-bit, 1 ´LSB/°C
Size 2x2x0.86 mm , LGA-12 2x2x1 mm , LGA-12
LSM6DS3 (A+G)

Application
RtM
ST Gyro to 6-axis IMU Products evolution 62

LSM6DS3
LSM6DS0 • Bigger FIFO
• 16-bit resolution • <1 mA in Normal mode
LSM330DLC • Accel + Gyro data • Low noise for Gyro
• Accel + Gyro in synchronous 7 mdps/√Hz
a single • 1.8 mA power • Low noise for Accel
package consumption 90 µg/√Hz
• FIFO, Self test • 1.8 V power supply
L3GD20H • Sensor Hub
• Interruptions • 3 x 3 package
• 16-bit resolution • Temp compensation
• 4 x 5 package
• FIFO, Self test • Algorithm embedded
• 3 x 3 package • 2.5 x 3 package

More Embedded
Gyro standalone Lower power, Lower noise
Features

AMS Application RtM 01/07/2015


LSM6DS3 - at a glance 63
The 6X Ultra
Ultra low power Ultra small size

Industry leading low power performance Tiny size to fit in the smallest,
for 3A+3G combo wearable and Internet of Things
Down to 0.6 mA in always-on mode devices
20% better than the best alternative 2.5 x 3.0 x 0.83 mm
solution

Ultra performing Ultra capable

Industry-best resolution for gyroscope 8 Kbyte “smart” FIFO memory to


and accelerometer batch more data before system
wake-up
Gyroscope rate noise down to 7 mdps/√Hz (typ.) 2 times larger than the best alternative
Accelerometer rate noise down to 90 µg/√Hz (typ.) solution

Ultra smart Ultra scalable


Embedded efficient and reliable Ideal companion for the ultra-low
motion tracking, pedometer and power STM32 family of
context awareness microcontrollers
Saving power and enabling
The best combination of 6-axis sensor
faster system reaction time
plus sensor hub

AMS Application RtM 01/07/2015


Event recognition 64

• The events that can be recognized are:


• Free-fall: 3 axis sub threshold recognition
• Wake-up: axis recognition
• 6D and 4D orientation detection: change of position recognition
• Single-tap and double-tap sensing
• Activity/inactivity recognition

• All these events are using only accelerometer data

• All these functions are running in parallel

• Each event can generate an interrupt signal that can be driven to the
two interrupt pins (INT1 and INT2)

Event recognition is useful for System power consumption reduction


by Shifting data processing from MCU to the sensors.
65

LSM6DS3 FIFO

AMS Application RtM 01/07/2015


Smart FIFO 66

• FIFO size 8 Kbyte


Data buffering reduces
• While sampling data @104Hz it can store:
MCU interaction with the
• 13,1 seconds of history for 1 sensor (XL)
sensor -> power
• 6,6 seconds of history for 2 sensors (XL,Gy)
• 3,3 seconds for 3 sensors case (XL,Gy,Mag)
consumption reduction

• Possibility to write four different sensors:


• Gyroscope, Accelerometer, External sensor 1, External sensor 2 or step counter
and time stamp or Temperature sensor data
• Possibility to save only high part of Gyro/XL data

• Data can be written into FIFO at different ODRs for each sensor with
a decimation of write frequency in FIFO for each sensor:
• 0 (no data in FIFO), 1 (no decimation), 2, 3, 4, 8, 16, 32

NO data repetition
NO wasted space

AMS Application RtM 01/07/2015


Sensor HUB concept 67

• MCU interacts with LSM6DS3 through standard I2C/SPI interfaces

• Thanks to I2C bus master in Sensor hub other external sensors can
be connected to LSM6DS3

• LSM6DS3 can autonomously read data out of the external sensors

Acc

Gyro

I2C REGS
Ext. SENSOR I2C
HUB
+
SPI MCU
sensors FIFO

Add additional sensors in your system handled autonomously by


the LSM6DS3 sensor HUB (offloading MCU)
AMS Application RtM 01/07/2015
X-NUCLEO-IKS01A1 68

The X-NUCLEO-IKS01A1 is a MEMS motion and LSM6DS3


environmental sensor evaluation board system STEVAL-MKI160V1
compatible to STM32Nucleo

Key HW Features
• LSM6DS0 (A+G), LIS3MDL (M), LPS25H
(Barometer), HTS221 (humidity) on the board
• DIL 24-pin socket available for additional MEMS
adapters and other sensors (LSM6DS3 STEVAL-
MKI160V1)
• X-CUBE-MEMS1 (LINK) firmware package includes
SW drivers / support for LSM6DS3 STEVAL-
MKI160V1

• SW projects available in source code for NUCLEO-


F401RE and NUCLEO-L053R8 X-NUCLEO-IKS01A1

http://www.st.com/web/en/catalog/tools/PF261191

AMS Application RtM 01/07/2015


MEMS Microphones
Digital & Analog Microphones 70
Roadmap Evolution

MP33AB01
MP23AB02B
MP33AB01H

2.5x3.35x.98 mm
3.76x2.95x1 mm
Bottom Port Bottom Port
SNR 63-66dB SNR 64dB
AOP 125dB AOP 125dB
SENS ±3dB SENS ±3dB

MP34DT01
MP34DB01
MP34DT01-M MP34DT04 MP23DB01MM
MP34DB02
MP34DTW01
MP34DT02

3x4x1 mm 3x4x1 mm 2.65x3.5x0.98 mm


3x4x1 mm Top Port Bottom port
MP34DT01 Top Port Bottom Port SNR 64.3dB SNR 64dB
SNR 60-63dB SNR 62.6dB
AOP 120dB AOP 120dB
AOP 120dB-145dB AOP 120dB
SENS ±3dB
SENS ±3dB Sens +/- 1dB
SENS ±3dB Multimode

2014 2015
Environmental sensors
Pressure Sensors Family 72

Mass Q2 2015
Production
HIGH
RUNNER

LPS22HB
2 x 2 x 0.76 mm
LPS25HB Very Low Noise
LPS25H Low power
2.5 x 2.5 x 0.76 mm consumption
2.5 x 2.5 x 1.0 mm Full molded package
Quadratic Compensation Improved performances
FIFO Improved moisture resistance
4uA with FIFO on
LPS331AP
3 x 3 x 1.0 mm
SW & Pin out compatible
for easy upgrade
LPS25HB: Sensor Technology 73

Suspended membrane
Full (silicon cap removed)
molded Silicon
package cap

Strengths
• Thinner device
• Full Molded package
• Improved shock / vibration suppression by shock absorber in the MEMS
structure
• Improved reliability
• Improved moisture resistance
LPS22HB 74

Optimizing the main blocks in the read out chain, we enhanced the performances:
better noise, improved accuracy and reduced current consumption

• Key parameters
• 260 to 1260 mbar absolute pressure
• Less than 1Pa RMS of noise
• ODR from 1 Hz to 75 Hz
• Low power consumption: 4 μA
• High shock survivability: > 20,000 g
• Embedded FIFO for Pressure and
Temperature data
• SPI and I²C interfaces
• Supply voltage: 1.7 to 3.6 V
• Smallest and thinnest form factor:
2x2x0.76 mm package
2 x 2 x 0.76 mm • Unique full-molded package in the market
UVIS25
75
UV Index Sensor
• Features
• 0 - 15 UV index output range
• Resolution: UVI / 16
• Selectable Read out :1 Hz ODR /
One Shot
• SPI and I2C interfaces
• Supply voltage: 1.7 to 3.6 V
• transparent molded package
2.5x2.5x0.76 mm 10L

• Applications
• Wearable
• No Computation or External Calibration • Smartphone
needed to calculate the UV Index • UV erythema dosimeter
• High Field of View
• Health and wellness
• No sensibility to Visible nor IR light
• Weather station

www.st.com/web/en/press/p3655
HTS221
76
Humidity Sensor
• Features
• Humidity and temperature sensor
• 0 to 100% RH range
• -40 to 120 °C temperature range
• Low Power Consumption
• 2 µA @ 1Hz ODR
• Humidity Accuracy - ±4.5%RH
(20%RH to 80%RH)
• SPI and I²C interfaces
• Supply voltage: 1.7V to 3.6V
• Ultra-thin full-molded package
(2x2x0.9 mm)
• High Resolution
• Low Power Consumption

 HTS221E with improved


%RH accuracy avail end Q2’15
Analog
Analog op amps: A Growing Portfolio 78

105 devices 35 devices 5 devices (mat10/20)

New New
Bipolar CMOS 2009 2014/15
CMOS BIP-JFET
& JFET 5V 16V 36V
TSV – TSU - TSZ TSX TSB

General Purpose Micro Power Micro Power

Precision Op-Amp Nano Power Low Power Low Power

Icc decreased from 10 to 100


Medium Speed

High Precision High Precision


Low Noise
High Precision

Low Power
Ultra Precision High Speed

Precision improved factor :


5-6 V 10 to 750 RAIL TO RAIL
10-12 V ESD HBM 4kV min
30-44 V TINY PACKAGES
PERFORMANCE
Mass Market
OpenSoftwareX – silicon through SDKs
Nucleo: a new approach for MEMS & 80

Sensors Tools
Flexible board power supply :
through USB or external source

Integrated ST-Link/V2-1:
mass storage device flash programming

2 push buttons, 2 color Leds

Arduino extension connectors :


easy access to add-ons

One STM32 MCU flavor with 64 pins

Morpho extension headers :


direct access to all MCU I/Os
STM32 Nucleo features
X-Nucleo Program 81

• A strong commitment to expand the number of ST products supported


through the X-Nucleo Program

X-NUCLEO-IDB04A1 X-NUCLEO-NFC01A1 X-NUCLEO-IHM01A1 X-NUCLEO-IKS01A1


Bluetooth Low Energy Dynamic NFC tag Stepper motor driver MEMS Inertial and
Expansion Board based on Expansion Board based on expansion board based on Environmental expansion
BlueNRG M24SR easySPIN™ L6474 board
Available Now Available Now Available Now Available Now
Ready to Use Solutions 82

Rapid Prototyping with A wide offer of evaluation boards


STM32 Open Development Environment (STEVAL) to address Vertical Markets

Automation
• Modular hardware enables broad Others 9%
deployment through a standardized 18%

Expansion boards
Lighting
development framework 13%

Home
• Stack multiple expansion boards Consumer
to add power management, sensors, 12% Sensors
connectivity and more to the STM32 (MEMS)
16%
Nucleo development boards
Power Motor
• Intuitive software tools offer code Management Control
26% 6%
examples and documentations
to get up and running quickly
>410 Evaluation Boards
• Price competitive boards
OpenSoftwareX 83
Bringing Apps developers to the ST silicon

Open Software eXpansion environment


Middleware open.FRAMEWORK

BlueMicrosystem
open.MEMS open.AUDIO open.RF
MotionFX / MotionAR BlueVoice BT Smart Profiles
Gesture (3rd party) BeamForming / SSL Mesh / 6LoWPAN BlueVoiceLink

STM32 ODE
HARDWARE SOFTWARE DRIVERS and HAL

STM32 Nucleo STM32 Nucleo STM32Cube


development
boards
expansion
boards
+ STM32Cube
software
expansion
software

1. BlueVoice / BlueVoiceLink SDK to be published on wk21


NOTE 2. Discussion with HillCrest ongoing for Gesture library
3. Working with Baimos–for
OpenSoftwareX silicon through secure
BlueID SDKs authentication library
Open.MEMS – IP Licensing tool 84
OpenSoftwareX License Wizard

1- Select library to activate

2 – Identify STM32 node

3 – Generate the request

4 – Send the request via email

Enabling rapid evaluation of software IP through a


simple email-based activation process
OpenSoftwareX – silicon through SDKs
X-NUCLEO-CCA02M1 85
MEMS Microphones for STM32 ODE

USB for Audio Streaming


STEVAL-MKI155V1

MEMS Microphones
coupon sockets

X-NUCLEO-CCA02M1 2pcs MP23DT01-M onboard


MEMS Microphones

OpenSoftwareX – silicon through SDKs


Open.AUDIO
86
MEMS MICs SW libraries
• PDM Library (part of X-CUBE-MEMSMIC1)
• Converts digital MEMS microphone PDM signal to the PCM format

• SOUND SOURCE LOCALIZATION


• using a MEMS microphone array, it can estimate the
angle of arrival of the audio signal

• BEAMFORMING
• using a MEMS microphone (omnidirectional) array, the library enables to create a
virtual directional microphone

• AEC
• Acoustic Echo Cancelation (Speex based)

• BLUEVOICE
• Speech audio data transfer over BLE RF link
Thank You