IT Guide

A. Screen Type

1. TFT : Thin Film Transistor

2. TFD : Thin Film Diode

3. LCD : Liquid Crystal Display

4. T – LCD : Transflective – Liquid Crystal Display

5. LED : Light Emitting Diode

6. OLED : Organic Light Emitting Diode

7. AMOLED : Active Matrix Organic Light Emitting Diode

8. IPS : In - Plane Switching

9. PLS : Plain Line Switching

10. LTPS : Low Temperature Poly Silicone

11. UFB : Ultra Fine Bright

12. STN : Super Twisted Nematic

13. CSTN : Colour Super Twisted Nematic

14. IGZO : Indium Gallium Zinc Oxide

15. HD : High Definition

16. Monochrome
 17. Retina Display

18. ClearBlack Display

19. Curve Screen

20. NOVA Screen

B. Screen Panel

1. True Quad HD – IPS + LCD

2. True Full HD – IPS + LCD

3. True HD - IPS

4. Quad Super AMOLED HD

5. Full Super AMOLED HD

6. Super AMOLED HD

7. Super AMOLED Plus

8. Super AMOLED Advanced

9. Super AMOLED

10. Active Matrix TFT HD

11. LED Backlit IPS LCD

12. LED Backlit IPS TFT

 13. LED Backlit LCD

14. Super Clear LCD

15. Super IPS+ LCD

16. Super IPS LCD 3

17. Super IPS LCD 2

18. Super IPS Neo LCD

19. Super LCD 3

20.Super LCD 2

21. Super LCD

22. Curved P – OLED

23. Curved P – AMOLED

C. Operating System (OS)

1. Android OS

 Android 1.0 a.k.a Alpha

 Android 1.1 a.k.a Beta

 Android 1.5 a.k.a CupCake

 Android 1.6 a.k.a Donut

  Android 2.0 a.k.a Eclair

 Android 2.2 a.k.a Froyo (Frozen Yoghurt)

 Android 2.3 a.k.a Gingerbread

 Android 3.0 a.k.a HoneyComb

 Android 4.0 a.k.a ICS (Ice Cream Sandwich)

 Android 4.1 a.k.a Jelly Bean

 Android 4.4 a.k.a KitKat

 Android 5.0 a.k.a Lollipop

 Android 6.0 a.k.a Marsmallow

 Android 7.0 a.k.a Nougat

 Android 8.0 a.k.a Oreo

2. Symbian OS

 Symbian S40 Asha

 Symbian S60 ^3

 Symbian S60 ^5

 Symbian v9.0

 Symbian v9.3

 Symbian v9.4

 Symbian Anna
  Symbian Belle

 Symbian Carla

3. Microsoft Windows Mobile

 Microsoft Windows Mobile 1.0

 Microsoft Windows Mobile 2.0

 Microsoft Windows Mobile 6.0

 Microsoft Windows Mobile 6.5

 Microsoft Windows Mobile Classic

 Microsoft Windows Mobile Proffesional

 Microsoft Windows Mobile 10

 Microsoft Windows Mobile 10 Enterprise

 Microsoft Windows Mobile 10 IoT Core

4. Microsoft Windows Phone

 Microsoft Windows Phone 7 Photon

 Microsoft Windows Phone 7.5 Mango

 Microsoft Windows Phone 7.8

 Microsoft Windows Phone 8

 Microsoft Windows Phone 8 Amber

 Microsoft Windows Phone 8 Black

  Microsoft Windows Phone 8.1

 Microsoft Windows Phone 8.1 Black

5. Microsoft Windows Desktop

 MS - DOS

 Microsoft Windows 1.0

 Microsoft Windows 1.1

 Microsoft Windows 2.0

 Microsoft Windows 3.0

 Microsoft Windows ME

 Microsoft Windows NT

 Microsoft Windows 95

 Microsoft Windows 98

 Microsoft Windows 99

 Microsoft Windows 2000

 Microsoft Windows Server 2003

 Microsoft Windows Server 2007 Enterprise

 Microsoft Windows Server 2007 Standard

 Microsoft Windows Server 2007 SBS Standard

 Microsoft Windows Server 2007 WinFoundation

 Microsoft Windows Server 2007 Solution

 Microsoft Windows Server 2007 Data Center

 Microsoft Windows Server 2007 Home Standard

 Microsoft Windows Server 2007 Home Premium

 Microsoft Windows Server 2008 Standard

 Microsoft Windows Server 2008 Solution

 Microsoft Windows Server 2008 WinFoundation

 Microsoft Windows Server 2008 Data Center

 Microsoft Windows Server 2008 Storage Standard

 Microsoft Windows Server 2008 Storage Workgroup

 Microsoft Windows Server 2008 Multi Point Standard

 Microsoft Windows Server 2008 Multi Point Premium

 Microsoft Windows Server 2012

 Microsoft Windows Server 2012 R2

 Microsoft Windows Server 2019

 Microsoft Windows XP Home

 Microsoft Windows XP Classic

 Microsoft Windows XP Proffesional

 Microsoft Windows Vista Starter

 Microsoft Windows Vista Proffesional

 Microsoft Windows Vista Business

 Microsoft Windows Vista Ultimate

 Microsoft Windows Vista Home Basic

 Microsoft Windows Vista Home Premium

 Microsoft Windows 7 Starter

 Microsoft Windows 7 Proffesional

 Microsoft Windows 7 Ultimate

 Microsoft Windows 7 Home Basic

 Microsoft Windows 7 Home Premium

 Microsoft Windows 8 RT

 Microsoft Windows 8 Core

 Microsoft Windows 8 Enterprise

 Microsoft Windows 8 Pro

 Microsoft Windows 8.1 RT

 Microsoft Windows 8.1 Enterprise

 Microsoft Windows 8.1 Core

 Microsoft Windows 8.1 Pro

 Microsoft Windows 10 Home

  Microsoft Windows 10 Enterprise

 Microsoft Windows 10 Enterprise LTSB

 Microsoft Windows 10 Education

 Microsoft Windows 10 Proffesional

 Microsoft Windows 10 S

6. Blackberry OS

 Blackberry 3

 Blackberry 4

 Blackberry 5

 Blackberry 6

 Blackberry 7

 Blackberry 7.1

 Blackberry 10

 Blackberry 10.1

 Blackberry 10.2

 Blackberry 10.3

 Blackberry 10.5

 Blackberry OS2

7. Other OS
  Maemo 5 (Symbian OS)

 MeeGo OS 2.1 Harmattan (Symbian OS)

 SailFish OS (Symbian OS)

 Privat OS (Android OS)

 Bada OS

 OS Tizen (Based on Android)

 Firefox OS

 Chrome OS

 Remix OS (Android OS)

D. User Interface (UI)

1. Samsung = Touchwiz UI

2. Sony = Timescape UI / Mediascape UI

3. HTC = HTC Sense UI

4. LG = Optimus UI

5. Lenovo = Lenovo Magic / Lenovo Launcher / Vibe UI

6. Acer = Acer Float UI

7. Microsoft = Tile Live UI / Metro UI (Fluent Design System)

 8. Asus = Zen UI

9. Xiaomi = MI UI

10. Huawei = EM UI

11. Meizu = Flyme OS

12. Oppo = ColorOS

13. Coolpad = Cool UI

14. Infinix = X UI

15. FiraOS

16. FiraUI

17. Cyanogen Mod

18. Cyanogen OS

E. Network Generation

1. 1G

 AMPS (Analog Mobile Phone System)

 CDMA (Coded Division Multiple Access)

o TDMA (Time Division Multiple Access)

o FDMA (Frequency Division Multiple Access)

2. 2G

 GSM (Global System for Mobile communication)

3. 2.5G

 GPRS (General Packet Radio Service)

4. 2.75G

 EDGE (Enhanced Data rates for GSM Evolution)

5. 3G

 UMTS (Universal Mobile Telecommunication System)

 W-AMR (Wideband – Adaptive Multi Rates)

 W-CDMA (Wideband – Coded Division Multiple Access)

6. 3.5G

 HSPA (High Speed Packet Access)

o HSDPA (High Speed Downlink Packet Access)

o HSUPA (High Speed Uplink Packet Access)

7. 3.75G

 HSPA + (High Speed Packet Access +)

 EV-DO (Evolution Data Optimized)

 LTE (Long Term Evolution)

8. 4G
  LTE – A (Long Term Evolution - Advanced)

o TDD – LTE (Time Division Duplex – Long Term Evolution)

o FDD – LTE (Frequency Division Duplex – Long Term Evolution)

 WiMax

9. 5G (Rumored)

F. King Every Vendor

1. Phone

 Sony : Sony Xperia Z6 Ultra

 Samsung : Samsung Galaxy SX

 HTC : HTC One M9+

 LG : LG G7

 Nokia : Nokia 9

 Microsoft : Microsoft Surface Phone

 Lenovo : Lenovo Vibe K6

 Acer : Acer Liquid Jade Primo

 Oppo : Oppo R9

 Smartfren : Smartfren Andromax R2

  Asus : Asus Zenfone 5z

 Google : Google Nexus 9

 Xiaomi : Xiaomi Mi Mix2

 Motorola : Motorola Nexus 6

 Huawei : Huawei Mate S

2. Tablet

 Sony : Sony Xperia Z4 Tablet

 Samsung : Samsung Galaxy View

 Lenovo : Lenovo Yoga Tab 3 Pro

 Nokia : Nokia Lumia 2520

 Asus : Asus Zenpad 10 S

 Microsoft : Microsoft Surface Book Refresh Edition

 Google : Google Pixel C

 Apple : Apple iPad Pro

G. First Time Smartphone

 Android

1. Android 1.0 Alpha : HTC Nexus One

2. Android 1.1 Beta : HTC Dream

3. Android 1.5 CupCake : T-Mobile MyTouch

4. Android 1.6 Donut : HTC Magic

5. Android 2.0 Eclair : Motorola Droid a.k.a Milestone

6. Android 2.2 Froyo (Frozen Yoghurt) : HTC Passion

7. Android 2.3 Gingerbread : Samsung Google Nexus S

8. Android 3.0 HoneyComb : Motorola Xoom

9. Android 4.0 ICS (Ice Cream Sandwich) : Samsung GT-I9250 Galaxy Nexus

10. Android 4.1 Jelly Bean : Google Nexus 7

11. Android 4.4 KitKat : LG Nexus 5

12. Android 5.0 Lollipop : Android One

13. Android 6.0 Marsmallow : Samsung Galaxy S7 / S7 Edge

 New Processor Core

1. Dual Core : LG Optimus 2X

2. Passive Quad Core : Samsung Galaxy S7 / S7 Edge

3. True Quad Core : LG Optimus 4X HD

4. Passive Hexa Core : Samsung Galaxy Note 3 Neo

5. True Hexa Core : K – Touch Hexa

6. Passive Octa Core : Samsung GT-I9500 Galaxy S4

7. True Octa Core : Imo Clarity

8. Passive Deca Core :

Year Microarchitectures Pipeline Stages Max. Clock

1989 486 (80486) 3 100 MHz

1993 P5 (Pentium) 5 300 MHz

1995 P6 (Pentium II) 14 (17 with load & store/retire) 450 MHz

1999 P6 (Pentium III) 12 (15 with load & store/retire) 450~1400 MHz

2000 NetBurst (Pentium 4) 20 800~3466 MHz

2003 Pentium M 10 (12 with fetch/retire) 400~1000 MHz

2004 Prescott 31 3800 MHz

2006 Intel Core 12 (14 with fetch/retire) 3000 MHz

2008 Nehalem 20 3000 MHz

2008 Bonnell 16 (20 with prediction miss) 2100 MHz

2011 Sandy Bridge 14 (16 with fetch/retire) 4000 MHz

2013 Silvermont 14 – 17 (16 – 19 with fetch/retire) 2670 MHz

2013 Haswell 14 (16 with fetch/retire) ~4000 MHz

2015 Skylake 14 (16 with fetch/retire) ~4000 MHz

2016 Kaby Lake ? ?

 Processors

Architectural Fabrication Micro Release

Codenames 8P/4P 4P/2P Enthusiast/ Marketing
change process Architecture date Desktop Mobile
Server/WS Server/WS WS names

 Core

 Pentium 4

 Pentium D
Tick Presler,
 Pentium M
Manufacturing P6, NetBurst Cedar Mill, 2006-01-05 - - Presler Cedar Mill Yonah
 Pentium Dual-
Technology Yonah
Core
65 nm  Celeron

 Xeon

 Core 2
Tock
 Pentium Dual-
New Woodcrest
Merom 2006-07-27 Tigerton Kentsfield Conroe Merom
Core
Microarchitect Clovertown
 Pentium
ure
Core  Celeron Dual-

Core
Tick
 Celeron
Manufacturing 45 nm Penryn 2007-11-11 Dunnington Harpertown Yorkfield Wolfdale Penryn
 Celeron M
Technology
 Xeon
 Tock
 Core i3
New
Nehalem 2008-11-17 Beckton Gainestown Bloomfield Lynnfield Clarksfield  Core i5
Microarchitect
 Core i7
ure Nehalem
 Pentium
Tick
 Celeron
Manufacturing Westmere 2010-01-04 Westmere-EX Westmere-EP Gulftown Clarkdale Arrandale
 Xeon
Technology

 Core
2nd
i3
Generat
 Core
Tock 32 nm ion
i5
New Sandy Sandy Bridge- Sandy Bridge- Sandy Bridge- Intel
2011-01-09 (Skipped) Sandy Bridge  Core
Microarchitect Bridge EP E M Core
i7
ure
 Pentium

 Celeron

 Xeon
Sandy Bridge
 Core
3rd
i3
Generat
 Core
ion
Tick i5
Intel
Manufacturing 22 nm Ivy Bridge 2012-04-29 Ivy Bridge-EX Ivy Bridge-EP Ivy Bridge-E Ivy Bridge Ivy Bridge-M  Core
Core
Technology i7

 Pentium

 Celeron

 Xeon
  Core
4th
 Haswell-MB i3
Generat
(notebooks)  Core
Tock ion
 Haswell-LP i5
New Intel
Haswell 2013-06-02 Haswell-EX Haswell-EP Haswell-E Haswell-DT (ultrabooks)  Core
Microarchitect Core
 Crystal Well i7
ure
(Iris Pro  Pentium

Graphics)  Celeron

 Xeon

Haswell

Refresh Refresh, Core i5-4690K

2014-06
(semi-Tock) Haswell Devil’s Core i7-4790K

Canyon

 Core
5th
i3
Generat
 Core
ion
i5
Tick Intel
 Core
Manufacturing Broadwell 2014-09-05 Broadwell-EX Broadwell-EP Broadwell-E - - Core
i7
Technology
14 nm  Core M

 Pentium

 Celeron

 Xeon

 Core 6th

Tock Skylake Skylake 2015-08-05 Skylake-EX Skylake-EP Skylake-X - - i3 Generat

ion
 New  Core Intel

Microarchitect i5 Core

ure  Core

i7

 Core

m3

 Core

m5

 Core

m7

 Pentium

 Celeron

 Xeon

 Core

i3

 Core

i5
7th
 Core
Generat
Skylake i7
Refresh ion
Refresh, 2016 Kaby Lake-X -  Core
(semi-Tock) Intel
Kaby Lake m3
Core
 Core

i5-Y

 Core

i7-Y

 Pentium
  Celeron

 Xeon

Coffee Lake 2017

Tick Cannon Lake 2018

10 nm
Tock Ice Lake 2018

semi-Tock Ice Lake Tiger Lake 2019

Tick ?
7 nm
Tock ?

Tick ?
5 nm
Tock ?
 Atom Roadmap

Processors/SoCs
Fabrication Releas
Microarchiteture MID,
process e date Tablet Netbook Nettop Embedded Server Communication CE
Smartphone

Tick 2008 Silverthorne N/A Diamondville Tunnel Creek Sodaville

45 nm Bonnell N/A
Tock 2010 Lincroft Pineview & Stellarton Groveland

Medfield

(Penwell &
Clover Trail Centerton &
Tick 32 nm Saltwell 2011 Lexington) & Cedar Trail (Cedarview) Unknown Unknown Berryville
(Cloverview) Briarwood
Clover Trail+

(Cloverview)

Merrifield

(Tangier) & Avoton /

Bay Trail-T Bay Trail-M Bay Trail-D Bay Trail-I
Tick 22 nm Silvermont 2013 Moorefield Knight Rangeley Unknown
(Valleyview) (Valleyview) (Valleyview) (Valleyview)
(Anniedale) & Landing

Slayton

Binghamton & Cherry Trail-T

Tick Airmont 2014 Braswell Denverton Unknown Unknown
Riverton (Cherryview)
14 nm
Morganfield
Tock Goldmont 2015 Apollo Lake Unknown Unknown Unknown Unknown Unknown
(Broxton)
H. Intel Processors Feature

 Essentials

1. Launch Date : Tanggal pertama kali produk dikenalkan.

2. Lithography : Teknologi semikonduktor yang dipakai untuk menghasilkan sirkuit terintegrasi, dan dilaporkan dalam

nanometer (nm); indikasi ukuran dari fitur yang dibuat di semikonduktor.

 Performances

1. # of Cores : Istilah hardware yang mendeskripsikan jumlah inti (core) dari CPU

2. # of Threads : Istilah software untuk basis urutan instruksi yang telah ditentukan yang dapat

diproses oleh satu inti (core) CPU.

3. Processor Base Frequency :

4. Max Turbo Frequency :

5. Cache : Area memory cepat yang berada di prosesor. Intel Smart Cache menunjukkan

kepada arsitektur yang mengizinkan semua inti (cores) untuk membagi akses secara dinamik ke cache level terakhir.

6. TDP (Thermal Design Power) :

7. Configurable TDP-up Frequency :

8. Configurable TDP-up :

9. Configurable TDP-down Frequency :

10. Configurable TDP-down :

 Supplemental Information
 1. Embedded Options Available :

2. Conflict Free :

 Memory Specifications

1. Max Memory Size (dependant on memory type) : Kapasitas maksimal memori (dalam GB) yang didukung oleh prosesor.

2. Memory Types : Prosesor Intel hadir dalam empat tipe memori yang berbeda: Single

Channel, Dual Channel, Triple Channel, dan Flex Mode.

3. Max # of Memory Channels : Jumlah saluran memori ke pita lebar untuk operasi aplikasi secara nyata.

4. Max Memory Bandwidth : Nilai maksimum yang mana data dapat dibaca atau disimpan ke dalam

memori semikonduktor oleh prosesor (dalam GB/s).

5. ECC Memory Supported :

 Graphics Specifications

1. Graphics Base Frequency :

2. Graphics Max Dynamic Frequency :

3. Graphics Video Max Memory :

4. Graphics Output :

5. 4K Support :

6. Max Resolution (Intel WiDi) :

7. Max Resolution (HDMI 1.4) :

8. Max Resolution (DP) :

 9. Max Resolution (eDP – Integrated Flat Panel) :

10. Max Resolution (VGA) :

11. DirectX Support : Indikasi dukungan untuk versi spesifik dari koleksi API (Application

Programming Interaces) milik Microsoft untuk mengendalikan proses multimedia.

12. OpenGL Support :

13. Intel Quick Sync Video :

14. Intel InTru 3D Technology :

15. Intel Clear Video HD Technology :

16. Intel Clear Video Technology :

17. Intel Wireless Display :

18. Intel Insider :

 Expansion Options

1. PCI Express Revision :

2. PCI Express Configurations :

3. Max # of PCI Express Lanes :

 Package Specifications

1. TJUNCTION : Temperatur maksimum yang diperbolehkan di chip prosesor.

 Advanced Technologies
1. Intel Turbo Boost Technology : Secara dinamis meningkatkan frekuensi prosesor jika

diperlukan dengan mengambil keuntungan dari panas dan daya di ruang utama untuk memberikan kecepatan ketika

dibutuhkan, dan meningkatkan efisiensi energi ketika tidak dibutuhkan.

2. Intel vPro Technology : Sekumpulan keamanan dan kemampuan pengendalian yang ada

didalam prosesor yang ditargetkan di empat area kritis dari keamanan TI: 1) Pengelolaan ancaman, termasuk perlindungan

dari rootkit, virus, dan malware 2) Perlindungan identitas dan titik akses website 3) Perlindungan rahasia pribadi dan data

bisnis 4) Pengawasan lokal dan jarak jauh, remediasi, dan memperbaiki PC dan workstation.

3. Intel Hyper-Threading Technology : Memberikan proses untaian setiap inti (core). Untaian proses

yang tinggi dapat menyelesaikan banyak pekerjaan secara paralel.

4. Intel Virtualization Technology (VT-x) : Mengizinkan satu program hardware untuk berfungsi seperti

beberapa program “maya”. Ini menawarkan peningkatan kendali dengan membatasi waktu dan mempertahankan produktivitas

dengan mengisolasi aktifitas komputasi ke dalam partisi terpisah.

5. Intel Virtualization Technology for Directed I/O (VT-d) :

6. Intel VT-x with Extended Page Tables (EPT) :

7. Intel TSX-NI : Sekumpulan instruksi yang berfokus pada skala performa

untaian. Teknologi ini membantu operasi paralel lebih efisien lewat peningkatan kontrol dalam penguncian software.

8. Intel 64 : Memberikan komputasi 64-bit di server, workstation,

desktop, dan mobile ketika dikombinasikan dengan software yang didukung. Arsitektur Intel 64 meningkatkan performa

dengan memperbolehkan sistem untuk mengalamatkan memori lebih dari 4 GB memori virtual dan fisik.
9. Instruction Set :

10. Instruction Set Extensions :

11. Idle States :

12. Enhanced Intel SpeedStep Technology :

13. Thermal Monitoring Technologies :

14. Intel ME Firmware Version :

15. Intel HD Audio Technology :

16. Intel Matrix Storage Technology : Menyediakan perlindungan, performa, dan pengembangan

untuk program desktop dan mobile. Apakah menggunakan satu atau lebih HDD, pengguna dapat mengambil keuntungan

peningkatan performa dan konsumsi daya yang lebih rendah. Ketika menggunakan lebih dari satu HDD pengguna mendapatkan

perlindungan tambahan dari kehilangan data saat terjadi kegagalan HDD. Pendahulu dari Intel Rapid Storage Technology.

17. Intel Identity Protection Technology :

18. Intel Rapid Storage Technology : Menyediakan perlindungan, performa, dan pengembangan

untuk program desktop dan mobile. Apakah menggunakan satu atau lebih HDD, pengguna dapat mengambil keuntungan

peningkatan performa dan konsumsi daya yang lebih rendah. Ketika menggunakan lebih dari satu HDD pengguna mendapatkan

perlindungan tambahan dari kehilangan data saat terjadi kegagalan HDD. Penerus dari Intel Matrix Storage Technology.

19. Intel Smart Connect Technology :

20. Intel Flex Memory Access : Memfasilitasi kemudahan peningkatan dengan mengizinkan

perbedaan ukuran memori untuk dipopulasikan dan meninggalkan dalam modus dual channel.
 21. Intel Stable Image Platform Program (SIPP) : Membantu perusahaan mengidentifikasi dan menyebarkan

standarisasi, salinan program PC yang stabil untuk sedikitnya 15 bulan.

22. Intel Small Business Advantage :

23. Intel Smart Response Technology : Mengombinasikan performa cepat dari SSD berkapasitas

kecil dengan HDD berkapasitas besar.

24. Intel My WiFi Technology :

 Intel Data Protection Technology

1. Intel AES New Instructions :

2. Secure Key : Terdiri dari pembuat nomor acak digital yang dibuat benar-benar

acak untuk menguatkan enkripsi algoritma.

3. Intel Software Guard Extensions (Intel SGX) :

4. Intel Memory Protection Extensions (Intel MPX) :

 Intel Platform Protection Technology

1. Trusted Execution Technology :

2. Execute Disable Bit :

3. Intel Anti-Theft Technology :