You are on page 1of 31

Forschungsschwerpunkt Technologien

der Mikroperipherik

Marking of Electronic Components and Board
Assemblies as RoHS Compatible –
Information in the Supply Chain and Logistics
Irina Stobbe, Otmar Deubzer, Hansjörg Griese, Herbert Reichl

3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 1 Irina Stobbe

Lead-free Labelling / Material Declaration
„ Labelling itself is NOT a requirement from the RoHS legislative

Why ?
„ Request in a common standard for marking scheme across the industry, i.e. in
a worldwide acceptable solution, which supports the trust in declaration
„ Ease communication within supply chain at minimum costs
„ Supporting manufacturing, repair, service (Life Cycle Enhancement)
„ Supporting material recycling: Announcement of valuable and difficult in
handling materials

Challenges:
Source: Fujitsu-Siemens
„ Label as small as possible, BUT should contain large amount of information
„ Higher production and documentation costs, reading effort
„ Missing comprehensibility for users (uncertainty of how to interpret the labels)

3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 2 Irina Stobbe

Requirements to Labelling/Marking?

Supporting decision making on different levels

Legislative Process- and Material-oriented
Requirements Requirements

WEEE RoHS Logistics/ Trace- Remaining Reco-
EcoDesign compliance Quality ability Lifetime vering

Legis- Supply Recyc-
User Market Service Reuse
lation chain ling

3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 3 Irina Stobbe

Lead.g. mostly contains lead Old equipment: before 2006-07-01 . June 8. Cd in Electronics after July 1.p 4 Irina Stobbe . 2006 Æ for 8 from 10 categories from WEEE (subject of changes ) Æ Exemptions are possible and subject of changes (defined in ANNEX.lead-free declaration for a short time ƒ Directive on the Restriction of the Use of Certain Hazardous Substances in EEE (RoHS) Æ Ban on e. reviewed by TAC) ƒ Directive End of Life of Vehicles (ELV) Æ Bann on Materials and Recycling. Cr(VI). European Legislative ƒ Directive on Waste Electrical and Electronic Equipment (WEEE) - Æ Producer Responsibility for Take Back of Used Electronics – and Recycling Rates Æ Scope: consumer products in 10 categories Def: Old-old-equipment: no declaration. Hg. 2005 . (temporarily) exemption for lead ƒ Draft Directive on establishing a framework for EcoDesign of Energy Using Products (EuP) Æ Eco-Design under the umbrella of CE-mark 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.

No Marking Requirement from RoHS Directive „ -Labelling only.p 5 Irina Stobbe . because marking has a temporarily character. 2005 . trust ! „ Rules and definitions like maximum concentration values (MCV) and explanations should simplify communication and agreements „ Markings about non-existence have a temporarily character: The destination is the restriction of hazardous materials without any exemptions. Harmonisation is handicapped by different interests of market players and timelines 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. if it is explicitly required by directives. That makes necessary that conformity assessment methods are defined by EU and available. „ Different marking systems are possible. „ EU Parliament and Commission have to decide about the commitment requirement Remain: „ Marking should provide convenience. June 8.

inner materials. Maximum processing temperature. 2005 .Information for life cycle.p 6 Irina Stobbe . Reuse • Material recycling (WEEE request) • Disposal 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. for eco-design / Product improvement processes • Marketing . June 8.Functionality • Use phase • Service. Repair. MSL) • Board specification (other hazardous materials. Information for convenience and benefit „ Relevant information in the supply chain • Status of technology change processes in the supply chain • Assembly process specification • Component specification (Terminal finish. finishes) „ Material data .

2005 . Various marking schemes on market examples only Intertronics (EU) Schurter ANDUS ZETEX (EU) Future electronics Panasonic Harwin TechSearch International AEC Lattice AAT Aston Ecliptek C&K components 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.p 7 Irina Stobbe . June 8.

Marking schemes : more brand than standard examples only Lead-free marking: Bourns Supertex Fairchild Lattice Nu visions Matrix USA Label IDent RoHS marking: Micro semiconductor Schurter NIC Components Phoenix Contact 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. June 8.p 8 Irina Stobbe . 2005 .

p 9 Irina Stobbe .Technologies for Labelling on Boards Bar code Printed with branding Printed Etched in the copper layer Printed label. 2005 . June 8. glued 2D data matric code laser etched 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.

Guidance for the lead-Free Marking of Materials. May 2004: Marking. Symbols. Components and Devices „ JEITA ETR-7021. Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies. and Devices „ IPC-1066. „ IPC-1066 and JEITA ET-7001 now as IEC proposals for world wide standardisation 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. June 8. 2005 .Questioners. proposals „ many enterprise specific rules and roadmaps / request in labelling if compatibility with RoHS and other legal or if lead in it. Standards and Technical reports – Inter-regional process „ JEDEC Standard JESD97. Components and Mounted Boards used in Electronic and Electric Equipment „ JEITA ET-7001 (Draft 2005) : The marking for presence and non-presence of the specified chemical substances in materials. June 2004.p 16 Irina Stobbe . components and NEW mounted boards used in electrical and electronic equipment „ EIAJ EDR-7605 (JEITA).and EFSOT. Technical Report : Marking guideline of packing for lead-free semiconductor device (only) „ Soldertec. Components. and Labels for Identification of Lead (Pb) Free Assemblies. June 2004: Marking.

but lead-free processable Phase 2: Lead-free solder systems and terminations Phase 3A: No lead in materials at all (only RoHS exemptions are allowed) Phase 3: lead-free in all components. 2005 .). solder joints and finishing materials „ ET-7001 (2005): Presence and non-presence. Cd... NEW no phases ! „ Materials will be described by their chemical symbol (Pb. CrVI.. alloys by the substances contained or by shortened composition symbols 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.p 21 Irina Stobbe . all RoHS materials. June 8.Approach „ ETR-7021 (2004): Levels of lead-free are defined as phase timeline for reach that (for components and boards) Phase 1: contains lead. JEITA . Hg.

.LF at all . Au. only - Lead-free Phases Phase 2 .1wt% in raw Tolerance up to maximum concentration wt% in the uniform substance or uniform materials. Solder (only JESD97) Lead-free per order presumed Lead free presumed Pb free presumed Board – IPC : HF = Substrate Halogen free 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.Totally Pb-free SnAgCu ÅÆ A40C5 SnAgCu ÅÆ A40C5 Solder symbol (e1. no Bi.LF terminals and solder presence or non-presence .low temp. material process ready.1 (0. 2 (1) Like RoHS without data Without reference Phase 1 . Comparison of Standards or Guidelines (1) Category Soldertec/BeCAP JEITA ET-7001 IPC-1066 / JESD97 Lead-free.p 27 Irina Stobbe .) for solder classes SnZnBi ÅÆ Z80B30 SnZnBi ÅÆ Z80B30 e1 .other SnX.Sn (see IEC 61190-1-3 or ISO 9453) e4 . NiPdAu) material under the presence/non-presence sign e5 . Limitation value (MCV) < 0. reference to RoHS.SnZn. no Bi e6 .Bi e7 .01) Pb-free means Pb < 0. Mercury-free. … Non-presence means substance < 0. NiPd.LF processable No more phases. June 8.2nd level interconnect Phase 3 Æ 3A .01) wt% in homogeneous material Exemptions Annex1.preplated(Ag.SnAgCu e2 .. 2005 . Scope Art.1 (0. e2. no Zn Solder Material It displays at the main unit and the wrapping e3 . SnZnX.RoHS compliance of a (RoHS) substance from Annex I - Phase 4 Æ 3 .

[[(PDPE)]]. June 8. MST None For components: Maximum safe Process temperature (MST) Parameters Not required.p 28 Irina Stobbe . 2005 . … Hg (PDPE) interc. label or barcode Component Non-presence: [[G]] or G Plus solder exemptions to be marked : characteristic A30C5 Hg: #1 … #4 Pb: #5 … #7 Cd: #8 Cr(VI): #9 #7-2006 >>#7-2006<< or Presence of other materials from Annex 1 Solder symbol (if year is required) (equivalent to RoHS) 2nd Totally Assembly Phase 3 level Pb-free [[Hg]]. Comparison of Standards or Guidelines (2) Category Soldertec/BeCAP JEITA ET-7001 IPC-1066 / JESD97 Phase 2 no more Solder symbol required Lead presence: [[Pb]] or Pb Phase 3A 2nd l. Z80B30) and the chemical formula with categories Material Declaration finishes Changes in exemptions are traceable. conf. terminals and board finishes with For substrates. i. (only IPC) included Benefits all RoHS-Materials 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.B. Material declaration makes boards easier to Other restrictions like Halogen-free (HF) support to service recycle. For solder. solder material. finish Recommended for solder ( z. Label Recommended: MSL.

2005 .and Material-oriented Requirements Requirements WEEE RoHS Logistics/ Trace.Requirements to Labelling/Marking? Supporting decision making on different levels Legislative Process. Supply Recyc- User Market Service Reuse lation chain ling 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.Remaining Reco- EcoDesign compliance Quality ability Lifetime vering Legis. June 8.p 30 Irina Stobbe .

2005 . conformal coatings (IPC- CC-830B) „ Solder process and solder material. Maximum safe temperature. Handbook of Material Data Declaration • RoHS materials. e. Supplier code etc See: Request in new product identifications numbers for transferred products in the supply chain logistics „ Material content information • refer to IEC DPAS 3/750. June 8. Moisture sensitivity level (MSL) „ Thermal stress „ Reuse – Disassembly – Repair .p 31 Irina Stobbe .Recycling information 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. Halogens (IEC 61249-2-21). part and serial number.g. High Level Information: Content „ Product identification. 3/2005.

Umbrella Specs of ZVEI • Positive list (Full material data declaration) Legislation : no explicit requirement. Joint Industry Guide • Averaged positive list e. Material Data Declaration : Requirements Material data declaration (MDD): • Negative list e. RoHS.g. RoHS compliance • Extended negative list e. etc trigger the implementation of MDD Æ IEC Working group for PAS Supply Chain : Customers‘ request for compliance declaration Design for Environment (DfE): MDD supports DfE with the existing databases 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. 2005 . June 8.p 32 Irina Stobbe .g. ELV.g. but the legislations like EuP. WEEE.

2 Sub-Part 1. pts Material D: 3 g 0 Material D: 100 ind. June 8.1: 93 g TPI/mass unit 970 indicator points 100 Material A: 12 g Ecological Material Rating Material A: 820 ind.p 33 Irina Stobbe . environmental screening „Toxic Potential Indicator“: Product: Product: 357 g Hazardous Allowable Water 3. toxicity assessment and raw material extraction energy calculation Example screening tool : IZM/EE Toolbox: TPI (Toxic Potential Indicator) RPI (Recycling Potential Indicator) ERM (Raw Material extraction energy) Product tree Environmental screening Product tree material declaration (PAS) indicators. e.1: Sub-Part 1. pts Material E: 49 g Material E: 30 ind.. 2005 ..g. pts Material B: 23 g (points per mass unit) Material B: 15 ind.. pts Product Product Sub-Part 1..260 indicator points Projection on Numerical Scale and Product Aggregation Product Sub-Part 1. pts Material F: 1 g Material F: 5 ind.2 Product Part 2 Environmental Assessment Product Part 2 . . 3rd International Conference on Lead-Free Electronics Source: Karsten Schischke Green Electronics Barcelona.160 indicator points Substances Workplace Pollution Declarations Concentration Classification (R-phrases) (MAK) (WGK) Product Part 1: Product Part 1: 122 g 2. Environmental Screening Requirements Material data are required in design phase – for resource consumption.

which can be a part of an environment management system (EMS) (that means optimization under environment conditions) • Waste flow optimisation reduces cost and impact 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.p 34 Irina Stobbe .2000.5. DIN ISO 9001. 2005 . 7.3) „ Which component with which charge number is when and in which product for which job and which costumer is built? „ Advantages of traceability in the inner supply chain: • Transparent production process • Targeted identification of affected assembly • Reduce cost and time in case of failure „ Which environmental effect can be reached with traceability: • Enables material flow management. Traceability „ Traceability : A process that has the ability to trace the usage and position of a unit using recorded documents (EN ISO 8402. June 8.

2005 . Place of real information storing is inside or outside of the product. Data matrix Life Cycle Modules (Memory. that is not directly visible and understandable ƒ It needs extra devices and handlings to get the information. June 8.p 35 Irina Stobbe . Labelling levels for more effective knowledge High Level Labelling: ƒ labelling. Transponder Transponder) Reader Realisation of storing these data: ƒ Data matrix (outsourcing the data) ƒ Transponder (RFID) (mostly outsourcing the data) ƒ LIM (capturing and storing the data) ( Low Level Labelling – single data: yes or no Æ one sign) 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. ƒ These kind of labelling provide more than one information.

„ Featuring: 1. 2005 . Data matrix „ Data matrix: A very area efficient 2D (two dimensional) barcode symbology = Finder Alternating Data region pattern pattern A unique perimeter pattern helps the barcode scanner determine the cell locations. non-changeable 2. June 8. Storage of special identification number. Access to company (Web-) DATABASE in order to get all required product information for service or recycling purposes (outsourced information) 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.p 36 Irina Stobbe .

RF ID system consists of a tag. reader (interrogator) that communicate with the tag through air interface. June 8. Computer RFID Reader Tag Data pulse Energy „ Featuring: 1. Problem: Too expensive and not sufficient memory to represent all material-content information Æ information should be outsourced 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. Transponder/RFID „ RFID: A system meant to provide data that is saved in a transponder (tag). 2005 . Data readout by interested party. an antenna to support the tag. Data modification possible (after service. …) 4. recycler 3.g. Generally. service provider.p 37 Irina Stobbe . e. Storage of material contents in transponder memory 2.

Refurbishment. Predictive Maintenance LIU recor & analy Test ds zes Use Transportation 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. Using a life cycle information unit (LIU/LIM) SFB 281. 2005 .p 38 Irina Stobbe . June 8.gov. funded project Life Cycle Units are integrated in (electronic) products : Design Reuse supports & Recycling improves Manufacturing supports Repair.

Use of provided information (Scenarios I) „ Recycling processes: Optical recognition of the lead-free sign and separation of higher graded lead-free PWBs: Special treatment before the smelting process for higher recovery rates of precious and other (Sn) metals. dismantling rules Benefit: cost for transponder and memory vs. chem. Analysis. „ Recycling: calculation of content of goods receipt instead of measurement (chem. temperature compatibility of components Benefit: quality 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. analysis). Benefit values not calculated yet. multiple use for logistics „ Repair: Knowledge about solder material and finishes Æ HF / A40C5 / OSP+ working temperature.p 39 Irina Stobbe . June 8. 2005 .

Use of provided information (Scenarios II) „ Service / Reuse: Full material and product information provide the possibility of reuse and upgrades including the traceability. 2005 . June 8. reuse DB 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. time.p 40 Irina Stobbe . Benefit: quality.

June 8.p 41 Irina Stobbe . EFSOT Material Declaration – outsourcing of information Project Example http://www. 2005 .efsot-europe.info International project on new generation environmental friendly soldering technologies 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.

EFSOT Material Declaration – outsourced info „outsourced“ information in web-based datasheets 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. 2005 .p 42 Irina Stobbe . June 8.

Problem: Data may be not accurate enough to support eco design on a material basis Material data variation from different manufacturers vs.p 43 Irina Stobbe . June 8. 2005 . USpecs information spectrum Tantalum MnO2 Silver TBBA Sb2O3 Fe/Ni Sn c c 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.

June 8. can be weighted by mass or by toxicity. Which data quality suffice …. B. 2005 . DQ ≅ 3-4 exemplary) „ Application of material based screening tools for EcoDesign Æ Full material declaration. DQ ≅ 2-3 exemplary) . averaged. Energy data. utilization data.1 % Æ No more information about environmental hotspots „ Reduction of hazardous material in components Æ JIG (List A. traces < 0.p 44 Irina Stobbe . ? „ Declaration of RoHS compliance Æ Negative List of selected materials. work in process ) 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. Æ Umbrella Specs (Typical values. data quality better than 4 (Data quality DQ ranges from 1 (bad) to 5 (excellent) in a systematic SPOLD-alike assessment. data quality better than 3 (includes averaged data) „ Provide a life cycle analysis Æ Full Material data.

Declaration of solder system and maximum safe temperature are useful in service or repair 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. for marketing it is free. June 8.sign needs explanation • Suggestion: Mark lead-containing components with lead and the number and year of RoHS exemption annex Pb #7-2006 „ Lead-free labelling is only for supply chain logistics (Floor shops and other).Summary (1) „ Lead free labelling depends on • Definition of „lead-free“ (limit values and unit) • Lead-free in outer connections or in the inner materials too? (relates to definition of phase 2 or phase 3) • RoHS compliance includes exemptions. what to use... which could be changed during the evaluation processes (. 2005 . and includes five materials more!) .p 45 Irina Stobbe .

assurance documents…. layouts. Very different on manufacturers • ISO 9000 and ISO 14000 support the transfer process „ Environment improvement due to labelling is possible only if manufacturer organizes traceability and provides energy or material flow management under environmental issues 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona. customer related documents. bills of material. June 8. place and data technology. • Kind of enumeration depends on historic grown old numbers.p 46 Irina Stobbe . 2005 .Summary (2) „ Real challenges in manufacturer management are to organise the enumeration (P/N) of changed components in all accompanying documents • Qualification of processes.

June 8. 2005 . Thanks for your attention ! Questions …? [[Pb. Hg]] A30C5 IPC-1066 / JESD97 JEITA ET-7001 #21/2006 G Marking of Electronic Components and Board Assemblies as RoHS Compatible – Information in the Supply Chain and Logistics Contact: Irina.30 .p 47 Irina Stobbe .efsot-europe.de +49 .Stobbe@TU-Berlin.464 03 156 http://www.info 3rd International Conference on Lead-Free Electronics Green Electronics Barcelona.