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 XC9500 In-System

Programmable CPLD Family
May, 1997 (Version 1.1) Product Information

Features Family Overview
• High-performance The XC9500 CPLD family provides advanced in-system
- 5 ns pin-to-pin logic delays on all pins programming and test capabilities for high performance,
- fCNT to 125 MHz general purpose logic integration. All devices are in-system
• Large density range programmable for a minimum of 10,000 program/erase
- 36 to 288 macrocells with 800 to 6,400 usable gates cycles. Extensive IEEE 1149.1 (JTAG) boundary-scan sup-
• 5 V in-system programmable port is also included on all family members.
- Endurance of 10,000 program/erase cycles As shown in Table 1, logic density of the XC9500 devices
- Program/erase over full commercial voltage and ranges from 800 to over 6,400 usable gates with 36 to 288
temperature range registers, respectively. Multiple package options and asso-
• Enhanced pin-locking architecture ciated I/O capacity are shown in Table 9. The XC9500 fam-
3
• Flexible 36V18 Function Block ily is fully pin-compatible allowing easy design migration
- 90 product terms drive any or all of 18 macrocells across multiple density options in a given package foot-
within Function Block print.
- Global and product term clocks, output enables, set
and reset signals The XC9500 architectural features address the require-
• Extensive IEEE Std 1149.1 boundary-scan (JTAG) ments of in-system programmability. Enhanced pin-locking
support capability avoids costly board rework. An expanded JTAG
• Programmable power reduction mode in each instruction set allows version control of programming pat-
macrocell terns and in-system debugging. In-system programming
• Slew rate control on individual outputs throughout the full device operating range and a minimum
• User programmable ground pin capability of 10,000 program/erase cycles provide worry-free recon-
• Extended pattern security features for design protection figurations and system field upgrades.
• High-drive 24 mA outputs Advanced system features include output slew rate control
• 3.3 V or 5 V I/O capability and user-programmable ground pins to help reduce system
• PCI compliant (-5, -7, -10 speed grades) noise. I/Os may be configured for 3.3 V or 5 V operation. All
• Advanced CMOS 5V FastFLASH technology outputs provide 24 mA drive.
• Supports parallel programming of multiple XC9500
devices Architecture Description
Each XC9500 device is a subsystem consisting of multiple
Function Blocks (FBs) and I/O Blocks (IOBs) fully intercon-
nected by the FastCONNECT switch matrix. The IOB pro-
vides buffering for device inputs and outputs. Each FB
provides programmable logic capability with 36 inputs and
18 outputs. The FastCONNECT switch matrix connects all
FB outputs and input signals to the FB inputs. For each FB,
12 to 18 outputs (depending on package pin-count) and
associated output enable signals drive directly to the IOBs.
See Figure 8.

April, 1997 (Version 1.0) 3-1

5 5. 1997 (Version 1.5 7.5 7.0 fCNT (MHz) 100 125 125 125 111 95 fSYSTEM (MHz) 100 83 83 83 67 56 Note: fCNT = Operating frequency for 16-bit counters fSYSTEM = Internal operating frequency for general purpose system designs spanning multiple FBs.600 2.5 5.5 8.5 5.5 6.800 6.5 5. 3-2 April.5 5.0 tCO (ns) 4.5 8.5 5.5 6. Table 1: XC9500 Device Family XC9536 XC9572 XC95108 XC95144 XC95216 XC95288 Macrocells 36 72 108 144 216 288 Usable Gates 800 1.200 4.400 3.5 10 15 tSU (ns) 4.400 Registers 36 72 108 144 216 288 tPD (ns) 5 7.XC9500 In-System Programmable CPLD Family 3 JTAG JTAG Port In-System Programming Controller Controller 36 Function I/O 18 Block 1 Macrocells I/O 1 to 18 I/O 36 FastCONNECT Switch Matrix I/O Function 18 Block 2 Macrocells I/O 1 to 18 Blocks I/O 36 Function I/O 18 Block 3 I/O Macrocells 1 to 18 I/O 3 I/O/GCK 36 1 Function I/O/GSR 18 Block N 2 or 4 Macrocells I/O/GTS 1 to 18 X5877 Figure 8: XC9500 Architecture Note: Function Block outputs (indicated by the bold line) drive the I/O Blocks directly.0) .

FB. each capable of implement. The FB also by the product term allocator. These paths are used for creating very fast counters Logic within the FB is implemented using a sum-of-prod. up to the 90 available. Each FB (except for the XC9536) supports local feedback The FB generates 18 outputs that drive the FastCONNECT 3 paths that allow any number of FB outputs to drive into its switch matrix. of 18 independent macrocells. complement signals into the programmable AND-array to Macrocell 1 Programmable Product AND-Array Term Allocators 18 To FastCONNECT From Switch Matrix 36 FastCONNECT Switch Matrix 18 OUT To I/O Blocks 18 PTOE Macrocell 18 1 3 Global Global Set/Reset Clocks X5878 Figure 10: XC9500 Function Block April. and set/reset signals. Any number of these product terms. 1997 (Version 1. output enable. These 18 outputs and their corresponding own programmable AND-array without going outside the output enable signals also drive the IOB. receives global clock.Figure 9: Available Packages and Device I/O Pins (not including dedicated JTAG pins) XC9536 XC9572 XC95108 XC95144 XC95216 XC95288 44-Pin VQFP 34 44-Pin PLCC 34 34 84-Pin PLCC 69 69 100-Pin TQFP 72 81 100-Pin PQFP 72 81 81 160-Pin PQFP 108 133 133 208-Pin HQFP 166 168 352-Pin BGA 166 192 Function Block Each Function Block.0) 3-3 . is comprised form 90 product terms. as shown in Figure 10. can be allocated to each macrocell ing a combinatorial or registered function. and state machines where all state registers are within the ucts representation. Thirty-six inputs provide 72 true and same FB.

and output enable. Each register supports both asynchronous set and to implement combinatorial functions. set/reset. 36 Global Global Set/Reset Clocks 3 Additional Product Terms (from other macrocells) Product Term Set 1 0 To S FastCONNECT Switch Matrix D/T Q Product Term Product Term Clock R Allocator Product Term Reset OUT To Product Term OE PTOE I/O Blocks Additional Product Terms (from other macrocells) X5879 Figure 11: XC9500 Macrocell Within Function Block 3-4 April.0) .XC9500 In-System Programmable CPLD Family Macrocell Each XC9500 macrocell may be individually configured for term allocator associated with each macrocell selects how a combinatorial or registered function. or as control inputs reset operations. The macrocell and the five direct terms are used. or it may be bypassed for combinatorial oper- for use as primary data inputs (to the OR and XOR gates) ation. The product tialized to the user-defined preload state (default to 0 if unspecified). associated FB logic is shown in Figure 11. all user registers are ini- including clock. During power-up. 1997 (Version 1. The macrocell register can be configured as a D-type or T- Five direct product terms from the AND-array are available type flip-flop.

0) 3-5 . Macrocell Product Term Set S D/T Product Term Clock R Product Term Reset I/O/GSR Global Set/Reset 3 I/O/GCK1 Global Clock 1 I/O/GCK2 Global Clock 2 Global Clock 3 I/O/GCK3 X5880 Figure 12: Macrocell Clock and Set/Reset Capability April.All global control signals are available to each individual term clock. Both true and complement polarities of a GCK macrocell. A GSR input is also pro- nals. the macrocell register clock vided to allow user registers to be set to a user-defined originates from either of three global clocks or a product state. As shown in Figure 12. pin can be used within the device. including clock. 1997 (Version 1. and output enable sig. set/reset.

Up to 15 product terms can be available to a single macrocell with only a small incremental delay of tPTA.0) . in Figure 13. 1997 (Version 1. Product Term Allocator X5895 Figure 14: Product Term Allocation With 15 Product Terms 3-6 April. Product Term Allocator Product Term Allocator Macrocell Product Term Logic Product Term Allocator X5894 Figure 13: Macrocell Logic Using Direct Product The product term allocator can re-assign other product terms within the FB to increase the logic capacity of a mac- Macrocell Logic rocell beyond five direct terms. terms in other macrocells.XC9500 In-System Programmable CPLD Family Product Term Allocator The product term allocator controls how the five direct Note that the incremental delay affects only the product product terms are assigned to each macrocell. The timing of the direct product ple. as shown in Figure 14. Any macrocell requiring With 15 P-Terms additional product terms can access uncommitted product terms in other macrocells within the FB. all five direct terms can drive the OR function as shown terms is not changed. For exam.

with a maxi- of products over several macrocells. the incremental delay is only 2*tPTA. Product Term Allocator Macrocell Logic With 2 Product Terms Product Term Allocator 3 Product Term Allocator Macrocell Logic With 18 Product Terms Product Term Allocator X5896 Figure 15: Product Term Allocation Over Several Macrocells April.0) 3-7 . mum incremental delay of 8*tPTA. as shown in Figure 15. All 90 from any macrocell within the FB by combining partial sums product terms are available to any macrocell.The product term allocator can re-assign product terms In this example. 1997 (Version 1.

XC9500 In-System Programmable CPLD Family The internal logic of the product term allocator is shown in Figure 16. 1997 (Version 1. From Upper To Upper Macrocell Macrocell Product Term Allocator Product Term Set Global Set/Reset 1 0 S D/T Q Global Clocks Product Term Clock R Product Term Reset Global Set/Reset Product Term OE From Lower To Lower X5881 Macrocell Macrocell Figure 16: Product Term Allocator Logic 3-8 April.0) .

1997 (Version 1. through user programming.0) 3-9 . multiple internal connections into a single wired-AND out- sponding to user pin inputs) and all FB outputs drive the put before driving the destination FB.FastCONNECT Switch Matrix The FastCONNECT switch matrix connects signals to the The FastCONNECT switch matrix is capable of combining FB inputs. as shown in Figure 17. This capability is available for internal connections originat- ing from FB outputs only. to drive in of the destination FB without any additional timing delay. Any of these (up to a FB fan-in limit tional logic capability and increases the effective logic fan- of 36) may be selected. This provides addi- FastCONNECT matrix. It is automatically invoked by the development software where applicable. FastCONNECT Switch Matrix Function Block 3 I/O Block (36) 18 D/T Q I/O Function Block I/O Block (36) 18 D/T Q I/O Wired-AND Capability X5882 Figure 17: FastCONNECT Switch Matrix April. each FB with a uniform delay. All IOB outputs (corre.

output driver. 1997 (Version 1.3 V signal levels. cells.XC9500 In-System Programmable CPLD Family I/O Block The I/O Block (IOB) interfaces between the internal logic The output enable may be generated from one of four and the device user I/O pins. TTL and 3. See Figure 18 for two global output enables for devices with up to 144 macro- details. or always “0”. output enable selection multiplexer. Each IOB includes an input options: a product term signal from the macrocell. any of buffer. The input buffer uses the internal 5 V voltage supply (VCCINT) to ensure that the input thresh- olds are constant and do not vary with the VCCIO voltage. Both polarities of any of the global 3-state The input buffer is compatible with standard 5 V CMOS. To other Macrocells VCCINT I/O Block To FastCONNECT Switch Matrix Macrocell Pull-up Resistor OUT I/O (Inversion in AND-array) 1 User- Product Term OE PTOE Programmable Ground 0 Slew Rate Control I/O/GTS1 Global OE 1 I/O/GTS2 Global OE 2 Available in I/O/GTS3 Global OE 3 XC95180. 5 V control (GTS) pins may be used within the device. XC95216 and XC95288 I/O/GTS3 Global OE 4 X5899 Figure 18: I/O Block and Output Enable Capability 3-10 April. There are and user programmable ground control. and four global output enables for devices with 180 or more macrocells. the global OE signals.0) . always “1”.

ing design changes depends on the ability of the architec- tional ground pins. This provides a high level of confidence of active during device programming mode and system maintaining both input and output pin assignments for power-up.Each output has independent slew rate control. The same board may be device output voltage supply (VCCIO) to a 5 V or 3.3 V XC9500 XC9500 IN CPLD OUT IN CPLD OUT 0V 0V 0V 0V 3. resistor is deactivated during normal operation.3 V levels by connecting the using the same pin assignments. By tying strategically located ture to adapt to unexpected changes. Pin-Locking Capability Each IOB provides user programmable ground pin capabil. accept design changes while maintaining the same pinout.5 V Standard Time Time 0 0 (a) (b) X5900 Figure 19: Output Slew-Rate Control For (a) Rising and (b) Falling Outputs 5 V CMOS 5V 5 V CMOS 5V 3. The XC9500 architecture provides 100% routing within the A control pull-up resistor (typically 10K ohms) is attached to FastCONNECT switch matrix.3 V 3.3 V 3. Output voltage supply. For extensive design changes requiring higher logic capac- The output driver is capable of supplying 24 mA output ity than is available in the initially chosen device.0) 3-11 . Output Output Voltage Voltage Standard Slew-Rated Limited Slew-Rated Limited tSLEW tSLEW 1.6 V 3.3 V/5 V Systems April.3 V or 3.3 V or 3. system noise generated from large numbers of simul.5 V 1. Figure 20 shows how the XC9500 device edge rates may be slowed down to reduce system noise can be used in 5 V only and mixed 3. This allows device I/O pins to be configured as addi. The unexpected design changes. 1997 (Version 1. The XC9500 devices programmable ground pins to the external ground connec. It is also activated for an erased device.3 V/5 V systems. See Figure 19.3 V 5V 5V VCCINT VCCIO VCCINT VCCIO 0V 0V 5 V TTL or 5 V TTL 5 V TTL or 3. have architectural features that enhance the ability to tion. The capability to lock the user defined pin assignments dur- ity. and incorporates a flexible each device I/O pin to prevent them from floating when the Function Block that allows block-wide allocation of available device is not in normal user operation. the new drive.3 V used with a higher density device without the expense of board rework. taneous switching outputs may be reduced. (with an additional time delay of tSLEW) through program- ming. This resistor is product terms.6 V ~4V 3.3 V GND GND 0V 0V (a) (b) X5901 Figure 20: XC9500 Devices in (a) 5 V Systems and (b) Mixed 3. All output drivers in the device may be configured for design may be able to fit into a larger pin-compatible device 3 either 5 V TTL levels or 3.

CODE. XC9572F. This provides the added flexibility of using pre-pro- XC9500 devices incorporate advanced data security fea- grammed devices during manufacturing. The XC9500F Erasing the entire device is the only way to reset the read devices support full JTAG functionality as in the standard security bit. available. remain low during this time. a third-party JTAG development IEEE 1149. and 100-pin and 160-pin PQFP power-up. such as during system 44-pin VQFP. Design Security mers. with an in-system tures which fully protect the programming data against programmable option for future enhancements. as shown in Figure 21.000 in-system program/erase cycles. timing. If a particular signal must instructions are added. the XC9500F family is available. or a simple micro. and functionality. FPGM.1 Boundary-Scan (JTAG) system.0) . SAMPLE/PRELOAD. ifications within this endurance limit. For ISP operations. The XC9536F. supporting identical internal programming pattern from being read or copied. and HIGHZ instructions are sup- All I/Os are 3-stated and pulled high by the IOB resistors ported in each device. The XC9500F series is supported for JTAG pins are subject to noise.1 instruction set. Each device gramming offers quick and efficient design iterations and meets all functional. EXTEST. then a pulldown resistor may FVFY. and ISPEX instructions are fully compliant exten- be added to the pin. JEDEC bitmap. 10. JTAG-compatible board tester. BYPASS. Once set. and data retention spec- eliminates package handling.XC9500 In-System Programmable CPLD Family In-System Programming Endurance XC9500 devices are programmed in-system via a standard All XC9500 CPLDs provide a minimum endurance level of 4-pin JTAG protocol. USER- sequence. Table 2: Data Security Options Read Security Default Set Read Allowed Read Inhibited Write Security Default Program/Erase Allowed Program/Erase Allowed Read Allowed Read Inhibited Set Program/Erase Inhibited Program/Erase Inhibited X5905 3-12 April. performance. the ISPEN. XC9500 devices fully support IEEE 1149. XC9500 family. 1997 (Version 1. Table 2 shows the four different security settings essary. IDCODE. five additional during in-system programming. INTEST. vated when the device needs to be reprogrammed with a valid pattern. the write-protection may be deacti- packages. The Xilinx development sys. unauthorized reading or inadvertent device erasure/repro- In applications where in-system programmability is unnec. tem provides the programming data sequence using a Xil- inx download cable. The write security bits provide added protection against grammed using the Xilinx HW130 or other third-party accidental device erasure or reprogramming when the device programmers. gramming. FERASE. with the exception of special in-system pro- gramming instructions. In-system pro. All XC9500F devices must be pro. XC9500 devices can also be programmed by the Xilinx HW130 device programmer as well as third-party program. The TMS and TCK pins have dedicated pull-up resistors as External Programming specified by the IEEE 1149. sions of the 1149.1 standard. 84-pin PLCC.1 boundary-scan processor interface that emulates the JTAG instruction (JTAG). and XC95108F are 100% plug-in compatible The read security bits can be set by the user to prevent the with the standard XC9500 devices.

in this manual. shown in Figure 22. Table 3 shows how April. The basic timing model. the maximum number of allocators in the product term power mode by the user. is valid for macrocell functions that use the direct product terms only. Timing Model The uniformity of the XC9500 architecture allows a simpli- fied timing model for the entire device. then the logic application can remain in standard power mode. The product term allocation time depends on the logic span of the macrocell function. with standard power setting.0) 3-13 . V CC GND (a) (b) X5902 3 Figure 21: In-System Programming Operation (a) Solder Device to PCB and (b) Program Using Download Cable Low Power Mode each of the key timing parameters is affected by the product term allocator (if needed). Product term clock to output and ing model shown in Figure 23. This feature allows the device power to be significantly reduced. Figure 15. If only direct product terms are used. while span is 0. the 18 product term function has a span of 2. low-power setting. Performance-critical parts of the path. which is defined as one less than Each individual macrocell may be programmed in low. The example in Figure 6 shows that up to 15 other parts of the application may be programmed for low. macrocells or across all macrocells. and standard slew rate setting. product terms are available with a span of 1. In the case of power operation to reduce the overall power dissipation. The values and explanations product term output enable delays are unaffected by the for each parameter are given in the individual device data macrocell power-setting. Macrocells programmed for low-power mode incur addi- tional delay (tLP) in pin-to-pin combinatorial delay as well Detailed timing information may be derived from the full tim- as register setup time. 1997 (Version 1. and slew-lim- All XC9500 devices offer a low-power mode for individual ited setting. for additional information. Refer to the application brief Using the XC9500 Timing Model. sheets.

as shown in Table 4.8 V). with the IOB pull-up resistors (~ 10K ohms) enabled. all user registers become initialized (typically within 100 µs). as shown in Figure 24. During this time. When the supply voltage reaches a safe 3-14 April. During power-up each XC9500 device employs internal circuitry which keeps the device in the quiescent If the device is in the erased state (before any user pattern state until the VCCINT supply voltage is at a safe level is programmed).XC9500 In-System Programmable CPLD Family tSU Combinatorial Combinatorial Logic Logic D/T Q tCO Propagation Delay = tPD Setup Time = tSU Clock to Out Time = tCO (a) (b) tPSU Combinatorial Logic D/T Q Combinatorial P-Term Clock Logic D/T Q Path tPCO Setup Time = tPSU Clock to Out Time = tPCO Internal System Cycle Time = tSYSTEM (c) (d) All resources within FB using local Feedback Combinatorial Logic Combinatorial Logic D/T Q Combinatorial Logic Internal Cycle Time = tCNT (e) Propagation Delay = tPD + tFBK Setup With Feedback Time (f) Combinatorial Figure 22: Basic Timing Model L i tF tLF tLOGILP S*tPTA tSLEW tPDI tIN tLOGI D/T Q tOUT tSUI tCOI tHI tPTCK tAOI tEN tGCK > tRAI tPTSR SR tGSR tPTTS tGTS Figure 23: Detailed Timing Model Power-Up Characteristics level. the device outputs remain disabled with (approximately 3.0) . The JTAG pins are JTAG pins are disabled and all device outputs are disabled enabled to allow the device to be programmed at any time. and the device is immediately available for opera- The XC9500 devices are well behaved under all operating tion. conditions. all device pins and the IOB pull-up resistors enabled. 1997 (Version 1.

The XC9500 CPLD family is fully supported by the develop- VCCINT ment systems available from Xilinx and the Xilinx Alliance Program vendors.If the device is programmed. as defined in the text. The designer can create the design using ABEL. Table 4: XC9500 Device Characteristics Device Quiescent Erased Device Valid User Circuitry State Operation Operation IOB Pull-up Resistors Enabled Enabled Disabled Device Outputs Disabled Disabled As Configured Device Inputs and Clocks Disabled Disabled As Configured Function Block Disabled Disabled As Configured JTAG Controller Disabled Enabled Enabled April.000 program/erase cycles. XC9500 devices. 1997 (Version 1. An advanced CMOS Flash process is used to fabricate all ary-scan tests at any time. The development system can be used to implement the design and generate a JEDEC bitmap which can be used to program the XC9500 device. fast programming times. The JTAG pins are enabled to allow device erasure or bound. schemat- 3. equations. Specifically developed for Xilinx in-system pro- grammable CPLDs. Each development system includes JTAG download soft- 0V ware that can be used to program the devices via the stan- No Quiescent Quiescent No dard JTAG interface and a download cable.8 V ics. or other HDL languages in a variety (Typ) of software front-end tools. S = the logic span of the function.0) 3-15 . VHDL. User Operation Power State State Power Initialization of User Registers X5904 3 Figure 24: Device Behavior During Power-up Table 3: Timing Model Parameters Product Term Macrocell Output Slew-Limited Description Parameter Allocator1 Low-Power Setting Setting Propagation Delay tPD + tPTA * S + tLP + tSLEW Global Clock Setup Time tSU + tPTA * S + tLP – Global Clock-to-output tCO – – + tSLEW Product Term Clock Setup tPSU + tPTA * S + tLP – Time Product Term Clock-to-output tPCO – – + tSLEW Internal System Cycle Period tSYSTEM + tPTA * S + tLP – Note: 1. the device inputs and outputs FastFLASH Technology take on their configured states for normal operation. the FastFLASH process provides high Development System Support performance logic capability. and endurance of 10.