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R1170x SERIES
R1170x SERIES
R1170x SERIES
R1170x SERIES
R1170x SERIES

R1170x SERIES

800mA LDO REGULATOR

NO.EA-084-0607

OUTLINE

The R1170x Series are positive voltage regulator ICs by CMOS process. The R1170x Series have features of high ripple rejection, low dropout voltage, high output voltage accuracy, low consumption current. Each of these ICs consists of a voltage reference unit, an error amplifier, resistor net for setting output voltage, a current limit circuit at short mode, a chip enable circuit, and thermal-shunt circuit. Output Voltage of R1170 is fixed in the IC. Low consumption current by the merit of CMOS process and built-in transistors with low ON-resistance make low dropout voltage and chip enable function prolong the battery life. These regulators are remarkable improvement on the current regulators in terms of ripple rejection, input transient response, and load transient response. Maximum Output Current is large for its compact size. Thus, the R1170x Series are suitable for various power sources for portable appliances. Since the packages for these ICs are the SOT-89-5 package, HSON-6,or HSOP-6J, high density mounting of the ICs on boards is possible.

FEATURES

Ultra-Low Supply Current

Typ. 80µA

Low Standby Current

Typ. 0.1µA

Output Current

Min. 800mA (VIN=VOUT+1.0V)

Low Dropout Voltage

Typ. 0.12V (VOUT=3.0V, IOUT=300mA)

High Output Voltage Accuracy

±2.0%

Low Temperature-drift Coefficient of Output Voltage

Typ.±100ppm/°C

Line Regulation

Typ. 0.05%/V

Output Voltage

1.5V to 5.0V

Small Package

SOT-89-5, HSON-6, HSOP-6J

Built-in Current Limit Circuit

Built-in Thermal Shutdown Circuit

APPLICATIONS

Local Power source for Notebook PC.

Local Power source for portable appliances, cameras, and videos.

Local Power source for equipment of battery-use.

Local Power source for home appliances.

R1170x

BLOCK DIAGRAMS

R1170xxx1A

VDD Vref Current Limit Thermal Shutdown CE SELECTION GUIDE
VDD
Vref
Current Limit
Thermal Shutdown
CE
SELECTION GUIDE

VOUT

GND

VDD

CE

R1170Dxxx1B

Vref Current Limit Thermal Shutdown
Vref
Current Limit
Thermal Shutdown

VOUT

GND

The output voltage, the chip-enable polarity, the taping type can be selected at the user's request. The selection can be made with the part number as follows;

R1170xxx1x-xx-x Part Number

↑ ↑

a b

c

d

e

Code

Contents

 

Package Type;

H: SOT-89-5

a

D: HSON-6

S: HSOP-6J

b

Designation of Output Voltage (VOUT) Stepwise setting with 0.1V increment in the range from 1.5V to 5.0V

 

Designation of option;

c

A: Built-in Chip Enable Circuit, Active at "L" B: Built-in Chip Enable Circuit, Active at "H"

 

Designation of Taping Type;

d

T1 (SOT-89-5), TR (HSON-6), E2 (HSOP-6J) (Refer to Taping Specifications)

 

Designation of composition of pin plating

e

-F: Lead free plating (SOT-89-5,HSON-6,HSOP-6J)

R1170x

PIN CONFIGURATION

SOT-89-5 5 4 Φ 1.0
SOT-89-5
5
4
Φ 1.0

123

PIN DESCRIPTION

SOT-89-5

HSON-6 Top View Bottom View 6 5 4 4 5 6 1 2 3 3
HSON-6
Top View
Bottom View
6
5 4
4
5 6
1 2
3
3 2
1
HSOP-6J 65 4 R
HSOP-6J
65 4
R

12 3

Pin No

Symbol

Description

1

CE or CE

Chip Enable Pin

2

GND

Ground Pin

3

NC

No Connection

4

VDD

Input Pin

5

VOUT

Voltage Regulator Output Pin

HSON-6

Pin No

 

Symbol

Description

1

VOUT

Voltage Regulator Output Pin

2

VOUT

Voltage Regulator Output Pin

3

CE or CE

Chip Enable Pin

4

GND

Ground Pin

5

VDD

Input Pin

6

VDD

Input Pin

Tab in the

∗ Tab in the parts have GND level. (They are connected to the reverse side of

parts have GND level. (They are connected to the reverse side of this IC.)

Do not connect to other wires or land patterns.

HSOP-6J

Pin No

Symbol

Description

1

VOUT

Voltage Regulator Output Pin

2

GND

Ground Pin

3

CE or CE

Chip Enable Pin

4

NC

No Connection

5

GND

Ground Pin

6

VDD

Input Pin

R1170x

ABSOLUTE MAXIMUM RATINGS

Symbol

Item

Rating

Unit

VIN

Input Voltage

7.0

V

VCE

Input Voltage ( CE or CE Input Pin)

0.3 to VIN+0.3

V

VOUT

Output Voltage

0.3 to VIN+0.3

V

IOUT

Output Current

1.2

A

 

Power Dissipation (SOT-89-5)* 1

900

 

PD

Power Dissipation (HSON-6)* 1

900

mW

Power Dissipation (HSOP-6J)* 1

1700

Topt

Operating Temperature

40 to 85

°C

Tstg

Storage Temperature

55 to 125

°C

1 ) For Power Dissipation, please refer to PACKAGE INFORMATION to be described.

 

R1170x

ELECTRICAL CHARACTERISTICS

R1170xxxxA

Topt=25°C

Symbol

Item

 

Conditions

Min.

Typ.

Max.

Unit

VIN

Input Voltage

     

6.0

V

ISS1

Supply Current1

VINVOUT=1.0V,

   

80

160

 

VCE=GND

 

µA

Istandby

Standby Current

VIN=VCE=6.0V

   

0.1

1.0

µA

   

VINVOUT=1.0V

         

VOUT

Output voltage

IOUT=100mA

 

×0.98

×1.02

V

IOUT1

Output Current

VINVOUT=1.0V

 

800

   

mA

VOUT/

 

VINVOUT=1.0V

         

IOUT

Load regulation

1mA

< = IOUT

<

= 300mA

30

100

mV

VDIF

Dropout Voltage

IOUT=300mA

 

Refer to Dropout Voltage Table

VOUT/

 

IOUT=100mA

         

VIN

Line regulation

VOUT+0.5V

< = VIN

<

= 6.0V

0.05

0.30

%/V

   

f=1kHz, Ripple 0.5Vpp

       

1.5V

< = VIN

< = 4.0V:

RR

Ripple Rejection

VINVOUT=1.0V

 

50

dB

4.1V

= < VIN

< = 5.0V:

VINVOUT=0.75V

 

VOUT/

Output Voltage Temperature Coefficient

IOUT=10mA

         

Topt

40°C = Topt = 85°C

<

<

±100

ppm/°C

Ilim

Short Current Limit

VOUT=0V

   

40

 

mA

RPU

Pull-up resistancefor CE pin

 

1.25

2.50

5.00

M

VCEH

CE Input Voltage "H"

 

1.50

 

VIN

V

VCEL

CE Input Voltage "L"

 

0.00

 

0.25

V

TTSD

Thermal Shutdown Detector Threshold Temperature

Junction Temperature

 

150

 

°C

TTSR

Thermal Shutdown Released Temperature

Junction Temperature

 

120

 

°C

R1170x

R1170xxxxB

Topt=25°C

Symbol

Item

 

Conditions

Min.

Typ.

Max.

Unit

VIN

Input voltage

     

6.0

V

ISS1

Supply Current1

VINVOUT=1.0V,VCE=VIN

 

80

160

µA

Istandby

Standby Current

VIN=6.0V,VCE=GND

 

0.1

1.0

µA

 

Reference Voltage for Adjustable Voltage Regulator

VINVOUT=1.0V

         

VOUT

IOUT=100mA

 

×0.98

×1.02

V

IOUT1

Output Current

VINVOUT=1.0V

 

800

   

mA

VOUT/

Load regulation

VINVOUT=1.0V

         

IOUT

1mA

< = IOUT

<

= 300mA

30

100

mV

VDIF

Dropout Voltage

IOUT=300mA

 

Refer to Dropout Voltage Table

VOUT/

Line regulation

IOUT=100mA

         

VIN

VOUT+0.5V

< = VIN

<

= 6.0V

0.05

0.30

%/V

   

f=1kHz, Ripple 0.5Vpp

       

1.5V

< = VIN

= < 4.0V:

RR

Ripple Rejection

VINVOUT=1.0V

 

50

dB

4.1V

< = VIN

< = 5.0V:

VINVOUT=0.75V

 

VOUT/

Topt

Output Voltage Temperature Coefficient

40°C = Topt = 85°C

<

<

 

±100

 

ppm/°C

Ilim

Short Current Limit

VOUT=0V

   

40

 

mA

RPD

Pull-down resistance for CE pin

 

1.25

2.50

5.00

M

VCEH

CE Input Voltage "H"

 

1.5

 

VIN

V

VCEL

CE Input Voltage "L"

 

0.00

 

0.25

V

TTSD

Thermal Shutdown Detector Threshold Temperature

Junction Temperature

 

150

 

°C

TTSR

Thermal Shutdown Released Temperature

Junction Temperature

 

120

 

°C

Dropout Voltage by Output Voltage (Topt=25°C)

Output Voltage VOUT (V)

Dropout Voltage VDIF (V)

Typ.

Max.

 

VOUT=1.5

0.35

0.45

 

VOUT=1.6

0.30

0.35

 

VOUT=1.7

0.25

0.30

1.8

< = VOUT

= < 2.0

0.20

0.25

2.1

= < VOUT

< = 2.4

0.15

0.20

2.5

< = VOUT

= < 5.0

0.12

0.18

R1170x

TEST CIRCUITS

CE CE VDD VOUT VDD VOUT IN OUT IN OUT IOUT ISS R1170xxx1B R1170xxx1B 10
CE
CE
VDD
VOUT
VDD
VOUT
IN
OUT
IN
OUT
IOUT
ISS
R1170xxx1B
R1170xxx1B
10
µ F
10
µ F
SERIES
SERIES
10
µ F
10
µ F
GND
GND
Standard Test Circuit
Supply Current Test Circuit
CE
CE
VDD
VOUT
VDD
VOUT
IN
OUT
IN
OUT
IOUT
R1170xxx1B
R1170xxx1B
10µF
SERIES
SERIES
10µF
10µF
P.G.
I1
I2
GND
GND

Test Circuit for Ripple Rejection, Input Transient Response

Test Circuit for Load Transient Response

R1170x

Technical Notes on External Components and Typical Application

Phase Compensation In these ICs, phase compensation is made with the output capacitor for securing stable operation even if the

load current is varied. For this purpose, use as much as 10µF Capacitor as CL. If you use a tantalum type capacitor and ESR value of the capacitor is large, output might be unstable. Evaluate your circuit with considering frequency characteristics. Further, refer to the Typical Characteristics No.

12.

Mounting on PCB Make VDD and GND lines sufficient. If their impedance is high, a current flows, the noise picked up or unstable operation may result. Further use as much as 10µF capacitor between VDD pin and GND pin as close as possible. Set an Output capacitor between VOUT pin and GND pin for phase compensation as close as possible. (Refer to the example of typical application)

IN

CE VDD R1170xxx1B VOUT OUT CI CL GND CI=10 µ F(Ceramic), CL=10 µ F(Ceramic)
CE
VDD
R1170xxx1B
VOUT
OUT
CI
CL
GND
CI=10 µ F(Ceramic), CL=10 µ F(Ceramic)

Example of the typical application of R1170xxxxB

R1170x

TYPICAL CHARACTERISTICS

1) Output Voltage vs. Output Current (Topt=25°C)

R1170x151B

1.8 VIN=2.5V 1.6 1.4 1.2 VIN =2V 1 0.8 0.6 VIN=3.5V 0.4 0.2 0 0
1.8
VIN=2.5V
1.6
1.4
1.2
VIN
=2V
1
0.8
0.6
VIN=3.5V
0.4
0.2
0
0 250
500
750
1000
1250
1500
Output Voltage VOUT(V)

Output Current IOUT(mA)

R1170x501B

6 5 VIN=6V 4 VIN=5.5V 3 2 1 0 0 250 500 750 1000 1250
6
5
VIN=6V
4
VIN=5.5V
3
2
1
0 0
250
500
750
1000
1250
1500
Output Voltage VOUT(V)

Output Current IOUT(mA)

2) Output Voltage vs. Input Voltage (Topt=25°C)

R1170x151B

1.7 1.6 IOUT=1mA IOUT=10mA 1.5 1.4 IOUT=100mA 1.3 IOUT=300mA 1.2 1.1 1 2 3 456
1.7
1.6
IOUT=1mA
IOUT=10mA
1.5
1.4
IOUT=100mA
1.3
IOUT=300mA
1.2
1.1
1
2
3
456
Output Voltage VOUT(V)

Input Voltage VIN(V)

R1170x301B

3.5 VIN=5V 3 VIN =4V 2.5 VIN=3.5V 2 1.5 1 0.5 0 0 250 500
3.5
VIN=5V
3
VIN
=4V
2.5
VIN=3.5V
2
1.5
1
0.5
0 0
250
500
750
1000
1250
1500
Output Voltage VOUT(V)

Output Current IOUT(mA)

R1170x201B

2.2 2.1 IOUT=10mA IOUT=1mA 2 1.9 1.8 IOUT=100mA 1.7 IOUT=300mA 1.6 1.5 1.4 Output Voltage
2.2
2.1
IOUT=10mA IOUT=1mA
2
1.9
1.8
IOUT=100mA
1.7
IOUT=300mA
1.6
1.5
1.4
Output Voltage VOUT(V)

123456

Input Voltage VIN(V)

R1170x

R1170x301B

3.2 3.1 IOUT=1mA IOUT=10mA 3.0 2.9 2.8 IOUT=100mA 2.7 IOUT=300mA 2.6 2.5 234 5 6
3.2
3.1
IOUT=1mA
IOUT=10mA
3.0
2.9
2.8
IOUT=100mA
2.7
IOUT=300mA
2.6
2.5
234
5
6
Output Voltage VOUT(V)

Input Voltage VIN(V)

R1170x501B

5.2 IOUT=1mA 5.0 IOUT=10mA IOUT=100mA 4.8 4.6 IOUT=300mA 4.4 4.2 4.0 3.8 4.0 4.5 5.0
5.2
IOUT=1mA
5.0
IOUT=10mA
IOUT=100mA
4.8
4.6
IOUT=300mA
4.4
4.2
4.0
3.8
4.0
4.5
5.0
5.5
6.0
Output Voltage VOUT(V)

Input Voltage VIN(V)

3) Dropout Voltage vs. Output Current

R1170x151B

0.8 0.7 25 ° C 0.6 0.5 85 ° C 0.4 -40 ° C 0.3
0.8
0.7
25
° C
0.6
0.5
85
° C
0.4
-40 ° C
0.3
0.2
0.1
0 0
100 200
300 400 500
600
700 800
Dropout Voltage VDIF(V)

Output Current IOUT(mA)

R1170x401B

4.2 4.1 IOUT=10mA IOUT=1mA 4.0 3.9 3.8 IOUT=100mA 3.7 IOUT=300mA 3.6 3.5 3.4 3.5 4
4.2
4.1
IOUT=10mA
IOUT=1mA
4.0
3.9
3.8
IOUT=100mA
3.7
IOUT=300mA
3.6
3.5
3.4
3.5
4
4.5
5
5.5
6
Output Voltage VOUT(V)

Input Voltage VIN(V)

R1170x201B

0.8 0.7 0.6 25 °C 0.5 0.4 85 °C 0.3 -40 °C 0.2 0.1 0
0.8
0.7
0.6
25
°C
0.5
0.4
85
°C
0.3
-40 °C
0.2
0.1
0 0
100 200
300
400 500 600
700 800
Dropout Voltage VDIF(V)

Output Current IOUT(mA)

R1170x

R1170x301B

0.50 0.45 0.40 25 ° C 0.35 0.30 85 ° C 0.25 0.20 -40 °
0.50
0.45
0.40
25
° C
0.35
0.30
85
° C
0.25
0.20
-40 ° C
0.15
0.10
0.05
0.00 0
100 200
300
400 500 600
700
800
Dropout Voltage VDIF(V)

Output Current IOUT(mA)

R1170x501B

0.35 0.30 25 ° C 0.25 85 ° C 0.20 0.15 -40 ° C 0.10
0.35
0.30
25
° C
0.25
85
° C
0.20
0.15
-40 ° C
0.10
0.05
0.00 0
100 200
300 400 500
600 700
800
Dropout Voltage VDIF(V)

Output Current IOUT(mA)

4) Output Voltage vs. Temperature

R1170x151B

VIN=2.5V, IOUT=10mA 1.60 1.58 1.55 1.53 1.50 1.48 1.45 1.43 1.40 -50 -25 0 25
VIN=2.5V, IOUT=10mA
1.60
1.58
1.55
1.53
1.50
1.48
1.45
1.43
1.40
-50
-25
0
25
50
75
100
Output Voltage VOUT(V)

Temperature Topt( ° C)

R1170x401B

0.45 0.40 0.35 25 °C 0.30 0.25 85 °C 0.20 0.15 -40 °C 0.10 0.05
0.45
0.40
0.35
25
°C
0.30
0.25
85
°C
0.20
0.15
-40 °C
0.10
0.05
0.00 0
100 200
300
400 500 600
700
800
Dropout Voltage VDIF(V)

Output Current IOUT(mA)

R1170x201B

VIN=3V, IOUT=10mA 2.10 2.08 2.05 2.03 2.00 1.98 1.95 1.93 1.90 -50 -25 0 25
VIN=3V, IOUT=10mA
2.10
2.08
2.05
2.03
2.00
1.98
1.95
1.93
1.90
-50
-25
0
25
50
75
100
Output Voltage VOUT(V)

Temperature Topt( ° C)

R1170x

R1170x301B

VIN=4V, IOUT=10mA 3.20 3.15 3.10 3.05 3.00 2.95 2.90 2.85 2.80 -50 -25 0 25
VIN=4V, IOUT=10mA
3.20
3.15
3.10
3.05
3.00
2.95
2.90
2.85
2.80
-50
-25
0
25
50
75
100
Output Voltage VOUT(V)

Temperature Topt( ° C)

R1170x501B

VIN=6V, IOUT=10mA 5.20 5.15 5.10 5.05 5.00 4.95 4.90 4.85 4.80 -50 -25 0 25
VIN=6V, IOUT=10mA
5.20
5.15
5.10
5.05
5.00
4.95
4.90
4.85
4.80
-50
-25
0
25
50
75
100
Output Voltage VOUT(V)

Temperature Topt( ° C)

5) Supply Current vs. Input Voltage (Topt=25°C)

R1170x151B

120 100 80 60 40 20 0 012 3 4 5 6 Supply Current ISS(µA)
120
100
80
60
40
20
0
012
3
4
5
6
Supply Current ISS(µA)

Input Voltage VIN(V)

R1170x401B

VIN=5V, IOUT=10mA

4.20 4.15 4.10 4.05 4.00 3.95 3.90 3.85 3.80 -50 -25 0 25 50 75
4.20
4.15
4.10
4.05
4.00
3.95
3.90
3.85
3.80
-50
-25
0
25
50
75
100
Output Voltage VOUT(V)

Temperature Topt( ° C)

R1170x201B

120 100 80 60 40 20 0 012 3 4 5 6 Supply Current ISS(µA)
120
100
80
60
40
20
0
012
3
4
5
6
Supply Current ISS(µA)

Input Voltage VIN(V)

R1170x

R1170x301B

120 100 80 60 40 20 0 012 3 4 5 6 Supply Current ISS(µA)
120
100
80
60
40
20
0
012 3
4
5
6
Supply Current ISS(µA)

Input Voltage VIN(V)

R1170x501B

120 100 80 60 40 20 0 012 3 4 5 6 Supply Current ISS(µA)
120
100
80
60
40
20
0
012 3
4
5
6
Supply Current ISS(µA)

Input Voltage VIN(V)

6) Supply Current vs. Temperature

R1170x151B

VIN=2.5V

160 140 120 100 80 60 40 20 -50 -25 0 25 50 75 100
160
140
120
100
80
60
40
20
-50
-25
0
25
50
75
100
Supply Current ISS(µA)

Temperature Topt( ° C)

R1170x401B

120 100 80 60 40 20 0 012 3 4 5 6 Supply Current ISS(µA)
120
100
80
60
40
20
0
012
3
4
5
6
Supply Current ISS(µA)

Input Voltage VIN(V)

R1170x201B

VIN=3V

160 140 120 100 80 60 40 20 -50 -25 0 25 50 75 100
160
140
120
100
80
60
40
20
-50
-25
0
25
50
75
100
Supply Current ISS(µA)

Temperature Topt( ° C)

R1170x

R1170x301B

VIN=4V

160 140 120 100 80 60 40 20 -50 -25 0 25 50 75 100
160
140
120
100
80
60
40
20
-50
-25
0
25
50
75
100
Supply Current ISS(µA)

Temperature Topt( ° C)

R1170x501B

VIN=6V

160 140 120 100 80 60 40 20 -50 -25 0 25 50 75 100
160
140
120
100
80
60
40
20
-50
-25
0
25
50
75
100
Supply Current ISS(µA)

Temperature Topt( ° C)

R1170x401B

VIN=5V

160 140 120 100 80 60 40 20 -50 -25 0 25 50 75 100
160
140
120
100
80
60
40
20
-50
-25
0
25
50
75
100
Supply Current ISS(µA)

Temperature Topt( ° C)

7) Dropout Voltage vs. Set Output Voltage (Topt=25°C)

R1170x

0.7 IOUT=400mA 0.6 0.5 IOUT=600mA 0.4 IOUT=800mA 0.3 0.2 IOUT=100mA 0.1 0.0 1 234 5
0.7
IOUT=400mA
0.6
0.5
IOUT=600mA
0.4
IOUT=800mA
0.3
0.2
IOUT=100mA
0.1
0.0
1
234
5
Droput Voltage VDIF(V)

Set Output Voltage VSET(V)

R1170x

8) Ripple Rejection vs. Frequency

R1170x151B

VIN=2.5V+0.5Vp-p, IOUT=100mA 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10
VIN=2.5V+0.5Vp-p, IOUT=100mA
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
Ripple Rejection RR(dB)

Ripple Frequency f (kHz)

R1170x301B

VIN=4V+0.5Vp-p, IOUT=100mA 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10
VIN=4V+0.5Vp-p, IOUT=100mA
80
70
60
50
40
30
20
10
0
0.01 0.1
1
10
100
Ripple Rejection RR(dB)

Ripple Frequency f (kHz)

R1170x501B

VIN=5.75+0.5Vp-p, IOUT=100mA 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10
VIN=5.75+0.5Vp-p, IOUT=100mA
80
70
60
50
40
30
20
10
0
0.01 0.1
1
10
100
Ripple Rejection RR(dB)

Ripple Frequency f (kHz)

R1170x201B

VIN=3V+0.5Vp-p, IOUT=100mA 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10
VIN=3V+0.5Vp-p, IOUT=100mA
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
Ripple Rejection RR(dB)

Ripple Frequency f (kHz)

R1170x401B

VIN=5V+0.5Vp-p, IOUT=100mA 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10
VIN=5V+0.5Vp-p, IOUT=100mA
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
Ripple Rejection RR(dB)

Ripple Frequency f (kHz)

R1170x

9) Ripple Rejection vs. Input Voltage

R1170x301B

IOUT=1mA, COUT=10 µ F 60 f=400Hz 50 f=1kHz 40 30 f=10kHz 20 10 0 3
IOUT=1mA, COUT=10 µ F
60
f=400Hz
50
f=1kHz
40
30
f=10kHz
20
10
0
3 3.2
3.4
3.6
Ripple Rejection RR(dB)

Input Voltage VIN(V)

R1170x301B

IOUT=100mA, COUT=10 µ F 60 f=400Hz 50 f=1kHz 40 30 f=10kHz 20 10 0 3
IOUT=100mA, COUT=10 µ F
60
f=400Hz
50
f=1kHz
40
30
f=10kHz
20
10
0
3 3.2
3.4
3.6
Ripple Rejection RR(dB)

Input Voltage VIN(V)

R1170x301B

IOUT=10mA, COUT=10 µ F 60 f=400Hz 50 f=1kHz 40 30 f=10kHz 20 10 0 3
IOUT=10mA, COUT=10 µ F
60
f=400Hz
50
f=1kHz
40
30
f=10kHz
20
10
0
3
3.2
3.4
3.6
Ripple Rejection RR(dB)

Input Voltage VIN(V)

10) Input Transient Response (Topt=25°C)

R1170x151B

tr=tf=10µs, IOUT=100mA, COUT=Ceramic 10 µF

1.8 4 1.75 3.5 1.7 Input Voltage 3 1.65 2.5 1.6 2 1.55 1.5 Output
1.8
4
1.75
3.5
1.7
Input Voltage
3
1.65
2.5
1.6
2
1.55
1.5
Output Voltage
1.5
1
1.45
0.5
1.4
0
0
20
40
60
80
100
120
140
160
180
200
Output Voltage VOUT(V)
Input Voltage VIN(V)

Time T(µs)

R1170x

R1170x301B

tr=tf=10µs, IOUT=100mA, COUT=Ceramic 10µF

3.4 6 3.3 5 Input Voltage 3.2 4 3.1 3 Output Voltage 3.0 2 2.9
3.4
6
3.3
5
Input Voltage
3.2
4
3.1
3
Output Voltage
3.0
2
2.9
1
2.8
0
0 20
40
60
80
100
120
140
160
180
200
Output Voltage VOUT(V)
Input Voltage VIN(V)

Time T(µs)

R1170x301B

tr=tf=10µs, IOUT=100mA, COUT=Ceramic 4.7µF

3.4 6 3.3 5 Input Voltage 3.2 4 3.1 3 Output Voltage 3.0 2 2.9
3.4
6
3.3
5
Input Voltage
3.2
4
3.1
3
Output Voltage
3.0
2
2.9
1
2.8
0
0 20
40
60
80
100
120
140
160
180
200
Output Voltage VOUT(V)
Input Voltage VIN(V)

Time T(µs)

R1170x501B

tr=tf=10µs, IOUT=100mA, COUT=Ceramic 10 µF

5.20 6.5 5.15 6.0 Input Voltage 5.10 5.5 5.05 5.0 Output Voltage 5.00 4.5 4.95
5.20
6.5
5.15
6.0
Input Voltage
5.10
5.5
5.05
5.0
Output Voltage
5.00
4.5
4.95
4.0
4.90
3.5
0 20
40
60
80
100
120
140
160
180
200
Output Voltage VOUT(V)
Input Voltage VIN(V)

Time T(µs)

Output Voltage VOUT(V)

Input Voltage VIN(V)

R1170x

5.20

5.15

5.10

5.05

5.00

4.95

4.90

R1170x501B

tr=tf=10µs, IOUT=100mA, COUT=Ceramic 4.7µF 6.5 6.0 Input Voltage 5.5 5.0 Output Voltage 4.5 4.0 3.5
tr=tf=10µs, IOUT=100mA, COUT=Ceramic 4.7µF
6.5
6.0
Input Voltage
5.5
5.0
Output Voltage
4.5
4.0
3.5
0 20
40
60
80
100
120
140
160
180
200

Time T(µs)

11) Load Transient Response (Topt=25°C)

R1170x151B

tr=tf=3µs, CIN=Ceramic 10 µF, VIN=2.5V, COUT=Ceramic 10 µF

2.0 120 1.9 100 1.8 80 Output Current 1.7 60 1.6 40 Output Voltage 1.5
2.0
120
1.9
100
1.8
80
Output Current
1.7
60
1.6
40
Output Voltage
1.5
20
1.4
0
0 20
40
60
80
100
120
140
160
180
200
Output Voltage VOUT(V)
Output Current IOUT(mA)

Time T(µs)

R1170x301B

tr=tf=3µs, CIN=Ceramic 10 µF, VIN=4V, COUT=Ceramic 10 µF

3.5 120 3.4 100 3.3 80 Output Current 3.2 60 3.1 40 Output Voltage 3.0
3.5
120
3.4
100
3.3
80
Output Current
3.2
60
3.1
40
Output Voltage
3.0
20
2.9
0
0 20
40
60
80
100
120
140
160
180
200
Output Voltage VOUT(V)
Output Current IOUT(mA)

Time T(µs)

R1170x

R1170x301B

tr=tf=3µs, CIN=Ceramic 10 µF, VIN=4V, COUT=Ceramic 4.7µF

3.5 120 3.4 100 3.3 80 Output Current 3.2 60 3.1 40 Output Voltage 3.0
3.5
120
3.4
100
3.3
80
Output Current
3.2
60
3.1
40
Output Voltage
3.0
20
2.9
0
0 20
40
60
80
100
120
140
160
180
200
Time T(µs)
R1170x501B
tr=tf=3µs, CIN=Ceramic 10 µF, COUT=Ceramic 10 µF
5.20
150
5.15
100
Output Current
5.10
50
5.05
0
Output Voltage
5.00
4.95
4.90
0 20
40
60
80
100
120
140
160
180
200
Time T(µs)
R1170x501B
tr=tf=3µs, CIN=Ceramic 10 µF, COUT=Ceramic 4.7µF
5.20
150
5.15
100
Output Current
5.10
50
5.05
0
Output Voltage
5.00
4.95
4.90
0 20
40
60
80
100
120
140
160
180
200
Output Voltage VOUT(V)
Output Voltage VOUT(V)
Output Voltage VOUT(V)
Output Current IOUT(mA)
Output Current IOUT(mA)
Output Current IOUT(mA)

Time T(µs)

R1170x

12) Stable Area (Topt=25°C, VIN = Set Output Voltage+1V, CIN = Ceramic 10µF) CE VOUT
12) Stable Area (Topt=25°C, VIN = Set Output Voltage+1V, CIN = Ceramic 10µF)
CE
VOUT
Ceramic
R1170xxxxB
Capacitor
S.A.
VIN
GND
ESR
Ceramic
VIN
Capacitor
IOUT

Spectrum

Analyzer

As an output capacitor for this IC, Ceramic capacitor is recommendable. However, other low ESR type capacitor can be used with this IC. For your reference, noise level is tested with the circuit as shown above, and if the noise level is 40µV or less than 40µV, the ESR values are plotted as stable area. Upper limit is described in the next four graphs, or ESR vs. Output Current. (Hatched area is the stable area.)

R1170x151B

COUT=Ceramic 10 µ F 100 f=400Hz f=1kHz 10 f=10kHz 1 0.1 0 200 400 600
COUT=Ceramic 10 µ F
100
f=400Hz
f=1kHz
10
f=10kHz
1
0.1
0 200
400
600
800
ESR(Ω)

Output Current IOUT(mA)

R1170x301B

COUT=Ceramic 10 µ F 100 10 1 0.1 0 200 400 600 800 ESR(Ω)
COUT=Ceramic 10 µ F
100
10
1
0.1
0 200
400
600
800
ESR(Ω)

Output Current IOUT(mA)

R1170x151B

COUT=Ceramic 4.7 µ F 100 10 1 0.1 0 200 400 600 800 ESR(Ω)
COUT=Ceramic 4.7 µ F
100
10
1
0.1
0 200
400
600
800
ESR(Ω)

Output Current IOUT(mA)

R1170x301B

COUT=Ceramic 4.7 µ F 100 10 1 0.1 0 200 400 600 800 ESR(Ω)
COUT=Ceramic 4.7 µ F
100
10
1
0.1
0 200
400
600
800
ESR(Ω)

Output Current IOUT(mA)

R1170x

R1170x501B

COUT=Ceramic 10 µ F 100 10 1 0.1 0.01 0 100 200 300 400 500
COUT=Ceramic 10 µ F
100
10
1
0.1
0.01
0
100 200 300
400 500
600 700
800
ESR(Ω)

Output Current IOUT(mA)

R1170x501B

COUT=Ceramic 4.7 µ F 100 10 1 0.1 0.01 0 100 200 300 400 500
COUT=Ceramic 4.7 µ F
100
10
1
0.1
0.01
0
100 200 300
400 500
600 700
800
ESR(Ω)

Output Current IOUT(mA)

PACKAGE INFORMATION

PE-SOT-89-5-0611

SOT-89-5

PACKAGE DIMENSIONS

4.5 ± 0.1 1.6 ± 0.2 0.42 ± 0.1 4 5 ∅ 1.0 1 2
4.5
± 0.1
1.6
± 0.2
0.42
± 0.1
4
5
1.0
1
2
3
0.4 7
±
0.1
0.4 2 ± 0.1
0.4 2 ± 0.1
1.5
± 0.1
1.5
± 0.1
0.9
Min.
2.5
±0.1
0.4
+0.5
4.5
−0.3
1.5 ± 0.1 0.4 ± 0.1 0.4 ± 0.1
1.5 ± 0.1
0.4 ± 0.1
0.4 ± 0.1

Unit: mm

TAPING SPECIFICATION (T1: Standard Type)

1.5 +0.1 4.0±0.1 ∅ 0 0.3±0.1 2.0±0.05 5.0 8.0±0.1 2.5Max. ∅1.6±0.1 T1 4.7 5.65 ±
1.5 +0.1
4.0±0.1
0
0.3±0.1
2.0±0.05
5.0
8.0±0.1
2.5Max.
∅1.6±0.1
T1
4.7
5.65
± 0.05
1.5
± 0.1
12
± 0.3

TAPING REEL DIMENSIONS

(1reel=1000pcs)

User Direction of Feed

REEL DIMENSIONS (1reel=1000pcs) User Direction of Feed REUSE REEL (EIAJ-RRM-12Bc) 15.4±1.0 13±0.3 2±0.5

REUSE REEL (EIAJ-RRM-12Bc)

15.4±1.0 13±0.3 2±0.5 21±0.8 13±0.2∅ ∅ 60 0 +1 0 ∅ 180 –1.5
15.4±1.0
13±0.3
2±0.5
21±0.8
13±0.2∅
60
0 +1
0
180 –1.5

PACKAGE INFORMATION

PE-SOT-89-5-0611

POWER DISSIPATION (SOT-89-5)

This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below:

Measurement Conditions

 

High Wattage Land Pattern

Standard Land Pattern

Environment

Mounting on Board (Wind velocity=0m/s)

Mounting on Board (Wind velocity=0m/s)

Board Material

Glass cloth epoxy plactic (Double sided)

Glass cloth epoxy plactic (Double sided)

Board

   

Dimensions

30mm × 30mm × 1.6mm

50mm × 50mm × 1.6mm

Copper Ratio

Top side : Approx. 20% , Back side : Approx. 100%

Top side : Approx. 10% , Back side : Approx. 100%

Through-hole

φ0.85mm × 10pcs

-

Measurement Result

(Topt=25°C,Tjmax=125°C)

 

High Wattage Land Pattern

Standard Land Pattern

Free Air

Power Dissipation

1300mW

900mW

500mW

Thermal Resistance

77°C/W

111°C/W

200°C/W

1500 1400 On Board 1300 (High Wattage Land Pattern) 1200 1100 On Board 1000 (Standard
1500
1400
On Board
1300
(High Wattage Land Pattern)
1200
1100
On Board
1000
(Standard Land Pattern)
900
800
700
Free Air
600
500
400
300
200
100
0
0 25
50
75 85 100
125
150
Power Dissipation P D (mW)

Ambient Temperature (°C)

Power Dissipation

30 7.5 15 50 High Wattage Standard 30 7.5 15 50
30
7.5
15
50
High Wattage
Standard
30
7.5
15
50

Measurement Board Pattern

Wattage Standard 30 7.5 15 50 Measurement Board Pattern IC Mount Area (Unit : mm) RECOMMENDED

IC Mount Area (Unit : mm)

RECOMMENDED LAND PATTERN (SOT-89-5)

0.7 Max. 1.0 0.7 Max. 45° 2.0 1.5 1.5 1.50.70.80.71.5
0.7 Max.
1.0
0.7 Max.
45°
2.0
1.5
1.5
1.50.70.80.71.5

(Unit : mm)

PACKAGE INFORMATION

PE-HSON-6-0611

HSON-6

Unit: mm

PACKAGE DIMENSIONS

2.9±0.2 (1.5) 0.5Typ. 6 4 1 3 Bottom View Attention: Tab suspension leads in the
2.9±0.2
(1.5)
0.5Typ.
6
4
1
3
Bottom View
Attention: Tab suspension leads in the
parts have VDD or GND level.(They are
connected to the reverse side of this IC.)
0.1
0.95
Refer to PIN DISCRIPTION.
Do not connect to other wires or land patterns.
0.3±0.1
0.1
M
0.15±0.05
2.8±0.2
0.9Max.
3.0±0.2
(0.15)
(0.2)(0.2)
(0.65)
(1.6)

TAPING SPECIFICATION

4.0±0.1 ∅1.5 +0.1 0.2±0.1 0 2.0±0.05 3.3 4.0±0.1 2.0Max. ∅1.1±0.1 TR User Direction of Feed
4.0±0.1
∅1.5 +0.1
0.2±0.1
0
2.0±0.05
3.3
4.0±0.1
2.0Max.
∅1.1±0.1
TR
User Direction of Feed
3.2
3.5±0.05
1.75±0.1
8.0±0.3

TAPING REEL DIMENSIONS

(1reel=3000pcs)

REUSE REEL (EIAJ-RRM-08Bc)

11.4±1.0 9.0±0.3 2±0.5 21±0.8 13±0.2 +1 60 0 0 180 −1.5
11.4±1.0
9.0±0.3
2±0.5
21±0.8
13±0.2
+1
60
0
0
180
−1.5

PACKAGE INFORMATION

PE-HSON-6-0611

POWER DISSIPATION (HSON-6)

This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below:

Measurement Conditions

 

Standard Land Pattern

Environment

Mounting on Board (Wind velocity=0m/s)

Board Material

Glass cloth epoxy plactic (Double sided)

Board Dimensions

40mm × 40mm × 1.6mm

Copper Ratio

Top side : Approx. 50% , Back side : Approx. 50%

Through-hole

φ0.5mm × 44pcs

Measurement Result

(Topt=25°C,Tjmax=125°C)

 

Standard Land Pattern

Free Air

Power Dissipation

900mW

400mW

Thermal Resistance

θja=(12525°C)/0.9W=111°C/W

250°C/W

1200 1100 On Board 1000 900 800 700 Free Air 600 500 400 300 200
1200
1100
On Board
1000
900
800
700
Free Air
600
500
400
300
200
100
0
0
25
50
75 85
100
125
150
Power Dissipation PD(mW)

Ambient Temperature (°C)

Power Dissipation

RECOMMENDED LAND PATTERN

0.35 0.95 1.6 1.7 0.651.15
0.35
0.95
1.6
1.7
0.651.15
40 40
40
40

Measurement Board Pattern

LAND PATTERN 0.35 0.95 1.6 1.7 0.651.15 40 40 Measurement Board Pattern (Unit: mm) IC Mount

(Unit: mm)

IC Mount Area Unit : mm

PACKAGES INFORMATION

PE-HSOP-6J-0701

HSOP-6J

PACKAGE DIMENSIONS

Unit: mm

5.02±0.3 654 1 2 3 0.2 +0.10 3.81 −0.05 0.605Typ. 1.67±0.1 0.10 0.4±0.1 0.12 M
5.02±0.3
654
1
2
3
0.2 +0.10
3.81
−0.05
0.605Typ.
1.67±0.1
0.10
0.4±0.1
0.12 M
0.15±0.1
1.5±0.1
6.0±0.3
3.9±0.2
0.60±0.2

TAPING SPECIFICATION

1.5 +0.1 4.0±0.1 0.3±0.1 0 2.0±0.05 6.7 2.7Max. 8.0±0.1 2.05±0.1 5.5 1.75±0.15.5±0.05 12±0.3
1.5 +0.1
4.0±0.1
0.3±0.1
0
2.0±0.05
6.7
2.7Max.
8.0±0.1
2.05±0.1
5.5
1.75±0.15.5±0.05
12±0.3

E2

User Direction of Feed

5.5 1.75±0.15.5±0.05 12±0.3 E2 User Direction of Feed TAPING REEL DIMENSIONS (1reel=1000pcs) REUSE REEL

TAPING REEL DIMENSIONS

(1reel=1000pcs)

REUSE REEL (EIAJ-RRM-12Bc)

15.4±1.0 13±0.3 21±0.8 2±0.5 13±0.2∅ ∅ 60 0 +1 ∅ 180 −1.5 0
15.4±1.0
13±0.3
21±0.8
2±0.5
13±0.2∅
60
0 +1
180 −1.5 0

PACKAGES INFORMATION

PE-HSOP-6J-0701

POWER DISSIPATION (HSOP-6J)

This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below:

Measurement Conditions

 

High Wattage Land Pattern

Standard Land Pattern

Environment

Mounting on Board (Wind velocity=0m/s)

Mounting on Board (Wind velocity=0m/s)

Board Material

Glass cloth epoxy plactic (Double sided)

Glass cloth epoxy plactic (Double sided)

Board Dimensions

50mm × 50mm × 1.6mm

50mm × 50mm × 1.6mm

Copper Ratio

90%

50%

Through-hole

φ0.5mm × 44pcs

φ0.5mm × 44pcs

Measurement Result

(Topt=25°C,Tjmax=125°C)

 

High Wattage Land Pattern

Standard Land Pattern

Free Air

Power Dissipation

2000mW

1700mW

540mW

Thermal Resistance

50°C/W

59°C/W

185°C/W

2600 2400 2200 On Boad (High Wattage Land Pattern) 2000 1800 1700 On Boad (Standerd
2600
2400
2200
On Boad (High
Wattage
Land Pattern)
2000
1800
1700
On Boad (Standerd Land
Pattern)
1600
1400
1200
Free Air
1000
800
540
600
400
200
0
0
25
50
7585 100
125
150
Power Dissipation PD(mW)

Ambient Temperature (°C)

Power Dissipation

50 50 18 20 High Wattage Standard 49 10 40 20
50
50
18
20
High Wattage
Standard
49
10
40
20

Measurement Board Pattern

IC Mount Area Unit : mmWattage Standard 49 10 40 20 Measurement Board Pattern RECOMMENDED LAND PATTERN (HSOP-6J) 1.905 1.905 0.6

RECOMMENDED LAND PATTERN

(HSOP-6J)

1.905 1.905 0.6 1.87 5.35 1.05
1.905 1.905
0.6
1.87
5.35
1.05

(Unit: mm)

Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN (HSOP-6J) 1.905 1.905 0.6 1.87

MARK INFORMATIONS

ME-R1170H-0310

R1170H SERIES MARK SPECIFICATION

• SOT-89-5 1 2 3 4 5 6
• SOT-89-5
1
2
3
4
5
6
1
1

: E (fixed)

 
2 ,
2 ,

: Setting Voltage2 , (refer to Part Number vs. Product Code)

(refer to Part Number vs. Product Code)

4
4

: Type (A or B)

5 ,
5 ,

: Lot Number5 ,

Part Number vs. Product Code

 

Product Code

 

Product Code

 

Product Code

 

Product Code

Part Number

1
1
2
2
3
3
4
4

Part Number

1
1
2
2
3
3
4
4

Part Number

1
1
2
2
3
3
4
4

Part Number

1
1
2
2
3
3
4
4

R1170H151A

E

1

5

 

A R1170H331A

E

3

3

 

A R1170H151B

E

1

5

B

R1170H331B

E

3

3

B

R1170H161A

E

1

6

 

A R1170H341A

E

3

4

 

A R1170H161B

E

1

6

B

R1170H341B

E

3

4

B

R1170H171A

E

1

7

 

A R1170H351A

E

3

5

 

A R1170H171B

E

1

7

B

R1170H351B

E

3

5

B

R1170H181A

E

1

8

 

A R1170H361A

E

3

6

 

A R1170H181B

E

1

8

B

R1170H361B

E

3

6

B

R1170H191A

E

1

9

 

A R1170H371A

E

3

7

 

A R1170H191B

E

1

9

B

R1170H371B

E

3

7

B

R1170H201A

E

2

0

 

A R1170H381A

E

3

8

 

A R1170H201B

E

2

0

B

R1170H381B

E

3

8

B

R1170H211A

E

2

1

 

A R1170H391A

E

3

9

 

A R1170H211B

E

2

1

B

R1170H391B

E

3

9

B

R1170H221A

E

2

2

 

A R1170H401A

E

4

0

 

A R1170H221B

E

2

2

B

R1170H401B

E

4

0

B

R1170H231A

E

2

3

 

A R1170H411A

E

4

1

 

A R1170H231B

E

2

3

B

R1170H411B

E

4

1

B

R1170H241A

E

2

4

 

A R1170H421A

E

4

2

 

A R1170H241B

E

2

4

B

R1170H421B

E

4

2

B

R1170H251A

E

2

5

 

A R1170H431A

E

4

3

 

A R1170H251B

E

2

5

B

R1170H431B

E

4

3

B

R1170H261A

E

2

6

 

A R1170H441A

E

4

4

 

A R1170H261B

E

2

6

B

R1170H441B

E

4

4

B

R1170H271A

E

2

7

 

A R1170H451A

E

4

5

 

A R1170H271B

E

2

7

B

R1170H451B

E

4

5

B

R1170H281A

E

2

8

 

A R1170H461A

E

4

6

 

A R1170H281B

E

2

8

B

R1170H461B

E

4

6

B

R1170H291A

E

2

9

 

A R1170H471A

E

4

7

 

A R1170H291B

E

2

9

B

R1170H471B

E

4

7

B

R1170H301A

E

3

0

 

A R1170H481A

E

4

8

 

A R1170H301B

E

3

0

B

R1170H481B

E

4

8

B

R1170H311A

E

3

1

 

A R1170H491A

E

4

9

 

A R1170H311B

E

3

1

B

R1170H491B

E

4

9

B

R1170H321A

E

3

2

 

A R1170H501A

E

5

0

 

A R1170H321B

E

3

2

B

R1170H501B

E

5

0

B

MARK INFORMATIONS

ME-R1170D-0607

R1170D SERIES MARK SPECIFICATION

• HSON-6 1 2 3 4 5 6
• HSON-6
1
2
3
4
5
6
1
1

: E (fixed)

 
2 ,
2 ,

: Setting Voltage2 , (refer to Part Number vs. Product Code)

(refer to Part Number vs. Product Code)

4
4

: Type (A or B)