Order Number: MCUK991001C8

Service Manual
GD30/GD50 Personal Cellular Telephone
Handheld Portable

EB-GD30 EB-GD50 Specification
900 MHz Frequency range Tx/Rx frequency separation RF channel bandwidth Number of RF channels Speech coding Operating temperature Type RF Output Power Modulation Connection Voice digitizing Transmission speed Diversity Signal Reception Intermediate Frequencies Antenna Terminal Impedance Antenna VSWR Dimensions Class 4 Handheld 2 W maximum GMSK (BT = 0.3) 8 ch/TDMA 13 kbps RPE-LTP / 13 kps ACLEP / 5.6 kps CELP / VSLEP 270.3 kbps Frequency hopping Double superheterodyne 282 MHz and 45 MHz 50 Ω <2.1 : 1 Height: 135 mm Width: 45 mm Depth: 20.5 mm (30 mm with EB-BLD30 Battery) 123 cc (150 cc with EB-BLD30 Battery) GD30: 130 g (170 g with EB-BLD30 Battery) GD50: 115 g (170 g with EB-BLD30 Battery) Graphical chip on glass liquid crystal, Alphanumeric, 16 x 3 characters, 5 icons and 6 x 1 characters 4 LEDs for the LCD (Green) 8 LEDs for the keypad (Green) 1 LED Incoming call (Green) 1 Charging LED (Red) 17 keys, Navigation key Plug-in type only 3.6 V EB-BSD30: 3.6 V nominal, 670mAh, Ni-MH EB-BSD50: 3.6 V nominal, 670mAh, Li-Ion EB-BLD30: 3.6V nominal, 1340mAh, Ni-MH EB-BSD30/EB-BSD50: 95 hrs maximum EB-BLD30: 190 hrs maximum EB-BSD30/EB-BSD50: 180 minutes EB-BLD30: 360 minutes 124 Full rate/Half rate/Enhanced Full rate Tx: 890 - 915 MHz Rx: 935 - 960 MHz 45 MHz 200 kHz 374 Full rate/Half rate 1800 MHz Tx: 1710 - 1785 MHz Rx: 1805 - 1880 MHz 95 MHz

-10°C to +55°C Class 1 Handheld 1 W maximum

Volume Weight Display Illumination

Keypad SIM External DC Supply Voltage Battery

Standby Battery Life DRX 9 Conversation Battery Life PL 7, DTX 50%

Battery life figures are dependent on network conditions.

WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting to service a product. Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the product or products dealt with in this service manual by anyone else could result in serious injury or death.

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This Service Manual is copyright and issued on the strict understanding that it is not to be reproduced, copied, or disclosed to any third party, either in whole or part, without the prior written consent of Matsushita Communication Industrial UK Ltd. Every care has been taken to ensure that the contents of this manual give an accurate representation of the equipment. However, Matsushita Communication Industrial UK Ltd. accepts no responsibility for inaccuracies which may occur and reserves the right to make changes to specification or design without prior notice. The information contained in this manual and all rights in any designs disclosed therein, are and remain the exclusive property of Matsushita Communication Industrial UK Ltd. Other patents applying to material contained in this publication: BULL CP8 PATENTS Comments or correspondence concerning this manual should be addressed to: Customer Support Department, Matsushita Communication Industrial UK Ltd., Colthrop,Thatcham, Berkshire. RG19 4ZD. ENGLAND © 1999 Matsushita Communication Industrial UK Ltd.

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MCUK991001C8 Service Manual

WARNINGS AND CAUTIONS
WARNING
The equipment described in this manual contains polarized capacitors utilising liquid electrolyte. These devices are entirely safe provided that neither a short-circuit nor a reverse polarity connection is made across the capacitor terminals. FAILURE TO OBSERVE THIS WARNING COULD RESULT IN DAMAGE TO THE EQUIPMENT OR, AT WORST, POSSIBLE INJURY TO PERSONNEL RESULTING FROM ELECTRIC SHOCK OR THE AFFECTED CAPACITOR EXPLODING. EXTREME CARE MUST BE EXERCISED AT ALL TIMES WHEN HANDLING THESE DEVICES.

Caution
The equipment described in this manual contains electrostatic sensitive devices (ESDs). Damage can occur to these devices if the appropriate handling procedure is not adhered to.

ESD Handling precautions
A working area where ESDs may be safely handled without undue risk of damage from electrostatic discharge, must be available. The area must be equipped as follows: Working Surfaces - All working surfaces must have a dissipative bench mat, SAFE for use with live equipment, connected via a 1M2 resistor (usually built into the lead) to a common ground point. Wrist Strap - A quick release skin contact device with a flexible cord, which has a built in safety resistor of approximately 1MΩ shall be used. The flexible cord must be attached to a dissipative earth point. Containers - All containers and storage must be of the conductive type.

Batteries
This equipment may contain an internal battery in addition to the external battery packs. These batteries are recyclable and should be disposed of in accordance with local legislation. They must not be incinerated, or disposed of as ordinary rubbish.

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. . . . . . . . .7 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 6. . . . . . . . . . . . . . . . 7 Hot Key Dial Source List . . . . . . .3 6. . . . . . . . . . . . . . . . . . . . . . . .3 3. . . . . . . . . . . . . . . . . . . . 8 Features Menu Structure . . . . . . . 80 Printed Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 3. . . . . . . . .7 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 6 TEST AND MEASUREMENT 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Main PCB: Processor . . . . . . . . . . 23 5 TECHNICAL SPECIFICATIONS 5. . . . . . . . . . . . .CONTENTS 1 INTRODUCTION 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Case Parts and Sub-Assemblies . . . . . . . . . . . . . .10 Main PCB: Top Level Diagram . . . . . . . . . .1 6. . . . . . . 25 Rx Characteristics . . . . . . . . . . . . . . . . . 12 Important Error Messages . . . . . . . . . . . .6 Introduction .4 9. . . . . . . . . . . . . . . . . . . . . . . 63 Keypad PCB . 29 External Testing . . . . . . . . . . . . . . . . . . . . .2 Tx Characteristics . . . 8 Public Man Machine Interface (MMI) . . . . . . . . .1 2. .1 7. . . . . . . . . . . . . . . . 61 Main PCB: Transmitter . . . . .2 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3. . . . . . . . . . . . .5 6. . 3 Handportable Main Kit . . . . . . . . . . . . . 18 4 DISASSEMBLY / REASSEMBLY INSTRUCTIONS 4. . . . . .1 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Lock Code . . . . . . 13 GSM Services Supported by PC Card . . . . .3 9. . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Main PCB . . .2 1. . . . . . . . . . . . .8 3. . . . . . . 6 Concept of Operation . . . . . . . . . . . . . . . . . . . . . . . 60 Main PCB: Receiver and Tx Modulator . . . . . .9 3. . . .6 7. . . . . . . . . . . . . . . . . . . . 80 Repair Jigs and Tools . . . . . . . . . . . 5 Location of Controls . . . . . . . . . 14 Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 6. . . . . . . . . . . . . . . . . . . .13 3. . 67 Printed Circuit Boards (PCBs) . . . . . . . . . . . . . 66 9 REPLACEMENT PARTS LIST 9. . . . . .2 9. . . .12 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 3. . . . . . .2 7. . . . . . . . . . . . . . . . . . . . 7 Alpha Entry . . .2 4. . . . . . . 19 Disassembly . . . . . . . . 1 Servicing Responsibilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Complete Unit Test Setup . . . . . . . . .5 3. . 70 Refurbishment Kits . . 12 Security Codes . . . . . . . . . . . . . . . . .3 7. . . 62 Main PCB: PSU and Synthesizer . . . . . . .1 4. . . 5 LCD Display . . . . . . . . . . . . . . . 9 Troubleshooting . . . . . . . . . . . .5 7. . . . . . . . 64 8 LAYOUT DIAGRAMS 8. . . . . . . . . . . . . . . . . .9 7. . . 32 Channel Box Test Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 8. . . . . . . . . . .3 General . . . . 55 Main PCB: Baseband Overview . . . . . . . . . . . . . . . . . 1 2 GENERAL DESCRIPTION 2. . . . . . . . . . . . . . . . . 57 Main PCB: PSU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 GSM Network Codes and Names . . . . . . . . . . . . .3 Purpose of this Manual . 36 Adjustment Mode . . . . . . . . . . . . . . . . . . . 81 MCUK991001C8 Service Manual Section –v– Issue 1 Revision 0 . . . . . . . . . . .4 3. . . . . . . . . . . . . . . . . . . .11 3. . . . . . . . . . . . . . . . . 65 Keypad PCB . . . .16 General . . . . . . . . . . . . . . 53 7 CIRCUIT DIAGRAMS 7. . . . . . . 1 Structure of the Manual . . . . . . . . . . . . . . . . . . .14 3. . . . . . . . . . . 13 SIM Personalisation . 59 Main PCB: Audio . . . . . . . . .4 7. . . .1 5. 20 Reassembly . . . . . . . . . . . . . 56 Main PCB: RF Overview . . . . . . 7 Incoming Calling Line Identification (CLI) . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 OPERATING INSTRUCTIONS 3. . .15 3. . . . . . . . . . . . . . . . . . . . . . .1 1. . . . . . . . . . . . .8 7. . . . . .1 9. . . . . . . . . . . . . . . . . . . . . . . .

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at an authorised service centre. 1. MCUK991001C8 Service Manual Section 1 –1– Issue 1 Revision 0 .provides a basic understanding of the equipment. kits and options. and thus determine what corrective action should be taken.1 Purpose of this Manual This Service Manual contains the information and procedures required for installing. Step-by-step troubleshooting information is given to enable the isolation and identification of a malfunction. installing and operating the equipment.provides complete instructions for the testing. Installation and operating information . operating and servicing the Panasonic GSM Personal Cellular Mobile Telephone system operating on the GSM Digital Cellular Network.3 Servicing Responsibilities The procedures described in this manual must be performed by qualified service engineering personnel. for the ordering of spare/ replacement parts. Illustrated parts list . Servicing information . repair and reassembly of each major component part. disassembly.provides instructions for unpacking. 1. 2. together with detailed information for each of the major component parts.INTRODUCTION 1 INTRODUCTION 1. The service engineering personnel are responsible for fault diagnosis and repair of all equipment described in this manual. General and technical information . 3. 4.2 Structure of the Manual The manual is structured to provide service engineering personnel with the following information and procedures: 1.provided to enable the identification of all equipment components. The test information enables verification of the integrity of the equipment after any remedial action has been carried out.

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business GSM telephones.2 GD50 Contents NUMBER 1 2 DESCRIPTION Main unit GD50 Battery. Large AC Adaptor Documentation PART NUMBER EB-GD30 EB-BSD30 EB-BLD30 EB-CAD70 See Section 9 3 — 2. The following features are included as standard: 1. The plug-in SIM contains the subscriber and network information necessary to operate the phone on a GSM network. light. Panasonic Model Numbers GD30 and GD50 are high performance. GSM 900 and GSM 1800 operation. 2.1 GD30 Contents NUMBER 1 2 DESCRIPTION Main unit GD30 Battery. small. Large AC Adaptor Documentation PART NUMBER EB-GD50 EB-BSD50 EB-BLD30 EB-CAD70 See Section 9 3 — MCUK991001C8 Service Manual Section 2 –3– Issue 1 Revision 0 . Standard or: Battery. Dual Band. 2.GENERAL DESCRIPTION 2 GENERAL DESCRIPTION 2. Triple Rate which includes Full Rate.2.2.2 Handportable Main Kit The handportable main kit provides a standalone Class 4 GSM telephone. Standard or: Battery. codec. Figure 2. Half Rate and Enhanced Full Rate (EFR) speech. GD50 has a Desktop Handsfree function comprising integral echo cancellation and noise suppression.1: Handportable Main Unit Kit Contents 2. In addition.1 General This section provides a general description and kit composition details for the GSM Handportable Telephone system and optional kits.

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Indicates that the navigation key (g) can be pressed. K Battery requires recharging. t using the “Call Divert” feature or the telephone has Call Divert set.\ weak signal area. ] shows that the vibration alert is switched on.2 LCD Display The handportable unit has a graphical chip on glass liquid crystal display in conjunction with the following icons: Menu Number Option Area Figure 3. 3. V shows that Greek character have been entered in Alpha Entry. Pressing the select key (B) will select the option displayed in the option area of the display. the battery icon will not light. O the telephone is locked.no tones: N indicates there are unread Short Text Messages (SMS. when the battery is fully charged. [ shows that telephone is in silent mode . Refer to the Operating Instructions supplied with the telephones for full operational information.1 General This section provides a brief guide to the operation and facilities available on the GD30 and GD50 mobile telephones. G The battery icon flashes during charging. U shows that normal character have been entered in Alpha Entry.). Displays the battery charge level: H Battery is at full charge.OPERATING INSTRUCTIONS 3 OPERATING INSTRUCTIONS 3. MCUK991001C8 Service Manual Section 3 –5– Issue 1 Revision 0 . W shows that extended character have been entered in Alpha Entry. To access a feature enter the menu number on the keypad. Displays a small icon related to the current status of the telephone: Y telephone is roaming on a non-home network. Menu Icon p Option Area Following some operations the display will automatically clear after three seconds or after pressing any key except E. Indicates that it is possible to make an emergency call. The number of the feature pointed to by the pointer. Each arrow will light individually to indicate which direction is valid. Lit when SMS area is full. X shows that numbers have been entered in Alpha Entry.1: LCD display T S Menu Number H Indicates received signal strength: T strong signal area. During car mount use.

Where appropriate the 0 key scrolls up or down through abbreviated control names and then select to reveal the international access code “+”.OPERATING INSTRUCTIONS 3. End Key.3 Location of Controls Incoming/Charge indicator: Green – incoming call. Browses through the Phonebook or stores a number in the Phonebook. Clear Key. Issue 1 Revision 0 Section 3 –6– MCUK991001C8 Service Manual . Send Key. Selects option shown in the Option Area of the display. Makes a call. Red – charging battery pack.2: Location of controls for GD30/GD50 g B A D C E 0 to 9 # Navigation Key. Digit keys. Select Key. Clears the last digit entered. Phonebook Key. Scrolls through options or features menu and increases or decreases volume. Ends a call or switches the telephone on/off when pressed and held. Vibrator enable/disable Key. Figure 3. External connector: Used to connect to external accessories or charging equipment. Enter wild numbers or pauses when pressed and held. Changes the type of characters entered during Alpha Entry. clears all digits when pressed and held or returns to the previous display. Press and hold to enable or disable the vibrator.

6 Incoming Calling Line Identification (CLI) When a call is received the last 6 digits of the CLI information is matched with the phonebook. 3. Each time a key is pressed it will display the next character. To choose the option press the Select Key (B).3: Concept of Operation Pressing up and down (e) will move the pointer up and down and scroll through more information in the main area of the display. Navigation Key and display. Pressing left and right (f) will scroll through options in the option area of the display.. When the cursor is moved over a character and another key pressed this will insert the new character. deletes the character to the left when at the end of the line or clears the entire entry when pressed and held. Therefore an incoming call could match to the wrong phonebook entry.5 Alpha Entry Alpha Entry is used to enter alphanumeric characters into Phonebook..OPERATING INSTRUCTIONS 3.1 Editing Alpha Entry Pressing e will move the cursor up or down one line. MCUK991001C8 Service Manual Section 3 –7– Issue 1 Revision 0 . extended characters (W). Figure 3.4 Concept of Operation There is a close relationship between the Select Key. To cycle between Greek characters (V). 3. When another key is pressed or no key is pressed for a short time the cursor will move to the next position. Short Messages and the Greeting Message. Key 1 2 3 4 5 6 7 8 9 C U “@–. Pressing f will move the cursor left or right one character. 3. Pressing C will delete the character to the left of the cursor.5. numerals (X) and normal characters (U) press A.:!¡?¿()‘&%+–/<>=£$¥¤§ ABCabc DEFdef GHIghi JKLjkl MNOmno PQRSpqrs TUVtuv WXYZwxyz ΑΒΓ ∆ΕΖ ΗΘΙ ΚΛΜ ΝΞΟ ΠΡ Σ ΤΥΦ ΞΨΩ AÄÅÆBCÇaàbc DEÉFdeèéf GHIghiì JKLjkl MNÑOÖømnñoòö PQRSpqrsß TUÜVtuùüv WXYZwxyz Character/Operation V W 1 2 3 4 5 6 7 8 9 X Deletes the character above the cursor.

it is unlikely that the user will have the option to change the Hot Key Dial source. if the user changes the source of the Hot Key Dial numbers. When the source is the EEPROM and the telephone software is updated. the source numbers may be lost. For some OEMs it may be a requirement to store these numbers in the EEPROM. Also. 3.OPERATING INSTRUCTIONS 3.7 Hot Key Dial Source List The source for Hot Key Dial Numbers is normally ‘Phonebook’ or ‘Service Dial Numbers’.4: Features Menu Structure Issue 1 Revision 0 Section 3 –8– MCUK991001C8 Service Manual . in the event that an OEM would like the Hot Key Dial source to be stored in the EEPROM.8 Features Menu Structure Figure 3. However. it will not be possible to redirect the source back to the EEPROM.

this information is restricted to those operations that are supported by GD30 and GD50 telephones.9.9.4 Call Hold Place a call on hold Recall a held call Make a second call Swap between two held calls End held call End active call Reject incoming call 2 <SND> 2 <SND> <TELEPHONE NUMBER> <SND> 2 <SND> O <SND> 1 <SND> 0 <SND> 3.3 Security Change PIN Change PIN2 Unblock PIN Unblock PIN2 * * 0 4 * <OLD PIN> * <NEW PIN> * <NEW PIN> # * * 0 4 2 * <OLD PIN2> * <NEW PIN2> * <NEW PIN2> # * * 0 5 * <PIN UNBLOCKING KEY> * <NEW PIN> * <NEW PIN> # * * 0 5 2 * <PIN2 UNBLOCKING KEY> * <NEW PIN2> * <NEW PIN2> # 3. 007 can be 7. respectively. 3.9.9 Public Man Machine Interface (MMI) It is possible to operate all GSM telephones in the same way using the Public MMI.g. Also <SND> and <END> should be replaced with D and E keys.9.9. 3.1 Reading Phonebook Memory Location # <MEMORY LOCATION> Leading zeros can be left out of the location number. e.2 Presentation of IMEI *#06# 3. The * and # in the following procedures should be replaced by * and #. However.5 Call Waiting Enable Call Waiting Disable Call Waiting Call Waiting Status * 4 3 * # <SND> # 4 3 * # <SND> * # 4 3 * # <SND> MCUK991001C8 Service Manual Section 3 –9– Issue 1 Revision 0 .OPERATING INSTRUCTIONS 3. The following operations will work with all GSM telephones.

7 Telecommunication Services Used for Public MMI Teleservice Service All teleservices Telephony All data teleservices Facsimile services Short Message Services (SMS) All teleservices except SMS Voice group services MMI Service Code 10 11 12 13 16 19 17 Bearer Service Service All bearer services All asynchronous services All synchronous services All data synchronous services All data asynchronous services All dedicated packet access All dedicated PAD access MMI Service Code 20 21 22 24 25 26 27 3.9.OPERATING INSTRUCTIONS 3.9.6 Calling Line Identification Calling Line Identification Feature Calling Line Identification Presentation (CLIP) Calling Line Identification Restriction (CLIR) Connected Line Presentation (CLOP) Connected Line Restriction (CLOR) Service Code 30 31 76 77 Enable Disable Temporary suppress identification Temporary display identification * <SERVICE CODE> * # <SND> # <SERVICE CODE> * # <SND> # 3 1 # <TELEPHONE NUMBER> <SND> * 3 1 # <TELEPHONE NUMBER> <SND> 3.8 Call Divert Call Divert Type Divert all calls Divert calls if busy Divert calls if no reply Divert if not reachable Service Code 21 67 61 62 Set (except “No Reply” Call Bar * * <SERVICE CODE> * <FORWARD TELEPHONE NUMBER> * <TELECOMMUNICATION SERVICE> # <SND> Set “No Reply” Call Bar * * <SERVICE CODE> * <FORWARD TELEPHONE NUMBER> * <TELECOMMUNICATION SERVICE> * <TIME TO RING (seconds) # <SND> Clear # # <SERVICE CODE> * <TELECOMMUNICATION SERVICE> * # <SND> Issue 1 Revision 0 Section 3 – 10 – MCUK991001C8 Service Manual .9.

9.OPERATING INSTRUCTIONS Status * # <SERVICE CODE> * <TELECOMMUNICATION SERVICE> * # <SND> Clear all Call Diverts ##002# 3.9 Call Bar Call Bar Type All outgoing calls Outgoing international calls Outgoing international calls except those to the PLMN country All incoming calls Incoming international calls when roaming Service Code 33 331 332 35 351 Set Clear Status Clear all Call Bar Types Change Call Bar Password * <PASSWORD> * <TELECOMMUNICATION SERVICE> # <SND> # <PASSWORD> * <TELECOMMUNICATION SERVICE> # <SND> * # <TELECOMMUNICATION SERVICE> # <SND> # 3 3 0 * <PASSWORD> # <SND> * * 0 3 * * <OLD PASSWORD> * <NEW PASSWORD> * <NEW PASSWORD> # <SND> MCUK991001C8 Service Manual Section 3 – 11 – Issue 1 Revision 0 .

Fixed Dial is switched on. The telephone is not registered to a network. The telephone is locked. Calls cannot be made from Fixed Dial Store Calls cannot be received The telephone is not switched on. Replace with a new one. if the battery life still is short. Check that SIM supports Fixed DialCheck if the Fixed Dial is switched on (Menu: Security: Fixed Dial). The message area is full. Outgoing calls are barred. Switch the telephone on. Roaming with the selected network is not allowed. Unlock the telephone (Menu: Security: Phone Lock). The telephone is not registered to a network. The telephone has detected a problem with the SIM. Unlock the telephone (Menu: Security: Phone Lock). Move to a coverage area and operate the telephone after it has registered with a network. Emergency calls cannot be made User’s phone is not in a GSM coverage area.11Important Error Messages The following table is a list of error messages that may occur during use of the telephone. Switch the telephone off and then back on. The life of the battery pack is affected by improper charging. Ensure batteries are fully charged. Additionally. Leave to charge for several minutes in temperatures between +5°C and +35°C. always use until the Low Battery Warning appears and then fully recharge the battery pack. use the telephone until the Low Battery Warning appears and then fully recharge three times. The SIM is blocked because the wrong PUK has been entered ten times. Switch off Fixed Dial (Menu: Security: Fixed Dial). ensure batteries are also discharged fully before recharging. with a description and suggested course of action: Area not Allowed Network not Allowed Security Failure SIM Blocked SIM Error Message Rejected Store Full PIN2 Invalidated Warning Store Full Continue? Auto Redial List Full Roaming in the selected area is not allowed. Contact the Service Provider. The battery level indicator H does not light when charging Calls cannot be made If a battery is deeply discharged it will take a short time before there is sufficient power in the telephone to light the battery level indicator H. contact the Service Provider. A message has been received but the message store is full. Disable the incoming call barring (Menu: Security: Call Bar). Contact the Service Provider. Redial list of unsuccessfully dialled numbers is full. To receive messages. 3. for NiMH batteries. Check that the antenna symbol S is displayed.OPERATING INSTRUCTIONS 3. Services controlled by PIN2 cannot be used. New messages cannot be stored until some of the currently stored messages are deleted. Telephone numbers cannot be recalled The telephone is locked. Avoid areas of poor reception. Move to a coverage area and operate the telephone after it has registered with a network. To maintain maximum performance. To revive a Battery Pack. The PIN2 is blocked permanently because the wrong PUK2 has been entered 10 times.10Troubleshooting The user is given the following information and advised to contact the dealer if the problems persist: Problem Telephone will not switch on Extremely short battery life for a new battery pack Short battery life for an old battery pack Short battery life for NiMH battery pack The network in use and the condition of the battery pack can affect battery life. Move to a coverage area and operate the telephone when the antenna symbol is displayed. delete some of the currently stored messages or set messages to automatically clear (Menu: Messages: Parameters: Auto Delete). If the message does not disappear. Switch the telephone off and then on again. the battery pack has eventually worn out. The battery pack was worn out. Disable the outgoing call barring (Menu: Security: Call Bar). Replace with a new one. Cause Remedy Check that the battery pack is fully charged and correctly connected to the telephone. Issue 1 Revision 0 Section 3 – 12 – MCUK991001C8 Service Manual . Check the telephone number is stored in the Fixed Dial. this is inherent in all NiMH batteries. Incoming calls are barred. The network has detected authentication failure because the SIM is not registered with that network. However. Contact the Service Provider.

12Security Codes Code Type Personal Identification Number (PIN) PIN 2 PIN/PIN 2 Unblocking Key (PUK/PUK 2) 8 Used to unblock PIN and PIN 2. Controls the call bar function.3 Personalisation Function Personalisation is activated during manufacture and then enabled at a later stage. a SIM supplied by one Network/Sub-network/Service Provider or a SIM purchased by a company (corporation).OPERATING INSTRUCTIONS 3. The mobile will recognise that the SIM is for testing purposes only and operate as normal. A PIN or PIN 2 will become blocked if the wrong PIN or PIN 2 is entered three times. Can both enable and disable personalisation. This personalisation of GD30/GD50 is sometimes referred to as SIM lock or SIM latch.13. When enabled the CK is withheld from the user and cannot be read. 3.13.1 Introduction SIM personalisation will limit the use of the telephone to a single SIM. 7. When personalisation is enabled it is only possible to disable it if the mobile contains an illegal SIM and the sixteen digit Control Key (CK) is known. a SIM configured for test purposes (e. MCUK991001C8 Service Manual Section 3 – 13 – Issue 1 Revision 0 . test SIM or soft SIM) should be used. Controls memory security.13SIM Personalisation 3. this service will be revoked. Number of Digits 4 to 8 4 to 8 Description Controls SIM security. 4. 3. Supplied by the service provider.4 Disabling Procedure 1. when the user has not supplied the SIM. When the blocked PIN or PIN 2 is unblocked. F B. Once the enable/disable menu is shown it is possible to select the type of personalisation. 6.g. If a personalised GD30/GD50 contains a SIM that is from a different source it will display the message “SIM ERROR” when switched on. 2. F B. F B. Supplied by the service provider. Controls telephone security. Password Lock Code Factory set to “0000”. There are two special key sequences to enter the enable/disable menu: Key sequence 746BB 52824BB Notes Can only disable personalisation. Enabling/disabling is available by entering a special key sequence immediately after power on. a new PIN or PIN 2 must be entered. F the 16 digit Control Key. The display will confirm which type of Personalisation has been disabled. 3. F e to point at: “SIM” for SIM Personalisation ”Network” for Network Personalisation “Subnetwork” for Subnetwork Personalisation ”SP” for Service Provider Personalisation or ”Corporate” for Company Personalisation. Supplied by the service provider.13.13. F 7 4 6 B B or 5 2 8 2 4 B B.2 Testing To test a personalised GD30/GD50. If the wrong password is entered three times. If the wrong PUK or PUK 2 is entered 10 times. Supplied by the service provider. 5. F the 16 digit Control Key. the cursorr SIM will be unusable. for security reasons. 4 4 3. 3.

F B. 6.13.4 kbps Asynchronous 4.2 kbps 1200/75 bps 2.8 kbps Asynchronous 9.6 kbps 300 bps 1.5 Enabling Procedure 1. 2. 7.8 kbps Dedicated PAD Access 9. F the 16 digit Control Key.6 kbps Information Transfer UDI or modem UDI or modem UDI or modem UDI or modem UDI or modem UDI or modem UDI UDI UDI UDI UDI Error Correction Options T or NT T or NT T or NT T or NT T or NT T or NT T or NT T or NT T or NT T or NT T or NT 3.15GSM Network Codes and Names Country Albania Andorra Armenia Australia Access Code +355 +376 +374 +61 Network Operator AMC STA -Mobiland Armentel TELECOM Australia OPTUS Communications Pty Ltd. F B.8 kbps 9.6 kbps Dedicated PAD Access 300 bps Dedicated PAD Access 1. The display will confirm which type of Personalisation has been enabled. 4.OPERATING INSTRUCTIONS 3. 3. F e to point at “SIM” for SIM Personalisation ”Network” for Network Personalisation “Subnetwork” for Subnetwork Personalisation ”SP” for Service Provider Personalisation or ”Corporate” for Company Personalisation.4 kbps Dedicated PAD Access 4.mobil Azercell Batelco Grameen Phone Ltd Belgacom Mobile Mobistar Cronet PTT Bosnia Citron DSTCom Jabatan Telekom CamGSM PTT Cameroon Cellnet Network Code 276 213 283 505 505 505 232 232 400 426 470 206 206 218 218 284 528 528 456 624 01 03 01 01 02 03 01 03 01 01 01 01 10 01 19 01 11 01 01 01 Issue 1 Revision 0 Section 3 – 14 – MCUK991001C8 Service Manual . 5 2 8 2 4 B B.4 kbps 4.14GSM Services Supported by PC Card Bearer Service Number 21 22 23 24 25 26 41 42 44 45 46 Bearer Service Rate Asynchronous 300 bps Asynchronous 1. Vodafone PTY Austria Azerbaijan Bahrain Bangladesh Belgium Bosnia & Herzegovina Bulgaria Brunei Darussalam Cambodia Cameroon +43 +994 +973 +880 +32 +387 +068 +359 +673 +855 +237 Mobilkom Austria max. F B.8 kbps 9. 3. F the 16 digit Control Key. 5.4 kbps 4.2 kbps Asynchronous 1200/75 bps Asynchronous 2.2 kbps Dedicated PAD Access 2.6 kbps Access Structure Asynch Asynch Asynch Asynch Asynch Asynch Asynch Asynch Asynch Asynch Asynch Access Rate 300 bps 1.2 kbps 2.

Ltd. T-Mobil D2.OPERATING INSTRUCTIONS Network Code 460 460 460 219 280 230 230 262 262 238 238 238 238 602 248 248 248 636 542 244 244 244 244 244 208 208 208 547 340 282 282 262 262 262 620 266 202 202 202 611 216 216 454 454 454 454 454 454 454 454 216 216 274 274 00 01 02 01 01 02 01 01 02 01 02 20 30 01 01 02 03 01 01 91 09 05 03 05 01 10 20 20 01 01 02 01 02 03 01 01 01 05 10 02 30 01 00 04 06 22 10 16 18 12 01 30 01 02 Country China Access Code +86 Network Operator Guangdong MCC China United Telecommuni-cations Corporation Liaoning PPTA Croatia Cyprus Czech Republic Germany Denmark +385 +357 +42 +49 +45 HR Cronet Cyprus Telecommunication Authority Eurotel Praha Radio Mobil DeTeMobil GmbH Mannesmann Mobilfunk TELE Danmark Mobile Sonofon Telia Mobilix Egypt Estonia +20 +372 Arento Eesti Mobiiltelefon Radiolinja Eesti AS Q GSM Ethiopia Fiji Finland +251 +679 +358 ETA Vodafone Sonera Finnet OY Radiolinja AB Telia Alands Mobiltelefon France +33 France Telecom SFR Bouygues Telekom French Polynesia French West Indies Georgia Germany +689 +590 +995 +49 Tikiphone Ameris Geocell Magticom D1. Hutchison Telephone Co.A STET HELLAS Guinea Hungary Hong Kong +224 +36 +852 Sotelgui Westel 900 GSM RT Pannon GSM RT Hong Kong Telecom CSL Ltd. SmarTone Mobile Communications Ltd. P Plus Comm New World PCS Mandarin Comm Pacific Link Peoples Telephone Hungary Iceland +36 +354 Pannon GSM Westel 900 Post & Simi Icelandic Mobile Phone MCUK991001C8 Service Manual Section 3 – 15 – Issue 1 Revision 0 . Mannesmann E-Plus Mobilfunk Ghana Gibralta Greece +233 +350 +30 ScanCom GibTel Cosmote Panafon S.

T.OPERATING INSTRUCTIONS Network Code 404 404 404 404 404 404 404 404 404 404 404 404 404 404 404 510 510 510 432 272 272 272 222 222 612 612 612 416 419 270 457 247 415 415 651 228 246 246 270 270 455 294 646 646 650 502 502 502 502 502 502 278 617 208 208 604 634 10 21 40 10 11 20 30 31 41 14 11 27 07 12 15 10 01 11 11 01 02 03 10 01 01 03 05 01 02 01 01 01 03 01 01 01 02 01 01 77 01 01 03 01 01 19 12 02 13 17 16 01 01 01 10 01 01 Country India Access Code +91 Network Operator Bharti Cellular Limited BPL Mobile Skycell Airtel Essar Maxtouch Command Mobilenet RPG MAA Modi Telstra Sterling Cellular BPL USWest TATA Escotel Aircel Digilink Indonesia +62 PT Telekomunikasi Indonesia PT.C.I Telecom Ireland Digifone Meteor Italy Ivory Coast +39 +225 Omnitel Pronto Italia Telecom Italia Mobile Comstar Ivoiris Loteny Telecom Jordan Kuwait Luxembourg Laos (People’s Democratic Republic) Latvia Lebanon Lesotho Liechtenstein Lithuania Luxembourg Macau Macedonia Madagascar Malawi Malaysia +962 +965 +352 +856 +371 +961 +266 +4175 +370 +352 +853 +389 +261 +265 +60 JMTS MTCNet P & T Luxembourg Lao Shinawatra Latvian Mobile Telephone Co. Satelit Palapa Indonesia PT Excelcomindo Pratama Iran (Islamic Republic of) Ireland +98 +353 T. France Telecom SFR ONPT Morocco Telecom de Mocambique Issue 1 Revision 0 Section 3 – 16 – MCUK991001C8 Service Manual .M. Libancell Cellis Vodacom Natel-D Bite GSM Omnitel P&T LUXGSM Millicom Lux SA C.Ltd. PTT Makedonija Sacel Madacom TNL Celcom Maxis My BSB MRTEL Adam Mutiara Telecom Malta Mauritius Monaco Morocco Mozambique +356 +230 +377 +212 +258 Telecell Mauritius Telecom Ltd.

OPERATING INSTRUCTIONS Network Code 219 649 204 204 546 530 242 242 422 410 310 515 515 260 260 260 268 268 268 427 647 226 226 250 250 222 222 420 420 608 633 525 525 231 231 293 655 655 214 214 413 634 240 240 240 228 228 417 466 640 520 520 605 286 286 641 01 01 04 08 01 01 01 02 02 01 01 02 01 01 02 03 06 01 03 01 10 01 10 01 02 10 01 01 07 01 01 01 03 02 01 41 01 10 07 01 02 01 01 07 08 01 01 09 92 01 01 18 02 01 02 01 Country Myanmar Namibia Netherlands New Caledonia New Zealand Norway Oman Pakistan Papua New Guinea Philippines Poland Access Code +95 +264 +31 +687 +64 +47 +968 +92 +675 +63 +48 Network Operator HPT MTC LIBERTEL PTT Telecom Mobilis Bell South Telenor Mobil AS NetCom GSM A/S General Telecoms Mobilink Pacific Globe Telecom GMCR Inc IslaCom Plus GSM ERA GSM IDEA Centertel Portugal +351 Telecomunicaçoes Moveis Nacionais (TMN) TELECEL Optimus Qatar Reunion Romania Russian Federation +974 +262 +40 +701 Q-Net SRR MobiFon MobilRom Mobile Telesystems North-West GSM KB Impuls San Marino Saudi Arabia Senegal Seychelles Singapore Slovak Republic Slovenia South Africa Spain Sri Lanka Sudan Sweden +378 +966 +221 +248 +65 +42 +386 +27 +34 +94 +249 +46 Omnitel Telecom Italia Mobile Al Jawal EAE Sonatel SEZ SEYCEL Singapore Telecom MobileOne Eurotel Globtel Mobitel Vodacom MTN Movistar AIRTEL Spain MTN Networks (PVT) Sri Lanka Mobitel Telia Mobitel Comviq GSM AB Europolitan AB Switzerland Syria Taiwan Tanazania (United Republic of) Thailand Tunisia Turkey Uganda +41 +963 +886 +255 +66 +216 +90 +256 Swisscom 900 Swisscom 1800 Mobile Syria LDTA Tritel TH AIS GSM Total Access Comms Tunisian PTT Turkcell Telsim Celtel Cellular MCUK991001C8 Service Manual Section 3 – 17 – Issue 1 Revision 0 .

Each country will have at least one network operator. Where messages are sent before they are forwarded onto their destination. Personal Identification Number used for SIM security. This can be used to restrict dialling to a specific area. The act of locking on to a GSM network. Used for the control of the call bar function. The Message Centre telephone number may be programmed into the SIM or supplied by the service provider. A small smart-card which stores unique subscriber and user-entered information such as Phone Book. Supplementary services may only be available on a subscription bases. Supplied by the service provider. paging and computerised home banking. Spaces in a stored telephone number. Supplied by the service provider. Network-controlled GSM functions supported by the telephone. It is most likely to be preprogrammed to the Service Dial Numbers by the Service Provider. GSM Home country Home network Hot Key Dial Lock code Message Centre Network operator Password PIN PIN2 PUK/ PUK2 Registration Roaming Service Dial Numbers Service provider SIM Supplementary service Wild numbers Issue 1 Revision 0 Section 3 – 18 – MCUK991001C8 Service Manual . Supplied by the service provider.OPERATING INSTRUCTIONS Network Code 255 255 424 424 234 234 234 234 234 434 434 434 452 452 220 220 648 01 05 01 02 15 10 55 50 58 04 05 01 01 02 01 02 01 Country Ukraine United Arab Emirates United Kingdom (Guernsey) (Jersey) (Isle of Man) Uzbekistan Access Code +380 +971 +44 Network Operator Mobile comms Golden Telecom UAE ETISALAT-G1 UAE ETISALAT-G2 Vodafone Cellnet Guernsey Telecoms Jersey Telecoms Manx Telecom +7 Daewoo GSM Coscom Buztel Vietnam Yugoslavia Zimbabwe +84 +381 +263 MTSC DGPT Mobile Telekom Pro Monte NET ONE 3. Global System for Mobile communications. The GSM network on which subscription details are held. Subscriber Identification Module. Supplied by the service provider. Factory set to “0000”. This is usually performed automatically by the telephone. The name given to the advanced digital technology that the telephone uses. Supplied by the service provider. The organisation responsible for providing access to the GSM network. The organisation responsible for operating a GSM network. and * and # will generate different DTMF tones when pressed during conversation. PIN/PIN2 Unblocking Key. Fixed Dial Memory and short messages. Hot Key Dial allows quick access to numbers stored in the Phonebook of Service Dial Number list. Used to unblock the PIN/PIN2. The numeric keys 0 to 9.16Glossary of Terms DTMF Dual Tone Multiple Frequency tones. The country in which the home network operates. For example billing information or access to Voice Mail. Service Dial Numbers are predefined numbers that allow the user to access a set of special services provided by the Service Provider. The ability to use the telephone on networks other than the Home network. Personal Identification Number used for the control of Fixed Dial Memory and call charge metering. These are used to access voice mail. When the telephone number is recalled pressing a numeric key will fill in a space. Used for security of the telephone. The source of the Hot Key Dial may be defined by the user or preprogrammed by the Service Provide.

FAILURE TO OBSERVE THIS WARNING COULD RESULT IN DAMAGE TO THE EQUIPMENT OR. The flexible cord must be attached to a dissipative earth point. Containers – All containers and storage must be of the conductive type. AT WORST. MCUK991001C8 Service Manual Section 4 – 19 – Issue 1 Revision 0 .DISASSEMBLY / REASSEMBLY INSTRUCTIONS 4 DISASSEMBLY / REASSEMBLY INSTRUCTIONS 4. must be available. which has a built in safety resistor of between 5k2 and 1M2 shall be used. 4. Wrist Strap – A quick release skin contact device with a flexible cord. POSSIBLE INJURY TO PERSONNEL RESULTING FROM ELECTRIC SHOCK OR THE AFFECTED CAPACITOR EXPLODING.1 ESD Handling Precautions A working area where ESDs may be safely handled without undue risk of damage from electrostatic discharge. Caution The equipment described in this manual contains electrostatic sensitive devices (ESDs). connected via a 1M2 resistor (usually built into the lead) to a common ground point. EXTREME CARE MUST BE EXERCISED AT ALL TIMES WHEN HANDLING THESE DEVICES. These procedures MUST be performed by qualified service personnel.1 General This section provides disassembly and reassembly procedures for the main components of GD30 and GD50 telephones. These devices are entirely safe provided that neither a short-circuit nor a reverse polarity connection is made across the capacitor terminals. The area must be equipped as follows: Working Surfaces – All working surfaces must have a dissipative bench mat.1. Damage can occur to these devices if the appropriate handling procedure is not adhered to. SAFE for use with live equipment. The following warnings and precautions MUST be observed during ALL disassembly/reassembly operations: WARNING The equipment described in this manual contains polarised capacitors utilising liquid electrolyte. at an authorized service centre.

Figure 4.3: PCB Assembly Removal Issue 1 Revision 0 Section 4 – 20 – MCUK991001C8 Service Manual . Care must be taken when separating the case from the cover as the retaining clips may be very stiff – if necessary.2 Disassembly 4. Figure 4. Remove the two screws securing the PCB assembly to the case. Remove the four case screws located inside the battery compartment. Remove the battery from the back of the telephone.1: Screw removal 2.2: Case Disassembly 3.DISASSEMBLY / REASSEMBLY INSTRUCTIONS 4. Remove the cover from the case by pulling from the connector end of the telephone.2. Figure 4.1 Case Removal 1. re-attach the battery to provide extra support for the case. Lift the PCB assembly away from the case.

While applying slight pressure to the side retaining clips. Figure 4. Figure 4.5: Main PCB removal 2. Observe polarity when replacing the battery.6: Keypad PCB removal MCUK991001C8 Service Manual Section 4 – 21 – Issue 1 Revision 0 . The backup battery is held in a retainer on the Main PCB. lift the Main PCB away from the chassis. Remove the case as previously described.2.4: Battery Polarity 4. lift the Keypad PCB away from the chassis.2.2 Changing the Backup Battery Remove the case as previously described. Figure 4. While applying slight pressure to the side retaining clips.3 Access to Printed Circuit Boards 1.DISASSEMBLY / REASSEMBLY INSTRUCTIONS 4.

9: Microphone assembly removal Issue 1 Revision 0 Section 4 – 22 – MCUK991001C8 Service Manual . Figure 4. Remove the rubber boot which contains the microphone.DISASSEMBLY / REASSEMBLY INSTRUCTIONS 3.. Gently bend the four Display Assembly lugs to allow removal from the Keypad PCB. Remove the keypad by peeling it away from the case front.8: Removing the keypad 2.4 Case-Mounted Components 1. ensure contacts are oriented such that they make contact with the corresponding printed circuit pads on the Main PCB. Figure 4.2. When refitting.7: Display Assembly removal 4. Figure 4.

11: Vibrate motor removal 4.e. The Vibrate motor may be removed by gently applying pressure under the spindle/counterweight.DISASSEMBLY / REASSEMBLY INSTRUCTIONS 3. Note that the retainer clip should be released gently from one side to ensure that damage does not occur to the retainer barbs. Figure 4.10: Speaker removal 4. i.3 Reassembly Care must be taken when reinstalling the back onto the telephone case. Unclip the speaker holder and lift out the speaker. Figure 4. Also ensure that the securing screws are not over-tightened as this may affect the operation of the keypad. the ribbon connector is facing the top of the telephone.. Ensure that the LCD module is oriented correctly. MCUK991001C8 Service Manual Section 4 – 23 – Issue 1 Revision 0 .

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1 Frequency error ±0.0 MHz (offset from carrier) Frequency Offset Filter Bandwidth 10 kHz 100 kHz 100 kHz 100 kHz 300 kHz 1 MHz Approximate Video Bandwidth 30 kHz 300 kHz 300 kHz 300 kHz 1 MHz 3 MHz Limits (dBm) GSM 900 -36 -36 -36 -30 -30 -30 GSM 1800 -36 -36 -36 -36 -36 -36 30 kHz 100 kHz -30 -30 Measurement conditions: Peak Hold.1. Modulated Carrier a.8 to 6.1.5 -30 -33 -60 5. in which case the limit ≤ -36 dBm shall apply. b. relevant TX band: P-GSM: 890 to 915 MHz. relative to base station frequency.1ppm max. In each of the bands 925-960 MHz and 1805-1880 MHz up to 5 spurious measurements can fail these limits.2 Modulation phase error RMS: ≤5° Peak: ≤20° 5.1.3 Output RF Spectrum due to Modulation Offset from Centre Frequency (kHz) ±100 ±200 ±250 ±600 to 1800 Maximum Level Relative to the Carrier (dB) +0. DCS: 1710 to 1785 MHz 0 to 1MHz 0 to 10 MHz ≥ 10 MHz ≥ 20 MHz (offset from edge of relevant TX band) 1. MCUK991001C8 Service Manual Section 5 – 25 – Issue 1 Revision 0 .TECHNICAL SPECIFICATIONS 5 TECHNICAL SPECIFICATIONS 5. 5..4 Output RF Spectrum due to Switching Transients Offset from Centre Frequency (kHz) GSM 900 ±400 ±600 ±1200 ±1800 -19 -21 -21 -24 Maximum Level (dBm) GSM 1800 -22 -24 -24 -27 Measurement conditions for output RF spectrum measurements: Frequency Span: 0 Hz Measurement Bandwidth: 30 kHz Video Bandwidth: 100 kHz Peak Hold 5. 5. Measurement averaged over a burst and then averaged again over 50 bursts. DCS: 1710 to 1785 MHz Relevent TX band: P-GSM: 890 to 915 MHz.1 Tx Characteristics All data is applicable to GSM 900 and GSM 1800 except where stated.1.5 Spurious Emissions at the Antenna Connector Frequency Range 30 to 50 MHz 50 to 500 MHz 500 MHz to 1GHz 1 GHz to 4GHz Excl.1.

5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.6 ±0. -0.5 ±0.5 ±0.5 GSM 1800 Power Control Level PL0 PL1 PL2 PL3 PL4 PL5 PL6 PL7 PL8 PL9 PL10 PL11 PL12 PL13 PL14 PL15 Transmitter Output Power (dBm) 29.6 Output Level.5 ±0.5 ±0.5 ±0.5 ±0.4.5 ±0.5 ±0.5 ±0.5 ±0.4 30.5 ±0.5 Extreme +0. Dynamic Operation GSM 900 Power Control Level PL5 PL6 PL7 PL8 PL9 PL10 PL11 PL12 PL13 PL14 PL15 PL16 PL17 PL18 PL19 Transmitter Output Power (dBm) 32.5 ±0.5 ±0.5 ±0.7 29 27 25 23 21 19 17 15 13 11 9 7 5 Tolerance for Conditions (dB) Normal +0.3.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0. −0.5 ±0.5 ±0.5 ±0.3. -0.5 ±0.5 ±0.5 ±0.5 ±0.1.TECHNICAL SPECIFICATIONS 5.7 Residual Peak Power ≤70 dBc (BW = 300 kHz) Issue 1 Revision 0 Section 5 – 26 – MCUK991001C8 Service Manual .5 ±0.7 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Tolerance for Conditions (dB) Normal +0.5 ±0.5 ±0.3 27.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.4.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.1.5 ±0.5 ±0.5 5.5 ±0.5 ±0. −0.6 ±0.5 Extreme +0.

TECHNICAL SPECIFICATIONS

5.2 Rx Characteristics
5.2.1 Sensitivity GSM 900 Full rate speech
The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is appropriate) is specified in the following table, according to the propagation conditions.
Channels Propagation Conditions TUhigh Test limit error rate % TCH/FS FER class Ib (RBER) class II (RBER) 6.742*α 0.42/α 8.33 Minimum no. of samples 8900 1,000,000 120,000 7.5 24000 9.333 60000 Propagation Conditions RA Test limit error rate % Minimum no. of samples Propagation Conditions HT Test limit error rate % Minimum no. of samples Static Conditions Test limit error rate % 0.122*α 0.41/α 2.439 Minimum no. of samples 164000 20,000,000 8200

The reference sensitivity level is <-102dBm. NOTE: 1 ≤ α ≤ 1.6. The value of a can be different for each channel condition but must remain the same for FER and class Ib RBER measurements for the same channel condition.

GSM 900 Half rate speech
The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is appropriate) is specified in the following table, according to the propagation conditions.
Channels Propagation Conditions TUhigh Test limit error rate % TCH/HS (FER) TCH/HS class Ib (BFI=0) TCH/HS class II (BFI=0) TCH/HS (UFR) TCH/HSL class Ib ((BFI or UFI)=0) 4.598 0.404 7.725 6.250 0.269 Minimum no. of samples 13050 148500 25500 9600 227000 8500 20000 7600 20000 Propagation Conditions RA Test limit error rate % Minimum no. of samples Propagation Conditions HT Test limit error rate % Minimum no. of samples

GSM 1800 Full rate speech
The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is appropriate) is specified in the following table, according to the propagation conditions.
Channels Propagation Conditions TUhigh Test limit error rate % TCH/FS FER class Ib (RBER) class II (RBER) 4.478*α 0.32/α 8.333 Minimum no. of samples 13400 1,500,000 60,000 7.5 24000 9.333 30000 Propagation Conditions RA Test limit error rate % Minimum no. of samples Propagation Conditions HT Test limit error rate % Minimum no. of samples Static Conditions Test limit error rate % 0.122*α 0.41/α 2.439 Minimum no. of samples 164000 20,000,000 8200

The reference sensitivity level is <-102 dBm. NOTE: 1 ≤ α ≤ 1.6. The value of a can be different for each channel condition but must remain the same for FER and class Ib RBER measurements for the same channel condition.

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TECHNICAL SPECIFICATIONS

GSM 1800 Half rate speech
The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is appropriate) is specified in the following table, according to the propagation conditions.
Channels Propagation Conditions TUhigh Test limit error rate % TCH/HS (FER) TCH/HS class Ib (BFI=0) TCH/HS class II (BFI=0) TCH/HS (UFR) TCH/HSL class Ib ((BFI or UFI)=0) 4.706 0.426 7.725 6.383 0.291 Minimum no. of samples 12750 141000 25500 9400 206000 8735 20000 7600 20000 Propagation Conditions RA Test limit error rate % Minimum no. of samples Propagation Conditions HT Test limit error rate % Minimum no. of samples

Blocking:
Frequency Small MS level in dBµVemf() GSM 900 FR ±600 kHz to FR ±800 kHz FR ±800 kHz to FR ±1.6 MHz FR ±1.6 MHz to FR ±3 MHz 915 MHz to FR -3 MHz FR ±3 MHz to FR 980 MHz FR ±600 kHz to FR ±800 kHz 1785 MHz to FR - 3 MHz 835 MHz to <915 MHz >980 MHz to 1000 MHz 100 kHz to <835 MHz >1000 MHz to 12.75 GHz 100 kHz to 1705 MHz >1705 MHz to<1785 MHz >1920 MHz to 1980 MHz >1980 MHz to 12.75 GHz 70 70 80 90 90 113 113 90 90 70 70 80 87 87 113 101 101 90 GSM 1800

Measurement Conditions: Wanted carrier is 3dB above reference sensitivity. Interferer is CW Spurious response exceptions: 6 exceptions are permitted IN band 915 - 980MHz 24 exceptions are permitted OUTSIDE band 915 - 980MHz.

Intermodulation Characteristics:
Interferer Level (f1 & f2) dBm -49 Interferer Frequencies (f1 & f2) Wanted frequency = 2f1 - f2, and |f1 - f2| = 800 kHz

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MCUK991001C8 Service Manual

TEST AND MEASUREMENT

6

TEST AND MEASUREMENT

6.1 Introduction
This section provides information on testing GD30 and GD50 telephones. The layout is as follows: 1. 2. 3. 4. 5. Section 6.2 External testing: describes equipment requirements and general set up procedure. Section 6.3 Complete Unit Test Setup: describes how the items of test equipment are used together and general set up procedure. Section 6.4 Channel box test commands: provides detailed explanation of the different commands available using the test equipment and channel-box software. Section 6.5 Adjustment mode: describes adjustments available on the GD30/GD50 handheld unit. Section 6.6 Lock code: describes the procedure to check or reset the lock code using the Channel box software.

6.2 External Testing
The GD30/GD50 unit can be connected to a compatible personal computer for electronic adjustment and fault diagnosis. This section provides a description of the equipment required to perform those tasks. Testing and adjustment of the handheld unit can be performed with the outer case in place and the cradle connected. For indepth fault finding the unit should first be disassembled, as detailed in Section 4, and then the PCB Repair Jig used to connect the PCBs together externally as they would be found in normal use. Fault tracing can then be performed on the PCBs using suitable test equipment, such as spectrum analysers and oscilloscopes. The unit must now be tested and calibrated for both frequencies (900 MHz and 1800 MHz) as well as for the two battery types.

6.2.1 Jigs and Tools Test Equipment Descriptions
1. Interface box, Part Number: IFB003/IFB004 a. IFB003: Voltage regulation for +7.2 V, +5.6 V or 4.8 V DC outputs. The +7.2 V switch setting is used as a supply to LiIon type batteries (compatible for other products), the 5.6 V switch setting is used for PCB testing and the 4.8 V switch setting is used for testing the complete unit Interface Box IFB004 is a later version that provides +4.8 V, +7.2V and +8.2 V DC outputs. It also allows selection of external power via the Interface cable. b. RS 232 interface. Ensures that the Unit Under Test is supplied with the correct signal levels and format..

The Interface box provides:

Figure 6.1: Interface Box IFB003 / IFB004 2. Personal Computer (PC) The PC (IBM compatible) is used as a Unit Under Test controller. This in conjunction with the channel box software, allows all of the test facilities normally provided through the keypad of the Unit Under Test.

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3. Power Supply Provides 12 V DC supply to Interface Box IFB003 or IFB004. 4. Test Battery Part Number: JT00022 Provides 3.6 V DC supply to Interface Box IFB003 or IFB004 to compensate for the current drain when the Unit Under Test is used at full transmit power.

Figure 6.2: Test Battery 5. PCB Repair Jig Part Number: JT00011 This unit provides the necessary connections between the Main and Key PCBs, and the connections between Main PCB and external test equipment.

Figure 6.3: PCB Repair Jig

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TEST AND MEASUREMENT
6. RF Adaptor Part Number: JT00009 This unit provides an RF connection between the Unit Under Test and external test equipment. It has a lug on the back to allow both Adaptor and Unit Under Test to be suspended from a suitable rack or channel bracket, if required.

Figure 6.4: RF Adaptor 7. GSM Tester This unit acts as a base station providing all the necessary GSM signalling requirements and also provides GSM signal measuring facilities. 8. Interface Cable Part Number: JT00004 The interface cable allows connection between a computer and the Unit Under Test via IFB003. Connector A is available separately, if required, under part number DHS31-P18S-HL-BD.

Figure 6.5: Interface Cable 9. Battery Calibration Voltage Control Unit (BCVCU) Part Number: JT00010 This unit provides three voltage levels (3 V, 4.1 V and 0 V) to the Test Battery, and is used during battery calibration checks. It is powered from the Interface Box. .

Figure 6.6: Battery Calibration Voltage Control Unit (BCVCU)

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3 Complete Unit Test Setup Figure 6.TEST AND MEASUREMENT 10. 6. Channel Box Software This is the test software for the telephone unit and should be installed onto the personal computer to be used for testing.7: Complete unit test setup Issue 1 Revision 0 Section 6 – 32 – MCUK991001C8 Service Manual .

Figure 6. Power On into Test Mode 1.8 V for Nickel Metal Hydride battery b.1 External Testing Setup Procedure IMPORTANT NOTE To allow accurate measurement of the complete unit the test equipment must be connected as shown (Figure 6. The Test Mode facility allows various sections of the handheld unit to be individually activated. The 12 V supply is connected to the rear socket of the Interface box. The PCB Test Setup must be used to enable repair to PCBs. Power supply +12V DC: OFF MCUK991001C8 Service Manual Section 6 – 33 – Issue 1 Revision 0 . Test Mode. Interface box 12 V power supply Personal computer (IBM compatible) with RS232 interface RS232 interface cable (9 pin straight through connection) GSM test station RF Adaptor Interface cable – JT00004 The channel box software (supplied on floppy disk) should be installed onto the main drive of the personal computer. Normal Mode. NOTE: A suitable test SIM card will be required which is compatible with the GSM test station.7.6 V for PCB testing 4. Full Test Equipment Requirements For testing the handheld unit the following equipment is required: 1. Once repair/replacement is complete. The RF cable is connected to the GSM test station via a suitable adapter. 4. 7. The Normal Mode facility allows the handheld unit to be powered externally for call origination/receiving operations. Two modes are available for testing the handheld unit: 1. Connect the test equipment into test mode configuration. 3. Ensure that the following settings are made: a.8: External test equipment setup 2. 5. 6. 2. the assembled unit must be tested and calibrated with the jigs and tools connected as shown in Figure 6. Interface box IFB003 Power: UP position IGN: DOWN position Mode UP position Voltage Dependent upon operation: 5. 2.3.6).TEST AND MEASUREMENT 6.

Figure 6. 6. At the PC press F10. Connect together the test equipment. Go to section 7. PC Channel box software loaded and the screen indicating as shown: Figure 6. Power On in Normal Mode 1. 4.TEST AND MEASUREMENT c. Steps 5 and 6 above must be carried out within 1 second or power ON will time-out. NOTE: The display will read: GET STATION ADDRESS = _ _ INFO = _ _ The back light will be illuminated and all LEDs will be lit.4 (Channel Box Test Commands) for further testing information. At the Interface box switch the power to ON. Press ENTER on the PC keyboard.10: External test equipment setup Issue 1 Revision 0 Section 6 – 34 – MCUK991001C8 Service Manual . Switch on the +12 V supply.9: PC Screen (SCRN10) 3. 5. 7.

4. At the PC press F10.12: PC Screen (SCRN11) 1. MCUK991001C8 Service Manual Section 6 – 35 – Issue 1 Revision 0 . 2. At the PC change the TEST field to read <TERM>. Press ENTER. Power supply +12V DC: OFF c. At the Interface box switch the POWER to ON. 5. set SOFT SIM field to <DIS> and set TEST field to <Test>. Interface box IFB003 Power: UP position IGN: DOWN position MODE: UP position b. Switch on the 12V supply. 3. Ensure that the following settings are made: a. Entering Call Mode from Test Mode Ensure that a charged battery is attached to the telephone. If the UUT is connected to a GSM test set. 6. The UUT will power down and up again. At the PC change the SOFT SIM field to read <ENB>. To return to test mode. PC Channel box software loaded and the screen indicating as shown: Figure 6. On the PC press ENTER.TEST AND MEASUREMENT 2.11: PC Screen (SCRN9) 3. after a delay of approximately 5 seconds the UUT will register service. The screen of the PC will resemble the one shown: Figure 6. Press ENTER. Press ENTER.

Allows a specified power level to be set at the UUT. BUZZ VOL. Sets TX Modulation to Normal burst DATA all 0s Normal burst DATA all 1s Normal burst DATA all random Access burst DATA random Provides an RSSI reading on the User specified channel. HIGH channels. Allows changes to AGC levels on LOW. MIC VOL. use the up/down scroll keys on the personal computer keyboard to select the channel-box command. SP2 GET KEY CODE CONTROL OUT <xx> <xx> <xx> <xx> <xx> <ENABLE><DISABLE> <LED R> <LED B> <CHARGE ON> <LED C> <HF ON> <ALL OFF> <ALL ON> <P1> <P2> INDICATION <TERM> <ReST> <INIT> <xxx> <xxx> <xxx> FUNCTION Terminates test mode. MIDDLE. Sets up predefined channel settings for DCS frequencies. After the handheld unit has been switched on (section 7. Sets up predefined channel settings for GSM frequencies.TEST AND MEASUREMENT 6. Provides an audio path for use with the GSM test station Sets audio loop-back from TX audio to RX audio without processing by the CODEC Sets audio paths: MIC off speaker off MIC external speaker internal MIC external speaker external MIC internal speaker internal MIC internal speaker external Sets buzzer volume between values 0 to 3 (Min to Max) Sets 4 side tone volume levels between 0dB and -18dB Sets 8 MIC volume levels between 26dB and 40dB Sets speaker pre-amp volume levels Sets speaker volume levels Displays the value of a key pressed on the keypad Switches on Incoming LED Switches on Backlight LEDs Switches charge sequence on LCD Switches on Charging LED Switches on handsfree mode Switches off all above Switches on all above Provides 50% visual display of check pattern on the UUT LCD Provides 50% visual display of check pattern on the UUT LCD CHECK LCD1 Issue 1 Revision 0 Section 6 – 36 – MCUK991001C8 Service Manual . Restarts test mode When RETURN is pressed this will reset the default channel settings. Use the left/right scroll keys to display the required indication and press the ENTER key to select the displayed function. CHANNEL BOX COMMAND TEST MODE INITIALIZE CHANGE CH GSM CHANGE CH DCS POWER LEVEL TX DATA <NRL 0> <NRL 1> <NRL R> <ACC R> RSSI (DBM) SET AGC 1 SET AGC 2 SET AGC 3 SP LOOP BACK <xxx> <xxx> <xxx> <xxx> <START> <STOP> PATH CONT <MOSO> <MESI> <MESE> <MISI> <MISE> VOL. SIDE VOL.4 Channel Box Test Commands The following table outlines the commands available using the channel-box software.3). SP1 VOL.

These procedures are: 1.5.3) The adjustment data selected during calibration is stored in the telephone EEPROM.13: Test software screen MCUK991001C8 Service Manual Section 6 – 37 – Issue 1 Revision 0 .2) I and Q values (Section 6. The following adjustments MUST be made on BOARD PAIRS.5. The following procedures MUST be performed after replacement or repair of one or both of the PCBs in the handheld unit.5. There are three distinct calibration procedures to adjust RF performance.2.DISP INDICATION <ENABLE> <DISABLE> FUNCTION Unit error codes will be displayed on the UUT display Unit error codes will not be displayed on the UUT display With ENABLE set and TEST MODE <TERM> the UUT is removed from test mode and can be placed into call mode With SOFT SIM <ENABLED> the UUT will be removed from test mode and can be placed into a call Checks and displays the SIM status Displays the software checksum SOFT SIM <ENABLE> <DISABLE> TEST MODE <TERM> SIM STATUS CHECK SUM <SHOW> <SHOW> 6.1) RSSI (Section 6.1 for a list of the equipment and setup procedures required to perform the following adjustment and calibration procedures. Failure to do so may result in incorrect operation of the telephone. Figure 6. 3. Ramping gain (Section 6.5 Adjustment Mode NOTE: See Section 6. 2.TEST AND MEASUREMENT CHANNEL BOX COMMAND SET ER.

5 ±0.0 5.1 Ramping Gain The carrier power must be measured and calibrated for each power level at channel 62.5 ±0. -0.5 3.5 2.TEST AND MEASUREMENT 6.5 3.5 ±0.0 2.5 4.0 4.5 ±0.0 3.5 ±0.5 ±0.5 3.3.0 4.5 4.5 ±0.0 5.0 3.5 ±0.5 3.5 Initial Calibration Value 194 184 176 168 159 151 144 137 130 125 119 114 109 103 97 92 Change per dB 5.5 3.7 29 27 25 23 21 19 17 15 13 11 9 7 5 Tolerance (dBm) +0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 3.3 27.5 3.5 Issue 1 Revision 0 Section 6 – 38 – MCUK991001C8 Service Manual .5 2.5 3.5 ±0.5 2.0 4.5 ±0.0 3. -0.5 GSM 1800 Power Level PL0 PL1 PL2 PL3 PL4 PL5 PL6 PL7 PL8 PL9 PL10 PL11 PL12 PL13 PL14 PL15 Peak Power (dBm) 29.5 ±0.5 ±0.5 ±0.5 ±0.5.5 2.5 ±0.5 ±0. GSM 900 Power Level PL5 PL6 PL7 PL8 PL9 PL10 PL11 PL12 PL13 PL14 PL15 PL16 PL17 PL18 PL19 Peak Power (dBm) 32.6 ±0.5 ±0.5 ±0.5 ±0.0 4.0 4.5 ±0.5 2.5 ±0.5 ±0.5 3.4 30.0 2.0 5.5 ±0.5 Initial Calibration Value 214 200 190 181 173 163 153 144 137 130 125 120 114 107 100 Change per dB 7.4.7 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Tolerance (dBm) +0.

15: Power level view 1 MCUK991001C8 Service Manual Section 6 – 39 – Issue 1 Revision 0 . GSM 1800 shall be calibrated for all power levels PL0 to PL15 for top middle and bottom channels. Panasonic recommends that a power meter capable of measurement to an accuracy of ±0. Figure 6. Set the Channel box controls to Channel 62 at Power Level 14.14: Tx data field 2. At the GSM test unit measure the Peak Power.3).TEST AND MEASUREMENT Calibration of output power on each power level NOTE: To ensure that the telephone operates within set SAR margins. If the measured power is in the range of the target power (see previous table). normal burst modulated with random data as follows: a. Press the down arrow until CHANGE CH <62> is highlighted and then press ENTER. Press the move left arrow until <14> appears in the highlighted field. Press ENTER. To calibrate the ramping gain. Press the down arrow until TX DATA <OFF> is highlighted. Press the down arrow until PL <14> is highlighted. 4. middle and high channels for GSM 900. 3. At the Channel box press F7 to view the TRIM for the mid-channel. This procedure must be followed for all power levels PL5 to PL19. Press ENTER. first switch the unit into Test Mode (Section 6. c. Use of a less accurate power meter may result in the phone failing to meet SAR standards. Press the move arrow until <NRL R> appears in the highlighted field. 1.2 dBm (Hewlett Packard HP8990 or equivalent) is used when calibrating power levels. then proceed to step 10. for low. Figure 6. b.

7.16: Power level view 2 6.Measured Power) x Change per dB (step 5) (table) (step2) (table) Make a note of the result.17: Power level selection 1 Issue 1 Revision 0 Section 6 – 40 – MCUK991001C8 Service Manual . Figure 6. At the Channel box press F6 to program the TRIM for the mid-channel. and make a note of this value. Figure 6. Perform the following calculation and make a note of the result: New Trim value = Old Trim Value + (Required Power .TEST AND MEASUREMENT 5. Select VIEW TRIM PL MCH.

At the GSM test unit re-measure the peak power. Press ESC. Figure 6.TEST AND MEASUREMENT 8. Repeat steps 2 to 11 of this procedure for the remaining power levels. the carrier power must be measured and calibrated at LOW and HIGH channels as described in steps 2 to 14.19: Power level selection 3 10. Repeat steps 2 to 14 for the GSM 1800 settings in the following order: PL10 (limits ±0.2dB).5dB). Power Levels between PL19 and PL14. Calibrate PL5 (limits ±0.18: Power level selection 2 9. Power levels between PL5 and PL1. Power Levels between PL9 and PL6. MCUK991001C8 Service Manual Section 6 – 41 – Issue 1 Revision 0 . in the following order: PL6. 12. PL5 and PL15. PL9 and PL19. Select PROGRAM TRIM PL MCH GSM. Power levels between PL10and PL5. 13. Enter the value calculated in step 6 into the data field and then press ENTER. After calibrating at channel 62. Figure 6. PL1. Power Levels between PL14 and PL9. 14. Highlight the PL14 field and press ENTER. 15. 11. 16.

TEST AND MEASUREMENT Power levels between PL15 and PL10.2dB). Issue 1 Revision 0 Section 6 – 42 – MCUK991001C8 Service Manual .3 and switch the unit into test mode as described. This process must be carried out for LOW/BOTTOM CHANNEL and HIGH/TOP CHANNEL. Apply a carrier frequency of +68KHz to the UUT (for Ch 67 = 948. If the measured value is not -90 ±1 then make the following calculation: RSSI offset value = [-(90+MEASURED RSSI VALUE)] x 2 = [-90-MEASURED RSSI VALUE] x 2. for example [-(90+(-95))] x 2 = [-90-(-95)] x 2 = 10 Record the result. 2.400 MHz) at an input level of -90 dBm. Highlight the RSSI dBm <> field and press ENTER.5. At the Channel box highlight the CHANGE CH <67> field and press ENTER. 5.2 RSSI This procedure describes the calibration of RSSI on the compensation channel (Mch = Ch 67).20: RSSI dB field 6. 4. Power level PL0 (limits ±0. Set up the test equipment as described in Section 6. Figure 6. Highlight the SET AGC 1 field and change the set value to 45 dB and press ENTER. 3. Channel Low/Bottom Mid High/Top GSM900 10 62 105 GSM1800 544 699 885 6. The following channel settings are used in this procedure: 1.

Press ESC. MCUK991001C8 Service Manual Section 6 – 43 – Issue 1 Revision 0 . Figure 6. At the Channel box press F7 to view data. Select TRIM OTHER and make a note of the RSSI COMP GSM reading.22: RSSI reading 2 9.21: RSSI reading 1 8.TEST AND MEASUREMENT 7. Figure 6.

Enter the result into RSSI COMP field for example: 10+ 5 = 15 . Press ESC. Channel Low/Bottom Comp High/Top GSM 900 37 67 95 Issue 1 Revision 0 Section 6 – 44 – MCUK991001C8 Service Manual . 15. Figure 6. Repeat steps 6 to 15 for both LOW/BOTTOM and HIGH/TOP channels.TEST AND MEASUREMENT 10. 14.23: RSSI reading 3 11. Press ENTER. 12. 16. Figure 6. Make the following calculation: RSSI offset value (from step 8) + reading noted in step 6. At the Channel box press F6 to program data. Measure the RSSI level again by highlighting the RSSI dBm field and press ENTER. Select TRIM RSSI and press ENTER.24: RSSI reading 4 13.

Press ENTER.5. Press ENTER. Figure 6. Qch adjustment procedures the transmitter must be set to Power Level 5 (this presents the worst case of non-linearity) so care must be taken that the spectrum analyser used can accept a signal input of 33 dBm. Press the down arrow until TX DATA is highlighted.25: Channel box setup MCUK991001C8 Service Manual Section 6 – 45 – Issue 1 Revision 0 . b.4 MHz RBW = 10 kHz VBW = 10 kHz span = 1 MHz sweep time = 2 sec 1. a. Set the Channel box controls to channel 62 at power level 5. Press the down arrow until PL is highlighted. Press the move arrow until “NRL 1” appears in the highlighted field. 6. Repeat steps 6 to 15 for GSM 1800 on the channels listed below:. Q ch Offsets Spectrum Analyser setup centre frequency = 902. Press the down arrow until CHANGE CH > is highlighted and then press ENTER. Channel Bch Lch Mch Hch Tch GSM 1800 586 681 731 861 878 NOTE: The AGC1 setting for GSM 1800 RSSI calibration should be 51 dBm. If not an appropriate attenuator must be used. I. normal burst modulated with all 1’s. c. d.3 I and Q Values NOTE: With the I.TEST AND MEASUREMENT 17.

TEST AND MEASUREMENT 2.(-9 dBm) = 42 dBm Figure 6. If carrier leakage ratio is greater than 30 dBc then unit is OK. Carrier leakage ratio is measured as the ratio of peak power and the power at 68 kHz below peak frequency. (offset calibration is complete). If carrier leakage ratio less than 30 dBc then go to ‘Ich Gain Caliibration’.468 MHz) = 33 dBm power at 135 kHz below peak power = -9 dBm carrier leakage ratio = 33 dBm . Ich check 1.27: I. Q data field selection 1 Issue 1 Revision 0 Section 6 – 46 – MCUK991001C8 Service Manual . Example: peak power (902. On the spectrum analyser measure the carrier leakage ratio.26: Carrier leakage ratio 3. 4. At the Channel box check Ich offset data by selecting F7 then VIEW TRIM OTHER. Figure 6.

Figure 6. Select Ich OFFSET Figure 6. press F6 to program TRIM OTHER.Q data field selection 2 3.Q data field selection 3 MCUK991001C8 Service Manual Section 6 – 47 – Issue 1 Revision 0 .28: I.TEST AND MEASUREMENT 2.29: I. At the Channel box set Ich offset to 147.

If the original carrier leakage ratio is less than the new carrier leakage ratio go to I Inc Calibration. Issue 1 Revision 0 Section 6 – 48 – MCUK991001C8 Service Manual . 247. Set Ich offset to 127. 3. 227. Using the spectrum analyser measure the new carrier leakage ratio. (offset calibration is complete). 6. 27 and 7. Press move down arrow until QCH OFFSET appears in the field. Q Dec Calibration 1. Enter 147 for Ich OFFSET and press ENTER. I Dec Calibration 1. Set Qch offset to 107 (see Qch Check step 2). Measure the new carrier leakage ratio. 2. If not then repeat steps 1. If the carrier leakage ratio is greater than 30dBc then unit is OK (offset calibration is complete). 4. 67. 3. 6. If the original carrier leakage ratio is less than new carrier leakage ratio then go to Q Inc Calibration. Using the Spectrum Analyser. b. 47. Set Qch offset to 147. 2. 2 and 3 above for Ich offset values: 87.Q data field selection 4 5. If the carrier leakage ratio is greater than 35 dBc the unit is OK. If the carrier leakage ratio is greater than 30dBc then the unit is OK. At the Channel box press F6. c. 5. 4. If the original carrier leakage ration (see I. Press ENTER. If the new carrier leakage ratio is greater than 30dBc then the unit is OK (offset calibration is complete). If not then repeat steps 1. Set Ich offset to 167 (see Ich check step 2). 2. Enter 3 into the data field and press enter. 4. Figure 6. 5. 3. (offset calibration is complete). Qch Check 1. I Inc Calibration 1. 8. If the original carrier leakage ratio (see I. Q ch Offsets step 2) is greater than new carrier leakage ratio then go to Q Dec Calibration. Using the spectrum analyser measure the carrier leakage ratio. If the carrier leakage ratio is still not greater than 30dBc then go to Qch Check. If the carrier leakage ratio is still not greater than 30dBc then go to Qch Check. 207.30: I. a. 5.TEST AND MEASUREMENT 4. measure the new carrier leakage ratio. Set Ich offset to 107 (see Ich Check step 2). 2. Measure carrier leakage ratio.Q OFFSETS step 2) is greater than the new carrier leakage ratio go to I Dec Calibration. 2 and 3 above for Ich offset values: 187. 7.

Press ENTER. 2.4 MHz RBW = 10 kHz VBW = 10 kHz span = 1 MHz sweep time = 2 sec 1. Press the down arrow until TX DATA is highlighted. 7. Example: peak power (902. If image leak ratio is less than 30 dBc then go to Ich gain calibration. 2 and 3 above for Qch offset values: 87. c. b.TEST AND MEASUREMENT 3. (offset calibration is complete). Q Inc Calibration 1. 227. Set Qch offset to 167 (see Qch Check step 2). centre frequency = 902.(-9 dBm) = 42 dBm Figure 6. If image leak ratio is greater than 30 dBc then unit is OK. Spectrum Analyser Setup. Press the move arrow until 1 appears in the highlighted field. 3. Press the down arrow until PL is highlighted. 4. If not then repeat steps 1. 4. 5. 67. I.31: Image leak ratio 3. 2. 27. Qch Gain IMPORTANT: I. If carrier leakage ratio is greater than 35 dBc then unit is OK. Set the Channel box controls to channel 62 at power level 5. Measure carrier leakage ratio. Press the down arrow until CHANGE CH > is highlighted and then press ENTER. 2 and 3 above for Qch offset values:187. 5. 247.468 Mhz) = 33 dBm power at 135 kHz below peak power = -9 dBm image leak ratio = 33 dBm . Qch offset calibration should be done before this calibration. 47. 207. If the carrier leakage ratio is still less than 35 dBc then unit is a fail. If the carrier leakage ratio is greater than 35 dBc then unit is OK. Press ENTER. (offset calibration is complete). (offset calibration is complete). normal burst modulated with all 1’s. MCUK991001C8 Service Manual Section 6 – 49 – Issue 1 Revision 0 . a. Image leak ratio is the measured ratio of peak power and the power at 135 kHz below peak frequency. If carrier leakage ratio is less than 35 dBc then repeat steps 1. 4. If carrier leakage ratio is less than 35 dBc then unit is a fail. Using the spectrum analyser measure the image leak ratio.

At the Channel box highlight the CHG CH (GSM900 or GSM1800) field and set the required test channel.5 Simple Transmitter Test The following procedure gives a method by which the Unit Under Test (UUT) can be placed into a condition allowing the service technician to probe the entire transmit RF path. a. 3. Issue 1 Revision 0 Section 6 – 50 – MCUK991001C8 Service Manual . Highlight the PL field and set the required test power level. Perform the following steps: 1. 3.3 field and enter the required gain value.TEST AND MEASUREMENT IQch Gain Calibration 1.2. Press ENTER. Enter 1 (for -0. Press ENTER. 4. Highlight the TX_DATA field and select the required modulation type and data. If image leak ratio is greater than 30 dBc then unit is OK. 2 and 3 above with IQch gain values: -0. Perform the following steps: 1. Measure the image leak ratio. At the GSM test unit input an RF signal at the required frequency and level. The UUT is now in the required state to allow probing of the transmit RF path. 4. Input level and frequency can also be specified. (offset calibration is complete) If image leak ratio is less than 30 dBc then repeat steps 1. Highlight the SET AGC 1. 2.25 dB) into the data field. To perform the following procedure the UUT must first be placed into Test Mode. 5.5. 6. b. 5.25 dB. On the Channel box press F6. Press ENTER.75 dB (enter ‘3’). 2. Press ENTER. 6. Set IQch gain to -0. Press move left arrow until IQCH GAIN field is highlighted. Press ENTER.5.50 dB (enter ‘2’). Input level and frequency can also be specified. If image leak ratio is still less than 30 dBc then the unit is a fail. 3. The unit has now been placed in a state which will allow the received signal path to be monitored. 2. c. To perform the following procedure the UUT must first be placed into Test Mode. 6.4 Simple Receiver Test The following procedure gives a method by which the Unit Under Test (UUT) can be placed into a condition allowing the service technician to probe the entire receive RF path. and select TRIM OTHER. Press ENTER. At the Channel box highlight the CHG CH (GSM900 or GSM1800) field and set the required test channel. and -0.

Press [F6]. record the value for later use. and select: "TRIM Other" again. test battery. If the value is outside the range 390 and 428. 10. "TEST SET TEST MODE" should be displayed in the phone display. and select: "TRIM Other" again. Leave the power supply switched OFF and set the MODE or EXT PWR switch to OFF. 2. then [enter]. Temperature Calibration 1. 6. Press [F6]. Set the BCVCU output to 3. 2. Otherwise. then [enter]. and select: "TRIM Other". Press [F6]. and select: "VIEW ADC LINES".1 V (centre position on switch) and set the 82 Ohm switch to OFF. MCUK991001C8 Service Manual . A Battery Calibration Voltage Control Unit (BCVCU) is used to provide the necessary voltage levels for these checks. "VIEW ADC LINES".1 V. 5. [enter]. Select and run the Channel Box software in ‘Test Mode’. Enter value from step 8 above. If the ADC data is not already being displayed. 4. Press [F10] and power the phone on. 7. Section 6 – 51 – Issue 1 Revision 0 4. Enter the value recorded in step 3. voltage.6 Battery Charging & Calibration There are three procedures to calibrating the battery. 6. Go to.TEST AND MEASUREMENT 6. Ensure that the BCVCU output is set to 4. 11. If reading is outside the range 803 and 723. Record this value for use below. Otherwise. Look at the value for ADIN3 (BAT TEMP). Preliminaries 1. 8. temperature and charging calibration. Go to.5. and select: "BAT TEMP". Otherwise. record the value for later use.0 V. Look at ADIN1 (BAT VOLT) reading. Press "[Y]" [enter] on the PC to re-read ADC Data. Look at ADIN1 (BAT VOLT) reading again. 5. The BCVCU replaces the two regulated power supplies and 82 Ohm resistor required to calibrate previous mobile phone products. Press [N] (in repeat yes/no box). Connect the mobile phone. and select: "BAT VOLT HIGH". Enter value from step 5 above.2 V. Voltage Calibration 1. Go to. then there is a fault and further investigation is required. press [F4].32: Battery Calibration Test Connections 2. and select: "BAT VOLT LOW". calculate the difference between the reading and the theoretical value of 409. This reading is "BAT VOLT HIGH". Go to. If the reading is not within the range 518 and 598. 3. then there is a fault and further investigation is required. Go to. BCVCU and Interface Box as shown in the diagram below. Figure 6. then there is a fault and further investigation is required. 9. Press [F4] on the PC. 3. Set the BCVCU output to 4. Press [N] (in repeat yes/no box). This reading is "BAT VOLT LOW". Go to.1 volts. Set the Interface Box to output to 7. Go to. Set the BCVCU to 4.

24."DAC Reference".171. 6. present value +200). (“ACK” should be displayed on the PC screen. 9. Ensure that the BCVCU output is set to 4. the example from step 6 would produce a value of: 714 . 28.200. is inside the range 255 .33: Modification to Interface Cable JT00004 1. 3. Press [N] (in repeat yes/no box). Go to. Use ←→ arrows to highlight and select "CRG ON".5 7. Measure VBAT voltage at the test battery. step 5) . Otherwise store the value as described below. 2. Read ADIN5 (CRG CURRENT) value and record it as "Total current". Go to. Enter:. Enter the final DAC data value from step 10. For example.) Disconnect VBAT by switching the BCVCU output to OFF. then [enter]."View ADC Lines". highlight "Control out". 12. Press [F6]. . and select:. 17. Enter the value calculated by subtracting the difference value recorded in step 6 from the DAC Data value (714). Highlight and select "DAC Step". Go to. Issue 1 Revision 0 Section 6 – 52 – MCUK991001C8 Service Manual 5.1) / 0. Press [F4]."Trim Other". modified as shown in the diagram below.5 or 718 . Otherwise. 4.value read above]. Press {shift} + [F4]."Set DAC Data". and select:. Highlight. Repeat steps 6 to 8 until the measured voltage is 4. If ["BAT VOLT HIGH" (from Voltage Calibration.1 V output and the MODE or EXT_PWR switch set to ON. for a measured voltage of 4. then it may be necessary to re-power the telephone and start the Charging Calibration procedure again from step 1. Type a value of 714. 21. Using arrows ↑↓. If it is not displayed. 20. Otherwise there is a fault and further investigation is required. Re-enter original value from step 10 (i.View ADC lines. 29. and select:. then go to step 20 (below) to store value. set the 82 Ohm switch to OFF. Press {shift}+[F4]. Go to.e. 8.4. and select:. Press {shift}+[F4]. and select:. 14. 26.1 V ± 5 mV then go to step 11 below. 23. and select: "Set DAC Data".0057 = difference. 25. Select: "Set DAC Data". 19.4. Read value for ADIN1 ("BAT VOLT"). Press [F6]. and select: "Set DAC Data". As an example. This value must be an integer.1)/0. Set the 82 Ohms switch ON. Press {shift}+[F4]. 22. [enter]. calculate the difference thus:. Highlight and select "Trim Other". Press [F4]. Figure 6.0057 = -3.5) = 717. 27. Go to. then there is a fault and further investigation is required. 15. to allow EXT_PWR to be fed via pin 9 of the D-TYpe connector to the phone connector. If the voltage is inside the range 4.08 V the difference will be: (4. 13.08 .(value stored in step 12) . If the final value for DAC Data is outside the range 614 ± 814. On the BCVCU. Go to. 16.TEST AND MEASUREMENT Charging Calibration NOTE: The charging calibration procedure requires an interface cable (part number JT00004). Enter value obtained in step 19.(-3. 11.(measured voltage . 18.1 V ± 5 mV 10.

and select:. [enter] to read ADC value again.TEST AND MEASUREMENT 30. Press [F6] 33.43. Press [Y].34: View lock code 1 2. then there is a fault and further investigation is required. Figure 6. 31. Press ENTER. Enter the offset value calculated in step 31."Phone current"). Press [N] (in repeat yes/no box). 32. and select:. Figure 6. Go to.2.1 for a list of the equipment and setup procedures required to perform the following adjustment and calibration procedures."TRIM other". 34. To perform the following procedures the UUT must be placed into Test Mode.6. Press [F9]."Charging current" .1 Check current lock code 1. calculate the offset thus:. turn OFF power supplies and remove the telephone. Go to. 6. If this outside the range 37 and 49.35: View lock code 2 MCUK991001C8 Service Manual Section 6 – 53 – Issue 1 Revision 0 . wait for the prompt “Saving EV Trim Data” to disappear. 6. then [enter]. Calculate the Charge current ("Total current" . The display will show the current lock status and lock code for the Unit Under Test. At the Channel box press F4 and highlight VIEW LOCK CONDITION. and record it as "Phone current"."Complete offset". 35.6 Lock Code NOTE: See Section 6. Otherwise.

2 Change current lock code 1. 2. At the Channel box press SHIFT and F4 and highlight PROG LOCK CONDITION. Press ENTER to unlock the Unit Under Test. The current lock code will be used.36: Change program lock code 3. Press ENTER.6. Issue 1 Revision 0 Section 6 – 54 – MCUK991001C8 Service Manual . Figure 6. Enter “0000” to reset and lock the Unit Under Test to the factory default lock code “0000”.TEST AND MEASUREMENT 6.

3) 10164-1 MCUK991001C8 Service Manual Section 7 – 55 – Issue 1 Revision 0 .2) RF (Figure 7.1 Main PCB: Top Level Diagram BASEBAND (Figure 7.CIRCUIT DIAGRAMS 7 CIRCUIT DIAGRAMS 7.

CIRCUIT DIAGRAMS 7.2 Main PCB: Baseband Overview PSU (Figure 7.6) 10165-1 Issue 1 Revision 0 Section 7 – 56 – MCUK991001C8 Service Manual .5 AUDIO (Figure 7.4) PROCESSOR Figure 7.

3 Main PCB: RF Overview RECEIVER & Tx MODULATOR (Figure 7.9) TRANSMITTER (Figure 7.7) PSU & SYNTHESIZER (Figure 7.8) 10166-1 MCUK991001C8 Service Manual Section 7 – 57 – Issue 1 Revision 0 .CIRCUIT DIAGRAMS 7.

4 Main PCB: PSU Issue 1 Revision 0 Section 7 – 58 – MCUK991001C8 Service Manual .CIRCUIT DIAGRAMS 7.

5 Main PCB: Processor MCUK991001C8 Service Manual Section 7 – 59 – Issue 1 Revision 0 .CIRCUIT DIAGRAMS 7.

3. 2. R601: CHANGE OF VALUE. COMPONENTS SHOWN WITHIN BOX AREA (LEFT) ARE FITTE GD50 BUILD ONLY Issue 1 Revision 0 Section 7 – 60 – MCUK991001C8 Service Manual . 4.6 Main PCB: Audio SEE NOTES FOR GD50 BUILD: 1.CIRCUIT DIAGRAMS 7. CAPACITOR C602 FITTED INSTEAD OF R609. CAPACITOR C601 FITTED INSTEAD OF R608.

CIRCUIT DIAGRAMS 7.7 Main PCB: Receiver and Tx Modulator MCUK991001C8 Service Manual Section 7 – 61 – Issue 1 Revision 0 .

8 Main PCB: Transmitter N/F N/F N/F N/F = NOT FITTED Issue 1 Revision 0 Section 7 – 62 – MCUK991001C8 Service Manual .CIRCUIT DIAGRAMS 7.

CIRCUIT DIAGRAMS 7.9 Main PCB: PSU and Synthesizer MCUK991001C8 Service Manual Section 7 – 63 – Issue 1 Revision 0 .

10Keypad PCB Issue 1 Revision 0 Section 7 – 64 – MCUK991001C8 Service Manual .CIRCUIT DIAGRAMS 7.

1 Main PCB A B C D E F 2 3 4 N/F 1 10171-1 MCUK991001C8 Service Manual Section 8 – 65 – Issue 1 Revision 0 .LAYOUT DIAGRAMS 8 LAYOUT DIAGRAMS 8.

LAYOUT DIAGRAMS 8.2 Keypad PCB A B C D E F 1 2 3 4 10172-1 Issue 1 Revision 0 Section 8 – 66 – MCUK991001C8 Service Manual .

6 x 6mm " " " " " " BATTERY HOOK BATTERY SPRING RECEIVER RETAINER RECEIVER MICROPHONE ASSEMBLY ANTENNA VIBRATE MOTOR ASSEMBLY Ref A A A Part Number GD30CVR01B GD30CVR01K GD30CVR01S Description GD30 Cover (Service) Blue GD30 Cover (Service) Black GD30 Cover (Service) Silver GD30 COVER.) consists of: M101 1GA532AA** M104 6HA623A M105 2QA543A M110 6HA617A B GD30CAS01 consists of: M102 1HA519B M126 6HA661A M129 6HA567A MCUK991001C8 Service Manual Section 9 – 67 – Issue 1 Revision 0 . CONN.1: GD30 Case Parts Ref M103 M106 M108 M109 M114 M115 M116 M117 M118 M119 M122 M123 M127 002 005 012 013 Part Number 2EA551AA 2BA517BAAA 6RA507A G5MDS002C 4GA545A 4GA543A 3Z70054B " " " 2AA502A 4N70042A 2RA506AACA HH76009A 9ZA652A AN76031A BD76013A Description LCD PANEL.1 Case Parts and Sub-Assemblies 9. M1. ANT.1.9 REPLACEMENT PARTS LIST 9.1 GD30 Case Parts Figure 9. STD PANASONIC KEYPAD CAP PATENT LABEL ANTENNA NUT ANTENNA TERMINAL SCREW. COLOURED RECEIVER CUSHION INDICATOR LCD CUSHION Case Assembly (Service) GD30/GD50 CASE BACK BUZZER CUSHION CUSHION (EXT.

1. M1. CONN.) A consists of: M101 1GA539AA** M104 6HA654A M105 2QA555A M110 6HA617A B GD30CAS01 consists of: M102 1HA519B M126 6HA622A M129 6HA567A Issue 1 Revision 0 Section 9 – 68 – MCUK991001C8 Service Manual .6 x 6mm " " " " " " BATTERY HOOK BATTERY SPRING RECEIVER RETAINER RECEIVER MICROPHONE ASSEMBLY ANTENNA VIBRATE MOTOR ASSEMBLY Ref Part Number GD50CVR01B GD50CVR01K GD50CVR01N GD50CVR01Y Description GD50 Cover (Service) Blue GD50 Cover (Service) Black GD50 Cover (Service) Green GD50 Cover (Service) Grey GD50 COVER.2: GD50 Case Parts Ref M103 M106 M108 M109 M114 M115 M116 M117 M118 M119 M122 M123 M127 002 005 012 013 Part Number 2EA563AA 2BA518AA 6RA507A G5MDS002C 4GA545A 4GA543A 6FA513A " " " 2AA502A 4N70042A 2RA516B HH76002A 9ZA652A AN76031A BD76013A Description LCD PANEL.REPLACEMENT PARTS LIST 9. ANT. STD PANASONIC KEYPAD CAP PATENT LABEL ANTENNA NUT ANTENNA TERMINAL SCREW.2 GD50 Case Parts Figure 9. COLOURED RECEIVER CUSHION INDICATOR LCD CUSHION Case Assembly (Service) GD30/GD50 CASE BACK BUZZER CUSHION CUSHION (EXT.

7.6 x 6mm 6FA513A (GD50) " " EB-QB03D30UK LCD MODULE (see Sect.3: GD30/GD50 Sub-Assemblies Ref M113 M120 M121 001 Part Number Description Ref B Part Number Description 2FA525A CHASSIS 3Z70054B (GD30) SCREW M1.1.2.2) Main PCB Assembly BUZZER SIM HOLDER I/O CONNECTOR RF CONNECTOR MAIN PCB-TO-KEYBOARD PCB CONNECTOR BATTERY CONTACT BACKUP BATTERY HOLDER. BACKUP BATTERY includes: 003 HB76004B 004 JS8A00005 010 JA76020B 011 PY76011B 014 PY76018A 015 016 018 019 JJ76002A ML616S K3ZZ00200009 A GD30KPCB01 Keypad PCB Assembly LCD CONNECTOR includes: 006 K1MZ14A00001 007 MCUK991001C8 Service Manual Section 9 – 69 – Issue 1 Revision 0 .3 GD30 and GD50 Sub-Assemblies Figure 9.9.

1 Main PCB: Variants Model: EB-GD30 & EB-GD50 Part Number Ref.F.N PROGRAM MAIN PCB MOBILCOM PROGRAM MAIN PCB TELSTRA PROGRAM MAIN PCB E. C101 C102 C103 C104 C105 C106 C107 C108 C109 C110 C111 C112 C113 C114 C115 C116 C117 C118 C119 C120 C122 C123 C124 C125 C127 C128 C129 C130 C131 C132 Part Number F1H1A4740005 ECUE1H330JCQ F1H1A4740005 F1H1A4740005 F1H1A4740005 F1G1A104A012 F1G1A104A012 ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ F1G1A104A012 F1H1A4740005 F1H1A4740005 F1H1A4740005 ECUE1H102KBQ ECUE1H102KBQ ECUE1H331KBQ ECUE1H330JCQ ECUE1H330JCQ F1H1A4740005 ECUE1H102KBQ ECUE1H101JCQ ECUE1C103KBQ ECUE1H040CCQ ECUE1C103KBQ ECUE1H330JCQ ECUE1H030CCQ ECUE1C103KBQ ECUE1H101JCQ Name: Main PCB (Common Items) Description CAP CER 470nF 10% 10V X5R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 470nF 10% 10V X5R SMD CAP CER 470nF 10% 10V X5R SMD CAP CER 470nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 100nF 10% 10V X5R SMD CAP CER 470nF 10% 10V X5R SMD CAP CER 470nF 10% 10V X5R SMD CAP CER 470nF 10% 10V X5R SMD CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 330pF 10% 50V X7R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 470nF 10% 10V X5R SMD CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 4pF +/-0.R PROGRAM MAIN PCB WESTEL PROGRAM MAIN PCB HUTCHISON PROGRAM MAIN PCB PLUS GSM PROGRAM MAIN PCB TURKCELL PROGRAM MAIN PCB FRANCETEL PROGRAM MAIN PCB FT FTMS PROGRAM MAIN PCB TELESTET PROGRAM MAIN PCB ACTIVA PROGRAM MAIN PCB TMN PROGRAM MAIN PCB PANNON PROGRAM MAIN PCB VODACOM PROGRAM MAIN PCB NETCOM PROGRAM MAIN PCB K.2.2 Printed Circuit Boards (PCBs) 9.2.25pF 50V NP0 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 3pF +/-0.9.2 Main PCB: Common Items Model: EB-GD30 & EB-GD50 Ref.A PROGRAM MAIN PCB PAYT VODAFONE PROGRAM MAIN PCB CHINESE ENABLED PROGRAM Description Name: Main PCB (Variants) 9. GD30 003 003 003 003 003 003 003 003 003 003 GD30BRD001 GD30BRD002 GD30BRD003 GD30BRD004 GD30BRD005 GD30BRD006 GD30BRD007 GD30BRD008 GD30BRD009 GD30BRD010 GD30BRD011 GD30BRD012 GD30BRD013 GD30BRD014 GD30BRD015 GD30BRD016 GD30BRD017 GD30BRD018 GD30BRD019 GD30BRD020 GD30BRD021 GD30BRD022 GD30BRD023 GD30BRD024 GD30BRD025 GD50 GD50BRD001 GD50BRD002 GD50BRD003 GD50BRD004 GD50BRD005 GD50BRD006 GD50BRD007 GD50BRD008 GD50BRD009 GD50BRD010 GD50BRD011 GD50BRD012 GD50BRD013 GD50BRD014 GD50BRD015 GD50BRD016 GD50BRD017 GD50BRD018 GD50BRD019 GD50BRD020 GD50BRD021 GD50BRD022 GD50BRD023 GD50BRD024 GD50BRD025 MAIN PCB STANDARD PROGRAM MAIN PCB BINARING PROGRAM MAIN PCB CELCOM PROGRAM MAIN PCB AIRTEL PROGRAM MAIN PCB EUROTEL PROGRAM MAIN PCB MOVISTAR PROGRAM MAIN PCB S.25pF 50V NP0 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 100pF 5% 50V NP0 SMD 1 E2 E2 E2 C2 C2 C2 C2 D4 D4 D4 C4 C4 Grid F2 F2 F2 E2 F2 F2 F1 F2 F2 E2 F2 F1 F2 F2 F1 F1 F2 Issue 1 Revision 0 Section – 70 – MCUK991001C8 Service Manual REPLACEMENT PARTS LIST 003 003 003 003 003 003 003 003 003 003 003 003 003 003 003 .R.P.

3V SMD CAS CAP CER 470nF 10% 10V X5R SMD CAP CER 470nF 10% 10V X5R SMD CAP CER 100nF 10% 16V X7R SMD CAP CER 100nF 10% 16V X7R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP TANT 0. C133 C135 C136 C137 C138 C139 C140 C141 C142 C401 C402 C403 C404 C405 C407 C408 C409 C410 C411 C412 C413 C414 C415 C416 C417 C501 C502 C503 C505 C506 C507 Part Number ECUE1H102KBQ ECUE1E271KBQ ECUE1C103KBQ ECUE1C103KBQ ECUE1H101JCQ ECUE1C103KBQ ECUE1H102KBQ ECUE1H101JCQ ECUE1C103KBQ ECJ1VB1C104K F1H1A4740005 ECUE1H102KBQ F1G1A104A012 F1G1A104A012 ECUE1H102KBQ F1G1A104A012 F3E0J1060006 F3E0J1060006 F3F1A1060002 YTAJB336M006 YTAJB336M006 ECST1CZ474R F3E0J1060006 F1H1A4740005 F1H1A4740005 ECJ1VB1C104K ECJ1VB1C104K ECUE1H330JCQ ECST1CZ474R F3F1A1060002 F1G1A104A012 Name: Main PCB (Common Items) Description CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 270pF 10% 25V X7R SMD CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 100nF 10% 16V X7R SMD CAP CER 470nF 10% 10V X5R SMD CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 100nF 10% 10V X5R SMD CAP TANT 10uF 20% 6. C508 C509 C510 C511 C512 C513 C514 C515 C516 C517 C518 C519 C520 C521 C522 C523 C524 C525 C526 C527 C528 C529 C530 C531 C532 C533 C603 C604 C605 C606 C607 Part Number F1G1A104A012 F1G1A104A012 F3E0J1060006 F1H1A4740005 F3E0J1060006 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1H1A4740005 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 F1G1A104A012 ECJ1VB1C104K ECUE1H330JCQ ECUE1H100DCQ ECUE1H330JCQ ECUE1H100DCQ ECUE1H330JCQ Name: Main PCB (Common Items) Description CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP TANT 10uF 20% 6.47uF 20% 16V SMD CA CAP TANT 10uF 20% 10V SMD CASE CAP CER 100nF 10% 10V X5R SMD D1 D1 E2 D1 D1 D1 D1 B3 B3 E1 E1 E1 E1 E1 F1 F1 E1 F1 E2 E2 F1 E1 D2 D2 D2 C4 D4 Grid C4 C4 Model: EB-GD30 & EB-GD50 Ref.5pF 50V NP0 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 33pF 5% 50V NP0 SMD 10 F1 C2 C2 C2 C2 C2 Grid B4 C4 C3 C3 B4 B4 C3 E2 E2 E2 E2 E2 E2 E1 D2 E1 E2 E2 E2 B3 E1 B4 C3 REPLACEMENT PARTS LIST C3 .MCUK991001C8 Service Manual Section – 71 – Issue 1 Revision 0 Model: EB-GD30 & EB-GD50 Ref.3V SMD CAS CAP CER 470nF 10% 10V X5R SMD CAP TANT 10uF 20% 6.3V SMD CAS CAP TANT 10uF 20% 6.3V SMD CAS CAP TANT 10uF 20% 10V SMD CASE CAP TANT 33uF 20% 6V3 SMD CASE CAP TANT 33uF 20% 6V3 SMD CASE CAP TANT 0.3V SMD CAS CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 470nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 10V X5R SMD CAP CER 100nF 10% 16V X7R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 10pF +/-0.47uF 20% 16V SMD CA CAP TANT 10uF 20% 6.

25pF 50V NP0 CAP CER 1pF +/-0.5pF 50V NP0 CAP TANT 10uF 20% 6.25pF 50V NP CAP CER 3pF +/-0.5pF 50V NP0 Grid E3 A1 B1 B1 B1 B1 B1 B1 F3 F3 B1 B1 B1 B1 B1 B1 B1 E4 F3 E4 A1 B2 B1 B1 F3 A1 A1 F3 B2 F3 A1 .3V SMD CAS CAP CER 100nF 10% 10V X5R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33nF 10% 10V X5R SMD 1 CAP CER 33nF 10% 10V X5R SMD 1 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 22nF 10% 16V X7R SMD 1 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 390pF 10% 50V X7R SMD CAP CER 470pF 10% 50V X7R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 2pF +/-0.25pF 50V NP0 CAP CER 10pF +/-0. C608 C618 C619 C620 C621 C622 C623 C624 C625 C626 C627 C628 C700 C701 C702 C703 C704 C705 C706 C707 C708 C709 C710 C711 C712 C715 C716 C717 C718 C721 C722 Part Number ECUE1H100DCQ ECST0JZ106R F1G1A104A012 ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ YCCIX024K333 YCCIX024K333 ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ YCCIX027K223 ECUE1H330JCQ ECUE1H391KBQ ECUE1H471KBQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1C103KBQ ECUE1H020CCQ ECUE1H010CCQ ECUE1H220JCQ ECUE1H020CCQ ECUE1H220JCQ ECUE1H470JCQ ECUE1H101JCQ ECUE1C103KBQ ECUE1H220JCQ ECUE1H330JCQ ECUE1H010CCQ ECUE1H040CCQ Name: Main PCB (Common Items) Description CAP CER 10pF +/-0.5pF +/-0.25pF 50V NP0 CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 47pF 5% 50V NP0 SMD 10 CAP CER 2pF +/-0.25pF 50V NP0 A4 E2 E2 E2 F2 F2 F2 F2 B1 B1 E3 B1 B1 B1 B1 E3 E3 B1 B1 B1 B1 B1 B1 B1 B1 B1 E3 Grid C2 F2 F2 Model: EB-GD30 & EB-GD50 Ref.5pF 50V NP0 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 10pF +/-0.25pF 50V NP0 CAP CER 8pF +/-0.25pF 50V NP0 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 2pF +/-0.5pF 50V NP0 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 100nF 10% 10V X5R SMD CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 47pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 10pF +/-0.Issue 1 Revision 0 Section – 72 – MCUK991001C8 Service Manual REPLACEMENT PARTS LIST Model: EB-GD30 & EB-GD50 Ref.25pF 50V NP0 CAP CER 4pF +/-0. C723 C724 C725 C728 C729 C733 C734 C735 C736 C737 C738 C739 C740 C743 C744 C745 C748 C749 C750 C751 C752 C753 C754 C755 C760 C761 C762 C763 C764 C766 C767 Part Number ECUE1H040CCQ ECUE1H101JCQ ECUE1H220JCQ ECUE1H0R5CCQ ECUE1H030CCQ ECUE1H080DCQ ECUE1H470JCQ ECUE1H330JCQ ECUE1H101JCQ ECUE1H220JCQ ECUE1H020CCQ ECUE1H102KBQ ECUE1H330JCQ ECUE1H102KBQ ECUE1H330JCQ ECUE1H470JCQ ECUE1H020CCQ ECUE1H100DCQ ECUE1H330JCQ ECUE1H100DCQ ECUE1H330JCQ F1G1A104A012 ECUE1H220JCQ ECUE1H470JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H101JCQ ECUE1H100DCQ Name: Main PCB (Common Items) Description CAP CER 4pF +/-0.5pF 50V NP0 S CAP CER 47pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 2pF +/-0.25pF 50V NP0 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 47pF 5% 50V NP0 SMD 10 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 1pF +/-0.25pF 50V NP0 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 0.

25pF 50V NP0 CAP CER 2pF +/-0.MCUK991001C8 Service Manual Section – 73 – Issue 1 Revision 0 Model: EB-GD30 & EB-GD50 Ref.3V SMD CAS CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP TANT 4.7pF +/-0. C768 C769 C770 C771 C772 C773 C774 C775 C778 C779 C780 C781 C782 C783 C784 C785 C786 C787 C788 C789 C801 C802 C803 C804 C805 C806 C807 C808 C809 C811 C814 Part Number F1H1A4740005 ECUE1H102KBQ ECUE1H330JCQ ECUE1H100DCQ ECUE1H390JCQ ECUE1H181JCQ ECUE1H181JCQ ECUE1C103KBQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H471KBQ ECUE1H100DCQ ECJ1VB1E273K ECUE1H101JCQ ECUE1H010CCQ ECUE1H471KBQ ECUE1H090DCQ F1H1A4740005 ECUE1H470JCQ ECUE1C103KBQ ECUE1H220JCQ ECUE1H151JCQ ECUE1H151JCQ ECUE1H020CCQ ECUE1H020CCQ ECUE1H2R7CCQ ECUE1H030CCQ ECUE1H820JCQ ECUE1H820JCQ ECUE1H330JCQ Name: Main PCB (Common Items) Description CAP CER 470nF 10% 10V X5R SMD CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 2pF +/-0.5pF 50V NP0 CAP CER 39pF 5% 50V NP0 SMD 10 CAP CER 180pF 5% 50V X7R SMD 1 CAP CER 180pF 5% 50V X7R SMD 1 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 470pF 10% 50V X7R SMD CAP CER 10pF +/-0.25pF 50V NP0 CAP CER 82pF 5% 50V NP0 SMD 10 CAP CER 82pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 Grid E4 E4 E4 A1 B2 B2 B2 B2 B2 E4 E4 B1 E3 B2 E3 B1 E3 B1 E4 E4 F4 F4 F3 F4 F3 F3 F3 F3 F4 F4 B2 Model: EB-GD30 & EB-GD50 Ref.25pF 50V NP CAP CER 3pF +/-0.7uF 20% 16V SMD CAS CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 47pF 5% 50V NP0 SMD 10 CAP CER 3pF +/-0.5pF 50V NP0 S CAP CER 470nF 10% 10V X5R SMD CAP CER 47pF 5% 50V NP0 SMD 10 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 150pF 5% 50V NP0 SMD 1 CAP CER 150pF 5% 50V NP0 SMD 1 CAP CER 2pF +/-0.5pF 50V NP0 CAP CER 27nF 10% 25V X7R SMD 1 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 1pF +/-0.3V SMD CAS CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 22pF 5% 50V NP0 SMD 10 Grid B2 A1 A1 A1 A2 A2 E4 B2 B2 E4 E4 E4 F3 B2 C1 C2 D4 D4 C2 C1 C1 B2 C1 REPLACEMENT PARTS LIST C1 C1 B1 C1 C1 C1 C1 C1 .25pF 50V NP0 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 10pF +/-0. C815 C816 C820 C821 C822 C823 C824 C825 C826 C827 C832 C833 C834 C835 C900 C901 C902 C903 C904 C906 C907 C908 C909 C910 C911 C912 C913 C914 C915 C916 C917 Part Number F3F1A1060002 ECUE1H220JCQ F3F1A1060002 ECUE1H120JCQ ECUE1H220JCQ ECUE1H220JCQ ECUE1H330JCQ ECUE1H030CCQ ECUE1H220JCQ ECUE1H220JCQ ECUE1C103KBQ ECUE1H100DCQ ECUE1H330JCQ ECUE1H020CCQ ECUE1H330JCQ ECST0JZ106R ECUE1H330JCQ ECUE1H330JCQ F3F1C475A004 ECUE1H330JCQ ECUE1H220JCQ ECUE1H470JCQ ECUE1H030CCQ ECUE1C103KBQ ECST0JZ106R ECUE1H220JCQ ECUE1H330JCQ ECUE1C103KBQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H220JCQ Name: Main PCB (Common Items) Description CAP TANT 10uF 20% 10V SMD CASE CAP CER 22pF 5% 50V NP0 SMD 10 CAP TANT 10uF 20% 10V SMD CASE CAP CER 12pF 5% 50V NP0 SMD 10 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 3pF +/-0.25pF 50V NP0 CAP CER 2.25pF 50V NP0 CAP CER 33pF 5% 50V NP0 SMD 10 CAP TANT 10uF 20% 6.25pF 50V NP0 CAP CER 470pF 10% 50V X7R SMD CAP CER 9pF +/-0.25pF 50V NP0 CAP CER 10nF 10% 16V X7R SMD 1 CAP TANT 10uF 20% 6.

5pF 50V NP0 CAP CER 12pF 5% 50V NP0 SMD 10 CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 12pF 5% 50V NP0 SMD 10 SUPPRESSOR ESD 4 ELEMENTS SMD SUPPRESSOR ESD 4 ELEMENTS SMD SUPPRESSOR ESD 4 ELEMENTS SMD Grid C2 C2 C2 C2 C2 C2 C2 C2 C2 C2 C1 C2 C2 F4 F4 F4 E4 E3 C1 E3 D4 E4 D4 C1 D4 E3 E3 E3 A3 A4 A3 .8nF 10% 16V X7R SMD CAP CER 120pF 5% 50V NP0 SMD 1 CAP CER 3. C918 C919 C920 C921 C922 C923 C924 C925 C926 C928 C929 C930 C931 C932 C933 C934 C935 C936 C937 C938 C939 C940 C941 C942 C944 C945 C946 C947 C948 C949 C950 Part Number ECUE1H470JCQ F3F1C475A004 ECUE1H101JCQ ECST0JZ106R ECUE1H470JCQ ECUE1H220JCQ F3F1C475A004 ECUE1H330JCQ ECUE1H330JCQ ECUE1H102KBQ ECUE1H330JCQ ECST0JZ106R F1G1A104A012 ECUE1H330JCQ ECUE1C103KBQ ECUE1H030CCQ ECUE1C103KBQ ECST0JZ106R ECUE1H330JCQ ECUE1H220JCQ ECUE1H470JCQ F3F1C475A004 ECUE1C103KBQ ECUE1H330JCQ ECUE1H121JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1C682KBQ ECUE1H121JCQ ECUE1E332KBQ Name: Main PCB (Common Items) Description CAP CER 47pF 5% 50V NP0 SMD 10 CAP TANT 4. C951 C952 C953 C954 C955 C956 C957 C959 C960 C961 C962 C964 C965 C966 C967 C968 C969 C970 C971 C972 C973 C974 C975 C976 C977 C978 C979 C980 D101 D102 D103 Part Number ECUE1H220JCQ ECJ1VB1H103K F1H1C4730003 ECUE1H221JCQ ECUE1H391KBQ ECUE1H102KBQ ECST0JZ106R F1G1A104A012 ECST0JZ106R ECUE1H330JCQ ECUE1H330JCQ ECHU1C333JB5 ECUE1H681KBQ ECUE1H330JCQ ECUE1H101JCQ ECUE1H101JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H330JCQ ECUE1H220JCQ ECUE1H060DCQ ECUE1H330JCQ ECUE1H020CCQ ECUE1H100DCQ ECUE1H120JCQ ECUE1H102KBQ ECUE1H120JCQ B0KB00000010 B0KB00000010 B0KB00000010 Name: Main PCB (Common Items) Description CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 10nF 10% 50V X7R SMD 1 CAP CER 47nF 10% 16V X7R SMD 1 CAP CER 220pF 5% 50V NP0 SMD 1 CAP CER 390pF 10% 50V X7R SMD CAP CER 1nF 10% 50V X7R SMD 10 CAP TANT 10uF 20% 6.3V SMD CAS CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 47pF 5% 50V NP0 SMD 10 CAP TANT 4.3V SMD CAS CAP CER 100nF 10% 10V X5R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 3pF +/-0.3nF 10% 25V X7R SMD Grid C1 C1 D4 C1 C1 C1 C1 C1 C1 D4 C2 D4 D4 D4 D4 D4 B2 B2 B2 B2 B2 B2 B2 B2 D4 D4 D4 D4 C2 C2 C2 Model: EB-GD30 & EB-GD50 Ref.7uF 20% 16V SMD CAS CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 1nF 10% 50V X7R SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP TANT 10uF 20% 6.7uF 20% 16V SMD CAS CAP CER 100pF 5% 50V NP0 SMD 1 CAP TANT 10uF 20% 6.3V SMD CAS CAP CER 47pF 5% 50V NP0 SMD 10 CAP CER 22pF 5% 50V NP0 SMD 10 CAP TANT 4.3V SMD CAS CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP FILM 33nF 5% 16V SMD 3216 CAP CER 680pF 10% 50V X7R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 100pF 5% 50V NP0 SMD 1 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 6pF +/-0.7uF 20% 16V SMD CAS CAP CER 10nF 10% 16V X7R SMD 1 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 120pF 5% 50V NP0 SMD 1 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 6.3V SMD CAS CAP CER 100nF 10% 10V X5R SMD CAP TANT 10uF 20% 6.25pF 50V NP0 CAP CER 10pF +/-0.Issue 1 Revision 0 Section – 74 – MCUK991001C8 Service Manual REPLACEMENT PARTS LIST Model: EB-GD30 & EB-GD50 Ref.25pF 50V NP0 CAP CER 10nF 10% 16V X7R SMD 1 CAP TANT 10uF 20% 6.5pF 50V NP0 S CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 2pF +/-0.

8x CONNECTOR SKT I/O 18 WAY SMD HOLDER FOR BATTERY CELL CONNECTOR BATTERY 2 WAY SMD CONNECTOR BATTERY 2 WAY SMD Grid A3 F2 F1 F2 C4 F1 F1 F1 E1 D1 F1 F1 B4 B4 B4 A4 A4 C1 D4 E3 D3 A1 A1 E3 C1 A1 B1 F1 D4 E3 E4 Model: EB-GD30 & EB-GD50 Ref.5MHz SMD 2012 FILTER SAW RX GSM/PCN SMD 3.5 MHz SMD 2012 6PI FILTER IF SAW 225MHz SMD 7.7V SMD DIODE MA2S111 80V 100mA SMD SS DIODE ZENER 6V2 SMD SS-MINI 2P DIODE ZENER 6V2 SMD SS-MINI 2P DIODE ZENER 6V2 SMD SS-MINI 2P COUPLER 1.MCUK991001C8 Service Manual Section – 75 – Issue 1 Revision 0 Model: EB-GD30 & EB-GD50 Ref.8nH 5% SMD 1005 INDUCTOR 8.2x5 FILTER LC 1412.747GHz SMD 2012 6PIN COUPLER 897.7nH +/-0.7nH +/-0.3nH SMD 10 INDUCTOR 2.8x FILTER SAW RX GSM/PCN SMD 3.3nH SMD 10 INDUCTOR 68nH 5% SMD 1608 INDUCTOR 12nH 5% SMD 1005 INDUCTOR 100nH 5% SMD 1005 INDUCTOR 33nH 5% SMD 1005 INDUCTOR 12nH 5% SMD 1005 INDUCTOR 22nH 5% SMD 1005 INDUCTOR 12nH 5% SMD 1005 INDUCTOR 10nH 5% SMD 1005 INDUCTOR 220nH 5% SMD 1608 INDUCTOR 18nH 5% SMD 1005 INDUCTOR 39nH 5% SMD 1005 INDUCTOR 39nH 5% SMD 1005 INDUCTOR 18nH 5% SMD 1005 INDUCTOR 6.7V SMD DIODE MAZS0470G ZENER 4. INDUCTOR 82nH 5% SMD 1608 INDUCTOR 82nH 5% SMD 1608 INDUCTOR 100nH 5% SMD 1005 INDUCTOR 100nH 5% SMD 1005 INDUCTOR 120nH 5% SMD 1608 INDUCTOR 82nH 5% SMD 1608 INDUCTOR 18nH 5% SMD 1005 INDUCTOR 4.73 OHM 0.3nH SMD 10 Grid C4 C4 C4 C4 C4 E1 D2 D2 B2 B1 E3 E3 B2 B1 B2 E3 B1 E3 B1 B1 B1 B1 A1 REPLACEMENT PARTS LIST B2 A1 B2 B2 B1 B2 B2 A1 .2nH 5% SMD 1005 INDUCTOR 2. D104 D105 D106 D107 D108 D401 D402 D403 D404 D405 D406 D501 D502 D503 D504 D601 D602 D900 D901 D902 D903 E800 E801 FL700 FL701 FL702 FL703 J100 J101 J900 J901 Part Number B0KB00000010 B0JCDD000001 B0JCDD000001 B0KB00000010 MA2Z07700L B0ADEJ000010 MA2S111TX MA2S111TX B0JCMC000004 B0JCDD000001 MA2S111TX B0JCDD000001 B0JCDD000001 B0JCDD000001 B0JCDD000001 MAZS0470GL MAZS0470GL MA2S111TX MAZS0620ML MAZS0620ML MAZS0620ML B9Z000000019 B9Z000000018 EFCH225MDQP1 J0E1417B0001 EFCH9418MTY2 EFCH9418MTY2 JA76020B K3ZZ00200009 JJ76002A JJ76002A Name: Main PCB (Common Items) Description SUPPRESSOR ESD 4 ELEMENTS SMD DIODE RB521S-30 SCHOTTKY 30V 2 DIODE RB521S-30 SCHOTTKY 30V 2 SUPPRESSOR ESD 4 ELEMENTS SMD DIODE MA77 100mA SMD S-MINI 2 DIODE ARRAY QUAD SW SMD UMD6 DIODE MA2S111 80V 100mA SMD SS DIODE MA2S111 80V 100mA SMD SS DIODE SHOTTKY 20V 1A SMD SC-59 DIODE RB521S-30 SCHOTTKY 30V 2 DIODE MA2S111 80V 100mA SMD SS DIODE RB521S-30 SCHOTTKY 30V 2 DIODE RB521S-30 SCHOTTKY 30V 2 DIODE RB521S-30 SCHOTTKY 30V 2 DIODE RB521S-30 SCHOTTKY 30V 2 DIODE MAZS0470G ZENER 4. L101 L102 L103 L104 L106 L501 L601 L602 L700 L701 L702 L703 L704 L705 L706 L709 L711 L713 L715 L716 L717 L718 L720 L721 L722 L723 L724 L725 L726 L727 L729 Part Number G1CR47J00006 G1CR47J00006 G1C82NJ00010 G1C10NJ00008 ELJRF47NJF2 G1A101C00002 G1C82NJ00008 G1C82NJ00008 G1CR10J00010 G1CR10J00010 G1CR12J00003 G1C82NJ00009 ELJRF18NJF2 G1C4N7Z00004 G1C2N7Z00007 G1C68NJ00007 ELJRF12NJF2 G1CR10J00010 ELJRF33NJF2 ELJRF12NJF2 ELJRF22NJF2 ELJRF12NJF2 G1C10NJ00008 G1CR22J00006 ELJRF18NJF2 ELJRF39NJF2 ELJRF39NJF2 ELJRF18NJF2 ELJRF6N8JF2 ELJRF8N2JF2 ELJRF2N2DF2 Name: Main PCB (Common Items) Description INDUCTOR 470nH 5% SMD 2012 INDUCTOR 470nH 5% SMD 2012 INDUCTOR 82nH 5% SMD 1005 INDUCTOR 10nH 5% SMD 1005 INDUCTOR 47nH 5% SMD 1005 INDUCTOR 100uH 30% 1.2nH +/-0.

6nH +/-0. L730 L731 L732 L733 L734 L800 L801 L804 L807 L808 L809 L900 L901 L902 LS900 P100 Q101 Q102 Q401 Q402 Q403 Q404 Q405 Q406 Q501 Q700 Q701 Q702 Q703 Q800 Q801 Part Number ELJRF8N2JF2 ELJRF18NJF2 G1C5N6Z00005 ELJRF18NJF2 ELJRF18NJF2 G1C4N7Z00004 G1C15NJ00008 G1C5N6Z00005 ELJRF22NJF2 G1C15NJ00008 G1C15NJ00008 ELJRF6N8JF2 ELJRF8N2JF2 ELJRF22NJF2 HB76004B PY76018A B1GFCFEM0001 B1ABCB000024 2SD2216TX B1DHCC000012 B1GKGFBJ0001 B1GKGFBJ0001 B1CFJC000001 B1ADPC000003 B1GKCFLL0006 B1GKCFNE0001 B1GKCFNE0001 B1GKCFLL0006 B1GFCFEM0001 B1GKCFNE0001 XP0431200L Name: Main PCB (Common Items) Description INDUCTOR 8.3nH SMD 10 INDUCTOR 18nH 5% SMD 1005 INDUCTOR 18nH 5% SMD 1005 INDUCTOR 4. Q900 Q901 R101 R102 R103 R104 R105 R106 R107 R108 R109 R110 R111 R112 R113 R114 R115 R116 R117 R118 R119 R120 R121 R122 R123 R124 R125 R126 R401 R403 R404 Part Number 2SD1511RSTX B1GKCFNE0001 ERJ2GEJ102X ERJ2GEJ103X ERJ2GEJ331X EXB24V331JX EXB24V331JX ERJ2GEJ332X ERJ3GEYF104V ERJ2GEJ103X ERJ2GEJ103X ERJ2GEJ331X ERJ2GEJ104X ERJ2GEJ472X ERJ2GEJ103X ERJ2GEJ103X ERJ2GEJ472X ERJ2GE0R00X ERJ2GEJ101X ERJ2GEJ682X ERJ2GEJ221X ERJ2GEJ681X ERJ2GEJ223X ERJ2GEJ103X ERJ2GEJ103X ERJ2GEJ103X EXB24V331JX EXB24V331JX ERJ2GEJ104X ERJ2GEJ104X ERJ2GEJ103X Name: Main PCB (Common Items) Description TRANSISTOR 2SD1511RSTX NPN HFE TRANSISTOR RN4905 DUAL NPN PNP RES 1K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 330 OHM 5% 1/16W SMD 1005 RES NETWORK 330 OHMx2 5% 1/16W RES NETWORK 330 OHMx2 5% 1/16W RES 3.2nH 5% SMD 1005 INDUCTOR 18nH 5% SMD 1005 INDUCTOR 5.2nH 5% SMD 1005 INDUCTOR 22nH 5% SMD 1005 BUZZER GD90 CONNECTOR BOARD TO BOARD 2x16 TRANSISTOR UMH10TN DUAL NPN WI TRANSISTOR 2SC4226 NPN SMD SOT TRANSISTOR 2SD2216TX NPN SMD S TRANSISTOR SI3441DV MOSFET -20 TRANSISTOR IMD14 DUAL SMD SMT6 TRANSISTOR IMD14 DUAL SMD SMT6 TRANSISTOR FDG6301N DUAL N-CH TRANSISTOR 2SB1424T100R PNP SM TRANSISTOR UMD2N DUAL SMD UMT6 TRANSISTOR RN4905 DUAL NPN PNP TRANSISTOR RN4905 DUAL NPN PNP TRANSISTOR UMD2N DUAL SMD UMT6 TRANSISTOR UMH10TN DUAL NPN WI TRANSISTOR RN4905 DUAL NPN PNP TRANSISTOR XP4312 DUAL NPN PNP E4 A2 Grid E4 F3 F3 B2 B1 F3 F3 E4 E4 B2 B2 C2 C2 D4 F4 D1 F2 C2 E1 E1 C1 C1 E1 E1 F2 B1 B2 F3 Model: EB-GD30 & EB-GD50 Ref.7K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 4.8K OHM 5% 1/16W SMD 1005 RES 220 OHM 5% 1/16W SMD 1005 RES 680 OHM 5% 1/16W SMD 1005 RES 22K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES NETWORK 330 OHMx2 5% 1/16W RES NETWORK 330 OHMx2 5% 1/16W RES 100K OHM 5% 1/16W SMD 1005 RES 100K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 E1 A4 B2 D2 C4 C4 C4 D2 D2 C2 C4 D4 D4 F2 F1 D1 B3 F1 F2 F2 F2 F2 F1 F2 F1 E1 F2 F2 Grid C1 .6nH +/-0.Issue 1 Revision 0 Section – 76 – MCUK991001C8 Service Manual REPLACEMENT PARTS LIST Model: EB-GD30 & EB-GD50 Ref.7nH +/-0.7K OHM 5% 1/16W SMD 1005 RES JUMPER 0 OHM 1A SMD 1005 RES 100 OHM 5% 1/16W SMD 1005 RES 6.3nH SMD 10 INDUCTOR 15nH 5% SMD 1005 INDUCTOR 5.8nH 5% SMD 1005 INDUCTOR 8.3nH SMD 10 INDUCTOR 22nH 5% SMD 1005 INDUCTOR 15nH 5% SMD 1005 INDUCTOR 15nH 5% SMD 1005 INDUCTOR 6.3K OHM 5% 1/16W SMD 1005 RES 100K OHM 1% 1/16W SMD 1608 RES 10K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 330 OHM 5% 1/16W SMD 1005 RES 100K OHM 5% 1/16W SMD 1005 RES 4.

2K OHM 1% 1/16W SMD 1005 RES 390 OHM 5% 1/16W SMD 1005 RES 10 OHM 5% 1/16W SMD 1005 RES 470 OHM 5% 1/16W SMD 1005 RES 47 OHM 5% 1/16W SMD 1005 RES 1.2K OHM 5% 1/16W SMD 1005 RES 4.8K OHM 1% 1/16W SMD 1005 RES 6.2K OHM 5% 1/16W SMD 1005 RES 1.2K OHMx2 5% 1/16 Grid E1 D1 D1 E1 E1 E1 D1 D1 D1 D1 D1 D1 C1 D1 C1 E1 E1 E1 B4 B4 B4 B4 E1 E2 C3 E1 B4 E2 D2 F2 F2 Model: EB-GD30 & EB-GD50 Ref.2K OHM 5% 1/16W SMD 1005 RES 1.8K OHM 1% 1/16W SMD 1005 RES 2.2K OHM 5% 1/16W SMD 1005 RES 82 OHM 5% 1/16W SMD 1005 RES 100 OHM 5% 1/16W SMD 1005 RES 51 OHM 5% 1/16W SMD 1005 RES 82 OHM 5% 1/16W SMD 1005 RES 22K OHM 5% 1/16W SMD 1005 RES 12K OHM 5% 1/16W SMD 1005 RES 75 OHM 5% 1/16W SMD 1005 RES 100 OHM 5% 1/16W SMD 1005 Grid F2 B1 B1 B1 B1 B2 B2 B2 E4 B2 B2 B2 B2 B2 B2 E4 E3 E3 B2 F3 F3 F3 F3 REPLACEMENT PARTS LIST A1 A1 A1 A1 F3 F3 A1 A1 .2K OHM 1% 1/16W SMD 1005 RES 2. R607 R701 R702 R703 R705 R706 R707 R708 R709 R710 R711 R712 R713 R714 R715 R716 R719 R720 R723 R724 R725 R726 R727 R800 R801 R802 R803 R804 R805 R806 R807 Part Number EXB24V331JX ERJ2GEJ393X ERJ2GEJ392X ERJ2GEJ510X ERJ2GEJ392X ERJ2GE0R00X ERJ2GEJ100X ERJ2GEF223X ERJ2GEJ4R7X ERJ2GEF682X ERJ2GEF682X ERJ2GEF222X ERJ2GEF222X ERJ2GEF222X ERJ2GEF222X ERJ2GEJ391X ERJ2GEJ100X ERJ2GEJ471X ERJ2GEJ470X ERJ2GEJ122X ERJ2GEJ122X ERJ2GEJ122X ERJ2GEJ122X ERJ2GEJ820X ERJ2GEJ101X ERJ2GEJ510X ERJ2GEJ820X ERJ2GEJ223X ERJ2GEJ123X ERJ2GEJ750X ERJ2GEJ101X Name: Main PCB (Common Items) Description RES NETWORK 330 OHMx2 5% 1/16W RES 39K OHM 5% 1/16W SMD 1005 RES 3.15 OHM 1% 1/4W SMD RES 33 OHM 5% 1/10W SMD 2012 RES 15K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 27 OHM 5% 1/10W SMD 2012 RES 10K OHM 5% 1/16W SMD 1005 RES 56 OHM 5% 1/10W SMD 2012 RES 100K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 47 OHM 5% 1/16W SMD 1005 RES 2. R405 R406 R407 R408 R409 R410 R411 R412 R413 R414 R415 R416 R417 R418 R419 R420 R421 R502 R503 R504 R505 R506 R507 R508 R510 R511 R512 R513 R604 R605 R606 Part Number ERJ2GEJ104X ERJ2GEJ104X ERJ2GEJ104X ERJ2GEJ473X ERJ2GEJ103X ERJ2GEJ123X D1BDR1500001 ERJ6GEYJ330V ERJ2GEJ153X ERJ2GEJ103X ERJ2GEJ103X ERJ2GEJ103X ERJ6GEYJ270V ERJ2GEJ103X ERJ6GEYJ560V ERJ2GEJ104X ERJ2GEJ103X ERJ2GEJ470X ERJ2GEJ222X ERJ2GEJ472X ERJ2GEJ104X ERJ2GEJ223X ERJ2GEJ104X ERJ2GEJ104X ERJ2GE0R00X ERJ2GEJ102X ERJ2GEJ102X ERJ2GEJ102X ERJ2GEJ223X EXB24V331JX EXB24V122JX Name: Main PCB (Common Items) Description RES 100K OHM 5% 1/16W SMD 1005 RES 100K OHM 5% 1/16W SMD 1005 RES 100K OHM 5% 1/16W SMD 1005 RES 47K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 12K OHM 5% 1/16W SMD 1005 RESISTOR 0.2K OHM 5% 1/16W SMD 1005 RES 1.9K OHM 5% 1/16W SMD 1005 RES 51 OHM 5% 1/16W SMD 1005 RES 3.7K OHM 5% 1/16W SMD 1005 RES 100K OHM 5% 1/16W SMD 1005 RES 22K OHM 5% 1/16W SMD 1005 RES 100K OHM 5% 1/16W SMD 1005 RES 100K OHM 5% 1/16W SMD 1005 RES JUMPER 0 OHM 1A SMD 1005 RES 1K OHM 5% 1/16W SMD 1005 RES 1K OHM 5% 1/16W SMD 1005 RES 1K OHM 5% 1/16W SMD 1005 RES 22K OHM 5% 1/16W SMD 1005 RES NETWORK 330 OHMx2 5% 1/16W RES NETWORK 1.2K OHM 1% 1/16W SMD 1005 RES 2.7 OHM 5% 1/16W SMD 1005 RES 6.MCUK991001C8 Service Manual Section – 77 – Issue 1 Revision 0 Model: EB-GD30 & EB-GD50 Ref.2K OHM 1% 1/16W SMD 1005 RES 2.9K OHM 5% 1/16W SMD 1005 RES JUMPER 0 OHM 1A SMD 1005 RES 10 OHM 5% 1/16W SMD 1005 RES 22K OHM 1% 1/16W SMD 1005 RES 4.

768KHz SMD 7.8K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES JUMPER 0 OHM 1A SMD 1005 RES 750 OHM 5% 1/16W SMD 1005 RES 3.75V 100mA IC MB15F03SLPFV1-G-BND-ER DUAL VCO IF DUAL 520/540MHz SMD 5.0x5.7 4 IC BA3891KV CHARGE ASIC SMD QF IC R1111N181B REG 1.7K OHM 5% 1/16W SMD 1005 RES JUMPER 0 OHM 1A SMD 1005 RES 330 OHM 5% 1/16W SMD 1005 RES 330 OHM 5% 1/16W SMD 1005 RES 10 OHM 5% 1/16W SMD 1005 CONNECTOR RF COAXIAL DIPLEXER ANTENNA SWITCH GSM/DS B2 A1 F4 B2 B2 B2 A2 B2 B2 C1 D4 D4 C2 C2 B1 C2 C2 C2 C2 B2 B2 E3 D4 D4 F3 F3 Grid A1 F4 F4 Model: EB-GD30 & EB-GD50 Ref.65mm PI IC HD155123FEB RF BRIGHT 2 GSM VCO TX SMD 9. R808 R809 R810 R811 R812 R813 R814 R816 R817 R818 R822 R824 R825 R900 R902 R903 R904 R905 R906 R908 R909 R910 R912 R913 R914 R915 R916 R918 S700 S701 Part Number ERJ2GEJ510X ERJ2GEJ103X ERJ2GEJ103X ERJ2GEJ103X ERJ2GE0R00X ERJ2GEJ750X ERJ2GEJ223X ERJ2GEJ150X ERJ2GEJ391X ERJ2GEJ391X ERJ2GEJ223X ERJ2GE0R00X ERJ2GE0R00X ERJ2GEJ182X ERJ2GEJ103X ERJ2GE0R00X ERJ2GEJ751X ERJ2GEJ332X ERJ2GEJ220X ERJ2GE0R00X ERJ2GEJ4R7X ERJ2GEJ150X ERJ2GEJ152X ERJ2GEJ272X ERJ2GE0R00X ERJ2GEJ331X ERJ2GEJ331X ERJ2GEJ100X PY76011B SY76003A Name: Main PCB (Common Items) Description RES 51 OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES 10K OHM 5% 1/16W SMD 1005 RES JUMPER 0 OHM 1A SMD 1005 RES 75 OHM 5% 1/16W SMD 1005 RES 22K OHM 5% 1/16W SMD 1005 RES 15 OHM 5% 1/16W SMD 1005 RES 390 OHM 5% 1/16W SMD 1005 RES 390 OHM 5% 1/16W SMD 1005 RES 22K OHM 5% 1/16W SMD 1005 RES JUMPER 0 OHM 1A SMD 1005 RES JUMPER 0 OHM 1A SMD 1005 RES 1.8V SMD SOT IC ADP3307ART REG 2.Issue 1 Revision 0 Section – 78 – MCUK991001C8 Service Manual REPLACEMENT PARTS LIST Model: EB-GD30 & EB-GD50 Ref.75V 100mA IC R1111N281B REG 2.0x1.2x2.8V SMD SOT IC R5102V001A-E2 REG WDT SMD S IC S-80824ANNP-EDM-T2 VOL DET IC BH6107KV INTERFACE ASIC SMD IC F731741B GEMINI 0.3x7.3x7.8V SMD SOT IC ADP3307ART REG 2.5x Grid D2 D1 B3 E1 D4 E1 B4 E2 C4 B1 B1 E3 F4 A2 E4 D4 C1 C1 B2 D4 C2 C2 A4 B4 .5K OHM 5% 1/16W SMD 1005 RES 2.4m IC RS5C348A REAL TIME CLOCK SM LNA DUAL GSM/DCS SMD 0.0 IC DUAL BAND APC TSSOP20 PA PF08103B-02-TB DUAL GSM/DCS IC MGA-81563-1HA MMIC AMP SMD IC R1111N281B REG 2.0 SIMLOCK 12V 10uA 6 PIN SMD DEV CRYSTAL 32.3 VCO RF SMD 9.2x2.0x1.7 OHM 5% 1/16W SMD 1005 RES 15 OHM 5% 1/16W SMD 1005 RES 1.3K OHM 5% 1/16W SMD 1005 RES 22 OHM 5% 1/16W SMD 1005 RES JUMPER 0 OHM 1A SMD 1005 RES 4.18u SMD 0 IC TCM4400E BB/RF VEGA 3E 0. U101 U401 U402 U403 U404 U501 U503 U504 U505 U700 U701 U702 U800 U801 U802 U900 U901 U902 U903 U904 U905 U906 X100 Y501 Part Number TX76001A UY76051A C0DBAFC00007 C0DBFGG00001 C0EBD0000030 UY76046A UY76102A C1CB00000746 YRS5C348A GN01073B01MC C1CB00000803 UY76044A C1CB00000711 C5CB00000023 C1CB00000794 C0DBAFC00004 C0DBZFC00006 C0DBAFC00004 C0DBZFC00006 C1CB00000795 UY76084A UY76043A K1ZZ00001018 H0J327200022 Name: Main PCB (Common Items) Description TCVCXO 13MHz SMD 7.

3V X5R SMD 1 CAP CER 680nF 10% 16V X7R SMD CAP CER 1uF 10% 10V X5R SMD 20 CAP CER 680nF 10% 16V X7R SMD CAP CER 10pF +/-0.3V SMD CAS CAP TANT 10uF 20% 6.5pF 50V NP0 CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 680nF 10% 16V X7R SMD CAP CER 680nF 10% 16V X7R SMD CAP CER 680nF 10% 16V X7R SMD CAP CER 680nF 10% 16V X7R SMD CAP CER 680nF 10% 16V X7R SMD CAP CER 47pF 5% 50V NP0 SMD 10 CAP CER 22pF 5% 50V NP0 SMD 10 CAP CER 1uF 10% 6.9.5pF 50V NP0 CAP CER 470nF 10% 10V X5R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP TANT 10uF 20% 10V SMD CASE CAP CER 10pF +/-0.4 Main PCB: GD50-Specific Items Model: EB-GD50 Ref.2.3V X5R SMD 1 CAP CER 1uF 10% 6.5pF 50V NP0 INDUCTOR 82nH 5% SMD 1608 RES NETWORK 12 OHMx2 5% 1/16W CHIP RESISTOR 5K6 OHM +/-5% 1/ RES 100K OHM 5% 1/16W SMD 1005 IC LM4871M AUDIO PA 1. C601 C602 C609 C610 C611 C612 C613 C614 C615 C616 C617 L603 R601 R602 R603 U601 Part Number ECST0JZ106R ECST0JZ106R F1H1A4740005 ECUE1H330JCQ ECUE1H100DCQ ECUE1H222KBQ ECUE1H100DCQ F1H1A4740005 ECUE1H330JCQ F3F1A1060002 ECUE1H100DCQ G1C82NJ00008 EXB24V120JX ERJ2GEJ562X ERJ2GEJ104X C0ABAA000030 Name: Main PCB (GD50-Specific Items) Description CAP TANT 10uF 20% 6. R601 R608 R609 Part Number EXB24V180JX ERJ6GEY0R00V ERJ6GEY0R00V Name: Main PCB (GD30-Specific Items) Description RES NETWORK 18 OHMx2 5% 1/16W SMD 1010 RES JUMPER 0 OHM 2A SMD 2012 RES JUMPER 0 OHM 2A SMD 2012 Grid D2 E2 E2 9.5pF 50V NP0 CONNECTOR LCD 14 WAY SMD CONNECTOR LCD 14 WAY SMD SUPPRESSOR ESD 4 ELEMENTS SMD Grid A4 C4 C4 C4 C4 C3 C4 C4 C4 C3 C3 C3 C3 C4 C4 C4 C3 C4 C3 C3 C3 C3 MCUK991001C8 Service Manual Section – 79 – Issue 1 Revision 0 9.5pF 50V NP0 CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 2.5pF 50V NP0 CAP CER 10pF +/-0.2.5pF 50V NP0 CAP CER 10pF +/-0.5 Keypad PCB Model: EB-GD30 & EB-DG50 Ref.5pF 50V NP0 CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 10pF +/-0.3 Main PCB: GD30-Specific Items Model: EB-GD30 Ref. C001 C002 C003 C004 C005 C006 Part Number ECUE1H100DCQ F1J1C6840003 F1J1C6840003 F1J1C6840003 F1J1C6840003 F1J1C6840003 ECUE1H470JCQ ECUE1H220JCQ F1H0J1050013 F1H0J1050013 F1J1C6840003 F1J1A1050011 F1J1C6840003 ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ K1MZ14A00001 K1MZ14A00001 B0KB00000010 Name: Keypad PCB Description CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 10pF +/-0.3V SMD CAS CAP CER 470nF 10% 10V X5R SMD CAP CER 33pF 5% 50V NP0 SMD 10 CAP CER 10pF +/-0.2.2nF 10% 50V X7R SMD CAP CER 10pF +/-0.5pF 50V NP0 CAP CER 10pF +/-0.1W SMD S Grid E2 E2 D2 D2 D2 D2 D1 D1 D1 D2 D2 D2 D2 D2 D2 D2 C007 C008 C009 C010 C011 C012 C013 C014 C015 C016 C017 C018 C019 C020 C021 C022 C023 C024 C025 C026 CN001 CN002 D002 REPLACEMENT PARTS LIST C3 C3 A4 A4 C3 C4 A4 .

2V 2 COLOUR LED 5V 25mA 3.1 GD30 Model: EB-GD30 Ref.2M OHM 1% 1/10W SMD 2012 RES NETWORK 150 OHMx2 5% 1/16W RES NETWORK 150 OHMx2 5% 1/16W RES NETWORK 120 OHMx2 5% 1/16W GD30 RECEIVER SHIELD Grid C4 F4 F3 E4 E3 D4 D3 D4 D3 C4 C4 C3 C3 A3 C3 C4 C3 C3 C3 C4 C4 C4 C4 C4 9.2V DIODE LED GREEN 16-28mcd 2. Part Number IFB004 JT00009 JT00010 JT00011 JT00022 JT00004 Name: Jigs and Tools Description INTERFACE BOX GD30/GD50 RF ADAPTOR BATTERY CALIBRATION VOLT.3 Refurbishment Kits 9. GREEN REFURBISHMENT KIT.2V DIODE LED GREEN 16-28mcd 2.2Lx2.4 Repair Jigs and Tools Model: EB-GD30 Ref.2V DIODE LED GREEN 16-28mcd 2. 9. Part Number 9R3000B 9R3000K 9R3000S Name: Jigs and Tools Description REFURBISHMENT KIT.3.2V DIODE LED GREEN 16-28mcd 2. Coloured Cover Assembly.2V DIODE LED GREEN 16-28mcd 2. SILVER Notes Issue 1 Revision 0 Section – 80 – MCUK991001C8 Service Manual REPLACEMENT PARTS LIST 9. GREY Notes R001 R002 R003 R004 R005 R006 R007 R008 R009 R010 SHIELD NOTE: Each refurbishment kit includes.2V DIODE LED GREEN 16-28mcd 2.2V DIODE LED GREEN 16-28mcd 2. Part Number 9RD500B 9RD500K 9RD500N 9RD500Y Name: Jigs and Tools Description REFURBISHMENT KIT.2V DIODE LED GREEN 16-28mcd 2. Case Assembly. LCD Panel.2V DIODE LED GREEN 16-28mcd 2. RF Cap. CONTROL UNIT GD30/GD50 PCB REPAIR JIG TEST BATTERY INTERFACE CABLE Notes . BLUE REFURBISHMENT KIT. BLUE REFURBISHMENT KIT. Memo Key. PCB Screw (x2). BLACK REFURBISHMENT KIT. BLACK REFURBISHMENT KIT. Key Sheet. Cover Screw (x4).2 GD50 Model: EB-GD50 Ref.Model: EB-GD30 & EB-DG50 Ref.2V DIODE LED GREEN 16-28mcd 2.2V DIODE LED GREEN 16-28mcd 2.3. Antenna and Patent Label.7W RES NETWORK 120 OHMx2 5% 1/16W RES NETWORK 150 OHMx2 5% 1/16W RES NETWORK 150 OHMx2 5% 1/16W RES 150 OHM 5% 1/10W SMD 1608 RES 150 OHM 5% 1/10W SMD 1608 RES 300K OHM 1% 1/16W SMD 1608 RES 1. D003 DS001 DS002 DS003 DS004 DS005 DS006 DS007 DS008 DS009 DS010 DS011 DS012 DS013 Part Number MA2S111TX B3ABB0000066 B3ABB0000066 B3ABB0000066 B3ABB0000066 B3ABB0000066 B3ABB0000066 B3ABB0000066 B3ABB0000066 B3ABB0000066 B3ABB0000066 B3ABB0000066 B3ABB0000066 CL155URGDT EXB24V121JX EXB24V151JX EXB24V151JX D0GB151JA002 D0GB151JA002 ERJ3EKF3003V ERJ6ENF1204V EXB24V151JX EXB24V151JX EXB24V121JX GD30MDS030B Name: Keypad PCB Description DIODE MA2S111 80V 100mA SMD SS DIODE LED GREEN 16-28mcd 2.

EUROPEAN WARRANTY PANASONIC UK ROMANIAN RUSSIAN SLOVAKIAN GD30DPKYU 7QA959AAAA 9. REPLACEMENT PARTS LIST . EUROPEAN WARRANTY TURKISH. EUROPEAN WARRANTY POLISH PORTUGUESE.2 Identification of Individual Instructions On the rear cover of each manual there is a part number.9. EUROPEAN WARRANTY ENGLISH. GERMAN. ENGLISH FRENCH. EUROPEAN WARRANTY HUNGARIAN DUTCH PTT/KPN ENGLISH. For Example.5. Part Number GD30 GD30DPKAR GD30DPKCH GD30DPKCZ GD30DPKDN GD30DPKES GD30DPKEUA GD30DPKEUB GD30DPKFN GD30DPKFR GD30DPKFT GD30DPKGE GD30DPKGR GD30DPKHU GD30DPKKPN GD30DPKKU GD30DPKLE GD30DPKMT GD30DPKNL GD30DPKNW GD30DPKPL GD30DPKPR GD30DPKPUK GD30DPKRM GD30DPKRU GD30DPKSK GD50 GD50DPKAR GD50DPKCH GD50DPKCZ GD50DPKDN GD50DPKES GD50DPKEUA GD50DPKEUB GD50DPKFN GD50DPKFR GD50DPKFT GD50DPKGE GD50DPKGR GD50DPKHU GD50DPKKPN GD50DPKKU GD50DPKLE GD50DPKMT GD50DPKNL GD50DPKNW GD50DPKPL GD50DPKPR GD50DPKPUK GD50DPKRM GD50DPKRU GD50DPKSK ARABIC. Part Number GD30 GD30DPKSL GD30DPKSW GD30DPKTA GD30DPKTL GD30DPKTU GD30DPKUK GD50 GD50DPKSL GD50DPKSW GD50DPKTA GD50DPKTL GD50DPKTU GD50DPKUK GD50DPKYU 7QA959AABA Name: Documentation Description SLOVENIAN SWEDISH.1 Document Packs NOTE: Document Packs consist of language-specific User Guide.5.5 Printed Material 9. GERMAN. Quick Start and Warranty Card where applicable. EUROPEAN WARRANTY FRENCH. ITALIAN WARRANTY CARD. EUROPEAN WARRANTY ENGLISH BOX. FRENCH. EUROPEAN WARRANTY FRENCH. The suffix to this number is the issue level of the manual. EUROPEAN WARRANTY CZECH DUTCHTONE SPANISH DANISH. EUROPEAN WARRANTY FINNISH. ITALIAN. the part number for the English GD30 instruction is 7LB270A where the final ’A’ shows the manual is issue ’A’. ENGLISH ITALIAN. PRINTED Model: EB-GD30 & EB-GD50 Ref. GERMAN. EUROPEAN WARRANTY NORWEGIAN. EUROPEAN WARRANTY GREEK. EUROPEAN WARRANTY FRANCE TELECOM. EUROPEAN WARRANTY TAIWAN. EUROPEAN WARRANTY CARD DUTCH. ENGLISH. Name: Documentation Description MCUK991001C8 Service Manual Section – 81 – Issue 1 Revision 0 Model: EB-GD30 & EB-GD50 Ref.FRENCH ITALIAN. EUROPEAN WARRANTY GERMAN. ARABIC ENGLISH. ENGLISH.

REPLACEMENT PARTS LIST This page is left intentionally blank. Issue 1 Revision 0 Section 9 – 82 – MCUK991001C8 Service Manual .

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Printed in UK UK991002000PJ .

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