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LCD TV SERVICE MANUAL
CHASSIS : ML-051A
MODEL : 26LX2R-ZE
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS .............................................................................................. 2 PRODUCT SAFETY ..................................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION................................................................11 TROUBLE SHOOTING ............................................................................15 BLOCK DIAGRAM...................................................................................18 WIRING DIAGRAM ..................................................................................19 EXPLODED VIEW .................................................................................. 20 EXPLODED VIEW PARTS LIST ..............................................................21 REPLACEMENT PARTS LIST ............................................................... 22 SVC. SHEET ...............................................................................................
SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. An other abnormality exists that must be corrected before the receiver is returned to the customer. Any voltage measured must not exceed 0. there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer. Do not modify the original design without permission of manufacturer. Leakage Current Hot Check circuit AC Volt-meter Before returning the receiver to the customer. to be sure the set is safe to operate without damage of electrical shock.75 volt RMS which is corresponds to 0. Leakage Current Cold Check(Antenna Cold Check) With the instrument AC plug removed from AC source.. connect an electrical jumper across the two AC plug prongs. over 1W). Conduit. such as antennas. keep the resistor 10mm away from PCB. Connect 1. 1.15uF capacitor between a known good earth ground (Water Pipe.) and the exposed metallic parts. connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals. Place the AC switch in the on position. always perform an AC leakage current check on the exposed metallic parts of the cabinet. Fire.5 Kohm/10W -3- . It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. or other Hazards. Do not use a line Isolation Transformer during this check. CONDUIT etc. etc. If the exposed metallic part has a return path to the chassis. When the exposed metal has no return path to the chassis the reading must be infinite. the measured resistance should be between 1MΩ and 5. etc. phone jacks. terminals. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. General Guidance An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. These parts are identified by in the Schematic Diagram and Replacement Parts List. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. To Instrument's exposed METALLIC PARTS 0.2MΩ. Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet. If any fuse (or Fusible Resistor) in this TV receiver is blown. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock. Keep wires away from high voltage or high temperature parts.15uF Good Earth Ground such as WATER PIPE. etc.5K/10watt resistor in parallel with a 0. When replacing a high wattage resistor (Oxide Metal Film Resistor. In case any measurement is out of the limits specified. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part.5mA. replace it with the specified.
CAUTION: Be sure no power is applied to the chassis or circuit. 5. Do not test high voltage by "drawing an arc". and hold it there only until the solder flows onto and around both the component lead and the foil. 5. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam. 2. These can generate electrical charges sufficient to damage ES devices. -4- . cotton-tipped stick or comparable non-abrasive applicator. clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner. obtain and wear a commercially available discharging wrist strap device. 8. c. Use with this receiver only the test fixtures specified in this service manual. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM. Alternatively. 2. 1. Use a mall wirebristle (0. 2. Always unplug the receiver AC power cord from the AC power source before. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. hold the soldering iron tip and solder the strand against the component lead until the solder melts. place the assembly on a conductive surface such as aluminum foil. Immediately before handling any semiconductor component or semiconductor-equipped assembly. drain off any electrostatic charge on your body by touching a known earth ground. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. CAUTION: Work quickly to avoid overheating the circuit board printed foil. or 1. lubrication of contacts in not required. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. Use the following soldering technique. a. Keep the soldering iron tip clean and well tinned. aluminum foil or comparable conductive material). 4. a. c. always follow the safety precautions. General Servicing Precautions 1. read and follow the SAFETY PRECAUTIONS on page 3 of this publication. 3. Do not use freon-propelled spray-on cleaners. 5. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil.) General Soldering Guidelines 1. Unless specified otherwise in this service manual. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. d. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Quickly draw the melted solder with an anti-static.25cm) brush with a metal handle. Use only an anti-static type solder removal device. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual. circuit board module or any other receiver assembly.5 inch. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 4. Immediately before removing the protective material from the leads of a replacement ES device. Use a grounded-tip. Always remove the test receiver ground lead last. Minimize bodily motions when handling unpackaged replacement ES devices. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. FETVOM. After removing an electrical assembly equipped with ES devices. (500 F to 600 F) b. Allow the soldering iron tip to reach a normal temperature (500 F to 600 F) b. 8. 6. Remember: Safety First. First. Thoroughly clean the surfaces to be soldered. Allow the soldering iron tip to reach normal temperature. which should be removed to prevent potential shock reasons prior to applying power to the unit under test. suctiontype solder removal device or with solder braid. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device. 6. touch the protective material to the chassis or circuit assembly into which the device will be installed. Heat the component lead until the solder melts. to prevent electrostatic charge buildup or exposure of the assembly. Use only a grounded-tip soldering iron to solder or unsolder ES devices. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 7. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. 7. Do not use freon-propelled chemicals. and observe all other safety precautions. etc) equipped with a suitable high voltage probe. Removing or reinstalling any component. 4. Do not spray chemicals on or near this receiver or any of its assemblies. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. Use the following unsoldering technique a. b. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. 3. low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F.SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda.
2. The following guidelines and procedures should be followed whenever this condition is encountered. 6. Carefully crimp and solder the connections. 2. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. Carefully remove the transistor from the heat sink of the circuit board. Power Output. use the standard technique as outlined in paragraphs 5 and 6 above. Carefully remove the damaged copper pattern with a sharp knife. This technique involves the installation of a jumper wire on the component side of the circuit board. Replace heat sink. wrap each lead of the new diode around the corresponding lead on the circuit board. Solder the IC connection. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. Solder the overlapped area and clip off any excess jumper wire. Bend into a "U" shape the end of each of three leads remaining on the circuit board. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. apply additional solder. Carefully bend each IC lead against the circuit foil pad and solder it. Transistor Device Removal/Replacement 1. Securely crimp the leads of replacement component around notch at stake top. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. Heat and remove all solder from around the transistor leads. 3. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. 5. Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. -5- . Clean the soldered areas with a small wire-bristle brush. 3. 3. 2. (Use this technique only on IC connections). Observing diode polarity. 1. (Remove only as much copper as absolutely necessary). Securely crimp each connection and solder it. 2. Solder the connections. 3. the following technique should be used to remove and replace the IC. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. When holes are the slotted type. 4. Remove at least 1/4 inch of copper. 3. (It is not necessary to reapply acrylic coating to the areas). 4. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. Remove the defective copper pattern with a sharp knife. 2. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges. Remove defective diode by clipping its leads as close as possible to diode body. 2. reheat them and if necessary. "Small-Signal" Discrete Transistor Removal/Replacement 1. 2. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. and clip off excess lead. Removal 1. Remove the defective transistor by clipping its leads as close as possible to the component body. Diode Removal/Replacement 1.IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. Bend into a "U" shape the replacement transistor leads. 3. 4. to ensure that a hazardous condition will not exist if the jumper wire opens. 1. Remove the heat sink mounting screw (if so equipped). When working with boards using the familiar round hole. Bend the two remaining leads perpendicular y to the circuit board. If they are not shiny. 4. Insert new transistor in the circuit board. 2. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Solder each transistor lead. Carefully insert the replacement IC in the circuit board. 3. 5. Fuse and Conventional Resistor Removal/Replacement 1. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
005 inch PAL. 3. Item Video input applicable system Specification PAL-D/K. SECAM NTSC 4.SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement. 60Hz Worldwide 600. I. Receivable Broadcasting System 1) PAL/SECAM BG 2) PAL/SECAM DK 3) PAL I/I 4) SECAM L/L' 5) NTSC M 6) PAL-N/M 7) NTSC M 3. Application range This specification is applied to ML-051A chassis. 5. Display LCD Module LPL(LC260W02) 26. RF Input Channel VHF : E2 ~ E12 UHF : E21 ~ E69 CATV : S1 ~ S20 HYPER : S21~ S41 L/L' : B. B/G. NTSC-M. 7. 6. 50/60Hz) (4) Measurement must be performed after heat-run more than 30min. 1. 200 PR.(Option) NTSC JAPAN FRANCE NTSC 6). C. 2.53 mm (diagona) FVS 100 program FS 8. Storage Environment 3) Temp : -20 ~ 50 deg 4) Humidity : 10~90 % 10. Requirement for Test Testing for standard of each part must be followed in below condition. (1) Temperature: 25°C ± 2°C (2) Humidity: 65% ± 10% (3) Power: Standard input voltage (AC 100-240V. Input Voltage Market Picture Size Tuning System AC 100 ~ 240 V/50Hz. Operating Environment 1) Temp : 0 ~ 40 deg 2) Humidity : 10~90 % 9. (5) Adjusting standard for this chassis is followed a special standard.43 2.7) South America Market 7) Except South America NTSC Market (ME) PAL (ZE/TE) EU/Non-EU (PAL Market) Remark -6- .General Specification(TV) No 1. D VHF : 2~13 UHF : 14~69 CATV : 1~125 VHF Low : 1 ~ M10 VHF High : 4~S22 UHF : S23~62 4.
Anti-glare treatment of the front polarizer.1125i) 2 : Y GND 4 : Pb GND 6 : Pr GND 8 : LINE1 10:Line2 Ready 12:SWITCH GND 14: SWITCH 5 Power ON Stand by DPMS Mode Power off 6 LCD Module H/V-Sync ON/ON OFF/ON ON/OFF Type Size Pixel Pitch Pixel Format Coating Back Light LPL LPL Video Active OFF OFF Power consumption ≤ max 115W ≤ 3. By 768 vert. 480p.525p.0W ≤ typ. 30W 626.1 147. LPL 18EEFL -7- .0 x 44. SIDE) PC Input Specification Unit Remark 1366 horiz.4.5 x RGB W W W W mm LED Green Red Green * (H) x (V) x (D) JAPAN Only 480i. Pixels RGB strip arrangement Hard coating(3H).0x 373.5x 421. 720p. General Specification No 1 2 3 Panel Frequency range Control Function Item 26" TFT WXGA LCD H : 31 ~ 61Khz V : 56 ~ 75Hz 1) Contrast/Brightness 2) H-Position / V-Position 3) Tracking : Clock / Phase 4) Auto Configure 5) Reset 4 Component Jack 1:Y 3 : Pb 5 : Pr 7 : Line1 Ready 9 : LINE2 11: LINE3 13: Line3 Ready D4 Jack (525i. 1080i ZE(SIDE) TE/ME(REAR.750p.
469 37.75 84.72 60 59.50 84. U/D Typ 178.00 50.00 70. DVD 480i SDTV.00 60. -0. PC INPUT Mode Table No 1 2 3 4 5 Resolution 720x400 640x480 800x600 832x624 1024x768 H-freq(kHz) 31.00 49. ME TE. ME HDTV 1080i 50Hz (AU Ver. ME TE.75 45.275 0. Typ. 4.321 25.066 Typ.47 60. Resolution 640x480 640x480 704x480 720x576 720x576 1280x720 1280x720 1920x1080 1920x1080 1920x1080 H-freq(kHz) 15. ME TE.625 31.00 78.5.720 33. 8. 178 Remark 6. 178 Max 178. Typ.5 57.00 60.123 6 7 8 9 10 1280x768 1360x768 1366x768 1920x1080 1280x720 47.875 49. ME ZE.725 48.375 VESA(XGA) VESA(XGA) VESA(XGA) VESA(WXGA) VESA(WXGA) Supported HDCP DVI Digital 1080i HDCP DVI Digital 720p VESA VESA VESA VESA Proposed Analog RGB.799 60.96 31. ME HDTV 1080i 59. Digital RGB -8- .640 0.75 86.00 59.55 60.720 47. 2.340 0.03 500 1. Typ.25 33.363 56. 3.73 15.279 0.879 46.375 74.00 44. ME HDTV 1080i 60Hz (ATSC) TE. ME TE.283 65. TE.00 75.63 31. DVD 480i EDTV 480p SDTV.029 59.) TE. Item Specification Min 1 2 3 4 Viewing Angle (CR>10) Luminance Contrast Ratio CIE Color Coordinates (CIE 1931) RED GREEN BLUE WHITE WX WY RX RY GX GY BX BY Typ. TE.03 Luminance(cd/ ) Variation 450/900 600/1200 0. Typ. +0.75 79.607 0. Typ. 9.94 50. 7. PB.5 40.(Hz) 70.Component Video Input (Y. ME ZE.00 V-freq.47 15.799 59.00 60.94Hz TE.00 Pixel clock(MHz) 28. TE. Typ. 6.145 0.17 31.25 45.282 0.94 59. 5.8 59.00 60.00 75. PR) Specification No 1.94 V-freq(Hz) SDTV.Optical Feature(LCD Module) No.31 75 74.75 33. 10. DVD 625 Line HDTV 576p HDTV 720p HDTV 720p Proposed ZE.94 75. ME 7.776 47.870 59.00 59.468 31.3 500 Typical MAX/MIN ALL white/All back R/L.684 37. Typ. Typ.94 50.
75 86.75 45.123 6 7 8 9 10 1280x768 1360x768 1366x768 1920x1080 1280x720 47.17 31.00 78.5 40.55 60.799 60.720 33.5 Vrms 0.00 Pixel clock(MHz) 28.8 59.8V) .321 25.75 79.12V) .5 Vrms 0.5 57.5 .7 V 75 > 10 Signal Level Impedance <1 > 10 <1 > 10 75 -9- .50 84.47 60.75 84.725 48.875 49.720 47.31 75 74.00 V-freq.375 74.AV Mode Mid (5 .7 V High (1 . HDMI INPUT Mode Table No 1 2 3 4 5 Resolution 720x400 640x480 800x600 832x624 1024x768 H-freq(kHz) 31.5 Vrms 0.3V) .5 Vrms 0.(Hz) 70.94 75.Wide Screen Low (0 .7 V High (9.00 75.799 59.00 75.684 37.2V) .375 VESA(XGA) VESA(XGA) VESA(XGA) VESA(WXGA) VESA(WXGA) Supported HDCP DVI Digital 1080i HDCP DVI Digital 720p VESA VESA VESA VESA Proposed Analog RGB. Digital RGB 9.776 47.00 60.TV Mode 9 10 11 12 13 14 15 16 17 18 19 20 21 Ground (Green) Comms Data 2 Green input Comms Data 1 Ground (Red) Ground (Blanking) Red input RGB Switching Control Ground (Video input & Output) Ground (RGB Switching Control) Video output (Composite) Video input (Composite) Common ground (Shield) 0.(Full Scart) Pin 1 2 3 4 5 6 7 8 Audio Input B (right) Audio Output A (left) Ground (audio) Ground (blue) Audio input A (left) Blue input Function Select (AV control) Signal Audio Output B (right) 0.029 59.468 31.469 37.Composite 1V including sync 1V including sync 75 75 75 75 0.870 59.0.00 60.00 70.4V) . Mechanical specification <Table 1> Scart Arrangement 1.363 56.8.879 46.00 49.RGB Low (0 .283 65.
10 - .2V) .5 Vrms 0.(Half Scart) Pin 1 2 3 4 5 6 7 8 Audio Input B (right) Audio Output A (left) Ground (audio) Ground (blue) Audio input A (left) Function Select (AV control) Signal Audio Output B (right) 0.8V) .Wide Screen Low (0 .5 Vrms 0.<Table 2> Scart Arrangement 2.AV Mode Mid (5 .5 Vrms 0.TV Mode 9 10 11 12 13 14 15 16 17 18 19 20 21 Ground (Green) Comms Data 2 Comms Data 1 Ground (Red) Ground (Blanking) Red input Ground (Video input & Output) Video output (Composite) Video input (Composite) Common ground (Shield) 1V including sync 1V including sync 75 75 > 10 Signal Level Impedance <1 > 10 <1 > 10 - .5 .5 Vrms High (9.12V) .
Month. the use of isolation transformer will help to protect test instruments. it is not necessary to use an isolation transformer.Never connect HDMI & DVI-D & DVI-A Cable at the same time.4 Detail EDID Options are below(a.Use the proper cables below for EDID Writing No 1 2 3 Item Manufacturer ID Version Revision Content GSM Digital 1 Digital 3 Hexadecimal 1E6D 01 03 3.1 ANALOG(128Bytes) 00 01 02 00 00 FF FF 10 c 01 20 11 49 4B 30 61 40 01 40 35 00 BC 50 40 80 37 60 4B 1F 3D 70 03 FF 03 A5 01 88 00 09 04 FF 01 6E 01 21 BC 00 05 FF 46 80 01 00 88 0A 06 FF 27 31 1B 00 21 20 07 00 78 40 21 1C 00 20 08 1E EA 01 50 4E 00 20 09 6D D9 01 A0 1F 18 20 0A 0B 0C 0D 0E 0F a B0 01 51 00 00 20 0A A3 01 00 80 00 20 20 57 45 1E 51 00 00 20 b 49 40 30 00 FD 00 20 9C 01 48 1E 00 00 00 25 01 88 30 38 FC b. e 0F 23 10 21 13 35 00 00 1E 00 10 20 30 40 50 60 70 3. e) a.1. Year : Controlled on production line d. Specification.2 Adjustment must be done in the correct sequence. 50/60Hz.11 - . 2. Application Range This spec.ADJUSTMENT INSTRUCTION 1. EDID * Caution . 2. sheet is applied to all of the ML-051A chassis (TORNADO) manufactured at LG TV Plant 00 10 20 30 40 50 60 70 3. Model Name(Hex) : Model Name 26LX2R-ZE 32LX2R-ZE 32LP1R-ZE 37LP1R-ZE 42LP1R-ZE Model Name(HEX) 32364C5832522D5A45 33324C5832522D5A45 33324C5031522D5A45 33374C5031522D5A45 34324C5031522D5A45 d e 3. c.5 Before adjustment.2 DIGITAL(128Bytes) 00 01 02 00 00 FF FF 10 c 01 20 11 49 4B 30 61 40 01 40 35 00 BC 50 40 80 37 60 70 00 38 4B 03 FF 03 A5 01 88 00 08 1E EA 01 50 4E 00 0A d 1F 3D 09 00 0A 20 04 FF 80 6E 01 21 BC 05 FF 46 80 01 00 88 06 FF 27 31 1B 00 21 07 00 78 40 21 1C 00 09 6D D9 01 A0 1F 18 20 20 0A 0B 0C 0D 0E 0F a B0 01 51 00 00 20 20 A3 01 00 80 00 20 20 57 45 1E 51 00 00 20 b 49 40 30 00 FC 00 20 9C 01 48 1E 00 00 00 25 01 88 30 33 FD e.2. 2. Product ID Model name 26LX2R 32LX2R 32LP1R 37LP1R 42LP1R Product ID 22039(A) 22040(A) 30041(A) 30042(D) 30039(A) 30040(D) 30043(A) 30044(D) 40013(A) 40014(D) Product ID Dec 22039(A) 22040(D) 30041(A) 30042(D) 30039(A) 30040(D) 30043(A) 30044(D) 40013(A) 40014(D) Hex 5617 5618 7559 755A 7557 7558 755B 755C 9C4D 9C4E EDID Table 1756 1856 5975 5A75 5775 5875 5B75 5C75 4D9C 4E9C 3.3 EDID FOR HDMI(256Bytes) 00 01 02 00 FF FF c 01 11 49 4B 61 40 01 35 00 BC 40 80 37 08 1E EA 01 50 4E 00 0A d 00 38 4B 1F 3D 09 00 0A 20 00 02 09 00 00 8E 00 00 00 01 03 07 01 00 21 00 00 00 02 21 07 1D 1E 00 00 00 00 03 1C 23 00 8C 00 32 00 00 04 46 09 80 0A 18 00 00 00 05 85 07 51 D0 2A 00 00 00 06 04 07 D0 8A 12 1C 00 00 07 02 83 1C 20 00 00 00 00 08 01 01 20 E0 10 00 00 00 03 FF 03 A5 01 88 00 04 FF 80 6E 01 21 BC 05 FF 46 80 01 00 88 06 FF 27 31 1B 00 21 07 00 78 40 21 1C 00 09 6D D9 01 A0 1F 18 20 20 09 03 00 40 2D 41 00 00 00 0A 0B 0C 0D 0E 0F a B0 01 51 00 00 20 20 0A 00 00 80 10 43 00 00 00 A3 01 00 80 00 20 20 0B 23 65 35 10 17 00 00 00 57 45 1E 51 00 00 20 0C 09 03 00 3E 20 00 00 00 b 49 40 30 00 FC 00 20 0D 07 0C BC 96 28 00 00 00 9C 01 48 1E 00 00 01 0E 07 00 88 00 60 00 00 00 25 01 88 30 33 FD 2. 2. However.1 Because this is not a hot chassis. Checksum: ChangeCable by total EDID data e . Serial No : Controlled on production line c.2.1 Data 3. execute Heat-Run for 30 minutes at RF no signal. d. .3 The adjustment must be performed at 25±5°C temperature and 65±10% relative humidity if there is no specified designation.Use the proper signal cable for EDID Download Analog EDID: Pin3 exists Digital EDID: Pin3 exists Caution: .4 The input voltage of the receiver must be kept between 100~220V.2. b. 2.
5) Auto-RGB OK means the adjustment is completed. 3) Press the ADJ key on R/C for adjustment. 3) Press the ADJ key on R/C for adjustment.MSPG-925F Pattern Generator->Model: 202 / Pattern: 32 4.1 Method of Auto RF/AV/S-VIDEO Color Balance. 2) Execute the SET Heat Run for 30minutes 3) Push the ADJ Button then you can see the OSD 4) Push the ADJ Button again for White Balance mode 5) Adjust High light with R/B Gain/Offset(G Gain fix. 5) Auto-RGB OK means the adjustment is completed. 4. white Balance 5. then it becomes automatically.1 Method of Auto Component Color Balance 1) Input the Component 720p 100% Color Bar(MSPG925F model:215.MSPG-925F Pattern Generator 4. 1) Input the Video Signal: 75% Color Bar signal into AV3 (ZE). 4) Press the (Vol. then it becomes automatically. 3) Press ADJ key on R/C for adjustment. pattern:18) into RGB. +) key to operate the set . 4) Press the (Vol. ADC Calibration 4.Remote controller for adjustment .12 - .1 Adjustment of RF/AV/SAV * Test Equipment . 5.4. pattern:33) signal into Component.Remote controller for adjustment . TE/ME : component 1 or 2) 2) Set the PSM to Standard mode in the Picture menu. (ZE : component . * Required Equipments . 4) Press the (Vol.3 Adjustment of RGB * Required Equipments .1 Method of Auto RGB Color Balance 1) Input the PC 1024x768@60Hz 1/2 Black & White Pattern(MSPG-925F model:37.2 Adjustment of Component. then it becomes automatically.2.3. 5) Auto-RGB OK means adjustment is completed. 4. +) key to operate the set. G Offset fix) . AV1(TE). VIDEO1(ME) 2) Set the PSM to Standard mode in the Picture menu.1.Remote controller for adjustment . +) key operate To set .MSPG-925F Pattern Generator->Model: 215 / Pattern: 33 4.1 Manual white Balance (AV) 1) Execute CA-110 Zero Calibration. (using D-sub to DVI-I cable) 2) Set the PSM to Standard mode in Picture menu.
6. Shipping Conditions No 1 2 3 4 5 6 7 Power Volume Level Main Picture Input Main Last Channel Mute ARC Station Auto Program Manual Program Program Edit Favorite Program 8 Picture PSM Dynamic Contrast Brightness Colour Sharpness 9 Sound SSM AVL Balance 10 Special Input Child Lock Auto sleep Language 11 PC H-Position V-Position Clock Phase Auto Configue Variable by each mode None Dynamic 100 45 50 50 Flat Off 0 TV Off Off English(Area Management) Item Off 30 TV Pr 01 Off 16 : 9 Condition Remark .13 - .
To select the functions such as video.SVC REMOCON 1 2 3 4 5 6 7 8 9 10 11 To turn the TV on or off To turn the TV on automatically if the power is supplied to the TV.) Displays the teletext time in the normal mode TIME Enables to select the sub code in the teletext mode Used as the size key in the PIP screen in the normal mode SIZE Used as the size key in the teletext mode Used as the index key in the teletext mode (Top index will be MULTI PIP displayed if it is the top text. P-CHECK To check TV screen sound easily S-CHECK To select size of the main screen (Normal.) Used as Mode in the teletext mode MODE To select the simultaneous screen PIP To adjust screen tilt TILT To manually select the channel. VOL To set a specific function or complete setting. function or channel. 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 Shortcut keys Shortcut keys Shortcut keys . ENTER To move the channel down in the PIP screen. STILL Used as a hold key in the teletext mode (Page updating is stopped. MENU To set the delivery condition status after manufacturing the TV set. voice. To activate the mute function. To adjust the screen voltage (automatic): In-start mute Adjust AV(Enter into W/B adjustment mode) IN-START W/B adjustment (automatic): After adjusting the screen W/B adjustment Exit two times (Adjustment completed) To enter into the adjustment mode. IN-STOP To halt the main screen in the normal mode. 0~9 POWER Shortcut keys Shortcut keys Shortcut keys 12 Use the AV key to enter the screen W/B adjustment mode. PIP CH-(OP1) To use as a red key in the teletext mode To move the channel in the PIP screen PIP CH+(OP2) To use as a green key in the teletext mode To switch between the main and sub screens PIP SWAP(OP3) To use as a yellow key in the teletext mode To select the input status in the PIP screen PIP INPUT(OP4) To use as a blue key in the teletext mode To set a function that will automatically adjust screen status to match EYE the surrounding brightness so natural color can be displayed.) To select the position of the PIP screen in the normal mode Used as the update key in the teletext mode (Text will be POSITION displayed if the current page is updated. MUTE To check TV screen image easily. or the sub screen at the PIP screen. (Use the POWER ON POWER key to deactivate): It should be deactivated when delivered. Spectacle. ADJ To select the multiple sound mode (Mono. Wide or Zoom) ARC Switch to closed caption broadcasting CAPTION To toggle on/off the teletext mode TXT To select an external input for the TV screen TV/AV To start turbo sound TURBO SOUND TURBO PICTURE To start turbo picture To enter adjustment mode when manufacturing the TV sets.14 - . Stereo or Foreign language) MPX To release the adjustment mode EXIT To easily adjust the screen according to surrounding brightness APC(PSM) To easily adjust sound according to the program type ASC(SSM) To check component input MULTIMIDIA To check the front AV FRONT-AV To move channel up/down or to select a function displayed on the screen. To adjust horizontal line and sub-brightness. CH To adjust the volume or accurately control a specific function.
6608MHZ) No CHECK CRYSTAL X800 Yes CHECK IC806 VOLTAGE (5V) No CHECK IC806 Yes CHECK Power on/off (5V) No CHECK Q1001 Yes REPLACE POWER BOARD .TROUBLESHOOTING NO POWER (POWER INDICATOR OFF) CHECK CN804 VOLTAGE (P-ST_5V) No CHECK POWER BOARD Yes CHECK CRYCTAL X800(19.15 - .
3V) Yes Yes REPLACE LCD MODULE No DOWN LOAD ISP DATA or REPLACE MAIN BOARD .NO VIDEO CHECK LVDS Output P3(PIN 21.16 - . PIN 22) No CHECK THE PERIPHERAL IC800 Yes Check L2 (12V) No CHECK THE PERIPHERAL IC1 Yes CHECK L1022 (24V) No CHECK R898 (3.
NO SOUND IS THE SPK CABLE CONNECTED WELL? No INSERT CABLES WELL Yes DOES IC302 OPERATE? No CHECK IC302 OR CHANGE Yes DOES IC301 OPERATE? No CHECK IC301 OR CHANGE Yes DOES IC300 OPERATE? No CHECK X300 OR CHANGE Yes DOES IC400 OPERATE? No CHECK X400 OR CHANGE Yes REPLACE JACK BOARD .17 - .
18 - .BLOCK DIAGRAM .
5 6631T25023G 6631T25024Z 6631V10004A 6631T11020Z 6 7 8 9 10 11 12 PART NO. NO. 6631T20032H 6631T25026C 6631T25026A 6631T11023D 1 6631T20033D 2 6631T20037N 3 6631T20037X 4 6631T20034V .19 6 3 1 2 4 NO. PART NO.WIRING DIAGRAM 10 11 9 8 9 5 12 7 7 . NO. PART NO.
EXPLODED VIEW 010 020 100 080 070 060 090 030 050 .20 - 130 140 080 040 150 160 120 110 .
2005 Printed in Korea ..P/NO : 38289S0004K Jul.
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