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TDA6107AJF

Triple video output amplier


Rev. 02 28 April 2005 Product data sheet

1. General description
The TDA6107AJF contains three video output ampliers which are intended to drive the three cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package, and uses high-voltage DMOS technology. To obtain maximum performance, the amplier should be used with black-current control.

2. Features
s s s s s s s s Typical bandwidth of 5.5 MHz for an output signal of 60 V (p-p) High slew rate of 900 V/s No external components required Very simple application Single supply voltage of 200 V Internal reference voltage of 2.5 V Fixed gain of 81 Black-Current Stabilization (BCS) circuit with voltage window from 1.8 V to 6 V and current window from +100 A to 10 mA s Thermal protection s Internal protection against positive ashover discharges appearing on the CRT

3. Ordering information
Table 1: Ordering information Package Name TDA6107AJF DBS9MPF Description plastic DIL-bent-SIL medium power package with n; 9 leads Version SOT111-1 Type number

Philips Semiconductors

TDA6107AJF
Triple video output amplier

4. Block diagram
VDD 6 MIRROR 1 MIRROR 5

TDA6107AJF

CASCODE 1

MIRROR 4 CURRENT SOURCE 1 THERMAL PROTECTION CIRCUIT Vi(1), Vi(2), Vi(3)

3
1 9, 8, 7 Voc(1), Voc(2), Voc(3)

Rf VIP REFERENCE DIFFERENTIAL STAGE

1, 2, 3 Ri Ra

MIRROR 3

Iom

CASCODE 2

MIRROR 2 4
mce457

Fig 1. Block diagram (one amplier shown)

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Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

5. Pinning information
5.1 Pinning

Vi(1) Vi(2) Vi(3) GND Iom VDD Voc(3) Voc(2) Voc(1)

1 2 3 4 5 6 7 8 9
001aac587

TDA6107AJF

Fig 2. Pin conguration

5.2 Pin description


Table 2: Symbol Vi(1) Vi(2) Vi(3) GND Iom VDD Voc(3) Voc(2) Voc(1) Pin description Pin 1 2 3 4 5 6 7 8 9 Description inverting input 1 inverting input 2 inverting input 3 ground (n) black-current measurement output supply voltage cathode output 3 cathode output 2 cathode output 1

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Product data sheet

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

6. Internal circuitry
GND to cascode stage 1, 2, 3 4 VDD 6 to black-current measurement circuit

TDA6107AJF
(1)

esd

from input circuit esd to black-current measurement circuit from control circuit from input circuit Vbias

esd esd

flash 7, 8, 9

5 esd 6.8 V

from blackcurrent measurement circuit from control circuit

esd

to black-current measurement circuit

to black-current measurement circuit


mce458

(1) All pins have an energy protection for positive or negative overstress situations.

Fig 3. Internal pin conguration

7. Limiting values
Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currents as specied in Figure 9; unless otherwise specied. Symbol VDD Vi Vom |Iom(mean)| Voc Tstg Tj Vesd Parameter supply voltage input voltage at pins Vi(1), Vi(2) and Vi(3) measurement output voltage absolute value of mean current of measurement output (for three channels) cathode output voltage storage temperature junction temperature electrostatic discharge voltage Human Body Model (HBM) Machine Model (MM) Voc = 0 V to VDD; Vom = 1.8 V to 6 V Conditions Min 0 0 0 0 55 20 Max 250 12 6 5.6 VDD +150 +150 3000 300 Unit V V V mA V C C V V

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Product data sheet

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

8. Thermal characteristics
Table 4: Symbol Rth(j-a) Rth(j-n)
[1]

Thermal characteristics Parameter thermal resistance from junction to n Conditions


[1]

Typ 56 11

Unit K/W K/W

thermal resistance from junction to ambient in free air

An external heatsink is necessary; see Application Note AN10227-01.

8 Ptot (W) 6
(1)

mbh989

(2)

0 40

40

80

120 160 Tamb (C)

(1) Innite heatsink. (2) No heatsink.

Fig 4. Power derating curves

8.1 Thermal protection


The internal thermal protection circuit gives a decrease of the slew rate at high temperatures: 10 % decrease at 130 C and 30 % decrease at 145 C (typical values on the spot of the thermal protection circuit).

outputs 5 K/W thermal protection circuit 6 K/W fin


mgk279

Fig 5. Equivalent thermal resistance network

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Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

9. Characteristics
Table 5: Characteristics Operating range: Tj = 20 C to +150 C; VDD = 180 V to 210 V; test conditions: Tamb = 25 C; VDD = 200 V; Voc(1) = Voc(2) = Voc(3) = 12VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in test circuit of Figure 9; unless otherwise specied. Symbol Iq Vref(int) Ri G G PSRR ct(DC) Iom(offset) Iom/Ioc Parameter quiescent supply current internal reference voltage (input stage) input resistance gain of amplier gain difference power supply rejection ratio DC crosstalk between channels offset current of measurement output (for three channels) linearity of current transfer (for three channels) Ioc = 0 A; Vom = 1.8 V to 6 V Ioc = 100 A to +100 A; Vom = 1.8 V to 6 V Ioc = 100 A to +10 mA; Vom = 1.8 V to 4 V Output pins Voc(1), Voc(2), Voc(3) Voc(DC) Voc(DC)(offset) Voc(T) Voc(T)(offset) DC output voltage Ii = 0 A 76 5 87 0 10 0 97 +5 V V mV/K mV/K differential DC output offset Ii = 0 A voltage between two output pins output voltage temperature drift differential output offset voltage temperature drift between two output pins maximum peak output current minimum output voltage maximum output voltage small signal bandwidth large signal bandwidth Voc = 50 V to VDD 50 V Vi = 4.5 V; at Ioc = 0 mA Vi = 0.5 V; at Ioc = 0 mA Voc = 60 V (p-p) Voc = 100 V (p-p)
[3] [2] [2]

Conditions

Min 5.6 73 4.2

Typ 6 2.5 2.1 81 0 55 50 1.0 1.0

Max 7.6 89 +4.2 +50 1.1 1.1

Unit mA V k

f < 50 kHz

[1]

50 0.9 0.9

dB dB A

Measurement output pin Iom; Voc = Voc(min) to Voc(max)

Ioc(max) Voc(min) Voc(max) BS BL tco(p) tco(p)

VDD 15 10

20 5.5 4.5 60 0

10 +10

mA V V MHz MHz ns ns

cathode output propagation time Voc = 100 V (p-p) square 50 % input to 50 % output wave difference in cathode output propagation time 50 % input to 50 % output (between two output pins) cathode output rise time 10 % output to 90 % output cathode output fall time 90 % output to 10 % output Voc = 100 V (p-p) square wave

[3]

toc(r) toc(f)

Voc = 50 V to 150 V square wave Voc = 150 V to 50 V square wave

[3]

67 67

91 91

113 113

ns ns

[3]

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Product data sheet

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

Table 5: Characteristics continued Operating range: Tj = 20 C to +150 C; VDD = 180 V to 210 V; test conditions: Tamb = 25 C; VDD = 200 V; Voc(1) = Voc(2) = Voc(3) = 12VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in test circuit of Figure 9; unless otherwise specied. Symbol tst SR Ov Parameter settling time input (50 %) to output (99 % to 101 %) slew rate between 50 V to VDD 50 V cathode output voltage overshoot Conditions Voc = 100 V (p-p) square wave Vi = 2.5 V (p-p) square wave Voc = 100 V (p-p) square wave
[3]

Min -

Typ 900 2

Max 350 -

Unit ns V/s %

[3]

[3]

[1] [2] [3]

The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage. See Figure 6 for the typical DC-to-DC transfer of Vi to Voc. f < 1 MHz; tr = tf = 40 ns [pins Vi(1), Vi(2) and Vi(3)]; see Figure 7 and Figure 8.

200 Voc (V) 160

mce455

120

80

40

0 0 1 2 3 Vi (V) 4

Fig 6. Typical DC-to-DC transfer of Vi to Voc

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Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

2.96 Vi (V)

2.34 t

1.73

tst Ov (in %) 150 140 Voc (V) 100 149 151

60 50

t toc(r) tco(p)
mce477

Fig 7. Output voltage [pins Voc(1), Voc(2) and Voc(3)] rising edge as a function of the AC input signal

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Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

2.96 Vi (V)

2.34 t

1.73

tst

150 140 Voc (V) 100 Ov (in %) 60 50 49 t toc(f) tco(p)


mce476

51

Fig 8. Output voltage [pins Voc(1), Voc(2) and Voc(3)] falling edge as a function of the AC input signal

10. Application information


10.1 Cathode output
The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance ash) of 3 A maximum with a charge content of 100 C. External protection against higher currents is described in Application note AN10227-01. The cathode is also protected against peak currents (caused by positive voltage peaks during low-resistance ash) of 6 A maximum with a charge content of 100 nC. External protection against higher currents is described in Application note AN10227-01. The DC voltage of pin VDD must be within the operating range of 180 V to 210 V during the peak currents.

10.2 Flashover protection


The TDA6107AJF incorporates protection diodes against CRT ashover discharges that clamp the cathodes output voltage up to a maximum of VDD + Vd.

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Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

To limit the diode current an external 1.5 k carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to be connected to the main PCB). VDD must be decoupled to GND: 1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must be placed as close as possible to pins VDD and GND and must be within 5 mm. 2. With a capacitor > 3.3 F on the picture tube base print, depending on the CRT size.

10.3 Switch-off behavior


The switch-off behavior of the TDA6107AJF is controllable. This is because the output pins of the TDA6107AJF are still under control of the input pins for low power supply voltages (approximately 30 V and higher).

10.4 Bandwidth
The addition of the ash resistor produces a decreased bandwidth and increases the rise and fall times.

10.5 Dissipation
A distinction must rst be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The static dissipation of the TDA6107AJF is due to voltage supply currents and load currents in the feedback network and CRT. The static dissipation Pstat equals: Pstat = VDD IDD + 3 Voc Ioc Where: VDD = supply voltage IDD = supply current Voc = DC value of cathode output voltage Ioc = DC value of cathode output current The dynamic dissipation Pdyn equals: Pdyn = 3 VDD (CL + Cint) fi Voc(p-p) Where: CL = load capacitance Cint = internal load capacitance (4 pF) fi = input frequency Voc(p-p) = cathode output voltage (peak-to-peak value) = non-blanking duty cycle The TDA6107AJF must be mounted on the picture tube base print to minimize the load capacitance.

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Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

11. Test information


VDD C1 22 F C2 Ra 22 nF J1 Vi(1) 1 Ri 1 Iom C9 3.2 pF J2 Vi(2) 2 Ri 2 Ra 22 nF Iom C12 3.2 pF J3 Vi(3) 3 Ri 3 Ra 22 nF C15 3.2 pF VIP REFERENCE 5 Iom Vom 4V
mce459

Rf Vof

C7 20 nF

C8 10 F

Voc(1) C10 6.8 pF R1 2 M probe 1 C11 136 pF R2 100 k

C3 22 F C4

Rf Vof 8

Voc(2) C13 6.8 pF R3 2 M probe 2 C14 136 pF R4 100 k

C5 22 F C6

Rf Vof 7

Voc(3) C16 6.8 pF R5 2 M probe 3 C17 136 pF R6 100 k

TDA6107AJF
4 GND

Current sources J1, J2 and J3 must be adjusted so that the DC output voltage of pins Voc(1), Voc(2) and Voc(3) is set to 100 V.

Fig 9. Test circuit

11.1 Quality information


The General Quality Specication for Integrated Circuits, SNW-FQ-611 is applicable.

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Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

12. Package outline


DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1

D1 q P P1 Q A2

A3 q1 q2

A A4 seating plane pin 1 index

L 1 Z b2 e b b1 w M 9

e2

5 scale

10 mm

DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT111-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION A 18.5 17.8 A2 A3 max. 3.7 8.7 8.0 A4 b b1 b2 c D (1) D1 E (1) e e2 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q q q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1

65o o 55

15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20

1.75 15.1 1.55 14.9

ISSUE DATE 95-03-11 03-03-12

Fig 10. Package outline SOT 111-1 (DBS9MPF)


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Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

13. Handling information


Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits.

14. Soldering
14.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

14.2 Soldering by dipping or by solder wave


Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specied maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

14.3 Manual soldering


Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 C and 400 C, contact may be up to 5 seconds.

14.4 Package related soldering information


Table 6: Package CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP [2]
[1] [2]

Suitability of through-hole mount IC packages for dipping and wave soldering methods Soldering method Dipping suitable Wave suitable suitable [1] not suitable

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. For PMFP packages hot bar soldering or manual soldering is suitable.

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Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

15. Revision history


Table 7: Revision history Release date 20050428 Data sheet status Product data sheet Change notice Doc. number 9397 750 14728 Supersedes TDA6107AJF_1 Document ID TDA6107AJF_2 Modications:

The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Changed data sheet status to product data sheet Preliminary specication 9397 750 11632 -

TDA6107AJF_1

20030919

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Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

16. Data sheet status


Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualication Denition This data sheet contains data from the objective specication for product development. Philips Semiconductors reserves the right to change the specication in any manner without notice. This data sheet contains data from the preliminary specication. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specication without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specication. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN).

III

Product data

Production

[1] [2] [3]

Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

17. Denitions
Short-form specication The data in a short-form specication is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values denition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specied use without further testing or modication.

18. Disclaimers
Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specied.

19. Contact information


For additional information, please visit: http://www.semiconductors.philips.com For sales ofce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

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Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 02 28 April 2005

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Philips Semiconductors

TDA6107AJF
Triple video output amplier

20. Contents
1 2 3 4 5 5.1 5.2 6 7 8 8.1 9 10 10.1 10.2 10.3 10.4 10.5 11 11.1 12 13 14 14.1 14.2 14.3 14.4 15 16 17 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 9 Cathode output . . . . . . . . . . . . . . . . . . . . . . . . . 9 Flashover protection . . . . . . . . . . . . . . . . . . . . . 9 Switch-off behavior . . . . . . . . . . . . . . . . . . . . . 10 Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 Quality information . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Handling information. . . . . . . . . . . . . . . . . . . . 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering by dipping or by solder wave . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information . . . . . . . . . . . . . . . . . . . . 15

Koninklijke Philips Electronics N.V. 2005


All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 28 April 2005 Document number: 9397 750 14728

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