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Classification : Report

Reliability Prediction Report

The details of the system are as follows :

1. Date : 2. Model :

2009-06-23 RealScan-10

3. Quantity : 1 4. Analyst : SUPREMA

5. Results Name RealScan-10 Fits * Fits(Failure Unit) = Failure Per Billion Hour(109) Hours years Failure Rate 1283.084936 MTBF 779,371.63 Remark 88.97

Standard :

Telcordia SR-332 - Reliability Prediction Procedure for Electronic Equipment

Failure Distribution : Exponential Operating Temperature : 40 C

Operating Stress : 50% (Voltage, Current, Power )

Reliability Prediction Report

Contents I. Purpose II. Terms III. Analysis Methods

I. Purpose

A reliability prediction is simply the analysis of parts and components in an effort to predict the rate at which an item will fail. A reliability prediction is one of the most common forms of reliability analyses. These predictions can help development engineers make decisions about component selection, stress levels and different designs.

II. Terms

1. MTBF (Mean Time Between Failure) The average between failure occurrences. The sum of the operating time of a machine divided by the total number of failures.

2. MTTF (Mean Time To Failure) A basic measure of system reliability for non-repairable items: The total number of life units of an item divided by the total number of failures within that population, during a particular measurement interval under stated conditions.

3. Failure An event when machinery/equipment is not available to produce parts at specified conditions when scheduled or is not capable of producing parts or perform scheduled operations to specification. For every failure, an action is required.

4. Failure Rate Number of failures per unit of gross operating period in terms of time, events, cycles, or number of parts.

5. Reliability The probability that machinery/equipment can perform continuously, without failure, for a specified interval of time when operating under stated conditions.

6. Availability A measure of the degree to which machinery/equipment is in an operable and committable state at any point in time. Specifically, the percent of time that machinery/equipment will be operable when needed.

III. Analysis Methods 1) Model : MIL-HDBK-217

This handbook contains two methods of reliability prediction such as Part Stress Analysis and part Count. These methods vary in degree of information needed to apply them

1-1) Part Stress Methods Part Stress Analysis Methods requires a greater amount of detailed information and is applicable during the later design phase when actual hardware and circuits being designed.

1-2) Parts Count Methods Parts Count Methods required less information, generally part quantities, quality level and the application environment. The Parts Count Methods will usally result in a more conservative estimate of system reliability than the Parts Stress Method.

1-3) equation for calculation

MIL-HDBK-217F Gate/Logic Arrays and Microprocessor Equations

P = ( C1 T + C2 E) Q L where: C1 = Die Complexity Failure Rate T = Temperature Factor C2 = Package Failure Rate E = Environment Factor Q = Quality Factor

MIL-HDBK-217F Memories Equations

P = ( C1 T + C2 E + CYC ) Q L where: C1 = Die Complexity Failure Rate T = Temperature Factor C2 = Package Failure Rate E = Environment Factor CYC = EEPR

MIL-HDBK-217F VHSIC/VHSIC-Like and VLSI CMOS Equations

P = BD MFG T CD + BP E Q PT + EOS where: BD = Die Base Failure Rate MFG = Manufacturing Process Correction Factor T = Temperature Factor CD = Die Complexity Corr

MIL-HDBK-217F GaAs MMIC and Digital Devices Equations

P = ( C1 T A + C2 E) L Q where: C1 = Die Complexity Failure Rate T = Temperature Factor A = Device Application Factor C2 = Package Failure Rate E = Envi

Failure Rate() = 1X106 Hours MTBF=1/

2) Model : Bellcore(Telcordia) TR-332 The Bellcore reliability prediction model was originally developed by AT&T Bell Labs. Bell Labs modified the equations from MIL-HDBK-217 to better represent what their equipment was experiencing in the field. The main concepts between MIL-HDBK-217 and Bellcore were very similar, but Bellcore added the ability to take into account burn-in, field, and laboratory testing. This added ability has made the Bellcore standard very popular with commercial organizations. The current versionof Telcordia is Issue 1, and follows Bellcore Issue 6 in order of release. Telcordia Issue 1 was released in May 2001. Telcordia also supports the ability to perform a parts count or part stress analysis, but in Telcordia, these different calculations are referred to as Calculation Methods. Telcordia offers ten different Calculation Methods. Each of these Methods is designed to take into account different information. This information can include stress data, burn-in data, field data, or laboratory test data. Failure Rate() = 1X109 Hours (FITs)

MTBF = 1 /

Bellcore Method I - Case 1 Equations

Device Steady-State Failure rate = SSi SSi = Gi Qi Si Ti where: Gi = Generic steady-state failure rate for the ith device Qi = Quality Factor for the ith device Si = Stress Factor = based on 50% stress (value of 1.0) Ti = Temperature Factor = based on 40C temperature(value of 1.0)
Bellcore Method I - Case 2 Equations Same as Method 1 - Case 1 above. Bellcore Method I - Case 3 Equations

Device Steady-State Failure rate = SSi SSi = Gi Qi Si Ti where: Gi = Generic steady-state failure rate for the ith device Qi = Quality Factor for the ith device Si = Stress Factor for the ith device Ti = Temperature Factor for the ith device due to normal operating temperature during the steady state
Bellcore Method II Equations

Method II Equations are based on the same basic principles as Method I. The calculation of the Device Steady-State Failure rate (SSi) is the same as Method I with the only difference being the possible calculation of Gi. The basic equation is as follows: SSi = Gi Qi Si Ti where: Gi = Base steady-state failure rate for the ith device Qi = Quality Factor for the ith device Si = Stress Factor for the ith device

Ti = Temperature Factor for the ith device due to normal operating temperature during the steady state

The basis for the calculation of Gi is outlined below for each different case:

Bellcore Method II - Case L1 Equations

If T1 10,000, then: Gi = [2+n]/[(2/Gi)+(4x10-6)N0(T1)0.25Q] If T1 > 10,000, then: Gi = [2+n]/[(2/Gi)+((3x10-5)+(T1X10-9))N0Q] where: n Gi N0 T1 Q = = = = = The number of failures in the laboratory test Generic steady-state failure rate for the ith device Number of devices on test Effective time on test in hours Device Quality Factor

Bellcore Method II - Case L2 Equations

If T1 10,000, then: Gi = [2+n]/[(2/G)+(4x10-6)N0(T1)0.25] If T1 > 10,000, then: Gi = [2+n]/[(2/G)+((3x10-5)+(T1X10-9))N0] where: n = The number of failures in the laboratory test

G N0 T1

= = =

Generic failure rate Number of units on test Effective time on test in hours

Bellcore Method II - Case L3 Equations

Gi = [2+n]/[(2/Gi)+(4x10-6)N0 W Q] where: n Gi N0 Q W = The number of failures in the laboratory test = Generic steady-state failure rate for the ith device = Number of devices on test = Device Quality Factor = Special time factor

If T1 + Te 10,000, then: W = (T1 + Te)0.25 - Te0.25

If T1 + Te > 10,000 Te , then:

W = ((T1 + Te) / 4000) + 7.5 - Te0.25

If Te > 10,000, then: W = T1 / 4000

where:

T1 = The effective time on test Te = Total effective burn-in time for devices as defined: Te = Ab,d tb,d where: Ab,d = temperature acceleration factor due to device burn-in tb,d = device burn-in time (hours) N0 = Number of devices on test

Q W

= =

Device Quality Factor Special time factor

Bellcore Method II - Case L4 Equations

Gi = [2+n]/[(2/Gi)+(4x10-6)N0 W] where: n Gi N0 W = = = = The number of failures in the laboratory test Generic steady-state failure rate for the ith device Number of devices on test Special time factor

If T1 + Te 10,000, then: W = (T1 + Te)0.25 - Te0.25

If T1 + Te > 10,000 Te , then:

W = ((T1 + Te) / 4000) + 7.5 - Te0.25

If Te > 10,000, then: W = T1 / 4000

where:

T1 = The effective time on test Te = Total effective burn-in time for devices as defined: Te = Tb,d + Ab,u tb,u where: Tb,d = average device effective burn-in time Ab,u = temperature acceleration factor due to device burn-in tb,u = device burn-in time (hours) N0 = Number of devices on test

Q W

= =

Device Quality Factor Special time factor

Bellcore Method III Equations Due to the complexity and detail of the calculations for Method III, the equations have not been included for reference here. Refer to the Bellcore [Reliability Prediction Procedure for Electronic Equipment] for all details regarding Method III equations. RDF 2000 RDF 2000 is the new version of the CNET UTEC80810 reliability prediction standard that covers most of the same components as MIL-HDBK-217. The models take into account power on/off cycling as well as temperature cycling and are very complex with predictions for integrated circuits requiring information on equipment outside ambient and print circuit ambient temperatures, type of technology, number of transistors, year of manufacture, junction temperature, working time ratio, storage time ratio, thermal expansion characteristics, number of thermal cycles, thermal amplitude of variation, application of the device, as well as per transistor, technology related and package related base failure rates. As this standard becomes more widely used it could become the international successor to the US MIL-HDBK-217 NPRD-95 data NPRD-95 data provides failure rates for a wide variety of items, including mechanical and electromechanical parts and assemblies. The document provides detailed failure rate data on over 25,000 parts for numerous part categoriesgrouped by environment and quality level. Because the data does not include time-to-failure, the document is forced to report average failure rates to account for both defects and wearout. Cumulatively, the database represents approximately 2.5 trillion part hours and 387,000 failures accumulated from the early 1970's through 1994. The environments addressed include the same ones covered by MIL-HDBK-217; however, data is often very limited for some environments and specific part types. For these cases, it then becomes necessary to use the

[rolled up[ estimates provided, which make use of all data available for a broader class of parts and environments. Although the data book approach is generally thought to be less desirable, it remains an economical means of estimating [ballpark] reliability for mechanical components.

Summary Report
System Name Environment Temperature RealScan-10 Ground,Fixed Controlled 40 Date Standard Analyst 2009-06-23 Telcordia SR-332

SYSTEM Unit1 Unit2 Unit3

RealScan-10 RS-10_Main RS-10_Power RS-10_UI

1 1 1 1

1,283.08 780.562763 415.710415 86.811758

MTBF 779,371.63 1,281,126.96 2,405,520.68 11,519,176.93

Reliability 0.988823 0.993186 0.996365 0.99924

MTBF Report

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Reliability Prediction Report


System Name Environment Temperature RS-10_Main Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 780.562763 1,281,126.96

Part Number

Category

Pi Factors Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

10pF

Capacitor

CHIP-MLCC, 0402, 10pF, 50V, 10%, X7R, RoHS

15pF

Capacitor

CHIP-MLCC, 0402, 15pF, 50V, 10%, C0G, RoHS

18pF

Capacitor

CHIP-MLCC, 0603, 18pF, 50V, 5%, C0G, RoHS

22pF

Capacitor

CHIP-MLCC, 0603, 22pF, 50V, 5%, C0G, RoHS

330pF

Capacitor

CHIP-MLCC, 0402, 330pF, 50V, 10%, X7R, RoHS

470pF

Capacitor

CHIP-MLCC, 0603, 470pF, 50V, 10%, X7R, RoHS

1nF

Capacitor

CHIP-MLCC, 0402 1nF, 50V, 10%, X7R, RoHS

MTBF Report

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Reliability Prediction Report


System Name Environment Temperature RS-10_Main Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 780.562763 1,281,126.96

Part Number

Category

Pi Factors Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

1nF

Capacitor

CHIP-MLCC, 0603, 1nF, 50V, 10%, C0G, RoHS

3.3nF

Capacitor

CHIP-MLCC, 0402, 3.3nF, 50V, 10%, X7R, RoHS

12

12

100nF

Capacitor

CHIP-MLCC, 0402, 100nF/0.1uF, 16V, 10%, X7R, RoHS

18

18

100nF

Capacitor

CHIP-MLCC, 0603, 100nF/0.1uF, 50V, 10%, C0G, RoHS

1uF

Capacitor

CHIP-MLCC, 0805, 1uF, 50V, 10%, X7R, RoHS

22uF

Capacitor

CHIP-MLCC, 1206, 22uF, 6.3V, 10%, T=1.60.2, X5R, RoHS

11

11

10uF/6.3V

Capacitor

CHIP-TANTAL, A, 10uF, 6.3V, 20%

MTBF Report

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Reliability Prediction Report


System Name Environment Temperature RS-10_Main Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 780.562763 1,281,126.96

Part Number

Category

Pi Factors Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 6.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 15.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

68u/6.3V

Capacitor

CHIP-TANTAL, B, 68uF, 6.3V, 20%

MBRS140

Diode

SCHOTTKY DIODE, SMB, 40V, 1A, RoHS

UWX1V470MCL1GB

Capacitor

CHIP-ALUMINUM, 47uF, 35V, 20%, RoHS

15

0.9999

HH-1M2012-102

Inductive Device

SMD-BEAD, 2012, 1000 AT 100MHz, 800mA, RoHS

HH-1M1608-121

Inductive Device

SMD-CHIP-BEAD, 0603, 120@100MHz, 2000mA, RoHS

14

12505WR-06

Other

SMD-CONN, 1.25mm PITCH, 6PIN, RA TYPE, RoHS

0.00132

12512WR-05

Other

DIP-CONN, 1.25mm PITCH, 5PIN, RA TYPE, RoHS

0.00132

MTBF Report

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Reliability Prediction Report


System Name Environment Temperature RS-10_Main Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 780.562763 1,281,126.96

Part Number

Category

Pi Factors Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .013911 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 20.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

20017WR-06

Other

DIP-CONN, 2mm PITCH, 5PIN, RA TYPE, RoHS

0.00132

12505WR-08

Other

SMD-CONN, 1.25mm PITCH, 8PIN, RA TYPE, RoHS

0.00132

12512WR-02

Other

DIP-CONN, 1.25mm PITCH, 2PIN, RA TYPE, RoHS

0.00132

SLF7032T-100M1R4-2

Inductive Device

CHIP-INDUCTOR, 7X7X3.2, 10uH, 1.4A, RoHS

0.5

VLF5014AT-4R7M1R1

Inductive Device

SMD-INDUCTOR, 4.5X4.7X1.4, 4.7uH, 1.1A RoHS

CL-2M2012-121JT

Other

COMMON MODE FILTER, 2LINE,120Ohm at 100MHz,400mA, RoHS

0.01391

IRLML6402

Transistor

P-CHANNEL MOSFET, SOT-23, -20V, -3.7A, RoHS

20

0.9998

MTBF Report

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Reliability Prediction Report


System Name Environment Temperature RS-10_Main Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 780.562763 1,281,126.96

Part Number

Category

Pi Factors Lamda G : 60.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.057656 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

18.432MHZ

Miscellaneous

SMD-OSC, SX-SS, 5X3.2, 18.432MHz, RoHS

60

0.9995

SA-B2012-301-03

Other

CHIP-VARISTOR, 2012, 300VDC, 3pF, RoHS

2.11531

51 Resistor

CHIP RES, 0402, 51, 50V, 1/16W, 5%, RoHS

39.2/1%

Resistor

CHIP-RES, 0603, 39.2, 50V, 1/10W, 1%, RoHS

75 Resistor

CHIP RES, 0402, 75, 50V, 1/16W, 5%, RoHS

82 Resistor

CHIP RES, 0402, 82, 50V, 1/16W, 5%, RoHS

0.5

100 Resistor

CHIP RES, 0402, 100, 50V, 1/16W, 5%, RoHS

0.5

MTBF Report

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Reliability Prediction Report


System Name Environment Temperature RS-10_Main Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 780.562763 1,281,126.96

Part Number

Category

Pi Factors Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

150 Resistor

CHIP RES, 0402, 150, 50V, 1/16W, 5%, RoHS

1.5

1.5K

Resistor

CHIP RES, 0603, 1.5K, 50V, 1/16W, 5%, RoHS

0.5

2.2K

Resistor

CHIP RES, 0402, 2.2K, 50V, 1/16W, 5%, RoHS

2.43K 1%

Resistor

CHIP-RES, 0603, 2.43K 1%, 50V, 1/10W, 1%, RoHS

0.5

1K

Resistor

CHIP-RES, 0603, 1K, 50V, 1/10W, 5%, RoHS

0.5

10K

Resistor

CHIP RES, 0402, 10K, 50V, 1/16W, 5%, RoHS

12

10K

Resistor

CHIP RES, 0603, 10K, 50V, 1/16W, 5%, RoHS

MTBF Report

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Reliability Prediction Report


System Name Environment Temperature RS-10_Main Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 780.562763 1,281,126.96

Part Number

Category

Pi Factors Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

15K

Resistor

CHIP RES, 0603, 15K, 50V, 1/16W, 5%, RoHS

1.5

47K

Resistor

CHIP RES, 0603, 47K, 50V, 1/16W, 5%, RoHS

0.5

68K

Resistor

CHIP RES, 0603, 68K, 50V, 1/10W, 5%, RoHS

0.5

82K

Resistor

CHIP RES, 0603, 82K, 50V, 1/10W, 5%, RoHS

0.5

150K

Resistor

CHIP RES, 0603, 150K, 50V, 1/10W, 5%, RoHS

300K

Resistor

CHIP RES, 0603, 300K, 50V, 1/10W, 5%, RoHS

0.5

75 Resistor

CHIP-4ARRAY RES, 0402x4, 75, 50V, 1/16W, 5%, RoHS

12

MTBF Report

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Reliability Prediction Report


System Name Environment Temperature RS-10_Main Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 780.562763 1,281,126.96

Part Number

Category

Pi Factors Lamda G : 191.363241 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 9.825340 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 3.00000 Lamda G : 28.126441 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 62.461965 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 28.126441 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 24.545500 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 28.126441 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description SDRAM, 256Mbit(4Mx4BANKx16), 54TSOP-II, 166MHz, 3.3V RoHS

Qty

Failure Rate

Reliability

K4S561632H-UC75

IC

191.36324

0.9983

ADSP-BF531SBBCZ400

IC

MPU, BLACKFIN PROCESSOR, PBGA-169, 400MHz, RoHS

29.47602

0.9997

EP3003

IC

2CH DC-DC CONTROLLER, 600mA, DFN-10, RoHS

28.12644

0.9998

SST25LF020A

IC

SST, SPI-FLASH, 2Mbit , SO-8, RoHS

62.46197

0.9995

NET2272REV1A-LF

IC

LPX, USB 2.0 HI-SPEED PERIPHERAL CONTROLLER, TQFP-64, RoHS

28.12644

0.9998

MT9P031I12STM

Other

Micron, 5M PIXEL CMOS MONO IMAGE SENSOR, iLCC-48, RoHS

24.5455

0.9998

S-1112B25MC

IC

SII, LDO Regulator,SOT-23-5, 2.5V-FIXED,150mA, RoHS

28.12644

0.9998

MTBF Report

Page 9

Reliability Prediction Report


System Name Environment Temperature RS-10_Main Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 780.562763 1,281,126.96

Part Number

Category

Pi Factors Lamda G : 28.126441 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 28.126441 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 10.103315 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 28.126441 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .046153 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 25.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 12.557368 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 3.00000

Description

Qty

Failure Rate

Reliability

S-1112B18MC

IC

SII, LDO Regulator,SOT-23-5, 1.8V-FIXED,150mA, RoHS

28.12644

0.9998

TPA2005D1DRBR

IC

TI. D-CLASS AMP,QFN-8

28.12644

0.9998

BD8714

IC

DAC, SO-14

10.10332

0.9999

LMV321IDBVR

IC

TI. OP-AMP, SOT-23-5

28.12644

0.9998

SMF05CT1G

Other

5-LINE TVS ARRAY, SC-88, RoHS

0.04615

30MHz

Miscellaneous

SMD-CRYSTAL, SX-SS, 5X3.2, 30MHz, C=18pF, RoHS

25

0.9998

AT88SC153

IC

SECURE MEMORY, SOIC-8, 3X64X8, RoHS

37.6721

0.9997

MTBF Report

Page 1

Reliability Prediction Report


System Name Environment Temperature RS-10_Power Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 415.710415 2,405,520.68

Part Number

Category

Pi Factors Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

100pF

Capacitor

CHIP-MLCC, 0603, 100pF, 50V, 10%, C0G, RoHS

10nF

Capacitor

CHIP-MLCC, 0603, 10nF, 50V, 10%, C0G, RoHS

100nF

Capacitor

CHIP-MLCC, 0603, 100nF, 50V, 10%, C0G, RoHS

1uF

Capacitor

CHIP-MLCC, 0603, 1uF, 16V, 10%, X7R, RoHS

1uF

Capacitor

CHIP-MLCC, 0805, 1uF, 50V, 10%, X7R, RoHS

4.7uF

Capacitor

CHIP-MLCC, 0805, 4.7uF, 16V, 10%, X7R(X5R), RoHS

22uF

Capacitor

CHIP-MLCC, 1206, 22uF, 6.3V, 10%, T=1.60.2, X5R, RoHS

MTBF Report

Page 2

Reliability Prediction Report


System Name Environment Temperature RS-10_Power Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 415.710415 2,405,520.68

Part Number

Category

Pi Factors Lamda G : 15.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 6.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 31.577080 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

UWX1V470MCL1GB

Capacitor

CHIP-ALUMINUM, 47uF, 35V, 20%, RoHS

15

0.9999

220uF/16V

Capacitor

CHIP-TANTAL, D, 220uF, 16V, 20%, RoHS

HH-1M1608-121

Inductive Device

CHIP-BEAD, 0603, 120@100MHz, 2000mA, RoHS

3.5

HH-1M2012-102

Inductive Device

SMD-BEAD, 2012, 1000 AT 100MHz, 800mA, RoHS

MBRS140

Diode

SCHOTTKY DIODE, SMB, 40V, 1A, RoHS

18

1812L050

Other

CHIP-PTC, 1812, 0.5A, RoHS

31.57708

0.9997

12512WR-05

Other

DIP-CONN, 1.25mm PITCH, 5PIN, RA TYPE, RoHS

0.00132

MTBF Report

Page 3

Reliability Prediction Report


System Name Environment Temperature RS-10_Power Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 415.710415 2,405,520.68

Part Number

Category

Pi Factors Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .013911 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 20.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 30.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 3.00000

Description

Qty

Failure Rate

Reliability

12505WR-02

Other

SMD-CONN, 1.25mm PITCH, 2PIN, RA TYPE, RoHS

0.00132

20017WR-06

Other

DIP-CONN, 2.00mm PITCH, 6PIN, RA TYPE, RoHS

0.00132

SLF7032T-100MR4

Inductive Device

CHIP-INDUCTOR, 7X7X3.2, 10uH, 1.4A, RoHS

SHP0760P

Inductive Device

CHIP-INDUCTOR, 7.5X7.5X6, 18uH, 2.9A, RoHS

0.5

CL-2M2012-121JT

Other

COMMON MODE FILTER, 2LINE,120Ohm at 100MHz,400mA, RoHS

0.01391

FDS9435

Transistor

P-CHANNEL MOSFET, SO-8, -30V, -5.3A, RoHS

20

0.9998

MMBT3906

Transistor

PNP-TR, SOT-23, 40V, 200mA, RoHS

180

0.9992

MTBF Report

Page 4

Reliability Prediction Report


System Name Environment Temperature RS-10_Power Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 415.710415 2,405,520.68

Part Number

Category

Pi Factors Lamda G : 1.057656 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .046153 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

SVR220D-07B

Other

DIP-VARISTOR, 7mm, 18VDC, RoHS

1.05766

SFI0603ML080

Other

CHIP-TVS, 0603, 8VDC, RoHS

0.04615

1.2 Resistor

CHIP-RES, 0603, 1.2, 50V, 1/10W, 5%, RoHS

0.5

15 Resistor

CHIP-RES, 0603, 15, 50V, 1/10W, 5%, RoHS

0.5

300 Resistor

CHIP-RES, 0603, 300, 50V, 1/10W, 5%, RoHS

0.5

680 Resistor

SMD-RES, 0603, 680, 5%, 1/10W, 5%, RoHS

9.1K

Resistor

CHIP-RES, 0603, 9.1K, 50V, 1/10W, 5%, RoHS

0.5

MTBF Report

Page 5

Reliability Prediction Report


System Name Environment Temperature RS-10_Power Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 415.710415 2,405,520.68

Part Number

Category

Pi Factors Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 3.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .004575 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

4.7K

Resistor

CHIP-RES, 0603, 4.7K, 50V, 1/10W, 5%, RoHS

0.5

10K

Resistor

CHIP-RES, 0603, 10K, 50V, 1/10W, 5%, RoHS

33K

Resistor

CHIP-RES, 0603, 33K, 50V, 1/10W, 5%, RoHS

0.5

47K

Resistor

CHIP-RES, 0603, 47K, 50V, 1/10W, 5%, RoHS

0.5

1M

Resistor

CHIP-RES, 0603, 1M, 50V, 1/10W, 5%, RoHS

C8320-05BFRSBO

Other

DIP-CONN-MINI B USB , 5PIN, RoHS

0.00132

DC-005

Other

DIP-DC-JACK, FEMALE, 5.5mm/2.0mm, RA TYPE, RoHS

0.00458

MTBF Report

Page 6

Reliability Prediction Report


System Name Environment Temperature RS-10_Power Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 415.710415 2,405,520.68

Part Number

Category

Pi Factors Lamda G : 28.126441 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 28.126441 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 28.126441 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

LM3485

IC

HYSTERETIC PFET BUCK CONTROLLER, MSOP-8, RoHS

28.12644

0.9998

TPS2115PW

IC

TI. POWER MUX, TSSOP-8-0.65P,ROHS

56.25288

0.9998

SC104IMLTR

IC

Semtech. White LED Driver, MLF-8

28.12644

0.9998

MTBF Report

Page 1

Reliability Prediction Report


System Name Environment Temperature RS-10_UI Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 86.811758 11,519,176.93

Part Number

Category

Pi Factors Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 1.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 3.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 3.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .001319 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 3.000000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

100nF

Capacitor

CHIP-MLCC, 0603, 100nF, 50V, 10%, C0G, RoHS

10uF/6.3V

Capacitor

CHIP-TANTAL, A, 10uF, 6.3V, 20%

RED

Optical Device

RED Color SMD type LED, 0603, 0.4T, RoHS

GREEN

Optical Device

GREEN Color SMD type LED, 0603, 0.4T, RoHS

12

HH-1M1608-121

Inductive Device

CHIP-BEAD, 0603, 100@100MHz, 2000mA, RoHS

12505WS-06

Other

SMD-CONN, 1.25mm PITCH, 6PIN, ST TYPE, RoHS

0.00132

Bi Color LED

Optical Device

Bi-Color(RED, GREEN) SMD LED, 1.6x1.25mm, 0.4T, RoHS

10

30

MTBF Report

Page 2

Reliability Prediction Report


System Name Environment Temperature RS-10_UI Ground,Fixed Controlled 40 Telcordia SR-332 Failure Rate MTBF 86.811758 11,519,176.93

Part Number

Category

Pi Factors Lamda G : 1.057656 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .500000 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : 10.103315 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000 Lamda G : .046153 Pi T : 1.00000 Pi S : 1.00000 Pi Q : 1.00000

Description

Qty

Failure Rate

Reliability

VN20-260L-751JT

Other

CHIP-VARISTOR, 0805, Clamping Voltage 58V, Maximum cap 750pF

1.05766

1K

Resistor

CHIP-RES, 0603, 1K, 50V, 1/10W, 5%, RoHS

24

12

560 Resistor

CHIP-RES, 0603, 560, 50V, 1/10W, 5%, RoHS

0.5

10K

Resistor

CHIP RES, 0603, 10K, 50V, 1/16W, 5%, RoHS

PCA9535

IC

REMOTE 16-BIT IIC AND SMBUS IO EXPANDER,TSSOP-24, RoHS

20.20663

0.9999

SMF05CT1G

Other

5-LINE TVS ARRAY, SC-88, RoHS

0.04615