Precautions

1-2 ESD Precautions

Certain semiconductor devices can be easily damaged by static electricity. Such components are commonly called Electrostatically Sensitive (ES) Devices, or ESDs. Examples of typical ESDs are: integrated circuits, some field effect transistors, and semiconductor chip components. The techniques outlined below should be followed to help reduce the incidence of component damage caused by static electricity. CAUTION: Be sure no power is applied to the

4.

Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static can generate electrical charges sufficient to damage ESDs. Do not use Freon-propelled chemicals. When sprayed, these can generate electrical charges sufficient to damage ESDs. protective packaging until immediately before installing it. Most replacement ESDs are packaged with all leads shorted together by conductive foam, aluminum foil, or a comparable conductive material. Immediately before removing the protective shorting material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed. Maintain continuous electrical contact between the ESD and the assembly into which it will be installed, until completely plugged or soldered into the circuit. Minimize bodily motions when handling unpackaged replacement ESDs. Normal motions, such as the brushing together of clothing fabric and lifting ones foot from a carpeted floor, can generate static electricity sufficient to damage an ESD.

5.

6. Do not remove a replacement ESD from its

chassis or circuit, and observe all other safety precautions.

1. Immediately before handling a semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, employ a commercially available wrist strap device, which should be removed for your personal safety reasons prior fo applying power fo the unit under fesf. equipped with ESDs, place the assembly on a conductive surface, such as aluminum or copper foil, or conductive foam, to prevent electrostatic charge buildup in the vicinity of the assembly. solder or desolder ESDs.

7.

8.

2. After removing an electrical assembly

9.

3. Use only a grounded-tip soldering iron to

I-3 Lithium Battery Precautions

1. Exercise caution when replacing a Lithium battery. There could be a danger of explosion and subsequent operator injury and/or equipment damage if incorrectly installed. Be sure to replace the battery with the same or equivalent type recommended by the manufacturer. 3. Lithium batteries contain toxic substances and should not be opened, crushed, or burned for disposal.

2.

1-2

Samsung Electronics

2 Specification

-c
2-1 Transmitter
Parameter 1 Normal Document Size
,

Specification 2lOx297mm 216 x 1500 mm l52x76mm

I I

Max. Min.

Document Thickness Scan Line Length Effective Scanning Width Scanning Method Horizontal Vertical Horizontal Vertical Horizontal Resolution Vertical

0.085 x 0.115 mm A4 paper,1 728 scan elements along 216 line length 208 mm Flat-bed scanning using CIS Stepping motor 203 pels/in (8 dots/mm) Standard: Fine: 3.85 lines/mm (98 lines/in) 7.7 lines/mm (196 lines/in)

cc

Super Fine: 15.4 lines/mm (392 lines/in)

2-2 Receiver
Parameter Coding Scheme Recording Paper Size Effective Recording Width Recording Method Horizontal Resolution Vertical MH (Modified Huffman) 216 mm x 30 m, core 12.7 mm diametre 208 mm Solid state Thermal Printing Head 8 dots/mm (203 pels/in) Standard: Fine: 3.85 lines/mm (98 lines/in) 7.7 lines/mm (196 lines/in) Specification

Suoer Fine: 15.4 lines/mm (392 lines/in)

Samsung Electronics

2-l

Specifications

2-3 Line Control Block

Parameter Communication Facility Line Coupling Transmission Speed Modem
I

Specification Public Switched Telephone Network (PSTN) Direct 9600,7200,4800,2400 bps QAM, DPSK and FSK 1 (V.29, V.27ter with fall back function and V.21) 1 1700 Hz (9600/7200 bps)
1 1800 Hz (4800/2400

Carrier Frequency Control Sianal

bps)

1 1100 H z

(CNG)

2100 Hz (CED) 300 bps (FSK) Output Level Input Sensitivity Input & Output Impedance 0 dBm to - 15 dBm +O.O I-3 dBm, adjustable in 1 dB steps 0 dBm to - 43 dBm and -5 dBm to -48 dBm 600 ohm f 30%

2-4 Others

r
Dialling Signal Dialling Method

Parameter DP/DTMF

Specification Memory dialling, Redialling 5 memory dial (power on) Check power label attached near the power cord connection.
1

Memory Capacity Power Requirement Power Consumption ( Temperature 1 Relative Humidity 1 Width Dimension Depth Height Weight Stand-by In use

7 Watt Max. 115 Watt 150to95F (lOCto35C) I20 to 80 % RH (Non-Condensing) 1 290 mm (11.4 in) 245 mm (9.64 in) 109 mm (4.29 in) 3.0 kg I

2-2

Samsung Electronics

3. Operating Instructions

3-1 How To Enter Service Mode

In service mode (tech) mode, the technician can check the machine and perform various test to isolate the cause of a malfunction. To enter service mode, press MENU, #, 1,9,3,4 in sequence, and TECH will be displayed in the LCD to confirm that the machine has entered service (tech) mode. While in service mode, the machine still performs all normal operations. To return to normal user mode, press MENU, #, 1,9,3,4 in sequence again, or turn the power switch off, then on by plugging the power cord out, then in. Options changed while in service mode do not remain changed, unless you first clear machine memory.

3-2 Changing Options

3-2-l Selectable Options

GRAY SCALE LEVEL Choose either 16 or 32 gaey scale levels. The selected level is also used in the photo sending mode. If you select 32 levels, transmission time is longer, however the result at the receiving end will be superior. This mode works only when the remote machine is capable of super-fine mode. REMOTE RECEIVE CODE This code can be used only with a phone extension connected to the FAX machine. The user can initiate FAX receive mode by entering a remote receiving code on the extension phone. The code is factory preset to * 9 * , and the middle digit may be changed to any digit between 0 and 9.

CONFIRMATION REPORT PRINTOUT Select whether a confirmation report prints each time a user sends a fax. YES: The machine prints out the report automatically after each fax sent. ERROR : The machine prints a report only when there is an error. NO: The machine does not print the report automatically. User can print the list on demand.

AUTO IOURNAL The fax machine prints the TX/RX journal automatically after every 50 fax sessions.

MODEM SPEED Select baud rate of 9600,7200,4800, or 2400 bps. The lower the baud rate, the larger the acceptable error rate. T30 protocol has a fixed speed of 300 bps in the protocol mode. When the TX speed is set to 9600 or 7200 bps, the RX speed will be either V.29 or V.27 ter. When the TX speed is set to 4800 or 2400 bps, the RX speed will be V.27 ter.

RING BEFORE ANSWER Select the number of rings the machine allows before it answers a call in automa tic receiving mode.

Samsung Electronics

3-l

Operating Instructions

CALL TRANSFERRING
This feature allows the fax machine to transfer incoming callers message to a specified remote location. Choose YES to turn on this feature. The LCD display asks to enter the telephone number you want to be transferred. Choose NO to turn off the feature.

REMOTE PASSWORD
You can change the three-character password used to access your machine from a remote phone. The password is preset to #139# (pound one three nine pound) at the factory. The first and the last ##s are fixed, but you can change the middle numbers from 0 to 9. The machine doesnt accept double character codes (ex 119,229 etc.> as passwords, because line conditions can occasionally make the machine fail to recognize a double digit code. Enter the characters you want to use, then press START.

CALL MONITORING
This feature enables you to hear callers leaving messages on the machine. Choose YES to turn on this feature. Choose NO to turn off this feature.

BATTERY ALARM
You can turn on the battery alarm feature. With this feature on, the machine displays the low battery message in the LCD and sounds beeps to alert you low battery condition. Choose YES to turn on the battery alarm feature. Choose NO to turn off the battery alarm feature.

CHARGE SAVER
This feature lets the user dial into this machine from a remote phone and check whether anyone has left a message without being charged for a charge call. When charge saver is on and there are messages waiting to be heard, the machine answers on the number of rings you specify in the ring count option. If there are no messages, the machine answers on the second ring after the number specified. This gives the user time to hang up the phone before the machine answers - and saves the price of the call. Choose YES to turn on charge saver. Choose NO to turn off charge saver.

CHECK BATTERY
If you want to check the remains of the battery, press START button. The machine displays the remaining capacity of the battery in the LCD.

LINE MONITOR
You can hear line signals through a tone speaker. The volume is adjustable. Choose YES to monitor the line signal. Choose NO to turn off this feature. Speaker will be active only for dialing, the starting part of the phase B of CCITT, and key tones.

MESSAGE RECORDING TIME

You can select the maximum time allowed for caller messages and memos. If you choose YES, the LCD display shows you the time limits available : 0 second, 30 seconds, 60 seconds or 90 seconds. Choose the proper time. If you choose 0, it allows callers to hear the greeting message but doesnt permit them to leave
messages.

TRANSMISSION LEVEL
You can set the transmission level to between 0 and -15 dBm in 1 dB steps using the control panel keypad. Accuracy is + 0 /-3 dBm.

3-2

Samsung Electronics

Operating Instructions

RECEPTION LEVEL
* Reception level may be too low due to cable losses. If set to -43 dBm, reception sensitivity will be between 0 and -43 dBm. If set to -48 dBm, reception sensitivity will be between -5 and -48 dBm.

RING ON CHECK TIME

The machine must receive a ring signal with a specified active time from a telephone exchange in automatic reception mode. In this case, the detection time that the machine agrees to be valid the inputed ring signal is changeable by this option. If the activation time of ring signal is below of the set value of the ring on check time, the machine can not detect this ring signal.

CABLE EOUALISZR
Copper telephone wire attenuates low frequencies less than high frequencies. The longer a cable is, the more pronounced the effect. To compensate for this attenuation you may need to set the machine to match the cable length currently used. Select short or long.

RING OFF CHECK TIME

The machine have to receive a ring signal with specified inactive time as well as active time. This option is able to change the inactive time. If the inactive time of ring signal is above of the set value of the ring off check time and below of the set value of the ring check maximum time, the machine can detect this ring signal off (Ol-99,1=10 msec)

BUSY ON DROP OUT TIME

While checking busy on time, if any signal noise is detected, the machine will ignore the signal noise unless it is greater than a specified time.

RING CHECK MAXIMUM TIME

This option is able to change the inactive maximum time. If the inactive time of ring signal is above of the set value of the ring off check time and below off the set value of the ring check maximum time, the machine can detect this ring signal off. If the time is above of the set value of the ring check maximum time the previous ring counter is cleared. (Ol-99,1=100 msec)

BUSY OFF DROP OUT TIME

While checking busy off time, if any signal noise is detected, the machine will ignore the signal noise unless it is greater than a specified time.

FLASH TIME

This feature allows you to change the flash time.

BUSY TONE DETECTION LEVEL

While checking tone in ANS/FAX mode, If any signal which is great than set level is detected for a few seconds the machine will disconnect the line.

3-2-2 Changing Options

Press MENU, 3, START/COPY in sequence. Press ) or 4 to select the desired option item. When the desired option item appears, press START and use ) or 4 to change the status of a selected function.

PAUSE TIME
Adjust the period of pause time to wait for a second dial tone in a PABX or mobile paging system. You can adjust the time from 1 set to 9 set (1 to 9).

Samsung Electronics

3-3

Operating instructions

3-3 Test Mode

Test mode is used to test machine functions. To enter test mode, press MENU, 0, START/COPY buttons in sequence.

TPH TEST
You can print a TPH test pattern and check the heating element of TPH with this test pattern. Figure 3-1 is a sample test pattern.

Figure 3-1: TPH Test Pattern

CIS TEST
You can check the scanning elements of the CIS (Contact Image Sensor) and print a shading waveform graphically with dots. The graph waveform will resemble figure 3-2, below.

CIS TEST

i
I

Figure 3-2: CIS Shading Waveform

3-4

Samsung Electronics

Operating Instructions

MODEM TEST

ROM TEST
Tests machine ROM (Read Only Memory). The result and the software version appear in the LCD in the following format: CHKSUM= XX, VXX, OK

The modem will send various transmit signals on the telephone line. You can check the following:
l

FSK test tones: 1100 Hz, 1650 Hz, 1850 Hz, 2100 Hz G3 training: 9600,7200,4800,2400 bps

MEMORY CLEAR
Erases contents of RAM. When memory is cleared, the machine returns to default settings.

3-4 Report Printout

A number of useful reports can be printed in service mode. One of these lists is the protocol list, which contains detailed information which may be required when contacting technical support. To print this list, press MENU, 4, START/COPY in sequence. When a report name appears in the display, scroll through the list of reports by pressing ) or 4. When a desired report is selected, press START/COPY.

c c

CI

CONFIRMATION REPORT
Shows the last transmission result.

SYSTEM DATA LIST

Shows all options that were set in user mode and service mode.

VOICE STATUS REPORT m Shows the status of the recorded voice messages.

PROTOCOL LIST This list is available in the service mode only, and shows the sequence of the CCITT group 3 T.30 protocol during the most recent TX or RX operation. You can check for send and receive errors with this list. If a communication error occurs while the machine is in service mode, the protocol list will print automatically.

TRANSMISSION TOURNAL
Shows information about faxes sent.

RECEPTION IOURNAL Shows information about faxes received.

HELP LIST TELEPHONE NUMBER LIST This report illustrates the machines basic functions and commands. Use as a quick reference guide.

Lists all numbers stored in the machines onetouch and speed dialling memory.

Samsung Electronics

3-5

Operating Instructions

3-5 LCD Disdav

3-5-l During communication
In user mode, the LCD shows the remote machines TTI number, communication type, (send or receive), and page number. In service mode, the display shows the communication type, abbreviations for the CCITT Group 3 T.30 protocol as they occur, the protocol type (G3), coding type (MH), baud rate in kbps, and line time.

3-5-2 If a communication problem occurs:

In user mode, the display shows one of the following reasons: PAPER JAM, SEND ERROR, or RECEIVE ERROR. In service mode, the display shows all error messages available in user mode, as well as additional error messages not available in user mode. Error messages shown in service mode only are as follows: PRE-MESSAGE ERROR: problem occurred during phase B of session MESSAGE ERROR: problem occurred during phase C of session POST-MESSAGE ERROR: problem occurred during phase D of session LINE ERROR: machine cannot connect or has lost connection with the remote machine Additional messages, not shown above, will appear in the transmission and reception journals printed in service mode.

3-6

Samsung Electronics

4. Disassembly and Reassembly

Note: Make sure power is OFF, and unplug the power cord from the wall outlet.

4-l Handset
l

Disconnect the handset cord modular plug from the machine. Remove the two rubber dummies from the holes and loosen the two screws. Push the upper cover in the direction of arrow to remove.

1c

Figure 4-1

4-2 TX Guide & White Roller

l

Open the operation unit assembly. Disengage the stopper. Remove TX guide. Remove white roller.

c w

Figure 4-2

Samsung Electronics

4-l

Disassembly instruction

4-3. TOD Cover

l

Loosen the six screws fastening the top cover. Carefully lift the top cover as shown in the direction of the arrow.

Figure 4-3

4-4. OPE Unit

l

Disconnect the harnesses from the Main PBA. Loosen the two screws fastening the Main PBA. Disconnect the harnesses from the LIU PBA. Remove the OPE unit from the base unit.
Main PCB

Figure 4-4

4-2

Samsung Electronics

Disassembly Instruction

4-4-l. OPE Cover

Loosen the seven screws fastening the OPE unit. Carefully lift the OPE cover in the direction of the arrow as shown.

Figure 4-5

4-5. Main Frame

l

Loosen the screw fastening the power supply and earth harness. Loosen the five screws fastening the main frame assembly. Lift the main frame assembly and D.DET sensor PBA.

Figure 4-6

Samsung Electronics

4-3

Disassembly Instruction

4-6. LIU PBA & POWER SUPPLY

l

Loosen the six screws fastening the LIU PBA and Power Supply unit. Lift the LIU PBA and Power Supply unit.

Figure 4-7

4-4

Samsung Electronics

5. Circuit Description

5-I General
The main circuit board consists of memory, MODEM, TX- and RX-related circuitry, TAD, and the Integrated Facsimile Controller (IFC), which includes the CPU and I/O device drivers and controls the system.

5-2 IFC
This circuit consists of the data and address bus, real time clock (RTC), image sensor, motor driver controller, Thermal Print head controller, IFC including I/O port, and system reset circuit.

5-2-l Memory Map

The external memory of the CPU is divided into 32kB RAM (OOOOH through SOOOH) and 64kB ROM (FFOOOOH through FFFFFFH).
OOFEFF OOFEEO OOFE80

,,* ,#,

Reserved Setup Registers

c *

FFFFFF ROMcsn FOOOOO

,** ,* Operational Registers

OOFEOO Not Available OOFDFF OOFDCO OOFD80

OFFFFF CSOn 000000 DBCMC Buffer

OOFDOO

Dither Table

-jiyq; F B80
OOEOOO

cc
Samsung Electronics

Figure 5-1: XFC Memory Map

5-l

Circuit Description

5-2-2 Data & Address Bus Control

/RD and /WR signals are active in the low state, with TSTCLK high, and an internal wait state occurs in the TSTCLK (6 MHz). These signals are sent to the /RD and /WR ports of RAM , ROM, and the MODEM in order to read or write data when a chip select line is active. /CSO: RAM chip select active (low) /ROMCS: ROM chip select active (low) /MCS: MODEM chip select active (low) DO - D7: 8 bit data bus A0 - A19: address bus

5-2-3 System Clock

The 6 MHz internal clock frequency is generated by dividing the 12 MHz system clock from MODEM by two inside the MODEM.

RTC CRYSTAL COMMUNICATION

STB O-3 PDAT PCLK PLAT THADI

IROMCS IRAMCS IRDIWR DO-D7 AO-A17

PRINTER DATA CONTROL AND SENSORS

) EXTERNAL BUS

IFC(XFC-6)

IRDIWR DO-D7 AO-A4 IMCS IMIRQ SYSCLK IPWRDWN REST0 IBATRST

MODEM

Figure 5-2: XFC Hardware interface Signals

5-2

Samsung Electronics

Circuit Description

5-2-4 Real Time Clock (RTC)

c I(r This circuit receives clock pulses from an external 32.768 kHz crystal, which it divides into hours,

minutes, seconds, year, month, and day. A battery maintains operation when power is off. XFC-B can up-track 32 years, beginning with 1992.

32768 KHz -

1Hz 15 BIT 6 B I T 1 co=6~~~ co=6k[z CO=24 H SECONDS PRESCALER

BUSY FLAG CLEAR

BUSY FLAG

- CO=28,29, 30,0r 31 : 5BIT

7 4 BIT MONTHS I co=12 5 BIT YEARS I

LEAP YEAR DECODER 1 DRIVER 1

Figure 5-3: RTC Block Diagram

5-2-5 Print Control

The PCLK and PDAT signals synchronise serial print data to the TPH. PLAT latches TPH serial print data to the TPH from a shift register through PDAT. STBl - STB4 enable TPH printing in four sequential intervals.
Print Cmd A PrintLine (MSINT Cary-out) Shifi Data

This system has a lOms/Line printing format and determines STB High/Low enable status according to the STBPOL signal.

Print Cmd A

Sh D

Sh C

Sh D

Sh C

Shift Clk

IIIIlIIIIIIIIllI
I

wiiiiiiiiir

llllllllulllllll

STBl

STB2

Figure 5-4: Printer Timing

Samsung Electronics

5-3

Circuit Description

5-2-6 TPH A/D Converter

The ADC is composed of a 6 bit DAC, comparator, filter, and 9 bit up/down counter. The 6 MSBs of the 9 bit counter generate a reference signal to the comparator. TPH temperature or DTAD back-up voltage is sensed by comparing DAC output

voltage to the comparator with the thermistor input voltage (THDI), which originates as an output signal from the TPH. It then supplies the proper strobe pulse to the TPH. The thermistor input voltage (THDI) operates within a range of 1

to 4v.

Counter Clock-------i Comparator THDI t

m m B
0

DAC out

6 MSBs

Figure 5-5: ADC Block Diagram

Battery

THDl

GND5

Approximate values (TPH Temperature) of R28 and R29 can be calculated from the following formulas: R28 = 0.25 x (R29 x Rth (Tl)} / (R29 + Rth (Tl)} R29 = (15Rth (Tl) x Rth (T2)}/ {Rth (Tl) -16Rth (T2)) Where Tl = minimum temperature, T2 = maximum temperature. Figure 5-6: THD Connection Circuit

5-4

Samsung Electronics

Circuit Description

c*

5-2-7 Operation Panel Control Communication

A Synchronous/ Asynchronous Receiver/Transmitter (SART) controls serial data transmission between the main circuit board and the operator panel.
CPU Bus + SclkCtrlLo SclkCtrlHi

Band Gen (8x) Tx/Rx Control IRQ control t

4

) SartlRQ ---)(j SCLK -

SARTCmd

RxShift

Reg

RXD

1 (SARTData) RxBuffer

c9

Figure 5-7: SART Block Diagram

Samsung Electronics

Circuit Description

5-2-8 Image Sensor

The shading wave is formed by scanning the white roller prior to a document. The slice level is determined by the shading wave, and

compensates for shading distortion according to the CIS characteristics. The wave format from the CIS is converted into a 6 bit digital value in the IFC image processor, and then processed in B/W or intermediate mode.

Shading Correction 0 Shade RAMQ

+,,-I Inversion Table a 8x6 Mutiplier k 0

!____a _ -#A

--p=

6 FADC -*--------------------i---------~------------------------------O ____________ Gray Scale Image I enhancement 1 a Texf mode image I

External

External Video Processing Data Input

0 Inversion Table Enabled (ShTbEnb) @ Shading Enabled (ShadeEnb) @ Edge Enhancement Enabled (EdgeEnhEnb) @ Dynamic Background and Contrast Control Enabled (DBCCErr~ - Primary Paths - - - - Secondary (optional) Paths

Figure 5-8: Scanner Image Processing Block Diagram

5-6

Samsung Electronics

Circuit Description

5-2-9 CIS Input Processor *

To process the B/W input signal, maximum (+VREF) and minimum (- VREF) values of the CIS input signal are controlled by calibrating MUXA and MUXB in the high state for the maximum level, and setting them to earth for the minimum level.

Processing to compensate for CIS shading distortion is controlled with MUXA low and MUXB high. For B/W mode, MUXA should be high, and MUXB low. For half-tone, MUXA is low, and MUXB is high.

XFC-B

External Circuits
.................., ! Shading RAM !
z................;

Scanner Image Processing

: External i ; RAM : i....*...........( { Line Buffer i . RAM i *.................

Scanner r--l

Figure 5-9: Scanner Interface Block Diagram

5-2-10 CIS Driver

The CIS driver clock frequency is 250 kHz. A 75% duty cycle is used to lengthen the charging time. A

start signal is provided every 10 ms to match the line scanning time. Actual image signal is provided in less than 6.8 ms, using the 250 kHz clock and taking A4 paper size into consideration.

250 KHZ (L:DUTY 75%) CLOCK SI

4------------------------------------------------*:

1 LINE

Samsung Electronics

5-7

Circuit Description

5-2-11 l/O Port Table

I/O 0 0 0 I I 0 I I 0 0 0 SIO SIO SIO 0 I 0 DSP RESET DSP DATA PUMP DISABLE TPH POWER (+24 V) ON DSP DATA PUMP ENABLE TPH POWER (+24 V) OFF OPE MICOM TX OPE MICOM TX TPH TEMPARATURE CHECK MIC. OFF ICM RECORD PATH DTAD BACK-UP BATTERY CHECK MIC. OFF ICM RECORD PATH MODEM TX PATH MODE DETECT SENSOR OPEN ACTIVE STATE (H) SPEAKER DISABLE CML RELAY ON (FAX) DSP HIGH BYTE SELECT ACTIVE STATE (L) SPEAKERENABLE CML RELAY OFF (TEL) DSP LOW BYTE SELECT RING DETECT DSP ACKNOWLEDGE DSP OGM TX PATH MODE DETECT SENSOR CLOSE

116

GPO2

VOL-B

115

GPO 3

VOL-c

106 105 104 103

GPO 4 GPO 5 GPO 6 GPO 7

MPA MPB /MPA /MPB

0 0

MOTOR PHASE A MOTOR PHASE B MOTOR PHASE - A MOTOR PHASE - B

0 0

5-8

Samsung Electronics

Circuit Description

5-2-l 2 Motor Controller

5-2-l 3 Miscellaneous Signals

The key click consists of an 800 Hz tone of 20 ms duration. /REST0 drives MODEM (/PORI), UART (/POR) and serves to reset the MODEM, UART. /MIRQ is the MODEM interrupt signal.

c c

The SFllOT performs sending, receiving, and printing functions utilising a single 24 volt motor. This motor has a 150 ohm winding resistance. Three drive strobe pulses operate the motor.

Table 5-l 1: Motor Functions Motor Function Swing Gear Control 1

Document Out

Drive Strobe
100 pps 1oopps 1oopps I 1oopps

5-2-l 4 Reset
2 phase l-2 phase 1 2 phase ( Two power resets and a watchdog timer in the IFC comprise the elements of this circuit. Battery power reset (/BATRST) is used to initialise the battery-powered logic, and primary power reset (/PWRDWN) initialises non-battery-powered logic when system power is supplied.

Super Fine Mode

/ Other

i+
ok (TSTCLK) Watchdog Reset XOUT ~ t Power up Delay 2 (8 TSTCLKS) (1-2 Reset clocks) R-S TO ~ntemal logic RESETn

-:

Clock enable

BATRSTn

Lockout to battery (BadwpConllg)

loCkout register reset

set mstate t

Trlstate Control

Figure 5-12: Power Reset Block Diagram

POWER MONITOR
If 5V power to KIA7045P drops to between 4.65 and 4.35V (typically 4.5V), power failure will be indicated and the output of KIA7045P will go low (GND). This causes the IFC to become active (low=reset). The IFC reset causes the MODEM IFC/RESET terminal to be reset. The output terminal of KIA7045P is an open-drain configuration, and is connected to PFC through a 10k pull-up resistor.

WATCH DOG TIMER

This programmable counter in the IFC is reset every 2 ms. If not reset after 250 ms, the system is automatically reset and switches to initialise mode.

BATTERY POWER RESET

When battery power
t i m e , VB CUrrent

(VB)

is applied to IFC the first

ESLIltS i n /BATRST going low,

causing a reset to occur.

Samsung Electronics

5-9

Circuit Description

5-3 Memory
System memory consists of 64kB ROM and 32kB RAM. Ail of RAM is backed up. ROM and RAM are selected by chip select lines, and data is accessed by the units position of the byte. c5V power is applied to RAM through VB. The SFllOT model facsimile machine uses a Li(thium) battery. A lk resistor in series with the positive battery terminal is for battery protection.

5-4 Modem and TX- and RX- Related Circuits

These circuits control signal transmission between the internal MODEM and the LIU or a remote MODEM. The R96DFXL MODEM is a single-chip fax-MODEM having features to detect and generate DTMF tones. TX OUT is the MODEM output port, and RX IN is the input port. /PORI is the IFC signal which enables MODEM initialisation at system power on. DO - D7 are data buses. RSO- RS4 are internal register select signals which determine the mode. /MCS is the chip select signal, /RD and /WR are the read and write control signals. RLSD is used for v.24 interface-related signals and /MIRQ is the MODEM interrupt. Refer to Figure 5-14 for available R96DFXL I/O ports.

PIN NO PIN NAME 100 GP 02 1 2 3 4 5 63 61 75 76 94 93 91 GP 03 GP 04 GP 05 GP 06 GP 07 GP 11 GP 13 GP 16 GP 17 GP 19 GP 20 GP 21

CIRCUIT NAME
HT-BI HOOKDET2 OFF-RST

I/O
0 I 0 I I

ACTIVE STATE (H) HALFTONE MODE

DESCRIPTION
BINARY MODE EXTERNAL TEL. IN USE

OPE RESET

RX-CTRL -GLED

0 0 I I I I I I

RX PATH CIS LED ON

REMOTE PATH CIS LED OFF

5-10

Samsung Electronics

Circuit Description

5-4-I Transmit Circuit

5-4-2 Receive Circuit

In receive mode, analog signals from the LIU board are transferred to RX IN through the BPF and smoothing filter.

f- F

This circuitry controls transmission of analog signals from the MODEM. Output voltage from the MODEM is buffered through the LIU board and OP amp after signal smoothing and filtering, and finally output to the line.

5-5 TAD
TAD circuit consists of a voice coprocessor to record and play voice messages in voice memory.

5-5-l Recording Path

R55 provides power to the condenser microphone. Voice signal from the microphone is passed through active filter U15, R117 and C96, R82, C58 to clear aliasing noise occuring while sampling and amplifying the signal. Q5 and Q2 compose ALC (Automatic Level Control) circuit. CODEC (U22) converts the voice signal to digital and converts the digital signal from voice coprocessor into analog for line output.

5-5-3 Line Input and Play Path

Incoming signals from line are stored in the voice memory (4 M DRAM) through CODEC and DSPG DRAM controller. When played, DSPG processes the data stored in voice memory and sends it out to LIU through CODEC and R108. To playback through the speaker, DSPG sends the signal to speaker through R108, MUX (U12, U14), and op amp.

5-5-4 DSPG 5-5-2 Mic Input Path

Transmit path functions as MIC input path. Outgoing messages and memo messages from CODEC are stored in the voice memory (4 M DRAM) through the DSPG DRAM controller. This circuit consists of Host Interface, Memory Interface, CODEC Interface, and DSP core. Host Interface sends and receives data to and from IFC. Memory Interface sends and receives the compressed voice data to and from DRAM to play back and record voice data. DSP core communicates with host IFC through Host Interface.

5-5-5 Voice Backup

+5V is supplied for voice memory through VBT when power is on. When power is off, +5V is supplied from the 9V backup battery.

Samsung Electronics

5-11

Circuit Description

5-6 LIU PBA

The LIU (Line Interface Unit) interfaces the MODEM and telephone to the telephone line. The FAX and telephone portions of the LIU are active with machine power on. When machine power is off, only the telephone circuitry operates, powered by telephone line voltage. The FAX portion of LIU consists of the interface between MODEM and telephone line, and the circuits for DC loop feeding, DP signal, loop current, and ring detect. The telephone portion is divided into ringer, dialling, and speech circuits. Refer to the Schemetic and Wiring Diagram sections of this manual. Refer to LIU circuit and Block Diagrams.

5-6-l FAX section

MODEM/ LINE INTERFACE This is the path for data and remote control signals.
l

RING DETECT U201 pin 28 (MO) is the ring tone output port and drives Q207, which drives FET202 and the piezo buzzer. The driving signal of the piezo buzzer is applied to photo coupler U204.

CML201 relay: switches telephone line between FAX and telephone circuits. U201 pin 3 TIT (Telephone Input Transformer): Single ended input from transformer (T202). U201 pin 3 ROT (Receive Output Transformer): Output for driving transformer (T203) with an AC impedance larger than 10 kohm. C202: DTMF and CNG detect path to T20120 kohm winding under idle conditions and DC blocking for 20 kohm winding. AC impedance: The AC impedance of U201 (ILIU) is set to 1000 ohm by external capacitor (C215) at U201 pin 8 CI (Complex Impedance input) port. With external resistor (R249) at U201 pin 34 AC1 port it can be programmed to 600 ohm. U201 pin 35 CS (Current Shunt control output) port is an N-channel open-drain output to control the external high power shunt transistor for synthesizing AC and DC impedances. DC conditions: Normal operating mode is from 15 mA to 100 mA. An operating mode with reduced performance is 5 mA to 15 mA. In the line hold range from 0 mA to 5 mA, the device is in a power down mode and the voltage at U201 pin 37 LI (Line Input) port is reduced to a maximum of 3.5 V. The DC characteristic is determinedby the voltage at U201 pin 37 LI port and a R215 resistor between U201 pin 37 LI and Pin 39 LS port. It can be calculated by the equation: VL~ = VLI + ILINE x R215

LLC (Line Loss Compensation)/LOOP

CURRENT DETECT
l

The LLC is a pin option. When activated, the transmit and receive gains for input and output are decreased by 6 dB. Line current is 20 mA when U201 pin 31 LLC is connected to AGND and 75 mA when this pin is connected to Vcc. The LLC is deactivated when LLC pin is connected to Vss. When the CML201 relay or hook switch switches to telephone line, U201 on the LIU board and U6 on the Main board start communication. U201 sends <Ack> message which contains line current information. Using this line current information, Main CPU can recognize a parallel phone.

SERIAL INTERFACE U201 pin 11 RXD : Schmitt triger input (threshold = 2.5 V) to serial interface. U201 pin 29 TXD : Open-drain output from serial interface. The communication is via a standard UART: Baud Rate 9600 Start Bit 1 Stop Bit 1 Date Bits 8 Parity Bit None LSB is transferred prior to MSB

5-12

Samsung Electronics

Circuit Description

5-5-2 Telephone Section

RINGER CIRCUIT

DP DIAL
l

Current Sense Input).

When a ringing voltage is sensed on the line, Vcc of U201 (I-LIU) is charged via an external path. When operating voltage is reached, the oscillator starts and U201 detects the ring frequency. After a valid ring frequency is applied to the U201 pin 25 RFD (Ring Frequency Discrimination) port, the ring tone generator of U201 sends out a 3-tone melody via U201 pin 28 MO (Ring Melody Output) port. U201: I-LIU and associated components.

U201 pin 2 (DMS) is set to Vcc (33/67) or Vss (40/60) by R227 or R228. Dial pulses originate at U201 pin 27 (DPn), which toggles Q205, driving Q201. The resulting intermittent voltage interrupts the telephone line. Pulse MB ratio is set by U201 pin 2 MDS port. Vcc = 33~67, and Vss = 40160. U201 pin 35 CS port: Modulation and shorting the line during make period of pulse dialling.

c+

p*

*\ f-9

Ring frequency passes through DC blocking capacitor C201 or C234 (for Switzerland or Austria) and zener diode ZD205 or ZD209 (for Switzerland or Austria) to U201 pin 25 RFD port. Line ring AC voltage passes through DC blocking capacitor C201, current limit resistor R203, diode bridge BD201, CML relay and hook switch to FET202 (BS170) pin3, C217,ZD207 and R226. The ring frequency discriminator of U201 assures that only signals with a frequency between 13 Hz and 70 Hz are regarded as valid ring signals. * When a valid ring signal is present for 73 ms continuously, the ring melody generator (pin 28, MO) is activated and remains active as long as a valid ring signal is present. U201 filters the ring signal and applies it to output pin 28 (MO). This is the piezo buzzer drive signal. The 3 basic melody frequencies are: Fl = 880 Hz, F2 = 1067 Hz and F3 = 1333Hz. The repetition rate is set to 4 which means that the sequence of Fl, F2, F3, Fl, F2, F3 is repeated 4 times per second.
l l l

SPEECH CIRCUIT
l

U201 (STI9510) and associated components.

Handset transmitter circuit Transmit (condenser mic.) of handset is filtered by R213, R242, R243, R244, C221, C223, C224, C225, C231, C232 and C246, and then amplified by U201 pins 32 and 33 (Ml, M2). . Handset receiver circuit Dynamic recever of handset is filtered by R245, C226, C227, C228 and C248, and then applied to U201 pin 1 (ROH). U201 pin 39 (LS) is audio output to telephone line.

SIDETONE CIRCUIT
l

Sidetone audio characteristics are controlled by R217, R218, C212, and C214, connected to U201 pin 7 STB.

MF DIAL
l

9 c
l

U201 pin 2 DMS (Dial Mode Selection) port is set by T/P switch (SW202). MF signal appears (tone level of low group: typical -14 dBm) at U201 pin 4 MFO (DTMF Generator Output). This signal is levelled by R248, R250 and C235, then to Amplifier U201 pin 9 MFI (DTMF Amplifier Input). Line dial signals appear at U201 pin 39 LS (Line

Samsung Electronics

5-13

Circuit Description

5-7 OPE PBA

OPE PBA consists of U300 (MICOM Z8601), LCD, key matrix, LED indicators, and the paper empty sensor. Refer to OPE Circuit and Block Diagrams.
l

Signals from the key matrix are delivered to U300 X/Y input pin group @l-X). Connector P4 is NPO (No Power Operation) key matrix output. U300 pin 4 (RX DATA) is UART data to MAIN PBA. Display from controller is received at U300 pin 5 (TX DATA). LCD drive signals are U300 P2-X pin group, connector pin P2-1 - P2-3.

Machine status LED drive signals are U300 PO-X pin group. . Paper empty sensor staturs delivers to U300 pin 39. (High: paper empty, Low: paper exists).
l

i
UART 2 / ) Connector Reset

MICOM Z-8601

/a +; (qz+iiq J-q T
Samsung Electronics

Figure 5-13 OPE Block Diagram

5-14

6. Troubleshooting
6-1. Overall Troubleshooting Flow
Plug in the power cord

f
Load document in feeder Push START Key

OGM Recording

Call machine from another phone

Samsung Electronics

6-l

Troubleshooting

6-2

Samsung Electronic

Troubleshooting

6-2. Check Power Supply

Check AC socket

Connect as required

Notify customer

Check Cl2 Voltage

Replace Cord

Replace Fuse

Replace Fuse

Check Ul waveform d

Check Ul output
waveform

IF?
Remove short

Replace Ul

Samsung Electronics

6-3

Troubleshooting

6-2-l N o +5V

Check U2 Input voltage

Check CON 1

Check PCB Pattern

Replace U2

6-2-2. No + 12 V

Check CON1

Check PCB Pattern

Replace U3

6-4

Samsung Electronics

Troubleshooting

6-2-3 No -12 V

Check U4 Input voltage

Remove short

Replace D4

Check CON1

pii---)

Check PCB Pattern

Replace U4

f-7
6-2-4 No + 24V

Remove short

Replace D3

Cl2 Discharged

Check CON1

*(x---)

Samsung Electronics

Troubleshooting

6-2-5 + 24 V TPH Doesnt output

(y-c---)Remove short
1

Samsung

Electronics

6-6

Troubleshooting

6-3. System Not Initialized

7
Start

Check vcc 2 4.75 v Pl-10 (+5V) Pl-11,12 (GND5)

Replace U3 Voltage detector IC

Clock Ul-133

Clock UlO-69

Replace Xl XTAL

Samsung Electronics

6-7

Troubleshooting

Continued

23
End

6-8

Samsung Electronics

I rourxesnoorlny

6-4 Document Not Loading

Start

w Insert Document

Replace D-DET PBA

See Section 6-2

Replace Ul

Samsung Electronics

6-9

Troubleshooting

6-5 No Copy Mode Operation

(--yL--)
Reloading Document

Replace Main PBA

Replace Ul

Replace U2

See Section 6-2

Replace Ul

Replace U4

6-10

Samsung Electronics

Troubleshooting

Continued

rcplrirlll

See Section 6-2

Replace CIS

iI

Samsung Electronics

6-11

Troubleshooting

6-6. OGM Not Playing Back

Speaker On

Replace main board

Replace Mic. I Y 7 END Y Replace U20

v Replace speaker

6-l 2

Samsung Electronic

Troubleshooting

6-7. ICM Not Recording

Call machine from other phone

) Check LIU board

J

CT3
End

Samsung Electronics

6-l 3

Troubleshooting

6-8. Malfunction in Auto Answer

7
Start * Call machine from another phone Replace Ul D

Q
Replace LIU board I 6-14

Samsung Electronic:

Troubleshooting

6-9. Malfunction in Manual Receiving

Lift handset from

Check hook switch in CONN board

W Check LIU board

) Replace LIU board

Replace main board

Samsung Electronics

6-15

Troubleshooting

6-10. Automatic Receive Malfunction

Call fax machine

/
4

Machine to

Auto Answer ?

Y i I
Replace: Main Board

0
N
Manual Receive

6-l 6

Samsung Electronics

Troubleshooting

6-11. No Dial Tone

Press OHDIV.REQ.

OK I
check service at

NG

G
Lift Handset Check I Replace:

Request Telephone Service

Main Board U2

Check/Replace: Hook Switch P7 & Wiring LIU u201

Samsung Electronics

6-l 7

Troubleshooting

6-12. Transmit Failure

e
Load document

0
Start

1.
Dial Receiving Machine

6-l 8

Samsung Electronics

7 Electrical Parts List

7-1 MAIN PBA
Capacitor / Resistor tolerance: D:0.5%,F:l%,G:2%,J:5%,K:lO%,M:20%,Z:+80%,-20%

I I

1 Ref. No. 1

I
Cl
c2 c3

Description PBA, PCB Assembly, MAIN - Cauacitors Ceramic, Chip, 680 pF, J, 50 V Ceramic, Chip, 680 pF, J, 50 V Ceramic, Chip, 680 pF, J, 50 V

SEC Code

Remark

2203-001132 2203-001132 2203-001132 / 1 2203-001132 2203-001132 2203-000239 2203-000239 2203-001132 2203-001132 2203-000192 2203-000192 1 I

lC4 Ic5 C6 c7

1 Ceramic, Chip, 680 pF, J, 50 V I Ceramic, Chip, 680 pF, J, 50 V Ceramic, Chip, 100 pF, J, 50 V Ceramic, Chip, 100 pF, J, 50 V Ceramic, Chip, 680 pF, J, 50 V Ceramic, Chip, 680 pF, J, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V I Ceramic, Chip, 100 nF, Z, 50 V I Ceramic, Chip, 100 nF, Z, 50 V I Ceramic, Chip, 100 nF, Z, 50 V

1 C8
c9
Cl0 Cl1 Cl2 Cl3 Cl4 Cl5 Cl6 Cl7 Cl8 Cl9 c20 c21 c22 C23 C24

2203400192 2203-000192
2203-000192 I I I 2203-000192 2203-000192 2203-000192 2203-000192 2203-000192 2203-000192 2203-000192 2203-000192 2203-000192 2203-000192 I 2203-000192 2203-000192 2203-000192 2203-000192 2203-000192 2203-000192 I 2203-000192 2203-000192 I I I

I I

1 1
1 1

I I

I I I I

I I I I

I Ceramic, Chip, 100 nF, Z, 50 V I Ceramic, Chip, 100 nF, Z, 50 V I Ceramic, Chin, 100 nF, Z, 50 V
Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V I Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V I Ceramic, Chip, 100 nF, Z, 50 V 1 Ceramic, Chip, 100 nF, Z, 50 V 1 Ceramic, Chip, 100 nF, Z, 50 V

I I I

1 1

C25 C26 C27 C28 c29 c30 c31 1 C32 C33

I I

1
I

Samsung Electronics

7-l

Electrical Parts List

7-2

Samsung Electronics

Electrical Parts List

Cl14
Cl15 Cl16 Cl17

Ceramic, Chip, 680 pF, J, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V

2203-001132 2203400192 2203-000192 2203400192

Samsung Electronics

7-3

Electrical Parts List Ref. No.

Cl18 Cl19 Cl20 Pl P2 P3 P4 P5 I6 P7 I8 P9 SOKl Dl D2 D3 D4 D5 D6 D7 D8 D9 DlO ZDl ZD2

Description
Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V Ceramic, Chip, 100 nF, Z, 50 V

SEC Code
2203-000192 2203-000192 2203-000192 13711-000657 3711-002815 3711-000398 3711-000411 3711-000517 3711-000496 3711-000470 3711-000452 3711-000443 3704-000255 0401-000116 0401-000116 0401-000116 0401-000116 0401-000116 0401-000116 0401-000116 0401-000116 0401-000116 0401-000116 0403-000464

Remark

- Connectors Header, Box, 12 Pin Header, Box, 14 Pin Header, 3 Wall, 10 Pin Header, 3 Wall, 12 Pin Header, 3 Wall, 8 Pin Header, 3 Wall, 6 Pin Header, 3 Wall, 4 Pin Header, 3 Wall, 3 Pin Header, 3 Wall, 2 Pin Socket, IC; 32 Pin

- Diodes Switching, MMSD914Tl Switching, MMSD914Tl Switching, MMSD914Tl Switching, MMSD914Tl Switching, MMSD914Tl Switching, MMSD914Tl Switching, MMSD914Tl Switching, MMSD914Tl Switching, MMSD914Tl Switching, MMSD914Tl Zener, PTZ!%lB, 5.lV Zener, PTZ5.1B, 5.1V

0403-000464

u9
UlO Ull u12 u13 u14

Op amp, 4558 MODEM, R96DFXL Op amp, 4558 Analog Switch, MC14053B OP amp, 4558 Analog Switch, MC140538

1201-000189 1205-000246 1201-000189 1001-000172 1201-000189 1001-000170

7-4

Samsung Electronics

Electrical Parts List Ref. No.

u15 U16 u17 U18 u19 u20 u21 u22 U23 Rl R2 R3 R4 OP amp, 4558 Audio amp, MC34119 CMOS Logic, 74HC245 CMOS Logic, 74HC32 CMOS Logic, 74HCOO DSP, 16 bit, D6305BllAQA DRAM, 44C1000,lM x 4 bit CODEC, TI3054J 1 Analog Switch, TC4S66FT I

Description

SEC Code
1201-000189 1205-000105 0801-000696 0801-000411 0801-000792 0904001068 1105-000133 1205-000120 1001-000133 2007-000300 2007-000300 2007-000300 2007-000300 1 1 1 2007-000282 2007-000300 2007-000300 2007-000300 2007-000300 2007-000300 2007-000300 2007-000468 2007-000300 2007-001289 2007-000300 2007-000300 1 2007-000300 1 1 1 2007-000300 2007-000300 2007-000300 2007-000941 2007-000409 2007-000300 2007-001208 2007-000300 1 2007-000300 2007-000300 2007-000546 2007-000917 2007-000572 1 2007-000572 1 1 2007-000572 1 1 1 1 1 1 1 I

Remark

I I

- Resistors Chip, 10 kohm, J, l/10 W Chip, 10 kohm, J, l/10 W Chip, 10 kohm, J, l/10 W Chip, 10 kohm, 1, l/10 W 1 Chip, 100 kohm, J, l/10 W 1 Chip, 10 kohm, J, l/10 W

I I
1

Im IR6
1R7 R8 R9

I
1
I

1 Chip, 10 kohm, J, l/10 W

Chip, 10 kohm, J, l/10 W

Chip, 10 kohm, J, l/10 W

Chip, 10 kohm, J, l/10 W

RlO Rll R12 R13 R14 R15 R16 1 R17

Chip, 10 kohm, J, l/10 W ^

Chip, 1 kohm, J, l/10 W Chip, 10 kohm, J, l/10 W Chip, 20 ohm, J, l/4 W Chip, 10 kohm, J, l/10 W Cl-k, 10 kohm, T, l/10 W 1 Chip, 10 kohm, J, l/10 W 1 Chip, 10 kohm, J, l/10 W

IR18

I I

I=J Iw1
I

IR19

1 Chip, 10 kohm, J, l/10 W 1 Chip, 10 kohm, J, l/10 W I Chip, 47 kohm, J, l/10 W

*

R22 R23 R24 R25 R27 R28 lx29 R30 1 1R31 1 R32

Chip, 15 kohm, J, l/10 W Chip, 10 kohm, J, l/10 W Chip, 82 kohm, J, l/10 W

Chip, 10 kohm, J, l/10 W 1 Chip, 10 kohm, J, l/10 W

Chip, 10 kohm, J, l/10 W Chip, 20 kohm, J, l/10 W Chip, 46.4 kohm, F, l/10 W Chip, 220 ohm, J, l/10 W

1 Chip, 220 ohm, J, l/10 W

1 Chip, 220 ohm, J, l/10 W

Samsung Electronics

Electrical Parts List

R69 R70 R71 R72 R73 R74 R75 R76

Chip, 39 kohm, J, l/10 W Chip, 7.5 kohm, J, l/10 W Chip, 6.2 kohm, J, l/10 W Chip, 1.2 kohm, J, l/low Chip, 330 kohm, J, l/10 W Chip, 330 kohm, J, l/10 W Chip, 220 ohm, J, l/10 W Chip, 1 Mohm, J, l/10 W

2007-000830

2007-001141
2007-001055 2007-000221 2007-000757 2007-000757 2007-000572 2007-000477

Samsung Electronics

Electrical Parts List

Samsung Electronics

7-7

Electrical Parts List

Ref. No.
R120

Description
Chip, 33 kohm, J, 1 /lO W

SEC Code 2007-000774

2007-000409 2007-000572 0501-000279 0501-000342 0501-000385 0501-000279 0501-000279

Remark

R121
R122

Chip, 15 kohm, J, l/10 W

Chip, 220 ohm, J, l/10 W

- Transistors -

Ql Q2
43 Q4 Q5

Small Signal, KSAll82, PNP Small Signal, KSC2982, NPN Small Signal, KSC5019, NPN Small Signal, KSAll82, PNP Small Signal, KSAll82, PNP

I I I

I IL1 IL2
r-3

- Miscellaneous I Inductor, SMD, 3.3 PH, K ( Resistor, Chip, 0 ohm, J, l/10 W Resistor, Chip, 0 ohm, J, l/10 W Crystal, 0.032768M Crystal, 24.00014M Crvstal, 29.4912M Battery-LI, 3V, 210mA PCB, MAIN, Blank ( 2703-000185 2007-000029 2801-001498 2801-001528 2801-001530 4301-000108 ( I I2007-000029

I
I

Xl x3

x4
BAT PCB

7-8

Samsung Electronics

Electrical Parts List

7-2. OPE PBA

I I I I
I

I ho1 II3302
ho3 R304
R305

- Resistors -

1 Chip, 22 kohm, J, l/8 W 1 Chip, 22 kohm, J, l/8 W 1 Chip, 200 ohm, J, l/8 W
Chip, 0 ohm, J, l/8 W

Chin 22 kohm, T, l/8 W

1 Chiu,22kohm,T,1/8W

I I I
I
1 1 1 1 1 1

1 R306 IR307
k3@3

km9 JR310
I Ix311
I

( Chip, 22 kohm, J, l/8 W ) Chip, 10 kohm, J, l/8 W 1 Chip, 22 kohm, J, l/8 W

I Chip, 22 kohm, T,1/8 W
I A

I Chip, 10 kohm, T, l/8 W

1 Chin. 22 kohm, T. l/8 W

1 R312 R313 R314 R315

1 Chip, 200 ohm, J, l/8 W I Chip, 22 kohm, J, l/8 W 1 Chip, 680 ohm, J, l/8 W
1 Chip, 330 ohm, J, l/8 W

1 R316

Samsung Electronics

7-9

Electrical Parts List

- Transistors Q301 Q302 Q302 Small Signal, NPN, KSA1182-Y Small Signal, NPN, KSA1182-Y Small Signal, NPN, KSA1182-Y 0501-000279 0501-000279 0501-000279

- Miscellanceous -

Harness, Wire Connector, Header, 3.Wall,2 Pin Harness, Wire IC-Micom, Mask

JF39-41037A 3711-000438 JF39-41038A JF09-10052A

7-10

Samsung Electronics

Electrical Parts Lit

7-3. HOOK PBA

Ref. No. I Description Assembly, HOOK 1 SEC Code I Remark JF92-00778A
II I I

1 1
I

PCB
I Pl

I PCB, Blank, HOOK

I

I Switch, Hook, 48 V, 200 mA

I Connector, Header, 11 Pin
I Connector, Header, 2 Pin

1I

3409-000118

1 371 l-000402 I3711-000815

1 P2

7-4. D.DET PBA

Ref. No. 1 Description Assembly, D.DET
I PCB, Blank, D.DET Interrupter 1 Harness. Wire

1 SEC Code

[ Remark

1 1 IJCB
I
1 SENl IPl

I
10604-000230
1 TF39-40826A

I
1

I
I

7-5. P.EMPTY PBA

Ref. No. 1 Description Assembly, P.EMPTY
PCB PCB, Blank, D.DET Switch, Detector Harness, Wire 3409-000172 1 JF39-40986A

1 SEC Code

1 Remark

Samsung Electronics

7-11

Electrical Parts List

7-6. HANDSET PBA

Ref. No. 1 Description ASSEMBLY, HANDSET PCB
PCB ZDl MIC Rx PCB, Blank, Handset Diode, Zener, lN4736A Mic, Condensor Audio, Receiver 0403-000142 3003-000103 3009-000154

1 SEC Code

I Remark

7-7. OTHERS

7-12

Samsung Electronics

Electrical Parts List

7-8 Power Supply (Input Voltage : 220 V)

Location No Description FET 8OOV,5A Transistor, NPN 6Ov, 150rnA Ul u2 u3 u4 PC1 BDl Dl D2 D3 D4 D5 D6 D7 D8 ZDl ZD2 ZD3 ZD4 PWM Control IC DIP 8Pin IC Regulator +5V,l.OA,Min IC Regulator -12V,05A IC Regulator + 12V,O.5 A Photo Coupler 5.0 kVAac, 50 mA, CRT50-400% Diode-Bridge 6OOV,4A Diode-FR 1 kV, 1 A, 75 ns Diode-FR 2OOV,l A Diode-FIX 200 V, 10 A Diode-FR 2OOV,l A DiodeSchottky 60V,3A Diode-SW 75 V, 0.15 A, 4 ns Diode-SW 75 V, 0.15 A, 4 ns Diode-FR 200 V, 1 A, 35 ns Diode-Zener 0.5 w, 20 v Diode-Zener 0.5 W, 6.2 V Diode-Zener 0.5 w, 18 v Diode-Zener 1 W,27V 2SK1537 KTC3198Y(C1815Y) KSC945C-Y FA5311P KA7552 LM2940T-50 L494OV5 KA78M12CT NJM78M12FA KA79M12CT NJM79M05FA TCDTllOlG PC111 D3SBA60 RBV406 BYIll-1000 BYV26E UF4003 DlNL20U DlOLC20U BYQ28-200 UF4003 DlNL20U S3S6M SB360 lN4148 lN4148 lN4148 lN4148 UF4003 DlNL20U MTZ20B lN5250B MTZ6.2B lN5234B MTZ18C lN5248B TZP27B lN4750A Part No Vendor SHINDENGEN KEC SEC 996-201354AA SEC Code

Q1 Q2

FUJI
SEC NS S-T SEC 996203254AA 996203254AC 996203413AA

JRC
SEC

JRC
TELEFUNKEN SHARP SHINDENGEN SANKEN S/T PHILIPS GI SHINDENGEN SHINDENGEN PHILIPS GI SHINDENGEN SHINDENGEN GI ROHM-KOREA TELEFUNKEN ROHM-KOREA TELEFUNKEN GI SHINDENGEN ROHM-KOREA TELEFUNKEN ROHM-KORE A TELEFUNKEN ROHM-KOREA TELEFUNKEN ROHM-KOREA TELEFUNKEN 996-203005AC 996-203307AD 996203201AB 996203151AD 996203005AD

Samsung Electronics

7-13

Electrical Parts List Description

(ZAP-X, ;!2onF,25ov (XP-x, 1100 nF, 125 v
I

Part No 2222-335-10224M 1 KNB1530-0.22-250VAC 2222-335-10104M KNB1530-O.l-250VAC 1 HCYE2G222MAA DE7100F222MVAl-KC HCYE2G222MAA DE71OOF222MVAl-KC

I

Vendor PHILIPS ISKRA PHILIPS-KOREA ISKRA SEM MURATA SEM MURATA SEM MURATA SEM MURATA SAMHWA SAMYOUNG SEM MURATA SAMHWA SHINSHIN SAMHWA

SEC Code

(Z-CERAMIC

2.2 nF, 400 V

(Z-CERAMIC

2.2 nF, 400 V

tCAP-Y,

HCYE2G472MAA ) DE7150F472MVAl-KC
I

1.7 nF, 400 V

IC-CERAMIC

HCYE2G472MAA DE7150F472MVAl-KC HD2GVB127MHA KMH2GVNSN121M22F HCYE2G472MAA DE7150F472MVAl-KC

4.7 nF, 400 V

,C-ELECTROLYTIC

C-CERAMIC 4.7 nF, 400 v

r
Cl0 Cl1 Cl2

( : (

1 kV, 100 pF
tC-CERAMIC

HCYB3AlOlKDB SR215A471KAA CR051BCOH471 J RXlVJB336M SXElWB33OMMC TSlHRB472KAN TSlHRB472JAN TSlHRB473KAN 1 TSlHRB473JAN

SEM AVX SAMHWA SAMHWA SAMYOUNG SAMHWA SAMHWA SAMHWA SAMHWA SGS-T SAMHWA SAMHWA

470 pF, 50 VDC

IC-ELECTROLYTIC

33@,35V
,C-MYLAR

t--p--Cl4 Cl5 Cl6

F
I I

4.7 nF, 50 V/100 V C-MYLAR 47 nF, 50 V/100 V

I I
I

lnF,lkV Cl8 Cl9 c20 c21 C24 C-ELECTROLYTIC 1000pF,35v C-ELECTROLYTIC 33pF,35v C-ELECTROLYTIC 100 pF, 35 v C-ELECTROLYTIC 680$,16V C-ELECTROLYTIC 68OpF,16V

HCYB3A102KDB RGlVHB108M SXElWB102MMC RGlVJB336M SMSlWB33OMMC RGlVJB107M SXElWBlOlMMC RYlCHB687M SXElCVB681MMC RYlCHB687M SXElCVB681MMC

SEM SAMHWA SAMYOUNG SAMHWA SAMYOUNG SAMHWA SAMYOUNG SAMHWA SAMYOUNG SAMHWA SAMYOUNG

7-14

Samsung Electronics

Electrical Parts List

Location No
C25

Description
C-ELECTROLYTIC 100 LlF, 35 v C-ELECTROLYTIC

Part No
RGlVJB107M SXElWBlOlMMC

Vendor
SAMHWA SAMYOUNG SAMHWA SAMYOUNG

SEC Code

1 C27 C29

) C-ELECTROLYTIC 33pF,35v C-ELECTROLYTIC l)lF,5OV C-ELECTROLYTIC 33@,35V C-CERAMIC 100 nF, 50 w C-CERAMIC 100 nF, 50 v R-VARIABLE 0.5 W, 1 k Top ADJ R-CARBON l/2 W, 560 kO, 5 % R-METAL OXIDE lW, 100 kQ, 5 % R-METAL OXIDE lW,lookQ,5% R-METAL OXIDE 2W, 100 kQ, 5 % R-CARBON 1/4W,27 kQ5% R-WIRE WOUND 1 w, 0.15 Q, 1% R-CARBON 1/4W,22Q 5% R-METAL OXIDE 1/4w, 120 a, 1% R-METAL OXIDE 1/4w, 200 a, 1% R-METAL OXIDE 2W, 5.6 kQ 1% R-CARBON 1/4W,2.2kQ 5% R-CARBON 1/4W,12kS2 5% R-CARBON l/8 W, 1.0 kn 5 %

1 RGlVJB336M SMSl WB330MMC RGlHJB105M SMSlHVBOlOMMC RGlVJB336M SMSl WB330MMC CGFlH104ZFK CCYVlH104ZF CGFlHlaQZFK CCYVlH104ZF EVN-DJAA03BlK 25PRlK RD1/2W 560KJ RSSlW22OKJ RSSlW220KJ RSS2WlOOKJ RD1/4W27KJ RWlW0.15F RD1/4W22J RSl/4W120F RS1/4W2OOF RS1/8W5.6F RD1/4W 2.2KJ RDl/4W12KJ RD1/8W68OJ SAMHWA SAMYOUNG SAMHWA SEM SAMHWA SEM MATSUSHITA BECKMAN ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON HANMI ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON

C34
C38 c40 VRl Rl R2 R3 R4 R5 R6 R7 R8 R9 RlO Rll R12 R13

Samsung Electronics

7-15

Electrical Parts List

Location No
R14 R15 R16 R17 R18 R19 R20 R21 R25 LFl LF2 Ll Tl Bl B2 B3 TNRl NT1

Description
R-CARBON l/8 W, 4.7 kQ 5 % R-CARBON l/8 W, 6.8 kQ 5 % R-CARBON l/8 W, 2.2 kR 5 % R-CARBON 1/4W,lOkQ 5% R-METAL OXIDE 2 W, 820 525 % R-CARBON 1/4W,22Q 5% R-CARBON 1/4w,150n 5% R-METAL OXIDE lW,4.7sz 5% R-CARBON l/4 W, 390 kSZ 5 % COIL COIL COIL TRANS-MAIN EER 28/34 BEAD BEAD BEAD Surge Absorber 140 VAC, 0.6 A Thermistor 10 ohm Relay, Fuse Glass 250 V, 2 A HARNESS, 12 PIN IN LET, 250 V, 6 A RSSlW4.7J

Part No
RD1/8W4.7KJ RDl/8W6.8KJ RD1/8W2.2KJ RD1/4WlOKJ RSS2W82OJ RD1/4W22J RDl/4W15OJ

Vendor
ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON ROHM-KOREA DOOWON FINE DUCKSAN FINE DUCKSAN FINE DUCKSAN FINE DUCKSAN SAMHWA SAMHWA SAMHWA MAIDA ILJIN DOSHIN SANGSHIN CHUNGWON TRIAD SAMJOO DAESUNG S-CRAFT TSC

SEC Code

RD1/4W390KJ 4L19-0792-HO20 4L19-0792-HO20 4LO4-1415 4T21-0918-HO20 BFD3550R2F BFD3512R2F BFD3550R2F D6921ZOV301RA09 INR14D471K lOD-9 KLO9LOlO KM1 l-M24F 50T020H T50020H SK-HN-0739 EAC-409-030 ACR303BlO

A A

RLl Fl CON1 INLET

7-16

Samsung Electronics