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COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

• 75532

component maintenance manual
(with illustrated parts list)

HMEC 25

This manual includes coverage of the following equipment: Model No Boomset HMEC 25-KAX Sennheiser Part No 025-230-415

Sennheiser electronic GmbH & Co. KG D - 30900 Wedemark Tel.: 05130 / 600 - 0 Fax: 05130 / 600 - 300 Vendor Code: D 8114

Printed in Germany

23-41-35
June 29/98

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

RECORD OF REVISIONS REV NO ISSUE DATE DATE INSERTED BY REV NO ISSUE DATE DATE INSERTED BY REV NO ISSUE DATE DATE INSERTED BY

23-41-35
Record of Revisions Pages 1/2 June 29/98

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

RECORD OF TEMPORARY REVISIONS TEMPORARY REV NO PAGE NUMBER ISSUE DATE BY DATE REMOVED BY

23-41-35
Record of Temporary Revisions Pages 1/2 June 29/98

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COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 SERVICE BULLETIN LIST SERVICE BULLETIN NO MANUAL REVISION NUMBER MANUAL REVISION DATE SUBJECT NOTE: Refer to modification history figure preceding schematic diagrams for additional service bulletin information 23-41-35 Service Bulletin List Pages 1/2 June 29/98 .

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Fixtures. and Equipment Description and Operation Illustrated Parts List Testing and Troubleshooting * The asterisk indicates pages changed. added. 23-41-35 List of Effective Pages Pages 1/2 June 29/98 . or deleted by the current change.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 LIST OF EFFECTIVE PAGES SUBJECT Title Record of Revisions Record of Temporary Revisions Service Bulletin List List of Effective Pages Table of Contents Introduction 1 2 1 2 PAGE DATE June 29/98 June 29/98 Blank June 29/98 Blank Cleaning SUBJECT Disassembly PAGE 301 302 303 304 401 402 501 502 601 602 701 702 703 704 801 802 901 902 903 904 1001 1002 1003 1004 1005 1006 DATE June 29/98 June 29/98 June 29/98 Blank June 29/98 Blank June 29/98 Blank June 29/98 Blank June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 Blank June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 Blank Check 1 2 1 2 1 2 1 2 3 4 1 2 3 4 5 6 101 102 103 104 105 106 107 108 109 110 111 112 June 29/98 Blank Repair June 29/98 Blank June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 Blank June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 Assembly (Including Storage) Fits and Clearances Special Tools.

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................... 401 3..................................... Procedure ................................. 101 1............................ 101 B.................... Precautions and General Techniques ........................................................................... Procedures .......................................... 302 C............COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 TABLE OF CONTENTS SUBJECT PAGE INTRODUCTION ................................................................. NoiseGard® active noise compensation .............................................. 301 1............................................................................ 2 4........................ Electrical Description ................................................................. Introduction ................................................................................................ 401 1...... 401 23-41-35 Table of Contents Page 1 June 29/98 ................................................................................................................................. Troubleshooting Approach . 3 4............................................................................................................................ General ................................................................................................... Equipment Specifications ......................................... 301 A.............................................................................................. Introduction .......................................... 103 A.......................................................... Test Equipment and Power Requirements .................................................................................................................................................................................... Testing ............................................... 2 3.................................. 1 2.............................................................................................................................................................. List of Illustrations ..... 302 B................... Microphone Arm Holder Disassembly ....................................... 3 A............................................... Purpose of Equipment ......... Equipment Description .................................. General ........................................................................... 101 A.................................. 303 CLEANING .......................................................................... 104 E......... 103 B.............. Ear pad Disassembly ........................................................................................................................................ Advisories ......................... 101 2................................................................................................. 3 B................................................................................. Headphone Capsule Disassembly ................................ Philosophy ........................................... 104 D................................................ Introduction to HMEC 25 Troubleshooting ..................................................................................................................... 301 3...................................... 1 3...... 1 1....... 1 1........................................ 401 2............... Troubleshooting ............................................................................................................................................................................. 101 C........................................................................................................................... 103 C..................... Mechanical Description .................................................................................... 5 TESTING ............................................................... Test Procedures ............................... Troubleshooting Aids ......................... 4 DESCRIPTION AND OPERATION . 1 2................. 301 2........ Cleaning Materials ...................... Introduction ...... 105 DISASSEMBLY ........ Frontispiece ..........................................................

..... 501 1........................................................ Detailed Assembly Procedures ........................................... Introduction ....... Procedures ............................ Microphone Arm Holder Assembly ........................ 704 5....................................................................................... 1001 1................. FIXTURES.......... 701 A.......................... Wiring ............................ Detailed Parts List ..................................................................... Repair Supplies . 701 A.......................................................................................... 702 B.............................................................................................................................................................. 901 1................................................. 601 2.............................................................................................................................................................................. 501 REPAIR .......................................................... Introduction ............................................................................................................................. Ear Pad Assembly ............... 703 C................................................................ 501 2............................. Headphone Capsule Assembly ......... 601 1................................... Procedures ......... 601 3.................................................... 801 SPECIAL TOOLS....................................................... 601 ASSEMBLY ......... Introduction ........................................................................................................................ AND EQUIPMENT ...................................................................................................................................... Final Testing .............................................................COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 TABLE OF CONTENTS SUBJECT PAGE CHECK .................. 701 1...... Test Equipment/Resource Requirements ....................................................................................................................... 1001 23-41-35 Table of Contents Page 2 June 29/98 ............................................................................................................................ 901 ILLUSTRATED PARTS LIST ................................ 701 2......................................................... 701 3............................. 704 FITS AND CLEARANCES ........... Storage Instructions .......................................... General ...... 1001 A...................................................................................................................................... Precautions and General Techniques ......... 703 4................................................................

Assembly (Including Storage). SO THAT ALL NEW HEADSETS FOR AVIATION (E. When reporting a specific problem. General This component maintenance manual (with illustrated parts list) includes maintenance instructions prepared in accordance with ATA Specification No 100 for Manufacturers’ Technical Data for the Sennheiser HMEC 25 Boomset. The procedures are prepared for the mechanic that performs shop work and not for the aircraft mechanic. BEFORE ATTEMPTING ANY MAINTENANCE OPERATION ON THE EQUIPMENT COVERED IN THIS MANUAL. REMARK: TESTING AND SERVICING HEADPHONE AND MICROPHONE SECTION IS HANDLED IN TWO SEPARATE MANUALS. WITH THE NEW VERSION OF THE HMEC 25 BOOMSET THE MICROPHONE AMPLIFIER IS LOCATED IN THE HOUSING OF THE NEW MKE 45 ELECTRET MICROPHONE.30900 Wedemark 23-41-35 Introduction Page 1 June 29/98 . HME 45 AND HMEC 45) ARE EQUIPPED LIKEWISE. and the page number. Check. Cleaning. This component maintenance manual provides shop-verified procedures that will enable a mechanic unfamiliar with the equipment to restore it to a serviceable condition. and Equipment. THIS MODULAR DESIGN OF ELECTRET MICROPHONE CAPSULE AND MICROPHONE AMPLIFIER FITTED TOGETHER IN A STAND-ALONE HOUSING SEPARATE FROM THE HEADPHONE SECTION PROVIDES A HIGHER FLEXIBILITY TOWARDS NEW PRODUCTS. KG Publications Department D . Although every effort has been made to keep it free from errors.G. Fits and Clearances. and Illustrated Parts List. Repair. Special Tools. VERIFY THAT YOU HAVE COMPLETE AND UP-TO-DATE PUBLICATIONS BY REFERRING TO THE APPLICABLE PUBLICATIONS AND SERVICE BULLETIN INDEXES. We welcome your comments concerning this manual. CAUTION: THE MATERIAL IN THIS MANUAL IS SUBJECT TO CHANGE. the paragraph or figure number. HMEC 25. Testing. The maintenance instructions are presented in the following sections: Description and Operation. Disassembly. Fixtures. Send your comments to: Sennheiser electronic GmbH & Co.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 INTRODUCTION 1. some may occur. please describe it briefly and include the manual part number.

............................... 109 HMEC 25-KAX Schematic Diagram ....... 1004 23-41-35 Introduction Page 2 June 29/98 .............................................................................................................. 106 Test Setup Diagram 3 ...................................................................................................... 302 HMEC 25 Microphone Arm Holder Disassembly ................................................ 108 HMEC 25 NoiseGard® Circuit Card Assembly..................................................................................................................................................... 401 HMEC 25 Microphone Arm Holder Assembly ...................................... 702 HMEC 25 Headphone Capsule Assembly .............. Maintenance Aid Diagram ............................... List of Illustrations FIGURE 1 2 3 4 101 102 103 104 105 106 107 108 109 110 111 301 302 303 401 701 702 703 901 1 2 PAGE Equipment Covered ......................................................................................................................................................... and Equipment .. 4 Test Setup Diagram 1 .........COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 2................... 2 HMEC 25-KAX Outline Dimensions ................ 302 HMEC 25 Headphone Capsule Disassembly ............................. 102 Test Procedure Outline .............. 110 HMEC 25 Wiring Diagram ................. 3 HMEC 25-KAX Connector Pin Assignments ........................................................................................................................................................................................... 111 HMEC 25-KAX Connecting Cable ............................................. 105 Test Setup Diagram 2 ....................... 112 HMEC 25 Ear Pad Disassembly ................ Fixtures........................................................................................................................................................................... Schematic Diagram ......................................................... 703 Tools...................... 901 HMEC 25-KAX Boomset Assembly ...................... 1 Equipment Specifications .............................. 303 Cleaning Materials ......................................................................................................................................................................................................... 106 Fault Isolation Procedure ......... 107 HMEC 25 NoiseGard® Circuit Card Assembly............................... 703 HMEC 25 Ear Pad Assembly ................................................................................. 1002 HMEC 25 Microphone Arm Holder Assembly ...................................................................... 102 Test Procedures ............................................................................................................................................................................................................................

THE PRECAUTIONS NORMALLY USED TO PROTECT SEMICONDUCTORS ARE NOT SUFFICIENT FOR THE PROTECTION OF ESDS COMPONENTS. DEENERGIZE OR DISCONNECT ALL POWER AND SIGNAL SOURCES AND LOADS. THE OPERATOR SHOULD MAINTAIN CONTACT WITH THE CONDUCTIVE PORTION OF THE CONTAINER. CA N IO UT 23-41-35 Introduction Page 3 June 29/98 . E. SERVICE PERSONNEL ARE ADVISED TO OBSERVE STANDARD SAFETY PRECAUTIONS TO PREVENT PERSONAL INJURY. NEVERTHELESS. D. TO PREVENT DAMAGE BY TRANSIENT VOLTAGES.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 3. THEY SHOULD BE ON THE CONDUCTIVE WORK SURFACE OR IN CONDUCTIVE CONTAINERS. DO NOT HANDLE ESDS DEVICES UNNECESSARILY OR REMOVE THEM FROM THEIR PACKAGES UNTIL ACTUALLY USED OR TESTED. HOWEVER. USERS MUST RECOGNIZE THAT IT IS NOT PRACTICAL TO PROVIDE MONITORING FOR ALL CONCEIVABLE SYSTEM FAILURES AND THAT. JUST AS ARE MORE CONVENTIONAL SEMICONDUCTOR DEVICES. HOWEVER UNLIKELY. WHEN ESDS DEVICES AND ASSEMBLIES ARE NOT IN THE UNIT. THE PILOT HAS THE RESPONSIBILITY TO DETECT SUCH AN OCCURRENCE BY MEANS OF CROSS-CHECKS WITH REDUNDANT OR CORRELATED INFORMATION AVAILABLE IN THE COCKPIT. Advisories WARNING: THIS UNIT EXHIBITS A VERY HIGH DEGREE OF FUNCTIONAL INTEGRITY. GROUND THE REPAIR OPERATOR THROUGH A CONDUCTIVE WRIST STRAP OR OTHER DEVICE USING A 470-kΩ OR 1-MΩ SERIES RESISTOR TO PROTECT THE OPERATOR. BECAUSE OF THEIR VERY HIGH ELECTRICAL RESISTANCE. WHICH IN CONJUNCTION WITH NONCONDUCTIVE GARMENTS AND FLOOR COVERINGS GENERATES AND RETAINS STATIC ELECTRICITY. F. THAT WILL CONTACT THE UNIT. WHEN A DEVICE OR ASSEMBLY IS INSERTED IN OR REMOVED FROM A CONTAINER. SUCH AS SOLDERING EQUIPMENT. DO NOT USE PLASTIC BAGS UNLESS THEY HAVE BEEN IMPREGNATED WITH A CONDUCTIVE MATERIAL. IN ORDER TO ADEQUATELY PROTECT ESDS DEVICES. G. PLACE THE UNIT ON GROUNDED CONDUCTIVE WORK SURFACE. THE FOLLOWING PRECAUTIONS MUST BE FOLLOWED: A. ONLY SOLDERING IRONS HAVING ZERO VOLTAGE AT THE TIP SHOULD BE USED. B. THE LOW-ENERGY SOURCE THAT MOST COMMONLY DESTROYS ESDS DEVICES IS THE HUMAN BODY. CONTACT WITH THE OPERATOR’S HAND PROVIDES A SUFFICIENT GROUND FOR TOOLS THAT ARE OTHERWISE ELECTRICALLY ISOLATED. IO N CAUTION: CA UT ELECTROSTATIC SENSITIVE DEVICES OBSERVE PRECAUTIONS FOR HANDLING ESDS DEVICES ARE SUBJECT TO DAMAGE BY EXCESSIVE LEVELS OF VOLTAGE AND/OR CURRENT. WARNING: WHILE PERFORMING MAINTENANCE WITH THE COVERS REMOVED FROM THIS UNIT. GROUND ANY TOOLS. IT IS POSSIBLE THAT ERRONEOUS OPERATION COULD OCCUR WITHOUT A FAULT INDICATION. C. THE DEVICE AND EVERYTHING THAT CONTACTS IT MUST BE BROUGHT TO GROUND POTENTIAL BY PROVIDING A CONDUCTIVE SURFACE AND DISCHARGE PATHS.

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 4. Frontispiece Typical HMEC 25 Boomset 23-41-35 Introduction Page 4 June 29/98 .

The NoiseGard® circuit is powered from +12 to 35 V dc supplied by a Jack Panel. Purpose of Equipment The HMEC 25 Boomset was designed to provide excellent wearing comfort by making it lightweight. 23-41-35 Page 1 June 29/98 . General Refer to frontispiece for an overall view of the HMEC 25 Boomset. Equipment Covered Figure 1 2. provide unequaled transmission quality by using Sennheiser´s own noise-compensated microphones and acoustically matched earphone transducers. The HMEC 25 Boomset is designed to permit permanent use in aircraft cockpits. The Boomset facilitates +12 to 35 V Jack Panel powering using a specially designed XLR connector with a DC/DC Converter.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 DESCRIPTION AND OPERATION 1. Microphone amplifier is fitted in the microphone housing. Figure 1 is a list of the equipment covered in this manual. MODEL NO DESCRIPTION SENNHEISER PART NUMBER 025-230-415 HMEC 25-KAX Boomset with microphone amplifier and jack connector. The HMEC 25 Boomset is powered from +16 V dc supplied by a Standard Jack Panel. It incorporates electronic circuits and components that serve to process signals for a Standard Jack Panel.

170 gr 1. Equipment Specifications Figure 2 lists the specifications for the HMEC 25-KAX Boomset. without cable Length of cable Panel connector Headphones Transducer principle Frequency response Impedance Sensitivity (1 kHz. noise-compensated 300 to 5. sound pressure level (distortion < 5 %) Output voltage Terminating impedance Supply voltage Power supply for NoiseGard® system SPECIFICATION approx.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 3.5 N back-electret condenser capsule. ATARF 23-41-24.8 m PJ-055 (Headphone). 1 mW) Active noise compensation Total harmonic distortion Headband pressure Microphone and amplifier* Transducer principle Frequency response Max. Equipment Specifications Figure 2 23-41-35 Page 2 June 29/98 . PJ-068 (Microphone) XLR 3-pin plug (Panel powering) dynamic. 70566. Part No. approx. 20 mA +12 to 35 V dc Jack Panel supply fed into XLR 3-pin plug. 16 V dc (8 V to 16 V). CHARACTERISTICS Physical Weight. 2.000 Hz 120 dB 400 mV ± 3 dB at 114 dB/SPL (corresponding to RTCA/DO 214) 150 Ω typ. Typical current consumption between 10 mA and 30 mA with a maximum of 50 mA *NOTE: For servicing the MKE 45 microphone refer to the CMM MKE 45. closed 16 to 22.5 dB between 100 Hz and 2 kHz <1% approx.000 Hz 200 Ω (connected in parallel) 92 dB/SPL ± 3 dB ≥ 15 dB ± 1. supraaural.

Equipment Description A. The boom microphone can be rotated through approx. The boomset consists of a split headband and two headphone systems.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 4. HMEC 25-KAX Outline Dimensions Figure 3 23-41-35 Page 3 June 29/98 . Mechanical Description The HMEC 25-KAX Boomset is connected to a Standard Jack Panel with two jack plugs. ± 135°.

Front view 5 Input +12 to 35 V Ground 3 PIN / CONDUCTOR 1 2. The boomset consists of a boom microphone with amplifier for air traffic communication and two headphone systems.screen blue red black yellow.4 3 5 6 7.8 / / / / / / red blue.blue FUNCTION Boom microphone Hi Boom microphone Lo Ground (Supply voltage) +12 V Supply voltage Audio sidetone Lo Audio sidetone Hi HMEC 25-KAX Connector Pin Assignments Figure 4 23-41-35 Page 4 June 29/98 .COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 B. Electrical Description The MKE 45 microphone of the HMEC 25-KAX Boomset is powered from + 16 V dc.

figure 102. and Equipment. WARNING: WHILE PERFORMING MAINTENANCE WITH THE COVERS REMOVED FROM THIS UNIT. 23-41-35 Page 101 June 29/98 . 70566. Testing A. to begin immediate troubleshooting. Test Procedures Refer to figure 101 for initial setup. B. ATARF 23-41-24. (2) Units that have been repaired and must be verified by the repairing agency as a part of the repair cycle. this test must be performed on units removed from an aircraft for test or repair prior to reinstallation of that unit. ALL SERVICE PERSONNEL IS ADVISED TO OBSERVE STANDARD SAFETY PRECAUTIONS TO PREVENT PERSONAL INJURY. In addition. The testing information included covers the headphone and NoiseGard® section and is provided to assist the technician in accomplishing the above two categories. The performance test provides a functional operational check of the equipment and is recommended to be used as a customer acceptance test if the customer decides to do so. figure 901. Saving time rather refer to the test procedure. Part No. In the event of a unit from an aircraft is received with a specific complaint. The NoiseGard® circuit must be powered by switching on an external +12 to 35 V supply. C. Fixtures. the performance test does not have to be performed. for test equipment required. Test Equipment and Power Requirements (1) Test Equipment Refer to figure 108 and to Tools. For testing the microphone section (Electret capsule and amplifier) refer to the Component Maintenance Manual for the MKE 45 microphone. Introduction Avionics equipment requiring testing usually falls into the following categories: (1) Units received from the line maintenance personnel with a general complaint of bad or no function that require testing to verify that a fault exists.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 TESTING AND TROUBLESHOOTING 1. (2) Power Source The HMEC 25 Boomset requires +16 V dc power for test purposes.

4 1.2 1.3 Aural test of headphone capsules. Audio signal must be present at both left and right channel. Vary audio frequency of the sine-wave generator from 20 Hz to 20 kHz. Using your hands gently knock against the capsule housing (both left and right).0 1. Imax ≈ 50 mA. Set sine wave generator to 1 kHz/775 mV ac and connect as shown in figure 101. Check distortion. No ambient noise must occur.5 I ≈ (14 . humming or hissing must be audible. Connect Boomset with sine wave generator and set to 2. 200 Ω 1.8 to Pin 6 Test Setup Diagram 1 Figure 101 STEP 1. 1.1 PROCEDURE HEADPHONE / NoiseGard® CHECK Connect Boomset to supply voltage (+12 to 35 V dc).8 to Pin 6 IMPEDANCE METER from Jack plug Pin 7.WAVE GENERATOR Audio frequency signal from Jack plug Pin 7. Vary audio frequency of the sine-wave generator from 20 Hz to 20 kHz.7 23-41-35 Page 102 June 29/98 . Check current consumption.6 1. Switch off NoiseGard® circuit. Disconnect sine-wave generator and check impedance with impedance meter (1 kHz) Disconnect impedance meter and switch on NoiseGard® circuit.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 SINE .18) mA No ambient noise like rustle.2 V rms. Test Procedures Figure 102 RESULTS 1. Put Boomset onto your head.

and then to the applicable circuit area. as necessary. Voltages and waveforms. Further testing using the troubleshooting aids provided throughout this manual is necessary to isolate individual failed parts. help lead the technician to isolation of faulty parts. 23-41-35 Page 103 June 29/98 . (3) Fault Isolation Test The next logical step is to perform the specific fault isolation test that is associated with the complaint or failed step in the performance test. the unit can be returned to the aircraft as good and reinstalled. When a unit does fail the performance test. Troubleshooting A. In cases where the unit passes all portions of the test and no fault is discovered. choose to omit the performance test and proceed directly to the fault isolation test. These sections are referenced. in addition to the theory of operation. the next objective is to isolate the actual fault or faults. and begin in-depth troubleshooting procedures. Begin by performing the specific associated test in the fault isolation test procedure in this section. B. The function of this section is to guide fault isolation.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 2. (2) Specified Complaint The test technician may. at his discretion. These troubleshooting aids are identified and explained in paragraph C. first to a specific malfunction. All sections of this manual contain important information to aid in the accomplishment of total repair and understanding of the unit. These tests examine more completely the functions and circuits associated with the trouble area. Troubleshooting avionics equipment usually falls into two categories: failures with a specific complaint and failures with an unspecified complaint. Troubleshooting Approach (1) Unspecified Complaint Troubleshooting a unit with an unspecified complaint requires the technician to test the unit according to the performance test to determine if a fault actually exists. Philosophy This section is the focal point that repair personnel should use to isolate faults in the unit. to facilitate completion of the repair task.

The test points are identified in a rectangle on the schematic and maintenance aid diagrams. Near each waveform are listed the oscilloscope settings the technician can use to reconstruct the conditions required to obtain the proper measurement. Each such service case means an elaborated alignment is of high importance involving very specific test procedures and equipment. for an overall . The defective devices then after exchanging should be sent to the Sennheiser headquarter plant where repair is performed according to all specifications. i. For that reason we do not recommend repairing any of these units in separate but preferably exchanging them as a complete unit! Your stock should be prepared to keep a certain number of complete units as spare in case any malfunction in the compensating circuit is detected. feedback circuitry and headphone capsule represent one complete (and pre-aligned) unit. Thereafter the devices will be returned to keep your stock complete. and are keyed to proper test points to aid in their physical location. but phase-inverted (180°) signal in an electronic circuit. D. (2) Test Points Test points are physical points located on an assembly to allow a technican to make necessary voltage and waveform measurements during fault isolation procedures. for ordering a complete unit: – 75550 – Also refer to page 1002/1003. Troubleshooting Aids (1) Maintenance Aid Diagrams Maintenance aid diagrams illustrate the physical location of all components on the major assemblies and can be found adjacent to each applicable schematic diagram. These points may or may not be actual jacks. due to component tolerances in each unit repairing or exchanging just one unit could lead to an excessive deviation of bias points towards the compensating parameters. Spare Part No. Detailed Parts List.e. Each test point identifies a major voltage or waveform important for circuit operation. (3) Waveforms Waveforms are an important tool in troubleshooting and can be used to fault isolate to a defective stage when used properly. NoiseGard® active noise compensation The basic principle of NoiseGard® active noise compensation is built upon the idea of cancelling a defined signal spectrum of ambient noise disturbing speech related signals.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 C. (4) Voltages Circuit voltages are illustrated on the schematic diagram to help the technician in circuit fault isolation. Both electret mic capsule. Waveforms are located on the maintenance aid diagrams when applicable. 23-41-35 Page 104 June 29/98 .view. These points may also be referenced in test and troubleshooting procedures. In technical terms this is achieved by adding the ambient noise with the same.

NOTE: The symptoms listed in the fault isolation procedure are those thought to be the most common and are to help the technican test the circuit in logical sequence. the purpose of the test.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 E. the waveforms on the maintenance aid diagrams should be used to isolate a particular problem. The outline lists each test. 23-41-35 Page 105 June 29/98 . an outline of the test procedure contents (figure 103) is provided. TEST TEST NAME PURPOSE OF TEST FAULT ISOLATION PROCEDURE STEP (SEE FIGURE 105) 1.0 2. and refers to a particular section in the fault isolation procedure should a test fail.0 2 3 NoiseGard® dc voltage NoiseGard® signal processing Checks internal dc voltages (NoiseGard®) Checks NoiseGard® active/passive function Test Procedure Outline Figure 103 (2) Fault Isolation Procedure The fault isolation procedure (figure 105) is provided as an aid in isolating the cause of failure in a particular test. If a problem is encountered that is not covered in the fault isolation procedure. Introduction to HMEC 25 Troubleshooting (1) Test Procedure Contents To aid in determining the most direct approach to troubleshooting. especially on units with specific complaints. They may not cover all possible problems.

Check Q6/8. – 6 V dc.D for amendments given towards handling NoiseGard® active noise compensation. 1. Fault Isolation Procedure Figure 105 (Sheet 1 of 3) 23-41-35 Page 106 June 29/98 . Check Q5/7. Check from TP1 to TP2 (gnd). Supply voltage electret mic capsule. Refer to page 105/paragraph 2. Check from TP5/6 to TP2 (gnd).1 CIRCUIT NoiseGard® DC VOLTAGE Supply voltage (internal). Bias voltage output amplifier. RESULTS COMMENTS + 6 V dc. Check from Q6/8 (collector) to TP2 (gnd). REMARK: Further measurements are not recommendable.3 + 6 V dc.2 Check C18. + 5 V dc.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 DC/DC CONVERTER (XLR 3-pin) +12 to 35 V +12 V DVM HMEC 25 NoiseGard® Circuit Card Assembly TP3/4 TP5/6 TP1 TP2 Test Setup Diagram 2 Figure 104 TEST STEP 1. – 6 V dc. R1. Check from Q5/7 (collector) to TP2 (gnd).0 1. Check from TP3/4 to TP2 (gnd). Check C19/21. 1.

Check C8/9. U1-2/3-1/4-2. Refer to page 105/paragraph 2. Check C7/14. Check from TP3 and TP6 to TP2 (gnd).4 OK NOP NOP NOP OK NOP OK OK OK REMARK: Further measurements are not recommendable.D. RESULTS 2.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 SINE . For exact component location refer to pages 108/109. R13/19.2 2. R20.WAVE GENERATOR AFmeter NoiseGard® Compensation Circuit No servicing/repairing of any electronic components within NoiseGard ® Compensation Circuit. Fault Isolation Procedure Figure 105 (Sheet 2 of 3) 23-41-35 Page 107 June 29/98 . Refer to page 105/paragraph 2. = NoiseGard® off act. Active Audio Circuit Audio frequency 1 kHz / 775 mV ac HMEC 25 NoiseGard® Circuit Card Assembly Passive Audio Circuit Test Setup Diagram 3 Figure 106 TEST STEP 2.3 2.0 CIRCUIT NoiseGard® SIGNAL PROCESSING Passive* Audio signal 2.D for amendments given towards handling NoiseGard® active noise compensation. Check Q3/4/7/8. = NoiseGard® on Check NoiseGard® ± 6 V supply voltage. Check cable (TP7/8 and TP9/10 to Jack Plug) for loose or intermittent connection.1 OK Active* Audio signal NOP Compensation Circuit NOP *pass. Q5/6.

Maintenance Aid Diagram Figure 107 23-41-35 Page 108 June 29/98 .COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 Component side + Solder side HMEC 25 NoiseGard® Circuit Card Assembly.

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 HMEC 25 NoiseGard® Circuit Card Assembly. Schematic Diagram Figure 108 23-41-35 Page 109 June 29/98 .

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 Ground +(12 .35) V (Solder side) HMEC 25-KAX Schematic Diagram Figure 109 23-41-35 Page 110 June 29/98 .

Headband cable green screen brown white red blue/screen orange brown white green yellow green > screen > red > blue > compensating capsule KE4 transducer capsule brown green screen white brown green > screen > red > blue > compensating capsule KE4 transducer capsule HMEC 25 Wiring Diagram Figure 110 white/screen COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 Microphone side brown white/screen Headphone side MKE 45 Microphone TP 9 TP 4 Microphone arm Connecting cable 23-41-35 Page 111 June 29/98 .

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 5 Front view HMEC 25-KAX Connecting Cable Figure 111 Input +12 to 35 V Ground 3 23-41-35 Page 112 June 29/98 .

DISASSEMBLING THE EQUIPMENT WITH THE POWER CONNECTED IS DANGEROUS TO LIFE AND ALSO MAY CAUSE VOLTAGE TRANSIENTS THAT CAN DAMAGE THE EQUIPMENT. 25C. are in this section. Perform the performance tests and the fault isolation test given in the Testing and Troubleshooting section to determine if and what disassembly is required. 2. when required. When an IPL item number is followed with a lettered suffix (25A. warnings. Introduction Disassemble the HMEC 25 Boomset only when repair is necessary and only to the extent necessary to effect repair. all disconnected electrical wiring. WARNING: REMOVE POWER BEFORE DISASSEMBLING ANY PORTION OF THE EQUIPMENT. The order of disassembly of electronic equipment can usually be determined by inspection. Special techniques. CA UT IO N 23-41-35 Page 301 June 29/98 . 3. placement of leads. Procedure NOTE: Numbers in parenthesis refer to item numbers on the referenced figures in the Illustrated Parts List. cautions. or otherwise identify. and unique procedures. and methods of applying insulation (if any) before unsoldering or removing any electrical parts. 25B.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 DISASSEMBLY 1. etc) that is used to list different part numbers for a given item required by use-on codes. ELECTROSTATIC SENSITIVE DEVICES OBSERVE PRECAUTIONS FOR HANDLING N IO UT CAUTION: CA REFER TO ESDS HANDLING CAUTION IN ADVISORIES PARAGRAPH IN MANUAL INTRODUCTION. only the basic IPL item number (25) is referenced in the following procedures. Make note of coding. Disassemble only as far as indicated by the nature of the fault. Procedures are in the order of disassembly from the highest to the lowest subassembly. Precautions and General Techniques Mark.

(2) Lever headphone capsule (4) out of capsule housing (3). 2 1 HMEC 25 Ear Pad Disassembly Figure 301 B. 3 6 5 4 HMEC 25 Headphone Capsule Disassembly Figure 302 23-41-35 Page 302 June 29/98 . (4) Remove circuit card assembly (5) and foam pad (6). Remove the ear pad (2) with other hand. EAR PAD DISASSEMBLY (Refer to figure 301) (1) Place headphone capsule (1) face down on work surface and hold it in position with one hand.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 A. HEADPHONE CAPSULE DISASSEMBLY (Refer to figure 302) (1) Insert a screw driver between rim of capsule housing (3) and headphone capsule (4). (3) Unsolder wires and capsule connectors from circuit card assembly (5).

9 7 8 HMEC 25 Microphone Arm Holder Disassembly Figure 303 23-41-35 Pages 303/304 June 29/98 .COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 C. (2) Loosen Phillips screws (9) and remove microphone arm holder as illustrated. MICROPHONE ARM HOLDER DISASSEMBLY (Refer to figure 303) (1) Loosen retain-clip (7) and pull microphone arm (8) out of its guide notch.

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MATERIAL RECOMMENDED TYPE Isopropyl alcohol Watchmaker tissues Various Various Cleaning Materials Figure 401 3. Introduction This section presents the unique special instructions necessary for cleaning parts and disassembled assemblies of this equipment.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 CLEANING 1. Procedures WARNING: OBSERVE ALL WARNINGS AND CAUTIONS LISTED IN THE ADVISORIES PARAGRAPH OF THIS MANUAL. 2. DO NOT REUSE OR CONTAMINATE THE CLEANING SOLUTION BY REDIPPING THE TISSUE INTO THE CLEANING SOLUTION CONTAINER. the technician should follow the instructions outlined in the Standard Shop Practices. CAUTION: 23-41-35 Pages 401/402 June 29/98 . DO NOT REUSE TISSUES FOR CLEANING. For standard cleaning instructions. Equivalent substitutes may be used. Cleaning Materials Cleaning materials required to clean special areas of this equipment are listed in figure 401.

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Check all parts for perfect mechanical operation. the technician should follow the instructions outlined in the Standard Shop Practices manual. A. 2.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 CHECK 1. Procedures WARNING: OBSERVE ALL WARNINGS AND CAUTIONS LISTED IN THE ADVISORIES PARAGRAPH OF THIS MANUAL AND THE STANDARD SHOP PRACTICES. 23-41-35 Pages 501/502 June 29/98 . For standard equipment checks. Introduction This section presents the unique special instructions necessary to verify the condition of disassembled and cleaned assemblies of this equipment.

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2. Introduction This section presents the unique special instructions necessary for the repair of disassembled assemblies of this equipment. No special procedures are required to repair this equipment. For standard repair procedures. Repair Supplies No special supplies are required to repair this equipment. the technician should follow the instructions outlined in the Repair section of the Standard Shop Practices. 3.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 REPAIR 1. Procedures WARNING: OBSERVE ALL WARNINGS AND CAUTIONS LISTED IN THE ADVISORIES PARAGRAPH OF THIS MANUAL AND THE STANDARD SHOP PRACTICES. 23-41-35 Pages 601/602 June 29/98 .

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All necessary repairs or replacements should be made before beginning assembly procedures. Procedures are in order of the lowest major part or subassembly and proceed to a completely assembled unit. General This section presents instructions for assembling the HMEC 25 Boomset. 23-41-35 Page 701 June 29/98 . Use Dacron lacing cord. DISCONNECT POWER FROM THE HMEC 25. nonwaxed lacing cord. or Tyraps. CAUTION: WHEN REPLACING A SOLID-STATE COMPONENT. etc) that is used to list different part numbers for a given item required by use-on codes. placement of leads. (2) (3) 3. and wire insulation made during disassembly. Detailed Assembly Procedures NOTE: All item numbers in parenthesis refer to item numbers on the referenced figures in the Illustrated Parts List. SOLDER IRON SHOULD BE GROUNDED PROPERLY WITH RESPECT TO BOARD OR CHASSIS WHEN REPLACING LOW-VOLTAGE DEVICES (DIODES.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 ASSEMBLY (INCLUDING STORAGE) 1. Replace electrical wiring with wire of the same size and color code as that removed. Precaution and General Techniques IO N CAUTION: CA UT ELECTROSTATIC SENSITIVE DEVICES OBSERVE PRECAUTIONS FOR HANDLING REFER TO ESDS HANDLING CAUTION IN ADVISORIES PARAGRAPH IN MANUAL INTRODUCTION. INTEGRATED CIRCUITS. CA N IO UT CAUTION: A. ETC). Federal Specification QQ-S-5716 composition Sn 60. (1) All wire connections are to be soldered as specified in MIL-S-6872 using rosin-cor4 solder. If not available. 25B. FAILURE TO COMPLY WILL CAUSE DAMAGE TO ELECTRICAL COMPONENTS. Lace ties should be approximately 13 mm (1/2 in) apart. Lace all electrical harness and tie at all breakouts. only the basic IPL item number (25) is referenced in the following procedures. determine by examining a unit known to be correct. TRANSISTORS. BEFORE REPLACING MODULES OR SUBASSEMBLIES. refer to notes on color coding. 25C. When an IPL item number is followed with a lettered suffix (25A. USE A HEAT SINK ATTACHED TO THE LEADS TO PREVENT DAMAGE TO THE DEVICE. Wiring NOTE: Before soldering any part. 2.

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 A. (2) Push microphone arm (8) onto its guide notch and secure with retain-clip (7). MICROPHONE ARM HOLDER ASSEMBLY (Refer to figure 701) (1) Assemble microphone arm holder as illustrated and secure Phillips screws (9). 9 7 8 HMEC 25 Microphone Arm Holder Assembly Figure 701 23-41-35 Page 702 June 29/98 .

2 1 HMEC 25 Ear Pad Assembly Figure 703 23-41-35 Page 703 June 29/98 . (3) Fit headphone capsule (4) in capsule housing (3) matching with the notch guide. 3 6 5 4 HMEC 25 Headphone Capsule Assembly Figure 702 C. (2) Solder wires and capsule connectors on circuit card assembly (5) in the same position when disassembling. HEADPHONE CAPSULE ASSEMBLY (Refer to figure 702) (1) Place circuit card assembly (5) and foam pad (6) in capsule housing (3) in sequence as below.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 B. Mount ear pad (2) with other hand. EAR PAD ASSEMBLY (Refer to figure 703) (1) Place headphone capsule (1) face down on work surface and hold it in position with one hand.

At no time should the ambient temperature of the storage area fall below – 20 °C (– 4 °F) or rise above + 70 °C (158 °F). include a desiccant. Storage Instructions Ensure all subassemblies are secured to the chassis. Final Testing After all repairs have been made and the HMEC 25 has been reassembled. 23-41-35 Page 704 June 29/98 . Place the equipment in the original container if available. the unit should be checked according to the procedure in the Testing section. Do not store in polyurethane bags for longer than a few month.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 4. Before storing the equipment. 5.

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 FITS AND CLEARANCES The fits and clearances that must be observed during assembly of this equipment are indicated. where applicable. 23-41-35 Pages 801/802 June 29/98 . in the Assembly section of this manual.

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of the test equipment/resources required independent of a specific manufacturer’s model. ITEM (MUS REF NO) MINIMUM USE SPECIFICATION NO FUNCTION/PARAMETER Vertical characteristics Modes of operation Bandwidth Signal amplitude range (p-p) Input impedance Deflection factor range Deflection factor accuracy 2-channel Dc to 10 MHz 10 mV to 200 V > 10 MΩ 2 mV/div to 5 V/div ± 3 % of signal display (p-p) Ac / dc 50 V dc.0 Horizontal characteristics Tools. AND EQUIPMENT 1. Unless otherwise specified.9 Input coupling Maximum input Trigger source (Cont) 2. 200 V ac Internal.8 1. A unit-under-test (UUT) requirement to test resource capability ratio of 1:1 was used to derive all accuracy parameter characteristics.0 1. channel B CHARACTERISTIC MAINT REPRESENTATIVE LEVEL TYPE CODE Hitachi V-1150 Tektronix R5440 III Oscilloscope 1.6 1. Test Equipment/Resource Requirements Figure 901 provides the minimum use specifications (MUS) for the test equipment resources required to perform test and alignment procedures for the HMEC 25 Boomset. and Equipment Figure 901 (Sheet 1 of 4) 23-41-35 Page 901 June 29/98 .1 1.2 1. only one unit of each test equipment/resource is required. and are provided to aid in utilization of existing or alternate test resources. external. Fixtures.3 1. The test performing activity should utilize test equipment/ resource with capability that exceeds the identified accuracy characteristic in accordance with applicable local test and measurement integrity control to those listed as representative. channel A.5 1. as other equipment may be entirely satisfactory if specified and recalibrated as necessary to maintain that capability.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 SPECIAL TOOLS.4 1.7 1. FIXTURES. by parameter and characteristic. The MUS are the generic technical description.

7 2.2 1.0 3.2 AF-meter 1.5 1. and Equipment Figure 901 (Sheet 2 of 4) 23-41-35 Page 902 June 29/98 . single sweep.1 (Cont) 2.0 1.4 2. III 30 µV to 300 V 10 Hz to 100 kHz ± 3 % of reading 1 MΩ / 50 pF Ac V (rms) according to DIN 45633 and DIN 45500 0 dB to -10 dB 1. auto single 1 µs to 1 s/div ± 3% Dc.1 Input level potentiometer Integrated filter 1000 Hz stop filter Attenuation at 1000 Hz > 66 dB Tools. ac and/or edge.3 2.0 2. auto Not applicable MAINT REPRESENTATIVE LEVEL TYPE CODE Oscilloscope 2.1 1.6 Delay time base General Remote operation Functions Ac voltage function Amplitude range Frequency range Accuracy Input impedance Display Dynamic properties Optional All Sennheiser UPM 550-1 II.1 3. Fixtures.2 2.3 1.5 3.4 1.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 ITEM (MUS REF NO) MINIMUM USE SPECIFICATION NO FUNCTION/PARAMETER Sweep modes Sweep ranges Time base (sweep) accuracy Sweep trigger modes CHARACTERISTIC Norm. norm.

4 V p-p Less than 200 ns Less than 5 % at higher than .3 dB. and Equipment Figure 901 (Sheet 3 of 4) 23-41-35 Page 903 June 29/98 .0 3.2 3.2 Attenuator 10 dB x 7.0 2.3 Square wave function Maximum output voltage Rise . fine adjuster for sine wave 600 Ω ± 3 %. selectable MAINT REPRESENTATIVE LEVEL TYPE CODE Leader LAG-126 III 1. 0.5 dB : 20 kHz to 500 kHz 2.30 dBV Tools.01 % : 10 Hz to 50 kHz Less than 0.2 dB : 5 Hz to 20 kHz ± 0. 1 dB x 9.005 % : 20 Hz to 20 kHz Less than 0.time Overshot Approx.3 Output impedance 2.1 FUNCTION/PARAMETER Frequency range Output waveform CHARACTERISTIC 5 Hz to 500 kHz Sine and square wave.1 3. Fixtures. with a dBm .dBV changeover switch Less than 0.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 ITEM (MUS REF NO) Audio Generator MINIMUM USE SPECIFICATION NO 1.1 Sine wave function Maximum output voltage + 10 dB ± 0.0 1. unbalanced 1.2 Distortion factor 2.3 Level flatness 3.1 x 9 dB.1 % : 5 Hz to 500 kHz ± 0.

1 1. Sennheiser ZP 3 1 kHz.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 ITEM (MUS REF NO) Impedance meter MINIMUM USE SPECIFICATION NO 1. 250 Hz.3 1. 16 kHz 3 1/2 digits 19.1 Display Measuring ranges 1. 4 kHz. 8 kHz.4 Accuracy Capacitances Inductances Tools.0 FUNCTION/PARAMETER Test frequencies CHARACTERISTIC MAINT REPRESENTATIVE LEVEL TYPE CODE II 63 Hz. Fixtures. and Equipment Figure 901 (Sheet 4 of 4) 23-41-35 Page 904 June 29/98 .999 MΩ ± 5% 5 pF to 2000 µF 10 µH to 5000 H 1.2 1.99 Ω to 1.

descriptive information. etc. and reference to other figures. requisition. 2. 3. modifier. Absence of a code indicates part applies to all models. Use only part numbers specified in this parts list for replacement of parts. INDENT Column—Items are coded 1. EFFECT CODE Column—Part variations within a group of equipment are indicated by a letter code (A. etc. Sennheiser part numbering system consists of 5 digits. and issuance of parts. C. Electrostatic Discharge Sensitive devices are identified by (ESDS). AIRLINE PART NO Column—Part numbers will be included by the airlines as applicable. 23-41-35 Page 1001 June 29/98 .COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 ILLUSTRATED PARTS LIST 1. to indicate the relationship to the next higher assembly. letter B second change. Refer to the Advisories at the front of the manual for proper handling of these parts. B. Detailed Parts List FIG-ITEM Column—Digits are item numbers assigned in sequence to correspond with item numbers on the illustration. NOMENCLATURE Column—Listed are the noun name. REV (Revision Identifier) dash (—) denotes original. PART NO Column—Listed are standard Sennheiser part numbers. UNITS PER ASSY Column—Quantities specified are per item number. Introduction The purpose of this parts list is for identification. letter A first change. A. etc. Parts listed meet critical equipment design specification requirements. Service Bulletins are identified by SB 1. SB 2. etc).

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 80 160 10 90 90 150 20 70 60 120 30 140 130 170 110 40 100 50 HMEC 25-KAX Boomset Assembly Figure 1 23-41-35 Page 1002 June 29/98 .

4.8x3. pair.0. velour Cable 500mm Ring RD5.5 Cap.2x1. headphone capsule with PCB.25s + XLR-3M Ring RD7.COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 DETAILED PARTS LIST FIG-ITEM 1-001 1-010 1-020 1-030 1-040 1-050 1-060 1-070 1-070A 1-080 1-090 1-100 1-110 1-120 1-130 1-140 1-150 1-160 1-170 PART NUMBER 025-230-415 48234 75550 70743 58877 75818 24821 75527 69417 58715 24812 59997 19849 57122 57124 75427 75464 50722 44740 AIRLINE PART NUMBER I N D E N T NOMENCLATURE Boomset HMEC 25-KAX for Airlines Split headband Dyn.0. microphone side Cap housing HMEC 25-KAX Type plate Clip EFFECT CODE UNITS PER ASSY RF 1 2 1 1 1 1 1 1 1 3 1 1 3 1 1 1 1 1 1 2 2 2 2 2 3 2 2 2 3 2 2 2 2 2 2 2 2 23-41-35 Page 1003 June 29/98 .0x2.3m + 5.5 (strain relief for 1-050) Annular earpad.5x16. pair Annular earpad.0 Sleeve RDI3. Replacement Microphone arm holder Electret microphone with amplifier Cable 1. 6.8m / jack 6.5 (strain relief for 1-080) Flexible microphone arm with plug Strain relief Sleeve RDI1.

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 20 30 10 40 50 70 60 60 HMEC 25 Microphone Arm Holder Assembly Figure 2 23-41-35 Page 1004 June 29/98 .

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415 DETAILED PARTS LIST FIG-ITEM 2-001 2-010 2-020 2-030 2-040 2-050 2-060 2-070 PART NUMBER 70743 44619 39796 19846 33320 33321 46590 19848 AIRLINE PART NUMBER I N D E N T NOMENCLATURE Microphone arm holder Base for microphone arm Disk spring Ring Pressure spring Stop pin Lens screw M2x8 DIN7985 Cap EFFECT CODE UNITS PER ASSY RF 1 1 1 1 1 2 1 1 2 2 2 2 2 2 2 23-41-35 Page 1005/1006 June 29/98 .