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TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812

Digital Signal Processors

Data Manual

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Literature Number: SPRS174S April 2001 – Revised March 2011

TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812
SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.ti.com

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..................................................................................... 11 1.1 Features .................................................................................................................... 11 1.2 Getting Started ............................................................................................................. 12 Introduction ...................................................................................................................... 13 2.1 Description ................................................................................................................. 13 2.2 Device Summary .......................................................................................................... 14 2.3 Pin Assignments ........................................................................................................... 15 2.3.1 Terminal Assignments for the GHH/ZHH Packages ....................................................... 15 2.3.2 Pin Assignments for the PGF Package ...................................................................... 16 2.3.3 Pin Assignments for the PBK Package ...................................................................... 17 2.4 Signal Descriptions ........................................................................................................ 18 Functional Overview .......................................................................................................... 27 3.1 Memory Map ............................................................................................................... 28 3.2 Brief Descriptions .......................................................................................................... 33 3.2.1 C28x CPU ....................................................................................................... 33 3.2.2 Memory Bus (Harvard Bus Architecture) .................................................................... 33 3.2.3 Peripheral Bus .................................................................................................. 33 3.2.4 Real-Time JTAG and Analysis ................................................................................ 33 3.2.5 External Interface (XINTF) (2812 Only) ...................................................................... 34 3.2.6 Flash (F281x Only) ............................................................................................. 34 3.2.7 ROM (C281x Only) ............................................................................................. 34 3.2.8 M0, M1 SARAMs ............................................................................................... 34 3.2.9 L0, L1, H0 SARAMs ............................................................................................ 35 3.2.10 Boot ROM ....................................................................................................... 35 3.2.11 Security .......................................................................................................... 35 3.2.12 Peripheral Interrupt Expansion (PIE) Block ................................................................. 36 3.2.13 External Interrupts (XINT1, XINT2, XINT13, XNMI) ........................................................ 36 3.2.14 Oscillator and PLL .............................................................................................. 37 3.2.15 Watchdog ........................................................................................................ 37 3.2.16 Peripheral Clocking ............................................................................................. 37 3.2.17 Low-Power Modes .............................................................................................. 37 3.2.18 Peripheral Frames 0, 1, 2 (PFn) .............................................................................. 37 3.2.19 General-Purpose Input/Output (GPIO) Multiplexer ......................................................... 38 3.2.20 32-Bit CPU-Timers (0, 1, 2) ................................................................................... 38 3.2.21 Control Peripherals ............................................................................................. 38 3.2.22 Serial Port Peripherals ......................................................................................... 38 3.3 Register Map ............................................................................................................... 39 3.4 Device Emulation Registers .............................................................................................. 41 3.5 External Interface, XINTF (2812 Only) ................................................................................. 42 3.5.1 Timing Registers ................................................................................................ 43 3.5.2 XREVISION Register ........................................................................................... 43 3.6 Interrupts .................................................................................................................... 44 3.6.1 External Interrupts .............................................................................................. 47 3.7 System Control ............................................................................................................ 48 3.8 OSC and PLL Block ....................................................................................................... 50
TMS320F281x, TMS320C281x DSPs
Contents
Copyright © 2001–2011, Texas Instruments Incorporated

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TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812
www.ti.com SPRS174S – APRIL 2001 – REVISED MARCH 2011

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............................................................................................. 51 ................................................................................................ 52 3.10 External Reference Oscillator Clock Option ........................................................................... 52 3.11 Watchdog Block ........................................................................................................... 53 3.12 Low-Power Modes Block ................................................................................................. 54 Peripherals ....................................................................................................................... 55 4.1 32-Bit CPU-Timers 0/1/2 ................................................................................................. 55 4.2 Event Manager Modules (EVA, EVB) ................................................................................... 58 4.2.1 General-Purpose (GP) Timers ................................................................................ 61 4.2.2 Full-Compare Units ............................................................................................. 61 4.2.3 Programmable Deadband Generator ........................................................................ 61 4.2.4 PWM Waveform Generation .................................................................................. 61 4.2.5 Double Update PWM Mode ................................................................................... 61 4.2.6 PWM Characteristics ........................................................................................... 62 4.2.7 Capture Unit ..................................................................................................... 62 4.2.8 Quadrature-Encoder Pulse (QEP) Circuit ................................................................... 62 4.2.9 External ADC Start-of-Conversion ........................................................................... 62 4.3 Enhanced Analog-to-Digital Converter (ADC) Module ............................................................... 63 4.4 Enhanced Controller Area Network (eCAN) Module .................................................................. 68 4.5 Multichannel Buffered Serial Port (McBSP) Module .................................................................. 73 4.6 Serial Communications Interface (SCI) Module ....................................................................... 77 4.7 Serial Peripheral Interface (SPI) Module ............................................................................... 80 4.8 GPIO MUX ................................................................................................................. 83 Development Support ........................................................................................................ 86 5.1 Device and Development Support Tool Nomenclature ............................................................... 86 5.2 Documentation Support ................................................................................................... 87 5.3 Community Resources .................................................................................................... 89 Electrical Specifications ..................................................................................................... 90 6.1 Absolute Maximum Ratings .............................................................................................. 90 6.2 Recommended Operating Conditions .................................................................................. 90 6.3 Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) .............. 91 6.4 Current Consumption ..................................................................................................... 92 6.5 Current Consumption Graphs ............................................................................................ 94 6.6 Reducing Current Consumption ......................................................................................... 96 6.7 Emulator Connection Without Signal Buffering for the DSP ......................................................... 96 6.8 Power Sequencing Requirements ....................................................................................... 97 6.9 Signal Transition Levels .................................................................................................. 99 6.10 Timing Parameter Symbology .......................................................................................... 100 6.11 General Notes on Timing Parameters ................................................................................. 100 6.12 Test Load Circuit ......................................................................................................... 100 6.13 Device Clock Table ...................................................................................................... 101 6.14 Clock Requirements and Characteristics ............................................................................. 102 6.14.1 Input Clock Requirements ................................................................................... 102 6.14.2 Output Clock Characteristics ................................................................................ 103 6.15 Reset Timing .............................................................................................................. 103 6.16 Low-Power Mode Wakeup Timing ..................................................................................... 107
3.8.1 Loss of Input Clock 3.9 PLL-Based Clock Module
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Copyright © 2001–2011, Texas Instruments Incorporated

......................30............1 PWM Timing ............... 145 6................................. 145 6......ti......24 External Interface Read Timing ...... 116 6..........1 McBSP Transmit and Receive Timing .....................6 Sequential Sampling Mode (Single-Channel) (SMODE = 0) ....3 Converter ....................30................................. 145 6............................32 Flash Timing (F281x Only) ................................................ 146 6............................................................. 147 6.....................................................................................................................................34 Migrating From F281x Devices to C281x Devices ................................. 143 6..........................31.............17.2 Interrupt Timing .................. 129 6........ 156 6........31.23 XINTF Signal Alignment to XCLKOUT .............................................................. Texas Instruments Incorporated ...........33 ROM Timing (C281x only) ..... 132 6.........com 7 8 ...........................7 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1) .............................................................................30.................................26 External Interface Ready-on-Read Timing With One External Wait State ................. 140 6....21 Serial Peripheral Interface (SPI) Slave Mode Timing .......................................................................... 149 6.. 148 6..........................................................30.............................. 115 6.... 161 6.........22 External Interface (XINTF) Timing ......8 Definitions of Specifications and Terminology .............................................................................................................30..5... 142 6...............................................................30 On-Chip Analog-to-Digital Converter ..................................................2 McBSP as SPI Master or Slave Timing .27 External Interface Ready-on-Write Timing With One External Wait State ............................. 133 6. 159 Revision History .... 139 6........................1 Reference Voltage ............... 111 6.........1 ADC Absolute Maximum Ratings ............. 136 6...5....................................................................................................................................... 145 6......................30.................... 144 6..17 Event Manager Interface 4 Contents Copyright © 2001–2011...............................................................28 XHOLD and XHOLDA .............................................................................................................2 Analog Inputs ..20 Serial Peripheral Interface (SPI) Master Mode Timing ..............................4 Conversion Modes ......................................5.......30..........30..............30.............. 145 6....... 145 6...... TMS320F2812 TMS320C2810........................30.................................... 114 6......................................................................................TMS320F2810.........................................3 Current Consumption for Different ADC Configurations ........................................ 149 6.17........................2 ADC Electrical Characteristics Over Recommended Operating Conditions ............ 125 6.......................30......................................................... 113 6..... 142 6.........................5 Detailed Description .................................................4 ADC Power-Up Control Bit Timing ............... TMS320F2811.................31 Multichannel Buffered Serial Port (McBSP) Timing ................................ TMS320C2811...........................................................5........................................................................................................25 External Interface Write Timing ....... 121 6....................................29 XHOLD/XHOLDA Timing ..........................................18 General-Purpose Input/Output (GPIO) – Output Timing ........... 130 6.................................................. 152 6................................................... 160 Mechanical Data ................................... TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www................................... 111 6..........19 General-Purpose Input/Output (GPIO) – Input Timing .. 158 6............................30............

............... 74 Serial Communications Interface (SCI) Module Block Diagram.................. 110 PWM Output Timing ..................................................................TMS320F2810............................ 42 Interrupt Sources ........................................................................... 99 Input Levels ............................................................................................................................................................ 56 Event Manager A Functional Block Diagram .......................................................................................................................................................... 100 Clock Timing ................... 30 F2810/C2810 Memory Map ......................................................................... 17 Functional Block Diagram .......................................................................................................... 95 C2812/C2811/C2810 Typical Power Consumption Over Frequency ...................................................................................................................................com SPRS174S – APRIL 2001 – REVISED MARCH 2011 List of Figures 2-1 2-2 2-3 3-1 3-2 3-3 3-4 3-5 3-6 3-7 3-8 3-9 3-10 3-11 4-1 4-2 4-3 4-4 4-5 4-6 4-7 4-8 4-9 4-10 4-11 4-12 5-1 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 6-9 6-10 6-11 6-12 6-13 6-14 6-15 6-16 6-17 6-18 6-19 6-20 TMS320F2812 and TMS320C2812 179-Ball GHH/ZHH MicroStar BGA™ (Bottom View)..................................................................................... 112 TMS320F2812 and TMS320C2812 176-Pin PGF LQFP (Top View) List of Figures 5 Copyright © 2001–2011......................................................................... 69 eCAN Memory Map .............................................................. 106 Effect of Writing Into PLLCR Register ............................................................................................................................................................................ 30 External Interface Block Diagram ........................................................... 65 ADC Pin Connections With External Reference ................................................................................... 66 eCAN Block Diagram and Interface Circuit ................................... 64 ADC Pin Connections With Internal Reference .......... 99 3........................................................................................................................ 109 HALT Wakeup Using XNMI ..................................................................... 103 Power-on Reset in Microcomputer Mode (XMP/MC = 0) (See Note D) .............................................................................................. 45 Clock and Reset Domains ........................ TMS320C2811........................................... 106 Warm Reset in Microcomputer Mode ................. TMS320F2812 TMS320C2810............................................................................... 61 Block Diagram of the F281x and C281x ADC Module ...................................................................................... TMS320C2810.... TMS320C2812 www..... 94 F2812/F2811/F2810 Typical Power Consumption Over Frequency ................... 82 GPIO/Peripheral Pin Multiplexing .................. 16 TMS320F2810............................................. 107 STANDBY Entry and Exit Timing ..................................................................................................................................................................... 111 TDIRx Timing ............................................................................................................................................. 87 F2812/F2811/F2810 Typical Current Consumption Over Frequency ..................................... 79 Serial Peripheral Interface Module Block Diagram (Slave Mode).................................................................................................................................................................. and TMS320C2811 128-Pin PBK LQFP (Top View) ............. Texas Instruments Incorporated ....................... 50 Recommended Crystal/Clock Connection ........................................................................................................................................................ 95 C2812/C2811/C2810 Typical Current Consumption Over Frequency ...................................... 15 ........................................................ 29 F2811/C2811 Memory Map .......................................................................................................................................... TMS320F2811........................................................................... 112 EVASOC Timing ...... TMS320F2811..... 106 IDLE Entry and Exit Timing ............................ti........................... 53 CPU-Timers ........................... 44 Multiplexing of Interrupts Using the PIE Block ....................................... 48 OSC and PLL Block ............................ 71 McBSP Module With FIFO ........ 98 Output Levels .............................................. 28 F2812/C2812 Memory Map ................................................................................................................................... 85 TMS320x281x Device Nomenclature .............................................................. 97 F2812/F2811/F2810 Typical Power-Up and Power-Down Sequence – Option 2 ................................................................................................................................................... 96 Emulator Connection Without Signal Buffering for the DSP ........................................................ 105 Power-on Reset in Microprocessor Mode (XMP/MC = 1) ....... 52 Watchdog Module ................................. 55 CPU-Timer Interrupts Signals and Output Signal ........................3-V Test Load Circuit.........................................................................................................................................................................................................................................................................................

......................... 122 SPI Slave Mode External Timing (Clock Phase = 1) ................................................................ McBSP Timing as SPI Master or Slave: CLKSTP = 10b........................................................................................... 135 Write With Synchronous XREADY Access ...................................................................................................................................................... CLKXP = 0 .... TMS320F2811.................................................................... TMS320C2811..........................ti....................................................... McBSP Timing as SPI Master or Slave: CLKSTP = 11b............................................................... TMS320F2812 TMS320C2810....................................................................................................... 112 External Interrupt Timing ..................... 114 GPIO Input Qualifier – Example Diagram for QUALPRD = 1 ......................... McBSP Timing as SPI Master or Slave: CLKSTP = 11b......................................................................................................... 113 General-Purpose Output Timing ........................................... 128 Example Read Access .......................................................................... 134 Example Read With Asynchronous XREADY Access ..........TMS320F2810........................................ McBSP Transmit Timing ................................................................................................... CLKXP = 1 ............................................................................................................................................... 145 ADC Power-Up Control Bit Timing .......................................................................................................................................................................................... 140 XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK) ..................................................................................................................................... Simultaneous Sampling Mode Timing 6 List of Figures Copyright © 2001–2011............................ 118 SPI Master External Timing (Clock Phase = 1) ... Texas Instruments Incorporated ................. 120 SPI Slave Mode External Timing (Clock Phase = 0) ................................................... 137 Write With Asynchronous XREADY Access .............. 138 External Interface Hold Waveform ..........................................................................................................................com 6-21 6-22 6-23 6-24 6-25 6-26 6-27 6-28 6-29 6-30 6-31 6-32 6-33 6-34 6-35 6-36 6-37 6-38 6-39 6-40 6-41 6-42 6-43 6-44 6-45 6-46 6-47 6-48 EVBSOC Timing ..................... McBSP Timing as SPI Master or Slave: CLKSTP = 10b.............................................................................. McBSP Receive Timing ......................... 141 ADC Analog Input Impedance Model ................................................. 145 147 151 151 152 153 154 155 Sequential Sampling Mode (Single-Channel) Timing ..................... 124 Relationship Between XTIMCLK and SYSCLKOUT .......................................................... CLKXP = 0 .. 131 Example Write Access ....... 116 SPI Master Mode External Timing (Clock Phase = 0) ............ 146 ..................................................... 115 General-Purpose Input Timing ................. CLKXP = 1 .......... TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www....................................................................................................... 132 Example Read With Synchronous XREADY Access ..................

................................................................ PIE Configuration and Control Registers.............................................................. GPIO Mux Registers ...................... 96 Recommended “Low-Dropout Regulators” ............................................... 101 102 102 102 103 103 107 7 Input Clock Frequency ...... F281x and C281x Low-Power Modes ................................................ 92 TMS320C281x Current Consumption by Power-Supply Pins Over Recommended Operating Conditions During Low-Power Modes at 150-MHz SYSCLKOUT .......................................................... CAN Registers .......................................................................................................................................... 1....... Clocking.................................................................. ADC Registers ............. .................................................................. 97 TMS320F281x and TMS320C281x Clock Table and Nomenclature XCLKIN Timing Requirements – PLL Bypassed or Enabled XCLKIN Timing Requirements – PLL Disabled .................................................................................................................................................................... TMS320C2812 www................................................................................. GPIO Data Registers .................................................................................................................................................................................................................................................. Reset (XRS) Timing Requirements ..........................................................................................................................................com SPRS174S – APRIL 2001 – REVISED MARCH 2011 List of Tables 2-1 2-2 3-1 3-2 3-3 3-4 3-5 3-6 3-7 3-8 3-9 3-10 3-11 3-12 3-13 3-14 3-15 3-16 3-17 3-18 4-1 4-2 4-3 4-4 4-5 4-6 4-7 4-8 4-9 4-10 4-11 4-12 5-1 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 6-9 6-10 6-11 6-12 Hardware Features .................................................................................. External Interrupts Registers .....3-V eCAN Transceivers for the TMS320F281x and TMS320C281x DSPs ....................................................................................................................... McBSP Registers .............................. 14 Signal Descriptions .................................................... PLLCR Register Bit Definitions ..................... 18 Addresses of Flash Sectors in F2812 and F2811 ................... IDLE Mode Timing Requirements ........................................................................................................................................................ 3........................................................................................... 102 ...................... SPI Registers ............................................. 36 ..................................... Possible PLL Configuration Modes .. XCLKOUT Switching Characteristics (PLL Bypassed or Enabled) ......................... EVA Registers ................................................................. Peripheral Frame 0 Registers Peripheral Frame 1 Registers 39 39 40 41 43 43 45 46 47 49 51 52 54 57 58 59 67 70 72 75 78 78 81 83 84 87 TMS320F281x Current Consumption by Power-Supply Pins Over Recommended Operating Conditions During Low-Power Modes at 150-MHz SYSCLKOUT ................................................................. and Low-Power Mode Registers ......................................................................................................................... TMS320C2811...................................................................................................... 35 Impact of Using the Code Security Module ................................................................................... Watchdog..... 93 Typical Current Consumption by Various Peripherals (at 150 MHz) ............ Device Emulation Registers................................................................................................................................................................................... Texas Instruments Incorporated ............ PIE Peripheral Interrupts ....................................................................... CPU-Timers 0............ Module and Signal Names for EVA and EVB .......................................................... Peripheral Frame 2 Registers .......................................................ti................................................................................................ List of Tables Copyright © 2001–2011............. XINTF Configuration and Control Register Mappings ............................................................................... 32 Boot Mode Selection ............................................................................... 31 Wait States ........................................................................... TMS320F2811...................... Possible PLL Configuration Modes ................................................................................................................................................................ XREVISION Register Bit Definitions ............ SCI-A Registers ............................................................................................................................................................................................................................. PLL....................TMS320F2810......................................... SCI-B Registers ....................................................................................................................... TMS320F2812 TMS320C2810.................................................................................................................................. TMS320x281x Peripheral Selection Guide .......................... .................................................................................................................................................................................................................................... 31 Addresses of Flash Sectors in F2810 ................ 2 Configuration and Control Registers ...........

................... CLKXP = 1) .. SPI Slave Mode External Timing (Clock Phase = 0) .................... 1 Wait State) ...................................................... Flash Endurance for A and S Temperature Material ....................................................... SPI Master Mode External Timing (Clock Phase = 1) ........... General-Purpose Input Timing Requirements ............................ TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www....................................................................................................................... McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b....................................................................................................... External Memory Interface Write Switching Characteristics ........... External ADC Start-of-Conversion – EVA – Switching Characteristics ... SPI Slave Mode External Timing (Clock Phase = 1) ............. External Memory Interface Write Switching Characteristics (Ready-on-Write.......... Timer and Capture Unit Timing Requirements ........................................................................ McBSP Timing Requirements ...................... CLKXP = 0) ........................... Synchronous XREADY Timing Requirements (Ready-on-Read....................................................................................................................................................................... Simultaneous Sampling Mode Timing .................. Asynchronous XREADY Timing Requirements (Ready-on-Read.................................................. 1 Wait State) ...................... 1 Wait State) ............. External Memory Interface Read Timing Requirements .. 1 Wait State) .................... HALT Mode Timing Requirements ............................. Relationship Between Parameters Configured in XTIMING and Duration of Pulse .............................................................. McBSP Switching Characteristics .... McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b..................................................... External Memory Interface Read Timing Requirements (Ready-on-Read...... External Memory Interface Read Switching Characteristics (Ready-on-Read...................................... Synchronous XREADY Timing Requirements (Ready-on-Write........................... External ADC Start-of-Conversion – EVB – Switching Characteristics ...... DC Specifications ....................................................................... Interrupt Timing Requirements ................................................................ ADC Power-Up Delays .......... McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b...... CLKXP = 1) .......................................... HALT Mode Switching Characteristics ..................................... McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b......................................... CLKXP = 0) ........................................................ XINTF Clock Configurations . .................................... AC Specifications ................ CLKXP = 1) .....................................TMS320F2810................................................................................................................................................................................................................................... Asynchronous XREADY Timing Requirements (Ready-on-Write................................. XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK) ................................................com 6-13 6-14 6-15 6-16 6-17 6-18 6-19 6-20 6-21 6-22 6-23 6-24 6-25 6-26 6-27 6-28 6-29 6-30 6-31 6-32 6-33 6-34 6-35 6-36 6-37 6-38 6-39 6-40 6-41 6-42 6-43 6-44 6-45 6-46 6-47 6-48 6-49 6-50 6-51 6-52 6-53 6-54 6-55 6-56 6-57 6-58 6-59 6-60 8 ..................................... XHOLD/XHOLDA Timing Requirements (XCLKOUT = XTIMCLK) ................................................................................................. TMS320F2812 TMS320C2810.................................................................... 1 Wait State) ........... General-Purpose Output Switching Characteristics ....................................................................................... Sequential Sampling Mode Timing ... McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b.................. CLKXP = 0) .......................................................... External Memory Interface Read Switching Characteristics ....................................................................................................................... Interrupt Switching Characteristics ...... McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b........................................................................ McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b.... IDLE Mode Switching Characteristics STANDBY Mode Timing Requirements List of Tables 107 108 108 110 110 111 111 112 112 113 113 114 116 117 119 121 123 125 128 130 130 132 133 133 133 133 136 136 136 140 141 143 144 144 145 146 147 149 150 152 152 153 153 154 154 155 155 156 Copyright © 2001–2011.................................................................................. STANDBY Mode Switching Characteristics ............................................................................................................................................................................................................................................... TMS320F2811.............................................................. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b................ SPI Master Mode External Timing (Clock Phase = 0) ...........................................ti.. 1 Wait State) ........................................ TMS320C2811......... Texas Instruments Incorporated ........................................................ 1 Wait State) ...................................................... PWM Switching Characteristics ..... Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK) .. CLKXP = 0) ...... CLKXP = 1) .............

.................................... 158 Minimum Required ROM Wait States at Different Frequencies (C281x devices) .... TMS320C2811.................................................. 158 Thermal Resistance Characteristics for 179-Ball GHH ........................ TMS320F2812 TMS320C2810........... 161 Thermal Resistance Characteristics for 179-Ball ZHH............com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6-61 6-62 6-63 6-64 6-65 6-66 8-1 8-2 8-3 8-4 Flash Endurance for Q Temperature Material .................................................. 156 Flash Parameters at 150-MHz SYSCLKOUT ................ 161 Thermal Resistance Characteristics for 176-Pin PGF ......................................................................................................................................................TMS320F2810.......................... TMS320C2812 www.................... 161 Copyright © 2001–2011............................................. 156 Flash/OTP Access Timing ...................... TMS320F2811...... 157 Minimum Required Flash Wait States at Different Frequencies (F281x devices) ................................................................................... Texas Instruments Incorporated List of Tables 9 ........ti...... 157 ROM Access Timing........................................................................... 161 Thermal Resistance Characteristics for 128-Pin PBK .................................................................................

TMS320F2811.TMS320F2810. Texas Instruments Incorporated . TMS320C2811. TMS320F2812 TMS320C2810.ti.com 10 List of Tables Copyright © 2001–2011. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.

eZdsp is a trademark of Spectrum Digital Incorporated. TMS320 are trademarks of Texas Instruments. TMS320F2812 TMS320C2810.67-ns Cycle Time) – Low-Power (1. STANDBY. TMS320C2000.9-V Core @150 MHz.TMS320F2810. standard warranty. Copyright © 2001–2011. Products conform to specifications per the terms of the Texas Instruments standard warranty. TI. TMS320C2810. TMS320C2812 1 1.ti. TMS320F2811. TMS320C55x. 16 Channels – 2 x 8 Channel Input Multiplexer – Two Sample-and-Hold – Single/Simultaneous Conversions – Fast Conversion Rate: 80 ns/12. TMS320C281x DSPs Features • Clock and System Control – Dynamic PLL Ratio Changes Supported – On-Chip Oscillator – Watchdog Timer Module • Three External Interrupts • Peripheral Interrupt Expansion (PIE) Block That Supports 45 Peripheral Interrupts • Three 32-Bit CPU-Timers • 128-Bit Security Key/Lock – Protects Flash/ROM/OTP and L0/L1 SARAM – Prevents Firmware Reverse-Engineering • Motor Control Peripherals – Two Event Managers (EVA. Standard UART – Enhanced Controller Area Network (eCAN) – Multichannel Buffered Serial Port (McBSP) • 12-Bit ADC. TMS320F2812.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Digital Signal Processors Check for Samples: TMS320F2810.3-V I/O) Design • JTAG Boundary Scan Support (1) • High-Performance 32-Bit CPU ( TMS320C28x™) – 16 x 16 and 32 x 32 MAC Operations – 16 x 16 Dual MAC – Harvard Bus Architecture – Atomic Operations – Fast Interrupt Response and Processing – Unified Memory Programming Model – 4M Linear Program/Data Address Reach – Code-Efficient (in C/C++ and Assembly) – TMS320F24x/LF240x Processor Source Code Compatible • On-Chip Memory – Flash Devices: Up to 128K x 16 Flash (Four 8K x 16 and Six 16K x 16 Sectors) – ROM Devices: Up to 128K x 16 ROM – 1K x 16 OTP ROM – L0 and L1: 2 Blocks of 4K x 16 Each Single-Access RAM (SARAM) – H0: 1 Block of 8K x 16 SARAM – M0 and M1: 2 Blocks of 1K x 16 Each SARAM • Boot ROM (4K x 16) – With Software Boot Modes – Standard Math Tables • External Interface (2812) – Over 1M x 16 Total Memory – Programmable Wait States – Programmable Read/Write Strobe Timing – Three Individual Chip Selects (1) 1 IEEE Standard 1149. TMS320C2811.1 1234 TMS320F281x.5 MSPS • Up to 56 General-Purpose I/O (GPIO) Pins • Advanced Emulation Features – Analysis and Breakpoint Functions – Real-Time Debug via Hardware • Development Tools Include – ANSI C/C++ Compiler/Assembler/Linker – Code Composer Studio™ IDE – DSP/BIOS™ – JTAG Scan Controllers(1) • Low-Power Modes and Power Savings – IDLE. HALT Modes Supported – Disable Individual Peripheral Clocks • High-Performance Static CMOS Technology – 150 MHz (6. TMS320C2811. Texas Instruments Incorporated . 2 3 4 PRODUCTION DATA information is current as of publication date. Production processing does not necessarily include testing of all parameters. TMS320C54x. 1.8-V Core @135 MHz. EVB) – Compatible to 240xA Devices • Serial Port Peripherals – Serial Peripheral Interface (SPI) – Two Serial Communications Interfaces (SCIs). TMS320F2811. Code Composer Studio. 3. C28x. All other trademarks are the property of their respective owners. TMS320C2812 www. TMS320C28x. and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.1-1990 IEEE Standard Test Access Port and Boundary-Scan Architecture Please be aware that an important notice concerning availability. MicroStar BGA. DSP/BIOS.

PBK) [Q100 Qualification] 1. 2811) • Temperature Options – A: –40°C to 85°C (GHH. For more detail on each of these steps. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320C281x DSPs Copyright © 2001–2011. PGF.2 Getting Started This section gives a brief overview of the steps to take when first developing for a C28x™ device. PGF.ti. ZHH) (2812) – 176-Pin Low-Profile Quad Flatpack (LQFP) With External Memory Interface (PGF) (2812) – 128-Pin LQFP Without External Memory Interface (PBK) (2810. see the following: • Getting Started With TMS320C28x Digital Signal Controllers (literature number SPRAAM0) • C2000 Getting Started Website (http://www.com/f28xkits) 12 TMS320F281x.TMS320F2810.ti. TMS320C2811.ti. TMS320F2812 TMS320C2810. ZHH. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. ZHH. PBK) – Q: –40°C to 125°C (PGF. TMS320F2811.com/c2000getstarted) • TMS320F28x DSC Development and Experimenter’s Kits (http://www. PBK) – S: –40°C to 125°C (GHH.com • Package Options – 179-Ball MicroStar BGA™ With External Memory Interface (GHH.

TMS320F2812 TMS320C2810. and describes the function of each pin. Throughout this document. TMS320F2811. and F2812. TMS320C2812 www.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 2 Introduction This section provides a summary of each device’s features. Copyright © 2001–2011. and TMS320F2812 are abbreviated as F2810. TMS320C2811. 2. and TMS320C2812 are abbreviated as C2810. 2811 denotes both F2811 and C2811 devices. F281x denotes all three Flash devices.1 Description The TMS320F2810. TMS320C2811. TMS320F2811. members of the TMS320C28x™ DSP generation. TMS320F2812. TMS320C2811. and 2812 denotes both F2812 and C2812 devices.ti. Texas Instruments Incorporated Introduction Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 13 . TMS320F2811. F2811. The functional blocks and the memory maps are described in Section 3. respectively. and mechanical data about the available packaging. TMS320C2810. Functional Overview. and TMS320C2812 devices. TMS320C2810. 2810 denotes both F2810 and C2810 devices. are highly integrated. high-performance solutions for demanding control applications. C2811. electrical specifications. This document also provides detailed descriptions of peripherals. and C2812. parameter measurement information.TMS320F2810. TMS320F2810. lists the pin assignments. C281x denotes all three ROM devices. respectively.

67 ns 18K – 128K Yes Yes Yes (3) Yes EVA. TMS320C2811. EVB 4 16 6/2 Yes Yes 16 3 Yes SCIA. SCIB Yes Yes 56 3 F2811 6. EVB 4 16 6/2 Yes Yes 16 3 Yes SCIA. TMS320C2810. EVB 4 16 6/2 Yes Yes 16 3 Yes SCIA. 3. for descriptions of device stages.com 2. TMS320C2812 DSP Silicon Errata (literature number SPRZ193) has been posted on the Texas Instruments (TI) website. See Section 5.2 Device Summary Table 2-1 provides a summary of each device’s features. TMS320C2811. OTP is replaced by a 1K x 16 block of ROM.ti.67 ns 18K 128K – Yes Yes Yes – EVA. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . A type change represents a major functional feature difference in a peripheral module.8-V Core (135 MHz).67 ns 18K – 64K Yes Yes Yes (3) – EVA. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TMS320F2812 TMS320C2810.3-V On-Chip Flash (16-bit word) On-Chip ROM (16-bit word) Code Security for On-Chip Flash/SARAM/OTP/ROM Boot ROM OTP ROM (1K x 16) External Memory Interface Event Managers A and B (EVA and EVB) ● ● ● General-Purpose (GP) Timers Compare (CMP)/PWM Capture (CAP)/QEP Channels Watchdog Timer 12-Bit ADC ● Channels 32-Bit CPU Timers Serial Peripheral Interface (SPI) Serial Communications Interfaces A and B (SCIA and SCIB) Controller Area Network (CAN) Multichannel Buffered Serial Port (McBSP) Digital I/O Pins (Shared) External Interrupts Supply Voltage 1. 28xxx DSP Peripheral Reference Guide (literature number SPRU566) and in the peripheral reference guides. TMS320F2812. SCIB Yes Yes 56 3 Yes – – – Yes Yes Yes TMS C2811 6. EVB 4 16 6/2 Yes Yes 16 3 Yes SCIA. there may be minor differences between devices that do not affect the basic functionality of the module. Hardware Features (1) FEATURE TYPE (2) – – – – – – – 0 – – 0 0 – 0 – 0 0 0 0 – – – 128-pin PBK Yes – – – – – – – – Yes Yes Yes TMS 176-pin PGF 179-ball GHH 179-ball ZHH A: –40°C to 85°C S: –40°C to 125°C Q: –40°C to 125°C (Q100 Qualification) F2810 6. SCIB Yes Yes 56 3 Yes – – – Yes Yes Yes TMS C2812 6.9-V Core (150 MHz). Device and Development Support Tool Nomenclature. 1. 14 Introduction Copyright © 2001–2011. SCIB Yes Yes 56 3 Yes – – – Yes Yes Yes TMS F2812 6.TMS320F2810. SCIB Yes Yes 56 3 – Yes Yes Yes Yes Yes PGF only TMS Instruction Cycle (at 150 MHz) Single-Access RAM (SARAM) (16-bit word) 3.1. SCIB Yes Yes 56 3 – Yes Yes Yes Yes Yes PGF only TMS C2810 6. TMS320F2811. EVB 4 16 6/2 Yes Yes 16 3 Yes SCIA.67 ns 18K 128K – Yes Yes Yes Yes EVA. These device-specific differences are listed in the TMS320x28xx.67 ns 18K 64K – Yes Yes Yes – EVA.3-V I/O Packaging Temperature Options Product Status (4) (1) (2) (3) (4) The TMS320F2810. EVB 4 16 6/2 Yes Yes 16 3 Yes SCIA. Within a peripheral type. It will be updated as needed.67 ns 18K – 128K Yes Yes Yes (3) – EVA. On C281x devices. Table 2-1. TMS320F2811.

P XZCS0AND1 PWM8 PWM10 VSS VDD CAP6_ QEPI2 XD[8] VSS VDD T3CTRIP_ T4CTRIP/ PDPINTB EVBSOC VDD XZCS2 SCITXDB N SPISOMIA PWM7 PWM9 XR/W T4PWM_ T4CMP C4TRIP TEST2 VDD3VFL XD[11] XA[2] XWE CANTXA CANRXA VDDIO M SPISIMOA XA[1] XRD PWM12 CAP4_ QEP3 CAP5_ QEP4 TEST1 XD[9] X2 VSS XA[3] PWM1 SCIRXDB PWM2 L VDD VSS XD[6] PWM11 XD[7] C5TRIP VDDIO TDIRB XD[10] VDDIO VSS PWM3 PWM4 XD[12] K VSS SPICLKA XD[4] SPISTEA T3PWM_ T3CMP VSS C6TRIP TCLKINB X1/ XCLKIN XHOLDA PWM5 VDD VSS PWM6 J MCLKXA MFSRA XD[3] VDDIO XD[5] XD[13] T1PWM_ T1CMP XA[4] T2PWM_ T2CMP VSS H VDD MCLKRA XD[1] MFSXA XD[2] CAP1_ QEP1 CAP2_ QEP2 CAP3_ QEPI1 XA[5] T1CTRIP_ PDPINTA G MDXA MDRA XD[0] VSS XA[0] T2CTRIP/ EVASOC VDDIO VDD VSS XA[6] F XMP/MC ADCRESEXT VSSA1 VDDA1 ADCINB7 C3TRIP XCLKOUT XA[7] TCLKINA TDIRA E AVDDREFBG ADCADCAVSSREFBG REFP REFM ADCINA5 ADCBGREFIN XHOLD XNMI_ XINT13 VDDIO XA[13] C2TRIP XA[8] C1TRIP VSS D ADCINB6 ADCINB5 ADCINB4 ADCINA1 ADCINA6 XRS XA[18] XINT2_ ADCSOC XINT1_ XBIO VSS EMU0 TDO TMS XA[9] C ADCINB3 ADCINB0 ADCINB1 ADCINA2 VSSA2 VSS1 SCITXDA VDD EMU1 VSS XA[12] XA[10] TDI VDD B ADCINB2 VDDAIO ADCLO ADCINA3 ADCINA7 XREADY XA[17] VSS XA[15] VDD XD[14] TRST XZCS6AND7 VSS A VSSAIO ADCINA0 ADCINA4 VDDA2 VDD1 SCIRXDA XA[16] XD[15] XA[14] XF_ XPLLDIS TCK TESTSEL XA[11] 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Figure 2-1.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 2.TMS320F2810. Texas Instruments Incorporated Introduction Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 15 . TMS320F2811. TMS320C2812 www.3. TMS320C2811.1 Terminal Assignments for the GHH/ZHH Packages See Table 2-2 for a description of each terminal’s function(s). 2. Figure 2-2 shows the pin assignments for the 176-pin PGF low-profile quad flatpack (LQFP) and Figure 2-3 shows the pin assignments for the 128-pin PBK LQFP. TMS320F2812 and TMS320C2812 179-Ball GHH/ZHH MicroStar BGA™ (Bottom View) Copyright © 2001–2011.ti. TMS320F2812 TMS320C2810.3 Pin Assignments Figure 2-1 illustrates the ball locations for the 179-ball GHH and ZHH ball grid array (BGA) packages. Table 2-2 describes the function(s) of each pin.

TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812
SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.ti.com

2.3.2

Pin Assignments for the PGF Package
The TMS320F2812 and TMS320C2812 176-pin PGF low-profile quad flatpack (LQFP) pin assignments are shown in Figure 2-2. See Table 2-2 for a description of each pin’s function(s).
XA[11] TDI XA[10] VSS VDD TDO TMS XA[9] C3TRIP C2TRIP C1TRIP XA[8] VSS XCLKOUT XA[7] TCLKINA TDIR T2CTRIP/EVASOC VDDIO VSS VDD XA[6] T1CTRIP_PDPINTA CAP3_QEPI1 XA[5] CAP2_QEP2 CAP1_QEP1 VSS T2PWM_T2CMP XA[4] T1PWM_T1CMP PWM6 VDD VSS PWM5 XD[13] XD[12] PWM4 PWM3 PWM2 PWM1 SCIRXDB SCITXDB CANRXA
132 89

131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90

133 XZCS6AND7 TESTSEL TRST TCK EMU0 XA[12] XD[14] XF_XPLLDIS XA[13] VSS VDD XA[14] VDDIO EMU1 XD[15] XA[15] XINT1_XBIO XNMI_XINT13 XINT2_ADCSOC XA[16] VSS VDD SCITXDA XA[17] SCIRXDA XA[18] XHOLD XRS XREADY VDD1 VSS1 ADCBGREFIN VSSA2 VDDA2 ADCINA7 ADCINA6 ADCINA5 ADCINA4 ADCINA3 ADCINA2 ADCINA1 ADCINA0 ADCLO VSSAIO 176 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175

88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 XZCS2 CANTXA VSS XA[3] XWE T4CTRIP/EVBSOC XHOLDA VDDIO XA[2] T3CTRIP_PDPINTB VSS X1/XCLKIN X2 VDD XD[11] XD[10] TCLKINB TDIRB VSS VDD3VFL XD[9] TEST1 TEST2 XD[8] VDDIO C6TRIP C5TRIP C4TRIP CAP6_QEPI2 CAP5_QEP4 VSS CAP4_QEP3 VDD T4PWM_T4CMP XD[7] T3PWM_T3CMP VSS XR/W PWM12 PWM11 PWM10 PWM9 PWM8 PWM7 45

1

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
44

Figure 2-2. TMS320F2812 and TMS320C2812 176-Pin PGF LQFP (Top View)

16

Introduction

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VDDAIO ADCINB0 ADCINB1 ADCINB2 ADCINB3 ADCINB4 ADCINB5 ADCINB6 ADCINB7 ADCREFM ADCREFP AVSSREFBG AVDDREFBG VDDA1 VSSA1 ADCRESEXT XMP/MC XA[0] VSS MDRA XD[0] MDXA VDD XD[1] MCLKRA MFSXA XD[2] MCLKXA MFSRA XD[3] VDDIO VSS XD[4] SPICLKA SPISTEA XD[5] VDD VSS XD[6] SPISIMOA SPISOMIA XRD XA[1] XZCS0AND1

Copyright © 2001–2011, Texas Instruments Incorporated

TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812
www.ti.com SPRS174S – APRIL 2001 – REVISED MARCH 2011

2.3.3

Pin Assignments for the PBK Package
The TMS320F2810, TMS320F2811, TMS320C2810, and TMS320C2811 128-pin PBK low-profile quad flatpack (LQFP) pin assignments are shown in Figure 2-3. See Table 2-2 for a description of each pin’s function(s).
TDI VSS VDD TDO TMS C3TRIP C2TRIP C1TRIP VSS XCLKOUT TCLKINA TDIRA T2CTRIP/EVASOC VDDIO VDD T1CTRIP_PDPINTA CAP3_QEPI1 CAP2_QEP2 CAP1_QEP1 T2PWM_T2CMP T1PWM_T1CMP PWM6 VDD VSS PWM5 PWM4 PWM3 PWM2 PWM1 SCIRXDB SCITXDB CANRXA
96 65 97

128

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31

TESTSEL TRST TCK EMU0 XF_XPLLDIS VDD VSS VDDIO EMU1 XINT1_XBIO XNMI_XINT13 XINT2_ADCSOC VSS VDD SCITXDA SCIRXDA XRS VDD1 VSS1 ADCBGREFIN VSSA2 VDDA2 ADCINA7 ADCINA6 ADCINA5 ADCINA4 ADCINA3 ADCINA2 ADCINA1 ADCINA0 ADCLO VSSAIO

95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 CANTXA VDD VSS T4CTRIP/EVBSOC T3CTRIP_PDPINTB VSS X1/XCLKIN X2 VDD TCLKINB TDIRB VSS VDD3VFL TEST1 TEST2 VDDIO C6TRIP C5TRIP C4TRIP CAP6_QEPI2 CAP5_QEP4 CAP4_QEP3 VDD T4PWM_T4CMP T3PWM_T3CMP VSS PWM12 PWM11 PWM10 PWM9 PWM8 PWM7

98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127

1

32

Figure 2-3. TMS320F2810, TMS320F2811, TMS320C2810, and TMS320C2811 128-Pin PBK LQFP (Top View)

Copyright © 2001–2011, Texas Instruments Incorporated

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VDDAIO ADCINB0 ADCINB1 ADCINB2 ADCINB3 ADCINB4 ADCINB5 ADCINB6 ADCINB7 ADCREFM ADCREFP AVSSREFBG AVDDREFBG VDDA1 VSSA1 ADCRESEXT VSS MDRA MDXA VDD MCLKRA MFSXA MCLKXA MFSRA VDDIO VSS SPICLKA SPISTEA VDD VSS SPISIMOA SPISOMIA

17

TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812
SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.ti.com

2.4

Signal Descriptions
Table 2-2 specifies the signals on the F281x and C281x devices. All digital inputs are TTL-compatible. All outputs are 3.3 V with CMOS levels. Inputs are not 5-V tolerant. A 100-µA (or 20-µA) pullup/pulldown is used. Table 2-2. Signal Descriptions (1)
PIN NO. NAME 179-BALL GHH/ZHH D7 B7 A8 B9 A10 E10 C11 A14 C12 D14 E12 F12 G14 H13 J12 M11 N10 M2 G5 A9 B11 J10 L14 N9 L9 M8 P7 L5 L3 J5 K3 J3 H5 H3 G3 176-PIN PGF 158 156 152 148 144 141 138 132 130 125 121 118 111 108 103 85 80 43 18 147 139 97 96 74 73 68 65 54 39 36 33 30 27 24 21 128-PIN PBK – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – I/O/Z (2) PU/PD (3) DESCRIPTION

XINTF SIGNALS (2812 ONLY) XA[18] XA[17] XA[16] XA[15] XA[14] XA[13] XA[12] XA[11] XA[10] XA[9] XA[8] XA[7] XA[6] XA[5] XA[4] XA[3] XA[2] XA[1] XA[0] XD[15] XD[14] XD[13] XD[12] XD[11] XD[10] XD[9] XD[8] XD[7] XD[6] XD[5] XD[4] XD[3] XD[2] XD[1] XD[0] O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z – – – – – – – – – – – – – – – – – – – PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU 16-bit XINTF Data Bus 19-bit XINTF Address Bus

(1) (2) (3) 18

Typical drive strength of the output buffer for all pins is 4 mA except for TDO, XCLKOUT, XF, XINTF, EMU0, and EMU1 pins, which are 8 mA. I = Input, O = Output, Z = High impedance PU = pin has internal pullup; PD = pin has internal pulldown. Pullup/pulldown strength is given in Section 6.3, Electrical Characteristics Over Recommended Operating Conditions. The pullups/pulldowns are enabled in boundary scan mode. Introduction
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when active (low). XINTF Zone 6 and Zone 7 Chip Select. The state of the XMP/MC pin is ignored after reset. The XINTF will release the bus when any current access is complete and there are no pending accesses on the XINTF. by the Lead. External devices should only drive the external bus when XHOLDA is active (low). XR/W indicates read cycle is active. Normally held high. All XINTF buses and strobe signals will be in a high-impedance state. per zone basis. Texas Instruments Incorporated Introduction Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 19 . and Trail periods in the XTIMINGx registers. when high. Read Enable. Read Not Write Strobe. Active-low read strobe. When low. requests the XINTF to release the external bus and place all buses and strobes into a high-impedance state. Zone 7 is enabled on the external interface. See the timing diagrams for more details. Signal Descriptions (continued) PIN NO. Switches between microprocessor and microcomputer mode. and Trail periods in the XTIMINGx registers. TMS320C2812 www. XHOLD. Active. Zone 7 is disabled from the external interface. by the Lead. XHOLDA is released when the XHOLD signal is released.TMS320F2810.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 2-2. The write strobe waveform is specified. Active-low write strobe. XZCS2 is active (low) when an access to the XINTF Zone 2 is performed. The read strobe waveform is specified. NAME 179-BALL GHH/ZHH 176-PIN PGF 128-PIN PBK I/O/Z (2) PU/PD (3) DESCRIPTION Microprocessor/Microcomputer Mode Select. and on-chip boot ROM may be accessed instead. Indicates peripheral is ready to complete the access when asserted to 1. per zone basis. XR/W indicates write cycle is active. XINTF Zone 2 Chip Select. TMS320C2811. XMP/MC F1 17 – I PD XHOLD E7 159 – I PU XHOLDA K10 82 – O/Z – XZCS0AND1 P1 44 – O/Z – XZCS2 P13 88 – O/Z – XZCS6AND7 B13 133 – O/Z – XWE N11 84 – O/Z – XRD M3 42 – O/Z – XR/W N4 51 – O/Z – XREADY B6 161 – I PU Copyright © 2001–2011. NOTE: The XRD and XWE signals are mutually exclusive. When low. XREADY can be configured to be a synchronous or an asynchronous input. Write Enable.ti. This signal is latched into the XINTCNF2 register on a reset and the user can modify this bit in software. TMS320F2812 TMS320C2810. Ready Signal. External Hold Acknowledge. XZCS0AND1 is active (low) when an access to the XINTF Zone 0 or Zone 1 is performed. Active. XHOLDA is driven active (low) when the XINTF has granted a XHOLD request. External Hold Request. XZCS6AND7 is active (low) when an access to the XINTF Zone 6 or Zone 7 is performed. XINTF Zone 0 and Zone 1 Chip Select. TMS320F2811. When high.

XRS causes the device to terminate execution.com Table 2-2. TMS320F2811. the XRS pin will be driven low for the watchdog reset duration of 512 XCLKIN cycles.9-V) core digital power supply (VDD). Device reset. XCLKOUT = SYSCLKOUT/4. Oscillator Output Output clock derived from SYSCLKOUT to be used for external wait-state generation and as a general-purpose clock source. Reserved for TI.8-V (or 1. Test Pin. this pin is not connected to any circuitry internal to the device). this pin is a “no connect (NC)” (i. execution begins at the location pointed to by the PC. NAME 179-BALL GHH/ZHH 176-PIN PGF 128-PIN PBK I/O/Z (2) PU/PD (3) DESCRIPTION JTAG AND MISCELLANEOUS SIGNALS Oscillator Input – input to the internal oscillator.TMS320F2810. On F281x devices. At reset. A clamping diode may be used to clamp a buffered clock signal to ensure that the logic-high level does not exceed VDD (1.9 V) or a 1. TEST2 must be left unconnected. On C281x devices. It should be noted that the X1/XCLKIN pin is referenced to the 1. It is recommended that this pin be driven by an open-drain device. The PC will point to the address contained at the location 0x3FFFC0.. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www..ti. Reserved for TI. rather than the 3. On C281x devices. Signal Descriptions (continued) PIN NO.8 V or 1. TEST1 must be left unconnected.e. this pin is a “no connect (NC)” (i. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .8-V oscillator may be used. Must be connected to ground. Device Reset (in) and Watchdog Reset (out). or 1/4 the frequency of SYSCLKOUT. Reserved for TI. the XCLKOUT pin is not placed in a high-impedance state during reset. This pin is also used to feed an external clock. TMS320C2811. 1/2 the frequency. When XRS is brought to a high level. this pin is not connected to any circuitry internal to the device). This pin is driven low by the DSP when a watchdog reset occurs. provided that the proper voltage levels be driven on the X1/XCLKIN pin. Test Pin. The output buffer of this pin is an open-drain with an internal pullup (100 µA. XCLKOUT is either the same frequency. X1/XCLKIN K9 77 58 I – X2 M9 76 57 O – XCLKOUT F11 119 87 O – TESTSEL A13 134 97 I PD XRS D6 160 113 I/O PU TEST1 M7 67 51 I/O – TEST2 N7 66 50 I/O – 20 Introduction Copyright © 2001–2011.3-V I/O supply (VDDIO). Unlike other GPIO pins. On F281x devices. The 28x can be operated with an external clock source. TMS320F2812 TMS320C2810. During watchdog reset. The XCLKOUT signal can be turned off by setting bit 3 (CLKOFF) of the XINTCNF2 register to 1. typical).e. Test Pin.

A 2.ti. this pin is used as an interrupt to or from the emulator system and is defined as input/output through the JTAG scan. TRST. JTAG test clock with internal pullup JTAG test-mode select (TMS) with internal pullup. With the EMU0 pin at a logic-high state and the EMU1 pin at a logic-low state. Since this is application-specific. when driven high. If this signal is not connected or driven low. TMS320F2811. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK. This pin is also used to put the device into boundary-scan mode. TMS320C2812 www. When TRST is driven high. TRST is an active-high test pin and must be maintained low at all times during normal device operation. TMS320F2812 TMS320C2810. it has an internal pulldown device. Texas Instruments Incorporated Introduction Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 21 . PU/PD (3) DESCRIPTION TRST B12 135 98 I PD TCK TMS A12 D13 136 126 99 92 I I PU PU TDI C13 131 96 I PU TDO D12 127 93 O/Z – Copyright © 2001–2011. test data output (TDO). it is recommended that each target board be validated for proper operation of the debugger and the application. Emulator pin 0. In other instances.2-kΩ resistor generally offers adequate protection. it is recommended that each target board be validated for proper operation of the debugger and the application. and the test reset signals are ignored. The value of this resistor should be based on drive strength of the debugger pods applicable to the design. Signal Descriptions (continued) PIN NO. gives the scan system control of the operations of the device.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 2-2. NOTE: Do not use pullup resistors on TRST.2-kΩ to 4.TMS320F2810. The contents of the selected register (instruction or data) is shifted out of TDO on the falling edge of TCK. an external pulldown resistor is highly recommended. EMU0 D11 137 100 I/O/Z PU NOTE: An external pullup resistor is recommended on this pin. In a low-noise environment. a rising edge on the TRST pin would latch the device into boundary-scan mode. Since this is application-specific. TMS320C2811. The value of this resistor should be based on the drive strength of the debugger pods applicable to the design. NAME 179-BALL GHH/ZHH 176-PIN PGF 128-PIN PBK I/O/Z (2) JTAG JTAG test reset with internal pulldown. JTAG scan out. This serial control input is clocked into the TAP controller on the rising edge of TCK. the device operates in its functional mode.7-kΩ resistor is generally adequate. TRST may be left floating. A 2. JTAG test data input (TDI) with internal pullup.

and VDDAIO pins have been fully powered up. and VDDAIO pins have been fully powered up. EMU1 C9 146 105 I/O/Z PU NOTE: An external pullup resistor is recommended on this pin. 1–10 µF low ESR capacitor can be used in the external reference mode. [Can accept external reference input (1 V) if the software bit is enabled for this mode.com Table 2-2. Signal Descriptions (continued) PIN NO.5 Ω) ceramic bypass capacitor of 10 µF to analog ground. VDDA2. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. this pin is used as an interrupt to or from the emulator system and is defined as input/output through the JTAG scan. NAME 179-BALL GHH/ZHH 176-PIN PGF 128-PIN PBK I/O/Z (2) PU/PD (3) DESCRIPTION Emulator pin 1. The value of this resistor should be based on the drive strength of the debugger pods applicable to the design.] NOTE: Use the ADC Clock rate to derive the ESR specification from the capacitor data sheet that is used in the system. TMS320C2811. a rising edge on the TRST pin would latch the device into boundary-scan mode. ADCREFP E2 11 11 I/O – ADCREFM E4 10 10 I/O – 22 Introduction Copyright © 2001–2011. Requires a low ESR (under 1. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . 8-channel analog inputs for Sample-and-Hold B. Requires a low ESR (under 1. ADC ANALOG INPUT SIGNALS ADCINA7 ADCINA6 ADCINA5 ADCINA4 ADCINA3 ADCINA2 ADCINA1 ADCINA0 ADCINB7 ADCINB6 ADCINB5 ADCINB4 ADCINB3 ADCINB2 ADCINB1 ADCINB0 B5 D5 E5 A4 B4 C4 D4 A3 F5 D1 D2 D3 C1 B1 C3 C2 167 168 169 170 171 172 173 174 9 8 7 6 5 4 3 2 119 120 121 122 123 124 125 126 9 8 7 6 5 4 3 2 I I I I I I I I I I I I I I I I – – – – – – – – – – – – – – – – ADC Voltage Reference Output (2 V).2-kΩ to 4. VDDA2. Since this is application-specific. TMS320F2811. [Can accept external reference input (2 V) if the software bit is enabled for this mode. The ADC pins should not be driven before the VDDA1. 8-channel analog inputs for Sample-and-Hold A.] NOTE: Use the ADC Clock rate to derive the ESR specification from the capacitor data sheet that is used in the system. This pin is also used to put the device into boundary-scan mode. it is recommended that each target board be validated for proper operation of the debugger and the application. TMS320F2812 TMS320C2810. With the EMU0 pin at a logic-high state and the EMU1 pin at a logic-low state.ti. A 2. The ADC pins should not be driven before the VDDA1. ADC Voltage Reference Output (1 V). 1–10 µF low ESR capacitor can be used in the external reference mode.TMS320F2810.5 Ω) ceramic bypass capacitor of 10 µF to analog ground. When TRST is driven high.7-kΩ resistor is generally adequate.

for voltage requirements. NAME 179-BALL GHH/ZHH 176-PIN PGF 128-PIN PBK I/O/Z (2) PU/PD (3) DESCRIPTION ADC External Current Bias Resistor.8-V or 1. ADC Analog GND ADC Analog Power (3.8-V (or 1. Recommended Operating Conditions.TMS320F2810. Core and Digital I/O Ground Pins Copyright © 2001–2011.3-V Analog I/O Power Pin Analog I/O Ground Pin ADCBGREFIN AVSSREFBG AVDDREFBG ADCLO VSSA1 VSSA2 VDDA1 VDDA2 VSS1 VDD1 VDDAIO VSSAIO VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS E6 E3 E1 B3 F3 C5 F4 A5 C6 A6 B2 A2 H1 L1 P5 P9 P12 K12 G12 C14 B10 C8 G4 K1 L2 P4 K6 P8 M10 L11 K13 J14 G13 E14 B14 D10 C10 B8 164 12 13 175 15 165 14 166 163 162 1 176 23 37 56 75 – 100 112 128 143 154 19 32 38 52 58 70 78 86 99 105 113 120 129 142 – 153 116 12 13 127 15 117 14 118 115 114 1 128 20 29 42 56 63 74 82 94 102 110 17 26 30 39 – 53 59 62 73 – – 88 95 – 103 109 – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – POWER SIGNALS 1.3-V Supply ADC Digital GND ADC Digital 1.9-V) Supply 3.9 kΩ ± 5% for ADC clock range 1–18. ADCRESEXT F2 16 16 O – Use 24. TMS320F2811.ti. Signal Descriptions (continued) PIN NO.75 MHz. TMS320C2811.9-V Core Digital Power Pins. Must be left unconnected. Test Pin. ADC Analog GND ADC Analog GND ADC Analog 3.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 2-2. Texas Instruments Incorporated Introduction Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 23 .75 MHz–25 MHz. See Section 6. TMS320F2812 TMS320C2810. Connect to analog ground. Reserved for TI.2.3-V) Common Low Side Analog Input.3-V Supply ADC Analog 3. use 20 kΩ ± 5% for ADC clock range 18. TMS320C2812 www.

Signal Descriptions (continued) PIN NO.PWM6 (O) GPIOA6 T1PWM_T1CMP (I) GPIOA7 T2PWM_T2CMP (I) GPIOA8 .C2TRIP (I) GPIOA15 .PWM7 (O) GPIOB1 .TDIRB (I) GPIOB12 .CAP2_QEP2 (I) GPIOA10 .CAP3_QEPI1 (I) GPIOA11 .TDIRA (I) GPIOA12 . TMS320F2811.PWM4 (O) GPIOA4 .PWM8 (O) GPIOB2 .CAP4_QEP3 (I) GPIOB9 . This pin is used as VDDIO in ROM parts and must be connected to 3.3 V at all times after power-up sequence requirements have been met. TMS320C2811.PWM11 (O) GPIOB5 .PWM12 (O) GPIOB6 T3PWM_T3CMP (I) GPIOB7 T4PWM_T4CMP (I) GPIOB8 . 3 3-V I/O Digital Power Pins DESCRIPTION VDD3VFL N8 69 52 – – GPIO OR PERIPHERAL SIGNALS GPIOA OR EVA SIGNALS GPIOA0 .C3TRIP (I) GPIOB0 .PWM9 (O) GPIOB3 .PWM10 (O) GPIOB4 . TMS320F2812 TMS320C2810.PWM3 (O) GPIOA3 . NAME VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO 179-BALL GHH/ZHH J4 L7 L10 N14 G11 E9 176-PIN PGF 31 64 81 – 114 145 128-PIN PBK 25 49 – – 83 104 I/O/Z (2) – – – – – – PU/PD (3) – – – – – – 3.3 V in ROM parts as well.C1TRIP (I) GPIOA14 . This pin should be connected to 3.PWM2 (O) GPIOA2 .CAP6_QEPI2 (I) GPIOB11 .CAP1_QEP1 (I) GPIOA9 .TCLKINA (I) GPIOA13 .TMS320F2810.PWM1 (O) GPIOA1 .CAP5_QEP4 (I) GPIOB10 .com Table 2-2.3-V Flash Core Power Pin. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.PWM5 (O) GPIOA5 .ti.TCLKINB (I) M12 M14 L12 L13 K11 K14 J11 J13 H10 H11 H12 F14 F13 E13 E11 F10 N2 P2 N3 P3 L4 M4 K5 N5 M5 M6 P6 L8 K8 92 93 94 95 98 101 102 104 106 107 109 116 117 122 123 124 45 46 47 48 49 50 53 55 57 59 60 71 72 68 69 70 71 72 75 76 77 78 79 80 85 86 89 90 91 33 34 35 36 37 38 40 41 43 44 45 54 55 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU PU GPIO or PWM Output Pin #1 GPIO or PWM Output Pin #2 GPIO or PWM Output Pin #3 GPIO or PWM Output Pin #4 GPIO or PWM Output Pin #5 GPIO or PWM Output Pin #6 GPIO or Timer 1 Output GPIO or Timer 2 Output GPIO or Capture Input #1 GPIO or Capture Input #2 GPIO or Capture Input #3 GPIO or Timer Direction GPIO or Timer Clock Input GPIO or Compare 1 Output Trip GPIO or Compare 2 Output Trip GPIO or Compare 3 Output Trip GPIO or PWM Output Pin #7 GPIO or PWM Output Pin #8 GPIO or PWM Output Pin #9 GPIO or PWM Output Pin #10 GPIO or PWM Output Pin #11 GPIO or PWM Output Pin #12 GPIO or Timer 3 Output GPIO or Timer 4 Output GPIO or Capture Input #4 GPIO or Capture Input #5 GPIO or Capture Input #6 GPIO or Timer Direction GPIO or Timer Clock Input GPIOB OR EVB SIGNALS 24 Introduction Copyright © 2001–2011.

MCLKXA (I/O) GPIOF9 .MFSXA (I/O) GPIOF11 .XNMI_XINT13 (I) GPIOF0 .MDXA (O) GPIOF13 .MCLKRA (I/O) GPIOF10 .SPICLKA (I/O) GPIOF3 .SCIRXDA (I) GPIOF6 .MDRA (I) 179-BALL GHH/ZHH N6 L6 K7 176-PIN PGF 61 62 63 128-PIN PBK 46 47 48 I/O/Z (2) I/O I/O I/O PU/PD (3) PU PU PU DESCRIPTION GPIO or Compare 4 Output Trip GPIO or Compare 5 Output Trip GPIO or Compare 6 Output Trip GPIOD OR EVA SIGNALS H14 G10 110 115 81 84 I/O I/O PU PU GPIO or Timer 1 Compare Output Trip GPIO or Timer 2 Compare Output Trip or External ADC Start-of-Conversion EV-A GPIOD OR EVB SIGNALS P10 P11 79 83 60 61 I/O I/O PU PU GPIO or Timer 3 Compare Output Trip GPIO or Timer 4 Compare Output Trip or External ADC Start-of-Conversion EV-B GPIO or XINT1 or XBIO input GPIO or XINT2 or ADC start-of-conversion GPIO or XNMI or XINT13 GPIO or SPI slave in.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 2-2.C5TRIP (I) GPIOB15 . TMS320F2812 TMS320C2810.C4TRIP (I) GPIOB14 . NAME GPIOB13 .TMS320F2810. TMS320F2811. TMS320C2812 www. Signal Descriptions (continued) PIN NO. Texas Instruments Incorporated Introduction Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 25 .SPISTEA (I/O) GPIOF4 .CANRXA (I) GPIOF8 . master in GPIO or SPI clock GPIO or SPI slave transmit enable GPIO or SCI asynchronous serial port TX data GPIO or SCI asynchronous serial port RX data GPIO or eCAN transmit data GPIO or eCAN receive data GPIO or McBSP transmit clock GPIO or McBSP receive clock GPIO or McBSP transmit frame synch GPIO or McBSP receive frame synch GPIO or McBSP transmitted serial data GPIO or McBSP received serial data GPIOE OR INTERRUPT SIGNALS D9 D8 E8 M1 N1 K2 K4 C7 A7 N12 N13 J1 H2 H4 J2 G1 G2 149 151 150 40 41 34 35 155 157 87 89 28 25 26 29 22 20 106 108 107 31 32 27 28 111 112 64 65 23 21 22 24 19 18 I/O/Z I/O/Z I/O I/O/Z I/O/Z I/O/Z I/O/Z I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O – – PU – – – – PU PU PU PU PU PU PU PU – PU GPIOF OR SPI SIGNALS GPIOF OR SCI-A SIGNALS GPIOF OR CAN SIGNALS GPIOF OR McBSP SIGNALS Copyright © 2001–2011. TMS320C2811.SCITXDA (O) GPIOF5 .MFSRA (I/O) GPIOF12 .SPISOMIA (I) GPIOF2 .C6TRIP (I) GPIOD0 T1CTRIP_PDPINTA (I) GPIOD1 T2CTRIP/EVASOC (I) GPIOD5 T3CTRIP_PDPINTB (I) GPIOD6 T4CTRIP/EVBSOC (I) GPIOE0 .CANTXA (O) GPIOF7 .SPISIMOA (O) GPIOF1 .ti.XINT1_XBIO (I) GPIOE1 XINT2_ADCSOC (I) GPIOE2 . master out GPIO or SPI slave out.

26 Introduction Copyright © 2001–2011. TMS320F2812 TMS320C2810. The PLL will be disabled if this pin is sensed low. 3.SCIRXDB (I) P14 M13 90 91 66 67 I/O/Z I/O/Z – – NOTE Other than the power supply pins.com Table 2-2. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. XPLLDIS – This pin is sampled during reset to check whether the PLL must be disabled. TMS320C2811. HALT and STANDBY modes cannot be used when the PLL is disabled. However.TMS320F2810. GPIO – GPIO function GPIO or SCI asynchronous serial port transmit data GPIO or SCI asynchronous serial port receive data GPIOF14 XF_XPLLDIS (O) A11 140 101 I/O PU GPIOG OR SCI-B SIGNALS GPIOG4 . 2.3-V supply. TMS320F2811. XF – General-purpose output pin.SCITXDB (O) GPIOG5 .3-V rail has reached recommended operating conditions. it is acceptable for an I/O pin to ramp along with the 3. Signal Descriptions (continued) PIN NO. NAME 179-BALL GHH/ZHH 176-PIN PGF 128-PIN PBK I/O/Z (2) PU/PD (3) DESCRIPTION GPIOF OR XF CPU OUTPUT SIGNAL This pin has three functions: 1. no pin should be driven before the 3. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .ti.

com SPRS174S – APRIL 2001 – REVISED MARCH 2011 3 Functional Overview Memory Bus TINT0 CPU-Timer 0 CPU-Timer 1 CPU-Timer 2 TINT2 PIE TINT1 (96 Interrupts) (A) Real-Time JTAG INT14 External Interface (XINTF) (B) Control Address (19) Data (16) INT[12:1] M0 SARAM 1K x 16 M1 SARAM 1K x 16 L0 SARAM 4K x 16 L1 SARAM 4K x 16 XINT13 XNMI G P I O M U X INT13 External Interrupt Control (XINT1/2/13. On C281x devices. A. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 27 . B. XINTF is available on the F2812 and C2812 devices only. Figure 3-1. TMS320C2812 www. TMS320F2811. 45 of the possible 96 interrupts are used on the devices. C.TMS320F2810. Functional Block Diagram Copyright © 2001–2011. XNMI) SCIA/SCIB SPI McBSP eCAN FIFO FIFO FIFO C28x CPU NMI GPIO Pins Flash 128K x 16 (F2812) 128K x 16 (F2811) 64K x 16 (F2810) EVA/EVB ROM 128K x 16 (C2812) 128K x 16 (C2811) 64K x 16 (C2810) 16 Channels 12-Bit ADC XRS X1/XCLKIN X2 XF_XPLLDIS System Control (Oscillator and PLL + Peripheral Clocking + Low-Power Modes + Watchdog) RS CLKIN OTP 1K x 16 H0 SARAM 8K x 16 (C) Memory Bus Boot ROM 4K x 16 Peripheral Bus Protected by the code-security module.ti. TMS320C2811. the OTP is replaced with a 1K x 16 block of ROM. TMS320F2812 TMS320C2810.

TMS320C2811. E. Peripheral Frame 1. Figure 3-2. XZCS6AND7) (Enabled if MP/MC = 1) XINTF Vector . Peripheral Frame 0. XZCS2) Reserved XINTF Zone 6 (0.M0 vector. ENPIE = 1) 0x00 0040 0x00 0400 Low 64K (24x/240x Equivalent Data Space) 0x00 0800 0x00 0D00 Reserved Reserved 0x00 0E00 0x00 2000 Reserved Reserved XINTF Zone 0 ×(8K x 16. Secure Block) 128-Bit Password H0 SARAM (8K x 16) Reserved Reserved 0x3F C000 × XINTF Zone 7 (16K x 16. User program cannot access these memory maps in program space. Zones 0 and 1 and Zones 6 and 7 share the same chip select. hence.RAM (32 x 32) (Enabled if VMAP = 1. XZCS0AND1) XINTF Zone 1 (8K x 16. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. D. “Protected” means the order of Write followed by Read operations is preserved rather than the pipeline order. BROM vector. F. TMS320F2812 TMS320C2810. these memory blocks have mirrored locations. ENPIE = 0) 0x3F F000 0x3F FFC0 Boot ROM (4K x 16) (Enabled if MP/MC = 0) BROM Vector× . Boot ROM and Zone 7 memory maps are active either in on-chip or XINTF zone depending on MP/MC. MP/MC = 0. MP/MC = 1. XZCS0AND1) (Protected) 0x00 2000 0x00 4000 0x00 6000 0x00 7000 0x00 8000 0x00 9000 0x00 A000 Peripheral Frame 1 (Protected) Peripheral Frame 2 (Protected) Reserved Reserved L0 SARAM (4K x 16. C. XZCS6AND7) 0x3D 7800 0x3D 7C00 0x3D 8000 OTP (or ROM) (1K x 16. Reserved locations are reserved for future expansion.5M x 16. Secure Block) Reserved (1K) High 64K (24x/240x Equivalent Program Space) 0x3F 7FF8 0x3F 8000 0x3F A000 Flash (or ROM) (128K x 16.ti.ROM (32 x 32) (Enabled if VMAP = 1.TMS320F2810. Application should not access these areas. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320F2811.RAM (32 x 32) (Enabled if VMAP = 0) M0 SARAM (1K x 16) M1 SARAM (1K x 16) × Peripheral Frame 0 PIE Vector .com 3. ENPIE = 0) LEGEND: Only one of these vector maps .RAM (256 x 16) (Enabled if VMAP = 1. Certain memory ranges are EALLOW protected against spurious writes after configuration. XINTF vector . Memory blocks are not to scale. G.5M x 16. B.1 Memory Map Block Start Address On-Chip Memory Data Space 0x00 0000 Prog Space External Memory XINTF Data Space Prog Space × M0 Vector . not in both. Secure Block) 0x08 0000 0x10 0000 0x18 0000 XINTF Zone 2 × (0.should be enabled at a time. PIE vector. and Peripheral Frame 2 memory maps are restricted to data memory only. Secure Block) L1 SARAM ×(4K x 16. F2812/C2812 Memory Map 28 Functional Overview Copyright © 2001–2011. A.

TMS320F2810. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 29 . Peripheral Frame 1. C. B.RAM (32 x 32) (Enabled if VMAP = 0) M0 SARAM (1K x 16) M1 SARAM (1K x 16) × Peripheral Frame 0 PIE Vector . TMS320F2812 TMS320C2810. and Peripheral Frame 2 memory maps are restricted to data memory only. Peripheral Frame 0. Secure Block) L1 SARAM ×(4K x 16.ROM (32 x 32) (Enabled if VMAP = 1. Secure Block) 128-Bit Password H0 SARAM (8K x 16) Reserved 0x3F F000 0x3F FFC0 Boot ROM (4K x 16) (Enabled if MP/MC = 0) BROM Vector× . E.RAM (256 x 16) (Enabled if VMAP = 1.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Block Start Address On-Chip Memory Data Space Prog Space 0x00 0000 × M0 Vector . Memory blocks are not to scale. Secure Block) Reserved (1K) High 64K (24x/240x Equivalent Program Space) 0x3F 7FF8 0x3F 8000 0x3F A000 Flash (or ROM) (128K x 16. TMS320C2812 www. D. ENPIE = 0) LEGEND: Only one of these vector maps . F2811/C2811 Memory Map Copyright © 2001–2011. Figure 3-3. Certain memory ranges are EALLOW protected against spurious writes after configuration. Reserved locations are reserved for future expansion. User program cannot access these memory maps in program space. “Protected” means the order of Write followed by Read operations is preserved rather than the pipeline order. Secure Block) Reserved 0x3D 7800 0x3D 7C00 0x3D 8000 OTP (or ROM) (1K x 16.ti. A.should be enabled at a time. BROM vector . MP/MC = 0. TMS320F2811. ENPIE = 1) 0x00 0040 0x00 0400 Low 64K (24x/240x Equivalent Data Space) 0x00 0800 0x00 0D00 Reserved 0x00 0E00 0x00 2000 Reserved Reserved 0x00 6000 0x00 7000 0x00 8000 0x00 9000 0x00 A000 Peripheral Frame 1 (Protected) Peripheral Frame 2 (Protected) Reserved L0 SARAM (4K x 16. Application should not access these areas. TMS320C2811.M0 vector. PIE vector.

Memory blocks are not to scale.RAM (256 x 16) (Enabled if VMAP = 1. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. and Peripheral Frame 2 memory maps are restricted to data memory only.M0 vector. TMS320C2811. E.ti.TMS320F2810.ROM (32 x 32) (Enabled if VMAP = 1. TMS320F2811. ENPIE = 0) LEGEND: Only one of these vector maps . Secure Block) Reserved 0x3D 7800 0x3D 7C00 0x3E 8000 OTP (or ROM) (1K x 16. Certain memory ranges are EALLOW protected against spurious writes after configuration. Application should not access these areas. Secure Block) L1 SARAM ×(4K x 16.com Block Start Address On-Chip Memory Data Space Prog Space 0x00 0000 × M0 Vector . B. A. MP/MC = 0. F2810/C2810 Memory Map 30 Functional Overview Copyright © 2001–2011. Reserved locations are reserved for future expansion. Secure Block) Reserved Flash (or ROM) (64K x 16. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . Figure 3-4. TMS320F2812 TMS320C2810. BROM vector . Peripheral Frame 0. User program cannot access these memory maps in program space. ENPIE = 1) 0x00 0040 0x00 0400 Low 64K (24x/240x Equivalent Data Space) 0x00 0800 0x00 0D00 Reserved 0x00 0E00 0x00 2000 Reserved Reserved 0x00 6000 0x00 7000 0x00 8000 0x00 9000 0x00 A000 Peripheral Frame 1 (Protected) Peripheral Frame 2 (Protected) Reserved L0 SARAM (4K x 16. Secure Block) 128-Bit Password H0 SARAM (8K x 16) Reserved High 64K (24x/240x Equivalent Program Space) 0x3F 7FF8 0x3F 8000 0x3F A000 0x3F F000 0x3F FFC0 Boot ROM (4K x 16) (Enabled if MP/MC = 0) BROM Vector× . “Protected” means the order of Write followed by Read operations is preserved rather than the pipeline order. C. Peripheral Frame 1. D.should be enabled at a time.RAM (32 x 32) (Enabled if VMAP = 0) M0 SARAM (1K x 16) M1 SARAM (1K x 16) × Peripheral Frame 0 PIE Vector . PIE vector.

16K x 16 Sector B. the top 32K of Flash/ROM and H0 SARAM block can be used to run 24x/240x-compatible code (if MP/MC mode is low) or. 16K x 16 Sector F. 8K x 16 Sector I. Copyright © 2001–2011. TMS320F2812 TMS320C2810. Addresses of Flash Sectors in F2810 ADDRESS RANGE 0x3E 8000 0x3E BFFF 0x3E C000 0x3E FFFF 0x3F 0000 0x3F 3FFF 0x3F 4000 0x3F 5FFF 0x3F 6000 0x3F 7F80 0x3F 7FF5 0x3F 7FF6 0x3F 7FF7 0x3F 7FF8 0x3F 7FFF PROGRAM AND DATA SPACE Sector E. 16K x 16 Sector D. 8K x 16 Sector H. 8K x 16 Sector A. 16K x 16 Sector B. Hence. code can be executed from XINTF Zone 7 (if MP/MC mode is high). 16K x 16 Sector E. 16K x 16 Sector G.ti. Addresses of Flash Sectors in F2812 and F2811 ADDRESS RANGE 0x3D 8000 0x3D 9FFF 0x3D A000 0x3D BFFF 0x3D C000 0x3D FFFF 0x3E 0000 0x3E 3FFF 0x3E 4000 0x3E 7FFF 0x3E 8000 0x3E BFFF 0x3E C000 0x3E FFFF 0x3F 0000 0x3F 3FFF 0x3F 4000 0x3F 5FFF 0x3F 6000 0x3F 7F80 0x3F 7FF5 0x3F 7FF6 0x3F 7FF7 0x3F 7FF8 0x3F 7FFF PROGRAM AND DATA SPACE Sector J. 16K x 16 Sector C. 16K x 16 Sector D. 8K x 16 Sector A. 16K x 16 Sector C. The “High 64K” of the memory address range maps into the program space of the 24x/240x. 8K x 16 Program to 0x0000 when using the Code Security Module Boot-to-Flash (or ROM) Entry Point (program branch instruction here) Security Password (128-Bit) (Do not program to all zeros) Table 3-2. 8K x 16 Program to 0x0000 when using the Code Security Module Boot-to-Flash (or ROM) Entry Point (program branch instruction here) Security Password (128-Bit) (Do not program to all zeros) The “Low 64K” of the memory address range maps into the data space of the 240x.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 3-1. TMS320C2811. 24x/240x-compatible code will execute only from the “High 64K”memory area. TMS320F2811. on the 2812.TMS320F2810. TMS320C2812 www. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 31 .

One zone has its own chip select and the remaining four zones share two chip selects. 1-wait minimum Programmable. 1-wait minimum Fixed Fixed Fixed Fixed Fixed Programmed via the Flash registers. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Programmed via the Flash registers. The Boot ROM is disabled in this mode. The user can change this mode in software and hence control the mapping of Boot ROM and XINTF Zone 7. No other memory blocks are affected by XMP/MC. XINTF Zone 7 is accessed if the XMP/MC pin is pulled high. Cycles can be extended by external memory or peripheral. 1-wait-state operation is possible at a reduced CPU frequency. Each zone can be programmed with its own timing (wait states) and to either sample or ignore external ready signal. See Section 3. The CSM password locations are hardwired for 16 wait states. The state of the XMP/MC signal on reset is stored in an MP/MC mode bit in the XINTCNF2 register.ti.6.5. XINTF (2812 only).6. at reset.TMS320F2810. The C28x CPU supports a block protection mode where a region of memory can be protected to make sure that operations occur as written (the penalty is extra cycles that are added to align the operations). Table 3-3. The wait states for the various spaces in the memory map area are listed in Table 3-3.com The XINTF consists of five independent zones. The “protected” mode ensures that all accesses to these blocks happen as written. Peripheral Frame 1. will appear in reverse order on the memory bus of the CPU. Peripheral Frame 2.2. and XINTF Zone 1 are grouped together to enable these blocks to be “write/read peripheral block protected”. This signal selects microprocessor or microcomputer mode of operation. by default.2. TMS320F2811. to different memory locations. External Interface. In microprocessor mode. for details. TMS320F2812 TMS320C2810. a write immediately followed by a read. This makes interfacing to external peripherals easy and glueless. See Section 3. This allows the user to either boot from on-chip memory or from off-chip memory. This can cause problems in certain peripheral applications where the user expected the write to occur first (as written). I/O space is not supported on the 2812 XINTF. NOTE The chip selects of XINTF Zone 0 and Zone 1 are merged into a single chip select (XZCS0AND1). 0-wait-state operation is possible at reduced CPU frequency. In microcomputer mode. Zone 7 is disabled such that the vectors are fetched from Boot ROM. for more information. 0-wait operation is not possible. On the 2812. 0-wait minimum 0-wait 1-wait Programmable. Wait States AREA M0 and M1 SARAMs Peripheral Frame 0 Peripheral Frame 1 Peripheral Frame 2 L0 and L1 SARAMs OTP (or ROM) WAIT-STATES 0-wait 0-wait 0-wait (writes) 2-wait (reads) 0-wait (writes) 2-wait (reads) 0-wait Programmable. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . See Section 3. Zone 7 is mapped to high memory such that the vector table is fetched externally. for more information. COMMENTS Flash (or ROM) H0 SARAM Boot-ROM XINTF 32 Functional Overview Copyright © 2001–2011. This mode is programmable and. and the chip selects of XINTF Zone 6 and Zone 7 are merged into a single chip select (XZCS6AND7). TMS320C2811. Fixed Fixed Programmed via the XINTF registers. Because of the C28x pipeline. Flash (F281x Only). Flash (F281x Only). it will protect the selected zones.

read a data value and write a data value in a single cycle. The program read bus consists of 22 address lines and 32 data lines.2 Memory Bus (Harvard Bus Architecture) As with many DSP type devices.2 3. multiple busses are used to move data between the memories and peripherals and the CPU. enable the C28x to efficiently handle higher numerical resolution problems that would otherwise demand a more expensive floating-point processor solution. The C28x is source code compatible to the 24x/240x DSP devices. The peripheral bus bridge multiplexes the various busses that make up the processor “Memory Bus” into a single bus consisting of 16 address lines and 16 or 32 data lines and associated control signals. Special branch-look-ahead hardware minimizes the latency for conditional discontinuities. The data read and write busses consist of 32 address lines and 32 data lines each. enables the C28x to fetch an instruction. The C28x has an 8-level-deep protected pipeline with pipelined memory accesses.2. 3. TMS320C2811.) Data Reads Program Reads (Simultaneous program reads and fetches cannot occur on the memory bus. the C28x is a very efficient C/C++ engine.) Lowest: Fetches (Simultaneous program reads and fetches cannot occur on the memory bus. Add to this the fast interrupt response with automatic context save of critical registers.2. One version only supports 16-bit accesses (called peripheral frame 2) and this retains compatibility with C240x-compatible peripherals. and register locations can be modified while the processor is running and executing code and servicing interrupts. The other version supports both 16. The C28x memory bus architecture contains a program read bus. Special store conditional operations further improve performance.2.ti. commonly termed “Harvard Bus”. The Copyright © 2001–2011.4 Real-Time JTAG and Analysis The F281x and C281x implement the standard IEEE 1149. hence existing 240x users can leverage their significant software investment. enabling users to develop not only their system control software in a high-level language.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 3. Additionally.) Program Writes (Simultaneous data and program writes cannot occur on the memory bus. the F281x and C281x support real-time mode of operation whereby the contents of memory. Additionally. data read bus and data write bus. The 32 x 32-bit MAC capabilities of the C28x and its 64-bit processing capabilities.TMS320F2810. This efficiency removes the need for a second processor in many systems.3 Peripheral Bus To enable migration of peripherals between various Texas Instruments ( TI™) DSP family of devices. the priority of Memory Bus accesses can be summarized as follows: Highest: Data Writes (Simultaneous data and program writes cannot occur on the memory bus.and 32-bit accesses (called peripheral frame 1). the F281x and C281x adopt a peripheral bus standard for peripheral interconnect. This pipelining enables the C28x to execute at high speeds without resorting to expensive high-speed memories. 3. resulting in a device that is capable of servicing many asynchronous events with minimal latency. but also enables math algorithms to be developed using C/C++. Two versions of the peripheral bus are supported on the F281x and C281x.1 JTAG interface. The 32-bit-wide data busses enable single cycle 32-bit operations.2. TMS320F2812 TMS320C2810. The C28x is as efficient in DSP math tasks as it is in system control tasks that typically are handled by microcontroller devices. peripheral. Generally.) 3. All peripherals and memories attached to the memory bus will prioritize memory accesses. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 33 . TMS320C2812 www. TMS320F2811. The multiple bus architecture.1 Brief Descriptions C28x CPU The C28x™ DSP generation is the newest member of the TMS320C2000™ DSP platform.

like all other memory blocks on C28x devices. Zones 0. program. special analysis hardware is provided that allows the user to set hardware breakpoint or data/address watch-points and generate various user selectable break events when a match occurs. The exact performance gain when using the Flash pipeline mode is application-dependent. NOTE The F2810/F2811/F2812 Flash and OTP wait states can be configured by the application. Flash effective performance can be improved by enabling the flash pipeline mode in the Flash options register. B2 RAM blocks and hence the mapping of data variables on the 240x devices can remain at the same physical address on C28x devices. see the TMS320C28x CPU and Instruction Set Reference Guide (literature number SPRU430). and three 16K x 16 sectors. The M0 and M1 blocks. This makes for easier programming in high-level languages. B1. The partitioning is performed within the linker. Hence. it can be used to execute code or store data information. Zones 6 and 7 also share a single chip-select. 34 Functional Overview Copyright © 2001–2011. The F2810 has 64K x 16 of embedded flash. 3. strobe signal setup and hold timing and each zone can be programmed for extending wait states externally or not. no software monitor is required. and six 16K x 16 sectors. see the TMS320x281x DSP System Control and Interrupts Reference Guide (literature number SPRU078). All three devices also contain a single 1K x 16 of OTP memory at address range 0x3D 7800–0x3D 7BFF. However. TMS320F2812 TMS320C2810. The user can individually erase. are mapped to both program and data space.6 Flash (F281x Only) The F2812 and F2811 contain 128K x 16 of embedded flash memory. there is a 1K x 16 ROM block that replaces the OTP memory available in flash devices. segregated into four 8K x 16 sectors. 6. 3. The programmable wait-state. therefore.TMS320F2810. Zones 0 and 1 share a single chip-select. each 1K x 16 in size. This allows applications running at slower frequencies to configure the flash to use fewer wait states. Special memory pipelining is provided to enable the flash module to achieve higher performance. The stack pointer points to the beginning of block M1 on reset.2. M1 SARAMs All C28x devices contain these two blocks of single access memory. This is a unique feature to the F281x and C281x. The M0 block overlaps the 240x device B0. 3.5 External Interface (XINTF) (2812 Only) This asynchronous interface consists of 19 address lines. TMS320C2811. effective performance of linear code execution will be much faster than the raw performance indicated by the wait state configuration alone. and validate a flash sector while leaving other sectors untouched. TMS320F2811. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. 2. 16 data lines. Additionally. The C2810 has 64K x 16 of ROM. The C28x device presents a unified memory map to the programmer. and OTP wait-state registers.8 M0. Each of the five zones can be programmed with a different number of wait states.ti. The flash/OTP is mapped to both program and data space. segregated into two 8K x 16 sectors. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . 3. chip-select and programmable strobe timing enables glueless interface to external memories and peripherals. and 7. For information on how to submit ROM codes to TI. In addition to this. For more information on the Flash options. 1.2.com user can also single step through non-time critical code while enabling time-critical interrupts to be serviced without interference.2.2. the user can use M0 and M1 to execute code or for data variables. and three chip-select lines. it is not possible to use one sector of the flash or the OTP to execute flash algorithms that erase/program other sectors. With this mode enabled. The F281x and C281x implement the real-time mode in hardware within the CPU. The chip-select lines are mapped to five external zones.7 ROM (C281x Only) The C2812 and C2811 contain 128K x 16 of ROM. Flash wait-state.

com SPRS174S – APRIL 2001 – REVISED MARCH 2011 3.11 Security The F281x and C281x support high levels of security to protect the user firmware from being reverse-engineered. For example. irrespective of whether code security has been used or not.2. the user can select to execute code already present in the internal Flash or download new software to internal RAM through one of several serial ports. These locations must be programmed to 0x0000. addresses 0x3F 7FF2–0x3F 7FF5 and 0x3D 7BFC–0x3D 7BFF are reserved for TI. See the TMS320x281x DSP Boot ROM Reference Guide (literature number SPRU095). TMS320F2812 TMS320C2810. Each block can be independently accessed hence minimizing pipeline stalls. The security features a 128-bit password (hardcoded for 16 wait states). A branch instruction must have been programmed here prior to reset to re-direct code execution as desired. Table 3-4. L1. 3. User application should not use these locations in any way. Table 3-4 shows the details of how various boot modes may be invoked. H0 SARAMs The F281x and C281x contain an additional 16K x 16 of single-access RAM. divided into three blocks (4K + 4K + 8K). TMS320F2811. If the boot mode selected is Flash. The Boot ROM program executes after device reset and checks several GPIO pins to determine which boot mode to enter. H0. or OTP. TMS320C2811. Doing so would permanently lock the device. The security feature prevents unauthorized users from examining the memory contents via the JTAG port. executing code from external memory or trying to boot-load some undesirable software that would export the secure memory contents. the user must write the correct 128-bit ”KEY” value. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 35 .TMS320F2810. all addresses between 0x3F 7F80 and 0x3F 7FF5 cannot be used as program code or data.2. addresses 0x3F 7F80 through 0x3F 7FEF may be used for code or data. PU = pin has an internal pullup.10 Boot ROM The Boot ROM is factory-programmed with boot-loading software. Boot Mode Selection (1) (2) BOOT MODE SELECTED GPIO PU status (3) Jump to Flash/ROM address 0x3F 7FF6. which the user programs into the flash. for more information. TMS320C2812 www. To enable access to the secure blocks. Each block is mapped to both program and data space. • • • Copyright © 2001–2011. No PU = pin does not have an internal pullup.9 L0. The Boot ROM also contains standard tables. such as SIN/COS waveforms. 3. The 128-bit password (at 0x3F 7FF8–0x3F 7FFF) must not be programmed to zeros. which matches the value stored in the password locations within the Flash/ROM. Call SPI_Boot to load from an external serial SPI EEPROM Call SCI_Boot to load from SCI-A Jump to H0 SARAM address 0x3F 8000 Jump to OTP address 0x3D 7800 Call Parallel_Boot to load from GPIO Port B (1) (2) (3) GPIOF4 (SCITXDA) PU 1 0 0 0 0 0 GPIOF12 (MDXA) No PU x 1 0 0 0 0 GPIOF3 (SPISTEA) No PU x x 1 1 0 0 GPIOF2 (SPICLK) No PU x x 1 0 1 0 Extra care must be taken due to any effect toggling SPICLK to select a boot mode may have on external logic.ti. On ROM devices. for use in math-related algorithms. NOTE • When the code-security passwords are programmed. then no external code is loaded by the bootloader. If the code security feature is not used. One code security module (CSM) is used to protect the flash/ROM/OTP and the L0/L1 SARAM blocks.2. Other boot modes exist as well.

Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL. EXCLUDED DAMAGES INCLUDE. The 96 interrupts are grouped into blocks of 8 and each group is fed into 1 of 12 CPU interrupt lines (INT1 to INT12). TI DOES NOT. 13). 3. OR PUNITIVE DAMAGES. The combined signal name is XNMI_XINT13. 2. TO CONFORM TO TI'S PUBLISHED SPECIFICATIONS FOR THE WARRANTY PERIOD APPLICABLE FOR THIS DEVICE. INCIDENTAL. HOWEVER. TMS320C2811. Each of the interrupts can be selected for negative or positive edge triggering and can also be enabled/disabled (including the XNMI). which is reset to zero when a valid interrupt edge is detected. HOWEVER CAUSED.12 Peripheral Interrupt Expansion (PIE) Block The PIE block serves to multiplex numerous interrupt sources into a smaller set of interrupt inputs. ARISING IN ANY WAY OUT OF YOUR USE OF THE CSM OR THIS DEVICE. Each individual interrupt can be enabled/disabled within the PIE block. On the F281x and C281x. TI MAKES NO WARRANTIES OR REPRESENTATIONS CONCERNING THE CSM OR OPERATION OF THIS DEVICE. XINT13 is combined with one non-masked external interrupt (XNMI). Each of the 96 interrupts is supported by its own vector stored in a dedicated RAM block that can be overwritten by the user. This counter can be used to accurately time-stamp the interrupt. Impact of Using the Code Security Module ADDRESS 0x3F 7F80 – 0x3F 7FEF 0x3F 7FF0 – 0x3F 7FF5 0x3D 7BFC – 0x3D 7BFF (1) CODE SECURITY STATUS Code Security Enabled Fill with 0x0000 Code Security Disabled Application code and data (1) Application code and data See the TMS320F2810.TMS320F2810. 45 of the possible 96 interrupts are used by peripherals. TMS320C2812 DSP Silicon Errata (literature number SPRZ193) for some restrictions.ti. WARRANT OR REPRESENT THAT THE CSM CANNOT BE COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE ASSOCIATED MEMORY CANNOT BE ACCESSED THROUGH OTHER MEANS. TMS320F2811. Prioritization of interrupts is controlled in hardware and software. 36 Functional Overview Copyright © 2001–2011. Disclaimer Code Security Module Disclaimer THE CODE SECURITY MODULE (CSM) INCLUDED ON THIS DEVICE WAS DESIGNED TO PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED MEMORY (EITHER ROM OR FLASH) AND IS WARRANTED BY TEXAS INSTRUMENTS (TI). MOREOVER. INDIRECT. IN ACCORDANCE WITH ITS STANDARD TERMS AND CONDITIONS. TMS320C2810. The masked interrupts also contain a 16-bit free-running up-counter. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.2. XINT13. TMS320F2812 TMS320C2810. Hence the CPU can quickly respond to interrupt events. It takes 8 CPU clock cycles to fetch the vector and save critical CPU registers. BUT ARE NOT LIMITED TO LOSS OF DATA. TMS320F2811. INCLUDING ANY IMPLIED WARRANTIES OF MERCHANT ABILITY OR FITNESS FOR A PARTICULAR PURPOSE.com Table 3-5. 3. The PIE block can support up to 96 peripheral interrupts. WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.2. LOSS OF GOODWILL. XINT2. SPECIAL.13 External Interrupts (XINT1. The vector is automatically fetched by the CPU on servicing the interrupt. EXCEPT AS SET FORTH ABOVE. TMS320C2811. TMS320F2812. LOSS OF USE OR INTERRUPTION OF BUSINESS OR OTHER ECONOMIC LOSS. XNMI) The F281x and C281x support three masked external interrupts (XINT1.

3. Only a reset or XNMI can wake the device from this mode. Three low-power modes are provided: IDLE: Place CPU in low-power mode. An enabled interrupt from an active peripheral will wake the processor from IDLE mode.ti.2. This mode basically shuts down the device and places it in the lowest possible power consumption mode. 1. the watchdog will generate a reset to the processor. A PLL is provided supporting up to 10-input clock-scaling ratios. 3. Erase. TMS320C2812 www. 1. Programming. Execution begins on the next valid cycle after detection of the interrupt event. 2 (PFn) The F281x and C281x segregate peripherals into three sections.18 Peripheral Frames 0. Peripheral clocks may be turned off selectively and only those peripherals that must function during IDLE are left operating. Additionally.16 Peripheral Clocking The clocks to each individual peripheral can be enabled/disabled to reduce power consumption when a peripheral is not in use. The user software must regularly reset the watchdog counter within a certain time frame. The mapping of peripherals is as follows: PF0: XINTF: PIE: Flash: Timers: CSM: PF1: PF2: eCAN: SYS: GPIO: EV: McBSP: SCI: SPI: ADC: External Interface Configuration Registers (2812 only) PIE Interrupt Enable and Control Registers Plus PIE Vector Table Flash Control. enabling the user to scale back on operating frequency if lower power operation is desired.2.17 Low-Power Modes The F281x and C281x devices are fully static CMOS devices. This mode leaves the oscillator and PLL functional. The PLL ratios can be changed on-the-fly in software. Refer to Section 6. the system clock to the serial ports (except eCAN) and the event managers. TMS320C2811.2.2.TMS320F2810. Verify Registers CPU-Timers 0.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 3. 3. Turns off the internal oscillator. STANDBY: HALT: 3. An external interrupt event will wake the processor and the peripherals. 2 Registers Code Security Module KEY Registers eCAN Mailbox and Control Registers System Control Registers GPIO Mux Configuration and Control Registers Event Manager (EVA/EVB) Control Registers McBSP Control and TX/RX Registers Serial Communications Interface (SCI) Control and RX/TX Registers Serial Peripheral Interface (SPI) Control and RX/TX Registers 12-Bit ADC Registers Copyright © 2001–2011. otherwise. The PLL block can be set in bypass mode.2. CAP and QEP blocks can be scaled relative to the CPU clock. for timing details. Electrical Specifications.14 Oscillator and PLL The F281x and C281x can be clocked by an external oscillator or by a crystal attached to the on-chip oscillator circuit. This enables the timing of peripherals to be decoupled from increasing CPU clock speeds. The watchdog can be disabled if necessary.15 Watchdog The F281x and C281x support a watchdog timer. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 37 . TMS320F2811. TMS320F2812 TMS320C2810. Turns off clock to CPU and peripherals.

it is automatically reloaded with a 32-bit period value. The timers have a 32-bit count-down register.TMS320F2810. TMS320F2812 TMS320C2810. The counter is decremented at the CPU clock speed divided by the prescale value setting. When the counter reaches zero. The event managers on the F281x and C281x are compatible to the event managers on the 240x devices (with some minor enhancements).21 Control Peripherals The F281x and C281x support the following peripherals that are used for embedded control and communication: EV: The event manager module includes general-purpose timers. It contains two sample-and-hold units for simultaneous sampling. the SPI is used for communications between the DSP controller and external peripherals or another processor. On the F281x and C281x.ti. display drivers. single ended. The ADC block is a 12-bit converter. The serial communications interface is a two-wire asynchronous serial port. This multiplexing enables use of a pin as GPIO if the peripheral signal or function is not used.2. 3.2. receive-and-transmit FIFO for reducing servicing overhead. 3. CPU-Timer 2 is available for general use. It supports 32 mailboxes. the user can also select the number of input qualification cycles to filter unwanted noise glitches. The SPI is a high-speed. and is connected to INT14 of the CPU.com 3. receive-and-transmit FIFO for reducing servicing overhead. Typical applications include external I/O or peripheral expansion through devices such as shift registers. The user can then individually program each pin for GPIO mode or peripheral signal mode. 1. CPU-Timer 0 is also for general use and is connected to the PIE block. and 2 are identical 32-bit timers with presettable periods and with 16-bit clock prescaling. which generates an interrupt when the counter reaches zero. Two such event managers are provided which enable two three-phase motors to be driven or four two-phase motors. TMS320F2811.20 32-Bit CPU-Timers (0. phone-quality codecs for modem applications or high-quality stereo audio DAC devices. Normally.2. synchronous serial I/O port that allows a serial bit stream of programmed length (one to sixteen bits) to be shifted into and out of the device at a programmable bit-transfer rate. the port supports a 16-level. TMS320C2811.0B-compliant. full-compare/PWM units. For specific inputs.22 Serial Port Peripherals The F281x and C281x support the following serial communication peripherals: eCAN: McBSP: This is the enhanced version of the CAN peripheral. the port supports a 16-level. If DSP/BIOS is not being used. On the F281x and C281x.2. CPU-Timer 2 is reserved for the DSP/BIOS Real-Time OS. On reset. and ADCs. commonly known as UART. The multichannel buffered serial port (McBSP) connects to E1/T1 lines. CPU-Timer 1 is for general use and can be connected to INT13 of the CPU. Multi-device communications are supported by the master/slave operation of the SPI. 2) CPU-Timers 0.19 General-Purpose Input/Output (GPIO) Multiplexer Most of the peripheral signals are multiplexed with general-purpose I/O (GPIO) signals. ADC: 3. 16-channels. all GPIO pins are configured as inputs. The McBSP receive and transmit registers are supported by a 16-level FIFO that significantly reduces the overhead for servicing this peripheral. and is CAN 2. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. time stamping of messages. 1. SPI: SCI: 38 Functional Overview Copyright © 2001–2011. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . capture inputs (CAP) and quadrature-encoder pulse (QEP) circuits.

TMS320C2811. then writes cannot be performed until the user executes the EALLOW instruction. If registers are EALLOW protected. TMS320F2812 TMS320C2810. The spaces are categorized as follows: Peripheral Frame 0: Peripheral Frame 1: Peripheral Frame 2: These are peripherals that are mapped directly to the CPU memory bus. See Table 3-6. See Table 3-7.TMS320F2810. These are peripherals that are mapped to the 16-bit peripheral bus. TMS320F2811. Table 3-6. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 39 . TMS320C2812 www. The Flash Registers are also protected by the Code Security Module (CSM). The EDIS instruction disables writes. All 32-bit accesses are aligned to even address boundaries. These are peripherals that are mapped to the 32-bit peripheral bus. See Table 3-8. Peripheral Frame 0 Registers (1) NAME ADDRESS RANGE 0x00 0880 – 0x00 09FF 0x00 0A00 – 0x00 0A7F (3) SIZE (x16) 384 128 96 16 48 32 192 64 160 32 256 512 ACCESS TYPE (2) EALLOW protected EALLOW protected CSM Protected EALLOW protected Not EALLOW protected Not EALLOW protected Not EALLOW protected EALLOW protected Device Emulation Registers Reserved FLASH Registers 0x00 0A80 – 0x00 0ADF 0x00 0AE0 – 0x00 0AEF 0x00 0AF0 – 0x00 0B1F 0x00 0B20 – 0x00 0B3F 0x00 0B40 – 0x00 0BFF 0x00 0C00 – 0x00 0C3F 0x00 0C40 – 0x00 0CDF 0x00 0CE0 – 0x00 0CFF 0x00 0D00 – 0x00 0DFF 0x00 0E00 – 0x00 0FFF Code Security Module Registers Reserved XINTF Registers Reserved CPU-TIMER0/1/2 Registers Reserved PIE Registers PIE Vector Table Reserved (1) (2) (3) Registers in Frame 0 support 16-bit and 32-bit accesses. Peripheral Frame 1 Registers (1) NAME eCAN Registers eCAN Mailbox RAM Reserved (1) ADDRESS RANGE 0x00 6000 – 0x00 60FF 0x00 6100 – 0x00 61FF 0x00 6200 – 0x00 6FFF SIZE (x16) 256 (128 x 32) 256 (128 x 32) 3584 ACCESS TYPE Some eCAN control registers (and selected bits in other eCAN control registers) are EALLOW-protected. Table 3-7.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 3.3 Register Map The F281x and C281x devices contain three peripheral register spaces.ti. This prevents stray code or pointers from corrupting register contents. Not EALLOW-protected The eCAN control registers only support 32-bit read/write operations. Copyright © 2001–2011.

TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812
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Table 3-8. Peripheral Frame 2 Registers (1)
NAME Reserved System Control Registers Reserved SPI-A Registers SCI-A Registers Reserved External Interrupt Registers Reserved GPIO Mux Registers GPIO Data Registers ADC Registers Reserved EV-A Registers Reserved EV-B Registers Reserved SCI-B Registers Reserved McBSP Registers Reserved (1) ADDRESS RANGE 0x00 7000 – 0x00 700F 0x00 7010 – 0x00 702F 0x00 7030 – 0x00 703F 0x00 7040 – 0x00 704F 0x00 7050 – 0x00 705F 0x00 7060 – 0x00 706F 0x00 7070 – 0x00 707F 0x00 7080 – 0x00 70BF 0x00 70C0 – 0x00 70DF 0x00 70E0 – 0x00 70FF 0x00 7100 – 0x00 711F 0x00 7120 – 0x00 73FF 0x00 7400 – 0x00 743F 0x00 7440 – 0x00 74FF 0x00 7500 – 0x00 753F 0x00 7540 – 0x00 774F 0x00 7750 – 0x00 775F 0x00 7760 – 0x00 77FF 0x00 7800 – 0x00 783F 0x00 7840 – 0x00 7FFF SIZE (x16) 16 32 16 16 16 16 16 64 32 32 32 736 64 192 64 528 16 160 64 1984 Not EALLOW Protected Not EALLOW Protected Not EALLOW Protected Not EALLOW Protected EALLOW Protected Not EALLOW Protected Not EALLOW Protected Not EALLOW Protected Not EALLOW Protected Not EALLOW Protected EALLOW Protected ACCESS TYPE

Peripheral Frame 2 only allows 16-bit accesses. All 32-bit accesses are ignored (invalid data may be returned or written).

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3.4

Device Emulation Registers
These registers are used to control the protection mode of the C28x CPU and to monitor some critical device signals. The registers are defined in Table 3-9. Table 3-9. Device Emulation Registers
NAME ADDRESS RANGE 0x00 0880 – 0x00 0881 0x00 0882 SIZE (x16) 2 1 Device Configuration Register Part ID Register 0x0001 or 0x0002 – F281x 0x0003 – C281x 0x0001 – Silicon Revision A 0x0002 – Silicon Revision B 0x0003 – Silicon Revisions C, D 0x0004 – Reserved 0x0005 – Silicon Revision E 0x0006 – Silicon Revision F 0x0007 – Silicon Revision G DESCRIPTION

DEVICECNF PARTID

REVID

0x00 0883

1

Revision ID Register

PROTSTART PROTRANGE Reserved

0x00 0884 0x00 0885 0x00 0886 – 0x00 09FF

1 1 378

Block Protection Start Address Register Block Protection Range Address Register

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3.5

External Interface, XINTF (2812 Only)
This section gives a top-level view of the external interface (XINTF) that is implemented on the 2812 devices. The external interface is a non-multiplexed asynchronous bus, similar to the C240x external interface. The external interface on the 2812 is mapped into five fixed zones shown in Figure 3-5. Figure 3-5 shows the 2812 XINTF signals.
Data Space 0x00 0000 XD[15:0] Prog Space

XA[18:0] 0x00 2000 0x00 4000 0x00 6000 0x08 0000 0x10 0000 XINTF Zone 6 (512K x 16) 0x18 0000 0x3F C000 XINTF Zone 7 (16K x 16) (mapped here if MP/MC = 1) XZCS6 XZCS6AND7 XINTF Zone 2 (512K x 16) XZCS2 XINTF Zone 0 (8K x 16) XINTF Zone 1 (8K x 16)

XZCS0 XZCS1

XZCS0AND1

XZCS7

0x40 0000

XWE XRD XR/W XREADY XMP/MC XHOLD XHOLDA (E) XCLKOUT

A. B.

C. D.

E.

The mapping of XINTF Zone 7 is dependent on the XMP/MC device input signal and the MP/MC mode bit (bit 8 of XINTCNF2 register). Zones 0, 1, 2, and 6 are always enabled. Each zone can be programmed with different wait states, setup and hold timing, and is supported by zone chip selects (XZCS0AND1, XZCS2, XZCS6AND7), which toggle when an access to a particular zone is performed. These features enable glueless connection to many external memories and peripherals. The chip selects for Zone 0 and Zone 1 are ANDed internally together to form one chip select (XZCS0AND1). Any external memory that is connected to XZCS0AND1 is dually mapped to both Zone 0 and Zone 1. The chip selects for Zone 6 and Zone 7 are ANDed internally together to form one chip select (XZCS6AND7). Any external memory that is connected to XZCS6AND7 is dually mapped to both Zone 6 and Zone 7. This means that if Zone 7 is disabled (via the MP/MC mode), then any external memory is still accessible via Zone 6 address space. XCLKOUT is also pinned out on the 2810 and 2811.

Figure 3-5. External Interface Block Diagram

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The operation and timing of the external interface, can be controlled by the registers listed in Table 3-10. Table 3-10. XINTF Configuration and Control Register Mappings
NAME XTIMING0 XTIMING1 XTIMING2 XTIMING6 XTIMING7 XINTCNF2 XBANK XREVISION ADDRESS 0x00 0B20 0x00 0B22 0x00 0B24 0x00 0B2C 0x00 0B2E 0x00 0B34 0x00 0B38 0x00 0B3A SIZE (x16) 2 2 2 2 2 2 1 1 DESCRIPTION XINTF Timing Register, Zone 0 can access as two 16-bit registers or one 32-bit register. XINTF Timing Register, Zone 1 can access as two 16-bit registers or one 32-bit register. XINTF Timing Register, Zone 2 can access as two 16-bit registers or one 32-bit register. XINTF Timing Register, Zone 6 can access as two 16-bit registers or one 32-bit register. XINTF Timing Register, Zone 7 can access as two 16-bit registers or one 32-bit register. XINTF Configuration Register can access as two 16-bit registers or one 32-bit register. XINTF Bank Control Register XINTF Revision Register

3.5.1

Timing Registers
XINTF signal timing can be tuned to match specific external device requirements such as setup and hold times to strobe signals for contention avoidance and maximizing bus efficiency. The XINTF timing parameters can be configured individually for each zone based on the requirements of the memory or peripheral accessed by that particular zone. This allows the programmer to maximize the efficiency of the bus on a per-zone basis. All XINTF timing values are with respect to XTIMCLK, which is equal to or one-half of the SYSCLKOUT rate, as shown in Figure 6-30. For detailed information on the XINTF timing and configuration register bit fields, see the TMS320x281x DSP External Interface (XINTF) Reference Guide (literature number SPRU067).

3.5.2

XREVISION Register
The XREVISION register contains a unique number to identify the particular version of XINTF used in the product. For the 2812, this register will be configured as described in Table 3-11. Table 3-11. XREVISION Register Bit Definitions

BIT(S) 15–0

NAME REVISION

TYPE R

RESET 0x0004

DESCRIPTION Current XINTF Revision. For internal use/reference. Test purposes only. Subject to change.

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3.6

Interrupts
Figure 3-6 shows how the various interrupt sources are multiplexed within the F281x and C281x devices.
Peripherals (SPI, SCI, McBSP, CAN, EV, ADC) (41 Interrupts) WDINT WAKEINT LPMINT

Watchdog Low-Power Modes XINT1

96 Interrupts

(A)

INT1 to INT12

Interrupt Control XINT1CR[15:0] XINT1CTR[15:0]

PIE

Interrupt Control XINT2CR[15:0] C28x CPU XINT2CTR[15:0] TINT0 INT14 MUX TINT2 TINT1 INT13

XINT2

TIMER 0 TIMER 2 (Reserved for DSP/BIOS) TIMER 1

GPIO MUX

select enable NMI Interrupt Control XNMICR[15:0] XNMICTR[15:0] XNMI_XINT13

A.

Out of a possible 96 interrupts, 45 are currently used by peripherals.

Figure 3-6. Interrupt Sources Eight PIE block interrupts are grouped into one CPU interrupt. In total, 12 CPU interrupt groups, with 8 interrupts per group equals 96 possible interrupts. On the F281x and C281x, 45 of these are used by peripherals as shown in Table 3-12. The TRAP #VectorNumber instruction transfers program control to the interrupt service routine corresponding to the vector specified. TRAP #0 attempts to transfer program control to the address pointed to by the reset vector. The PIE vector table does not, however, include a reset vector. Therefore, TRAP #0 should not be used when the PIE is enabled. Doing so will result in undefined behavior. When the PIE is enabled, TRAP #1 through TRAP #12 will transfer program control to the interrupt service routine corresponding to the first vector within the PIE group. For example: TRAP #1 fetches the vector from INT1.1, TRAP #2 fetches the vector from INT2.1 and so forth.

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IFR[12:1] INT1 INT2

IER[12:1]

INTM

1 MUX INT11 INT12 (Flag) (Enable) INTx.1 INTx.2 INTx.3 INTx.4 INTx.5 INTx.6 INTx.7 INTx.8 (Enable) (Enable/Flag) PIEIERx[8:1] (Flag) PIEIFRx[8:1] CPU 0

Global Enable

INTx

MUX

From Peripherals or External Interrupts

PIEACKx

Figure 3-7. Multiplexing of Interrupts Using the PIE Block Table 3-12. PIE Peripheral Interrupts (1)
CPU INTERRUPTS INT1 INT2 INT3 INT4 INT5 INT6 INT7 INT8 INT9 INT10 INT11 INT12 (1) PIE INTERRUPTS INTx.8 WAKEINT (LPM/WD) Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved INTx.7 TINT0 (TIMER 0) T1OFINT (EV-A) CAPINT3 (EV-A) T3OFINT (EV-B) CAPINT6 (EV-B) Reserved Reserved Reserved Reserved Reserved Reserved Reserved INTx.6 ADCINT (ADC) T1UFINT (EV-A) CAPINT2 (EV-A) T3UFINT (EV-B) CAPINT5 (EV-B) MXINT (McBSP) Reserved Reserved ECAN1INT (CAN) Reserved Reserved Reserved INTx.5 XINT2 T1CINT (EV-A) CAPINT1 (EV-A) T3CINT (EV-B) CAPINT4 (EV-B) MRINT (McBSP) Reserved Reserved ECAN0INT (CAN) Reserved Reserved Reserved INTx.4 XINT1 T1PINT (EV-A) T2OFINT (EV-A) T3PINT (EV-B) T4OFINT (EV-B) Reserved Reserved Reserved SCITXINTB (SCI-B) Reserved Reserved Reserved INTx.3 Reserved CMP3INT (EV-A) T2UFINT (EV-A) CMP6INT (EV-B) T4UFINT (EV-B) Reserved Reserved Reserved SCIRXINTB (SCI-B) Reserved Reserved Reserved INTx.2 PDPINTB (EV-B) CMP2INT (EV-A) T2CINT (EV-A) CMP5INT (EV-B) T4CINT (EV-B) SPITXINTA (SPI) Reserved Reserved SCITXINTA (SCI-A) Reserved Reserved Reserved INTx.1 PDPINTA (EV-A) CMP1INT (EV-A) T2PINT (EV-A) CMP4INT (EV-B) T4PINT (EV-B) SPIRXINTA (SPI) Reserved Reserved SCIRXINTA (SCI-A) Reserved Reserved Reserved

Out of the 96 possible interrupts, 45 interrupts are currently used. The remaining interrupts are reserved for future devices. These interrupts can be used as software interrupts if they are enabled at the PIEIFRx level, provided none of the interrupts within the group is being used by a peripheral. Otherwise, interrupts coming in from peripherals may be lost by accidentally clearing their flag while modifying the PIEIFR. To summarize, there are two safe cases when the reserved interrupts could be used as software interrupts: • No peripheral within the group is asserting interrupts. • No peripheral interrupts are assigned to the group (example PIE group 12).

Copyright © 2001–2011, Texas Instruments Incorporated

Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812

45

INT2 Group Flag Register PIE. INT7 Group Flag Register PIE.TMS320F2810. INT3 Group Enable Register PIE. Control Register PIE. TMS320F2812 TMS320C2810. INT8 Group Enable Register PIE. INT1 Group Flag Register PIE. Acknowledge Register PIE. INT2 Group Enable Register PIE. INT11 Group Flag Register PIE. INT4 Group Enable Register PIE. The PIE vector table is protected. INT10 Group Flag Register PIE. 46 Functional Overview Copyright © 2001–2011. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. INT5 Group Enable Register PIE. INT1 Group Enable Register PIE. INT6 Group Enable Register PIE. INT6 Group Flag Register PIE. INT3 Group Flag Register PIE.com Table 3-13. INT9 Group Flag Register PIE.ti. INT9 Group Enable Register PIE. INT12 Group Enable Register PIE. INT8 Group Flag Register PIE. INT10 Group Enable Register PIE. INT4 Group Flag Register PIE. INT11 Group Enable Register PIE. PIE Configuration and Control Registers (1) NAME PIECTRL PIEACK PIEIER1 PIEIFR1 PIEIER2 PIEIFR2 PIEIER3 PIEIFR3 PIEIER4 PIEIFR4 PIEIER5 PIEIFR5 PIEIER6 PIEIFR6 PIEIER7 PIEIFR7 PIEIER8 PIEIFR8 PIEIER9 PIEIFR9 PIEIER10 PIEIFR10 PIEIER11 PIEIFR11 PIEIER12 PIEIFR12 Reserved (1) ADDRESS 0x0000 0CE0 0x0000 0CE1 0x0000 0CE2 0x0000 0CE3 0x0000 0CE4 0x0000 0CE5 0x0000 0CE6 0x0000 0CE7 0x0000 0CE8 0x0000 0CE9 0x0000 0CEA 0x0000 0CEB 0x0000 0CEC 0x0000 0CED 0x0000 0CEE 0x0000 0CEF 0x0000 0CF0 0x0000 0CF1 0x0000 0CF2 0x0000 0CF3 0x0000 0CF4 0x0000 0CF5 0x0000 0CF6 0x0000 0CF7 0x0000 0CF8 0x0000 0CF9 0x0000 0CFA – 0x0000 0CFF SIZE (x16) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 6 PIE. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . INT5 Group Flag Register PIE. INT7 Group Enable Register PIE. TMS320F2811. INT12 Group Flag Register Reserved DESCRIPTION The PIE configuration and control registers are not protected by EALLOW mode. TMS320C2811.

Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 47 . Copyright © 2001–2011.1 External Interrupts Table 3-14. see the TMS320x281x DSP System Control and Interrupts Reference Guide (literature number SPRU078). TMS320C2811.6. For more information. TMS320F2812 TMS320C2810. TMS320F2811.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 3. External Interrupts Registers NAME ADDRESS 0x00 7070 0x00 7071 0x00 7072 – 0x00 7076 0x00 7077 0x00 7078 0x00 7079 0x00 707A – 0x00 707E 0x00 707F SIZE (x16) 1 1 5 1 1 1 5 1 XNMI counter register XNMI control register XINT1 counter register XINT2 counter register XINT1 control register XINT2 control register DESCRIPTION XINT1CR XINT2CR Reserved XNMICR XINT1CTR XINT2CTR Reserved XNMICTR Each external interrupt can be enabled/disabled or qualified using positive or negative going edge.ti.TMS320F2810. TMS320C2812 www.

Clock and Reset Domains 48 Functional Overview Copyright © 2001–2011. Figure 3-8.7 System Control This section describes the F281x and C281x oscillator.com 3. SYSCLKOUT is the output clock of the CPU. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. They are of the same frequency. the watchdog function and the low-power modes. Reset SYSCLKOUT Peripheral Reset CLKIN C28x CPU (A) Watchdog Block XRS X1/XCLKIN PLL OSC X2 Power Modes Control XF_XPLLDIS System Control Registers Peripheral Registers Clock Enables eCAN LSPCLK I/O Low-Speed Prescaler Peripheral Bus Peripheral Registers Low-Speed Peripherals SCI-A/B. TMS320F2812 TMS320C2810. TMS320C2811. Figure 3-8 shows the various clock and reset domains in the F281x and C281x devices that will be discussed. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . McBSP HSPCLK I/O GPIO MUX GPIOs High-Speed Prescaler Peripheral Registers High-Speed Peripherals EV-A/B HSPCLK I/O ADC Registers 12-Bit ADC 16 ADC Inputs A. SPI.TMS320F2810. CLKIN is the clock input to the CPU.ti. PLL and clocking mechanisms. TMS320F2811.

Copyright © 2001–2011. clocking. The PLL control register (PLLCR) is reset to a known state by the XRS signal only. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 49 . TMS320F2811. and Low-Power Mode Registers (1) NAME Reserved Reserved Reserved HISPCP LOSPCP PCLKCR Reserved LPMCR0 LPMCR1 Reserved PLLCR SCSR WDCNTR Reserved WDKEY Reserved WDCR Reserved (1) (2) ADDRESS 0x00 7010 – 0x00 7017 0x00 7018 0x00 7019 0x00 701A 0x00 701B 0x00 701C 0x00 701D 0x00 701E 0x00 701F 0x00 7020 0x00 7021 0x00 7022 0x00 7023 0x00 7024 0x00 7025 0x00 7026 – 0x00 7028 0x00 7029 0x00 702A – 0x00 702F SIZE (x16) 8 1 1 1 1 1 1 1 1 1 1 1 1 1 1 3 1 6 Watchdog Control Register Watchdog Reset Key Register PLL Control Register (2) System Control and Status Register Watchdog Counter Register Low-Power Mode Control Register 0 Low-Power Mode Control Register 1 High-Speed Peripheral Clock Prescaler Register for HSPCLK clock Low-Speed Peripheral Clock Prescaler Register for LSPCLK clock Peripheral Clock Control Register DESCRIPTION All of the above registers can only be accessed by executing the EALLOW instruction. TMS320C2812 www. watchdog and low-power modes. Watchdog.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 The PLL. TMS320C2811. Clocking. are controlled by the registers listed in Table 3-15. PLL.TMS320F2810. Table 3-15. Emulation reset (through Code Composer Studio) will not reset PLLCR.ti. TMS320F2812 TMS320C2810.

TMS320F2811.TMS320F2810. If a crystal is not used. OSC and PLL Block The on-chip oscillator circuit enables a crystal to be attached to the F281x and C281x devices using the X1/XCLKIN and X2 pins. 50 Functional Overview Copyright © 2001–2011. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TMS320C2811. TMS320F2812 TMS320C2810. XF_XPLLDIS Latch XRS XPLLDIS XCLKIN X1/XCLKIN OSCCLK (PLL Disabled) 0 CLKIN CPU SYSCLKOUT On-Chip Oscillator (OSC) PLL Bypass 4-Bit PLL Select /2 1 X2 PLL 4-Bit PLL Select PLL Block Figure 3-9. then an external oscillator can be directly connected to the X1/XCLKIN pin and the X2 pin is left unconnected. The PLLCR bits [3:0] set the clocking ratio. The logic-high level in this case should not exceed VDD.com 3. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .ti.8 OSC and PLL Block Figure 3-9 shows the OSC and PLL block on the F281x and C281x.

ti. an R-C circuit may be used to trigger the XRS pin of the DSP. TMS320F2811. when the input clocks are present. This condition could be used by the application firmware to detect the input clock failure and initiate necessary shut-down procedure for the system.5 XCLKIN * 2 XCLKIN * 2. if the input clock XCLKIN or the oscillator clock is removed or absent. Bit Value 0000 0001 0010 0011 0100 0101 3:0 DIV R/W 0. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 51 . Copyright © 2001–2011. when the external input clock fails.5 XCLKIN * 3 XCLKIN * 3. If a reset is issued by the debugger. TMS320C2811.1 Loss of Input Clock In PLL enabled mode. Normally. NOTE Applications in which the correct CPU operating frequency is absolutely critical must implement a mechanism by which the DSP will be held in reset. the PLL clocking ratio is not changed. TMS320F2812 TMS320C2810. the PLL will still issue a “limp-mode” clock. should the capacitor ever get fully charged. the watchdog counter does not change with the limp-mode clock). 3. The PLLCR register should have been written to with a non-zero value for this feature to work. The limp-mode clock will continue to clock the CPU and peripherals at a typical frequency of 1–4 MHz. the watchdog counter will decrement to initiate a watchdog reset or WDINT interrupt. the watchdog counter will stop decrementing (i.TMS320F2810. An I/O pin may be used to discharge the capacitor on a periodic basis to prevent it from getting fully charged.0. should the input clocks ever fail. where n is the PLL multiplication factor.5 XCLKIN * 5 Reserved Reserved Reserved Reserved Reserved DESCRIPTION The PLLCR register is reset to a known state by the XRS reset line.0.0 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 (1) n PLL Bypassed 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SYSCLKOUT XCLKIN/2 XCLKIN/2 XCLKIN XCLKIN * 1. Such a circuit would also help in detecting failure of the VDD3VFL rail. However. For example. PLLCR Register Bit Definitions BIT(S) 15:4 NAME Reserved TYPE R=0 XRS RESET (1) 0:0 SYSCLKOUT = (XCLKIN * n)/2.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 3-16. TMS320C2812 www.e.8..5 XCLKIN * 4 XCLKIN * 4.

TMS320C2811. Possible PLL Configuration Modes PLL MODE PLL Disabled REMARKS Invoked by tying XPLLDIS pin low upon reset. It can be re-enabled (if need be) after the PLL module has stabilized. TMS320F2812 TMS320C2810. Achieved by writing a non-zero value “n” into PLLCR register. the /2 module in the PLL block divides the clock input at the X1/XCLKIN pin by two before feeding it to the CPU. The resonator/crystal vendor has the equipment and expertise to tune the tank circuit. The PLL itself is bypassed. as well as control for low-power mode entry. • External clock source operation: This mode allows the internal oscillator to be bypassed.com 3. TI recommends that customers have the resonator/crystal vendor characterize the operation of their device with the DSP chip. Clock input to the CPU (CLKIN) is directly derived from the clock signal present at the X1/XCLKIN pin. parallel resonant • CL (load capacitance) = 12 pF • CL1 = CL2 = 24 pF • Cshunt = 6 pF • ESR range = 25 to 40 Ω 52 Functional Overview Copyright © 2001–2011. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.ti.10 External Reference Oscillator Clock Option The typical specifications for the external quartz crystal for a frequency of 30 MHz are listed below: • Fundamental mode. The vendor can also advise the customer regarding the proper tank component values that will ensure start-up and stability over the entire operating range.TMS320F2810. if PLL is not disabled. The device clocks are generated from an external clock source input on the X1/XCLKIN pin. Recommended Crystal/Clock Connection Table 3-17. The PLL has a 4-bit ratio control to select different CPU clock rates. TMS320F2811. PLL-based clock module. PLL block is completely disabled.9 PLL-Based Clock Module The F281x and C281x have an on-chip. Figure 3-10. The watchdog module should be disabled before writing to the PLLCR register. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . X1/XCLKIN X2 X1/XCLKIN X2 CL1 (A) CL2 Crystal (a) (A) External Clock Signal (Toggling 0-VDD) (b) NC A. The PLL-based clock module provides two modes of operation: • Crystal operation: This mode allows the use of an external crystal/resonator to provide the time base to the device. The /2 module in the PLL block now divides the output of the PLL by two before feeding it to the CPU. Default PLL configuration upon power-up. SYSCLKOUT XCLKIN PLL Bypassed PLL Enabled XCLKIN/2 (XCLKIN * n) / 2 3. However. This module provides all the necessary clocking signals for the device. which takes 131072 XCLKIN cycles.

TMS320C2811. this feature cannot be used because the oscillator (and PLL) are turned off and hence. The WATCHDOG module will run off the PLL clock or the oscillator clock. all peripherals are turned off on the device. The WDRST signal is driven low for 512 OSCCLK cycles. the WDINT signal can generate an interrupt to the CPU. Watchdog Module The WDINT signal enables the watchdog to be used as a wakeup from IDLE/STANDBY mode timer. the user disables the counter or the software must periodically write a 0x55 + 0xAA sequence into the watchdog key register which will reset the watchdog counter.11 Watchdog Block The watchdog block on the F281x and C281x is identical to the one used on the 240x devices. Texas Instruments Incorporated Functional Overview Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 53 . to take the CPU out of IDLE mode.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 3. The WDINT signal is fed to the LPM block so that it can wake the device from STANDBY (if enabled). In HALT mode. TMS320F2811. In IDLE mode. 512 oscillator clocks wide (OSCCLK).TMS320F2810. TMS320F2812 TMS320C2810. via the PIE. Figure 3-11 shows the various functional blocks within the watchdog module. for more details.ti.12. To prevent this. TMS320C2812 www. Low-Power Modes Block. so is the WATCHDOG. In STANDBY mode. Figure 3-11. whenever the 8-bit watchdog up counter has reached its maximum value. WDCR (WDPS[2:0]) WDCR (WDDIS) WDCNTR[7:0] OSCCLK /512 Watchdog Prescaler WDCLK 8-Bit Watchdog Counter CLR Clear Counter Internal Pullup WDKEY[7:0] Bad Key Watchdog 55 + AA Key Detector XRS Core-reset WDCR (WDCHK[2:0]) Bad WDCHK Key SCSR (WDENINT) Good Key Generate Output Pulse (512 OSCCLKs) WDRST WDINT WDRST (A) 1 0 1 A. See Section 3. Copyright © 2001–2011. The watchdog module generates an output pulse. The only peripheral that remains functional is the watchdog.

All other signals (including XNMI) will wake the device from STANDBY mode if selected by the LPMCR1 register. the clock is turned off. Table 3-18. Only the XRS and XNMI external signals can wake the device from HALT mode. XNMI. Hence. TMS320C2811. F281x and C281x Low-Power Modes MODE Normal LPM[1:0] X. WDINT. it is safe to use the XNMI signal for this function. the IDLE mode will not be exited and the device will go back into the indicated low-power mode. This signal must be kept low long enough for an interrupt to be recognized by the device. watchdog not functional) off off The Exit column lists which signals or under what conditions the low-power mode will be exited. A low signal. Debugger (3) XRS. STANDBY Mode HALT Mode 54 Functional Overview Copyright © 2001–2011. The IDLE mode on the C28x behaves differently than on the 24x/240x. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. while on the 24x/240x. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . XNMI. The selected signal(s) are also qualified by the OSCCLK before waking the device. NOTE The low-power modes do not affect the state of the output pins (PWM pins included).0 on on on (2) STANDBY 0. on any of the signals. Otherwise. On the C28x. the JTAG port can still function even if the core clock (CLKIN) is turned off. The various low-power modes operate as follows: IDLE Mode This mode is exited by any enabled interrupt or an XNMI that is recognized by the processor. will exit the low-power condition. Any Enabled Interrupt. TMS320F2812 TMS320C2810. C1/2/3/4/5/6TRIP.X off (oscillator and PLL turned off. XINT1. TMS320F2811. CANRX. Table 3-18 summarizes the various modes.0.1 on (watchdog still running) off off HALT (1) (2) (3) 1. SCIRXDA. On the C28x.X OSCCLK on CLKIN on SYSCLKOUT on EXIT (1) – XRS. T1/2/3/4CTRIP. Debugger (3) XRS. SCIRXDB. The LPM block performs no tasks during this mode as long as the LPMCR0(LPM) bits are set to 0. The user will need to select which signal(s) will wake the device. Debugger (3) IDLE 0.com 3. The XNMI input to the core has an enable/disable bit.ti.TMS320F2810. XNMI. WDINT. The number of OSCCLKs is specified in the LPMCR0 register. They will be in whatever state the code left them when the IDLE instruction was executed. the clock output from the core (SYSCLKOUT) is still functional.12 Low-Power Modes Block The low-power modes on the F281x and C281x are similar to the 240x devices.

ti. then CPU-Timer 2 can be used in the application. Reset Timer Reload 16-Bit Timer Divide-Down TDDRH:TDDR 32-Bit Timer Period PRDH:PRD SYSCLKOUT TCR. CPU-Timer 0 and CPU-Timer 1 can be used in user applications.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 4 Peripherals The integrated peripherals of the F281x and C281x are described in the following subsections: • Three 32-bit CPU-Timers • Two event-manager modules (EVA. Timer 2 is reserved for DSP/BIOS.4 (Timer Start Status) 16-Bit Prescale Counter PSCH:PSC Borrow 32-Bit Counter TIMH:TIM Borrow TINT Figure 4-1. TMS320F2811. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 55 .1 32-Bit CPU-Timers 0/1/2 There are three 32-bit CPU-timers on the F281x and C281x devices (CPU-TIMER0/1/2).TMS320F2810. CPU-Timers Copyright © 2001–2011. EVB). TMS320C2812 www. TMS320C2811. TMS320F2812 TMS320C2810. These timers are different from the general-purpose (GP) timers that are present in the Event Manager modules (EVA. SCI-B) • Serial peripheral interface (SPI) module • Digital I/O and shared pin functions 4. NOTE If the application is not using DSP/BIOS. EVB) • Enhanced analog-to-digital converter (ADC) module • Enhanced controller area network (eCAN) module • Multichannel buffered serial port (McBSP) module • Serial communications interface modules (SCI-A.

com In the F281x and C281x devices.ti. TINT2) are connected as shown in Figure 4-2. TMS320F2812 TMS320C2810. The timing of the timers is synchronized to SYSCLKOUT of the processor clock. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . Figure 4-2. When the counter reaches 0. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TINT1. The registers listed in Table 4-1 are used to configure the timers. the timer interrupt signals (TINT0. CPU-Timer Interrupts Signals and Output Signal The general operation of the timer is as follows: The 32-bit counter register “TIMH:TIM” is loaded with the value in the period register “PRDH:PRD”. TMS320F2811. TMS320C2811. B. INT1 to INT12 PIE TINT0 CPU-TIMER 0 C28x CPU INT13 TINT1 XINT13 TINT2 CPU-TIMER 2 (Reserved for DSP/BIOS) CPU-TIMER 1 INT14 A. a timer interrupt output signal generates an interrupt pulse. The timer registers are connected to the memory bus of the C28x processor. 56 Peripherals Copyright © 2001–2011.TMS320F2810. see the TMS320x281x DSP System Control and Interrupts Reference Guide (literature number SPRU078). The counter register decrements at the SYSCLKOUT rate of the C28x. For more information.

TMS320F2810. CPU-Timers 0. Counter Register High CPU-Timer 2. 1. Counter Register CPU-Timer 2. Period Register CPU-Timer 2. Control Register Copyright © 2001–2011. Period Register High CPU-Timer 0. Prescale Register High CPU-Timer 1.ti. TMS320F2812 TMS320C2810. Period Register High CPU-Timer 2. Prescale Register CPU-Timer 1. Period Register CPU-Timer 0. TMS320C2812 www. Prescale Register CPU-Timer 0. Period Register CPU-Timer 1. Control Register DESCRIPTION CPU-Timer 0.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 4-1. TMS320F2811. Prescale Register High CPU-Timer 1. Prescale Register CPU-Timer 2. Counter Register High CPU-Timer 1. TMS320C2811. Prescale Register High CPU-Timer 2. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 57 . Control Register CPU-Timer 0. Counter Register CPU-Timer 1. Counter Register CPU-Timer 0. Counter Register High CPU-Timer 0. 2 Configuration and Control Registers NAME TIMER0TIM TIMER0TIMH TIMER0PRD TIMER0PRDH TIMER0TCR Reserved TIMER0TPR TIMER0TPRH TIMER1TIM TIMER1TIMH TIMER1PRD TIMER1PRDH TIMER1TCR Reserved TIMER1TPR TIMER1TPRH TIMER2TIM TIMER2TIMH TIMER2PRD TIMER2PRDH TIMER2TCR Reserved TIMER2TPR TIMER2TPRH Reserved ADDRESS 0x00 0C00 0x00 0C01 0x00 0C02 0x00 0C03 0x00 0C04 0x00 0C05 0x00 0C06 0x00 0C07 0x00 0C08 0x00 0C09 0x00 0C0A 0x00 0C0B 0x00 0C0C 0x00 0C0D 0x00 0C0E 0x00 0C0F 0x00 0C10 0x00 0C11 0x00 0C12 0x00 0C13 0x00 0C14 0x00 0C15 0x00 0C16 0x00 0C17 0x00 0C18 – 0x00 0C3F SIZE (x16) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 40 CPU-Timer 2. Period Register High CPU-Timer 1.

ti. compare units. TMS320F2811. capture units. Event managers A and B have identical peripheral register sets with EVA starting at 7400h and EVB starting at 7500h. The paragraphs in this section describe the function of GP timers. EVA and EVB timers. see the TMS320x281x DSP Event Manager (EV) Reference Guide (literature number SPRU065). Module and Signal Names for EVA and EVB EVENT MANAGER MODULES GP Timers Compare Units EVA MODULE GP Timer 1 GP Timer 2 Compare 1 Compare 2 Compare 3 Capture 1 Capture 2 Capture 3 QEP1 QEP2 QEPI1 Direction External Clock Compare SIGNAL T1PWM/T1CMP T2PWM/T2CMP PWM1/2 PWM3/4 PWM5/6 CAP1 CAP2 CAP3 QEP1 QEP2 TDIRA TCLKINA C1TRIP C2TRIP C3TRIP T1CTRIP_PDPINTA (1) T2CTRIP/EVASOC MODULE GP Timer 3 GP Timer 4 Compare 4 Compare 5 Compare 6 Capture 4 Capture 5 Capture 6 QEP3 QEP4 QEPI2 Direction External Clock Compare EVB SIGNAL T3PWM/T3CMP T4PWM/T4CMP PWM7/8 PWM9/10 PWM11/12 CAP4 CAP5 CAP6 QEP3 QEP4 TDIRB TCLKINB C4TRIP C5TRIP C6TRIP T3CTRIP_PDPINTB (1) T4CTRIP/EVBSOC Capture Units QEP Channels External Clock Inputs External Trip Inputs External Trip Inputs (1) In the 24x/240x-compatible mode. 58 Peripherals Copyright © 2001–2011. However. compare units. Table 4-2 shows the module and signal names used. For more information. and quadrature-encoder pulse (QEP) circuits. Table 4-3 lists the EVA registers. These paragraphs are applicable to EVB with regard to function—however. capture units. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.com 4. Table 4-2. module/signal names would differ.2 Event Manager Modules (EVA. EVB) The event-manager modules include general-purpose (GP) timers. the T1CTRIP_PDPINTA pin functions as PDPINTA and the T3CTRIP_PDPINTB pin functions as PDPINTB. timer/unit names differ for EVA and EVB. and QEPs using EVA nomenclature.TMS320F2810. and capture units function identically. TMS320F2812 TMS320C2810. full-compare/PWM units. TMS320C2811. Table 4-2 shows the features and functionality available for the event-manager modules and highlights EVA nomenclature. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .

The above registers are mapped to Zone 2. TMS320F2811. EVA Registers (1) NAME GPTCONA T1CNT T1CMPR T1PR T1CON T2CNT T2CMPR T2PR T2CON EXTCONA (2) COMCONA ACTRA DBTCONA CMPR1 CMPR2 CMPR3 CAPCONA CAPFIFOA CAP1FIFO CAP2FIFO CAP3FIFO CAP1FBOT CAP2FBOT CAP3FBOT EVAIMRA EVAIMRB EVAIMRC EVAIFRA EVAIFRB EVAIFRC (1) (2) ADDRESS 0x00 7400 0x00 7401 0x00 7402 0x00 7403 0x00 7404 0x00 7405 0x00 7406 0x00 7407 0x00 7408 0x00 7409 0x00 7411 0x00 7413 0x00 7415 0x00 7417 0x00 7418 0x00 7419 0x00 7420 0x00 7422 0x00 7423 0x00 7424 0x00 7425 0x00 7427 0x00 7428 0x00 7429 0x00 742C 0x00 742D 0x00 742E 0x00 742F 0x00 7430 0x00 7431 SIZE (x16) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 GP Timer Control Register A GP Timer 1 Counter Register GP Timer 1 Compare Register GP Timer 1 Period Register GP Timer 1 Control Register GP Timer 2 Counter Register GP Timer 2 Compare Register GP Timer 2 Period Register GP Timer 2 Control Register GP Extension Control Register A Compare Control Register A Compare Action Control Register A Dead-Band Timer Control Register A Compare Register 1 Compare Register 2 Compare Register 3 Capture Control Register A Capture FIFO Status Register A Two-Level-Deep Capture FIFO Stack 1 Two-Level-Deep Capture FIFO Stack 2 Two-Level-Deep Capture FIFO Stack 3 Bottom Register of Capture FIFO Stack 1 Bottom Register of Capture FIFO Stack 2 Bottom Register of Capture FIFO Stack 3 Interrupt Mask Register A Interrupt Mask Register B Interrupt Mask Register C Interrupt Flag Register A Interrupt Flag Register B Interrupt Flag Register C DESCRIPTION The EV-B register set is identical except the address range is from 0x00 7500 to 0x00 753F. 32-bit accesses produce undefined results. New register compared to 24x/240x Copyright © 2001–2011.TMS320F2810. TMS320C2812 www.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 4-3.ti. TMS320C2811. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 59 . This space allows only 16-bit accesses. TMS320F2812 TMS320C2810.

The EVB module is similar to the EVA module. COMCONA[12]. C3TRIP EVASOC ADC (External) Timer 1 Compare T1CON[5.7. C2TRIP.ti.3.0] QEPDIR QEP Logic TDIRA CAPCONA[10. C1TRIP.6. EXTCONA[0] EVAENCLK EVATO ADC (Internal) Control Logic T1CTRIP/PDPINTA. Figure 4-3.0] T1CON[1] clock GP Timer 1 dir T1CON[10:8] TDIRA Prescaler TCLKINA HSPCLK 16 T1CON[15:11.2] TCLKINA clock dir reset Prescaler QEPCLK T2CON[10:8] HSPCLK GP Timer 2 16 T2CON[15:11. T2CTRIP.2] PWM1 PWM2 PWM3 Dead-Band Logic Output Logic PWM4 PWM5 PWM6 Full Compare 1 Full Compare 2 SVPWM State Machine Peripheral Bus Full Compare 3 COMCONA[15:5. TMS320C2811.4] 16 T2CON[1] GPTCONA[3.3. TMS320F2811. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .9] 16 CAP1_QEP1 Capture Units Index Qual CAPCONA[15:12. CAPCONA[8].2:0] ACTRA[15:12]. Event Manager A Functional Block Diagram 60 Peripherals Copyright © 2001–2011. TMS320F2812 TMS320C2810.6.TMS320F2810.com GPTCONA[12:4].2.4] Output Logic T1PWM_T1CMP 16 GPTCONA[1. T1CON[13:11] DBTCONA[15:0] ACTRA[11:0] Output Logic T2PWM_T2CMP Timer 2 Compare T2CON[5.7:0] EXTCONA[1:2] CAP2_QEP2 CAP3_QEPI1 A. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.

com SPRS174S – APRIL 2001 – REVISED MARCH 2011 4. for reads or writes • A 16-bit timer-compare register. The reload condition that supports double update PWM mode is reloaded on Underflow (beginning of PWM period) OR Period (middle of PWM period).2. overflow. The compare register associated with each GP timer can be used for compare function and PWM-waveform generation. TxPR (double-buffered with shadow register). for four maskable interrupts: underflow. Copyright © 2001–2011. The output states of the deadband generator are configurable and changeable as needed by way of the double-buffered ACTRx register.2. TMS320F2812 TMS320C2810. 4. Double update PWM mode can be achieved by using this condition for compare value reload. These compare units use GP timer1 as the time base and generate six outputs for compare and PWM-waveform generation using programmable deadband circuit. TxCON. GP timers also provide the time base for the other event-manager submodules: GP timer 1 for all the compares and PWM circuits. GP timer 2/1 for the capture units and the quadrature-pulse counting operations.2. TxCNT. 4.” This mode refers to a PWM operation mode in which the position of the leading edge and the position of the trailing edge of a PWM pulse are independently modifiable in each PWM period.3 Programmable Deadband Generator Deadband generation can be enabled/disabled for each compare unit output individually. The GP timer x (x = 1 or 2 for EVA. and period interrupts • A selectable direction input pin (TDIRx) (to count up or down when directional up-/down-count mode is selected) The GP timers can be operated independently or synchronized with each other. Internal or external input clocks with programmable prescaler are used for each GP timer.1 General-Purpose (GP) Timers There are two GP timers.2 Full-Compare Units There are three full-compare units on each event manager. To support this mode. The compare registers in F281x and C281x Event Managers are all buffered and support three compare value reload/update (value in buffer becoming active) modes. for reads or writes • A 16-bit timer-control register.ti. These modes have earlier been documented as compare value reload conditions. up-/down-counter. The deadband-generator circuit produces two outputs (with or without deadband zone) for each compare unit output signal. 4. There are three continuous modes of operations for each GP timer in up.2. x = 3 or 4 for EVB) includes: • A 16-bit timer. The state of each of the six outputs is configured independently.2.TMS320F2810. The compare registers of the compare units are double-buffered. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 61 . TxCMPR (double-buffered with shadow register).or up/down-counting operations. the compare register that determines the position of the edges of a PWM pulse must allow (buffered) compare value update once at the beginning of a PWM period and another time in the middle of a PWM period. TMS320C2812 www. TMS320F2811.5 Double Update PWM Mode The F281x and C281x Event Manager supports “Double Update PWM Mode. for reads or writes • Selectable internal or external input clocks • A programmable prescaler for internal or external clock inputs • Control and interrupt logic.4 PWM Waveform Generation Up to eight PWM waveforms (outputs) can be generated simultaneously by each event manager: three independent pairs (six outputs) by the three full-compare units with programmable deadbands. allowing programmable change of the compare/PWM pulse widths as needed. TMS320C2811. Double-buffering of the period and compare registers allows programmable change of the timer (PWM) period and the compare/PWM pulse width as needed. and two independent PWMs by the GP-timer compares. 4. timer compare. for reads or writes • A 16-bit timer-period register.

2. CAPCONx (R/W) • One 16-bit capture FIFO status register. The PDPINTx pin (after qualification) is reflected in bit 8 of the COMCONx register. the EVB QEP circuit can use CAP6 as a capture index pin. – PDPINTA pin status is reflected in bit 8 of COMCONA register. one for each capture unit • Three capture input pins (CAP1/2/3 for EVA. and x = 4. TMS320F2812 TMS320C2810. 2. the EVA QEP circuit can use CAP3 as a capture index pin as well. Direction or leading-quadrature pulse sequence is detected. – PDPINTB pin status is reflected in bit 8 of COMCONB register. falling edge. if they are not used for the capture function. Similarly.2.6 PWM Characteristics Characteristics of the PWMs are as follows: • 16-bit registers • Wide range of programmable deadband for the PWM output pairs • Change of the PWM carrier frequency for PWM frequency wobbling as needed • Change of the PWM pulse widths within and after each PWM period as needed • External-maskable power and drive-protection interrupts • Pulse-pattern-generator circuit.ti. 4. TMS320F2811.9 External ADC Start-of-Conversion EVA/EVB start-of-conversion (SOC) can be sent to an external pin (EVASOC/EVBSOC) for external ADC interface.com 4. symmetric. with EXTCONB register bits. CAP4 and CAP5 for EVB) can be used to interface the on-chip QEP circuit with a quadrature encoder pulse. for programmable generation of asymmetric.8 Quadrature-Encoder Pulse (QEP) Circuit Two capture inputs (CAP1 and CAP2 for EVA. respectively. the input must hold at its current level to meet the input qualification circuitry requirements. • EXTCON register bits provide options to individually trip control for each PWM pair of signals 4. The values of the selected GP timer counter is captured and stored in the two-level-deep FIFO stacks when selected transitions are detected on capture input pins. With EXTCONA register bits. and four-space vector PWM waveforms • Minimized CPU overhead using auto-reload of the compare and period registers • The PWM pins are driven to a high-impedance state when the PDPINTx pin is driven low and after PDPINTx signal qualification.] • User-specified transition (rising edge. or 3 for EVA. and GP timer 2/4 is incremented or decremented by the rising and falling edges of the two input signals (four times the frequency of either input pulse). CAPx (x = 1. 5. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . The input pins CAP1/2 and CAP4/5 can also be used as QEP inputs to the QEP circuit.TMS320F2810.7 Capture Unit The capture unit provides a logging function for different events or transitions. Full synchronization of these inputs is performed on-chip. or 6 for EVB). or both edges) detection • Three maskable interrupt flags.2. one for each capture unit • The capture pins can also be used as general-purpose interrupt pins.2. EVASOC and EVBSOC are MUXed with T2CTRIP and T4CTRIP. 62 Peripherals Copyright © 2001–2011. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Capture units include the following features: • One 16-bit capture control register. CAPFIFOx • Selection of GP timer 1/2 (for EVA) or 3/4 (for EVB) as the time base • Three 16-bit 2-level-deep FIFO stacks. The capture unit consists of three capture circuits. CAP4/5/6 for EVB)—one input pin per capture unit. 4. In order for a transition to be captured. [All inputs are synchronized with the device (CPU) clock. TMS320C2811.

two cascaded 8-state sequencers) • Sixteen result registers (individually addressable) to store conversion values – The digital value of the input analog voltage is derived by: Digital Value = 0. the autosequencer functions as a single 16-channel sequencer. In the cascaded mode. The ADC module has 16 channels. Functions of the ADC module include: • 12-bit ADC core with built-in S/H • Analog input: 0.ADCLO 3 when input £ 0 V when 0 V < input < 3 V when input ³ 3 V Digital Value = 4095. Autosequencing allows the system to convert the same channel multiple times. once the conversion is complete.TMS320F2810. On each sequencer. the selected channel value is stored in its respective RESULT register.3 Enhanced Analog-to-Digital Converter (ADC) Module A simplified functional block diagram of the ADC module is shown in Figure 4-4. The ADC module consists of a 12-bit ADC with a built-in sample-and-hold (S/H) circuit. • • • • • Multiple triggers as sources for the start-of-conversion (SOC) sequence – S/W – software immediate start – EVA – Event manager A (multiple event sources within EVA) – EVB – Event manager B (multiple event sources within EVB) Flexible interrupt control allows interrupt request on every end-of-sequence (EOS) or every other EOS Sequencer can operate in “start/stop” mode. The ADC interface is built around a fast.ti. 12. Copyright © 2001–2011. The two independent 8-channel modules can be cascaded to form a 16-channel module. MUXed inputs • Autosequencing capability provides up to 16 “autoconversions” in a single session. This gives increased resolution over traditional single-sampled conversion results. there is only one converter in the ADC module. Digital Value = 4096 ´ Input Analog Voltage . Although there are multiple input channels and two sequencers. allowing the user to perform oversampling algorithms.. TMS320C2812 www.0 V (voltages above 3.0 V produce full-scale conversion results) • Fast conversion rate: 80 ns at 25-MHz ADC clock. configurable as two independent 8-channel modules to service event managers A and B. allowing multiple “time-sequenced triggers” to synchronize conversions EVA and EVB triggers can operate independently in dual-sequencer mode Sample-and-hold (S/H) acquisition time window has separate prescale control The ADC module in the F281x and C281x has been enhanced to provide flexible interface to event managers A and B.e. each module has the choice of selecting any one of the respective eight channels available through an analog MUX.5 MSPS • 16-channel. TMS320C2811.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 4. TMS320F2812 TMS320C2810. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 63 . TMS320F2811.0 V to 3. Each conversion can be programmed to select any 1 of 16 input channels • Sequencer can be operated as two independent 8-state sequencers or as one large 16-state sequencer (i. The two 8-channel modules have the capability to autosequence a series of conversions. 12-bit ADC module with a fast conversion rate of 80 ns at 25-MHz ADC clock. Figure 4-4 shows the block diagram of the F281x and C281x ADC module.

While reset is active-low (XRS) the clock to the register will still function. be in a low-power inactive state. then the clock to the registers will be disabled. HALT: This signal only affects the analog module. It does not affect the registers. proper board layout is critical. TMS320F2812 TMS320C2810. The HALT mode will stop the clock to the CPU. The ADC registers are accessed at the SYSCLKOUT rate. Block Diagram of the F281x and C281x ADC Module To obtain the specified accuracy of the ADC. which will stop the HSPCLK.TMS320F2810. TMS320F2811. If high. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320C2811. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. 2. 64 Peripherals Copyright © 2001–2011. As soon as reset goes high. the ADC module is powered. The internal timing of the ADC module is controlled by the high-speed peripheral clock (HSPCLK). unused ADC inputs should be connected to analog ground. traces leading to the ADCIN pins should not run in close proximity to the digital signal paths. This is necessary to make sure all registers and modes go into their default reset state. proper isolation techniques must be used to isolate the ADC module power pins (VDDA1/VDDA2.ti. If low. Therefore the ADC register logic will be turned off indirectly. then the clocks to the registers will be enabled and the analog module will be enabled. Notes: 1. The analog module will.com System Control Block ADCENCLK High-Speed Prescaler HSPCLK SYSCLKOUT C28x Analog MUX ADCINA0 S/H ADCINA7 12-Bit ADC Module ADCINB0 S/H ADCINB7 Result Registers Result Reg 0 Result Reg 1 70A8h Result Reg 7 Result Reg 8 70AFh 70B0h Result Reg 15 70B7h ADC Control Registers S/W EVA ADCSOC SOC Sequencer 1 Sequencer 2 SOC S/W EVB Figure 4-4. Furthermore. however. For better accuracy and ESD protection. There will be a certain time delay (ms range) before the ADC is stable and can be used. this signal will be low. This is to minimize switching noise on the digital lines from getting coupled to the ADC inputs. To the best extent possible. The behavior of the ADC module based on the state of the ADCENCLK and HALT signals is as follows: ADCENCLK: On reset. When the user sets the ADCENCLK signal high. the ADC module goes into low-power mode. AVDDREFBG) from the digital supply.

3 V Analog 3. Use 24. B.9-V) supply as the digital core but separate the two with a ferrite bead or a filter Digital Ground A. C. Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance. TAIYO YUDEN EMK325F106ZH. Figure 4-5. ADC Pin Connections With Internal Reference NOTE The temperature rating of any recommended component must match the rating of the end product.9 kΩ for ADC clock range 1–18.75–25 MHz. Copyright © 2001–2011.3 V ADC Analog Power ADC Reference Power ADC Analog I/O Power Analog 3. or equivalent ceramic capacitor External decoupling capacitors are recommended on all power pins. Intended for test purposes only.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Figure 4-5 shows the ADC pin-biasing for internal reference and Figure 4-6 shows the ADC pin-biasing for external reference.TMS320F2810.3 V Analog Ground VDD1 ADC Digital Power VSS1 1. Provide access to this pin in PCB layouts.9 k /20 k 10 F (C) (C) (B) Test Pin ADC External Current Bias Resistor ADC Reference Positive Output ADC Reference Medium Output ADCRESEXT ADCREFP ADCREFM VDDA1 VDDA2 VSSA1 VSSA2 AVDDREFBG AVSSREFBG VDDAIO VSSAIO 10 F ADCREFP and ADCREFM should not be loaded by external circuitry Analog 3. ADCINA[7:0] ADCINB[7:0] ADCLO ADCBGREFIN (A) ADC 16-Channel Analog Inputs Analog input 0-3 V with respect to ADCLO Connect to Analog Ground 24. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 65 .8 V can use the same 1. use 20 kΩ for ADC clock range 18.8-V (or 1. D. TMS320F2811. TMS320C2812 www. TMS320C2811. TMS320F2812 TMS320C2810. EMK325BJ106MD. E.ti.75 MHz.3 V Analog 3.

3 V ADC Reference Power Analog 3. See the TMS320x281x DSP Analog-to-Digital Converter (ADC) Reference Guide (literature number SPRU060) for more information. D.75 MHz. In this mode. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .com ADC 16-Channel Analog Inputs Test Pin ADC External Current Bias Resistor ADC Reference Positive Input ADC Reference Medium Input ADCINA[7:0] ADCINB[7:0] ADCLO ADCBGREFIN ADCRESEXT ADCREFP ADCREFM Analog Input 0-3 V With Respect to ADCLO Connect to Analog Ground 24.75–25 MHz. TMS320C2811. Do not enable internal references when external references are connected to ADCREFP and ADCREFM.TMS320F2810.8 V can use the same 1.3 V Analog Ground A. Use 24. ADC Pin Connections With External Reference 66 Peripherals Copyright © 2001–2011.3 V ADC Analog I/O Power Analog 3.10 F 1 F . TMS320F2811. use 20 kΩ for ADC clock range 18.9 k /20 k (C) 2V 1V 1 F . External reference is enabled using bit 8 in the ADCTRL3 Register at ADC power up. 1. The voltage ADCREFP – ADCREFM will determine the overall accuracy. the accuracy of external reference is critical for overall gain.9 kΩ for ADC clock range 1–18.10 F (D) ADC Analog Power VDDA1 VDDA2 VSSA1 VSSA2 AVDDREFBG AVSSREFBG VDDAIO VSSAIO VDD1 VSS1 Analog 3.3 V Analog 3. C. It is recommended that buffered external references be provided with a voltage difference of (ADCREFP – ADCREFM) = 1 V ± 0. Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance. TMS320F2812 TMS320C2810. ADC Digital Power Figure 4-6.1% or better.9-V) Digital Ground supply as the digital core but separate the two with a ferrite bead or a filter External decoupling capacitors are recommended on all power pins.8-V (or 1. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. B.ti.

ti. TMS320F2812 TMS320C2810. controlled.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 The ADC operation is configured. Table 4-4. Copyright © 2001–2011. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 67 . TMS320C2812 www. ADC Registers (1) NAME ADCTRL1 ADCTRL2 ADCMAXCONV ADCCHSELSEQ1 ADCCHSELSEQ2 ADCCHSELSEQ3 ADCCHSELSEQ4 ADCASEQSR ADCRESULT0 ADCRESULT1 ADCRESULT2 ADCRESULT3 ADCRESULT4 ADCRESULT5 ADCRESULT6 ADCRESULT7 ADCRESULT8 ADCRESULT9 ADCRESULT10 ADCRESULT11 ADCRESULT12 ADCRESULT13 ADCRESULT14 ADCRESULT15 ADCTRL3 ADCST Reserved (1) ADDRESS 0x00 7100 0x00 7101 0x00 7102 0x00 7103 0x00 7104 0x00 7105 0x00 7106 0x00 7107 0x00 7108 0x00 7109 0x00 710A 0x00 710B 0x00 710C 0x00 710D 0x00 710E 0x00 710F 0x00 7110 0x00 7111 0x00 7112 0x00 7113 0x00 7114 0x00 7115 0x00 7116 0x00 7117 0x00 7118 0x00 7119 0x00 711C – 0x00 711F SIZE (x16) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 4 DESCRIPTION ADC Control Register 1 ADC Control Register 2 ADC Maximum Conversion Channels Register ADC Channel Select Sequencing Control Register 1 ADC Channel Select Sequencing Control Register 2 ADC Channel Select Sequencing Control Register 3 ADC Channel Select Sequencing Control Register 4 ADC Auto-Sequence Status Register ADC Conversion Result Buffer Register 0 ADC Conversion Result Buffer Register 1 ADC Conversion Result Buffer Register 2 ADC Conversion Result Buffer Register 3 ADC Conversion Result Buffer Register 4 ADC Conversion Result Buffer Register 5 ADC Conversion Result Buffer Register 6 ADC Conversion Result Buffer Register 7 ADC Conversion Result Buffer Register 8 ADC Conversion Result Buffer Register 9 ADC Conversion Result Buffer Register 10 ADC Conversion Result Buffer Register 11 ADC Conversion Result Buffer Register 12 ADC Conversion Result Buffer Register 13 ADC Conversion Result Buffer Register 14 ADC Conversion Result Buffer Register 15 ADC Control Register 3 ADC Status Register The above registers are Peripheral Frame 2 Registers. and monitored by the registers listed in Table 4-4. TMS320F2811. TMS320C2811.TMS320F2810.

68 Peripherals Copyright © 2001–2011.TMS320F2810.0B • Supports data rates up to 1 Mbps • Thirty-two mailboxes. NOTE: For a SYSCLKOUT of 150 MHz. TMS320F2811. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TMS320F2812 TMS320C2810. thereby eliminating the need for another node to provide the acknowledge bit. A “dummy” acknowledge is provided.ti. the smallest bit rate possible is 23. The 28x CAN has passed the conformance test per ISO/DIS 16845.com 4. Contact TI for details.4 kbps. version 2.4 Enhanced Controller Area Network (eCAN) Module The CAN module has the following features: • Fully compliant with CAN protocol. TMS320C2811. each with the following properties: – Configurable as receive or transmit – Configurable with standard or extended identifier – Has a programmable receive mask – Supports data and remote frame – Composed of 0 to 8 bytes of data – Uses a 32-bit time stamp on receive and transmit message – Protects against reception of new message – Holds the dynamically programmable priority of transmit message – Employs a programmable interrupt scheme with two interrupt levels – Employs a programmable alarm on transmission or reception time-out • Low-power mode • Programmable wake-up on bus activity • Automatic reply to a remote request message • Automatic retransmission of a frame in case of loss of arbitration or error • 32-bit local network time counter synchronized by a specific message (communication in conjunction with mailbox 16) • Self-test mode – Operates in a loopback mode receiving its own message.

TMS320F2812 TMS320C2810. Timer Management Unit 32 eCAN Memory (512 Bytes) Registers and Message Objects Control 32 eCAN Protocol Kernel Receive Buffer Transmit Buffer Control Buffer Status Buffer SN65HVD23x 3.TMS320F2810.ti. TMS320F2811. eCAN Block Diagram and Interface Circuit Copyright © 2001–2011. TMS320C2812 www.3-V CAN Transceiver CAN Bus Figure 4-7. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 69 . TMS320C2811. Receive Control Unit.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 eCAN0INT eCAN1INT Controls Address Data Enhanced CAN Controller Message Controller Mailbox RAM (512 Bytes) 32-Message Mailbox of 4 x 32-Bit Words 32 Memory Management Unit 32 CPU Interface.

3 V 3.3 V 3. 3.3 V 3.3 V LOW-POWER MODE Standby Standby Sleep Sleep None None Standby Standby and Sleep Standby SLOPE CONTROL Adjustable Adjustable Adjustable Adjustable None None Adjustable Adjustable Adjustable VREF Yes Yes Yes Yes None None None None None OTHER – – – – – – Diagnostic Loopback – Autobaud Loopback Built-in Isolation Low Prop Delay Thermal Shutdown Failsafe Operation Dominant Time-out TA –40°C to 85°C –40°C to 125°C –40°C to 85°C –40°C to 125°C –40°C to 85°C –40°C to 125°C –40°C to 125°C –40°C to 125°C –40°C to 125°C ISO1050 3–5.ti.5 V None None None –55°C to 105°C 70 Peripherals Copyright © 2001–2011.com Table 4-5.3 V 3.3 V 3. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .TMS320F2810. TMS320C2811.3 V 3. TMS320F2812 TMS320C2810. TMS320F2811. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.3 V 3.3 V 3.3-V eCAN Transceivers for the TMS320F281x and TMS320C281x DSPs PART NUMBER SN65HVD230 SN65HVD230Q SN65HVD231 SN65HVD231Q SN65HVD232 SN65HVD232Q SN65HVD233 SN65HVD234 SN65HVD235 SUPPLY VOLTAGE 3.

the RAM available (LAM. eCAN Memory Map NOTE If the eCAN module is not used in an application. TMS320F2811.CANMIM Mailbox Interrupt Level .MSGID Message Control . and mailbox RAM) can be used as general-purpose RAM.CANGIF1 Mailbox Interrupt Mask .CANGAM Master Control .CANTIOC RX I/O Control . TMS320C2812 www.CANRMP Received Message Lost .CANTEC Receive Error Counter .TMS320F2810.CANTOC Time-Out Status .ti.CANMC Bit-Timing Configuration .CANTSC Time-Out Control .CANBTC Error and Status .CANRIOC Time Stamp Counter .CANTRS Transmission Request Reset .CANAA Received Message Pending .CANGIF0 Global Interrupt Mask .MDH Reserved Figure 4-8.CANTRR Transmission Acknowledge . Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 71 .CANMD Transmission Request Set . MOTS. TMS320C2811.CANTOS 61E0h-61E7h 61E8h-61EFh 61F0h-61F7h 61F8h-61FFh Mailbox 28 Mailbox 29 Mailbox 30 Mailbox 31 Message Mailbox (16 Bytes) 61E8h-61E9h 61EAh-61EBh 61ECh-61EDh 61EEh-61EFh Message Identifier .CANRFP Global Acceptance Mask .CANOPC TX I/O Control .CANGIM eCAN Memory RAM (512 Bytes) 6100h-6107h 6108h-610Fh 6110h-6117h 6118h-611Fh 6120h-6127h Mailbox 0 Mailbox 1 Mailbox 2 Mailbox 3 Mailbox 4 Global Interrupt Flag 1 .CANME Mailbox Direction .com SPRS174S – APRIL 2001 – REVISED MARCH 2011 eCAN Control and Status Registers Mailbox Enable .CANMIL Overwrite Protection Control .CANES Transmit Error Counter . MOTO. Copyright © 2001–2011.CANRML Remote Frame Pending .CANREC Global Interrupt Flag 0 .MDL Message Data High .CANTA eCAN Memory (512 Bytes) 6000h Control and Status Registers 603Fh 6040h 607Fh 6080h 60BFh 60C0h 60FFh Local Acceptance Masks (LAM) (32 x 32-Bit RAM) Message Object Time Stamps (MOTS) (32 x 32-Bit RAM) Message Object Time-Out (MOTO) (32 x 32-Bit RAM) Abort Acknowledge . The CAN module clock should be enabled for this.MSGCTRL Message Data Low . TMS320F2812 TMS320C2810.

TMS320C2811.com The CAN registers listed in Table 4-6 are used by the CPU to configure and control the CAN controller and the message objects. eCAN control registers only support 32-bit read/write operations. 72 Peripherals Copyright © 2001–2011. Table 4-6. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.TMS320F2810. CAN Registers (1) NAME CANME CANMD CANTRS CANTRR CANTA CANAA CANRMP CANRML CANRFP CANGAM CANMC CANBTC CANES CANTEC CANREC CANGIF0 CANGIM CANGIF1 CANMIM CANMIL CANOPC CANTIOC CANRIOC CANTSC CANTOC CANTOS (1) ADDRESS 0x00 6000 0x00 6002 0x00 6004 0x00 6006 0x00 6008 0x00 600A 0x00 600C 0x00 600E 0x00 6010 0x00 6012 0x00 6014 0x00 6016 0x00 6018 0x00 601A 0x00 601C 0x00 601E 0x00 6020 0x00 6022 0x00 6024 0x00 6026 0x00 6028 0x00 602A 0x00 602C 0x00 602E 0x00 6030 0x00 6032 SIZE (x32) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Mailbox enable Mailbox direction Transmit request set Transmit request reset Transmission acknowledge Abort acknowledge Receive message pending Receive message lost Remote frame pending Global acceptance mask Master control Bit-timing configuration Error and status Transmit error counter Receive error counter Global interrupt flag 0 Global interrupt mask Global interrupt flag 1 Mailbox interrupt mask Mailbox interrupt level Overwrite protection control TX I/O control RX I/O control Time stamp counter (Reserved in SCC mode) Time-out control (Reserved in SCC mode) Time-out status (Reserved in SCC mode) DESCRIPTION These registers are mapped to Peripheral Frame 1. Mailbox RAM can be accessed as 16 bits or 32 bits. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . 32-bit accesses are aligned to an even boundary. TMS320F2812 TMS320C2810.ti. TMS320F2811.

or CLKR. Internal prescalers must be adjusted such that the peripheral speed is less than the I/O buffer speed limit—20-MHz maximum. TMS320F2811. (2) (2) Serial port performance is limited by I/O buffer switching speed. TMS320C2812 www. TMS320F2812 TMS320C2810. except the DMA features • Full-duplex communication • Double-buffered data registers which allow a continuous data stream • Independent framing and clocking for receive and transmit • External shift clock generation or an internal programmable frequency shift clock • A wide selection of data sizes including 8-.) – IIS-compliant devices • McBSP clock rate = CLKG = CLKSRG/(1 + CLKGDIV) . Analog Interface Chips (AICs). TMS320C2811. 12-. and other serially connected A/D and D/A devices • Works with SPI-compatible devices • Two 16 x 16-level FIFO for Transmit channel • Two 16 x 16-level FIFO for Receive channel The following application interfaces can be supported on the McBSP: • T1/E1 framers • MVIP switching-compatible and ST-BUS-compliant devices including: – MVIP framers – H.ti.TMS320F2810. or 32-bits • 8-bit data transfers with LSB or MSB first • Programmable polarity for both frame synchronization and data clocks • Highly programmable internal clock and frame generation • Support A-bis mode • Direct interface to industry-standard CODECs. 20-. 16-. Copyright © 2001–2011.5 Multichannel Buffered Serial Port (McBSP) Module The McBSP module has the following features: • Compatible to McBSP in TMS320C54x™/ TMS320C55x™ DSP devices. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 73 . where CLKSRG source could be LSPCLK. 24-.100 framers – SCSA framers – IOM-2 compliant devices – AC97-compliant devices (the necessary multiphase frame synchronization capability is provided. CLKX.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 4.

TMS320C2811. TMS320F2812 TMS320C2810.com Figure 4-9 shows the block diagram of the McBSP module with FIFO. TMS320F2811. Peripheral Write Bus MXINT To CPU TX Interrupt Logic TX FIFO Interrupt TX FIFO _15 TX FIFO _15 TX FIFO _1 McBSP Transmit Interrupt Select Logic TX FIFO _0 TX FIFO _1 TX FIFO _0 TX FIFO Registers 16 16 DXR1 Transmit Buffer 16 Compand Logic XSR2 XSR1 FSX CLKX DX DR CLKR FSR RBR2 Register 16 RBR1 Register 16 DRR1 Receive Buffer 16 RX FIFO _15 LSPCLK DXR2 Transmit Buffer McBSP Registers and Control Logic 16 RSR2 16 RSR1 16 Expand Logic McBSP DRR2 Receive Buffer 16 McBSP Receive Interrupt Select Logic RX FIFO Interrupt RX FIFO _15 MRINT To CPU RX Interrupt Logic RX FIFO _1 RX FIFO _0 RX FIFO _1 RX FIFO _0 RX FIFO Registers Peripheral Read Bus Figure 4-9. interfaced to the F281x and C281x version of Peripheral Frame 2.TMS320F2810. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. McBSP Module With FIFO 74 Peripherals Copyright © 2001–2011. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .ti.

TMS320F2812 TMS320C2810. TMS320F2811. Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 75 Copyright © 2001–2011. McBSP Registers NAME ADDRESS 0x00 78xxh – – – 00 TYPE (R/W) – – – R RESET VALUE (HEX) 0x0000 0x0000 0x0000 0x0000 DESCRIPTION DATA REGISTERS. else read DRR1 only McBSP Data Transmit Register 2 • Write First if the word size is greater than 16 bits. Texas Instruments Incorporated . else ignore DRR2 McBSP Data Receive Register 1 • Read Second if the word size is greater than 16 bits.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 4-7 provides a summary of the McBSP registers. TMS320C2811. else write to DXR1 only McBSP Serial Port Control Register 2 McBSP Serial Port Control Register 1 McBSP Receive Control Register 2 McBSP Receive Control Register 1 McBSP Transmit Control Register 2 McBSP Transmit Control Register 1 McBSP Sample Rate Generator Register 2 McBSP Sample Rate Generator Register 1 McBSP Multichannel Register 2 McBSP Multichannel Register 1 McBSP Receive Channel Enable Register Partition A McBSP Receive Channel Enable Register Partition B McBSP Transmit Channel Enable Register Partition A McBSP Transmit Channel Enable Register Partition B McBSP Pin Control Register McBSP Receive Channel Enable Register Partition C McBSP Receive Channel Enable Register Partition D McBSP Transmit Channel Enable Register Partition C McBSP Transmit Channel Enable Register Partition D McBSP Receive Channel Enable Register Partition E McBSP Receive Channel Enable Register Partition F McBSP Transmit Channel Enable Register Partition E McBSP Transmit Channel Enable Register Partition F McBSP Receive Channel Enable Register Partition G McBSP Receive Channel Enable Register Partition H McBSP Transmit Channel Enable Register Partition G McBSP Transmit Channel Enable Register Partition H DRR1 01 R 0x0000 DXR2 02 W 0x0000 DXR1 03 W 0x0000 McBSP CONTROL REGISTERS SPCR2 SPCR1 RCR2 RCR1 XCR2 XCR1 SRGR2 SRGR1 MCR2 MCR1 RCERA RCERB XCERA XCERB PCR RCERC RCERD XCERC XCERD RCERE RCERF XCERE XCERF RCERG RCERH XCERG XCERH (1) 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 MULTICHANNEL CONTROL REGISTERS DRR2/DRR1 and DXR2/DXR1 share the same addresses of receive and transmit FIFO registers in FIFO mode.ti. TMS320C2812 www.TMS320F2810. Table 4-7. TRANSMIT (1) – – – DRR2 McBSP Receive Buffer Register McBSP Receive Shift Register McBSP Transmit Shift Register McBSP Data Receive Register 2 • Read First if the word size is greater than 16 bits. else ignore DXR2 McBSP Data Transmit Register 1 • Write Second if the word size is greater than 16 bits. RECEIVE.

TMS320F2811. 76 Peripherals Copyright © 2001–2011. McBSP Registers (continued) NAME ADDRESS 0x00 78xxh TYPE (R/W) RESET VALUE (HEX) FIFO Data Registers (2) DRR2 DRR1 DXR2 DXR1 00 01 02 03 R R W W 0x0000 0x0000 0x0000 0x0000 McBSP Data Receive Register 2 – Top of receive FIFO • Read First FIFO pointers will not advance McBSP Data Receive Register 1 – Top of receive FIFO • Read Second for FIFO pointers to advance McBSP Data Transmit Register 2 – Top of transmit FIFO • Write First FIFO pointers will not advance McBSP Data Transmit Register 1 – Top of transmit FIFO • Write Second for FIFO pointers to advance McBSP Transmit FIFO Register McBSP Receive FIFO Register McBSP FIFO Control Register McBSP FIFO Interrupt Register McBSP FIFO Status Register DESCRIPTION FIFO MODE REGISTERS (applicable only in FIFO mode) FIFO Control Registers MFFTX MFFRX MFFCT MFFINT MFFST (2) 20 21 22 23 24 R/W R/W R/W R/W R/W 0xA000 0x201F 0x0000 0x0000 0x0000 FIFO pointers advancing is based on order of access to DRR2/DRR1 and DXR2/DXR1 registers. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320C2811.ti.TMS320F2810.com Table 4-7. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TMS320F2812 TMS320C2810.

overrun.ti. and each has its own separate enable and interrupt bits. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 77 . overrun. TMS320F2811. framing.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 4. and RX ERROR flag (monitoring four interrupt conditions) Separate enable bits for transmitter and receiver interrupts (except BRKDT) Max bit rate = 75 MHz/16 = 4. Internal prescalers must be adjusted such that the peripheral speed is less than the I/O buffer speed limit—20 MHz maximum. TMS320C2811. BRKDT flag (break condition occurred). The SCI receiver and transmitter are double-buffered. and the upper byte (15–8) is read as zeros. When a register is accessed. The SCI modules support digital communications between the CPU and other asynchronous peripherals that use the standard non-return-to-zero (NRZ) format. the SCI checks received data for break detection. The bit rate is programmable to over 65000 different speeds through a 16-bit baud-select register. Both can be operated independently or simultaneously in the full-duplex mode. Enhanced features: • Auto baud-detect hardware logic • 16-level transmit/receive FIFO (3) Serial port performance is limited by I/O buffer switching speed. TMS320F2812 TMS320C2810. To ensure data integrity.6 Serial Communications Interface (SCI) Module The F281x and C281x devices include two serial communications interface (SCI) modules. and framing errors. – Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX EMPTY flag (transmitter-shift register is empty) – Receiver: RXRDY flag (receiver-buffer register is ready to receive another character).688 x 106 b/s NRZ (non-return-to-zero) format Ten SCI module control registers located in the control register frame beginning at address 7050h NOTE: All registers in this module are 8-bit registers that are connected to Peripheral Frame 2. • Baud rate programmable to 64K different rates (3) Baud rate = LSPCLK (BRR + 1) * 8 LSPCLK 16 when BRR ¹ 0 when BRR = 0 = • • • • • • • • • • Data-word format – One start bit – Data-word length programmable from one to eight bits – Optional even/odd/no parity bit – One or two stop bits Four error-detection flags: parity. Copyright © 2001–2011.or full-duplex operation Double-buffered receive and transmit functions Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with status flags. and break detection Two wake-up multiprocessor modes: idle-line and address bit Half. TMS320C2812 www. parity.TMS320F2810. Features of each SCI module include: • Two external pins: – SCITXD: SCI transmit-output pin – SCIRXD: SCI receive-input pin NOTE: Both pins can be used as GPIO if not used for SCI. Writing to the upper byte has no effect. the register data is in the lower byte (7–0).

This space only allows 16-bit accesses.com The SCI port operation is configured and controlled by the registers listed in Table 4-8 and Table 4-9. 78 Peripherals Copyright © 2001–2011. High Bits SCI-A Baud Register.ti. High Bits SCI-B Baud Register. These registers are new registers for the FIFO mode. TMS320F2811. Table 4-9. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . Low Bits SCI-B Control Register 2 SCI-B Receive Status Register DESCRIPTION SCI-B Communications Control Register SCI-B Receive Emulation Data Buffer Register SCI-B Receive Data Buffer Register SCI-B Transmit Data Buffer Register SCI-B FIFO Transmit Register SCI-B FIFO Receive Register SCI-B FIFO Control Register SCI-B Priority Control Register SCIFFRXB (2) SCIFFCTB (2) SCIPRIB (1) (2) Registers in this table are mapped to peripheral bus 16 space. Low Bits SCI-A Control Register 2 SCI-A Receive Status Register DESCRIPTION SCI-A Communications Control Register SCI-A Receive Emulation Data Buffer Register SCI-A Receive Data Buffer Register SCI-A Transmit Data Buffer Register SCI-A FIFO Transmit Register SCI-A FIFO Receive Register SCI-A FIFO Control Register SCI-A Priority Control Register SCIFFCTA (1) These registers are new registers for the FIFO mode. 32-bit accesses produce undefined results. SCI-B Registers (1) NAME SCICCRB SCICTL1B SCIHBAUDB SCILBAUDB SCICTL2B SCIRXSTB SCIRXEMUB SCIRXBUFB SCITXBUFB SCIFFTXB (2) ADDRESS 0x00 7750 0x00 7751 0x00 7752 0x00 7753 0x00 7754 0x00 7755 0x00 7756 0x00 7757 0x00 7759 0x00 775A 0x00 775B 0x00 775C 0x00 775F SIZE (x16) 1 1 1 1 1 1 1 1 1 1 1 1 1 SCI-B Control Register 1 SCI-B Baud Register. Table 4-8. TMS320C2811.TMS320F2810. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TMS320F2812 TMS320C2810. SCI-A Registers NAME SCICCRA SCICTL1A SCIHBAUDA SCILBAUDA SCICTL2A SCIRXSTA SCIRXEMUA SCIRXBUFA SCITXBUFA SCIFFTXA (1) SCIFFRXA SCIPRIA (1) (1) ADDRESS 0x00 7050 0x00 7051 0x00 7052 0x00 7053 0x00 7054 0x00 7055 0x00 7056 0x00 7057 0x00 7059 0x00 705A 0x00 705B 0x00 705C 0x00 705F SIZE (x16) 1 1 1 1 1 1 1 1 1 1 1 1 1 SCI-A Control Register 1 SCI-A Baud Register.

8 Baud Rate MSbyte Register SCILBAUD.6 SCICCR. TMS320C2811.TMS320F2810.14 AutoBaud Detect Logic SCIRXD RXSHF Register RXWAKE SCIRXST.15 RX Error RX ERR INT ENA SCICTL1.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Figure 4-10 shows the SCI module block diagram.ti.0 SCICTL2. 7 .6 BRKDT SCIRXST. TMS320F2812 TMS320C2810.1 RXENA SCICTL1.6 TXRDY SCICTL2.4 . TMS320C2812 www.1 Receive-Data Buffer Register SCIRXBUF. 15 .0 TXINT TX Interrupt Logic TX FIFO Interrupts To CPU SCI TX Interrupt Select Logic SCITXD TX FIFO _1 ----- TX FIFO _15 SCITXBUF. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 79 .7 RX Error SCIRXST.3 1 WUT 8 TX FIFO _0 TXSHF Register 8 SCITXD TXENA TX EMPTY SCICTL2. TMS320F2811.6 SCI RX Interrupt Select Logic Figure 4-10.7-0 RX FIFO Registers RXFFOVF SCIRXST.7-0 8 RX FIFO _15 ----- SCIRXD LSPCLK RXRDY SCIRXST.7 TX INT ENA SCICTL2.5 Transmitter-Data Buffer Register TXWAKE SCICTL1.7-0 TX FIFO Registers SCIFFENA SCIHBAUD. Serial Communications Interface (SCI) Module Block Diagram Copyright © 2001–2011.2 FE OE PE SCIFFRX.5 RX FIFO Interrupts RX/BK INT ENA RX FIFO _1 RX FIFO _0 RX Interrupt Logic RXINT To CPU SCIRXBUF.0 Baud Rate LSbyte Register 8 SCIFFTX. SCICTL1.1 Frame Format and Mode Parity Even/Odd Enable SCICCR.

Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . When a register is accessed. 2. • Two operational modes: master and slave • Baud rate: 125 different programmable rates Baud rate = LSPCLK (SPIBRR + 1) LSPCLK 4 when SPIBRR ¹ 0 when SPIBRR = 0.com 4. Data word length: one to sixteen data bits Four clocking schemes (controlled by clock polarity and clock phase bits) include: – Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.ti. – Rising edge without phase delay: SPICLK inactive-low. Simultaneous receive and transmit operation (transmit function can be disabled in software) Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms. SPI transmits data one half-cycle ahead of the falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal. display drivers. 3 = • • • • • Serial port performance is limited by I/O buffer switching speed. – Falling edge with phase delay: SPICLK active-high. synchronous serial I/O port that allows a serial bit stream of programmed length (one to sixteen bits) to be shifted into and out of the device at a programmable bit-transfer rate. TMS320C2811. Nine SPI module control registers: Located in control register frame beginning at address 7040h. The SPI is a high-speed. Typical applications include external I/O or peripheral expansion through devices such as shift registers. Enhanced features: • 16-level transmit/receive FIFO • Delayed transmit control 80 Peripherals Copyright © 2001–2011. SPI transmits data one half-cycle ahead of the falling edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal. 1.TMS320F2810. The SPI module features include: • Four external pins: – SPISOMI: SPI slave-output/master-input pin – SPISIMO: SPI slave-input/master-output pin – SPISTE: SPI slave transmit-enable pin – SPICLK: SPI serial-clock pin NOTE: All four pins can be used as GPIO. – Rising edge with phase delay: SPICLK inactive-low. the register data is in the lower byte (7–0). NOTE: All registers in this module are 16-bit registers that are connected to Peripheral Frame 2. Multidevice communications are supported by the master/slave operation of the SPI. Internal prescalers must be adjusted such that the peripheral speed is less than the I/O buffer speed limit—20 MHz maximum. and the upper byte (15–8) is read as zeros. the SPI is used for communications between the DSP controller and external peripherals or another processor. SPI transmits data on the rising edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal. Normally. and ADCs. TMS320F2811. if the SPI module is not used. TMS320F2812 TMS320C2810. Writing to the upper byte has no effect.7 Serial Peripheral Interface (SPI) Module The F281x and C281x devices include the four-pin serial peripheral interface (SPI) module. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.

Copyright © 2001–2011.ti. TMS320F2812 TMS320C2810.TMS320F2810.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 The SPI port operation is configured and controlled by the registers listed in Table 4-10. SPI Registers (1) NAME SPICCR SPICTL SPISTS SPIBRR SPIRXEMU SPIRXBUF SPITXBUF SPIDAT SPIFFTX SPIFFRX SPIFFCT SPIPRI (1) ADDRESS 0x00 7040 0x00 7041 0x00 7042 0x00 7044 0x00 7046 0x00 7047 0x00 7048 0x00 7049 0x00 704A 0x00 704B 0x00 704C 0x00 704F SIZE (x16) 1 1 1 1 1 1 1 1 1 1 1 1 SPI Operation Control Register SPI Status Register SPI Baud Rate Register SPI Receive Emulation Buffer Register SPI Serial Input Buffer Register SPI Serial Output Buffer Register SPI Serial Data Register SPI FIFO Transmit Register SPI FIFO Receive Register SPI FIFO Control Register SPI Priority Control Register DESCRIPTION SPI Configuration Control Register These registers are mapped to Peripheral Frame 2. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 81 . TMS320F2811. TMS320C2812 www. 32-bit accesses produce undefined results. TMS320C2811. Table 4-10. This space only allows 16-bit accesses.

14 RX FIFO Registers SPIRXBUF RX FIFO _0 RX FIFO _1 ----RX FIFO _15 16 SPIRXBUF Buffer Register TX FIFO Interrupt SPI INT FLAG SPISTS.1 State Control Master/Slave SPI Char SPICCR. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. SPISTE is driven low by the master for a slave device.6 Clock Phase SPICTL.2 SPISTE SPI Bit Rate LSPCLK 6 SPIBRR.0 3 2 1 0 M S M S SW3 Clock Polarity SPICCR.6 SPICTL. Figure 4-11. Serial Peripheral Interface Module Block Diagram (Slave Mode) 82 Peripherals Copyright © 2001–2011.ti.0 SPIFFOVF FLAG SPIFFRX.com Figure 4-11 is a block diagram of the SPI in slave mode. TMS320F2812 TMS320C2810.15 . SPIFFENA SPIFFTX.4 RX FIFO Interrupt Overrun INT ENA RX Interrupt Logic SPIINT/SPIRXINT To CPU SPITXINT 16 M S M S SW2 SW1 M S SPISIMO M S SPISOMI (A) SPIDAT Data Register SPIDAT.15 TX FIFO Registers SPITXBUF TX FIFO _15 ----TX FIFO _1 TX FIFO _0 16 SPITXBUF Buffer Register 16 TX Interrupt Logic SPI INT ENA Receiver Overrun Flag SPISTS.3 .7 SPICTL.6 .3 SPICTL. TMS320F2811.0 Talk SPICTL.0 5 4 3 2 1 0 SPICLK A. TMS320C2811. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .TMS320F2810.

The pins can be individually selected to operate as “Digital I/O” or connected to “Peripheral I/O” signals (via the GPxMUX registers). registers are provided to configure the pin direction (via the GPxDIR registers) and to qualify the input signal to remove unwanted noise (via the GPxQUAL) registers). TMS320C2812 www. Copyright © 2001–2011.8 GPIO MUX The GPIO Mux registers are used to select the operation of shared pins on the F281x and C281x devices. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 83 . TMS320C2811. TMS320F2812 TMS320C2810.ti. These registers are EALLOW protected. Table 4-11. This prevents spurious writes from overwriting the contents and corrupting the system. Not all inputs support input signal qualification. GPIO Mux Registers (1) (2) (3) NAME ADDRESS 0x00 70C0 0x00 70C1 0x00 70C2 0x00 70C3 0x00 70C4 0x00 70C5 0x00 70C6 0x00 70C7 0x00 70C8 0x00 70C9 0x00 70CA 0x00 70CB 0x00 70CC 0x00 70CD 0x00 70CE 0x00 70CF 0x00 70D0 0x00 70D1 0x00 70D2 0x00 70D3 0x00 70D4 0x00 70D5 0x00 70D6 0x00 70D7 0x00 70D8 0x00 70D9 0x00 70DA 0x00 70DB 0x00 70DC – 0x00 70DF SIZE (x16) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 4 GPIO G Mux Control Register GPIO G Direction Control Register GPIO F Mux Control Register GPIO F Direction Control Register GPIO E Mux Control Register GPIO E Direction Control Register GPIO E Input Qualification Control Register GPIO D Mux Control Register GPIO D Direction Control Register GPIO D Input Qualification Control Register GPIO B Mux Control Register GPIO B Direction Control Register GPIO B Input Qualification Control Register DESCRIPTION GPIO A Mux Control Register GPIO A Direction Control Register GPIO A Input Qualification Control Register GPAMUX GPADIR GPAQUAL Reserved GPBMUX GPBDIR GPBQUAL Reserved Reserved Reserved Reserved Reserved GPDMUX GPDDIR GPDQUAL Reserved GPEMUX GPEDIR GPEQUAL Reserved GPFMUX GPFDIR Reserved Reserved GPGMUX GPGDIR Reserved Reserved Reserved (1) (2) (3) Reserved locations return undefined values and writes are ignored.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 4. TMS320F2811.TMS320F2810. Table 4-11 lists the GPIO Mux Registers. If selected for “Digital I/O”mode.

The above registers will typically be accessed regularly by the user. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. GPIO Data Registers (1) (2) NAME GPADAT GPASET GPACLEAR GPATOGGLE GPBDAT GPBSET GPBCLEAR GPBTOGGLE Reserved Reserved Reserved Reserved GPDDAT GPDSET GPDCLEAR GPDTOGGLE GPEDAT GPESET GPECLEAR GPETOGGLE GPFDAT GPFSET GPFCLEAR GPFTOGGLE GPGDAT GPGSET GPGCLEAR GPGTOGGLE Reserved (1) (2) ADDRESS 0x00 70E0 0x00 70E1 0x00 70E2 0x00 70E3 0x00 70E4 0x00 70E5 0x00 70E6 0x00 70E7 0x00 70E8 0x00 70E9 0x00 70EA 0x00 70EB 0x00 70EC 0x00 70ED 0x00 70EE 0x00 70EF 0x00 70F0 0x00 70F1 0x00 70F2 0x00 70F3 0x00 70F4 0x00 70F5 0x00 70F6 0x00 70F7 0x00 70F8 0x00 70F9 0x00 70FA 0x00 70FB 0x00 70FC – 0x00 70FF SIZE (x16) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 4 GPIO D Data Register GPIO D Set Register GPIO D Clear Register GPIO D Toggle Register GPIO E Data Register GPIO E Set Register GPIO E Clear Register GPIO E Toggle Register GPIO F Data Register GPIO F Set Register GPIO F Clear Register GPIO F Toggle Register GPIO G Data Register GPIO G Set Register GPIO G Clear Register GPIO G Toggle Register GPIO A Set Register GPIO A Clear Register GPIO A Toggle Register GPIO B Data Register GPIO B Set Register GPIO B Clear Register GPIO B Toggle Register DESCRIPTION GPIO A Data Register Reserved locations will return undefined values and writes will be ignored. 84 Peripherals Copyright © 2001–2011.ti. For more information. These registers are NOT EALLOW protected.com If configured for ”Digital I/O” mode. TMS320C2811. for clearing individual I/O signals (via the GPxCLEAR registers). or for reading/writing to the individual I/O signals (via the GPxDAT registers). TMS320F2811. for toggling individual I/O signals (via the GPxTOGGLE registers). Table 4-12 lists the GPIO Data Registers. see the TMS320x281x DSP System Control and Interrupts Reference Guide (literature number SPRU078). Table 4-12. additional registers are provided for setting individual I/O signals (via the GPxSET registers). TMS320F2812 TMS320C2810.TMS320F2810. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .

if they are driven low (as GPIO pins) and bit EXTCONx. Therefore. the state of the pin can be read through the GPxDAT register. TMS320F2811. any GPIO signal present at the pin will be propagated to the peripheral module as well. This feature removes unwanted spikes from the input signal. In the peripheral mode. Figure 4-12. GPxDAT/SET/CLEAR/TOGGLE Register Bit(s) Digital I/O Peripheral I/O GPxQUAL Register GPxMUX Register Bit GPxDIR Register Bit HighImpedance Control 0 MUX 1 0 MUX 1 Input Qualification SYSCLKOUT High-Impedance Enable (1) XRS Internal (Pullup or Pulldown) PIN A. Some selected input signals are qualified by the SYSCLKOUT. The CxTRIP and TxCTRIP pins will also put the corresponding PWM pins in high impedance.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Figure 4-12 shows how the various register bits select the various modes of operation for GPIO function.5 (PDPINTx) will put PWM pins in a high-impedance state. In the GPIO mode. The sampling window is 6 samples wide and the output is only changed when all samples are the same (all 0's or all 1's).TMS320F2810. the corresponding peripheral functionality (and interrupt-generating capability) must be disabled.0 or GPDDAT. not the value at the pin. B. reading the GPxDAT data register only gives the value written.0 = 1. The GPxQUAL register specifies the qualification sampling period. when a pin is configured for GPIO operation. Copyright © 2001–2011. TMS320C2811. provided the corresponding direction bit is zero (input mode). interrupts may be inadvertently triggered. This is especially critical when the PDPINTA and PDPINTB pins are used as GPIO pins. Since the output buffer of a pin connects back to the input buffer. TMS320F2812 TMS320C2810. when the GPIO pin is configured for output operation. GPIO/Peripheral Pin Multiplexing NOTE The input function of the GPIO pin and the input path to the peripheral are always enabled. Texas Instruments Incorporated Peripherals Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 85 . TMS320C2812 www. Otherwise. since a value of zero for GPDDAT.ti. It is the output function of the GPIO pin that is multiplexed with the output path of the primary (peripheral) function.

" TMS devices and TMDS development-support tools have been characterized fully.and C281x-based applications: Software Development Tools • Code Composer Studio™ Integrated Development Environment (IDE) – C/C++ Compiler – Code generation tools – Assembler/Linker – Cycle Accurate Simulator • Application algorithms • Sample applications code Hardware Development Tools • 2812 eZdsp • JTAG-based emulators – SPI515.. generate code. TMS320F2812GHH).com 5 Development Support Texas Instruments ( TI™) offers an extensive line of development tools for the C28x™ generation of DSPs. XDS510 USB • Universal 5-V dc power supply • Documentation and cables 5. including tools to evaluate the performance of the processors. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).ti. Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. develop algorithm implementations. Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. TMP. 86 Development Support Copyright © 2001–2011. TI’s standard warranty applies. and the quality and reliability of the device have been demonstrated fully. or TMS (e. TMS320F2811. XDS510PP. Each TMS320 DSP commercial family member has one of three prefixes: TMX. and fully integrate and debug software and hardware modules. TMX TMP TMS Experimental device that is not necessarily representative of the final device’s electrical specifications Final silicon die that conforms to the device’s electrical specifications but has not completed quality and reliability verification Fully qualified production device Support tool development evolutionary flow: TMDX TMDS Development-support product that has not yet completed Texas Instruments internal qualification testing Fully qualified development-support product TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes. TI assigns prefixes to the part numbers of all TMS320™ DSP devices and support tools. TMS320F2812 TMS320C2810.TMS320F2810.1 Device and Development Support Tool Nomenclature To designate the stages in the product development cycle. XDS510PP Plus. The following products support development of F281x. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .g. TMS320C2811. Only qualified production devices are to be used.

with design specifications. Figure 5-1 provides a legend for reading the complete device name for any TMS320x281x family member. TMS320F2811. 28xxx DSP Peripheral Reference Guide (literature number SPRU566) for more information on types of peripherals. NO.9-V Core/3. TMS320x281x Device Nomenclature 5. A). and hardware and software applications.8-V/1. PBK) and temperature range (for example. The types of documentation available include: data sheets and data manuals. TMS320C2811. This suffix indicates the package type (for example. there may be minor differences between devices which do not affect the basic functionality of the module. BGA = Ball Grid Array LQFP = Low-Profile Quad Flatpack Figure 5-1. See the TMS320x28xx. Texas Instruments Incorporated Development Support Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 87 . TMS320C2812 www. TMS 320 PREFIX TMX = experimental device TMP = prototype device TMS = qualified device F 2810 PBK A TEMPERATURE RANGE A = −40°C to 85°C S = −40°C to 125°C Q = −40°C to 125°C (Q100 qualification) PACKAGE TYPE TM GHH = 179-ball MicroStar BGA ZHH = 179-ball MicroStar BGA (lead-free) PGF = 176-pin LQFP PBK = 128-pin LQFP DEVICE 2810 2811 2812 (A) DEVICE FAMILY TM 320 = TMS320 DSP Family TECHNOLOGY F = Flash EEPROM (1. TMS320F2812 TMS320C2810. Copyright © 2001–2011. TMS320x281x Peripheral Selection Guide PERIPHERAL LIT. Within a peripheral type.ti. Table 5-1 shows the peripheral reference guides appropriate for use with the devices in this data manual. 2810 x TMS320x281x DSP System Control and Interrupts TMS320x281x DSP External Interface (XINTF) TMS320x281x Enhanced Controller Area Network (eCAN) TMS320x281x DSP Event Manager (EV) TMS320x281x DSP Analog-to-Digital Converter (ADC) TMS320x281x DSP Multichannel Buffered Serial Port (McBSP) TMS320x281x Serial Communications Interface (SCI) TMS320x281x Serial Peripheral Interface TMS320x281x DSP Boot ROM (1) A type change represents a major functional feature difference in a peripheral module.8-V/1.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 TI device nomenclature also includes a suffix with the device family name. Table 5-1.9-V Core/3.3-V I/O) A. These device-specific differences are listed in the peripheral reference guides.TMS320F2810.3-V I/O) C = ROM (1.2 Documentation Support Extensive documentation supports all of the TMS320™ DSP family generations of devices from product announcement through applications development. SPRU078 SPRU067 SPRU074 SPRU065 SPRU060 SPRU061 SPRU051 SPRU059 SPRU095 TYPE (1) – 0 0 0 0 0 0 0 – 2812 x x x x x x x x x x x x x x x x 2811.

Cost-effective 3. TMS320x281x DSP System Control and Interrupts Reference Guide describes the various interrupts and system control features of the 281x digital signal processors (DSPs). and quadrature-encoder pulse (QEP) circuits. result registers. referred to as the wrapper in this document. The eCAN module implemented in the C28x DSP is compatible with the CAN 2. The analog circuits of this converter. The SCI modules support digital communications between the CPU and other asynchronous peripherals that use the standard non-return-to-zero (NRZ) format. interface to device peripheral bus. TMS320F2812 TMS320C2810. the eCAN module provides a versatile and robust serial communication interface. include programmable conversion sequencer. The module is a 12-bit pipelined ADC.com The following documents are available on the TI website (http://www.3V DSP for Digital Motor Control Application Report. 3. The application report first describes a scenario of a 3. TMS320x28xx. TMS320x281x DSP Event Manager (EV) Reference Guide describes the EV modules that provide a broad range of functions and features that are particularly useful in motion control and motor control applications.ti. The EV modules include general-purpose (GP) timers. TMS320x281x DSP Boot ROM Reference Guide describes the purpose and features of the bootloader (factory-programmed boot-loading software). The McBSPs allow direct interface between a DSP and other devices in a system. no significant issue of interfacing between 3.0B standard (active). Guidelines for component layout and printed circuit board (PCB) design that can reduce Copyright © 2001–2011. commonly known as a UART.3-V analog-to-digital converter (ADC) versus 5-V ADC is also discussed.3-V/5-V interfacing techniques are then discussed for the situations where such interfacing is needed. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.3 V and 5 V exists. voltage regulators. TMS320x281x DSP External Interface (XINTF) Reference Guide describes the external interface (XINTF) of the 281x digital signal processors (DSPs). It also describes emulation features available on these DSPs. TMS320C2811. On-chip 3. TMS320x281x Enhanced Controller Area Network (eCAN) Reference Guide describes the eCAN that uses established protocol to communicate serially with other controllers in electrically noisy environments.3-V-only motor controller indicating that for most applications. Texas Instruments Incorporated SPRU060 SPRU095 SPRU065 SPRU067 SPRU061 SPRU078 SPRU074 SPRU566 SPRU051 SPRU059 SPRA550 88 Development Support Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320x281x Serial Communications Interface (SCI) Reference Guide describes the SCI that is a two-wire asynchronous serial port. interface to analog circuits. full-compare/PWM units. It also describes other contents of the device on-chip boot ROM and identifies where all of the information is located within that memory. Digital circuits. With 32 fully configurable mailboxes and time-stamping feature. sample-and-hold (S/H) circuits. TMS320F2811.ti. 28xxx DSP Peripheral Reference Guide describes the peripheral reference guides of the 28x digital signal processors (DSPs). referred to as the core in this document. capture units. include the front-end analog multiplexers (MUXs). TMS320x281x Serial Peripheral Interface Reference Guide describes the SPI—a high-speed synchronous serial input/output (I/O) port that allows a serial bit stream of programmed length (one to sixteen bits) to be shifted into and out of the device at a programmed bit-transfer rate. and interface to other on-chip modules. TMS320x281x DSP Multichannel Buffered Serial Port (McBSP) Reference Guide describes the McBSP available on the 281x devices.TMS320F2810. The SPI is used for communications between the DSP controller and external peripherals or another controller.com): SPRU430 TMS320C28x CPU and Instruction Set Reference Guide describes the central processing unit (CPU) and the assembly language instructions of the TMS320C28x™ fixed-point digital signal processors (DSPs). and other analog supporting circuits. the conversion core. TMS320x281x DSP Analog-to-Digital Converter (ADC) Reference Guide describes the ADC module.

TMS320C28x DSP/BIOS 5.com/sc/docs/pic/home. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. The objective is to help you come up to speed quickly in programming the eCAN. contact the Product Information Center listed at the http://www. TMS320F2811. macros. Copyright © 2001–2011. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.3 Community Resources The following links connect to TI community resources. TMS320F2811. Linked contents are provided "AS IS" by the respective contributors. All projects and CANalyzer configuration files are included in the spra876. At e2e. They do not constitute TI specifications and do not necessarily reflect TI's views. TMS320C2810.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 system noise and EMI effects are summarized in the last section. you can ask questions. Details on Signal Processing. and F2812 ADC Calibration Application Report describes a method for improving the absolute accuracy of the 12-bit analog-to-digital converter (ADC) found on the F2810/F2811/F2812 devices.ti. The methods described in this application note can improve the absolute accuracy of the ADC to achieve levels better than 0. available within the Code Composer Studio for TMS320C2000™ IDE. The CANalyzer tool from Vector CANtech. that simulates the instruction set of the C28x core. All programs have been extensively commented to aid easy understanding. The TMS320™ DSP newsletter. the absolute accuracy of the ADC is impacted. spra989. Texas Instruments Incorporated Development Support Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 89 . This application note is accompanied by an example program (ADCcalibration. is published quarterly and distributed to update TMS320™ DSP customers on product information.zip) that executes from RAM on the F2812 eZdsp. F2811. This compiler accepts ANSI standard C/C++ source code and produces TMS320™ DSP assembly language source code for the TMS320C28x device. Inc. To send comments regarding this TMS320F2810. TMS320C28x Optimizing C/C++ Compiler v5. Updated information on the TMS320™ DSP controllers can be found on the worldwide web at: http://www. see TI's Terms of Use. Programming Examples for the TMS320F281x eCAN Application Report contains several programming examples to illustrate how the eCAN module is set up for different modes of operation. click on the Submit Documentation Feedback link at the bottom of the page. Created to foster collaboration among engineers. explore ideas and help solve problems with fellow engineers.ti.TMS320F2810.com. TMS320C28x Assembly Language Tools v5. SPRU625 SPRU513 SPRU514 SPRA876 SPRA989 A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal processing research and education.5%. Due to inherent gain and offset errors. TMS320C2811. 5. assembler directives.com.zip file. TMS320C2811. TMS320C2812 www.ti.ti. F2810.0 User’s Guide describes the TMS320C28x™ C/C++ compiler. SPRU608 TMS320C28x Instruction Set Simulator Technical Overview describes the simulator.0 User’s Guide describes the assembly language tools (assembler and other tools used to develop assembly language code). common object file format. and symbolic debugging directives for the TMS320C28x™ device. was used to monitor and control the bus operation.TMS320C2812 Digital Signal Processors Data Manual (literature number SPRS174). For questions and support.htm site. TMS320F2812 TMS320C2810. TMS320F2812.x Application Programming Interface (API) Reference Guide describes development using DSP/BIOS™. TI E2E Community TI's Engineer-to-Engineer (E2E) Community. share knowledge.

3 1.com 6 Electrical Specifications This section provides the absolute maximum ratings and the recommended operating conditions for the TMS320F281x and TMS320C281x DSPs.TMS320F2810.3 V to 4.8 1. ZHH.9 0 3. VDDAIO. XCLKOUT. and functional operation of the device at these or any other conditions beyond those indicated under Section 6. These are stress ratings only. 6. VO Input clamp current. IOK (VO < 0 or VO > VDDIO) Operating ambient temperature ranges. T1CTRIP_PDPINTA.8 V (135 MHz) 1. and EMU1. VDDA1. TJ Storage temperature range.8 for power sequencing of VDDIO.5 V to 2. All voltage values are with respect to VSS.81 NOM 3. AVDDREFBG.89 2 UNIT V V V V VDD. 90 Electrical Specifications Copyright © 2001–2011.6 V –0.47 MAX 3. VIN Output voltage range. TMS320F2812 TMS320C2810. VDDAIO VDD3VFL fSYSCLKOUT VIH VIL IOH IOL TA Flash programming supply voltage Device clock frequency (system clock) High-level input voltage Low-level input voltage High-level output source current. PBK) (3) (3) Supply voltage range (VDDIO.14 2 2 2 0. TMS320F2811. Group 2 pins are as follows: XINTF pins.2. TDO.ti. VDD1 VSS VDDA1. PBK) Q version (PGF.8 0.7VDD 3. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. VDDA2. 6. I/O Device supply voltage.71 1.9 V ± 5% VDD = 1.9 V (150 MHz) 3. the list of absolute maximum ratings are specified over operating temperature ranges.47 150 135 VDDIO VDD 0. VDDA1/VDDA2/AVDDREFBG.3VDD –4 –8 4 8 V MHz V V mA mA –40 –40 –40 85 125 125 °C (1) (2) See Section 6. VDD. VOL = VOL MAX Ambient temperature A version S version Q version VDD = 1. and VDD3VFL. VDDAIO.47 1. see the IC Package Thermal Metrics Application Report (literature number SPRA953) and the Reliability Data for TMS320LF24xx and TMS320F28xx Devices Application Report (literature number SPRA963). VDD3VFL. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.4 V Low-level output sink current. Tstg (3) (1) –40°C to 85°C –40°C to 125°C –40°C to 125°C –40°C to 150°C –65°C to 150°C (2) (3) Unless otherwise noted. ZHH.6 V –0.3 V to 4.3 V to 4. VOH = 2. PGF. CPU Supply ground ADC supply voltage 3. EMU0.6 V ±20 mA ±20 mA A version (GHH. VDD1) Input voltage range. Continuous clamp current per pin is ±2 mA Long-term high-temperature storage and/or extended use at maximum temperature conditions may result in a reduction of overall device life. For additional information. TA S version (GHH.5 V –0. and AVDDREFBG) Supply voltage range (VDD.14 1. IIK (VIN < 0 or VIN > VDDIO) (2) Output clamp current. is not implied.2 VDDIO Recommended Operating Conditions (1) MIN Device supply voltage. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . Recommended Operating Conditions. TMS320C2811.1 Absolute Maximum Ratings (1) –0.8 V ± 5% All inputs except X1/XCLKIN X1/XCLKIN (@ 50 µA max) All inputs except X1/XCLKIN X1/XCLKIN (@ 50 µA max) All I/Os except Group 2 Group 2 (2) All I/Os except Group 2 Group 2 (2) 3. PGF.14 1. VDDA2. PBK) (3) Junction temperature range. XF.3 3.3 3.

VIN = 0 V VDDIO = 3. TMS320C2811. high-impedance state (off-state) Input capacitance Output capacitance Applicable to C281x devices Applicable to F281x devices The following pins have no internal PU/PD: GPIOE0. VIN = 0 V All I/Os (including XRS) except EVB GPIOB/EVB With pulldown VDDIO = 3.3 V. and TRST.3 V. VIN = 0 V VDDIO = 3.3 V.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. GPIOF1. The following pins have an internal pulldown: XMP/MC. TMS320F2812 TMS320C2810. GPIOF0. GPIOF2. VIN = VDD VDDIO = 3. TMS320C2812 www.TMS320F2810. TESTSEL.3 V.2 TYP MAX UNIT V VOH VOL IIL (1) IIL (2) High-level output voltage Low-level output voltage Input current (low level) Input current (low level) With pullup With pulldown With pullup 0. Copyright © 2001–2011. VIN = 0 V VDDIO = 3.3 Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) PARAMETER TEST CONDITIONS IOH = IOH MAX IOH = 50 µA IOL = IOL MAX VDDIO = 3. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 91 .3 V. GPIOG4.4 VDDIO – 0.3 V.ti. and GPIOG5. GPIOE1.4 –80 –80 –13 –140 –140 –25 –190 ±2 –190 –35 ±2 ±2 80 ±2 V µA µA IIH IOZ Ci Co (1) (2) (3) (4) Input current (high level) With pullup With pulldown (4) µA µA pF pF Leakage current (for pins without internal PU/PD). VIN = VDD VO = VDDIO or 0 V 2 3 28 50 (3) MIN 2. TMS320F2811. GPIOF12. GPIOF3.

and MAX voltage (VDD = 1.8-V rail (VDD).ti. IDDA includes current into VDDA1. 92 Electrical Specifications Copyright © 2001–2011. IDD represents the total current drawn from the 1.89 V. AVDDREFBG. and VDDAIO pins. TMS320F2812 TMS320C2810. VDDA = 3. MAX numbers are at 125°C. It includes a small amount of current (<1 mA) drawn by VDD1. All PWM pins are toggled at 100 kHz. TMS320F281x Current Consumption by Power-Supply Pins Over Recommended Operating Conditions During Low-Power Modes at 150-MHz SYSCLKOUT MODE TEST CONDITIONS All peripheral clocks are enabled. • • • • • • • • • • (1) (2) (3) (4) Flash is powered down XCLKOUT is turned off All peripheral clocks are on. Data is continuously transmitted out of the SCIA. VDDA2.TMS320F2810.47 V). TMS320F2811.com 6. SCIB. and CAN ports. TMS320C2811. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. VDDIO. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . The hardware multiplier is exercised. except ADC Flash is powered down Peripheral clocks are turned off Pins without an internal PU/PD are tied high/low Flash is powered down Peripheral clocks are turned off Pins without an internal PU/PD are tied high/low Input clock is disabled IDD TYP MAX (3) IDDIO (1) TYP MAX (3) IDD3VFL TYP MAX (3) IDDA (2) TYP MAX (3) Operational 195 mA (4) 230 mA 15 mA 30 mA 40 mA 45 mA 40 mA 50 mA IDLE 125 mA 150 mA 5 mA 10 mA 2 µA 4 µA 1 µA 20 µA STANDBY 5 mA 10 mA 5 µA 20 µA 2 µA 4 µA 1 µA 20 µA HALT 70 µA 5 µA 20 µA 2 µA 4 µA 1 µA 20 µA IDDIO current is dependent on the electrical loading on the I/O pins. Code is running out of flash with 5 wait-states. VDD3VFL. NOTE HALT and STANDBY modes cannot be used when the PLL is disabled.4 Current Consumption Table 6-1.

8-V rail (VDD). It includes a small amount of current (<1 mA) drawn by VDD1. TMS320C281x Current Consumption by Power-Supply Pins Over Recommended Operating Conditions During Low-Power Modes at 150-MHz SYSCLKOUT MODE TEST CONDITIONS All peripheral clocks are enabled. Code is running out of ROM with 5 wait-states. Copyright © 2001–2011.47 V). Data is continuously transmitted out of the SCIA.TMS320F2810. IDDA includes current into VDDA1.89 V. except ADC Peripheral clocks are turned off Pins without an internal PU/PD are tied high/low Peripheral clocks are turned off Pins without an internal PU/PD are tied high/low Input clock is disabled IDD TYP MAX (3) IDDIO (1) TYP MAX (3) IDDA (2) TYP MAX (3) Operational 210 mA (4) 260 mA 20 mA 30 mA 40 mA 50 mA IDLE 140 mA 165 mA 20 mA 30 mA 5 µA 10 µA STANDBY 5 mA 10 mA 5 µA 20 µA 5 µA 10 µA HALT 70 µA 5 µA 10 µA 1 µA IDDIO current is dependent on the electrical loading on the I/O pins. MAX numbers are at 125°C. VDDA = 3. and MAX voltage (VDD = 1.ti. TMS320C2812 www. TMS320C2811. TMS320F2812 TMS320C2810. and CAN ports. AVDDREFBG. VDD3VFL. TMS320F2811. VDDIO. The hardware multiplier is exercised. and VDDAIO pins. SCIB. All PWM pins are toggled at 100 kHz. • • • • • • • (1) (2) (3) (4) XCLKOUT is turned off All peripheral clocks are on.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 6-2. IDD represents the total current drawn from the 1. VDDA2. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 93 .

5 Current Consumption Graphs 250 200 Current (mA) 150 100 50 0 0 20 40 60 80 SYSCLKOUT (MHz) 100 120 140 160 IDD IDDIO IDD3VFL IDDA Total 3. TMS320C2811. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . It includes a small amount of current (<1 mA) drawn by VDDAIO. IDD represents the total current drawn from the 1. Test conditions are as defined in Table 6-1 for operational currents.com 6. IDD3VFL.3-V current is the sum of IDDIO. B. F2812/F2811/F2810 Typical Power Consumption Over Frequency 94 Electrical Specifications Copyright © 2001–2011. TMS320F2812 TMS320C2810. and IDDA. C. It includes a small amount of current (<1 mA) drawn by VDD1. IDDA represents the current drawn by VDDA1 and VDDA2 rails. Figure 6-1. F2812/F2811/F2810 Typical Current Consumption Over Frequency 700 600 500 Power (mW) 400 300 200 100 0 0 20 40 60 80 SYSCLKOUT (MHz) 100 120 140 160 Total Power Figure 6-2. D.TMS320F2810.8-V rail (VDD). Total 3. TMS320F2811. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.3-V current A.ti.

TMS320F2811.ti. IDD represents the total current drawn from the 1.3-V current A. Total 3. It includes a small amount of current (<1 mA) drawn by VDD1. C2812/C2811/C2810 Typical Power Consumption Over Frequency Copyright © 2001–2011. C. Test conditions are as defined in Table 6-2 for operational currents. C2812/C2811/C2810 Typical Current Consumption Over Frequency 600 500 400 Power (mW) 300 200 100 0 0 20 40 60 80 SYSCLKOUT (MHz) 100 120 140 160 Total Power Figure 6-4.8-V rail (VDD). TMS320F2812 TMS320C2810. It includes a small amount of current (<1 mA) drawn by VDDAIO.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 250 200 Current (mA) 150 100 50 0 0 20 40 60 80 SYSCLKOUT (MHz) 100 120 140 160 IDD IDDIO IDDA Total 3. D. IDDA represents the current drawn by VDDA1 and VDDA2 rails.3-V current is the sum of IDDIO and IDDA. B.TMS320F2810. TMS320C2812 www. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 95 . TMS320C2811. Figure 6-3.

6 Reducing Current Consumption 28x DSPs incorporate a unique method to reduce the device current consumption.TMS320F2810. Table 6-3 indicates the typical reduction in current consumption achieved by turning off the clocks to various peripherals. Turning off the clock to the ADC module results in the elimination of the current drawn by the analog portion of the ADC (IDDA) as well. no-buffering situation. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . see the pin description section. 6. A reduction in current consumption can be achieved by turning off the clock to any peripheral module which is not used in a given application. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. buffering is typically not needed. the emulation signals must be buffered. This number represents the current drawn by the digital portion of the ADC module. Figure 6-5 shows the simpler. Writing to/reading from peripheral registers is possible only after the peripheral clocks are turned on. If the distance is less than 6 inches. For the pullup/pulldown resistor values.7 Emulator Connection Without Signal Buffering for the DSP Figure 6-5 shows the connection between the DSP and JTAG header for a single-processor configuration. TMS320C2811.ti. Table 6-3. TMS320F2812 TMS320C2810. Typical Current Consumption by Various Peripherals (at 150 MHz) (1) PERIPHERAL MODULE eCAN EVA EVB ADC SCI SPI McBSP (1) (2) IDD CURRENT REDUCTION (mA) 12 6 6 8 (2) 4 5 13 All peripheral clocks are disabled upon reset.com 6. 6 inches or less VDDIO VDDIO EMU0 EMU1 TRST TMS TDI TDO TCK DSP 13 14 2 1 3 7 11 9 EMU0 EMU1 TRST TMS TDI TDO TCK TCK_RET JTAG Header PD 5 GND GND GND GND GND 4 6 8 10 12 Figure 6-5. If the distance between the JTAG header and the DSP is greater than 6 inches. TMS320F2811. Emulator Connection Without Signal Buffering for the DSP 96 Electrical Specifications Copyright © 2001–2011.

TMS320C2812 www.ti. minimum) before the VDD supply reaches 1. Option 2 is the recommended approach. C281x can also be used on boards that have F281x power sequencing implemented. the GPIO pins are undefined until the 1.9 V). 1. Flash.spectrumdigital.9-V and 3.com for F2812 eZdsp™ schematics and updates.9-V) rail lags the 3. 3.3-V and 1. The current F2812 silicon reference schematics (Spectrum Digital Incorporated eZdsp board) suggests two options for the power sequencing circuit. and the I/Os. ADC. an external power sequencing circuit enables VDDIO first. LDO regulators that facilitate power-sequencing (with the aid of additional external components) may be used to meet the power sequencing requirement. Table 6-4. TMS320C2811.5 V.5 V.TMS320F2810. ROM.9-V) can ramp together.3-V) to power up the CPU.9 V) (VDD/VDD1) supply pins. VDD3VFL.8 V (or 1. Recommended “Low-Dropout Regulators” SUPPLIER Texas Instruments PART NUMBER TPS767D301 NOTE The GPIO pins are undefined until VDD = 1 V and VDDIO = 2. In other words. TMS320F2811. VDDA1/VDDA2/VDDAIO/AVDDREFBG) and then ramp 1. See www. To ensure the correct reset state for all modules during power up.8 V (or 1. While option 1 is still valid. however. It is recommended that the device reset control from “Low-Dropout (LDO)” regulators or voltage supervisors be used to meet this constraint.3 V until VDDIO has reached 2. This ensures the reset signal from the I/O pin has propagated through the I/O buffer to provide power-on reset to all the modules inside the device. This will help to keep on-chip flash logic in reset prior to the VDDIO/VDD power supplies ramping down. • Power-Down Sequencing: During power-down.3-V supply pins (VDDIO. • Option 2: Enable power to all 3. there are some requirements to be met while powering up/powering down the device.8-V or 1.8-V (or 1.8 V or 1. then VDD and VDD1 (1.8 Power Sequencing Requirements TMS320F2812/F2811/F2810 silicon requires dual voltages (1. • Option 1: In this approach.9 V (VDD/VDD1) should not reach 0. After 1.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6.8-V rail reaches at least 1 V.5 V.3 V for Flash (VDD3VFL) and ADC (VDDA1/VDDA2/AVDDREFBG) modules are ramped up. Copyright © 2001–2011.8 V or 1.9 V) ramps. the device reset should be asserted low (8 µs. TI has simplified the requirement. TMS320F2812 TMS320C2810. Power sequencing is not needed for C281x devices. See Figure 6-11 for power-on reset timing.3-V rail. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 97 .8-V (or 1. if the 1. the 3.

5 V).8-V (or 1. Power-on Reset in Microcomputer Mode (XMP/MC = 0).com 2.3V (A) <10 ms 1.5 V. E.8-V (or 1. TMS320F2811. VDDA1. TMS320F2812 TMS320C2810. Reset (XRS) should remain low until supplies and clocks are stable.3 V VDD_3. for minimum requirements.8V (B) 1.5 V (C) (E) 3. Keeping reset low (XRS) at least 8 µs prior to the 1. F2812/F2811/F2810 Typical Power-Up and Power-Down Sequence – Option 2 98 Electrical Specifications Copyright © 2001–2011. C.3-V rail has been fully powered up.5 V >1 ms (D) >8 s XRS (F) XRS Power-Up Sequence Power-Down Sequence A.3-V supply is off regulation.3 V 3. See Figure 6-11.8 V (or 1.8V – VDD. VDD3VFL. this supply should be ramped as quickly as possible (after the 3. TMS320C2811. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . VDDA2. no pin should be driven before the 3.ti.5 V will keep the flash module in complete reset before the supplies ramp down.9-V) supply reaches 1. F.3-V supply reaches at least 2.5 V. this occurs a few milliseconds before the 1. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Other than the power supply pins.9 V) 1.9-V) supply reaches at least 1 V. G. D. AVDDREFBG VDD_1.3V – VDDIO. Voltage supervisor or LDO reset control will trip reset (XRS) first when the 3.8 V (or 1.TMS320F2810.9-V) supply reaching 1. VDD1 1. H. VDDAIO.9-V) supply should ramp after the 3. Figure 6-6.8-V (or 1. VDD_3. B. Since the state of GPIO pins is undefined until the 1.9 V) VDD_1. Typically.8-V (or 1.3-V supply reaches at least 2.

TMS320F2810. Output Levels Output transition times are specified as follows: • For a high-to-low transition.9 Signal Transition Levels Note that some of the signals use different reference voltages.4 V (VOL) Figure 6-7. Copyright © 2001–2011.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. the level at which the input is said to be no longer high is below VIH(MIN) and the level at which the input is said to be low is VIL(MAX) and lower.ti. TMS320C2812 www. the level at which the output is said to be no longer low is above VOL(MAX) and the level at which the output is said to be high is VOH(MIN) and higher. 2. Figure 6-8 shows the input levels. TMS320F2812 TMS320C2810. Output levels are driven to a minimum logic-high level of 2. see the recommended operating conditions table.4 V (VOH) 0. NOTE See the individual timing diagrams for levels used for testing timing parameters. TMS320F2811. • For a low-to-high transition. the level at which the input is said to be no longer low is above VIL(MAX) and the level at which the input is said to be high is VIH(MIN) and higher.0 V (VIH) 0. Figure 6-7 shows output levels.8 V (VIL) Figure 6-8. • For a low-to-high transition on an input signal.4 V. Input Levels Input transition times are specified as follows: • For a high-to-low transition on an input signal. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 99 . the level at which the output is said to be no longer high is below VOH(MIN) and the level at which the output is said to be low is VOL(MAX) and lower. TMS320C2811. 2.4 V and to a maximum logic-low level of 0.

The data sheet provides timing at the device pin. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect. TMS320F2811. TMS320F2812 TMS320C2810.ti. 3. or don't care level High impedance 6. For output timing analysis. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from the data sheet timing. see the appropriate cycle description section of this document. Figure 6-9. For actual cycle examples.com 6.5 nH Transmission Line Z0 = 50 W (A) Output Under Test Device Pin (A) 4. TMS320C2811.0 pF 1. the tester pin electronics and its transmission line effects must be taken into account.10 Timing Parameter Symbology Timing parameter symbols used are created in accordance with JEDEC Standard 100. The transmission line is intended as a load only. Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.TMS320F2810. The signal combinations shown in the following timing diagrams may not necessarily represent actual cycles. Tester Pin Electronics Data Sheet Timing Reference Point 42 W 3. 6.85 pF A.11 General Notes on Timing Parameters All output signals from the 28x devices (including XCLKOUT) are derived from an internal clock such that all output transitions for a given half-cycle occur with a minimum of skewing relative to each other. changing.12 Test Load Circuit This test load circuit is used to measure all switching characteristics provided in this document.3-V Test Load Circuit 100 Electrical Specifications Copyright © 2001–2011. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. some of the pin names and other related terminology have been abbreviated as follows: Lowercase subscripts and their meanings: a c d f h r su t v w access time cycle time (period) delay time fall time hold time rise time setup time transition time valid time pulse duration (width) Letters and symbols and their meanings: H L V X Z High Low Valid Unknown. To shorten the symbols. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .

Table 6-5. TMS320F281x and TMS320C281x Clock Table and Nomenclature MIN On chip oscillator clock XCLKIN SYSCLKOUT XCLKOUT HSPCLK LSPCLK ADC clock SPI clock McBSP XTIMCLK (1) (2) tc(OSC).5 (1) This is the default reset value if SYSCLKOUT = 150 MHz.5 6.67 150 50 20 50 20 40 25 13. Cycle time Frequency tc(HCO). Cycle time Frequency tc(CI). ADCCLK = SYSCLKOUT is not a valid mode for any value of SYSCLKOUT.ti. Cycle time Frequency tc(XCO).67 13. Cycle time (2) Frequency tc(SPC). Cycle time Frequency tc(ADCCLK).67 0. TMS320F2811.67 4 6.6 20 6. TMS320F2812 TMS320C2810.67 2 6. TMS320C2811.3 28. Cycle time Frequency tc(LCO). Cycle time Frequency tc(XTIM). Cycle time Frequency 6. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 101 . Copyright © 2001–2011. Table 6-5 lists the cycle times of various clocks. TMS320C2812 www.3 (1) 75 (1) NOM MAX 50 35 250 150 500 150 2000 150 150 75 UNIT ns MHz ns MHz ns MHz ns MHz ns MHz ns MHz ns MHz ns MHz ns MHz ns MHz 26.13 Device Clock Table This section provides the timing requirements and switching characteristics for the various clock options available on the F281x and C281x DSPs.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. ADCCLK has to be SYSCLKOUT/2 or lower. Cycle time Frequency tc(CKG).TMS320F2810.6 (1) 37. Cycle time Frequency tc(SCO). For SYSCLKOUT values of 25 MHz or lower. The maximum value for ADCCLK frequency is 25 MHz.

XCLKIN Fall time. XCLKIN Timing Requirements – PLL Bypassed or Enabled NO. XCLKIN Timing Requirements – PLL Disabled NO. TMS320F2812 TMS320C2810. The PLL itself is bypassed. XCLKIN Fall time. The /2 module in the PLL block now divides the output of the PLL by two before feeding it to the CPU. C8 C9 C10 C11 C12 tc(CI) tf(CI) tr(CI) tw(CIL) tw(CIH) Cycle time. SYSCLKOUT XCLKIN PLL Bypassed PLL Enabled XCLKIN/2 (XCLKIN * n) / 2 102 Electrical Specifications Copyright © 2001–2011. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.1 Input Clock Requirements The clock provided at the XCLKIN pin generates the internal CPU clock cycle. X1/XCLKIN high as a percentage of tc(CI) 40 40 MIN 6. X1/XCLKIN low as a percentage of tc(CI) Pulse duration. Possible PLL Configuration Modes PLL MODE PLL Disabled REMARKS Invoked by tying XPLLDIS pin low upon reset. XCLKIN Rise time.14 Clock Requirements and Characteristics 6. X1/XCLKIN low as a percentage of tc(CI) Pulse duration. XCLKIN Pulse duration. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . Input Clock Frequency PARAMETER Resonator fx Input clock frequency Crystal XCLKIN fl Limp mode clock frequency Without PLL With PLL MIN 20 20 4 5 2 TYP MAX 35 35 150 100 MHz MHz UNIT Table 6-7. However. XCLKIN Rise time. TMS320F2811. Default PLL configuration upon power-up. Achieved by writing a non-zero value “n” into PLLCR register. if PLL is not disabled. PLL block is completely disabled.ti.com 6. X1/XCLKIN high as a percentage of tc(CI) Up to 30 MHz 30 MHz to 150 MHz Up to 30 MHz 30 MHz to 150 MHz XCLKIN ≤ 120 MHz 120 < XCLKIN ≤ 150 MHz XCLKIN ≤ 120 MHz 120 < XCLKIN ≤ 150 MHz 40 45 40 45 MIN 6. XCLKIN Pulse duration.67 MAX 250 6 6 60 60 UNIT ns ns ns % % Table 6-8. C8 C9 C10 C11 C12 tc(CI) tf(CI) tr(CI) tw(CIL) tw(CIH) Cycle time.67 MAX 250 6 2 6 2 60 55 60 55 % % ns UNIT ns ns Table 6-9. the /2 module in the PLL block divides the clock input at the X1/XCLKIN pin by two before feeding it to the CPU.14. TMS320C2811. Table 6-6. Clock input to the CPU (CLKIN) is directly derived from the clock signal present at the X1/XCLKIN pin.TMS320F2810.

TMS320F2812 TMS320C2810. H = 0. this timing requirement includes the wakeup time for flash. C1 C3 C4 C5 C6 C7 (1) (2) (3) (4) tc(XCO) tf(XCO) tr(XCO) tw(XCOL) tw(XCOH) tp PARAMETER Cycle time.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. B. The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen.ti.15 Reset Timing Table 6-11. XCLKOUT Rise time.5 V.TMS320F2810. C10 C8 XCLKIN (A) C9 C1 C3 C4 C6 C5 XCLKOUT (A)(B) A. address/data valid after XRS high Oscillator start-up time Setup time for XPLLDIS pin Hold time for XPLLDIS pin Hold time for XMP/MC pin Hold time for boot-mode pins 1 16tc(CI) 16tc(CI) 16tc(CI) 2520tc(CI) (3) NOM MAX UNIT cycles cycles 8tc(CI) Warm reset 8tc(CI) 512tc(CI) 32tc(CI) 10 cycles cycles ms cycles cycles cycles cycles If external oscillator/clock source are used. See the TMS320x281x DSP Boot ROM Reference Guide (literature number SPRU095) and the TMS320x281x DSP System Control and Interrupts Reference Guide (literature number SPRU078) for further information. XCLKOUT low Pulse duration. Dependent on crystal/resonator and board design. reset pulse generated by watchdog Delay time.2 Output Clock Characteristics Table 6-10. XCLKOUT Pulse duration. This parameter has changed from 4096 XCLKIN cycles in the earlier revisions of the silicon. TMS320F2811. XCLKOUT configured to reflect SYSCLKOUT. XCLKOUT Fall time. Figure 6-10. TMS320C2812 www. XCLKOUT high PLL lock time (4) H–2 H–2 MIN 6. Reset (XRS) Timing Requirements (1) MIN tw(RSL1) tw(RSL2) tw(WDRS) td(EX) tOSCST (2) tsu(XPLLDIS) th(XPLLDIS) th(XMP/MC) th(boot-mode) (1) (2) (3) Pulse duration. TMS320C2811. The boot ROM reads the password locations.5tc(XCO) The PLL must be used for maximum frequency operation.67 (3) TYP 2 2 MAX UNIT ns ns ns H+2 H+2 131072tc(CI) ns ns ns A load of 40 pF is assumed for these parameters. reset time has to be low at least for 1 ms after VDD reaches 1. XCLKOUT Switching Characteristics (PLL Bypassed or Enabled) (1) (2) NO. stable XCLKIN to XRS high Pulse duration. XRS low Pulse duration. Copyright © 2001–2011. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 103 .14. Clock Timing 6. Therefore. The waveform relationship shown in Figure 6-10 is intended to illustrate the timing parameters only and may differ based on configuration.

If Boot ROM code executes after power-on conditions (in debugger environment). they could be input or output) until the 1.9-V) supply reaches at least 1 V and 3. This explains why XCLKOUT = XCLKIN/8 during this phase.8 V (or 1. Internal Boot-ROM Code Execution Phase Address/ Data/ Control td(EX) tsu(XPLLDIS) XPLLDIS Sampling XF/XPLLDIS (Don’t Care) th(XMP/MC) XMP/MC th(boot-mode) Boot-Mode Pins (D) I/O Pins GPIO Pins as Input Boot-ROM Execution Starts GPIO Pins as Input (State Depends on Internal PU/PD) User-Code Dependent Peripheral/GPIO Function Based on Boot Code (C) User-Code Execution Phase User-Code Dependent th(XPLLDIS) GPIOF14 (Don’t Care) User-Code Dependent A. VDDAIO (3.TMS320F2810. C. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320F2811. the Boot ROM code executes instructions for 1260 SYSCLKOUT cycles (SYSCLKOUT = XCLKIN/2) and then samples BOOT Mode pins.9 V)] 0.3 V) VDD. VDD1 [1.com VDDIO. VDDAn – VDDA1/VDDA2 and AVDDREFBG Upon power up.e. Power-on Reset in Microcomputer Mode (XMP/MC = 0) (See Note D) 104 Electrical Specifications Copyright © 2001–2011. SYSCLKOUT is XCLKIN/2 if the PLL is enabled. Figure 6-11. The SYSCLKOUT will be based on user environment and could be with or without PLL enabled.8-V (or 1. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. VDD3VFL VDDAn . Based on the status of the Boot Mode pin. D. TMS320C2811. TMS320F2812 TMS320C2810.. The BOOT Mode pins should be held high/low for at least 2520 XCLKIN cycles from boot ROM execution time for proper selection of Boot modes. the Boot code execution time is based on the current SYSCLKOUT speed.3 V (A) 2. the boot code branches to destination memory or boot code function in ROM.5 V.3-V supply reaches 2. B. SYSCLKOUT is further divided by 4 before it appears at XCLKOUT. After reset. The state of the GPIO pins is undefined (i.ti. Since both the XTIMCLK and CLKMODE bits in the XINTCNF2 register come up with a reset state of 1.5 V XCLKIN X1 XCLKOUT XCLKIN/8 (B) User-Code Dependent tOSCST XRS tw(RSL1) Address/Data Valid.

3-V supply reaches 2. SYSCLKOUT is XCLKIN/2 if the PLL is enabled.8-V (or 1. B.ti.8 V (or 1.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 VDDIO. TMS320F2812 TMS320C2810. Since both the XTIMCLK and CLKMODE bits in the XINTCNF2 register come up with a reset state of 1.9-V) supply reaches at least 1 V and 3.e. TMS320F2811.3 V) VDD. TMS320C2812 www. Upon power up. they could be input or output) until the 1. Figure 6-12. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 105 .3 V X1 tOSCST XCLKOUT XCLKIN/8 (A) User-Code Dependent XRS Address/ Data/ Control XF/XPLLDIS tw(RSL) td(EX) (Don’t Care) XPLLDIS Sampling (Don’t Care) tsu(XPLLDIS) th(XPLLDIS) GPIOF14/XF (User-Code Dependent) Address/Data/Control Valid Execution Begins From External Boot Address 0x3FFFC0 XMP/MC th(XMP/MC) (Don’t Care) I/O Pins (B) User-Code Dependent Input Configuration (State Depends on Internal PU/PD) A. The state of the GPIO pins is undefined (i.9 V)] XCLKIN 2. TMS320C2811. This explains why XCLKOUT = XCLKIN/8 during this phase. VDD1 [1.5 V.5 V 0. Power-on Reset in Microprocessor Mode (XMP/MC = 1) Copyright © 2001–2011. SYSCLKOUT is further divided by 4 before it appears at XCLKOUT. VDDAIO (3. VDD3VFL VDDAn..TMS320F2810.

Effect of Writing Into PLLCR Register 106 Electrical Specifications Copyright © 2001–2011. TMS320F2811. tp) is 131 072 XCLKIN Cycles Long.TMS320F2810. Figure 6-13. The BOOT Mode pins should be held high/low for at least 2520 XCLKIN cycles from boot ROM execution time for proper selection of Boot modes. This Period (PLL Lock-up Time. TMS320C2811. Based on the status of the Boot Mode pin.ti. The SYSCLKOUT will be based on user environment and could be with or without PLL enabled.] XCLKIN * 4 (Changed CPU Frequency) Figure 6-14. TMS320F2812 TMS320C2810. the Boot code execution time is based on the current SYSCLKOUT speed. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.com XCLKIN X1 XCLKOUT (XCLKIN * 5) tw(RSL2) XRS Address/ Data/ Control XF/XPLLDIS td(EX) User-Code Execution (Don’t Care) tsu(XPLLDIS) GPIOF14/XF (Don’t Care) XPLLDIS Sampling th(XMP/MC) XCLKIN/8 User-Code Dependent User-Code Execution Phase th(XPLLDIS) GPIOF14 User-Code Dependent (Don’t Care) XMP/MC (Don’t Care) Boot-ROM Execution Starts Boot-Mode Pins Peripheral/GPIO Function GPIO Pins as Input th(boot-mode) (A) Peripheral/GPIO Function User-Code Execution Starts I/O Pins User-Code Dependent GPIO Pins as Input (State Depends on Internal PU/PD) User-Code Dependent A. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . Warm Reset in Microcomputer Mode X1/XCLKIN Write to PLLCR SYSCLKOUT XCLKIN * 2 (Current CPU Frequency) XCLKIN/2 [CPU Frequency While PLL is Stabilizing With the Desired Frequency. the boot code branches to destination memory or boot code function in ROM. After reset. If Boot ROM code executes after power-on conditions (in debugger environment). the Boot ROM code executes instructions for 1260 SYSCLKOUT cycles (SYSCLKOUT = XCLKIN/2) and then samples BOOT Mode pins.

XCLKOUT = SYSCLKOUT WAKE INT can be any enabled interrupt.ti. Figure 6-15. TMS320F2811. IDLE Mode Switching Characteristics PARAMETER TEST CONDITIONS Without input qualifier With input qualifier Without input qualifier With input qualifier Without input qualifier With input qualifier (1) (2) MIN TYP MAX 8tc(SCO) 8tc(SCO) + IQT (2) 1050tc(SCO) 1050tc(SCO) + IQT (2) 8tc(SCO) 8tc(SCO) + IQT (2) UNIT Delay time. B. IDLE Entry and Exit Timing Copyright © 2001–2011.16 Low-Power Mode Wakeup Timing Table 6-12. TMS320C2811. XNMI. or XRS. external wake signal to program execution resume (1) • td(WAKE-IDLE) • • Wake-up from Flash – Flash module in active state Wake-up from Flash – Flash module in sleep state Wake-up from SARAM cycles cycles cycles This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 107 . WDINT. external wake-up signal Without input qualifier With input qualifier 2tc(SCO) 1tc(SCO) + IQT (1) NOM MAX UNIT cycles Input Qualification Time (IQT) = [tc(SCO) × 2 × QUALPRD] × 5 + [tc(SCO) × 2 × QUALPRD]. Execution of an ISR (triggered by the wake-up) signal involves additional latency. IDLE Mode Timing Requirements MIN tw(WAKE-INT) (1) Pulse duration. TMS320C2812 www. Input Qualification Time (IQT) = [tc(SCO) × 2 × QUALPRD] × 5 + [tc(SCO) × 2 × QUALPRD]. td(WAKE-IDLE) A0-A15 XCLKOUT (A) tw(WAKE-INT) WAKE INT (B) A. TMS320F2812 TMS320C2810.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. Table 6-13.TMS320F2810.

external wake-up signal Without input qualifier With input qualifier 12tc(CI) (2 + QUALSTDBY) * tc(CI) (1) NOM MAX UNIT cycles QUALSTDBY is a 6-bit field in the LPMCR0 register. TMS320F2811. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .ti. 108 Electrical Specifications Copyright © 2001–2011. STANDBY Mode Timing Requirements MIN tw(WAKE-INT) (1) Pulse duration.com Table 6-14. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Execution of an ISR (triggered by the wake-up) signal involves additional latency. TMS320F2812 TMS320C2810. IDLE instruction executed to XCLKOUT high Delay time. Table 6-15. STANDBY Mode Switching Characteristics PARAMETER td(IDLE-XCOH) Delay time.TMS320F2810. TMS320C2811. external wake signal to program execution resume (1) • Wake-up from Flash – Flash module in active state Wake-up from Flash – Flash module in sleep state Wake-up from SARAM Without input qualifier With input qualifier Without input qualifier With input qualifier Without input qualifier With input qualifier (1) 12tc(CI) 12tc(CI) + tw(WAKE-INT) 1125tc(SCO) 1125tc(SCO) + tw(WAKE-INT) 12tc(CI) 12tc(CI) + tw(WAKE-INT) cycles cycles TEST CONDITIONS MIN 32tc(SCO) TYP MAX 45tc(SCO) UNIT cycles td(WAKE-STBY) • • cycles This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction.

TMS320F2811. when DIVSEL = 11 This delay enables the CPU pipeline and any other pending operations to flush properly. F. the PLL and watchdog are not shut down. STANDBY Entry and Exit Timing Copyright © 2001–2011. D. After a latency period. when DIVSEL = 00 or 01 • 32 cycles. TMS320F2812 TMS320C2810. then it will fail.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 A B Device Status Flushing Pipeline Wake-up Signal C D STANDBY STANDBY E F Normal Execution tw(WAKE-INT) td(WAKE-STBY) X1/XCLKIN td(IDLE-XCOH) XCLKOUT 32 SYSCLKOUT Cycles A.TMS320F2810.ti. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 109 . C. The external wake-up signal is driven active. when DIVSEL = 10 • 64 cycles. Clocks to the peripherals are turned off. B. The device will respond to the interrupt (if enabled). It is recommended that STANDBY mode be entered from SARAM without an XINTF access in progress. The PLL block responds to the STANDBY signal. E. Figure 6-16. The device is now in STANDBY mode. If an access to XINTF is in progress and its access time is longer than this number. Normal execution resumes. TMS320C2812 www. SYSCLKOUT is held for the number of cycles indicated below before being turned off: • 16 cycles. TMS320C2811. the STANDBY mode is exited. However. IDLE instruction is executed to put the device into STANDBY mode.

XNMI wakeup signal Pulse duration. it initiates the PLL lock sequence. the device will respond to the interrupt (if enabled). B. TMS320F2811. D. the oscillator is turned on. G. The HALT mode is now exited. When XNMI is deactivated. TMS320C2811.ti. TMS320F2812 TMS320C2810. H. HALT Mode Timing Requirements MIN tw(WAKE-XNMI) tw(WAKE-XRS) Pulse duration. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. SYSCLKOUT is held for another 32 cycles before the oscillator is turned off and the CLKIN to the core is stopped.072 X1/XCLKIN cycles. The pulse duration of 2tc(CI) is applicable when an external oscillator is used. IDLE instruction executed to XCLKOUT high PLL lock-up time Delay time.TMS320F2810. HALT Mode Switching Characteristics PARAMETER td(IDLE-XCOH) tp Delay time. The device is now in HALT mode and consumes absolute minimum power. IDLE instruction is executed to put the device into HALT mode. which takes 131. the oscillator wake-up time should be added to this parameter. This 32-cycle delay enables the CPU pipe and any other pending operations to flush properly.com Table 6-16. When CLKIN to the core is enabled. C. but the PLL is not activated. HALT Wakeup Using XNMI 110 Electrical Specifications Copyright © 2001–2011. The PLL block responds to the HALT signal. Normal operation resumes. XRS wakeup signal 2tc(CI) 8tc(CI) NOM MAX UNIT cycles cycles Table 6-17. XCLKOUT = SYSCLKOUT Figure 6-17. If the internal oscillator is used. PLL lock to program execution resume td(WAKE) • • Wake up from flash – Flash module in sleep state Wake up from SARAM 1125tc(SCO) 35tc(SCO) cycles cycles MIN 32tc(SCO) TYP 45tc(SCO) 131072tc(CI) MAX UNIT cycles cycles A B Device Status Flushing Pipeline C D HALT HALT PLL Lock-up Time Wake-up Latency E F G Normal Execution XNMI tw(WAKE-XNMI) tp td(wake) X1/XCLKIN td(IDLE-XCOH) XCLKOUT (H) Oscillator Start-up Time 32 SYSCLKOUT Cycles A. after a latency. F. When XNMI is driven active. Clocks to the peripherals are turned off and the internal oscillator and PLL are shut down. E.

since the external signal is driven asynchronously. TMS320F2812 TMS320C2810. XCLKOUT = SYSCLKOUT Figure 6-19. the minimum width that is needed is 5 × 2 = 10 SYSCLKOUT cycles. Table 6-18. TMS320C2811. PWMx output high/low Delay time. The qualification sampling period is 2n SYSCLKOUT cycles. Six such samples will be taken over five sampling windows. For QUALPRD = 1. PWM outputs may be 100%. Maximum input frequency to the QEP = min[HSPCLK/2.1 PWM Timing PWM refers to all PWM outputs on EVA and EVB.17. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 111 .. when QUALPRD = 1. the qualification sampling period is 1 × 2 = 2 SYSCLKOUT cycles (i. PWM Output Timing XCLKOUT (A) tw(TDIR) TDIRx A. TCLKINx high as a percentage of TCLKINx cycle time Cycle time. PWM pin toggling frequency is limited by the GPIO output buffer switching frequency (20 MHz). TCLKINx low as a percentage of TCLKINx cycle time Pulse duration.e. As an example.ti. Timer and Capture Unit Timing Requirements (1) (2) MIN tw(TDIR) tw(CAP) tw(TCLKINL) tw(TCLKINH) tc(TCLKIN) (1) Pulse duration. CAPx input low/high Without input qualifier With input qualifier Without input qualifier With input qualifier 2tc(SCO) 1tc(SCO) + IQT (3) 2tc(SCO) 1tc(SCO) + IQT (3) 40 40 4tc(HCO) 60 60 MAX UNIT cycles cycles % % ns Pulse duration. XCLKOUT high to PWMx output switching XCLKOUT = SYSCLKOUT/4 TEST CONDITIONS MIN 25 10 MAX UNIT ns ns See the GPIO output timing for fall/rise times for PWM pins. TDIRx low/high Pulse duration.TMS320F2810. a 11-SYSCLKOUT-wide pulse ensures reliable recognition. Table 6-19. However. 20 MHz] Input Qualification Time (IQT) = [tc(SCO) × 2 × QUALPRD] × 5 + [tc(SCO) × 2 × QUALPRD]. XCLKOUT = SYSCLKOUT Figure 6-18. 0%. where “n” is the value stored in the QUALPRD bit field. TCLKINx (2) (3) The QUALPRD bit field value can range from 0 (no qualification) through 0xFF (510 SYSCLKOUT cycles). or increments of tc(HCO) with respect to the PWM period. TMS320F2811. TDIRx Timing Copyright © 2001–2011. PWM Switching Characteristics (1) (2) PARAMETER tw(PWM) (3) td(PWM)XCO (1) (2) (3) Pulse duration. TMS320C2812 www.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. the input is sampled every 2 SYSCLKOUT cycles). (A) XCLKOUT td(PWM)XCO tw(PWM) PWMx A.17 Event Manager Interface 6. each window being 2n SYSCLKOUT cycles.

TMS320C2811. TMS320F2811. XCLKOUT high to EVBSOC low Pulse duration. EVASOC low 32tc(HCO) MIN MAX 1tc(SCO) UNIT cycle ns XCLKOUT = SYSCLKOUT XCLKOUT td(XCOH-EVASOCL) tw(EVASOCL) EVASOC Figure 6-20. External ADC Start-of-Conversion – EVA – Switching Characteristics (1) PARAMETER td(XCOH-EVASOCL) tw(EVASOCL) (1) Delay time. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .com Table 6-20.ti. XCLKOUT high to EVASOC low Pulse duration. EVBSOC low 32tc(HCO) MIN MAX 1tc(SCO) UNIT cycle ns XCLKOUT = SYSCLKOUT XCLKOUT td(XCOH-EVBSOCL) tw(EVBSOCL) EVBSOC Figure 6-21. EVASOC Timing Table 6-21.TMS320F2810. EVBSOC Timing 112 Electrical Specifications Copyright © 2001–2011. TMS320F2812 TMS320C2810. External ADC Start-of-Conversion – EVB – Switching Characteristics (1) PARAMETER td(XCOH-EVBSOCL) tw(EVBSOCL) (1) Delay time.

PDPINTx low to PWM high-impedance state Delay time.17. INT low/high to interrupt-vector fetch Without input qualifier With input qualifier Without input qualifier With input qualifier MIN MAX 12 1tc(SCO) + IQT + 12 (1) 3 * tc(SCO) 2tc(SCO) + IQT (1) IQT + 12tc(SCO) (1) UNIT ns ns ns Input Qualification Time (IQT) = [tc(SCO) × 2 × QUALPRD] × 5 + [tc(SCO) × 2 × QUALPRD]. B. Interrupt Timing Requirements MIN tw(INT) tw(PDP) tw(CxTRIP) tw(TxCTRIP) (1) Pulse duration. TMS320C2812 www. T2CTRIP. (A) XCLKOUT tw(PDP). tw(CxTRIP). TMS320F2812 TMS320C2810. INT input low/high Pulse duration. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 113 .TMS320F2810. C4TRIP. PDPINTx input low Pulse duration. XINT2 td(INT) A0-A15 Interrupt Vector A. TMS320F2811. tw(TxCTRIP) TxCTRIP. CxTRIP. or C6TRIP PDPINTx – PDPINTA or PDPINTB PWM refers to all the PWM pins in the device (i.. Table 6-23. XCLKOUT = SYSCLKOUT TxCTRIP – T1CTRIP.ti. C. td(TRIP-PWM)HZ PWM (C) tw(INT) XNMI.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6.e. T4CTRIP CxTRIP – C1TRIP. The state of the PWM pins after PDPINTx is taken high depends on the state of the FCOMPOE bit. T3CTRIP. External Interrupt Timing Copyright © 2001–2011. Interrupt Switching Characteristics PARAMETER td(PDP-PWM)HZ td(TRIP-PWM)HZ td(INT) (1) Delay time. TMS320C2811. XINT1. C3TRIP. CxTRIP/TxCTRIP signals low to PWM high-impedance state Delay time. TxCTRIP input low With no qualifier With qualifier With no qualifier With qualifier With no qualifier With qualifier With no qualifier With qualifier 2tc(SCO) 1tc(SCO) + IQT (1) 2tc(SCO) 1tc(SCO) + IQT (1) 2tc(SCO) 1tc(SCO) + IQT (1) 2tc(SCO) 1tc(SCO) + IQT (1) MAX UNIT cycles cycles cycles cycles Input Qualification Time (IQT) = [tc(SCO) × 2 × QUALPRD] × 5 + [tc(SCO) × 2 × QUALPRD]. C5TRIP. C2TRIP.2 Interrupt Timing Table 6-22. CxTRIP input low Pulse duration. Figure 6-22. PWMn and TnPWM pins or PWM pin pair relevant to each CxTRIP pin). PDPINTx (B) td(PDP-PWM)HZ.

GPIO switching high to low Toggling frequency. TMS320F2811. TMS320C2811. GPIO switching low to high Fall time.18 General-Purpose Input/Output (GPIO) – Output Timing Table 6-24. TMS320F2812 TMS320C2810. General-Purpose Output Switching Characteristics PARAMETER td(XCOH-GPO) tr(GPO) tf(GPO) fGPO Delay time. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . GPO pins All GPIOs All GPIOs All GPIOs MIN MAX 1tc(SCO) 10 10 20 UNIT cycle ns ns MHz XCLKOUT (A) td(XCOH-GPO) GPIO tr(GPO) tf(GPO) A. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.TMS320F2810.com 6. XCLKOUT high to GPIO low/high Rise time.ti. General-Purpose Output Timing 114 Electrical Specifications Copyright © 2001–2011. XCLKOUT = SYSCLKOUT Figure 6-23.

For any other value “n”. TMS320C2812 www.TMS320F2810. the qualification sampling period is 2n SYSCLKOUT cycles (i. the GPIO pin will be sampled). Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 115 . TMS320C2811. GPIO Input Qualifier – Example Diagram for QUALPRD = 1 Copyright © 2001–2011. In other words.. Six consecutive samples must be of the same value for a given input to be recognized. Input qualification is not applicable when QUALPRD = 00. B. TMS320F2812 TMS320C2810. a 13-SYSCLKOUT-wide pulse provides reliable recognition. The QUALPRD bit field specifies the qualification sampling period.19 General-Purpose Input/Output (GPIO) – Input Timing See Note (A) GPIO Signal 1 1 0 0 0 0 0 0 0 1 0 0 0 1 1 1 1 1 1 1 1 1 Sampling period. Since external signals are driven asynchronously. This glitch is ignored by the input qualifier. determined by GPxQUAL [QUALPRD] Sampling Window SYSCLKOUT QUALPRD = 1 (SYSCLKOUT/2) (SYSCLKOUT cycle x 2 x QUALPRD) x 5 Output From Qualifier A. the input must be stable for 10 SYSCLKOUT cycles or greater. Figure 6-24. This would enable five sampling periods for detection to occur.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. It can vary from 00 to 0xFF. For the qualifier to detect the change.ti. at every 2n SYSCLKOUT cycle. the inputs should be stable for (5 × QUALPRD × 2) SYSCLKOUT cycles. TMS320F2811.e.

ti. General-Purpose Input Timing NOTE The pulse width requirement for general-purpose input is applicable for the XBIO and ADCSOC pins as well. 6. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . General-Purpose Input Timing Requirements MIN tw(GPI) (1) Pulse duration GPIO low/high All GPIOs With no qualifier With qualifier 2tc(SCO) 1tc(SCO) + IQT (1) MAX UNIT cycles Input Qualification Time (IQT) = [tc(SCO) × 2 × QUALPRD] × 5 + [tc(SCO) × 2 × QUALPRD]. TMS320F2811. TMS320C2811. XCLKOUT GPIOxn tw(GPI) Figure 6-25. Figure 6-26 and Figure 6-27 show the timing waveforms.TMS320F2810. 116 Electrical Specifications Copyright © 2001–2011.com Table 6-25. TMS320F2812 TMS320C2810. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.20 Serial Peripheral Interface (SPI) Master Mode Timing Table 6-26 lists the master mode timing (clock phase = 0) and Table 6-27 lists the timing (clock phase = 1).

SPISOMI before SPICLK low (clock polarity = 0) Setup time.5tc(SPC)M – 10 0 0 0.2) is set and the CLOCK PHASE bit (SPICTL.5tc(LCO) – 10 0.5tc(LCO) 0. TMS320C2812 www. Copyright © 2001–2011. SPI Master Mode External Timing (Clock Phase = 0) (1) (2) NO.5tc(SPC)M 0.5tc(LCO) – 10 MAX 127tc(LCO) 0.6).5tc(SPC)M 0.5 MHz MAX.5tc(SPC)M – 0.5tc(LCO) 0. SPICLK low (clock polarity = 1) Pulse duration.5tc(SPC)M – 10 0. SPISIMO data valid after SPICLK low (clock polarity = 0) Valid time.5tc(SPC)M + 0.5tc(SPC)M 0.5tc(SPC)M – 0. SPISOMI data valid after SPICLK low (clock polarity = 0) Valid time. NOTE: Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate: • Master mode transmit: 20 MHz MAX.TMS320F2810. 1 (3) SPI WHEN (SPIBRR + 1) IS EVEN OR SPIBRR = 0 OR 2 MIN tc(SPC)M tw(SPCH)M Cycle time. SPICLK low (clock polarity = 0) Pulse duration. SPICLK high (clock polarity = 1) Delay time. TMS320C2811.25tc(SPC)M – 10 0.5tc(SPC)M – 10 –10 –10 0.5tc(SPC)M + 0.5tc(LCO) – 10 0 0 0.5tc(LCO) 0.3) is cleared.5tc(SPC)M + 0.5tc(SPC)M – 0. Master mode receive: 12.5tc(SPC)M 10 10 SPI WHEN (SPIBRR + 1) IS ODD AND SPIBRR > 3 MIN 5tc(LCO) 0.5tc(LCO) – 10 –10 –10 0.5tc(LCO) – 10 0.5tc(SPC)M + 0. SPISOMI data valid after SPICLK high (clock polarity = 1) 4tc(LCO) 0. SPISOMI before SPICLK high (clock polarity = 1) Valid time.5tc(SPC)M + 0.5tc(LCO) – 10 0. SPICLK low to SPISIMO valid (clock polarity = 1) Valid time. Texas Instruments Incorporated Electrical Specifications 117 Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . • Slave mode transmit: 12.5tc(SPC)M – 10 0.5 MHz MAX.5tc(LCO) – 10 0. TMS320F2811. SPICLK high (clock polarity = 0) Pulse duration.5tc(LCO) 10 10 UNIT ns 2 tw(SPCL)M tw(SPCL)M ns 3 (3) tw(SPCH)M td(SPCH-SIMO)M ns 4 (3) td(SPCL-SIMO)M tv(SPCL-SIMO)M ns 5 (3) tv(SPCH-SIMO)M tsu(SOMI-SPCL)M ns 8 (3) tsu(SOMI-SPCH)M tv(SPCL-SOMI)M ns 9 (3) tv(SPCH-SOMI)M ns (1) (2) (3) The MASTER/SLAVE bit (SPICTL.5tc(SPC)M – 10 0. SPICLK Pulse duration. SPICLK high to SPISIMO valid (clock polarity = 0) Delay time.5tc(SPC)M – 0.5 MHz MAX.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 6-26.ti.5tc(SPC)M – 0.5tc(SPC)M – 0. SPISIMO data valid after SPICLK high (clock polarity = 1) Setup time. tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1) tc(LCO) = LSPCLK cycle time The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.25tc(SPC)M – 10 MAX 128tc(LCO) 0.5tc(SPC)M – 10 0.5tc(LCO) – 10 0.5tc(SPC)M + 0. Slave mode receive: 12. TMS320F2812 TMS320C2810.

SPISTE goes active 0. On the trailing end of the word. SPI Master Mode External Timing (Clock Phase = 0) 118 Electrical Specifications Copyright © 2001–2011.5tc(SPC) before valid SPI clock edge.TMS320F2810. TMS320F2812 TMS320C2810. In the master mode. Figure 6-26. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.ti. TMS320C2811. except that SPISTE stays active between back-to-back transmit words in both FIFO and non-FIFO modes. the SPISTE will go inactive 0.5tc(SPC) after the receiving edge (SPICLK) of the last data bit.com 1 SPICLK (clock polarity = 0) 2 3 SPICLK (clock polarity = 1) 4 5 SPISIMO Master Out Data Is Valid 8 9 SPISOMI Master In Data Must Be Valid SPISTE (A) A. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320F2811.

TMS320C2812 www. Slave mode receive: 12.5tc(SPC)M 0. 1 (3) SPI WHEN (SPIBRR + 1) IS EVEN OR SPIBRR = 0 OR 2 MIN tc(SPC)M tw(SPCH)M Cycle time. SPISOMI before SPICLK high (clock polarity = 0) Setup time.5tc(SPC)M – 10 0.5tc(LCO) – 10 0.5 MHz MAX.5tc(LCO) – 10 0.5tc(SPC)M + 0.5tc(SPC)M – 10 0 0 0.5tc(SPC)M + 0.5tc(SPC)M – 0.5tc(LCO) 0. SPISIMO data valid before SPICLK low (clock polarity = 1) Valid time.2) is set and the CLOCK PHASE bit (SPICTL.5tc(SPC)M – 10 0.5tc(SPC)M – 0.5 MHz MAX.5tc(LCO) 0.5tc(SPC)M – 10 ns ns ns tsu(SOMI-SPCL)M tv(SPCH-SOMI)M 11 (3) tv(SPCL-SOMI)M (1) (2) (3) The MASTER/SLAVE bit (SPICTL. SPISIMO data valid after SPICLK high (clock polarity = 0) Valid time.5tc(SPC)M – 10 0.5tc(SPC)M – 10 0. • Slave mode transmit: 12. SPICLK low (clock polarity = 1) Pulse duration.5tc(SPC)M 0.5tc(SPC)M + 0.25tc(SPC)M – 10 0.5tc(SPC)M – 10 0 0 0. SPISOMI before SPICLK low (clock polarity = 1) Valid time.5tc(SPC)M SPI WHEN (SPIBRR + 1) IS ODD AND SPIBRR > 3 MIN 5tc(LCO) 0.6).5tc(SPC)M – 0.5tc(LCO) UNIT ns 2 tw(SPCL)M tw(SPCL)M ns 3 (3) tw(SPCH)M tsu(SIMO-SPCH)M ns 6 (3) tsu(SIMO-SPCL)M 0.5tc(SPC)M – 0.5tc(LCO) – 10 0. tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1) tc(LCO) = LSPCLK cycle time The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.TMS320F2810.5tc(SPC)M + 0.5tc(SPC)M – 10 ns tv(SPCH-SIMO)M 7 (3) tv(SPCL-SIMO)M tsu(SOMI-SPCH)M 10 (3) 0. SPI Master Mode External Timing (Clock Phase = 1) (1) (2) NO. SPISOMI data valid after SPICLK low (clock polarity = 1) 4tc(LCO) 0.25tc(SPC)M – 10 0.5tc(SPC)M – 10 0.3) is set. SPISIMO data valid before SPICLK high (clock polarity = 0) Setup time.5tc(LCO) – 10 0.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 6-27. TMS320F2812 TMS320C2810.5 MHz MAX.5tc(SPC)M 0. SPICLK high (clock polarity = 0) Pulse duration.5tc(LCO) 0. SPICLK high (clock polarity = 1) Setup time. Copyright © 2001–2011. SPICLK Pulse duration.ti. NOTE: Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate: • Master mode transmit: 20 MHz MAX. Master mode receive: 12.5tc(SPC)M – 10 0. TMS320F2811.5tc(SPC)M – 10 0.5tc(SPC)M – 10 MAX 127tc(LCO) 0.5tc(SPC)M – 10 MAX 128tc(LCO) 0. SPISIMO data valid after SPICLK low (clock polarity = 1) Setup time. SPISOMI data valid after SPICLK high (clock polarity = 0) Valid time. Texas Instruments Incorporated Electrical Specifications 119 Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320C2811.5tc(SPC)M – 10 0. SPICLK low (clock polarity = 0) Pulse duration.

the SPISTE will go inactive 0.com 1 SPICLK (clock polarity = 0) 2 3 SPICLK (clock polarity = 1) 6 7 SPISIMO Master Out Data Is Valid 10 11 SPISOMI Master In Data Must Be Valid Data Valid SPISTE (A) A. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .5tc(SPC) before valid SPI clock edge. TMS320F2812 TMS320C2810. On the trailing end of the word. TMS320F2811.5tc(SPC) after the receiving edge (SPICLK) of the last data bit. except that SPISTE stays active between back-to-back transmit words in both FIFO and non-FIFO modes. SPI Master External Timing (Clock Phase = 1) 120 Electrical Specifications Copyright © 2001–2011. Figure 6-27. SPISTE goes active 0.TMS320F2810.ti. In the master mode. TMS320C2811. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.

SPI Slave Mode External Timing (Clock Phase = 0) (1) (2) NO.5tc(SPC)S – 10 0. Table 6-28.5 MHz MAX. TMS320C2811.5tc(SPC)S 0. SPICLK low (clock polarity = 0) Pulse duration.375tc(SPC)S – 10 0. tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1) tc(LCO) = LSPCLK cycle time The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR. Copyright © 2001–2011. SPICLK Pulse duration.5 MHz MAX.5tc(SPC)S – 10 0. SPICLK high to SPISOMI valid (clock polarity = 0) Delay time.6). • Slave mode transmit: 12.375tc(SPC)S – 10 0. Master mode receive: 12. SPICLK low to SPISOMI valid (clock polarity = 1) Valid time. Slave mode receive: 12.5 MHz MAX.ti. SPISIMO before SPICLK high (clock polarity = 1) Valid time.5tc(SPC)S 0. TMS320C2812 www. SPICLK high (clock polarity = 0) Pulse duration. 12 tc(SPC)S tw(SPCL)S 14 (3) tw(SPCL)S tw(SPCH)S 15 (3) td(SPCH-SOMI)S td(SPCL-SOMI)S 16 (3) tv(SPCL-SOMI)S tv(SPCH-SOMI)S 19 (3) tsu(SIMO-SPCL)S tsu(SIMO-SPCH)S 20 (3) tv(SPCL-SIMO)S tv(SPCH-SIMO)S (1) (2) (3) Cycle time.5tc(SPC)S ns ns MAX UNIT ns ns The MASTER/SLAVE bit (SPICTL.21 Serial Peripheral Interface (SPI) Slave Mode Timing Table 6-28 lists the slave mode timing (clock phase = 0) and Table 6-29 lists the timing (clock phase = 1).5tc(SPC)S ns ns ns 0. SPICLK low (clock polarity = 1) Pulse duration.5tc(SPC)S 0.5tc(SPC)S – 10 0. TMS320F2812 TMS320C2810.5tc(SPC)S – 10 0. SPISOMI data valid after SPICLK high (clock polarity = 1) Setup time.TMS320F2810. SPISIMO before SPICLK low (clock polarity = 0) Setup time. SPISIMO data valid after SPICLK high (clock polarity = 1) 13 (3) tw(SPCH)S MIN 4tc(LCO) 0. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 121 . NOTE: Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate: • Master mode transmit: 20 MHz MAX. SPISOMI data valid after SPICLK low (clock polarity = 0) Valid time.2) is cleared and the CLOCK PHASE bit (SPICTL. SPICLK high (clock polarity = 1) Delay time.3) is cleared.75tc(SPC)S 0 0 0.5tc(SPC)S 0. SPISIMO data valid after SPICLK low (clock polarity = 0) Valid time.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. TMS320F2811.75tc(SPC)S 0. Figure 6-28 and Figure 6-29 show the timing waveforms.

Figure 6-28. TMS320F2811. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.com 12 SPICLK (clock polarity = 0) 13 14 SPICLK (clock polarity = 1) 15 16 SPISOMI SPISOMI Data Is Valid 19 20 SPISIMO SPISIMO Data Must Be Valid SPISTE (A) A.5tc(SPC) after the receiving edge (SPICLK) of the last data bit. SPI Slave Mode External Timing (Clock Phase = 0) 122 Electrical Specifications Copyright © 2001–2011.TMS320F2810. In the slave mode.ti. TMS320F2812 TMS320C2810. the SPISTE signal should be asserted low at least 0.5tc(SPC) before the valid SPI clock edge and remain low for at least 0. TMS320C2811. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .

75tc(SPC)S 0.5 MHz MAX. Master mode receive: 12. SPICLK low (clock polarity = 0) Pulse duration.5tc(SPC)S 0. SPISIMO before SPICLK high (clock polarity = 0) Setup time.3) is set. SPICLK high (clock polarity = 1) Setup time. 12 13 (3) 14 (3) 17 (3) 18 (3) tc(SPC)S tw(SPCH)S tw(SPCL)S tw(SPCL)S tw(SPCH)S tsu(SOMI-SPCH)S tsu(SOMI-SPCL)S tv(SPCH-SOMI)S tv(SPCL-SOMI)S 21 (3) 22 (3) tsu(SIMO-SPCH)S tsu(SIMO-SPCL)S tv(SPCH-SIMO)S tv(SPCL-SIMO)S (1) (2) (3) Cycle time. SPISOMI before SPICLK high (clock polarity = 0) Setup time. SPI Slave Mode External Timing (Clock Phase = 1) (1) (2) NO. SPISIMO data valid after SPICLK low (clock polarity = 1) MIN 8tc(LCO) 0.5 MHz MAX. NOTE: Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate: • Master mode transmit: 20 MHz MAX.5tc(SPC)S – 10 0. SPICLK low (clock polarity = 1) Pulse duration.5 MHz MAX.125tc(SPC)S 0. TMS320F2811.125tc(SPC)S 0.5tc(SPC)S 0.5tc(SPC)S ns ns ns 0.ti. SPISIMO before SPICLK low (clock polarity = 1) Valid time.TMS320F2810. Copyright © 2001–2011. SPISOMI data valid after SPICLK high (clock polarity = 0) Valid time. tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1) tc(LCO) = LSPCLK cycle time The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR. SPISOMI data valid after SPICLK low (clock polarity = 1) Setup time.5tc(SPC)S – 10 0. Slave mode receive: 12.5tc(SPC)S – 10 0. SPICLK high (clock polarity = 0) Pulse duration. TMS320C2812 www.5tc(SPC)S – 10 0. SPICLK Pulse duration. • Slave mode transmit: 12.5tc(SPC)S 0.6).5tc(SPC)S 0. SPISOMI before SPICLK low (clock polarity = 1) Valid time.2) is cleared and the CLOCK PHASE bit (SPICTL.5tc(SPC)S ns ns MAX UNIT ns ns The MASTER/SLAVE bit (SPICTL. TMS320F2812 TMS320C2810. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 123 . TMS320C2811.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 6-29. SPISIMO data valid after SPICLK high (clock polarity = 0) Valid time.75tc(SPC)S 0 0 0.

TMS320F2810.5tc(SPC) after the receiving edge (SPICLK) of the last data bit. SPI Slave Mode External Timing (Clock Phase = 1) 124 Electrical Specifications Copyright © 2001–2011. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .5tc(SPC) before the valid SPI clock edge and remain low for at least 0. TMS320C2811. the SPISTE signal should be asserted low at least 0. In the slave mode. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TMS320F2811. Figure 6-29.com 12 SPICLK (clock polarity = 0) 13 14 SPICLK (clock polarity = 1) 17 18 SPISOMI SPISOMI Data Is Valid 21 22 SPISIMO SPISIMO Data Must Be Valid Data Valid SPISTE (A) A.ti. TMS320F2812 TMS320C2810.

TMS320F2810. read access Active period. Minimum wait state requirements must be met when configuring each zone’s XTIMING register. No internal device hardware is included to detect illegal settings. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 125 . TMS320F2811. ● If the XREADY signal is ignored (USEREADY = 0). The user configures the Lead/Active/Trail wait states in the XTIMING registers. write access Trail period. then WS = 0. write access DURATION (ns) X2TIMING = 0 XRDLEAD × tc(XTIM) (XRDACTIVE + WS + 1) × tc(XTIM) XRDTRAIL × tc(XTIM) XWRLEAD × tc(XTIM) (XWRACTIVE + WS + 1) × tc(XTIM) XWRTRAIL × tc(XTIM) X2TIMING = 1 (XRDLEAD × 2) × tc(XTIM) (XRDACTIVE × 2 + WS + 1) × tc(XTIM) (XRDTRAIL × 2) × tc(XTIM) (XWRLEAD × 2) × tc(XTIM) (XWRACTIVE × 2 + WS + 1) × tc(XTIM) (XWRTRAIL × 2) × tc(XTIM) tc(XTIM) – Cycle time. Active. read access Trail period. Table 6-30 shows the relationship between the parameters configured in the XTIMING register and the duration of the pulse in terms of XTIMCLK cycles.22 External Interface (XINTF) Timing Each XINTF access consists of three parts: Lead. These requirements are in addition to any timing requirements as specified by that device’s data sheet. then: 1.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6.ti. 1 Examples of valid and invalid timing when not sampling XREADY (no hardware to detect illegal XTIMING configurations): XRDLEAD Invalid Valid 0 1 XRDACTIVE 0 0 XRDTRAIL 0 0 XWRLEAD 0 1 XWRACTIVE 0 0 XWRTRAIL 0 0 X2TIMING 0. TMS320F2812 TMS320C2810. TMS320C2811. XTIMCLK WS refers to the number of wait states inserted by hardware when using XREADY. Lead: LR ≥ tc(XTIM) LW ≥ tc(XTIM) These requirements result in the following XTIMING register configuration restrictions (no hardware to detect illegal XTIMING configurations): XRDLEAD ≥1 XRDACTIVE ≥0 XRDTRAIL ≥0 XWRLEAD ≥1 XWRACTIVE ≥0 XWRTRAIL ≥0 X2TIMING 0. Relationship Between Parameters Configured in XTIMING and Duration of Pulse (1) (2) DESCRIPTION LR AR TR LW AW TW (1) (2) Lead period. write access Active period. There is one XTIMING register for each XINTF zone. If the zone is configured to ignore XREADY (USEREADY = 0). TMS320C2812 www. 1 0. 1 Copyright © 2001–2011. and Trail. Table 6-30. read access Lead period.

com ● If the XREADY signal is sampled in the synchronous mode (USEREADY = 1. 1 Examples of valid and invalid timing when using synchronous XREADY (no hardware to detect illegal XTIMING configurations): XRDLEAD Invalid Invalid Valid 0 1 1 XRDACTIVE 0 0 1 XRDTRAIL 0 0 0 XWRLEAD 0 1 1 XWRACTIVE 0 0 1 XWRTRAIL 0 0 0 X2TIMING 0. TMS320F2812 TMS320C2810. then: 1. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . Lead: Active: LR ≥ tc(XTIM) LW ≥ tc(XTIM) AR ≥ 2 × tc(XTIM) AW ≥ 2 × tc(XTIM) NOTE: Restriction does not include external hardware wait states. These requirements result in the following XTIMING register configuration restrictions (no hardware to detect illegal XTIMING configurations): XRDLEAD ≥1 XRDACTIVE ≥1 XRDTRAIL ≥0 XWRLEAD ≥1 XWRACTIVE ≥1 XWRTRAIL ≥0 X2TIMING 0.TMS320F2810. 1 0. TMS320C2811. 1 126 Electrical Specifications Copyright © 2001–2011. TMS320F2811. 2. READYMODE = 0).ti. 1 0. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.

TMS320C2812 www. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 127 . then: 1. TMS320F2811.TMS320F2810. 2.ti. 1 0 1 0. 1 0. Lead: Active: LR ≥ tc(XTIM) LW ≥ tc(XTIM) AR ≥ 2 × tc(XTIM) AW ≥ 2 × tc(XTIM) NOTE: Restriction does not include external hardware wait states 3.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 ● If the XREADY signal is sampled in the asynchronous mode (USEREADY = 1. TMS320F2812 TMS320C2810. 1 0. Lead + Active: LR + AR ≥ 4 × tc(XTIM) LW + AW ≥ 4 × tc(XTIM) NOTE: Restriction does not include external hardware wait states These requirements result in the following XTIMING register configuration restrictions (no hardware to detect illegal XTIMING configurations): XRDLEAD ≥1 XRDACTIVE ≥2 XRDTRAIL 0 XWRLEAD ≥1 XWRACTIVE ≥2 XWRTRAIL 0 X2TIMING 0. 1 or (no hardware to detect illegal XTIMING configurations): XRDLEAD ≥2 XRDACTIVE ≥1 XRDTRAIL 0 XWRLEAD ≥2 XWRACTIVE ≥1 XWRTRAIL 0 X2TIMING 0. TMS320C2811. READYMODE = 1). 1 Examples of valid and invalid timing when using asynchronous XREADY (no hardware to detect illegal XTIMING configurations): XRDLEAD Invalid Invalid Invalid Valid Valid Valid 0 1 1 1 1 2 XRDACTIVE 0 0 1 1 2 1 XRDTRAIL 0 0 0 0 0 0 XWRLEAD 0 1 1 1 1 2 XWRACTIVE 0 0 1 1 2 1 XWRTRAIL 0 0 0 0 0 0 X2TIMING 0. 1 Copyright © 2001–2011.

TMS320F2811. XINTF Clock Configurations MODE 1 Example: 2 Example: 3 Example: 4 Example: SYSCLKOUT 150 MHz 150 MHz 150 MHz 150 MHz XTIMCLK SYSCLKOUT 150 MHz SYSCLKOUT 150 MHz 1/2 SYSCLKOUT 75 MHz 1/2 SYSCLKOUT 75 MHz XCLKOUT SYSCLKOUT 150 MHz 1/2 SYSCLKOUT 75 MHz 1/2 SYSCLKOUT 75 MHz 1/4 SYSCLKOUT 37. Table 6-31.com Unless otherwise specified.5 MHz The relationship between SYSCLKOUT and XTIMCLK is shown in Figure 6-30. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Relationship Between XTIMCLK and SYSCLKOUT 128 Electrical Specifications Copyright © 2001–2011. TMS320C2811. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . all XINTF timing is applicable for the clock configurations shown in Table 6-31.TMS320F2810.ti. XTIMING0 XTIMING1 XTIMING2 XTIMING6 XTIMING7 XBANK LEAD/ACTIVE/TRAIL C28x CPU SYSCLKOUT /2 1 (A) XTIMCLK /2 1 (A) 0 1 0 XCLKOUT 0 0 XINTCNF2 (XTIMCLK) XINTCNF2 (CLKMODE) XINTCNF2 (CLKOFF) (A) Default value after reset Figure 6-30. TMS320F2812 TMS320C2810.

If this number of XTIMCLK cycles is even. then the alignment will be with respect to the falling edge of XCLKOUT. XCLKOUT rising edge (high) or XCLKOUT falling edge (low). Examples: XZCSH XRNWH Zone chip-select inactive-high XR/W inactive-high Copyright © 2001–2011. and zone chip-select (XZCS) change state in relationship to the rising edge of XTIMCLK. The external clock. For the case where XCLKOUT = one-half XTIMCLK. TMS320F2812 TMS320C2810. some strobes will change state either on the rising edge of XCLKOUT or the falling edge of XCLKOUT. For the case where XCLKOUT = XTIMCLK. can be configured to be either equal to or one-half the frequency of XTIMCLK. If the number of lead + active + trail XTIMCLK cycles (including hardware waitstates) is odd. the notation XCOHL is used to indicate that the parameter is with respect to either case.ti. XCLKOUT.TMS320F2810.23 XINTF Signal Alignment to XCLKOUT For each XINTF access. Examples: XRDL XWEL XRD active-low XWE active-low • Strobes that change at the beginning of the trail period will align to the rising edge of XCLKOUT if the total number of lead + active XTIMCLK cycles (including hardware waitstates) for the access is even. the alignment will be with respect to the rising edge of XCLKOUT. This is because all XINTF accesses begin with respect to the rising edge of XCLKOUT. For the case where XCLKOUT = one-half XTIMCLK. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 129 . Examples include the following: • Strobes that change at the beginning of an access always align to the rising edge of XCLKOUT. all of the XINTF strobes will change state with respect to the rising edge of XCLKOUT. the notation XCOH is used. then the alignment will be with respect to the falling edge of XCLKOUT. If the number of lead XTIMCLK cycles is odd. If the number of lead + active XTIMCLK cycles (including hardware waitstates) is odd. then the signal will change with respect to the falling edge of XCLKOUT. the number of lead. Examples: • XZCSL XRNWL Zone chip-select active-low XR/W active-low Strobes that change at the beginning of the active period will align to the rising edge of XCLKOUT if the total number of lead XTIMCLK cycles for the access is even. and trail cycles is based on the internal clock XTIMCLK. then the alignment will be with respect to the falling edge of XCLKOUT. active. TMS320C2811. XWE.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. If this number is odd. TMS320C2812 www. Examples: XRDH XWEH XRD inactive-high XWE inactive-high • Strobes that change at the end of the access will align to the rising edge of XCLKOUT if the total number of lead + active + trail XTIMCLK cycles (including hardware waitstates) is even. If the parameter is always with respect to the rising edge of XCLKOUT. Strobes such as XRD. In the XINTF timing tables. the XCLKOUT edge with which the change will be aligned can be determined based on the number of XTIMCLK cycles from the start of the access to the point at which the signal changes. TMS320F2811.

the XINTF address bus will always hold the last address put out on the bus. This includes alignment cycles. XCLKOUT high to address valid Delay time. XCLKOUT high/low to zone chip-select inactive-high Delay time. read access. TMS320F2811. XCLKOUT high to zone chip-select active-low Delay time. XCLKOUT high/low to XRD inactive-high Hold time.com 6. Table 6-33. read data valid from XRD active-low Setup time. See Table 6-30.24 External Interface Read Timing Table 6-32. External Memory Interface Read Switching Characteristics PARAMETER td(XCOH-XZCSL) td(XCOHL-XZCSH) td(XCOH-XA) td(XCOHL-XRDL) td(XCOHL-XRDH) th(XA)XZCSH th(XA)XRD (1) Delay time. External Memory Interface Read Timing Requirements MIN ta(A) ta(XRD) tsu(XD)XRD th(XD)XRD (1) Access time. TMS320F2812 TMS320C2810. address valid after zone chip-select inactive-high Hold time. read data valid before XRD strobe inactive-high Hold time. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TMS320C2811. XCLKOUT high/low to XRD active-low Delay time. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . AR = Active period. read access. 130 Electrical Specifications Copyright © 2001–2011.ti. address valid after XRD inactive-high –2 (1) (1) MIN –2 MAX 1 3 2 1 1 UNIT ns ns ns ns ns ns ns During inactive cycles. read data from address valid Access time.TMS320F2810. read data valid after XRD inactive-high 12 0 MAX (LR + AR) – 14 (1) AR – 12 (1) UNIT ns ns ns ns LR = Lead period.

B. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 131 .ti. Example Read Access XTIMING register parameters used for this example: XRDLEAD ≥1 (1) XRDACTIVE ≥0 XRDTRAIL ≥0 USEREADY 0 X2TIMING 0 XWRLEAD N/A (1) XWRACTIVE N/A (1) XWRTRAIL N/A (1) READYMODE N/A (1) N/A = “Don’t care” for this example Copyright © 2001–2011. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT.TMS320F2810. When necessary. C. the device will insert an alignment cycle before an access to meet this requirement. XA[0:18] will hold the last address put on the bus during inactive cycles. all signals will transition to their inactive state. TMS320F2812 TMS320C2810. TMS320F2811. For USEREADY = 0. D. TMS320C2812 www. including alignment cycles.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Lead XCLKOUT = XTIMCLK XCLKOUT = 1/2 XTIMCLK td(XCOH-XZCSL) XZCS0AND1. XZCS2. the external XREADY input signal is ignored. During alignment cycles. TMS320C2811. Figure 6-31. XZCS6AND7 XA[0:18] td(XCOH-XA) Active Trail td(XCOHL-XZCSH) td(XCOHL-XRDL) XRD XWE XR/W td(XCOHL-XRDH) tsu(XD)XRD ta(A) ta(XRD) th(XD)XRD DIN XD[0:15] XREADY A.

D. XCLKOUT high/low to XWE high Delay time. XCLKOUT high/low to XWE low Delay time. During alignment cycles. For USEREADY = 0. write access. Figure 6-32. When necessary. See Table 6-30. External Memory Interface Write Switching Characteristics PARAMETER td(XCOH-XZCSL) td(XCOHL-XZCSH) td(XCOH-XA) td(XCOHL-XWEL) td(XCOHL-XWEH) td(XCOH-XRNWL) td(XCOHL-XRNWH) ten(XD)XWEL td(XWEL-XD) th(XA)XZCSH th(XD)XWE tdis(XD)XRNW (1) (2) Delay time. XZCS2.ti. B. TMS320C2811. including alignment cycles. This includes alignment cycles. address valid after zone chip-select inactive-high Hold time. C. Example Write Access XTIMING register parameters used for this example: XRDLEAD N/A (1) (1) XRDACTIVE N/A (1) XRDTRAIL N/A (1) USEREADY 0 X2TIMING 0 XWRLEAD ≥1 XWRACTIVE ≥0 XWRTRAIL ≥0 READYMODE N/A (1) N/A = “Don’t care” for this example 132 Electrical Specifications Copyright © 2001–2011. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. data bus driven from XWE low Delay time. XZCS6AND7 XA[0:18] XRD td(XCOH-XZCSL) td(XCOH-XA) Active Trail td(XCOHL-XZCSH) td(XCOHL-XWEL) XWE XR/W ten(XD)XWEL XD[0:15] td(XWEL-XD) DOUT td(XCOH-XRNWL) td(XCOHL-XWEH) td(XCOHL-XRNWH) tdis(XD)XRNW th(XD)XWEH XREADY A. data valid after XWE active-low Hold time. XCLKOUT high/low to XR/W high Enable time. TW = Trail period. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT. Lead XCLKOUT = XTIMCLK XCLKOUT = 1/2 XTIMCLK XZCS0AND1.TMS320F2810. XA[0:18] will hold the last address put on the bus during inactive cycles. TMS320F2812 TMS320C2810. XCLKOUT high to zone chip-select active-low Delay time. write data valid after XWE inactive-high Maximum time for DSP to release the data bus after XR/W inactive-high TW – 2 (1) (2) MIN –2 MAX 1 3 2 2 2 1 UNIT ns ns ns ns ns ns ns ns ns ns ns –2 0 1 4 4 ns During inactive cycles. TMS320F2811. XCLKOUT high to address valid Delay time. XCLKOUT high to XR/W low Delay time. XCLKOUT high or low to zone chip-select inactive-high Delay time.25 External Interface Write Timing Table 6-34. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . the device will insert an alignment cycle before an access to meet this requirement. all signals will transition to their inactive state.com 6. the XINTF address bus will always hold the last address put out on the bus. the external XREADY input signal is ignored.

XCLKOUT high to zone chip-select active-low Delay time. This includes alignment cycles. External Memory Interface Read Switching Characteristics (Ready-on-Read. XREADY (asynchronous) high before XCLKOUT high/low Hold time. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 133 . address valid after XRD inactive-high –2 (1) (1) MIN –2 MAX 1 3 2 1 1 UNIT ns ns ns ns ns ns ns During inactive cycles. If XREADY (synchronous) is found to be low. For each sample. External Memory Interface Read Timing Requirements (Ready-on-Read. 3. XCLKOUT high/low to XRD active-low Delay time. then the access will complete. 1 Wait State) MIN ta(A) ta(XRD) tsu(XD)XRD th(XD)XRD (1) Access time.TMS320F2810. the XINTF address bus will always hold the last address put out on the bus.26 External Interface Ready-on-Read Timing With One External Wait State Table 6-35.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. and so forth). XCLKOUT high/low to XRD inactive-high Hold time. 2. TMS320C2812 www. Table 6-36. XREADY (synchronous) low Earliest time XREADY (synchronous) can go high before the sampling XCLKOUT edge Setup time. read data valid before XRD strobe inactive-high Hold time. it will be sampled again each tc(XTIM) until it is found to be high. read access. 1 Wait State) (1) MIN tsu(XRDYAsynchL)XCOHL th(XRDYAsynchL) te(XRDYAsynchH) tsu(XRDYAsynchH)XCOHL th(XRDYAsynchH)XZCSH (1) Setup time. then the access will complete. address valid after zone chip-select inactive-high Hold time. 1 Wait State) (1) MIN tsu(XRDYsynchL)XCOHL th(XRDYsynchL) te(XRDYsynchH) tsu(XRDYsynchH)XCOHL th(XRDYsynchH)XZCSH (1) Setup time. read data valid from XRD active-low Setup time. For each sample (n). read access. See Table 6-30. if XREADY (synchronous) is found to be high. TMS320F2812 TMS320C2810. read data from address valid Access time. XREADY (synchronous) low before XCLKOUT high/low Hold time. AR = Active period. XREADY (asynchronous) low Earliest time XREADY (asynchronous) can go high before the sampling XCLKOUT edge Setup time. Table 6-37. and so forth). read data valid after XRD inactive-high 12 0 MAX (LR + AR) – 14 (1) AR – 12 (1) UNIT ns ns ns ns LR = Lead period. the setup time (D) with respect to the beginning of the access can be calculated as: D = (XRDLEAD + XRDACTIVE + n – 1) tc(XTIM) – tsu(XRDYsynchL)XCOHL where n is the sample number (n = 1. XREADY (synchronous) high before XCLKOUT high/low Hold time. If XREADY (asynchronous) is found to be low. if XREADY (asynchronous) is found to be high. Synchronous XREADY Timing Requirements (Ready-on-Read. it will be sampled again each tc(XTIM) until it is found to be high. XREADY (asynchronous) low before XCLKOUT high/low Hold time.ti. Table 6-38. TMS320F2811. XREADY (asynchronous) held high after zone chip-select high 11 0 11 8 3 MAX UNIT ns ns ns ns ns The first XREADY (asynchronous) sample occurs with respect to E in Figure 6-34: E = (XRDLEAD + XRDACTIVE – 2) tc(XTIM) When first sampled. XCLKOUT high/low to zone chip-select inactive-high Delay time. Copyright © 2001–2011. 1 Wait State) PARAMETER td(XCOH-XZCSL) td(XCOHL-XZCSH) td(XCOH-XA) td(XCOHL-XRDL) td(XCOHL-XRDH) th(XA)XZCSH th(XA)XRD (1) Delay time. XREADY (synchronous) held high after zone chip-select high 15 0 15 12 3 MAX UNIT ns ns ns ns ns The first XREADY (synchronous) sample occurs with respect to E in Figure 6-33: E = (XRDLEAD + XRDACTIVE) tc(XTIM) When first sampled. setup time from the beginning of the access can be calculated as: D = (XRDLEAD + XRDACTIVE – 3 + n) tc(XTIM) – tsu(XRDYAsynchL)XCOHL where n is the sample number (n = 1. Asynchronous XREADY Timing Requirements (Ready-on-Read. 2. XCLKOUT high to address valid Delay time. TMS320C2811. 3.

TMS320F2810. setup time from the beginning of the access (D) can be calculated as: D = (XRDLEAD + XRDACTIVE + n – 1) tc(XTIM) – tsu(XRDYsynchL)XCOHL Reference for the first sample is with respect to this point E = (XRDLEAD + XRDACTIVE) tc(XTIM) where n is the sample number (n = 1.ti. B. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . 2. TMS320F2811. TMS320F2812 TMS320C2810. 3. and so forth). When necessary. This includes alignment cycles. XZCS2. Figure 6-33. Signal can be high or low during this time. the device will insert an alignment cycle before an access to meet this requirement. all signals will transition to their inactive state. TMS320C2811. Example Read With Synchronous XREADY Access XTIMING register parameters used for this example: XRDLEAD ≥1 (1) XRDACTIVE 3 XRDTRAIL ≥1 USEREADY 1 X2TIMING 0 XWRLEAD N/A (1) XWRACTIVE N/A (1) XWRTRAIL N/A (1) READYMODE 0 = XREADY (Synch) N/A = “Don’t care” for this example 134 Electrical Specifications Copyright © 2001–2011. For each sample. D. C. E. the XINTF address bus will always hold the last address put out on the bus. th(XRDYsynchH)XZCSH A. During inactive cycles. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT.com See Notes (A) and (B) Lead XCLKOUT = XTIMCLK XCLKOUT = 1/2 XTIMCLK XZCS0AND1. XZCS6AND7 XA[0:18] td(XCOH-XZCSL) td(XCOH-XA) WS (Synch) Active Trail See Note (C) td(XCOHL-XZCSH) td(XCOHL-XRDL) XRD XWE XR/W ta(A) XD[0:15] tsu(XRDYsynchL)XCOHL te(XRDYsynchH) DIN tsu(XD)XRD ta(XRD) td(XCOHL-XRDH) th(XD)XRD th(XRDYsynchL) tsu(XRDHsynchH)XCOHL XREADY(Synch) See Note (D) See Note (E) Legend: = Don’t care. During alignment cycles.

th(XRDYasynchH)XZCSH DIN tsu(XRDYasynchH)XCOHL A. E. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 135 . 3. During inactive cycles. 2. TMS320F2811. TMS320C2812 www. the device will insert an alignment cycle before an access to meet this requirement. Signal can be high or low during this time. During alignment cycles.TMS320F2810. D. setup time from the beginning of the access can be calculated as: D = (XRDLEAD + XRDACTIVE – 3 + n) tc(XTIM) – tsu(XRDYAsynchL)XCOHL where n is the sample number (n = 1. TMS320F2812 TMS320C2810. When necessary. XZCS2. XZCS6AND7 XA[0:18] td(XCOH-XZCSL) td(XCOH-XA) WS (Async) Active Trail See Note (C) td(XCOHL-XZCSH) td(XCOHL-XRDL) XRD XWE XR/W ta(A) tsu(XD)XRD ta(XRD) td(XCOHL-XRDH) th(XD)XRD XD[0:15] tsu(XRDYasynchL)XCOHL te(XRDYasynchH) th(XRDYasynchL) XREADY(Asynch) See Note (D) See Note (E) Legend: = Don’t care. Reference for the first sample is with respect to this point: E = (XRDLEAD + XRDACTIVE – 2) tc(XTIM) Figure 6-34. For each sample. TMS320C2811. C.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 See Notes (A) and (B) Lead XCLKOUT = XTIMCLK XCLKOUT = 1/2 XTIMCLK XZCS0AND1. and so forth). This includes alignment cycles. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT. B. the XINTF address bus will always hold the last address put out on the bus.ti. Example Read With Asynchronous XREADY Access XTIMING register parameters used for this example: XRDLEAD ≥1 (1) XRDACTIVE 3 XRDTRAIL ≥1 USEREADY 1 X2TIMING 0 XWRLEAD N/A (1) XWRACTIVE N/A (1) XWRTRAIL N/A (1) READYMODE 1 = XREADY (Async) N/A = “Don’t care” for this example Copyright © 2001–2011. all signals will transition to their inactive state.

if XREADY (asynchronous) is found to be high. TMS320C2811. write data valid after XWE inactive-high Maximum time for DSP to release the data bus after XR/W inactive-high TW – 2 (1) (2) MIN –2 MAX 1 3 2 2 2 1 UNIT ns ns ns ns ns ns ns ns ns ns ns –2 0 1 4 4 ns During inactive cycles. it will be sampled again each tc(XTIM) until it is found to be high. TMS320F2811. XREADY (synchronous) high before XCLKOUT high/low Hold time. Asynchronous XREADY Timing Requirements (Ready-on-Write. 1 Wait State) (1) MIN tsu(XRDYasynchL)XCOHL th(XRDYasynchL) te(XRDYasynchH) tsu(XRDYasynchH)XCOHL th(XRDYasynchH)XZCSH (1) Setup time. 3. XCLKOUT high to XR/W low Delay time. Table 6-40. it will be sampled again each tc(XTIM) until it is found to be high. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. setup time from the beginning of the access can be calculated as: D = (XWRLEAD + XWRACTIVE + n – 1) tc(XTIM) – tsu(XRDYsynchL)XCOHL where n is the sample number (n = 1. XCLKOUT high to address valid Delay time.TMS320F2810. 3. Table 6-41. XCLKOUT high/low to XWE high Delay time. XREADY (synchronous) low Earliest time XREADY (synchronous) can go high before the sampling XCLKOUT edge Setup time. XREADY (synchronous) held high after zone chip-select high 15 0 15 12 3 MAX UNIT ns ns ns ns ns The first XREADY (synchronous) sample occurs with respect to E in Figure 6-35: E = (XWRLEAD + XWRACTIVE) tc(XTIM) When first sampled. the XINTF address bus will always hold the last address put out on the bus. XREADY (asynchronous) held high after zone chip-select high 11 0 11 8 3 MAX UNIT ns ns ns ns ns The first XREADY (synchronous) sample occurs with respect to E in Figure 6-36: E = (XWRLEAD + XWRACTIVE – 2) tc(XTIM) When first sampled. See Table 6-30. setup time from the beginning of the access can be calculated as: D = (XWRLEAD + XWRACTIVE – 3 + n) tc(XTIM) – tsu(XRDYasynchL)XCOHL where n is the sample number (n = 1. 1 Wait State) (1) MIN tsu(XRDYsynchL)XCOHL th(XRDYsynchL) te(XRDYsynchH) tsu(XRDYsynchH)XCOHL th(XRDYsynchH)XZCSH (1) Setup time. 136 Electrical Specifications Copyright © 2001–2011. XREADY (synchronous) low before XCLKOUT high/low Hold time. data bus driven from XWE low Delay time. TW = trail period. 2. For each sample. and so forth). XCLKOUT high/low to XR/W high Enable time. 2. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . If XREADY (synchronous) is found to be low. 1 Wait State) PARAMETER td(XCOH-XZCSL) td(XCOHL-XZCSH) td(XCOH-XA) td(XCOHL-XWEL) td(XCOHL-XWEH) td(XCOH-XRNWL) td(XCOHL-XRNWH) ten(XD)XWEL td(XWEL-XD) th(XA)XZCSH th(XD)XWE tdis(XD)XRNW (1) (2) Delay time. XCLKOUT high to zone chip-select active-low Delay time. then the access will complete.27 External Interface Ready-on-Write Timing With One External Wait State Table 6-39. If XREADY (asynchronous) is found to be low. XREADY (asynchronous) low Earliest time XREADY (asynchronous) can go high before the sampling XCLKOUT edge Setup time. and so forth). write access. TMS320F2812 TMS320C2810. XCLKOUT high/low to XWE low Delay time. For each sample. if XREADY (synchronous) is found to be high.ti. data valid after XWE active-low Hold time. This includes alignment cycles. External Memory Interface Write Switching Characteristics (Ready-on-Write. XREADY (asynchronous) low before XCLKOUT high/low Hold time. then the access will complete. Synchronous XREADY Timing Requirements (Ready-on-Write.com 6. XREADY (asynchronous) high before XCLKOUT high/low Hold time. XCLKOUT high or low to zone chip-select inactive-high Delay time. address valid after zone chip-select inactive-high Hold time.

During alignment cycles. C. 2.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 See Notes (A) and (B) Lead 1 XCLKOUT = XTIMCLK XCLKOUT = 1/2 XTIMCLK XZCS0AND1. all signals will transition to their inactive state. Reference for the first sample is with respect to this point E = (XWRLEAD + XWRACTIVE) tc(XTIM) Figure 6-35. TMS320F2811. When necessary. B. XZCS2. TMS320C2812 www. the XINTF address bus will always hold the last address put out on the bus. Write With Synchronous XREADY Access XTIMING register parameters used for this example: XRDLEAD N/A (1) (1) XRDACTIVE N/A (1) XRDTRAIL N/A (1) USEREADY 1 X2TIMING 0 XWRLEAD ≥1 XWRACTIVE 3 XWRTRAIL ≥1 READYMODE 0 = XREADY (Synch) N/A = “Don’t care” for this example Copyright © 2001–2011. setup time from the beginning of the access can be calculated as: D = (XWRLEAD + XWRACTIVE + n – 1) tc(XTIM) – tsu(XRDYsynchL)XCOHL where n is the sample number (n = 1. Signal can be high or low during this time. This includes alignment cycles. the device will insert an alignment cycle before an access to meet this requirement. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 137 . For each sample.ti. 3 and so forth). TMS320F2812 TMS320C2810. XZCS6AND7 XA[0:18] XRD td(XCOH-XZCSL) td(XCOH-XA) WS (Synch) Active Trail See Note (C) td(XCOHL-XZCSH) th(XRDYsynchH)XZCSH td(XCOHL-XWEL) XWE td(XCOH-XRNWL) XR/W td(XWEL-XD) ten(XD)XWEL XD[0:15] tsu(XRDYsynchL)XCOHL te(XRDYsynchH) th(XRDYsynchL) DOUT td(XCOHL-XWEH) td(XCOHL-XRNWH) tdis(XD)XRNW th(XD)XWEH tsu(XRDHsynchH)XCOHL XREADY(Synch) See Note (D) See Note (E) Legend: = Don’t care. D. E. A.TMS320F2810. TMS320C2811. During inactive cycles. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT.

2. all signals will transition to their inactive state.TMS320F2810. During inactive cycles. the device will insert an alignment cycle before an access to meet this requirement. Reference for the first sample is with respect to this point E = (XWRLEAD + XWRACTIVE – 2) tc(XTIM) Figure 6-36. B. XZCS2.com See Notes (A) and (B) Lead 1 XCLKOUT = XTIMCLK XCLKOUT = 1/2 XTIMCLK XZCS0AND1. During alignment cycles. D. For each sample. TMS320C2811.ti. E. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . the XINTF address bus will always hold the last address put out on the bus. TMS320F2812 TMS320C2810. Write With Asynchronous XREADY Access XTIMING register parameters used for this example: XRDLEAD N/A (1) (1) XRDACTIVE N/A (1) XRDTRAIL N/A (1) USEREADY 1 X2TIMING 0 XWRLEAD ≥1 XWRACTIVE 3 XWRTRAIL ≥1 READYMODE 1 = XREADY (Async) N/A = “Don’t care” for this example 138 Electrical Specifications Copyright © 2001–2011. td(XCOHL-XWEH) td(XCOHL-XRNWH) tdis(XD)XRNW th(XD)XWEH A. C. 3 and so forth). XZCS6AND7 XA[0:18] XRD td(XCOH-XZCSL) td(XCOH-XA) WS (Async) Active Trail See Note (C) td(XCOHL-XZCSH) th(XRDYasynchH)XZCSH td(XCOHL-XWEL) XWE td(XCOH-XRNWL) XR/W td(XWEL-XD) ten(XD)XWEL XD[0:15] DOUT tsu(XRDYasynchL)XCOHL th(XRDYasynchL) te(XRDYasynchH) tsu(XRDYasynchH)XCOHL XREADY(Asynch) See Note (D) See Note (E) Legend: = Don’t care. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT. When necessary. TMS320F2811. This includes alignment cycles. setup time from the beginning of the access can be calculated as: D = (XWRLEAD + XWRACTIVE – 3 + n) tc(XTIM) – tsu(XRDYasynchL)XCOHL where n is the sample number (n = 1. Signal can be high or low during this time.

28 XHOLD and XHOLDA If the HOLD mode bit is set while XHOLD and XHOLDA are both low (external bus accesses granted). places the following signals in a high-impedance mode: XA[18:0] XD[15:0] XWE. the CPU is stalled until the XHOLD signal is removed. the bus and all signal strobes must be in high-impedance mode. and the XHOLDA signal is also driven active low. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 139 . when granted. On a reset (XRS).ti. If an access is made to the external interface. TMS320F2811. TMS320F2812 TMS320C2810.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. the HOLD mode bit is set to 0. TMS320C2811. XRD XR/W All other signals not listed in this group remain in their default or functional operational modes during these signal events. TMS320C2812 www. the CPU can still execute code from internal memory. An external DMA request. When HOLD mode is enabled and XHOLDA is active-low (external bus grant active). If the XHOLD signal is active low on a system reset. the XHOLDA signal is forced high (at the end of the current cycle) and the external interface is taken out of high-impedance mode. XZCS0AND1 XZCS2 XZCS6AND7 Copyright © 2001–2011.TMS320F2810.

XCLKOUT (/1 Mode) td(HL-Hiz) XHOLD td(HH-HAH) XHOLDA td(HL-HAL) td(HH-BV) High-Impedance XR/W. all pending XINTF accesses will be completed before the bus is placed in a high-impedance state. XHOLD high to XHOLDA high Delay time.com 6. The state of XHOLD is latched on the rising edge of XTIMCLK. TMS320F2811. All pending XINTF accesses are completed. TMS320F2812 TMS320C2810. and Control Delay time. XZCS0AND1. TMS320C2811. XHOLD/XHOLDA Timing Requirements (XCLKOUT = XTIMCLK) (1) (2) MIN td(HL-HiZ) td(HL-HAL) td(HH-HAH) td(HH-BV) (1) (2) Delay time. XHOLD high to Bus valid MAX 4tc(XTIM) 5tc(XTIM) 3tc(XTIM) 4tc(XTIM) UNIT ns ns ns ns When a low signal is detected on XHOLD. Data.29 XHOLD/XHOLDA Timing Table 6-42. B. Figure 6-37. Normal XINTF operation resumes. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. XHOLD low to XHOLDA low Delay time. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . XHOLD low to Hi-Z on all Address. XZCS6AND7 XA[18:0] Valid High-Impedance Valid XD[15:0] Valid See Note (A) See Note (B) A.ti. External Interface Hold Waveform 140 Electrical Specifications Copyright © 2001–2011. XZCS2.TMS320F2810.

XZCS2. TMS320F2811. the transitions can occur up to 1 XTIMCLK cycle earlier than the maximum value specified.TMS320F2810. XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK) (1) (2) (3) MIN td(HL-HiZ) td(HL-HAL) td(HH-HAH) td(HH-BV) (1) (2) (3) Delay time. XHOLD high to Bus valid MAX 4tc(XTIM) + tc(XCO) 4tc(XTIM) + 2tc(XCO) 4tc(XTIM) 6tc(XTIM) UNIT ns ns ns ns When a low signal is detected on XHOLD. XHOLD low to XHOLDA low Delay time. XCLKOUT (1/2 XTIMCLK) td(HL-HAL) XHOLD td(HH-HAH) XHOLDA td(HL-HiZ) td(HH-BV) High-Impedance XR/W. all bus transitions and XHOLDA transitions will occur with respect to the rising edge of XCLKOUT. The state of XHOLD is latched on the rising edge of XTIMCLK. all pending XINTF accesses will be completed before the bus is placed in a high-impedance state. TMS320F2812 TMS320C2810.ti. After the XHOLD is detected low or high. All pending XINTF accesses are completed. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 141 . for this mode where XCLKOUT = 1/2 XTIMCLK. XHOLD high to XHOLDA high Delay time. Normal XINTF operation resumes. Figure 6-38. XZCS0AND1. XZCS6AND7 XA[18:0] Valid High-Impedance Valid XD[15:0] See Note (A) Valid High-Impedance See Note (B) A. B. and Control Delay time. TMS320C2812 www. Thus. TMS320C2811. XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK) Copyright © 2001–2011. XHOLD low to Hi-Z on all Address.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 6-43. Data.

TMS320F2810. 142 Electrical Specifications Copyright © 2001–2011. Supply voltage range (VSSA1/VSSA2 to VDDA1/VDDA2/AVDDREFBG) Supply voltage range (VSS1 to VDD1) Analog Input (ADCIN) Clamp Current. TMS320F2811. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. The continuous clamp current per pin is ±2 mA. the list of absolute maximum ratings are specified over operating conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. total (max) (1) –0.com 6. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.3 V to 4.30 On-Chip Analog-to-Digital Converter 6.30.6 V –0.ti. These are stress ratings only.3 V to 2.5 V ±20 mA (1) The analog inputs have an internal clamping circuit that clamps the voltage to a diode drop above VDDA or below VSS.1 ADC Absolute Maximum Ratings Unless otherwise noted. TMS320C2811. TMS320F2812 TMS320C2810.

9-kΩ bias. The INL degrades for frequencies beyond 18. The ADC converter uses the difference between these two as its reference.ti. A software-based calibration procedure is recommended for better accuracy.9 0.05 V V V PPM/°C µV 0 –5 0 10 3 ±5 3 5 V mV pF µA F281x C281x If ADCREFP – ADCREFM = 1 V ± 0. ADCREFP – ADCREFM Temperature coefficient Reference noise EXTERNAL VOLTAGE REFERENCE (6) Accuracy. Applications that require these sampling rates should use a 20K resistor as bias resistor on the ADCRESEXT pin. the analog inputs should be kept within these limits.TMS320F2810.95 0. DC Specifications (1) PARAMETER Resolution ADC clock (2) ACCURACY INL (Integral nonlinearity) Offset error (4) Overall gain error with internal reference (5) Overall gain error with external reference (6) Channel-to-channel offset variation Channel-to-channel Gain variation ANALOG INPUT Analog input voltage (ADCINx to ADCLO) (7) ADCLO Input capacitance Input leakage current INTERNAL VOLTAGE REFERENCE (5) Accuracy. Copyright © 2001–2011.3 V applied to an analog input pin may temporarily affect the conversion of another pin. the accuracy of external reference is critical for overall gain. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 143 .com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. ADC clock ≤ SYSCLKOUT/2. The voltage difference (ADCREFP – ADCREFM) will determine the overall accuracy. for relevant documents. See the F2810. Voltages above VDDA + 0. Documentation Support. In this mode. A single internal band gap reference (±5% accuracy) sources both ADCREFP and ADCREFM signals.9k bias on ADCRESEXT pin for the full range 1–25 MHz.01 V V V 1.1 1.99 2 1 1 2.75 MHz–25 MHz.732 mV.30.2. these voltages track together. To avoid this. ADCVREFP Accuracy.1 1.75 MHz ADC clock –80 –200 –80 –50 ±8 ±8 ±1. TMS320C2811.75 MHz ADC clock 1–18.2 ADC Electrical Characteristics Over Recommended Operating Conditions Table 6-44. This improves overall linearity and typical current drawn by the ADC will be a few mA more than 24. TMS320F2811.0/4096 = 0. ADCVREFM Voltage difference. 1 LSB has the weighted value of 3. ADCVREFP Accuracy. The ADC module in C281x devices can operate at 24.1% (3) MIN 12 1 TYP MAX UNIT Bits kHz 25 1–18. ADCVREFM Input voltage difference. TMS320C2812 www.9 0. and hence.05 1.5-MHz ADCCLK. and F2812 ADC Calibration Application Report (literature number SPRA989) and Section 5. The total gain error will be the combination of the gain error shown here and the voltage reference accuracy (ADCREFP – ADCREFM). TMS320F2812 TMS320C2810.95 2 1 1 50 100 2. If SYSCLKOUT ≤ 25 MHz. ADCREFP – ADCREFM (1) (2) (3) (4) (5) 1.5 ±1 80 200 80 50 MHz LSB LSB LSB LSB LSB LSB LSB DNL (Differential nonlinearity) (3) (6) (7) Tested at 12.3 V or below VSS – 0. F2811.

5 mA ADC OPERATING MODE/CONDITIONS Mode A (Operational Mode): • BG and REF enabled • PWD disabled Mode B: • ADC clock enabled • BG and REF enabled • PWD enabled Mode C: • ADC clock enabled • BG and REF disabled • PWD enabled Mode D: • ADC clock disabled • BG and REF disabled • PWD enabled 7 mA 0 5 µA 1 µA 0 5 µA 1 µA 0 0 (1) (2) Test Conditions: • SYSCLKOUT = 150 MHz • ADC module clock = 25 MHz • ADC performing a continuous conversion of all 16 channels in Mode A IDDA – includes current into VDDA1/VDDA2 and AVDDREFBG Rs ADCIN0 Ron 1 kW Switch Source Signal ac Cp 10 pF Ch 1.25 pF 28x DSP Typical Values of the Input Circuit Components: Switch Resistance (Ron): 1 kW Sampling Capacitor (Ch): 1.ti.com Table 6-45.30.3 Current Consumption for Different ADC Configurations Table 6-46. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.25 pF Parasitic Capacitance (Cp): 10 pF Source Resistance (Rs): 50 W Figure 6-39. TMS320F2811. Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK) (1) IDDA (TYP) (2) 40 mA IDDAIO (TYP) 1 µA IDD1 (TYP) 0. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320F2812 TMS320C2810.1 69 MAX UNIT dB dB dB Bits dB 6. AC Specifications PARAMETER SINAD SNR THD (100 kHz) ENOB (SNR) SFDR Signal-to-noise ratio + distortion Signal-to-noise ratio Total harmonic distortion Effective number of bits Spurious free dynamic range MIN TYP 62 62 –68 10. TMS320C2811. ADC Analog Input Impedance Model 144 Electrical Specifications Copyright © 2001–2011.TMS320F2810.

30.30. TMS320F2812 TMS320C2810. If conversions are started without these delays.4 Conversion Modes The conversion can be performed in two different conversion modes: • Sequential sampling mode (SMODE = 0) • Simultaneous sampling mode (SMODE = 1) Copyright © 2001–2011.30. ADC Power-Up Control Bit Timing Table 6-47. TMS320C2812 www.0 V and ADCVREFM is set to 1. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 145 .5 Detailed Description 6. ADCVREFP is set to 2. ADC Power-Up Delays (1) MIN td(BGR) Delay time for band gap reference to be stable. These inputs are software-selectable.5.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6.30. Bits 7 and 6 of the ADCTRL3 register (ADCBGRFDN1/0) are to be set to 1 before the ADCPWDN bit is enabled.1 Reference Voltage The on-chip ADC has a built-in reference.3 Converter The on-chip ADC uses a 12-bit four-stage pipeline architecture. TMS320C2811. 6.4 ADC Power-Up Control Bit Timing ADC Power Up Delay PWDNBG ADC Ready for Conversions PWDNREF td(BGR) PWDNADC td(PWD) Request for ADC Conversion Figure 6-40.5. which achieves a high sample rate with low power consumption. the ADC results will show a higher gain.TMS320F2810. 6. all three bits can be cleared at the same time. 6.2 Analog Inputs The on-chip ADC consists of 16 analog inputs. 6. TMS320F2811. 7 20 TYP 8 50 1 MAX 10 UNIT ms µs ms td(PWD) (1) These delays are necessary and recommended to make the ADC analog reference circuit stable before conversions are initiated. which are sampled either one at a time or two channels at a time.0 V. Delay time for power-down control to be stable.5.30. Bit 5 of the ADCTRL3 register (ADCPWDN) is to be set to 1 before any ADC conversions are initiated. For power down.ti.5.30. which provides the reference voltages for the ADC.

Sample n+2 Sample n+1 Analog Input on Channel Ax or Bx Sample n ADC Clock Sample and Hold SH Pulse SMODE Bit td(SH) tdschx_n ADC Event Trigger from EV or Other Sources tSH tdschx_n+1 Figure 6-41. The selected channels will be sampled at every falling edge of the Sample/Hold pulse. TMS320F2811. tc(ADCCLK) = 40 ns REMARKS td(schx_n) 4tc(ADCCLK) 160 ns td(schx_n+1) (2 + Acqps) * tc(ADCCLK) 80 ns 146 Electrical Specifications Copyright © 2001–2011. software trigger. The ADC can start conversions on event triggers from the Event Managers (EVA/EVB). Sequential Sampling Mode Timing SAMPLE n td(SH) tSH Delay time from event trigger to sampling Sample/ Hold width/ Acquisition width Delay time for first result to appear in the Result register Delay time for successive results to appear in the Result register 2.30. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . TMS320C2811. The ADC interrupt flags are set a few SYSCLKOUT cycles after the Result register update. The Sample/Hold pulse width can be programmed to be 1 ADC clock wide (minimum) or 16 ADC clocks wide (maximum). The conversion time and latency of the Result register update are explained below.6 Sequential Sampling Mode (Single-Channel) (SMODE = 0) In sequential sampling mode. or from an external ADCSOC signal. the ADC can continuously convert input signals on any of the channels (Ax to Bx). TMS320F2812 TMS320C2810. If the SMODE bit is 0.com 6.ti.TMS320F2810. the ADC will do conversions on the selected channel on every Sample/Hold pulse. Sequential Sampling Mode (Single-Channel) Timing Table 6-48.5tc(ADCCLK) (1 + Acqps) * tc(ADCCLK) 40 ns with Acqps = 0 Acqps value = 0–15 ADCTRL1[8:11] SAMPLE n + 1 AT 25-MHz ADC CLOCK.

. TMS320F2811. The ADC can start conversions on event triggers from the Event Managers (EVA/EVB). The conversion time and latency of the Result register update are explained below.7 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1) In simultaneous mode. A7/B7. tc(ADCCLK) = 40 ns REMARKS td(schB0_n) 5tc(ADCCLK) 200 ns td(schA0_n+1) (3 + Acqps) * tc(ADCCLK) 120 ns td(schB0_n+1) (3 + Acqps) * tc(ADCCLK) 120 ns Copyright © 2001–2011.5tc(ADCCLK) (1 + Acqps) * tc(ADCCLK) 4tc(ADCCLK) 40 ns with Acqps = 0 160 ns Acqps value = 0–15 ADCTRL1[8:11] SAMPLE n + 1 AT 25-MHz ADC CLOCK. software trigger. Simultaneous Sampling Mode Timing Table 6-49. The ADC interrupt flags are set a few SYSCLKOUT cycles after the Result register update. TMS320C2812 www. A1/B1... the ADC can continuously convert input signals on any one pair of channels (A0/B0 to A7/B7).TMS320F2810.ti. and not in other combinations (such as A1/B3. etc. If the SMODE bit is 1. The selected channels will be sampled simultaneously at the falling edge of the Sample/Hold pulse.30. . The Sample/Hold pulse width can be programmed to be 1 ADC clock wide (minimum) or 16 ADC clocks wide (maximum). Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 147 .). TMS320F2812 TMS320C2810. the ADC will do conversions on two selected channels on every Sample/Hold pulse. Sample n Analog Input on Channel Ax Analog Input on Channel Bv ADC Clock Sample and Hold SH Pulse SMODE Bit ADC Event Trigger from EV or Other Sources tSH Sample n+1 Sample n+2 td(SH) tdschA0_n+1 tdschA0_n tdschB0_n tdschB0_n+1 Figure 6-42. NOTE In Simultaneous Mode. TMS320C2811. Simultaneous Sampling Mode Timing SAMPLE n td(SH) tSH td(schA0_n) Delay time from event trigger to sampling Sample/Hold width/ Acquisition Width Delay time for first result to appear in Result register Delay time for first result to appear in Result register Delay time for successive results to appear in Result register Delay time for successive results to appear in Result register 2. or from an external ADCSOC signal.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. the ADCIN channel pair select has to be A0/B0.

The last transition should occur at an analog value 1 1/2 LSB below the nominal full scale. The value for SINAD is expressed in decibels. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . DNL is the deviation from this ideal value. TMS320C2811. the effective number of bits.76) N= 6.ti.TMS320F2810.com 6. The point used as zero occurs 1/2 LSB before the first code transition. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions. Using the following formula.8 Definitions of Specifications and Terminology Integral Nonlinearity Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale. Thus. Spurious Free Dynamic Range (SFDR) SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal. effective number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD. (SINAD . SINAD can be expressed in terms of the number of bits. A differential nonlinearity error of less than ±1 LSB ensures no missing codes. Effective Number of Bits (ENOB) For a sine wave. Gain Error The first code transition should occur at an analog value 1/2 LSB above negative full scale. 148 Electrical Specifications Copyright © 2001–2011.30. TMS320F2811. Zero error is defined as the deviation of the actual transition from that point. including harmonics but excluding dc. The full-scale point is defined as level 1/2 LSB beyond the last code transition. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. Zero Offset The major carry transition should occur when the analog input is at zero volt. TMS320F2812 TMS320C2810. Signal-to-Noise Ratio + Distortion (SINAD) SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency. The deviation is measured from the center of each particular code to the true straight line between these two points.02 it is possible to get a measure of performance expressed as N. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal and is expressed as a percentage or in decibels.1. Differential Nonlinearity An ideal ADC exhibits code transitions that are exactly 1 LSB apart.

31. CLKR) speeds are not greater than the I/O buffer speed limit (20 MHz). external FSR high before CLKR low Hold time. McBSP Timing Requirements (1) (2) NO. 2P = 1/CLKG in ns. CLKR) range McBSP module cycle time (CLKG. external FSX high before CLKX low Hold time. CLKR/X Setup time. Copyright © 2001–2011. CLKG = CLKSRG/(1 + CLKGDV). CLKR/X Pulse duration. TMS320F2812 TMS320C2810. TMS320C2812 www. DR valid before CLKR low Hold time. TMS320C2811. CLKG is the output of sample rate generator mux. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 149 . McBSP performance is limited by I/O buffer switching speed.ti.31 Multichannel Buffered Serial Port (McBSP) Timing 6. CLKR/X high or CLKR/X low Rise time. DR valid after CLKR low Setup time. CLKSRG can be LSPCLK. external FSR high after CLKR low Setup time. TMS320F2811.1 McBSP Transmit and Receive Timing Table 6-50. CLKR/X Fall time. CLKSRG ≤ (SYSCLKOUT/2). Internal clock prescalers must be adjusted such that the McBSP clock (CLKG. CLKX. CLKR as source. McBSP module clock (CLKG. then the timing references of that signal are also inverted.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 6. CLKR) range M11 M12 M13 M14 M15 M16 M17 M18 M19 M20 (1) (2) (3) tc(CKRX) tw(CKRX) tr(CKRX) tf(CKRX) tsu(FRH-CKRL) th(CKRL-FRH) tsu(DRV-CKRL) th(CKRL-DRV) tsu(FXH-CKXL) th(CKXL-FXH) Cycle time. external FSX high after CLKX low CLKR/X ext CLKR/X ext CLKR/X ext CLKR/X ext CLKR int CLKR ext CLKR int CLKR ext CLKR int CLKR ext CLKR int CLKR ext CLKX int CLKX ext CLKX int CLKX ext 18 2 0 6 18 2 0 6 18 2 0 6 MIN 1 20 50 1 2P P–7 7 7 (3) MAX UNIT kHz MHz ns ms ns ns ns ns ns ns ns ns ns ns Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted. CLKX. CLKX. CLKX.TMS320F2810.

ti. CLKR high to internal FSR valid Delay time. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . (1) (2) (3) Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. This applies to all bits except the first bit transmitted. CLKX high to DX driven. 2P = 1/CLKG in ns. M1 M2 M3 M4 M5 M6 tc(CKRX) tw(CKRXH) tw(CKRXL) td(CKRH-FRV) td(CKXH-FXV) tdis(CKXH-DXHZ) Cycle time. M7 td(CKXH-DXV) Delay time. C = CLKRX low pulse width = P D = CLKRX high pulse width = P 150 Electrical Specifications Copyright © 2001–2011.TMS320F2810. Delay time. TMS320C2811. FSX high to DX valid. Only applies to first bit transmitted when in Data Delay 1 or 2 (XDATDLY = 01b or 10b) modes. McBSP Switching Characteristics (1) (2) NO. Enable time. M8 ten(CKXH-DX) Only applies to first bit transmitted when in Data Delay 1 or 2 (XDATDLY = 01b or 10b) modes.com Table 6-51. CLKX high to DX high impedance following last data bit Delay time. TMS320F2811. CLKR/X low Delay time. M9 td(FXH-DXV) Only applies to first bit transmitted when in Data Delay 0 (XDATDLY = 00b) mode. CLKR/X Pulse duration. FSX high to DX driven. DXENA = 0 DXENA = 1 DXENA = 0 DXENA = 1 DXENA = 0 DXENA = 1 DXENA = 0 DXENA = 1 PARAMETER CLKR/X int CLKR/X int CLKR/X int CLKR int CLKR ext CLKX int CLKX ext CLKX int CLKX ext CLKX int CLKX ext CLKX int CLKX ext CLKX int CLKX ext CLKX int CLKX ext CLKX int CLKX ext FSX int FSX ext FSX int FSX ext FSX int FSX ext FSX int FSX ext 0 6 P P+6 ns 0 6 P P+6 8 14 P+8 P + 14 ns ns MIN 2P D – 5 (3) C – 5 (3) 0 3 0 3 D + 5 (3) C + 5 (3) 4 27 4 27 8 14 9 28 8 14 P+8 P + 14 ns MAX UNIT ns ns ns ns ns ns Enable time. CLKX high to DX valid. If the polarity of any of the signals is inverted. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. CLKR/X high Pulse duration. CLKX high to internal FSX valid Disable time. CLKX high to DX valid. TMS320F2812 TMS320C2810. M10 ten(FXH-DX) Only applies to first bit transmitted when in Data Delay 0 (XDATDLY = 00b) mode. then the timing references of that signal are also inverted.

M11 M2.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 M1. M12 M3. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 151 . M11 M2. M12 M3. M12 CLKX M5 FSX (int) M19 FSX (ext) M9 DX (XDATDLY=00b) M10 Bit 0 Bit (n-1) M8 DX (XDATDLY=01b) Bit 0 M6 DX (XDATDLY=10b) M8 Bit 0 Bit (n-1) (n-2) Bit (n-1) (n-2) M7 (n-3) (n-2) M7 M7 (n-3) (n-4) M20 M5 M13 M14 Figure 6-44.TMS320F2810. TMS320C2811. TMS320F2811. McBSP Receive Timing M1. McBSP Transmit Timing Copyright © 2001–2011. TMS320C2812 www. TMS320F2812 TMS320C2810.ti. M12 CLKR M4 FSR (int) M15 FSR (ext) M18 M17 DR (RDATDLY=00b) DR (RDATDLY=01b) DR (RDATDLY=10b) Bit (n-1) M17 Bit (n-1) M17 Bit (n-1) (n-2) M18 (n-2) M18 (n-2) (n-3) (n-3) (n-4) M16 M4 M14 M13 Figure 6-43.

McBSP Timing as SPI Master or Slave: CLKSTP = 10b. M30 M31 M32 M33 (1) tsu(DRV-CKXL) th(CKXL-DRV) tsu(BFXL-CKXH) tc(CKX) Setup time.ti. FSX low to CLKX high Disable time. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TMS320F2811. TMS320C2811.6875 MHz and P = 13. CLKG should be LSPCLK/2 by setting CLKSM = CLKGDV = 1. CLKXP = 0) (1) NO.6875 MHz and P = 13. Also. LSB M32 MSB M33 CLKX M24 FSX M28 DX Bit 0 M30 DR Bit 0 Bit(n-1) M29 Bit(n-1) (n-2) M31 (n-2) (n-3) (n-4) (n-3) (n-4) M25 Figure 6-45. CLKX maximum frequency will be LSPCLK/16 .31. CLKX has to be minimum 8 CLKG cycles. FSX low to DX valid MASTER MIN 2P P 6 6 6P + 6 4P + 6 MAX SLAVE MIN MAX UNIT ns ns ns ns 2P = 1/CLKG. TMS320F2812 TMS320C2810. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b. With maximum LSPCLK speed of 75 MHz. With maximum LSPCLK speed of 75 MHz. CLKX maximum frequency will be LSPCLK/16 . FSX low after CLKX low Delay time. DX high impedance following last data bit from FSX high Delay time.2 McBSP as SPI Master or Slave Timing Table 6-52. CLKG should be LSPCLK/2 by setting CLKSM = CLKGDV = 1. CLKXP = 0) (1) NO. M24 M25 M28 M29 (1) th(CKXL-FXL) td(FXL-CKXH) tdis(FXH-DXHZ) td(FXL-DXV) PARAMETER Hold time. DR valid after CLKX low Setup time. CLKX has to be minimum 8 CLKG cycles. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b. For all SPI slave modes. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 . that is 4. FSX low before CLKX high Cycle time. CLKX 2P MASTER MIN 30 1 MAX SLAVE MIN 8P – 10 8P – 10 8P + 10 16P MAX UNIT ns ns ns ns 2P = 1/CLKG.3 ns. DR valid before CLKX low Hold time.3 ns. CLKXP = 0 152 Electrical Specifications Copyright © 2001–2011.TMS320F2810.com 6. For all SPI slave modes. Table 6-53. that is 4. Also.

DR valid after CLKX high Setup time. CLKXP = 0) (1) NO. For all SPI slave modes. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 6-54. Also CLKG should be LSPCLK/2 by setting CLKSM = CLKGDV = 1. CLKX has to be minimum 8 CLKG cycles.TMS320F2810. M39 M40 M41 M42 (1) tsu(DRV-CKXH) th(CKXH-DRV) tsu(FXL-CKXH) tc(CKX) Setup time. For all SPI slave modes.ti. TMS320F2812 TMS320C2810.6875 MHz and P = 13. M34 M35 M37 M38 (1) th(CKXL-FXL) td(FXL-CKXH) tdis(CKXL-DXHZ) td(FXL-DXV) PARAMETER Hold time. CLKX has to be minimum 8 CLKG cycles. CLKX maximum frequency will be LSPCLK/16 .3 ns. Table 6-55. McBSP Timing as SPI Master or Slave: CLKSTP = 11b. CLKXP = 0 Copyright © 2001–2011. TMS320F2811. CLKXP = 0) (1) NO. FSX low after CLKX low Delay time.3 ns. FSX low to DX valid MASTER MIN P 2P P+6 6 7P + 6 4P + 6 MAX SLAVE MIN MAX UNIT ns ns ns ns 2P = 1/CLKG. With maximum LSPCLK speed of 75 MHz. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 153 . LSB CLKX M34 FSX M37 DX Bit 0 M39 DR Bit 0 Bit(n-1) M38 Bit(n-1) (n-2) M40 (n-2) (n-3) (n-4) (n-3) (n-4) M35 MSB M42 M41 Figure 6-46. DR valid before CLKX high Hold time. CLKX 2P MASTER MIN 30 1 MAX SLAVE MIN 8P – 10 8P – 10 16P + 10 16P MAX UNIT ns ns ns ns 2P = 1/CLKG. With maximum LSPCLK speed of 75 MHz. that is 4. FSX low before CLKX high Cycle time. DX high impedance following last data bit from CLKX low Delay time. TMS320C2811. Also CLKG should be LSPCLK/2 by setting CLKSM = CLKGDV = 1. CLKX maximum frequency will be LSPCLK/16 . McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b.6875 MHz and P = 13. that is 4. FSX low to CLKX high Disable time. TMS320C2812 www.

ti. that is 4. CLKX has to be minimum 8 CLKG cycles. FSX low to DX valid MASTER MIN 2P P 6 6 6P + 6 4P + 6 MAX SLAVE MIN MAX UNIT ns ns ns ns 2P = 1/CLKG. FSX low before CLKX low Cycle time. CLKXP = 1) (1) NO.3 ns. LSB M51 MSB M52 CLKX M43 FSX M47 DX M48 M44 Bit 0 M49 Bit(n-1) (n-2) M50 (n-3) (n-4) DR Bit 0 Bit(n-1) (n-2) (n-3) (n-4) Figure 6-47. With maximum LSPCLK speed of 75 MHz. FSX low to CLKX low Disable time. CLKXP = 1) (1) NO. TMS320F2811. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. TMS320C2811. M49 M50 M51 M52 (1) tsu(DRV-CKXH) th(CKXH-DRV) tsu(FXL-CKXL) tc(CKX) Setup time.com Table 6-56. M43 M44 M47 M48 (1) th(CKXH-FXL) td(FXL-CKXL) tdis(FXH-DXHZ) td(FXL-DXV) PARAMETER Hold time.6875 MHz and P = 13. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .3 ns. For all SPI slave modes. FSX low after CLKX high Delay time. CLKX maximum frequency will be LSPCLK/16 . McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b. DR valid after CLKX high Setup time. CLKX has to be minimum 8 CLKG cycles. CLKX maximum frequency will be LSPCLK/16 . DX high impedance following last data bit from FSX high Delay time. CLKXP = 1 154 Electrical Specifications Copyright © 2001–2011. McBSP Timing as SPI Master or Slave: CLKSTP = 10b. Also CLKG should be LSPCLK/2 by setting CLKSM = CLKGDV = 1.6875 MHz and P = 13. that is 4. Also CLKG should be LSPCLK/2 by setting CLKSM = CLKGDV = 1. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b. TMS320F2812 TMS320C2810. With maximum LSPCLK speed of 75 MHz. For all SPI slave modes.TMS320F2810. CLKX 2P MASTER MIN 30 1 MAX SLAVE MIN 8P – 10 8P – 10 8P + 10 16P MAX UNIT ns ns ns ns 2P = 1/CLKG. DR valid before CLKX high Hold time. Table 6-57.

CLKX 2P MASTER MIN 30 1 MAX SLAVE MIN 8P – 10 8P – 10 16P + 10 16P MAX UNIT ns ns ns ns 2P = 1/CLKG. TMS320C2811. M58 M59 M60 M61 (1) tsu(DRV-CKXL) th(CKXL-DRV) tsu(FXL-CKXL) tc(CKX) Setup time.6875 MHz and P = 13. With maximum LSPCLK speed of 75 MHz. Also CLKG should be LSPCLK/2 by setting CLKSM = CLKGDV = 1.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 6-58. For all SPI slave modes.ti. CLKX maximum frequency will be LSPCLK/16 .3 ns. DX high impedance following last data bit from CLKX high Delay time. FSX low before CLKX low Cycle time. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b.TMS320F2810. FSX low after CLKX high Delay time. For all SPI slave modes. FSX low to CLKX low Disable time. TMS320F2812 TMS320C2810. that is 4. Also CLKG should be LSPCLK/2 by setting CLKSM = CLKGDV = 1. DR valid before CLKX low Hold time. McBSP Timing as SPI Master or Slave: CLKSTP = 11b. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 155 . CLKX maximum frequency will be LSPCLK/16 . CLKXP = 1) (1) NO. that is 4. DR valid after CLKX low Setup time. CLKXP = 1) (1) NO. M53 M54 M56 M57 (1) th(CKXH-FXL) td(FXL-CKXL) tdis(CKXH-DXHZ) td(FXL-DXV) PARAMETER Hold time. TMS320F2811. TMS320C2812 www. CLKXP = 1 Copyright © 2001–2011.6875 MHz and P = 13. CLKX has to be minimum 8 CLKG cycles. With maximum LSPCLK speed of 75 MHz.3 ns. CLKX has to be minimum 8 CLKG cycles. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b. FSX low to DX valid MASTER MIN P 2P P+6 6 7P + 6 4P + 6 MAX SLAVE MIN MAX UNIT ns ns ns ns 2P = 1/CLKG. Table 6-59. LSB CLKX M53 FSX M56 DX Bit 0 M58 DR Bit 0 Bit(n-1) M57 Bit(n-1) M55 (n-2) M59 (n-2) (n-3) (n-4) (n-3) (n-4) M54 M60 MSB M61 Figure 6-48.

ti.TMS320F2810.10 Using Flash API v1 (2) Using Flash API v2. For older silicon revisions. TMS320C2812 SPRS174S – APRIL 2001 – REVISED MARCH 2011 www. For older silicon revisions. TMS320F2812 TMS320C2810. the Write/Erase cycle numbers of 100 (MIN) and 1000 (TYP) are applicable.10 Using Flash API v1 (2) Using Flash API v2. Flash Endurance for A and S Temperature Material (1) ERASE/PROGRAM TEMPERATURE Nf NOTP (1) (2) Flash endurance for the array (Write/Erase cycles) OTP endurance for the array (Write cycles) 0°C to 85°C (ambient) 0°C to 85°C (ambient) MIN 20000 (2) TYP 50000 (2) 1 MAX UNIT cycles write Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers. Table 6-61. The Write/Erase cycle numbers of 20000 (MIN) and 50000 (TYP) are applicable only for silicon revision G. the Write/Erase cycle numbers of 100 (MIN) and 1000 (TYP) are applicable. TMS320F2811. TMS320C2811. C silicon only. Table 6-62. Flash Parameters at 150-MHz SYSCLKOUT (1) PARAMETER 16-Bit Word Program Time 8K Sector 16K Sector Erase Time IDD3VFLP IDDP IDDIOP (1) (2) 8K Sector 16K Sector VDD3VFL current consumption during the Erase/Program cycle VDD current consumption during Erase/Program cycle VDDIO current consumption during Erase/Program cycle Typical parameters as seen at room temperature including function call overhead. with all peripherals off. Erase Program Using Flash API v1 (2) Using Flash API v2.32 Flash Timing (F281x Only) Table 6-60.com 6. Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 .10 MIN TYP 35 50 170 250 320 500 10 11 75 35 140 20 MAX UNIT µs ms ms s mA mA mA 156 Electrical Specifications Copyright © 2001–2011. The Write/Erase cycle numbers of 20000 (MIN) and 50000 (TYP) are applicable only for silicon revision G. Flash API v1.00 is useable on rev. Flash Endurance for Q Temperature Material (1) ERASE/PROGRAM TEMPERATURE Nf NOTP (1) (2) Flash endurance for the array (Write/Erase cycles) OTP endurance for the array (Write cycles) –40°C to 125°C (ambient) –40°C to 125°C (ambient) MIN 20000 (2) TYP 50000 (2) 1 MAX UNIT cycles write Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.

1ú (round up to the next highest integer. whichever is larger) Flash Page Wait State = êç êç t c(SCO) ÷ ú ø û ëè éæ t a(fr) ö ù ÷ . Minimum Required Flash Wait States at Different Frequencies (F281x devices) SYSCLKOUT (MHz) 150 120 100 75 50 30 25 15 4 (1) SYSCLKOUT (ns) 6. or 1.33 40 66. Texas Instruments Incorporated Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 157 . or 0.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 Table 6-63.ti. TMS320F2811.67 8.TMS320F2810.33 20 33.1ú (round up to the next highest integer. Copyright © 2001–2011.1ú (round up to the next highest integer. TMS320C2811.67 250 PAGE WAIT STATE (1) 5 4 3 2 1 1 0 0 0 RANDOM WAIT STATE (1) 5 4 3 2 1 1 1 1 1 (2) OTP 8 7 5 4 2 1 1 1 1 Formulas to compute page wait state and random wait state: éæ t a(fp) ö ù ÷ .33 10 13. or 1. TMS320C2812 www. whichever is larger) OTP Wait State = êç ÷ ú êç ëè t c(SCO) ø û (2) Random wait state must be greater than or equal to 1. TMS320F2812 TMS320C2810. whichever is larger) Flash Random Wait State = êç êç t c(SCO) ÷ ú ø û ëè éæ t a(OTP) ö ù ÷ . Flash/OTP Access Timing PARAMETER ta(fp) ta(fr) ta(OTP) Paged Flash access time Random Flash access time OTP access time MIN 36 36 60 MAX UNIT ns ns ns Table 6-64.

TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812
SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.ti.com

6.33 ROM Timing (C281x only)
Table 6-65. ROM Access Timing
PARAMETER ta(rp) ta(rr) ta(ROM) (1) Paged ROM access time Random ROM access time ROM (OTP area) access time (1) MIN 23 23 60 MAX UNIT ns ns ns

In C281x devices, a 1K × 16 ROM block replaces the OTP block found in Flash devices.

Table 6-66. Minimum Required ROM Wait States at Different Frequencies (C281x devices)
SYSCLKOUT (MHz) 150 120 100 75 50 30 25 15 4 (1) SYSCLKOUT (ns) 6.67 8.33 10 13.33 20 33.33 40 66.67 250 PAGE WAIT STATE (1) 3 2 2 1 1 0 0 0 0 RANDOM WAIT STATE (1) 3 2 2 1 1 1 1 1 1
(2)

Formulas to compute page wait state and random wait state:

éæ t a(rp) ö ù ÷ - 1ú (round up to the next highest integer, or 0, whichever is larger) ROM Page Wait State = êç êç t c(SCO) ÷ ú è ø û ë éæ t a(rr) ö ù ÷ - 1ú (round up to the next highest integer, or 1, whichever is larger) ROM Random Wait State = êç êç t c(SCO) ÷ ú ø û ëè
(2) Random wait state must be greater than or equal to 1.

158

Electrical Specifications

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TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812
www.ti.com SPRS174S – APRIL 2001 – REVISED MARCH 2011

6.34 Migrating From F281x Devices to C281x Devices
The migration issues to be considered while migrating from the F281x devices to C281x devices are as follows: • The 1K OTP memory available in F281x devices has been replaced by 1K ROM in C281x devices. • Power sequencing is not needed for C281x devices. In other words, 3.3-V and 1.8-V (or 1.9-V) can ramp together. C281x can also be used on boards that have F281x power sequencing implemented; however, if the 1.8-V (or 1.9-V) rail lags the 3.3-V rail, the GPIO pins are undefined until the 1.8-V rail reaches at least 1 V. • Current consumption differs for F281x and C281x devices for all four possible modes. See the appropriate electrical section for exact numbers. • The VDD3VFL pin is the 3.3-V flash core power pin in F281x devices but is a VDDIO pin in C281x devices. • F281x and C281x devices are pin-compatible and code-compatible; however, they are electrically different with different EMI/ESD profiles. Before ramping production with C281x devices, evaluate performance of the hardware design with both devices. • Addresses 0x3D 7BFC through 0x3D 7BFF in the OTP and addresses 0x3F 7FF2 through 0x3F 7FF5 in the main ROM array are reserved for ROM part-specific information and are not available for user applications. • The ADC module in C281x devices can operate at 24.9k bias on ADCRESEXT pin for the full range 1–25 MHz. While migrating the F281x designs to C281x, use a 24.9k resistor for biasing the ADC. • The paged and random wait-state specifications for the flash and ROM parts are different. While migrating from flash to ROM parts, the same wait-state values must be used for best performance compatibility (for example, in applications that use software delay loops or where precise interrupt latencies are critical). • The PART-ID register value is different for Flash and ROM parts. For errata applicable to 281x devices, see the TMS320F2810, TMS320F2811, TMS320F2812, TMS320C2810, TMS320C2811, TMS320C2812 DSP Silicon Errata (literature number SPRZ193).

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159

TMS320F2810, TMS320F2811, TMS320F2812 TMS320C2810, TMS320C2811, TMS320C2812
SPRS174S – APRIL 2001 – REVISED MARCH 2011 www.ti.com

7

Revision History
This data sheet revision history highlights the technical changes made to the SPRS174R device-specific data sheet to make it an SPRS174S revision. Scope: See table below.
LOCATION Table 2-2 ADDITIONS, DELETIONS, AND MODIFICATIONS Signal Descriptions: • Updated DESCRIPTION of ADCREFP: – Changed "Requires a low ESR (50 mΩ–1.5 Ω) ceramic bypass capacitor ..." to "Requires a low ESR (under 1.5 Ω) ceramic bypass capacitor ..." – Added NOTE about using the ADC Clock rate to derive the ESR specification • Updated DESCRIPTION of ADCREFM: – Changed "Requires a low ESR (50 mΩ–1.5 Ω) ceramic bypass capacitor ..." to "Requires a low ESR (under 1.5 Ω) ceramic bypass capacitor ..." – Added NOTE about using the ADC Clock rate to derive the ESR specification Added "Community Resources" section

Section 5.3

160

Revision History

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247 41.08 UNIT °C/W °C/W °C/W Table 8-3.57 16.88 9. Thermal Resistance Characteristics for 128-Pin PBK PARAMETER PsiJT ΘJA ΘJC 128-PBK PACKAGE 0. TMS320F2812 TMS320C2810.com SPRS174S – APRIL 2001 – REVISED MARCH 2011 8 Mechanical Data Table 8-1 through Table 8-4 provide the thermal resistance characteristics for the various packages. Copyright © 2001–2011. Thermal Resistance Characteristics for 179-Ball ZHH PARAMETER PsiJT ΘJA ΘJC 179-ZHH PACKAGE 0.TMS320F2810.658 42. TMS320F2811. Thermal Resistance Characteristics for 179-Ball GHH PARAMETER PsiJT ΘJA ΘJC 179-GHH PACKAGE 0.65 10. Texas Instruments Incorporated Mechanical Data Submit Documentation Feedback Product Folder Link(s): TMS320F2810 TMS320F2811 TMS320F2812 TMS320C2810 TMS320C2811 TMS320C2812 161 . TMS320C2811.ti.271 41.658 42. TMS320C2812 www. Table 8-1.57 16. Thermal Resistance Characteristics for 176-Pin PGF PARAMETER PsiJT ΘJA ΘJC 176-PGF PACKAGE 0.76 UNIT °C/W °C/W °C/W The following mechanical package diagram(s) reflect the most current released mechanical data available for the designated device(s).08 UNIT °C/W °C/W °C/W Table 8-2.73 UNIT °C/W °C/W °C/W Table 8-4.

PACKAGE OPTION ADDENDUM www.ti.com 2-Sep-2011 PACKAGING INFORMATION Orderable Device TMS320C2810PBKA TMS320C2810PBKQ TMS320C2811PBKA TMS320C2811PBKQ TMS320C2812PGFA TMS320F2810PBKA TMS320F2810PBKQ TMS320F2810PBKS TMS320F2811PBKA TMS320F2811PBKQ TMS320F2811PBKS TMS320F2812GHHA TMS320F2812GHHAR TMS320F2812GHHQ TMS320F2812GHHS TMS320F2812PGFA TMS320F2812PGFQ TMS320F2812PGFS TMS320F2812ZHHA Status (1) Package Type Package Drawing LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP BGA MICROSTAR BGA MICROSTAR BGA MICROSTAR BGA MICROSTAR LQFP LQFP LQFP BGA MICROSTAR PBK PBK PBK PBK PGF PBK PBK PBK PBK PBK PBK GHH GHH GHH GHH PGF PGF PGF ZHH Pins 128 128 128 128 176 128 128 128 128 128 128 179 179 179 179 176 176 176 179 Package Qty Eco Plan TBD TBD TBD TBD TBD (2) Lead/ Ball Finish Call TI Call TI Call TI Call TI Call TI MSL Peak Temp Call TI Call TI Call TI Call TI Call TI (3) Samples (Requires Login) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE 1 90 1 1 1 1 1 1000 1 1 1 1 40 1 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CU NIPDAU Level-2-260C-1 YEAR CU NIPDAU Level-2-260C-1 YEAR CU NIPDAU Level-2-260C-1 YEAR CU NIPDAU Level-2-260C-1 YEAR CU NIPDAU Level-2-260C-1 YEAR SNPB SNPB SNPB SNPB Level-3-220C-168 HR Level-3-220C-168 HR Level-3-220C-168 HR Level-3-220C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR SNAGCU Level-3-260C-168 HR Addendum-Page 1 .

PREVIEW: Device has been announced but is not in production. and a lifetime-buy period is in effect.com 2-Sep-2011 Orderable Device TMS320F2812ZHHAR TMS320F2812ZHHS Status (1) Package Type Package Drawing BGA MICROSTAR BGA MICROSTAR ZHH ZHH Pins 179 179 Package Qty 1000 1 Eco Plan (2) Lead/ Ball Finish SNAGCU SNAGCU MSL Peak Temp (3) Samples (Requires Login) ACTIVE ACTIVE Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Level-3-260C-168 HR Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Where designed to be soldered at high temperatures. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. including the requirement that lead not exceed 0. TI Pb-Free products are suitable for use in specified lead-free processes. NRND: Not recommended for new designs. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible). TBD: The Pb-Free/Green conversion plan has not been defined.The planned eco-friendly classification: Pb-Free (RoHS).PACKAGE OPTION ADDENDUM www.ti. Samples may or may not be available. or 2) lead-based die adhesive used between the die and leadframe.please check http://www.1% by weight in homogeneous materials. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. but TI does not recommend using this part in a new design. and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL. or Green (RoHS & no Sb/Br) .The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances. (2) Eco Plan . TI bases its knowledge and belief on information provided by third parties. OTHER QUALIFIED VERSIONS OF TMS320F2812 : • Catalog: SM320F2812 • Enhanced Product: SM320F2812-EP • Military: SMJ320F2812 Addendum-Page 2 . In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Device is in production to support existing customers. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.ti. and thus CAS numbers and other limited information may not be available for release.com/productcontent for the latest availability information and additional product content details. OBSOLETE: TI has discontinued the production of the device. and peak solder temperature. Efforts are underway to better integrate information from third parties. TI and TI suppliers consider certain information to be proprietary. -. LIFEBUY: TI has announced that the device will be discontinued. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package. Peak Temp. Pb-Free (RoHS Exempt). and makes no representation or warranty as to the accuracy of such information.

QML certified for Military and Defense Applications Addendum-Page 3 .com 2-Sep-2011 NOTE: Qualified Version Definitions: • Catalog .TI's standard catalog product • Enhanced Product . Aerospace and Medical Applications • Military .Supports Defense.ti.PACKAGE OPTION ADDENDUM www.

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75 0.05 MIN 0. This drawing is subject to change without notice.20 SQ 23.60 MAX 0. All linear dimensions are in millimeters.08 4040134 / B 03/95 NOTES: A.45 1. C. B.MECHANICAL DATA OCTOBER 1994 PGF (S-PQFP-G176) 132 89 PLASTIC QUAD FLATPACK 133 88 0.80 26.17 0.80 1. TEXAS 75265 1 .45 Seating Plane 1.50 0.25 0°−7° 0. Falls within JEDEC MO-136 POST OFFICE BOX 655303 • DALLAS.27 0.08 M 0.13 NOM 176 45 1 21.50 SQ 24.35 44 Gage Plane 0.20 SQ 25.

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