2008

SMD Film Capacitors
Catalogue
CONTENTS

page
Short guide to main applications........................................................................................................................................... 2
Product coding and packaging.............................................................................................................................................. 3
PEN and PPS dielectrics typical temperature graphs........................................................................................................... 4
PEN and PPS dielectrics typical frequency graphs............................................................................................................... 5

LDE series - PEN dielectric RoHS 6

Low voltage (50 - 63 - 100 - 250 VDC) size table.............................................................................................. 6 and 7
High voltage (400 - 630 - 1000 VDC) size table........................................................................................................... 8
Technical data............................................................................................................................................................ 9
Maximum VRMS and IRMS vs. frequency graphs...............................................................................................10 and 11

LDB series - PPS dielectric RoHS 6

16 - 50 VDC size table............................................................................................................................................... 12
Technical data.......................................................................................................................................................... 13

Soldering recommendations and cautions.............................................................................................................. 14 and 15
Production process basic suggestions................................................................................................................................ 16

Although the text of this publication is accurate to the best of our knowledge when printed, we reserve the right to make
changes without prior notice.

1

07/2008

frequency and temperature . timing.High stability vs. frequency and temperature .No cracking .High stability vs. 07/2008 2 SMD Film advantages .High reliability .High stability vs.No cracking . frequency and time - Self-healing - High reliability - Low ESR (Equivalent Series Resistance) - Typical failure mode at the end of life: open circuit - No piezoelectric effect - No cracking - No VCC (Voltage Coefficient of Capacitance) SMD Film Capacitors are complementary to MLCCs for professional applications. coupling and decoupling LDE series Ceramic X7R Tire pressure monitoring system Resonant circuit LDE series Ceramic X7R DC/DC converter Input / output filtering LDE series Ceramic X7R LCD Monitor Inverter unit LDE series Ceramic X7R DVD player Filtering LDB series Ceramic NP0 PDA Inverter unit LDB series Ceramic NP0 Hi-Fi systems Filtering LDE / LDB series Ceramic X7R Description: - Non-encapsulated construction - Stacked technology - Metallized PEN (PolyEthylene Naphtalate) in LDE series - Metallized PPS (PolyPhenylene Sulfide) in LDB series - RoHS 6 compliant (no hazardous materials) Features: - Excellent stability vs.Low Lock-up time .Low ESR .High reliability .High reliability .Narrow tolerance .No cracking . frequency and temperature .No cracking . temperature.Low ESR .SMD Film Capacitors Short guide to main applications Device CONSUMER AUTOMOTIVE TELECOM Mobile phone Application A/D converter PLL filtering Arcotronics SMD Film proposal Main Competitors LDB series Ceramic NP0 Bluetooth ® PLL filtering LDB series Ceramic NP0 Modem DMT modulation / demodulation LDE / LDB series Ceramic NP0 Base station Filtering LDE / LDB series Ceramic X7R Line Card Input filtering LDE series Ceramic NP0 Splitter Filtering LDE series Ceramic X7R Wiper Noise suppression LDE series Ceramic X7R Driver information & car entertainment Filtering.No cracking .High reliability .

Digit 10 Digit 11 Digit 12 Digit 13 Digit 14 Capacitance tolerance G = ± 2 % J=±5% Dielectric code C = PPS Version 5 = standard A to Z = special Packaging N = taped A to Z = special Internal use Product packaging SMD Film Capacitor (top view) Size code 12.80 4.80 3.60 7.12 H A B C Digit 6 to 9 Capacitance value Digits 7 .06 12.60 11.90 B0 [mm] 3.60 2.00 2.90 3.30 5.A - - Digit 1 to 3 Series code. Digit 10 Capacitance tolerance Standard: K = ± 10 % M = ± 20 % (J = ±5% available upon request and review of project/application) Digit 11 Dielectric code A = PEN Digit 12 Version 5 = standard 0 = miniature A to Z = special Digit 13 Packaging N = taped A to Z = special Digit 14 Internal use Digit 15 0 (used in LDE RoHS 6 series only) Digit 6 to 9 Capacitance value Digits 7 .80 3.20 D 28.24 E = 100 VDC P = 630 VDC 40.50 3.10 2.9 indicate the first three numbers of the capacitance value.carrier tape: antistatic material .10 18.SMD Film Capacitors Product coding LDE series .30 2.80 Reel Reel dimensions W [mm] 8 8 P [mm] 4 4 T [μm] 250 250 Ø [mm] 180 180 W1 [mm] 8 8 W2 [mm] 12 12 12 8 300 330 12 16 12 8 250 330 12 16 16 8 300 330 16 20 16 12 300 330 16 20 24 12 250 330 24 28 24 16 300 300 300 330 24 28 3 Packaging quantities (pcs per reel) 3000 2250 4000 3000 3000 2250 1750 2250 1750 1500 1500 1250 1000 1500 1250 1000 1000 750 750 In accordance with IEC 60286-3 Materials: .00 K0 [mm] 1.10 5.9 indicate the first three numbers of the capacitance value. 07/2008 .12 C 22.RoHS 6 LDB series .8 .80 4.80 4. digit 6 indicates the number of zeros that must be added to obtain the rated capacitance in pF.60 5.10 18.80 5.20 28.80 4.8 .60 5.20 5.40 F G 3 4 5 6 7 8 9 10 11 L D B - - - - - - - C 12 13 14 - - - Digit 1 to 3 Series code.90 8.00 3.00 13.30 E 50. Digit 4 D. Digit 4 D.40 16.54 Carrier tape code a b a b c a b c a b c a b c a b c Tape Carrier tape dimensions A0 [mm] 2. digit 6 indicates the number of zeros that must be added to obtain the rated capacitance in pF.80 3.50 6.cover tape: polyester + polythene .06 12.10 2 Size code 60.C.00 10.30 50. rated voltage: (VR) C = 50 VDC D = 63 VDC I = 250 VDC M = 400 VDC Q = 1000 VDC (new version) Digit 5 12.12 22.90 4.C.90 11.24 40.reel: recyclable polystyrene All parts in reels are packed in hermetically sealed Moisture Barrier Bag (MBB) Class 1.70 5.90 3.40 60.00 3.30 5.50 14.54 12.06 A 1 12 13 14 15 - 0 B 18.90 10. rated voltage: (VR) A = 16 VDC C = 50 VDC Digit 5 Size code (customized sizes available upon request) 12.RoHS 6 The part number is composed of 15 digits: The part number is composed of 14 digits: 1 2 3 4 5 6 7 8 9 L D E - - - - - - 10 11 .50 6.

SMD Film Capacitors PEN and PPS dielectrics typical temperature graphs PEN PPS Capacitance vs.0 -1.0 2. temperature 4 .0 3. temperature Dissipation factor vs.0 1.0 -60 -40 -20 0 20 40 60 80 100 120 140 T [°C] 07/2008 Dissipation factor vs. temperature (f = 1 kHz) (f = 1 kHz) Insulation resistance vs. temperature Capacitance vs.0 0.0 4. temperature Insulation resistance vs. temperature (f = 1 kHz) (f = 1 kHz) $ C/C [%] 6.0 -2.0 5.

frequency Dissipation factor vs. frequency Note: measurements performed at T = 25 ± 5 °C 5 07/2008 . frequency PEN and PPS Impedance vs. frequency Equivalent Series Resistance vs.SMD Film Capacitors PEN and PPS dielectrics typical frequency graphs PEN PPS Capacitance vs. frequency Dissipation factor vs. frequency Capacitance vs. frequency Equivalent Series Resistance vs.

0 LDEDB2330 .8 LDEDC2330 ..1 LDEDA2100 .10 2250 2.7 LDEEC1330 .0 18..A0 .A0 .A0 .3 +0..0 3000 1.0 18.A0 .12 4000 1.7 LDECC1180 .3 +0.0 18..12 4000 1.12 4000 1..0 12..1 LDEDA2120 .4 13..0 12.12 4000 1.7 LDEDC2390 .A0 ..0 1500 pF 1800 pF 2200 pF 2700 pF 3300 pF 3900 pF 4700 pF 5600 pF 6800 pF 8200 pF 0.5 LDEEB2180 .022 µF 0.A0 ..06 3000 1.0 12.0 12.1 LDEEA1560 .7 LDEDC1150 .10 2250 1.A0 .A0 .06 3000 1.7 LDEEC1180 .0 18.06 3000 1.3 5..12 4000 1.0 18.N = Taped.A0 .0 12.0 18.12 4000 1.1 LDECA2270 .0 1200 pF 18.A0 .7 LDECC2270 .0 22..A5 .06 3000 1.7 LDEIC1680 .0 18.0 12.06 3000 1.039 µF 0.06 3000 1.A0 ..6 LDEIB1470 .0 12.5 P/N 5 digit A B C D E F th 07/2008 40.7 ± 0.1 LDECA1390 .06 3000 1.12 3000 2.12 4000 1.1 LDEDB2390 .0 12.1 LDEDA1220 ..0 12.A0 ..0 12.7 +0.12 4000 1.1 LDEIA1270 .12 4000 1.7 LDEDC1390 .1 LDEEA1180 .0 12.A0 .06 3000 1.12 4000 1.06 3000 1.A0 .0 LDEEB2330 ...1 LDECA2100 .12 4000 1.1 LDECA1270 .12 4000 1.A5 .0 12...0 18.1 LDEEA1220 .7 ± 0.0 12.A5 .A0 .12 4000 1.A0 .24 L (mm) 12.7 LDEIC2150 .7 LDEDC1180 .0 LDECB2330 ..A0 .1 18.7 LDECC1150 .9 LDEID2270 ..7 LDEDC2100 ..0 18.10 2250 2.8 LDECC1820 ..0 18...06 3000 1..06 3000 1.7 LDEEC2220 .12 4000 1.033 µF 12.06 3000 1.1 LDEIA1220 .A0 .10 3.039 µF 0.12 4000 1.7 LDECC1560 .4 ± 0...0 12.10 2250 2..0 12..0 18..12 4.1 LDEIA1120 .0 12.0 18.1 LDECA1150 .06 3000 1.A0 .1 LDEEA1470 .0 12. 1000 pF 12.022 µF 0.12 4000 1.0 12.12 4000 1.0 12.A5 .12 4000 1.06 3000 1.20 3000 1.A0 .3 ± 0.0.A0 .7 LDECC2220 ..06 3.06 3000 1.1 LDEEA1390 ..40 60..06 3000 1.12 3000 2.0 12.A0 .A5 ..0 12.1 LDEDA1390 .0 12.0 1000 pF 1500 pF 1800 pF 2200 pF 2700 pF 3300 pF 3900 pF 4700 pF 5600 pF 6800 pF 8200 pF 0.0 ± 0.1 LDEDA1820 .A5 .10 2250 2.033 µF 12.0 12.1 LDECA2180 .0 12..12 4000 1.A0 .A5 .06 3000 1.0 22.0 12..1 LDEEA1100 .7 LDECC2100 .A0 ..8 LDEEC2330 .12 4000 1...8 LDEDC1270 .0 18.7 LDEEC1220 .012 µF 0.10 2250 2.A5 .8 LDEDC1820 .20 3000 2.0 18.06 3000 1.0 12.6 LDEIC2330 .0 12.8 LDECC1270 .4 15.0 18..06 3000 1.2 LDEEA2150 .0 12.06 3000 1.A5 .A0 .06 3000 1.1 LDECA1470 .12 4000 1.0 12.A5 .0 12..06 3000 1.0 18.0 12.3 7.12 4000 1.2 LDEID2180 .8 LDECC2330 .0 18..0 12.1 LDECB2390 ..0 ± 0..20 28.1 1200 pF 12.0 0..7 LDECC2470 .1 LDECA1560 .1 LDEEA1820 . M = ±20%.7 LDECC1330 .7 LDEIC1330 .12 4000 1.12 4000 1.A5 .0 18.0 18.A0 ..1 LDEEA1150 ..06 3000 1.12 4000 1.A5 .0 18.1 LDEDA1560 .A5 .027 µF 18.7 LDEDC2220 .8 LDEEC1470 .1 LDEEA1120 .A0 .018 µF 0.0 12.7 LDECC1220 .0 18.2 LDECA1330 .12 4000 1.5 ± 0.2 *LDECA2330 .SMD Film Capacitors LDE series .A0 ..0 12..2 LDEEA1330 .0 12.A5 .7 LDEEC2470 .0 18.018 µF 0.1 LDEDA1150 .0 ± 0..0 18.0 18.7 LDEDC2150 .12 4000 1.1 LDECA1120 ..12 4000 1.06 3000 1.015 µF 0..A0 .A5 .5 LDEID2220 .12 4000 1.10 2250 2.A5 .047 µF 12.7 LDEDC1560 .A5 .0 18.12 4000 1.12 4000 1.12 4000 1..A5 ..0 12.A5 .4 W (mm) 1. (J = ±5% available upon request and review of project/application) Packaging .0 18.2 22..06 3000 1.047 µF) Standard and miniature versions 50 VDC / 40 VAC Rated cap.A0 .12 4000 1.0 18.1 LDECA2220 .1 LDEDA1100 .0 18.0 18....06 3000 1...10 2250 1.06 3000 1..5 ± 0.0 18.A0 .7 LDECC1390 .0 18.1 LDEEA2120 .0 18.0 12.12 4000 1..12 4000 1.06 3000 1.0 18..10 2250 1.06 3000 1.A5 ...12 3000 2.0 12.7 LDEEC2270 .A5 ..8 LDEIC2180 .12 4000 1..A0 .1 LDEEA1270 .06 3000 1.12 4000 1.12 4000 1.06 3000 1.2 LDEDA2150 .A5 .A5 .06 3000 1.6 LDEIB1390 .A0 .A0 .3 ± 0.A5 .0 18.012 µF 0.2 LDEIC2220 .A5 ...1 LDECA1220 .0 12.A5 .0 18.0.5 LDEIC2270 ..A0 .1 LDECA1820 ..8 LDEEC2180 .A5 .A0 .10 2250 1..A5 ..8 LDEDC2180 ..1 LDECA2120 ...0 18.0 12.0 22.10 2250 2.0 18.12 4000 1.0 12.A5 .12 4000 1..0 18.A5 .1 LDEDB2470 .2 2.A5 ...06 3000 1.0 18.0 22..A5 ..A0 .1 LDEIB2100 .0 12.A0 .PEN dielectric RoHS 6 ree F ead L LOW VOLTAGE (capacitance range: 1000 pF to 0.7 LDEIC1180 .06 3000 1.20 3000 2..3 .7 LDEEC2100 .06 3000 1.010 µF 0..0 18.A5 .12 4000 1.12 4000 1.06 3000 1.06 3000 1.047 µF .7 LDEDC2120 ..0 12.7 LDEIC2100 .A5 .12 4000 1.12 4000 1.A5 .0 18.12 4000 1.4 7.9 LDEID2330 .0 12.0 12.A0 ..A0 ..06 3000 1...0 22.0 18.A0 ..A5 ..0 18..0 18..A5 .0 12.06 3000 1.06 3000 1.12 4000 1.0 18.7 LDEIC1560 ..A5 .A5 ..0.12 4000 1.A0 .A0 .0 12.7 LDEIC2120 .12 4000 1.12 4000 1.0 18.0 18.0 18.0 22..7 LDEDC1680 ..3 .1 LDEEB2390 .0 12.A0 .0 18.A5 .12 4000 1..A5 .A0 .0 12.12 4000 1.A5 .0 18.7 LDEEC2120 ..A0 ..7 LDEEC1390 .A0 .30 6 50.A5 .12 4000 1.06 3000 1..1 ± 0..0 12...0 12.A5 .12 4000 1.A5 .8 LDEEC1820 .06 3000 1.06 3000 1.54 10..A5 .7 LDEEC1560 .0 18.06 3000 1..1 LDEDA1180 .0 18.7 LDEDC1220 .0 18.06 3000 1.A0 .10 2250 2.12 4000 1.12 4000 1.A5 .A5 .A0 .06 3000 1.0 12.A0 .06 3000 1.0 18.2 LDECA2150 .0 12...A5 .A0 .12 4000 1.20 3000 2.0 18.7 LDECC2120 ..A0 .A0 .A5 .12 4000 1.0 12.A5 .1 LDEDA2220 .A5 .8 LDEIB1680 .9 ± 0.A5 .7 LDEDC2270 .A5 .0 12..06 3000 1.A0 ..A0 ..0 18.0 18.1 LDEDA1680 .06 3000 1.0 18.10 2250 2.12 4000 1...A5 .A0 .0 18.5 ± 0.1 LDEDA1470 ..0 12.....0 12.12 4000 1.4 10.1 LDEEA1680 .1 LDECB2470 .12 4000 1..1 LDECA1180 .06 3000 1..2 LDEDA1330 .A0 .0 18.0 12.0 0.3 3.10 2250 1.0 18.A0 .A0 .0 18.8 LDEIC1470 .10 2250 2.0 12..1 6.A5 .A5 ..8 LDEDC1470 ..0 12.A5 .0 12.12 4000 1..8 LDEIC1270 .0 12.8 LDEEC1270 .027 µF LDEIA1100 .1 LDEDA2180 . A to Z = Special.0 18..A5 ..A0 .A5 .A5 . Size code Pcs per reel Hmax [mm] Part number 63 VDC / 40 VAC Size code Pcs per reel Hmax [mm] 100 VDC / 63 VAC Part number Size code Pcs per reel Hmax [mm] 250 VDC / 120 VAC Part number Size code Pcs per reel Hmax [mm] Part number Rated cap.A5 .A5 .12 4000 1.06 3000 1.A0 ..10 2250 1....0 12.8 LDEIC1820 .A5 . Internal use * only K and M tolerances available Size code 12.A5 .A0 .0 18.A5 .A0 ..3 .A5 .0 12.06 3000 1.1 LDEIA1150 .1 LDEDA1270 .0 18.12 4000 1.06 3000 1..0 12.06 3000 1..12 4000 1.A0 ..12 4000 1.0 12.1 LDEID2390 .20 3000 2.06 Tolerance .1 LDEIA1180 .12 4000 1.A0 ..2 LDEIA1330 .A0 .7 LDECC2150 .1 LDEDA1120 .12 4000 1.A5 .12 4000 1.3 LDEID2470 ...7 LDEDC1330 .A0 .7 LDEDC2470 .5 G H 0..A0 .06 3000 1..0 18.A5 .0 LDEIB1820 .06 3000 1...0 12.A0 .Standard: K = ±10%.12 4000 1.A0 .5 LDEEB2220 .0 18.2 *LDEDA2330 ...7 LDEIC1220 .0 12.A0 .1 LDECA1680 ..10 2250 2...0 12.0 12.A0 .A0 .0 18.A0 .015 µF 0.010 µF 0.10 2250 1.A0 .06 3000 1.8 LDECC2180 .7 LDEEC2150 .12 4000 1.7 LDECC2390 .A5 ...A0 ..7 LDEEC1680 .0 12.7 LDEEC1150 .1 LDEEA2100 ..A0 .A0 .A0 .7 LDECC1680 ..8 LDECC1470 .A5 .A5 ..7 LDEEB2270 .0 18.1 LDECA1100 .0 0.A0 .A5 .0 12.1 LDEDA2270 .4 6.A5 .0 18.06 3000 1..7 LDEEC2390 .A5 .0 18.0 18.5 13.20 2250 2.6 LDEIB1560 .12 4000 1.A5 .0 12.....A0 .1 LDEEB2470 .A0 .06 3000 1.7 LDEIC1390 .7 LDEIC1150 ..

4 LDECD3470 .20 0.24 2250 3.A5 ..A0 .0 40.20 1750 3.0 40.30 1000 5.A0 .A5 .A5 .15 µF 0..0 60.0 60.1 LDEEG4220 ..12 63 VDC / 40 VAC Size code Pcs per reel Hmax [mm] 1.30 50.0 40.0 60.5 LDECF4390 .5 µF 1.30 1000 4.4 7.0 0.20 3000 1.0 28..7 LDEIG3820 .54 1000 3.A0 ..54 750 5. Internal use * only K and M tolerances available Size code 18..A5 .A0 .30 0..3 LDEIG3390 .A5 .30 1500 3.2 LDEDC3180 .7 LDECF4330 .3 ± 0..4 LDEDC3100 .A5 .8 40.30 1000 5.0 18... M = ±20%.3 LDEDE4150 ..24 1500 4.A5 .0 22.A5 .3 LDEDF4220 .0 12..10 2250 2.A5 .A0 .30 1000 5.0 40.A5 .0 750 5..7 LDEIF3180 .5 LDEDH4390 .6 LDEED3120 ..68 µF 0.1 LDECE4100 ..A5 .A5 .6 LDEEE3390 ..54 750 4.0 2250 3.20 3000 1.40 1250 4.2 LDEEF4100 .30 1500 3.1 LDEEG4150 .1 LDEID3100 ..9 ± 0..20 1750 4.2 22.A5 ..0 LDEEE3470 .20 2250 3.4 LDEDC3220 .A0 .54 750 4....12 3000 2..54 1000 3..A5 .9 µF 4..A0 .40 1500 3.5 LDEID2820 .0 22.A5 .0 60.20 1750 4.30 1000 5...3 LDEIF3330 .4 LDEID3120 .A5 .A5 .5 LDECH4390 .5 LDEEF4150 .5 P/N 5 digit B C D E F th 40.9 LDEEH4330 .A5 .24 0.A5 .0 28.0 2.40 1500 3..56 µF 3000 2..0 12.A5 .0 50.0 22.30 1250 4.0 22.0 18.0 18.47 µF 0.20 3000 18.0 1750 4.0 3.0 28.A5 .5 ± 0.0 40.10 2250 4000 1.3 7.3 LDECH4470 ..0 2.2 µF 1.8 LDEDC2680 .A0 .A5 .A5 .3 LDEDH4470 .15 µF Pcs per reel Hmax [mm] Part number 3000 2.54 1000 1000 5.3 3.8 LDEED3270 .20 2250 3...4 LDEDG4180 .0 40.7 LDEDB2560 .A5 .54 1000 3.1 LDECE4180 .0 µF 1.A5 .0 50.0 18.A5 .0 18.40 1000 4.7 µF Tolerance ...A0 .0 22..0 0.3 LDECD3680 .0 50..12 3000 2..A0 .1 LDEDG4150 ..A5 .A5 .30 1000 5.0 40.1 6.5 LDEEE3560 .A0 ..0 22..0 60.A5 .0 40..82 µF 4.24 2250 2.0 60..4 LDECD4100 .A0 ....0 50.4 10.0 18.24 1750 3.0 50.20 2..0 60.0 22..A0 .A5 .0 28.A0 .5 LDEDF4390 .1 LDECG4150 .54 750 5.1 LDEDG4220 .20 3000 2.A5 ..A5 ..A0 .0 18.9 LDECD3270 .0 ± 0.3 LDEIE3120 .1 LDECB3100 .0 1750 4.20 3000 1.4 *LDEEE4100 ..40 1500 3.0 50.A0 .0 50.1 LDECB2820 .24 1500 5.27 µF 0.9 LDEDD3330 .A5 .8 LDEEF3820 .1 LDEEG4120 .N = Taped.22 µF 3000 2.A0 .20 3000 2.24 1500 5.9 LDEDC3150 .0 40.A5 .4 LDEIH3680 .3 LDEED3330 .0 12.A5 ..40 1500 3.10 µF 0.0 40..3 LDEEH4470 .0 40.0 LDEIF3390 ..30 1500 3.0 28..0 1.9 LDEEE3820 .12 4.24 2250 2.0 28.40 0.A0 .A5 .0 22.A5 .8 LDECC2680 .2 µF 2..A5 .0 28.A5 .A5 ..12 4000 12.40 1500 3.5 13..A0 ..20 2250 3.A5 .30 1000 4.47 µF 22..24 1750 4.12 12..A5 .A0 .12 4000 1.8 LDEEC2680 ..20 2250 3.0 1500 5.5 LDEEH4390 .0 1750 4.0 18..A5 ..3 LDECF4220 .0 60.0 22.9 LDEIE3100 .0 28.7 µF 3.A0 .20 Rated cap.9 LDECG4270 .0 28.A5 .7 LDECD3820 .4 LDEEG4180 ..0 60. 0.7 LDEDC3120 .0 50.A5 ..3 .A5 ..8 LDEID2680 ...0 28.18 µF LDEEC2560 .1 LDEDB2820 .20 1750 4.6 LDEDE4120 ...A5 .40 1250 4.0 22.A5 .A5 .10 2250 2.A0 ..A5 .6 *LDEEF4220 .0 28.0 LDEED3220 .1 LDEDD3390 .7 LDECC2560 .7 LDEDC2560 .A5 .0 60.3 LDECE4150 ...82 µF 1.A5 .30 1000 5.5 LDEIF3470 .0 12.0 28.1 LDECD3390 .7 LDEDF4330 .24 2250 2.A5 ...24 2250 3.4 LDEED3470 .20 3000 2. A to Z = Special..0 40.40 1250 0..0 LDEED3180 .24 2250 3...A5 .8 LDECD3560 .A0 .3 ± 0..9 LDECH4330 .A5 .A5 ..54 50. Part number 22.A0 .8 µF 2.1 LDEIF3220 .40 1500 3.A5 .4 LDECC3100 .0 22.3 +0.A0 ...0 50.A0 .30 1500 3.A5 .7 LDEIF3270 .7 LDEED3390 .39 µF 0..1 LDEDE4100 .9 LDEDG4270 ..0 40.068 µF 0.0 50.1 LDEDG4470 .A0 .1 LDECG4470 .1 LDEEE3680 .1 LDECC2820 .A0 ..0 50.A5 ..0 40.0 0.A5 .0 18.12 12.A5 .4 LDECC3220 .4 6.A5 .24 1500 5.2 LDEIE3220 .A5 ..0 40.0 750 5..40 1250 4.54 1000 3.20 18....12 3000 12..4 LDEIH4120 .0 ± 0.7 +0.40 1250 4.0 28.0 3000 1.7 LDECC3120 . (J = ±5% available upon request and review of project/application) Packaging .6 LDEIE2820 .12 4000 1.1 LDEDC2820 .12 µF Size code Pcs per reel Hmax [mm] 18.A0 .40 60.20 2250 3.A5 ...A0 ...0 5.0 50.9 LDEIH3820 .40 1500 3.9 LDEEG4270 ..0 60.0 50.0 2.7 LDEDD3820 .3 µF 3.5 ± 0..A0 .PEN dielectric RoHS 6 ree F ead L LOW VOLTAGE (capacitance range: 0.20 2..0 22.A5 .5 LDEIF3560 M A0 .0 50.7 µF LDEIG3560 ..54 1000 3.0 22.0 50.54 750 4.40 1000 4.20 3000 2.0 60.20 0.0 22.24 18.20 28.A5 .A5 .12 3000 2.0 22.6 LDEIH4100 .8 LDEIG3470 .4 W (mm) 2..0 18.056 µF to 4.0 LDEDF4270 .4 LDECG4180 .0 40.082 µF 0.3 LDEEH4270 .8 LDEIE3150 .0.4 15.12 4000 1.A5 .40 1000 5.1 LDECG4220 ..9 LDEED3150 ..0 28.0 28.20 Part number Part number 250 VDC / 120 VAC Size code 0.10 100 VDC / 63 VAC Size code Pcs per reel Hmax [mm] 1.056 µF 0.7 LDECB2560 .54 50..24 1750 4.4 LDEEF4180 ..0 3000 2.30 1500 2.A5 .2 µF 1.1 ± 0..20 3000 2....30 1250 4..30 1500 3000 2.A5 .24 2250 3.A5 .068 µF 0..4 13.12 3000 2..40 1250 3.A5 ..0 22.A0 .A5 .33 µF 22..0 LDECF4270 .0 40.A0 .40 1500 3.A5 .30 1500 3.0 18..20 3000 2.5 µF 1.4 LDEIE3180 .A0 ..A5 .7 LDEEF4120 .9 µF 4.0 28.0 22.056 µF 0.30 1250 4.7 1..A5 .22 µF 0.A5 ..1 LDEDE4180 .A5 ..0 22.24 L (mm) 12.0 18.9 LDEDH4330 .20 3000 2.A0 .A0 ....0 40.A0 .10 3.A0 .12 µF 0.0 50.0 µF 1.1 LDEDB3100 ..0 22.10 2250 2.3 µF 3...0 18.39 µF 0.30 1250 4.4 LDEDD3470 .4 28.54 750 5.24 2250 3.0 40.A0 ..0 28.A5 .0 22.6 LDECE4120 .A5 .40 1000 5.12 4000 LDECB2680 .54 750 4.A0 .A0 .A0 .A5 .0 ± 0..24 1750 4.2 LDEIG3680 .0 LDEEC3100 .5 ± 0.0 28.12 4000 1.0 28.7 LDEEG4330 .18 µF 0.24 2250 3.0 4000 1.20 3000 2.A5 .A5 .A5 ..4 LDEDD4100 .9 LDECD3330 .8 µF 2.9 LDECE3820 .4 22.1 LDEEC2820 .A5 .56 µF 0.A0 ..7 µF 3.9 LDEDD3270 .0 60.40 1250 4.0 50.12 3000 2250 2.0 28.A0 .SMD Film Capacitors LDE series .3 5.12 3000 2.A5 .24 2250 2.0 22.6 LDEID2560 .10 2250 18.12 3000 2.7 µF) Standard and miniature versions 50 VDC / 40 VAC Rated cap.0 LDEDB2680 .12 4000 1.0 40.9 LDEDE3820 ..20 3000 1.5 G 7 H 07/2008 .0 60.24 2250 3.27 µF 22..3 .A0 .12 4000 1..24 2250 22.A5 .33 µF 22.4 1000 50.A5 .A0 .3 LDEDD3680 .0 18..40 1000 4.082 µF 0.2 µF 2.10 2250 2.0 60.2 LDECC3180 .4 ± 0.0 18.0 50.10 µF 0..0 22.54 10.7 LDEIH4150 M A0 .9 LDECC3150 .30 1500 3.0 LDEDD3560 .Standard: K = ±10%.12 0..7 ± 0.10 2250 2.0.0 28.68 µF 1.

A5 .30 1000 4.0 LDEPD2150 .033 µF 22.40 60.12 µF 0.8 LDEQH3100 .20 1750 4.15 µF 40.5 13...7 LDEQG2560 ..A5 .4 LDEPD2180 .5 LDEPF2680 ..0 60.0 0..082 µF 28.A5 .A5 .9 LDEMD2270 .20 1750 4.47 µF 60.0 1500 pF 3000 2.4 6.A5 .A5 .0 0.20 2250 3..0 28.3 7..0 3300 pF 3900 pF 22.22 µF 50...20 3000 2.1 LDEMD2150 .30 1250 4.9 LDEPG3100 .A5 ..0 LDEQE2120 ..1 LDEME2680 ..0 40.018 µF 0.0 LDEQD1120 .0 50.0 22.0 0.0 8200 pF 0.A5 ..9 LDEQE1820 .015 µF 22.40 1000 4. Pcs per reel 630 VDC / 200 VAC Size code Pcs per reel Hmax [mm] 1000 pF 22.A5 .54 750 4...A5 .3 LDEPE2390 .Standard: K = ±10%.A5 .9 ± 0.0 0.0 50.0 40..A5 .A5 .20 1750 3...4 LDEPD2120 ..A5 .A5 .0 40.A5 .0 2200 pF 2700 pF 22.0 0.0 6800 pF 8200 pF 22..0 5600 pF 6800 pF 22.18 µF 40.20 1750 4..056 µF 28.0 22.7 ± 0.4 7.4 ± 0..4 LDEQD1470 .A5 .010 µF 0.0 ± 0..30 1000 5.022 µF 22.0 LDEPD1220 ..20 2250 3..22 µF 0.A5 .0 0.12 µF 40.0 0.A5 .A5 .A5 ..20 3000 2.24 1500 4.20 1750 3.A5 .20 1750 4.0 40.A5 .4 LDEMD2470 .018 µF 22.A5 ..9 LDEPD1390 .033 µF 0.10 µF 40.4 LDEPE2220 . A to Z = Special.27 µF 0.0 22..24 1500 5.1 LDEQG2470 .33 µF 50..A5 .20 3000 2.30 1500 3.A5 .A5 ...A5 ..6 LDEMF3120 .A5 ..0 28.A5 .A5 .30 50.0 28.40 1000 5.0 0.30 1250 3.A5 .0 22.A5 .4 LDEQD1680 .A5 .0 50.27 µF 50.015 µF 0.0 22.4 LDEPF2820 .0 0.3 LDEQD1270 .A5 .54 750 4.068 µF 0.022 µF 0..20 2250 3.20 3000 2.0 LDEQD1220 .A5 ..0 28.0 0.20 3000 2.A5 .A5 .54 1000 4.0 60.5 LDEPD1180 .0 0.20 3000 2.A5 .4 LDEME3100 .54 1000 4.6 LDEPD1820 .4 LDEQE2100 .9 LDEQE2150 .A5 .056 µF 0.A5 .0 22.24 2250 3.0 0.9 LDEQF2330 .0 4700 pF 5600 pF 22..0 28.A5 .0 LDEQD1390 ....20 2250 2.0 40.0 0.0 LDEPD1120 .4 LDEQE2180 .20 3000 1500 pF 22..30 1250 4..4 LDEPF2470 .24 1750 4.5 P/N 5 digit D E F th 07/2008 40.54 750 5. (J = ±5% available upon request and review of project/application) Packaging .20 1800 pF 22.A5 .0 LDEPD1560 ..1 LDEQF2270 .A5 .30 1000 5.40 1250 4.A5 .0 22.0 ± 0.20 3000 2.4 LDEQF2220 .6 LDEQD1330 .20 3000 2.24 2250 3.24 2250 2.A5 .24 1500 4.0 LDEPE2270 .0 3900 pF 4700 pF 22.0 1200 pF 3000 2.7 LDEMG3270 ..39 µF 0.A5 .24 1750 4.30 1500 3..A5 .24 L (mm) 6.047 µF 0.039 µF 0.24 1500 5..A0 .20 28...A5 .0 60.0 22.7 LDEPE2330 .A5 .0 0.30 1000 5.3 LDEPD1680 .20 2250 3.20 3000 2.A5 .0 0.0 ± 0..A5 .0 28.2 LDEPH3180 ..5 LDEQD1180 .0 22.A5 .A5 .20 3000 1.6 LDEPD1330 ...3 LDEPD1150 .A5 ..40 1500 3.0 28.A5 .20 3000 2.10 µF 0.0 28.0 0.0 2700 pF 3300 pF 22.6 LDEMG3330 ...2 LDEQH2820 .A5 .027 µF 22.30 1500 3.0 0.A5 .8 LDEMD2390 ...9 LDEPH3220 .A5 .54 10.A5 .1 ± 0.4 LDEPG3120 .20 3000 2.A5 .039 µF 22.0 50..3 LDEQD1150 .20 2200 pF 1000 VDC / 250 VAC Rated cap.30 1250 4.40 1000 5.5 G H 8 .9 LDEPF2560 .A5 ..0 60.24 1750 4.2 LDEMD2180 .0 22.8 LDEMG3220 .39 µF 60.40 1250 4.4 15.4 LDEMD2330 .5 LDEQG2390 .A5 .40 1000 4.A5 .0 LDEPD2100 .4 13.0 0.3 ± 0.47 µF) Standard and miniature versions 400 VDC / 160 VAC ** Rated cap.20 3000 1..0 50....0 28.9 LDEQD1100 .18 µF 0.A5 .7 *LDEPH3270 .40 1000 5.20 3000 1200 pF 22.N = Taped.027 µF 0..0 22. Part number Size code Pcs per reel Hmax [mm] Part number 1.0 1800 pF 22.7 LDEME2820 .0 1000 pF 2.5 ± 0.0 22.A5 ..24 2250 3..3 LDEPG3150 .54 1000 4.8 LDEMH3470 .A5 .5 LDEME2560 .A5 ...0 60.A5 .9 LDEQD1560 .0 0.A5 ..0 40..4 W (mm) 5. Internal use * only K and M tolerances available ** up to 230 VAC for maximum 30 minutes Suitable for xDSL ITU compliant version available upon request Size code 22.010 µF 22.20 3000 2.2 LDEMH3390 .4 10.9 LDEPD1100 .0 LDEPD1470 .A5 .5 *LDEPF3100 .20 2250 3.A5 .4 LDEMF3150 ..15 µF 0.24 1500 4.0 0..20 3000 2. M = ±20%.A5 .A5 .24 1500 5.5 LDEMD2220 .PEN dielectric rohs 6 ree F ead L High voltage (capacitance range: 1000 pF to 0.54 750 4.3 LDEPD1270 .20 3000 2.20 3000 2..33 µF 0.012 µF Size code Hmax [mm] Part number 0.0 0.47 µF Tolerance .1 LDEMF3180 .0 0.0 40..40 1250 3.0 22.40 1250 3.012 µF 22.068 µF 28..047 µF 22.0 50.20 3000 2..SMD Film Capacitors LDE series .0 50.5 LDEQG2680 .5 ± 0.082 µF 28.

33 μF Test conditions: T = 25 ± 5 °C.PEN dieletric RoHS 6 . f = 1 kHz) Dielectric absorption 0.1000 VDC Category voltage (VC) VC = VR up to 105 °C..4 175 165 157 151 135 128 122 114 108 103 40.400 . pure tin. IR ≥ 50% of the limit value Endurance (125 °C.20 Reliability (REF MIL HDBK 217) Failure rate ≤ 1 Fit 1 Fit = 10-9 failures / (components * hours) Rth [°C/W] -4 Size H max [mm] Rth [°C/W] 9 12.7 2.2 2.5 4.7 93 88 84 75 70 66 58 55 52 07/2008 . T = 25 ± 5 °C) for VR = 1000 VDC Maximum dv / dt 100 V / μs for VR ≤ 630 VDC 300 V / μs for VR = 1000 VDC N = ∑ N 2 ∑ Vrms _ i * 2�fi * C * tgδ max (fi ) = i=1 2 I rms _ i i=1 2�fi * C * tg δ max (fi ) (N: number of significant harmonics) The formula to calculate the maximum power [W] that can be dissipated by the capacitor is the following: It must be: Pcmax ≤ Pclim Please refer to the table and graph below for ∆Tlim and Rth values (Th: maximum ambient temperature surrounding the capacitor or hottest contact point .6 4.100 . brass. 2000 h.C.06 to 60. the consequent internal heating may cause the risk of smoke or fire.e.20 1.technical data Plates Winding Terminations Marking Climatic category Aluminium layer deposited by evaporation under vacuum.5 5.54 3.whichever is higher.7 3.06 12.630 .12 22.C.3 3.5 5.33 μF ≥ 400 s for C > 0. applications) Electrical data Operating temperature range -55 to +125 °C Rated voltage (VR) 50 .25% per degree °C has to be applied on the rated voltage (D.C.1h at +125 °C. and A.63 . Four layers: aluminium.5 5.1 1.5 5.4 x VR (2 s.7 μF Capacitance values E12 series Capacitance tolerances Standard: K = ± 10 % M = ± 20 %. tracks .5 3. applications at high frequency. 56 days) │∆C/C│≤ 7%. On packaging only. IR ≥ 50% of the limit value Rapid change of temperature (1h at -55 °C.6 4.24 50.6 4.5 x VR (2 s.8 % (T = 25 ± 5 °C. see page 14) │∆C/C│≤ 3% │∆tgδ│≤ 50 x 10-4 IR ≥ limit value No mechanical damage Bending (1 to 6 mm deflection) │∆C/C│≤ 1% No visible damage on the terminations (pealing) neither on the body (cracking) Long term stability (2 years) │∆C/C│≤ 3% for sizes ≤ 22.│∆tgδ│≤ 50 x 10-4. charging time: 1 min. 55 / 125 / 56 Dissipation (A.SMD Film Capacitors LDE series . Charging voltage: 10 VDC for VR < 100 VDC 100 VDC for VR ≥ 100 VDC Surge voltage test 1.40 60.250 .8% Insulation resistance ≥ 1 GΩ for C ≤ 0.i.4 3.3 4.C.25 x VC) │∆C/C│≤ 5%.Stacked technology. This is due to the high current flowing through the capacitor’s Equivalent Series Resistance.30 28. 1. (J = ±5% available upon request and review of project/application) Dissipation factor (tgδ) ≤ 0.) Size range When a capacitor is used in A.6 2. nickel. in the worst operating conditions in °C) Size H max [mm] Tests and performances Damp heat (40°C/93% R.54 (customized sizes available upon request) Capacitance range 1000 pF to 4. For temperatures between 105 and 125 °C a decreasing factor of 1.H. The formula to calculate the maximum power [W] dissipated by the capacitor is the following: Pc max = 12. 1000 cycles) │∆C/C│≤ 5% │∆tgδ│≤ 50 x 10-4 IR ≥ limit value No mechanical damage Reflow (as per reflow recommendations.10 18.20 │∆C/C│≤ 2% for sizes > 22.│∆tgδ│≤ 50 x 10 . T = 25 ± 5 °C) for VR ≤ 630 VDC 1. Non inductive .

250 vdc rated voltage) (Sinusoidal wave form / th* ≤ 85°C) Note: measurements performed in free air condition *Th: maximum ambient temperature surrounding the capacitor or hottest contact point .pen dielectric rohs 6 maximum vrms and irms vs.SMD Film Capacitors LDE series .i. tracks .100 .e. frequency (50 .63 . in the worst operating conditions in °C 07/2008 10 .whichever is higher.

1000 vdc rated voltage) (Sinusoidal wave form / th* ≤ 85°C) Note: measurements performed in free air condition *Th: maximum ambient temperature surrounding the capacitor or hottest contact point . tracks .pen dielectric rohs 6 maximum vrms and irms vs.SMD Film Capacitors LDE series .e.i.whichever is higher.630 . in the worst operating conditions in °C 11 07/2008 . frequency (400 .

1 18.C5 .5 LDBCB2220 .12 4000 1.N = Taped.7 LDBCC2560 .06 3000 1.C5 .- 0.1 LDBCA1470 .- 0.C5 .- 12.1 LDBAA2220 .1 LDBCA1680 .C5 .7 +0.039 µF 0.06 3000 1.C5 .C5 .7 LDBCC2680 .12 3000 2.C5 .- 0.3 .1 LDBAA2270 .C5 .033 µF 0.- 0.0.06 3000 1.047 µF 12.C5 .C5 .1 LDBAA2180 .012 µF 0.- 8200 pF 0.- 0.10 3.- 12.7 LDBAB2560 .C5 .010 µF Size code Pcs per reel Hmax [mm] Part number 0.10 2250 1.06 3000 1.10 µF 12.06 3000 1. Packaging . A to Z = Special.C5 .7 LDBAB2820 .2 2.7 LDBCC2820 .015 µF 12.- 18.C5 .C5 .4 LDBCB2150 .3 +0.06 3000 1.068 µF 12.- 0. Internal use ±2% Tolerance available Size code L (mm) 12.06 3000 1.C5 .10 2250 1.1 LDBCA2120 .10 2250 1.SMD Film Capacitors LDB series .10 2250 1.082 µF 0.- 4700 pF 5600 pF 12.- 12.- 12.- 5600 pF 6800 pF 12.- 6800 pF 8200 pF 12.06 3000 1.1 12.12 4000 1.06 3000 1.C5 .12 4.C5 .3 LDBAA2470 .10 2250 1.3 3.5 LDBCB2180 .3 +0.- 0.C5 .015 µF 0.10 µF Tolerance .2 W (mm) 1.06 3000 1.10 2250 1. J = ±5%.1 LDBCA1820 .056 µF 0.0 LDBCC3100 .7 ± 0.- 12.022 µF 12.010 µF 12.1 LDBCA1560 .033 µF 12.082 µF 12.068 µF 0.1 LDBCA2100 .012 µF 12.047 µF 0.C5 .C5 .C5 .1 LDBAA2150 .- 12.1 LDBCA1330 .- 18.3 .- 3900 pF 4700 pF 12.C5 .C5 .C5 .G = ±2%.C5 .C5 .0.7 LDBCB2330 .5 LDBCB2270 .3 P/N 5 digit A B C th 07/2008 12 .5 ± 0.027 µF 12.06 3000 1.9 LDBCB2390 .- 18.3 .027 µF 0.0 LDBAB3100 .- 12.022 µF 0.pps dielectric rohs 6 ree F ead L Standard version Rated capacitance 16 VDC 50 VDC Size code Pcs per reel Hmax [mm] Part number Rated capacitance 3300 pF 12.- 0.1 LDBAA2330 .7 LDBAB2680 .C5 .10 2250 2.039 µF 12.3 LDBCB2470 .- 3300 pF 3900 pF 12.- 0.06 3000 1.018 µF 0.C5 .C5 .10 2250 1.1 LDBAA2120 .06 3000 1.- 0.10 2250 1.- 12.06 3.018 µF 12.C5 .06 3000 1.3 ± 0.06 3000 1.1 LDBCA1390 .12 4000 1.0.- 0.2 LDBAA2390 .- 0.06 3000 1.056 µF 12.C5 .10 2250 1.10 2250 2.- 0.- 18.

rated voltage Size range 12.25 % per degree °C has to be applied on the D.│∆tgδ│≤ 30 x 10-4. Terminations Four layers: aluminium.1h at +125 °C.25 x VC) │∆C/C│≤ 3%.6 % (T = 25 ± 5 °C. nickel.12 Capacitance range 3300 pF to 0. T = 25 ± 5 °C) Tests and performances Damp heat (40 °C / 93% R. brass.IR ≥ 50% of the limit value │∆C/C│≤ 3% Rapid change of temperature (1h at -55 °C.IR ≥ 50% of the limit value Endurance (125 °C. 1000 cycles) │∆tgδ│≤ 50 x 10-4 IR ≥ limit value No mechanical damage Reflow (as per reflow recommendations. Winding Non inductive . For temperatures between 105 and 125 °C a decreasing factor of 1. Climatic category 55 / 125 / 56 Electrical data Operating temperature range -55 to + 125 °C Rated voltage (VR) 16 .C. 2000 h. see page 14) │∆C/C│≤ 3% . Marking On packaging only. charging time: 1 min.06 to 18.technical data Plates Aluminium layer deposited by evaporation under vacuum.50 VDC Category voltage (VC) VC = VR up to 105 °C. Charging voltage: 10 VDC for VR = 16 VDC 50 VDC for VR = 50 VDC Surge voltage test 1. MIL HDBK 217) Failure rate ≤ 1 Fit 1 Fit = 10-9 failures / (components * hours) 13 07/2008 . IR ≥ limit value No mechanical damage Bending (1 to 6 mm deflection) │∆C/C│≤ 1% No visible damage on the terminations (pealing) neither on the body (cracking) Long term stability (2 years) │∆C/C│≤ 1% Reliability (REF..75 x VR (5 s.1 μF Capacitance values E12 series Capacitance tolerances ± 2 % (G).SMD Film Capacitors LDB series . 1. f = 1 kHz) Dielectric absorption 0.│∆tgδ│≤ 50 x 10-4 . pure tin. ± 5 % (J) Dissipation factor (tgδ) ≤ 0.Stacked technology.pps dielectric rohs 6 .│∆tgδ│≤ 30 x 10-4.H. 56 days) │∆C/C│≤ 5%.02% Insulation resistance ≥ 3 GΩ Test conditions: T = 25 ± 5 °C.

7 3.10 2.3 4.2000 > 2000 Capacitor Hmax [mm] < 1.7 2.4 2.6 .3 1.6 10. the temperature on the capacitor’s surface is lower than 50 °C. Reflow temperature profile Linear profiles are also allowed (if in line with the reflow recommendations) Landing areas and solder paste suggestions Size ** A [mm] B [mm] C [mm] D [mm] 12. June 2007 with some limitations * For LDB series this value is 260 °C.3 9.2.1 28.4 ** For customized sizes.6 13.54 12. 07/2008 14 . in line with JEDEC STD 020D ed.1 2.9 8.0 1.SMD Film Capacitors Soldering recommendations and cautions Reflow recommendations Preheating Maximum preheating time: 180 s Minimum temperature: 150 °C Maximum temperature: 200 °C Maximum time within Tmax and Tmax .9 60.2 18.12 3.06 1.6 2.9 40.7 15.6 255 °C * 255 °C * 255 °C * 1.40 9.2 13.6 2.5 255 °C * 250 °C 245 °C > 2.1 2.5 18.6 2. thickness: 0. although not optimal for RoHS 6.20 4.3 4.6 8.10 ÷ 0.5 22. a minimum peak considered still valid.4 50. before the second reflow.1 6. specific landing areas suggestions are available These new landing area dimensions have the aim of taking full We suggest to use a Sn / Ag / Cu solder paste (suggested advantage of the new RoHS 6 terminations design. temperature of 210 °C on the component’s body is suggested.5 250 °C 245 °C 245 °C Second reflow if two reflow processes are needed.15 mm).30 7.1 3.5 °C (∆T5): 30 s (Tmax ≤ 250 °C) 10 s (250 °C < Tmax ≤ 255 °C *) Maximum time over 217 °C (∆T217): 150 s Maximum temperature on the component’s body (Tmax): Maximum temperature ramp rate: 3 °C / s (heating) 6 °C / s (cooling) Capacitor volume [mm3] < 350 350 .3 5.5 1. The preceding layout (2004 Catalogue) is therefore to be If a NOT Lead Free solder paste is used. be sure that.24 5.5 12.

Our recommendations are the following (see Fig. - if the soldering iron is equipped with a temperature controller device: set the temperature to 250 ± 3 °C and proceed as per Fig. Therefore please pay careful attention: - never touch the capacitor body with the sodering iron but rather touch the soldering iron and the end termination with the tin wire edge (see Fig. 3) wait a few seconds and check that the soldering joint has been properly created. it is absolutely necessary to protect the components against humidity.1%. Xylene and Trichloroethylene should not be used. clearly. - if the soldering iron is NOT equipped with a temperature controller device: this is the worst situation.SMD Film Capacitors Soldering recommendations and cautions Flux / Cleaning / Storage and Moisture Flux suggestions We suggest to use a no-clean flux with a halogen content lower than 0. Manual assembly recommendations If PCBs are assembled manually. move the soldering iron away as quickly as possible. pick & place machines and reflow soldering systems. components may stay in areas with controlled temperature and humidity (temperature ≤ 30 °C / relative humidity ≤ 60%) for 168 hours (rated voltage ≤ 100 VDC) or 696 hours (rated voltage > 100 VDC). 2) avoid any contact with the two cutting surfaces (C). deionized water or neutral pH detergents. 2) as soon as the tin wire starts melting. Cleaning suggestions To clean the PCB assembly we suggest to use a suitable solvent like Isopropyl Alcohol. If the reel inside the MBB is partially used. on both terminations. components require a baking (minimum time: 48 hours at 55 ± 5 °C) before the reflow. Arcotronics recommends to re-use the same MBB or to avoid areas without controlled temperature and humidity (see above). Solvents like Toluene. The following are a few practical suggestions but. 1): 1) when using tweezers. 3) a vacuum pen is recommended on the top and bottom surfaces (B). Fig. issues may occur because the typical temperature for manual soldering is around 350 °C. 1 Manual soldering recommendations LDE and LDB series have been designed for Surface Mount Technology. the operator’s experience is very important. care must be taken to avoid any mechanical damage to the components. After the MBB has been opened. Using a manual soldering iron. the operator’s experience is extremely important: 1) proceed as per Fig. is 5 s). If the above conditions are not respected. - if the soldering iron is equipped with a hot air flow device: set the hot air temperature to 250 ± 3 °C and do not send the hot air directly onto the capacitor plastic body. 2. 2 15 07/2008 . We can guarantee a 24 months shelf life (temperature ≤ 40 °C / relative humidity ≤ 90%). 2). Fig. avoid mass-mounting SMD Film Capacitors manually. For longer periods of time and / or higher temperature and / or higher relative humidity values. - in any case. In this situation. the components should be gripped across the two terminations (A). 2 (the maximum soldering time. Storage and moisture recommendations Arcotronics SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1.

page 14 capacitor damaged by a soldering iron see manual soldering recommendations. page 14 bad temperature distribution in the reflow oven check the reflow oven temperature distribution and variations landing area dimensions see landing areas suggestions.5 °C see reflow recommendations. page 14 no solder paste on the landing areas set the dispensing solder paste machine properly thermal profile parameters see reflow recommendations. small fissures on SMD Film Capacitors are not comparable to cracks on SMD Ceramics. 07/2008 16 . page 14 too high temperature ramp rate see reflow recommendations. page 15 too long time over 217 °C see reflow recommendations. Fissures do not influence in anyway SMD Film Capacitors’ reliability. page 15 capacitor damaged by a soldering iron see manual soldering recommendations. page 14 capacitor damaged by a soldering iron see manual soldering recommendations. page 15 too long time over 217 ° C see reflow recommendations. page 14 too long time within Tmax and Tmax . page 14 too high temperature ramp-up rate see reflow recommendations.5 °C see reflow recommendations. Therefore. page 14 solder paste quality see solder paste suggestions. page 14 not-uniform solder paste thickness on the landing areas set the dispensing solder paste machine properly wrong position of the capacitor on the landing areas set the pick & place machine properly thermal profile parameters see reflow recommendations. page 15 Note: small fissures on the capacitor’s cutting surface are actually slight detachments of two adjacent metallized film layers and have to be considered only as an aesthetic issue related to the SMD Film Capacitors’ manufacturing process and technology. page 14 solder paste quality see solder paste suggestions. page 14 too long time within Tmax and Tmax . page 14 bad temperature distribution in the reflow oven check the reflow oven temperature distribution and variations oxidated end terminations see moisture recommendations.SMD Film Capacitors Production process basic suggestions In case of: no solder joint on one end termination no solder joint on both end terminations capacitor’s body mechanical deformation capacitance drop (up to 20%) capacitance drop (over 20%) Typical cause Typical solution landing area dimensions see landing areas suggestions.

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