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Interface Transceiver of RS-232 Standard with One Supply Voltage
The ILX3232 is a 3V powered EIA/TIA-232 and V.28/V.24 communication interface with low power requirements, high data-rate capabilities. ILX3232 has a proprietary low dropout transmitter output stage providing true RS-232 performance from 3 to 5.5V supplies. The device requires only four small 0.1 µF standard external capacitors for operations from 3V supply. The ILX3232 has two receivers and two drivers. The device is guaranteed to run at data rates of 250Kbps while maintaining RS-232 output levels. Typical applications are Notebook, Subnotebook and Palmtop Computers, Battery Powered Equipment, Hand-Held Equipment, Peripherals and Printers.
• 300 µA SUPPLY CURRENT • 120Kbps MINIMUM GUARENTEED DATA RATE • 3V/µs MINIMUM GUARANTEED SLEW RATE • ENHANCED ESD SPECIFICATIONS: ±15kV IEC1000-4-2 Air Discharge • AVAILABLE IN DIP-16, SO-16,TSSOP16 AND SOP16L(W)
SOP16L(W) Ordering Information ILX3232N Plastic DIP ILX3232D SOIC ILX3232TSD TSSOP ILX3232DW SOP(W) ТА= from -40 to 85 оС for all packages
January 2009, Ver. 04
3 to 6 (VCC .3) to 7 0.ILX3232 PIN DESCRIPTION PlN N° 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 SYMBOL C1+ V+ C1 C2+ C2 VT2OUT R2IN R2OUT T2IN T1IN R1OUT R1IN T1OUT GND VCC NAME AND FUNCTION Positive Terminal for the first Charge Pump Capacitor Doubled Voltage Terminal Negative Terminal for the first Charge Pump Capacitor Positive Terminal for the second Charge Pump Capacitor Negative Terminal for the second Charge Pump Capacitor Inverted Voltage Terminal Second Transmitter Output Voltage Second Receiver Input Voltage Second Receiver Output Voltage Second Transmitter Input Voltage First Transmitter Input Voltage First Receiver Output Voltage First Receiver Input Voltage First Transmitter Output Voltage Ground Supply Voltage ABSOLUTE MAXIMUM RATING Symbol VCC V+ VV+ +|V-| TIN RIN TOUT ROUT tSHORT Transmitter Input Voltage Range Receiver Input Voltage Range Transmitter Output Voltage Range Receiver Output Voltage Range Transmitter Output Short to GND Time Parameter Supply Voltage Doubled Voltage Terminal Inverted Voltage Terminal Value -0.2 -0.3 to -7 13 -0.3 to 6 ± 25 ± 13. 04 . but their absolute addition can not exceed 13 V.0. V+ and V-can have a maximum magnitude of +7V. Functional operation under these condition is not implied.3) Continuous Unit V V V V V V V V Absolute Maximum Ratings are those values beyond which damage to the device may occur.3 to (VCC + 0. January 2009. Ver.
3V VCC = 5V 0.= 0V VCC = 3V to 5V VCC = 5.4 2.C4 = 0.ILX3232 ELECTRICAL CHARACTERISTICS (C1 .2mA IOUT = -0.5V VCC-0.5 300 Typ.01 ±1 Typ.C4 = 0. 25 Unit V V V V kΩ VROH January 2009.1µF tested at VCC = 3V to 5.0V VCC = 3.0 10M ± 60 Ω mA Max.5V.1 V 0.5V.4 ± 4. Max.5 6 Max.C4 = 0. VCC = 3V to 5. unless otherwise specified. 5 10 Unit mA mA LOGIC INPUT ELECTRICAL CHARACTERISTICS (C1 .3V VCC = 5V T-IN Min. Typical values are referred to TA = 25°C) Symbol VTOUT Parameter Output Voltage Swing Transmitter Output Resistance Output Short Circuit Current Test Conditions All Transmitter outputs are loaded with 3KΩ to GND VCC = V+ = V.5mA IOUT = -1mA 3 VCC = 3.3V VCC = 5.8 0.1µF. 04 . TA = -40 to 85°C. unless otherwise specified.1µF. Ver.3V VCC = 5V VCC = 3.5V VCC = 3. 2 2.8 1. Typical values are referred to TA = 25°C) Symbol VRIN VRIL VRIH VRIHYS RRIN VROL Parameter Receiver Input Voltage Operating Range RS-232 Input Threshold Low RS-232 Input Threshold High Input Hysteresis Input Resistance TTL/CMOS Output Voltage Low TTL/CMOS Output Voltage High TA = 25°C IOUT = 1.5 1. 0.0V VOUT = ± 2V VOUT = 0V Min.5 1.4 ± 0. unless otherwise specified. Unit V RTOUT ITSC RECEIVER ELECTRICAL CHARACTERISTICS (C1 .2 1.6 0. Typ. Typical values are referred to TA = 25°C) Symbol VTIL VTIH Parameter Input Logic Threshold Low Input Logic Threshold High Test Conditions T-IN (Note 1) VCC = 3. ± 5.6mA IOUT = 3.3 5 7 2.5V. -25 TA = 25°C TA = 25°C TA = 25°C TA = 25°C VCC = 3.3V VCC = 5.4 V Test Conditions Min. ±5 ± 3. TA = -40 to 85°C.6 VCC-0.4 Typ.5V.1µF tested at VCC = 3V to 5. Typical values are referred to TA = 25°C) Symbol ISUPPLY Parameter VCC Power Supply Current No Load No Load Test Conditions VCC = 3V ±10% VCC = 5V ±10% TA = 25°C TA = 25°C Min. 2. unless otherwise specified. TA = -40 to 85°C. TA = -40 to 85°C. Max. VCC = 3V to 5.8 Unit V V V µA Input Leakage Current IIL Note1: Transmitter input hysteresis is typically 250mV TRANSMITTER ELECTRICAL CHARACTERISTICS (C1 .C4 = 0.
1 C3 0.C4 = 0.1 C2 0. Typical values are referred to TA = 25°C) Symbol DR tPHLR tPLHR tPHLT tPLHT |tPHLR .7 5.5 C1 0.1 Cbypass 0.ILX3232 TIMING CHARACTERISTICS (C1 .1µF.0 300 300 RL = 3KΩ to 7KΩ VCC = 3. Unit Kbps µs µs ns ns V/µs Transmitter Skew is measured at the transmitter zero cross points APPLICATION CIRCUITS CAPACITANCE VALUE (µF) VCC 3.tPLHT| SRT Parameter Data Transfer Rate Propagation Delay Input to Output Propagation Delay Input to Output Receiver Propagation Delay Difference Transmitter Propagation Delay Difference Transition Slew Rate RL = 3KΩ RXIN = RXOUT RL = 3KΩ Test Conditions CL2= 1000pF one trasmitter switching CL = 150pF CL = 2500pF Min. 120 Typ.tPLHR| |tPHLT . VCC = 3V to 5.5V.1 C4 0. TA = -40 to 85°C.3V TA = 25°C measured from +3V to -3V or -3V to +3V CL = 150pF to 1000pF 3 30 9. 04 . Ver.0 2. unless otherwise specified.1 January 2009.0 Max.0 to 5. 240 4.
1μF capacitors.3V.ILX3232 TYPICAL OPERATING CHARACTERISTICS (VCC = +3. LOAD CAPACITANCE WHEN TRANSMITTING DATA January 2009. 240kbps data rate. 0.) TRANSMITTER OUTPUT VOLTAGE vs. all transmitters loaded with 3kΩ. Ver. LOAD CAPACITANCE SLEW RATE vs. unless otherwise noted. TA = +25°C. 04 . LOAD CAPACITANCE SUPPLY CURRENT vs.
The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. For example. The ESD structure is for rugged applications and environments sensitive to electro-static discharges and associated transients. formerly IEC801-2. There are different methods of ESD testing applied: a) MIL-STD-883. January 2009.883. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The test circuit for IEC1000-4-2 is shown on Figure 2. the Air Discharge method and the Contact Discharge method.7 b) IEC1000-4-2 Air-Discharge The Human Body Model has been the generally accepted ESD testing method for semiconductors. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. 04 . they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. 1 ESD Test Circuit for Human Body Model The Contact Discharge Method applies the ESD current directly to the EUT.ILX3232 ESD PROTECTION The ILX3232 incorporates ruggedized ESD cells on all driver output and receiver input pins. Fig. is generally used for testing ESD on equipment and systems. With the Air Discharge Method. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. This method was devised to reduce the unpredictability of the ESD arc. This energy. In situations such as hand held systems. whether discharged directly or through air. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. This method is also specified in MIL-STD. the rise time of the discharge current varies with the approach speed. The simulation is performed by using a test model as shown in Figure 1. The IEC-1000-4-2. Method 3015. the ESD charge can be directly discharged to the equipment from a person already holding the equipment. For system manufacturers.7 for ESD testing. There are two methods within IEC1000-4-2. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. Method 3015. Ver. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The ESD tolerance is at least ±15kV without damage or latch-up. an ESD voltage is applied to the equipment under test (EUT) through air. is predominantly a function of the discharge current rather than the discharge voltage.
the SW2 switch is pulsed so that the device under test receives a duration of voltage. the current limiting resistor (RS) and the source capacitor (CS) are 330Ω an 150pF. ESD Test Circuit for IEC1000-4-2 Fig.5kΩ an 100pF. For the Human Body Model. 04 . the current limiting resistor (RS) and the source capacitor (CS) are 1. the current limiting resistor. The voltage stored in the capacitor is then applied through RS. For IEC-1000-4-2. 3. onto the device under test (DUT). ESD Test Waveform for IEC1000-4-2 stringent than the Human Body Model. In ESD tests. 2. The lower current limiting resistor increases the current charge onto the test point. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. respectively. The higher CS value and lower RS value in the IEC1000-4-2 model are more Device Pin Tested Driver Outputs Receiver Inputs IEC1000-4-2 Air Discharge ±15kV ±15kV Level 4 4 January 2009. Ver. Fig. the second switch (SW2) is on while SW1 switches off. The CS is initially charged with the DC power supply when the first switch (SW1) is on.ILX3232 The circuit models in Figures 1 and 2 represent the typical ESD testing circuits used for these methods. respectively. Now that the capacitor is charged.
D SUFFIX SOIC (MS .25 mm (0.25 (0. Maximum mold flash or protrusion 0.5 NOTES: 1.8 0.36 NOTES: 1. mm A 16 9 Symbol A MIN 9. mm 16 9 B 1 8 Symbol A B C MIN 18.25 0. 04 .25 mm (0.25 MAX 10 4 1. 2.010) per side.81 8.25 6. for B ‑ 0.51 1.33 0. Maximum mold flash or protrusions 0.38 0.1 0. “B” do not include mold flash or protrusions.1 MAX 19.010) M T K PLANE G H H J M J K L M N 10° 3.27 5. Dimensions A and B do not include mold flash or protrusion.19 5.69 7.36 1.62 0.010) M T C M K SEATING PLANE H J K M P R 8° 0.62 0° 2.56 1.8 3.ILX3232 N SUFFIX PLASTIC DIP (MS . January 2009.14 2.67 6.26 0.92 7.25 (0.SEATING N G D 0.35 0.006) per side for A.11 5.010) per side. Dimensions “A”.72 0° 0.2 0.001BB) A Dimension.75 0.33 F L D F 0.78 C -T.15 mm (0.012AC) Dimension.2 0.8 1.4 1.54 7.27 H B P B C 1 G 8 C R x 45 D F G J F M -TD 0. Ver.
ILX3232 January 2009. Ver. 04 .
Ver. 04 .ILX3232 SOP16L (W) Package January 2009.
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