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2

ZTE

2000 10 31

ZTE

1Signal Integrity

2Transmission Line

3Characteristic Impedance

VIZ0 Z0=V/I
4Reflection

5Crosstalk

6Overshoot

7Undershoot

8
Tpd TTL3 ~ 20nS
9
10~90%
Tr
90~10%Tf
10

TTLCMOS

11

12

13

ZTE

VOH

VOL
VIH
VIL
VT
VOHMIN
VOLMAX
VIHMIN
VILMAX
IOL
IOH

ZTE

..................................................................9

1.1. ....................................................................................................................................9
1.2. ................................................................................................................9
1.2.1. TTL ................................................................................................9
1.2.2. CMOS ............................................................................................9
1.2.3. ECL .............................................................................................10
1.3. ()...........................................................................................10
1.3.1. (0 ).....................10
1.3.2. ..........................................................................................10
1.3.3. ..........................................................................................12
1.3.4. ..........................................................................................................................13
1.3.5. ..........................................................................................................................13
1.3.6. ..........................................................................................................................13
1.3.7. ..........................................................................................................................14
1.4. ..............................................................................................................................14
1.4.1. ......................................................................................................15
1.4.2. ..........................................................................15
1.4.3. ......................................................................................................15
1.4.4. ..............................................................................................................15
1.5. ..................................................................................................................................16
1.5.1. ..............................................................................................16
1.5.2. ..............................................................................................16
1.5.3. ..................................................................................16
1.5.4. ......................................................................................16
1.5.5. ..............................................................................................................16
1.5.6. ..............................................................................................................16
1.5.7. PCB ......................................................................................................16
1.5.8. ......................................................................................................16
1.5.9. ......................................................................................................16
1.5.10. ................................................................................................................16
1.6. ..................................................................................................................................16
1.6.1. ......................................................................................................16
1.6.2. ......................................................................................................16
1.6.3. ......................................................................................................16
1.6.4. ..................................................................................................................16
2

...........................................................................................................17

2.1. ..........................................................................................................................17
2.1.1. GaAs(),,,....................................17
2.1.2. ......................................................................17
2.2. ......................................................................................................................19

ZTE

2.2.1. TTL...................................................................................................................................19
2.2.2. CMOS TTL.......................19
2.2.3. LVDS.................................................................................................20
2.2.4. ECLPECL.................................................................................................................20
2.3. ..................................................................................................................................25
2.3.1. ..........................................................................................................................25
2.3.2. V/I :...................................................................27
2.3.3. ..................................................................................................................29
2.3.4. NMDC......................................................................................................30
2.3.5. NMAC .....................................................................................................31
2.4. ..................................................................................................................................32
2.4.1. ..............................................32
2.4.2. ..................................................................................................................32
2.4.3. N.......................................................................................................................32
2.5. ..................................................................................................................33
2.5.1. ..................................................................................................................33
2.5.2. ..............................................................................................33
2.5.3. ..............................................................................................33
3

........................................................................................................................34

3.1. ..................................................................................................................................34
3.2. :.....................................................................................................................35
3.2.1. ..............................................................................................................36
3.2.2. ..........................................................................................................38
3.3. ..........................................................................................................................39
3.3.1. ..............................................................................................................39
3.3.2. ..................................................................................................................39
3.4. ..............................................................................................................................44
3.4.1. ..............................................................................................................................44
3.4.2. ..............................................................................................................................45
3.4.3. ..............................................................................................................................45
3.5. ..............................................................................................................................46
3.5.1. ..........................................................................................................................46
3.5.2. ..................................................................................................................47
3.5.3. ..........................................................................................................50
3.5.4. ..........................................................................................................50
3.6. ..........................................................................................................51
3.7. ..................................................................................................................................52
3.7.1. ......................................................................................................52
3.7.2. ..........................................................................................................................52
3.7.3. ..........................................................................................................................53
3.7.4. ..........................................................................................................................53
3.7.5. ..........................................................................................................................53
3.8. ..........................................................................................................................53

ZTE

3.8.1. ..............................................................................................................................53
3.8.2. ..................................................................................................................................54
3.8.3. ..................................................................................................................................54
3.8.4. ..................................................................................................................................54
3.9. ..........................................................................................................54
3.9.1. ..........................................................................................................................54
3.9.2. ..........................................................................................................................55
3.9.3. ..........................................................................................................................55
3.9.4. ..........................................................................................................................55
4

..................................................................................................56

4.1. ..................................................................................................................................56
4.1.1. ..................................................................................................................56
4.1.2. ..................................................................................................................................56
4.1.3. Plane.............................................................56
4.2. .................................................................................................................................56
4.2.1. ..............................................................................56
4.2.2. ..........................................................................56
4.2.3. ..........................................................................56
4.2.4. ..........................................................................56
4.2.5. ......................................................................................57
4.3. ..........................................................................................................................58
4.4. ..................................................................................................................58
4.4.1. ..............................................................................58
4.4.2. ..................................................................................59
4.5. ..................................................................................................................................60
4.5.1. ..........................................................................................................................60
4.5.2. ..........................................................................................................................60
4.5.3. ..............................................................................................................61
4.5.4. ..............................................................................................................61
4.6. ..................................................................................................................62
4.6.1. ..........................................................................................................................62
4.6.2. BULK....................................................................................62
4.6.3. ..................................................................................................................64
4.6.4. ......................................................................................65
4.6.5. ..........................................................................................65
4.6.6. ..............................................................................................66
4.6.7. ......................................................................................................................67
4.7. ..................................................................................................................................68
4.7.1. ..................................................................................................................68
4.7.2. ..........................................................................................................68
4.7.3. ......................................................................................................68
4.7.4. ......................................................................................................................68

ZTE

1
1.1.
(High-Speed Digital Design)

()
()
(Signal Integrity SI)

1.2.

(VOH)(VOL)(tr)(tf)

1.2.1. TTL
TTL LVTTL

V
VOH
VT

VOL

t
VOHmin=2.4V VOLmax=0.4V VT=1.5V30mV

1.2.2. CMOS
CMOS

V
VOH
VT
VOL

t
9

ZTE

VOHmin=4.44V VOLmax=0.5V VT=2.5V (+5V )


VOHmin=2.4V

VOLmax=0.4V VT=1.5V (+3.3V )

1.2.3. ECL
ECL

t
VOH
VBB
VOL
v
VOHmin=-0.96V VOLmax=-1.65V VBB=-1.29V30mV
IC

1.3. ()
TTL CMOS
TTL ECL
LVDSGTLNMOSPMOS

1.3.1. (0 )
IC IC

t
(R) V = I R

1.3.2.
a) IC IC

ZTE

10

VOL=IOLR

VOL

R
t

IOL

B A
: IC


b) IC IC
VOH=IOH R

IOH

11

ZTE

3.3V

VOH IOH

B A
: IC

1.3.3.
IC (+3.3V)+3.3V
V

:
IC
IC VCC (VCC
=IR)
TTL

P-N

ZTE

12


()
IC TTL

1.3.4.

IC

1.3.5.

IC
IC
IC


tr tf
()

tr tf

1.3.6.
IC ()

13

ZTE

Vt

1.3.7.

tr tw
()

Vt

t
()tr

1.4.

ZTE

14

1.4.1.
1.4.2.
1.4.3.
1.4.4.

15

ZTE

1.5.
1.5.1.
1.5.2.
1.5.3.
1.5.4.
1.5.5.
1.5.6.
1.5.7. PCB
1.5.8.
1.5.9.
1.5.10.
1.6.
1.6.1.
1.6.2.
1.6.3.
1.6.4.

ZTE

16

2
2.1.
2.1.1. GaAs(),,,
2.1.2.
2.1.2.1.
N P
2.1.2.1.1. PMOSP

-v-

p( )

+ 5v
a

V-

f = a bc

17

ZTE

2.1.2.1.2. NMOS:N

+ 5V

V
N

V0

f =a+b+c

2.1.2.1.3. CMOS

PMOS

NMOS

0 0.5A ,

2.1.2.2. N
P
2.1.2.2.1. TTL:
STTLLSTTLALSTTLASTTLFTTLLVTTL
2.1.2.2.2. ECL
ECL..ECL10KECL100KECL10HECL10EECL100E
ZTE

18

2.2.
2.2.1. TTL

VCC

V1

b
c

V0

V0 = a bc
ECL
VOHMIN=2.4V
VIHMIN=2V

VOLMAX=0.4V
VILMAX=0.8V

VT=1.5V

2.2.2. CMOS TTL

VI

V0

VOhmin =4.44V VOLMAX=0.5V


VIHMIN=3.5V VILMAX=1.5V VT=2.5V

19

ZTE

2.2.3. LVDS

A
NMOS

3.5mA

350mV

350mV

100

1.2mW350mV ECL
18214

2.2.4. ECLPECL

ZTE

20

21

ZTE

ZTE

22

23

ZTE

ZTE

24

Vcc

f
a

VBB

VEE
f = a +b +c

f = a +b +c

VOHmin=-0.96V VOLmax=-1.65V
VIHmin=-1.105V VILmax=-1.475V VBB=-1.29V
PECL ECLVEE VCCVCC TTL
VCC VOHMIN=-0.96V+ VCC

2.3.
2.3.1.

2.3.1.1. TTL

VI
2v
VI

V0

VT
0.8v

0.2

2.4V

0.4

3V

V 0 (V )

TTL
VOH 2.4vVOL 0.4vVIH 2vVIL 0.8v

25

ZTE

NM
2.3.1.2. CMOS :

V0
5
4.4

V1

V0

2.5
0.5
2.5

1.5

3.5

(v)

VI

TTL
TTL TTL
CMOS TTL TTL
2.3.1.3. LVDS

2.3.1.4. ECL

1.475 1.29 1.105


0.81
0.96

VI (v)
V1

0.81
0.96

V0

1.29

V0

1.65
1.85

V 0 (v )

VO VO ECL VO V1
NM

ZTE

26

2.3.2. V/I :
2.3.2.1. V/I

2.3.2.1.1. TTL V/I

I (mA)

Vcc

V1

VI(v)
0

0.8V 1.5V

2V

3V

TTL V/I
Vcc-0.8v/R0.05A
2.3.2.1.2. CMOS V/I

I (mA)

V1

V0
1

VI
(v)

CMOS V/I V1
0
2.3.2.1.3. LVDS V/I CMOS

27

ZTE

2.3.2.1.4. ECL V/I

Ib

V1

IC

I (mA)

IR

- 1.475

V1(V)

V1 -1.105V -0.4V I=Ib+IR Ib== IC / IR = V1 / R


V1 -1.475V I= IR V1 -0.04v IB V1 I

2.3.2.2. VO / I0 :
2.3.2.2.1. TTL VO / I0

I0(mA)
I0
V0
0.8 1.5

(v) V0

VO / I0

ZTE

28

I
2.3.2.2.2. CMOS VO / I0
VO / I0

I0

(mA)

(v) V0
VO / I0

I0 (mA)

0.5

1.5

2.5

3.5

(V) V0

2.3.2.2.3. LVDS VO / I0

I0(mA)

2.3.2.2.4. ECL VO / I0

VO

I0
IO = VO / RR

2.3.3.

V0 (V)

- 1.475

- 1.29

1.105

2.3.3.1. TTL 1.1mV/


3.3mV/

VOH + 1.1mV/C

(V)
VT 2.2mV/C
VOL 1.1mV/C
29

ZTE

(C) T

2.3.3.2. CMOS

2.3.3.3. LVDS

2.3.3.4. ECL

1.1mV/

2.5
T

1.1mV/C

VOH
VBB

1.1mV/C

VOL

0.7mV/C

(V)

2.3.4. NMDC
2.3.4.1. NHMDC
2.3.4.1.1. TTL NHMDC
NHMDC =VOHMIN VIHMIN =2.4V2V=0.4v=400mV
2.3.4.1.2. CMOS NHMDC
NHMDC= VOHMIN -VIHMIN =4.44V-3.5V=0.906V=906mV
2.3.4.1.3. LVDS

2.3.4.1.4. ECL NHMDC


NHMDC= VOHMIN -VIHMIN =-0.96V--1.105V=0.145V=145mV
2.3.4.2. NLMDC
2.3.4.2.1. TTL NLMDC
NLMDC =VILMAX -VOLMAX=0.8v-0.4v=0.4v=400mV
ZTE

30

2.3.4.2.2. CMOS NLMDC


NLMDC =VILMAX-VOLMAX=1.5v-0.5v=1v=1000mV
2.3.4.2.3. LVDS NLMDC

2.3.4.2.4. ECL NLMDC


NLMDC=VILMAX-VOLMAX=-1.475v--1.65v=0.175v=175mV

2.3.5. NMAC
2.3.5.1. NHMAC
2.3.5.1.1. TTL NHMAC
NHMAC =VIHMIN -VT+30mV=2v-1.53v=0.47v=470mV
30mV VT 30mV
2.3.5.1.2. CMOS NHMAC
NHMAC= VIHMIN -VT+30mV=3.5V-2.5V+30mV=0.97V=970mV
2.3.5.1.3. LVDS NHMAC

2.3.5.1.4. ECL NHMAC


NHMAC= VIHMIN -VBB+30mV=-1.105V--1.26V=0.155V=155mV
2.3.5.2. NLMAC
2.3.5.2.1. TTL NLMAC
NMAC =VT 30mV-VILMAX =1.5V-0.03V-0.8V=0.67V=670mV
2.3.5.2.2. CMOS NLMAC
NLMAC =VT 30mV-VILMAX =2.5V-30mV-1.5V=0.97V=970mV
2.3.5.2.3. LVDS

2.3.5.2.4. ECL NLMAC


NLMAC=VBB-30mV-VILMAX =-1.29V-0.03V--1.475V=0.155V=155mV

31

ZTE

2.4.
2.4.1.
2.4.1.1. TTL +5V 3.3V
2.4.1.2. CMOS +5V 3.3V 2.5V 1.8V
2.4.1.3. LVDS 3.3V
2.4.1.4. ECL -5.2V -3V +3.3VPECL +5VPECL

2.4.2.
10
2.4.2.1. TTL
12V5V
00V0.8V
2.4.2.2. CMOS
13.5V5V 2V3.3V
00V1.5V 0V0.8V
2.4.2.3. ECL
10.96V0.81V
01.65V1.85V

2.4.3. N
TTL
2.4.3.1. NDC
2.4.3.1.1. NHDC
100%

100%

VCE
VOH
400mV
2.4.3.1.2. MLDC

V 100%

ZTE

32

VCE VOL
400mV

2.4.3.2. NAC
2.4.3.2.1. NHAC
100%

dv/dtdI/dt

2.4.3.2.2. NLAC
100%

dv/dtdI/dA

2.5.
2.5.1.
2.5.2.
2.5.3.

33

ZTE

3
3.1.

0 tr tf tr=tf

f=1/T=1/tr+tf=1/2tr=0.5/tr
0.5/ tr

6nS
v=m/6*10-9s=16.66*107 m/s

A
I

L
++

V2
I

I
V1
B
I
I

E H
E= Q/4r2
V=Edr
E/ Q
r

ZTE

34

H dr
dB =

=I

I dr
4r 2

=Bdr
r

B/ 2
H/

V=d/ dt
V=Ldi/dt
V1 I EHB
V

C=Q/V

lR

lL

lC

lG

lL

lR

lG

lC

lR

lC

lL

lG

lL

lR

iin
Vin

lC

lG

lR

lL

lC

lR

lG

lC

3.2. :

35

lL

ZTE

lG

3.2.1.

lR

lL

ZS
lG
lCP
Z

ZS= R+jwL
l
: ZP =

1
1
=
l (G + jwc ) YP

Z1

Z2

Z3

Zs

Zs
a

Zs

Z1N

Zp
a

Zp

Zp

Z0

Z1N=Z1=Z2=Z3=Z0

ZS

Zp

Z1n

V1
l

ZTE

36

Z0

V2

Z 0 ZP
=Z0
Z 0 + ZP
ZS + ZS 2 + 4 ZSZP
: Z 0 =
2
l ( R + jwL ) 1
R + jwL
=
+
l 2 ( R + jwL ) 2 + 4
2
2
G + jwc
Z 1N = ZS +

f100KHZ=2fLc RG L
1
R + jwL
R + jwL
Z 0 =
4
=
= ZPZS
2
G + jwc
G + jwc
C

YP
] = ln 1( + YPZS )
ZS
A 2 A3
ln 1( + A) = A + , YPZS 1
2 3
r = YPZS = l ( R + jw )l (G + jw c)
r = ln 1[ + ZS

f1KHZ W=2f
L
Z0 =
C
Z0

Z0 =

R
G

Z0
()

100k

f (Hz)

Z0

37

ZTE

3.2.2.
l

I1N

ZS

v1

Zp

Z0

v2

l
ZPZ 0
1

Z
P
Z
0
ZP + Z 0 ZS +
( ZP + Z 0)
V 1 ZS ( ZP + Z 0) + ZPZ 0

=
V2
ZPZ 0
1
1
= 1 + ZS (
+ )
ZP Z 0

V 2 =V 1

=+j
v2=v1-r
v1- v1 v2
v1- j v1 v2

V1
) = ln e ( + j ) = + j = r
V2
1
1
= ln[ 1 + Zs ( + )]
zp z 0

ln(

r = ln{1 + ZS [

ZTE

38

l (G + jwc )
+ l (G + jwc )]}
ZS

YP
] = ln 1( + YPZS )
ZS
A 2 A3
ln 1( + A) = A + , YPZS 1
2 3
r = YPZS = l ( R + jw )l (G + jw c)
r = ln 1[ + ZS

1
=

LC
1
tpd = = LC
v

v=

3.3.

3.3.1.

RT
V
Z0
R0

3.3.2.

39

ZTE

Z0

V
ZC

RT

i
Z0

Z0 AB ZC A B
ZC=2Z01-0.374e-.29s/hZC=2Z01-0.48e-0.96s/h
h h
S
AB
ZC

A
RT
B

ZTE

40

41

ZTE

ZTE

42

43

ZTE

( A B )
A B C

3.4.
3.4.1.
d
Z0 =

60

ln(

4h
)
d

Z0 =
d

60
D
ln( )
d
r

h d r
ZTE

44

D d r
D d

D
Z0 =

120

ln(

2D
)
d

3.4.2.
3.4.2.1.

Z0 =

87
5.98h
ln(
)
r + 1.41 0.8w + t )

tpd = 1.107 0.475r + 0.6ns / m

3.4.2.2.

Z0 =

h'

t
h

8.7
5.98h
ln[
]
' r 0.8w + t

' r = r[1 e

1.55h '
h

tpd = 0.8475 ' r

3.4.3.
3.4.3.1.

t
h

3.4.3.2.

45

ZTE

z0 =

60
1 .9 ( 2 h + t )
ln[
]
0 .8 w + t
r

tpd = 1.017 r

h
Z0

t
c

80
1 .9 ( 2 h + t )
h
ln[
] * [1
]
0 .8 w + t
4( h + t + c )
r

tpd = 1.017 r

t
h

3.5.
3.5.1.
+

PX=iXVX=VX2/Z0
PL=iLVL=VL2/RL
PR=iRVR=VR2/E0
iL=ix-ir
VL= iL*RL = VX+ VR

is

iX

il

Z0

Vs

RL
V x V R Vl

l=x

ZTE

46

VX
ix =
Z0
VR
iR =
Z0
VX
VR
VX - VR

iL =
=
Z0
Z0
Z0
VX +
VR
VX - VR
=
RL
Z0
1
1
1
1
VX
(
) =
VR (
+ )
Z0
RL
Z0
RL
RL
Z0
RL
Z0

VR =
VX RL Z 0
=
VX
RL +
Z0
RL +
Z0
RL Z 0

VR
RL
Z0

V
L
=
=
=L
VX
RL +
Z0

R
=
R
S

Z0
+
Z0

S L

3.5.2.
RL =Z0 S=0

Vs

is
V

Z0
Z 0 + Rs

VL

V
47

V
Z 0 + Rs

Z0
Z 0 + Rs

V
Z 0 + Rs

iL
ZTE

RL Z0 RL =3Z0 Rs =Z0

Z0
V
=
Z 0 + RS
2
1
L = + , s = 0
2
1 V V
VR = L VX = =
(t = )
2 2
4
V V
3V
VL = Vx + VR = + =
(t = )
2 4
4
V V
3V
Vs = Vs + VR + s VR = + =
(t = 2 )
2 4
4
VS = V

Vs
V
2
0

is

3V
4

V
2Z 0

2 3

Vl

ZTE

2 3

2 3

iL

3V
4
0

3V
4Z 0
0

48

3V
4Z 0

2 3

RLZ0 RL=Z0/3 RS=Z0

Z0
V
=
Z0 + RS
2
1
L = S = 0
is
2
V
V
VR =V- (t = )
2Z 0
4
2Z 0
V V V
VL = VX + VR = = (t = )
V
2 4
4
V
4Z 0
V V V
VS =4Z
V0S + VR + SVR = =
(t = 2 )
2 4
4
VS = V

Vs

VL

iL

V
4

V
4Z 0
t

RS Z0
RS RS+ RS= Z0 s=0 L=1

Vs

VL
V

V
V
2
0 2 3

0 2 3
49

t
ZTE

sL

3.5.3.
2tpd
tr=2 tpd tpd = tr /2

l :
lv= tpd = tr/2

v6nS/m

l= tr/2v
tr=3nS :

L=3nS/(2*6nS/m)=1/4m=25cm

25cm 25cm

3.5.4.
3.5.4.1.

R1
Z0

R2

(TTL)

R1//R2 = Z0

Z0

(ECL)
RT

RT = Z0

3.5.4.2.

Z0

CT

RT

ZTE

50

RT+XCT=Z

CT TRC3tpd

3.5.4.3.

R0

Rs

Z0

R0 + RS = Z0
V/2
3.5.4.4.

Vcc
Z0

3.5.4.2 3.5.4.3 3.5.4.4 TTL/CMOS

3.6.

ic + iL

ic iL B

iL
Cm

Lm

RT
RT
D

51

ZTE

VT

ic + iL
ic iL

CD AB

V0

V0

D
tpd
2tpd

A
B

tr
t=0

KB V 0

tr

tr

Kf

V0
tr

1 Lm
Kf = (
CmZ 0 )
2 Z0
1
Lm
Kb =
(
+CmZ 0)
4tpd Z 0
Lm
Cm
Z0
l
tpd
LmCm Lm Cm
tr LV0 tr
2tr+ tpd V0 LmCm

3.7.
3.7.1.

trtpd

3.7.2.

ZTE

52

A B AB
LMIN
LMIN=0.85tr/tpd

3.7.3.
LMINZ0

3.7.4.

LMIN tpd Z0

3.7.5.

B
A
C

Z0=Z0/N

3.8.
3.8.1.

53

ZTE

3.8.2.

3.8.3.

3.8.4.

3.9.
3.9.1.

D
D =K
K =

ZTE

1
f
1

54

3.9.2.

3.9.3.

3.9.4.
tr tpd

55

ZTE

4.1.
4.1.1.
Power Distribution SystemPDS

4.1.2.

Plane

4.1.3. Plane
PDS

Z PDS =

100

4.2.
4.2.1.
4.2.2.
4.2.3.
4.2.4.

ZTE

56

VN +

4.2.5.
4.2.5.1.
XPSW = ESR + 2 f ESL
ESR
ESL

a)

L PDS =10 .16 X ln(

2H
)
D

nH

in
H in
D in
b)

L PDS

X H
= 31 .9
W ( N 1)

nH
H

N=2

H
W
N

in
in
in

57

ZTE

4.3.

PDS

PDS
PDS

PDS

PDS

PDS

TTLECL
PDS

4.4.
4.4.1.

PDS

ZTE

58

4.4.2.
+ =

0.1mm
0.15mm

0.5mm

0.15mm

0.1mm

0.15mm

0.5mm

0.15mm

B
A

0.1mm
0.1mm

0.15mm

1.0mm

59

ZTE

0.15mm

B
0.1mm

4.5.
4.5.1.

/ PCB

i( D) =

I0
1

H 1 + (D / H )2

I0 A
H m
D m
i(D) A/in

4.5.2.

E=

2 .6
A I L f 2
R

A cm2
IL A
ZTE

60

V/m

f MHz
R m

4.5.3.

nH

4.5.4.

4.5.3

L = 5 D ln(

nH

D
)
W

T10 90 L / R = 2.2

L
2 Z 0

Tr = (T10 90 L / R ) 2 +(T10 90 ) 2

61

ZTE

V L
Vcrosstalk =
Tr = 3.4
Tr LZ0C

Vcrosstalk =

1.52 V C L
(Tr ) 2

4.6.
4.6.1.
4.6.1.1.
RF

4.6.2. BULK
4.6.2.1.

4.6.2.2. 5
4.6.2.3.
a
b/
c
d
4.6.2.4.
aI
b V
c XMAX = V / I
d LPSW
f FPSW

ZTE

62

FPSW =

X MAX
2 LPSW

g Cbypass

Cbypass =

1
2 FPSW X MAX

h LC Fbypass

Fbypass =

X MAX
2 LC

4.6.2.5.
5V CMOS 100 10pF 5ns
100nH

I = NC

V
5V
= 100 10 pF
= 1A
t
5ns

V = 0.100 V

X MAX =

V
= 0.1
I

LPSW =100 nH

FPSW =

X MAX
= 159 KHz
2LPSW

LC=5nH

Cbypass =

1
2FPSW X MAX

Fbypass =

63

=10 F

X MAX
= 3.18 MHz
2LC

ZTE

4.6.3.
4.6.3.1.

LPDS

+
DC
Cbypass
CL

4.6.3.2. XPSW

a >

Ltot

Ltot =

X MAX
X
T
= MAX r
2 Fknee

b LC
c N

N=

LC
Ltot

d CParallel

C parallel =
ZTE

1
2 Fbypass X MAX
64

e Celement

Celement =

C parallel
N

5V CMOS 100 10pF 5ns


100nH LC=5nH

Tr = 5ns
Ltot =

X MAX = 0.1

Fbypass = 3.18MHz

X MAX Tr
= 0.159nH

C parallel =

1
2 Fbypass X MAX

Celement =

C parallel
N

N=

LC
= 32
Ltot

= 0 .5 F

= 0.016 F

4.6.4.
4.6.4.1.
a) NP0
b) X7R
c) Z5U
X7R NP0 Z5U Z5U
NP0 ESR
NP0

4.6.5.
4.6.5.1.

65

ZTE

4.6.6.
4.6.6.1. PCB

C plane =

0.225 r A
d

PF

A in2
d in
r

FR-4 r=4.5)
d=0.01 in
Cplane= 100pF/in2
100pF/in2 Cplane PF F

ZTE

66

4.6.7.
4.6.7.1.

Power
Dielectric
Ground

A
d

0.225
C=

4.6.7.2.

xA x er

er = 90 C =5nf /in 2

1- Comp
CORE
2- Signal
3- Power
4- Ground

CapCORE

5- Signal
CORE

PDS
6- Wire

6 Layer / 3CoreConstruction

67

ZTE

4.7.
4.7.1.
4.7.2.
4.7.3.
4.7.4.
GROUND BOUNCEGB
PCB
L2

L3
I

L1
PCB

GROUND BOUNCE

ZTE

68

CL

RL

GROUND BOUNCE

69

ZTE

ZTE

70

1Skilling,H.H , Electric Transmission Lines, New York .McGraw-Hill, 1951


2Kaupp.H.R. Characteristics of Microstrip Transmission Lines, IEEE Transactions on
Electronic Computers. Vol. Ec-16 NO2 April 1967, pp.185-193
3Cohn, S.B. Characteristics Impedance of the Shielded Strip Transmission Line, Transactions
IRE. Vol.. MTT-2, July 1954. pp52-57
4DeFalco, J.A., Reflections and Crosstalk in Logic Circuit Interconnections, IEEE Spectrum,
July 1970.pp44-50
5Blood, Jr., William R. MECL System Design Handbook4th Edition, Motorola Inc., 1988.
6B.L.Hart, Digital Signal Transmission Line Circuit Technology, Van Nostrand Reinhold,
New York, 1988.
7Charles S. Walker, Capacitance, Inductance and Crosstalk Analysis, Artech House,
Norwood, Mass., 1990
8T.C.Edwards, Foundations for Microstrip Circuit Design, John Wiley, New York, 1981.
9Harlan Howe, Stripline Circuit Design, Artech House, Norwood, Mass., 1974
10S.R.SESHARI, Fundamentals of Transmission Lines and Electromagnetic Fields AddisonWesley, Reading, Mass., 1971
11Clyde F.Coombs, Jr., Ed., Printed Circuits Handbook, McGraw Hill, New York, 1988.
12Bernard S. Matisoff, Handbook of Electronics Packaging Design and Engineering, 2nd
edition, Van Nostrand Reinhold, New York, 1990
13Raymond H. Clark, Printed Circuit Engineering: Optimizing for Manufacturabillity, Van
Nostrand Reinhold, New York, 1989.
14Henry W. Ott, Noise Reduction Techniques in Electronic Systems, John Wiley, New York,
1988.
15Bernhard Keiser, Principles of Electromagnetic Compatibility, 3rd edition, Artech House,
Norwood, Mass., 1987.
16Clayton R. Paul, Introduction to Electromagnetic Compatibility, John Wiley, New York,
1992.
17 Frederick E. Terman, Radio Engineers Handbook, McGraw-Hill, New York, 1943
18Robert A. Pease, Troubleshooting Analog Circuit, Butterworth-Neinemann, Stoneham,
Mass., 1991.
19DeHon.A. And Knight.T., Automatic Impedance Control, 1993 IEEE International Solid
State Circuits Conference Digest of Technical Papers, IEEE, New York, 1993.
20Dworsky, L., Modern Transmission Line Theory and Applications, Robert E. Krieger
Publishing Company, Malabar, Florida, 1988.
21Gabara, T., and Thompson, D., Ground Bounce Control in CMOS Integrated Circuitry,
1988, IEEE International Solid State Circuits Conference Digest of Technical Papers, IEEE,
New York, 1988.
22PCI Local Bus SpecificationProduction VersionRevision 2.1
23CX27470 Traffic Stream ProcessorReference ManualVersion 1.0
24MECL System Design HandbookFourth EditionWilliam R. Blood, Jr.
25LVDS Owners Manual2nd Edition
26Noise Reduction Techniques in Electronic SystemsHenry W. Ott, John Wiley, New York,
71

ZTE

1988.
27Principles of Electromagnetic Compatibility,Bernhard Keiser, 3rd edition, Artech House,
Norwood, Mass., 1987.
28Automatic Impedance ControlDeHon.A., And Knight.T., 1993 IEEE International
Solid State Circuits Conference Digest of Technical Papers, IEEE, New York, 1993.
29Ground Bounce Control in CMOS Integrated Circuitry,Gabara, T., And Thompson, D.,
1988, IEEE International Solid State Circuits Conference Digest of Technical Papers, IEEE,
New York, 1988.

ZTE

72

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