Design Guideline for HDI

Date: Dec.12, 2006

2.1.2.…… 9 Stack Up …………….... It is highly recommended to keep close communication with the PWB manufacture on details in case by case...1.………………….. 8 Selective ENIG + OSP …………………………………………………………………. VIA Plugging ………………………………………………………………. 10 6.…………………………………………………………… 10 3. 6. 7 4...………..1. SMT & BGA Area Design ………………………………………………………………………. 4. 4 2..………………….……………………………………….……………………………………………… 6 Solder Mask Design ……………………………………... 4 2. HDI Build up with RCC………………………………………………………………………… 5 Design Rule for 0. Technology Comparison ………..…….. 2. 2 HDI & BVH ……………………………………………………………………………………………….……………………………………………………. 7 4... 5.. HDI Build up with 1080 prepreg ………………………………………….Table of Contents: 1. Note: The intent of this design guide line is to assist the designer to capture the initial design in an efficient & straightforward flow. General Design …………………………………………………………………………………….5 Pitch BGA ………………………. Page: 1 ..………………………….

15mm 106 (45um) 1080 (65uml) RCC Tg 140 18” x 24” (463x616mm) 21” x 24” (539x616mm) 8.08mm 32-40mil thickness +/-0.8”x4.4” (250x112mm) 5. General Design Table 1 Description Capability Base material Laminate & prepreg FR4 (Tg 140.5” (142x140mm) 7.6” x 5.170.5” (142x165mm) 7.8mml thickness +/-0.4” (212x112mm) 5.5” (112x165mm) +/-0.10mm +/-10% Reason Tg 140 is more common & with lower cost Yield higher due to reduce jamming Better micro via formation with enhance laser drilling productivity.5”x4.10mm HDI dielectric material Glass prepreg LD & normal 106 (45um) LD&normal 1080 (65um) LD&normal 2113 (90um) RCC RCC (Tg 140 & 170) Halogen Free RCC (Tg 140) Working panel size standard Optimum array size for 18”x24” panel 10 arrays / working panel 12 arrays / working panel 12 arrays / working panel 15 arrays / working panel for 21”x24” panel 10 arrays / working panel 12 arrays / working panel 12 arrays / working panel 15 arrays / working panel Board thickness tolerance <0.3” x 4.10mm With buried via 0.4”x6.6”x6.4” x 5.15mm 0. RCC Tg 140 is more common & have longer shelf life Efficient manufacturability Higher material utilization Higher material utilization Efficient manufacturability Page: 2 .8” (191x123mm) 4.10mm >40mil thickness +/-10% Recommendation FR4 Tg 140C HF FR4 Tg 140C 0.220) Halogen free FR4 (Tg140) Minimum core thickness Without buried via 0.5”x4.1” (191x105mm) 4.08mm +/-0.1.5” (112x140mm) 9.

up to 25um Min.15mm Drill size 0.25mm 0.20mm Hole to feature +/-8% Impedance tolerance ENIG Surface finishing ENIG + OSP OSP Immersion Silver ENIG thickness Nickel 4-7um Gold 0. OSP: simple process flow.25mm +/-10% ENIG ENIG + OSP OSP Higher yield due to plating distribution through out the entire panel Recommendation 100/100 um 100/100 um Yield higher using 4mil Reason ENIG: simple process flow.05mm NPTH +/-0. higher cost. risk of black pads.5um Standard control +/-0.08mm +/-0.2-0.05mm Minimum drill size & pad size Finished hole size 0.20um hole wall copper thickness Blind & buried via Micro via Plated through hole OSP thickness Dimension tolerance Hole vs hole Hole vs edge Edge vs edge Min.05mm 0. General Design Continue of Table 1 Description Minimum lw/ls Capability Inner layer 75/75 um Outer layer 75/75 um Hole size tolerance PTH +/-0.1. up to 25um Min. shelf life & number of IR reflow restriction ENIG + OSP: complex process flow.5um +/-0.08mm +/-0.03-0.2-0.). up to 25um 0. thk.20mm Pad size 0.30mm 0.).05mml +/-0.20um Tighter process parameters control is required on 47um +/-0. 10um(absolute) 20um(ave. superior b 15um(ave.13mm +/-0. thk.40mm 0.05-0.10mm 3-8um 0.). 13um (absolute) IPC 6012A Class 2 12um(ave. 18um(absolute) 0. longer shelf life.50mm 0.13mm Special handling is required which may reduce productivity Page: 3 .10mm +/-0. thk.

P. 1080 Stackvia 65 65 65 150 200 20 20 280 535 Skipvia 100 100 300 300 300 535 Design Rule (Table 3) Microvia drill size Microvia pad size Buried via drill size Buried via pad size Through via drill size Through via pad size 150um 300um 300um 500um 300um 500um Stackvia drill size Stackvia pad size Skipvia drill size Skipvia pad size Microvia to buried via spacing Min line width/spacing 125um 300um 280um 535um 170um 100um/100um (preferred) 75um/75um (minimum) Page: 4 .P.3 HDI & BVH 3.P. 1080 P. 1080 P.1 HDI Build up with 1080 Prepreg 300 170 10 500 500 200 280 125 65 65 65 P.

2 HDI Build up with RCC 275 170 10 500 500 200 280 125 65 65 65 65 65 65 125 200 20 20 200 450 RCC RCC RCC Stackvia Skipvia 100 100 275 300 300 450 Design Rule (Table 4) Microvia drill size Microvia pad size Buried via drill size Buried via pad size Through via drill size Through via pad size 125um 275um 300um 500um 300um 500um Stackvia drill size Stackvia pad size Skipvia drill size Skipvia pad size Microvia to buried via spacing Min line width/spacing 125um 300um 200um 450um 170um 100um/100um (preferred) 75um/75um (minimum) Page: 5 .3 HDI & BHV 3.

5 Design rule 2: 250 87.5 Pitch BGA Design rule 1: 255 95 75 117.4. Design Rule of 0.5 75 275 395 370 Solder mask opening 500 Trace BGA pad Solder mask opening 500 Trace BGA pad Condition: Hole wall copper thickness: 20um Final conduct thickness: 30um nominal Solder mask registration: 47um Condition: Hole wall copper thickness: 15 um Final conduct thickness: 25um nominal Solder mask registration: 44um Page: 6 .

) 60um (50um min) BGA pad size S/M clearance S/M coverage of trace 250um (275um max. Solder Mask Design 4.5 pith BGA 44 500 500 Design rule for normal condition (Table 5) Min spacing for SMT pads with S/M web Solder mask web between SMT pad S/M clearance Design rule for 0.) 44um 44um Page: 7 .1 SMT & BGA Area Design 200 80 60 338 250 44 420 300 60 Trace between 0.4.5 pith BGA with trace (Table 6) 200um (170um min.) 80um (70um min.

6mm 0.4-1.5-1.4.6mm 0.5-1.8-1. Solder Mask Design 4.5mm >=95% >=95% >=95% >=95% >=90% >50% filled >50% filled >30% filled >50% filled >30% filled No Yes Yes Yes Yes Yes No No No No Board thickness Max finished hole size % of vias be plugged % of hole barrel filled Additional plug hole process Recommendation Page: 8 .6mm 0.4-1.2 Via Plugging: Table 7 Via covered by S/M on Via covered by S/M on Via with S/M opening on both sides both sides single side 0.6mm 0.4mm 0.3mm 0.6mm 0.6mm 0.6mm 0.

it will cause defect of OSP on ENIG pad or Ni/Au on OSP pad. Selective ENIG Spacing between ENIG pad & OSP pad: 2nd D/F A OSP PAD ENIG pad We use 2nd D/F covering OSP pad during ENIG process to prevent OSP pad being plated with Ni/Au.5. B C Symbol A B C Description Spacing between ENIG pad & OSP pad 2nd D/F tenting width for OSP pad 2nd D/F clearance for ENIG pad Capability 300um 150um 150um Recommendation 350um 175um 175um Page: 9 . If the spacing between ENIG pad & OSP pad is insufficient for 2nd D/F registration.

000 200.54 2 5 2 4 2 8 2 77.6.000 1.48 3 5 2 4 3 8 1 77.21 2 5 2 2 2 8 2 77.000 1.60 3 6 2 4 3 10 2 77.3mm EM220 ENIG+OSP 4/4 mils 0.000 200.3mm EM220 ENIG+OSP 4/4 mils 0.000 1.000 1.3mm EM220 ENIG+OSP 4/4 mils 0.54 2 5 3 4 4 8 2 77.3mm EM220 ENIG+OSP 4/4 mils 0.000 100.3mm EM220 ENIG+OSP 4/4 mils 0.000 200.17 1 5 1 2 1 8 3 49.000 100.000 100.25 2 4 1 4 2 6 1 49.000 1.10 Layer count Core count Total MC hole qty/pnl Total microvia qty/pnl Cost ratio Page: 10 .000 1.3mm EM220 ENIG+OSP 4/4 mils 0.000 200.3mm EM220 ENIG+OSP 4/4 mils 0. Stack up 6.3mm EM220 ENIG+OSP 4/4 mils 0.3mm 1+2+2+1 1+(4)+1 1+(2)+(2)+1 2+2+2 1+2+2+2+1 1+(6)+1 1+(2)+2+(2)+1 2+2+2+2 2+(4)+2 2+(2)+(2)+2 2+2+2+2+2 2+(6)+2 2+(2)+(2)+(2)+2 Stack up Process times Pressing Image transfer MC drilling Laser drilling Cu plating 1 4 1 2 1 6 2 49.16 1 4 3 2 3 6 2 77.000 1.000 200.000 100.000 1.3mm EM220 ENIG+OSP 4/4 mils 0.000 100.000 1.000 200.000 200.1 Technology Comparison Technology General information Material Surface finish Min LW/LS Min MC drill size EM220 ENIG+OSP 4/4 mils 0.000 1.75 2 6 4 4 5 10 3 98.3mm EM220 ENIG+OSP 4/4 mils 0.000 1.000 100.000 1.00 2 4 2 2 2 6 1 77.3mm EM220 ENIG+OSP 4/4 mils 0.3mm EM220 ENIG+OSP 4/4 mils 0.65 2 6 1 4 2 10 3 49.000 2.37 1 5 3 2 3 8 3 77.

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