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INTEGRATED CIRCUITS

DATA SHEET

SAA8116HL Digital PC-camera signal processor, microcontroller and USB interface
Objective specification File under Integrated Circuits, IC22 2000 Apr 13

Philips Semiconductors

Objective specification

Digital PC-camera signal processor, microcontroller and USB interface
FEATURES • High precision digital processing with 10-bit input • Embedded microcontroller (80C51 core based) for control loops Auto Optical Black (AOB), Auto White Balance (AWB), Auto Exposure (AE) and USB interface control • Compliant for VGA CCD and VGA CMOS sensors (RGB Bayer) • USB 1.1 compliant core • RGB processing • Optical black processing • Defect pixel concealment • Programmable colour matrix • RGB to YUV transform • Programmable gamma correction (including knee) • Programmable edge enhancement • Video formatter with SIF/QSIF downscaler • Compression engine • Flexible Measurement Engine (ME) with up to eight measurements per frame • Internal Pulse Pattern Generator (PPG) for wide range of VGA CCDs (Sony, Sharp and Panasonic) and frame rate selection • Programmable H and V timings for the support of CMOS sensors • Programmable output pulse for switched mode power supply of the sensor • 3-wire interface to control the TDA8787A: Correlated Double Sampling (CDS) circuit, Automatic Gain Control (AGC) circuit and 10-bit ADC • Analog microphone/audio input to USB: Low DropOut (LDO) supply filter, microphone supply, low noise amplifier, programmable amplifier, PLL and ADC • Integrated analog USB driver (ATX) • Integrated main oscillator including a clock PLL to increase the crystal frequency (from 12 to 48 MHz) • USB 1.1 compliant bus-powered USB device with integrated power management and POR circuit. APPLICATIONS

SAA8116HL

• USB PC-camera (video and audio). GENERAL DESCRIPTION The SAA8116HL is a highly integrated third generation of USB PC-camera ICs. It is the successor of the SAA8112HL and SAA8115HL. It processes the digitized sensor data and converts it to a high quality, compressed YUV signal. Together with the audio signal, this video signal is then properly formatted in USB packets. In addition, an 80C51 microcontroller derivative with five I/O ports, I2C-bus, 512 bytes of RAM and 32 kbytes of program memory is embedded in the SAA8116HL. The microcontroller is used in combination with the programmable statistical measurement capabilities to provide advanced AE, AWB and AOB. The microcontroller is also used to control the USB interface.

2000 Apr 13

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body 14 × 14 × 1.3 − MAX.6 V 3. 100 leads.Philips Semiconductors Objective specification Digital PC-camera signal processor.6 tbf UNIT V mA V V − − 300 +150 70 125 MHz % mW °C °C °C low voltage TTL compatible low voltage TTL compatible − − − −55 0 − 12 50 − − 25 − ORDERING INFORMATION TYPE NUMBER SAA8116HL PACKAGE NAME LQFP100 DESCRIPTION plastic low profile quad flat package.3 V.4 mm VERSION SOT407-1 2000 Apr 13 3 . 3. microcontroller and USB interface SAA8116HL QUICK REFERENCE DATA Measured over full voltage and temperature range: VDD = 3.6 V CONDITIONS MIN. SYMBOL VDD IDD(tot) Vi Vo f(i)xtal δ Ptot Tstg Tamb Tj PARAMETER supply voltage total supply current input voltage output voltage crystal input frequency crystal frequency duty factor total power dissipation storage temperature ambient temperature junction temperature Tamb = 70 °C VDD = 3.3 V ±10% and Tamb = 0 to 70 °C. Tamb = 25 °C VDD = 3. unless otherwise stated.6 V.0 − TYP. 3.0 V < VDD < 3.0 V < VDD < 3. Tamb = 70 °C 3. 3.

FV2 FH1. RESERVED3 FS. 18. VDDD2 Fig.. 77. 46. FH2 ROG CRST 97 RG BCP. 44. 43.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. 35.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.0 FCE673 Objective specification SAA8116HL VDDD1. 76. 6 SMP RESERVED1 23. 2000 Apr 13 FV3. 45 39. VDDA2 POWER MANAGEMENT 3 75. 31. 38. 87. 13. 32 54 49. 50 48. 53. FCDS 92 5. 98 91. . 68 AGND1 to AGND3 2 56.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. 37. 42. 17. SCL EA ALE. 99 VDD1 to VDD6 8 8. 22 GND1 to GND8 P0. white to force landscape pages to be . 15. 92 93 PXL9 to PXL0 11.. PSEN 34 70 71 4 89 28 29 33. 19. 55. 24 94 64 83.1 Block diagram. 21 6 7. 84 ANALOG MODULES LDO SUPPLY FILTER MICROPHONE SUPPLY AUDIO LOW NOISE AMPLIFIER 57 58 59 1. 2 3. FV4 H 95 VSP WINDOW TIMING AND CONTROL REFERENCE TIMING PULSE PATTERN GENERATOR MODE DECODER V 96 ASCLK PCLK 10 9 FV1. microcontroller and USB interface 4 GPI1 GPI2 GPI3 LED FULLPOWER SNAPRES PRIVRES SDA. 36 VIDEO FORMATTER COMPRESSION ENGINE TRANSFER BUFFER AUDIO DECIMATION VFC 80C51 MICROCONTROLLER USB INTERFACE AD14 to AD8 AUDIO PLL AUDIO ADC 85 74 73 80 79 82 86 POR 69 XSEL XIN XOUT ATXDP ATXDN DELAYATT PSEL PORE OSCILLATOR AND CPLL ATX SAA8116HL 2 72. 14. DCP RESERVED2. 12. 41. 16. 81 VDDA1. 30. 47. 100. 40. 78. 88. 20 LDOIN LDOFIL LDOOUT Y PROCESSING PREPROCESSING RGB RECONSTRUCTION RGB PROCESSING RGB TO YUV UV PROCESSING 60 MICSUPPLY 4:2:2 FORMATTER 61 62 MICIN LNAOUT STROBE SDATA SCLK 25 27 26 PRE-PROCESSING INTERFACE MEASUREMENT ENGINE PROGRAMMABLE AUDIO GAIN AMPLIFIER 63 PGAININ BLOCK DIAGRAM Philips Semiconductors Digital PC-camera signal processor. 52. 51.7 to P0.

bit 7 5 .address).6 P0.4 P0. bit 0 supply voltage 2 for the digital core ground 8 for input buffers and predrivers optical black clamp pulse output to TDA8787A dummy clamp pulse output to TDA8787A strobe signal output to TDA8787A or general purpose output of the microcontroller serial clock output to TDA8787A or general purpose output of the microcontroller serial data output to TDA8787A or general purpose output of the microcontroller snapshot input or remote wake-up trigger input (programmable) privacy shutter input or remote wake-up trigger input (programmable) supply voltage 2 for input buffers and predrivers ground 2 for input buffers and predrivers I2C-bus clock input/output (master/slave) I2C-bus data input/output (master/slave) general purpose input 1 (Port 4. bit 2 microcontroller Port 0 bidirectional (data . microcontroller and USB interface PINNING PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 2000 Apr 13 SYMBOL FV1 FV2 FV3 LED FS FCDS VDD1 GND1 PCLK ASCLK PXL9 PXL8 PXL7 PXL6 PXL5 PXL4 PXL3 PXL2 PXL1 PXL0 VDDD2 GND8 BCP DCP STROBE SCLK SDATA SNAPRES PRIVRES VDD2 GND2 SCL SDA GPI1 P0. bit 5 pixel data input.address).7 TYPE(1) O O O O O O P P I O I I I I I I I I I I P P O O O O O I I P P I/O I/O I I/O I/O I/O I/O I/O DESCRIPTION vertical CCD transfer pulse output vertical CCD transfer pulse output vertical CCD transfer pulse output output to drive LED data sample-and-hold pulse output to TDA8787A (SHD) preset sample-and-hold pulse output to TDA8787A (SHP) supply voltage 1 for output buffers ground 1 for output buffers pixel input clock SAA8116HL clock1 (pixel clock) or clock2 (2 × pixel clock) output for ADC or CMOS sensor pixel data input.2 P0. bit 4 microcontroller Port 0 bidirectional (data . bit 9 pixel data input.address). bit 4 pixel data input.address).address). bit 6 pixel data input. bit 6) microcontroller Port 0 bidirectional (data . bit 0 microcontroller Port 0 bidirectional (data . bit 7 pixel data input. bit 1 pixel data input.Philips Semiconductors Objective specification Digital PC-camera signal processor. bit 6 microcontroller Port 0 bidirectional (data . bit 8 pixel data input. bit 3 pixel data input.0 P0. bit 2 pixel data input.

Philips Semiconductors Objective specification Digital PC-camera signal processor. bit 5) analog supply voltage 1 for crystal oscillator (12 MHz. bit 0 microcontroller Port 2 output (address).internal or external program memory (active LOW) ground 7 for input buffers and predrivers supply voltage 1 for the digital core analog supply voltage for LDO supply filter external capacitor connection (filter of LDO) external capacitor connection (internal analog supply voltage for PLL. bit 4 microcontroller Port 2 output (address).address).3 P0. bit 6 address latch enable output for external latch SAA8116HL program store enable output for external memory (active LOW) microcontroller Port 2 output (address).5 P0.address). bit 1 supply voltage 3 for output buffers ground 3 for output buffers microcontroller Port 2 output (address). fundamental) oscillator output oscillator input analog ground 1 for crystal oscillator supply voltage 4 for input buffers and predrivers ground 4 for input buffers and predrivers analog ground 2 for ATX transceiver negative driver of the differential data pair input/output (ATX) 6 . bit 3 microcontroller Port 2 output (address). bit 5 microcontroller Port 0 bidirectional (data . bit 5 microcontroller Port 2 output (address). bit 4) general purpose input 3 (Port 3. amplifier and ADC external Power-on reset (backup) general purpose input 2 (Port 1. bit 1 external access select input . amplifier and ADC) microphone supply output microphone input low noise amplifier output programmable gain amplifier input test pin 1 (should not be used) reference voltage 1 (used in the amplifier and the ADC) reference voltage 2 (used in the ADC) reference voltage 3 (used in the ADC) analog ground 3 for PLL.address). bit 3 microcontroller Port 0 bidirectional (data . microcontroller and USB interface PIN 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 2000 Apr 13 SYMBOL P0.1 VDD3 GND3 AD8 AD10 AD12 AD14 ALE PSEN AD13 AD11 AD9 EA GND7 VDDD1 LDOIN LDOFIL LDOOUT MICSUPPLY MICIN LNAOUT PGAININ RESERVED1 REF1 REF2 REF3 AGND3 PORE GPI2 GPI3 VDDA1 XOUT XIN AGND1 VDD4 GND4 AGND2 ATXDN TYPE(1) I/O I/O I/O P P O O O O O O O O O I P P P − − O I O I O I I I P I I I P O I P P P P I/O DESCRIPTION microcontroller Port 0 bidirectional (data . bit 2 microcontroller Port 2 output (address).

microcontroller and USB interface PIN 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 Note 1.Philips Semiconductors Objective specification Digital PC-camera signal processor. connected with pull-up resistor on ATXDP (USB) test pin 2 (should not be used) test pin 3 (should not be used) crystal selection input (backup) POR selection input (backup) supply voltage 5 for output buffers ground 5 for output buffers full power signal output (active LOW) horizontal CCD transfer pulse output horizontal CCD transfer pulse output reset output for CCD output amplifier gate vertical CCD load pulse output switch mode pulse output for CCD supply horizontal synchronization pulse output vertical synchronization pulse input/output CCD charge reset output for shutter control vertical CCD transfer pulse output supply voltage 6 for output buffers ground 6 for output buffers 2000 Apr 13 7 . I = input. O = output and P = power supply. SYMBOL ATXDP VDDA2 DELAYATT RESERVED2 RESERVED3 XSEL PSEL VDD5 GND5 FULLPOWER FH2 FH1 RG ROG SMP H V CRST FV4 VDD6 GND6 TYPE(1) I/O P O I I I I P P O O O O O O O I/O O O P P DESCRIPTION positive driver of the differential data pair input/output (ATX) analog supply voltage 2 for ATX transceiver SAA8116HL delay attached control output.

2 35 P0.4 37 P0.2 Pin configuration.7 39 P0. 2000 Apr 13 8 .1 42 VDD3 43 GND3 44 AD8 45 AD10 46 AD12 47 AD14 48 ALE 49 SAA8116HL Fig. microcontroller and USB interface SAA8116HL 89 FULLPOWER 84 RESERVED3 83 RESERVED2 82 DELAYATT 100 GND6 81 VDDA2 80 ATXDP 88 GND5 78 AGND2 79 ATXDN 97 CRST 99 VDD6 87 VDD5 77 GND4 86 PSEL handbook. full pagewidth FV1 FV2 FV3 LED FS FCDS VCC1 GND1 PCLK 1 2 3 4 5 6 7 8 9 85 XSEL 93 ROG 94 SMP 91 FH1 90 FH2 98 FV4 92 RG 95 H 96 V 76 VDD4 75 AGND1 74 XIN 73 XOUT 72 VDDA1 71 GPI3 70 GPI2 69 PORE 68 AGND3 67 REF3 66 REF2 65 REF1 64 RESERVED1 63 PGAININ 62 LNAOUT 61 MICIN 60 MICSUPPLY 59 LDOOUT 58 LDOFIL 57 LDOIN 56 VDDD1 55 GND7 54 EA 53 AD9 52 AD11 51 AD13 PSEN 50 FCE674 ASCLK 10 PXL9 11 PXL8 12 PXL7 13 PXL6 14 PXL5 15 PXL4 16 PXL3 17 PXL2 18 PXL1 19 PXL0 20 VDDD2 21 GND8 22 BCP 23 DCP 24 STROBE 25 SCLK 26 SDATA 27 SNAPRES 28 PRIVRES 29 VDD2 30 GND2 31 SCL 32 SDA 33 GPI1 34 P0.6 38 P0.5 40 P0.3 41 P0.Philips Semiconductors Objective specification Digital PC-camera signal processor.0 36 P0.

Philips Semiconductors Objective specification Digital PC-camera signal processor. Tamb = 0 to 70 °C. Tamb = 25 °C − − 2 Digital data and control inputs LOW-level input voltage HIGH-level input voltage 0.0 5 3.1VDD VDD − − 10 V V Digital data and control outputs LOW-level output voltage HIGH-level output voltage 0 0.50 3. SYMBOL VDD Vn supply voltage voltage on pins GND and AGND all other pins Tstg Tamb Tj Note 1.6 3. Stress beyond these levels may cause permanent damage to the device. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 53 storage temperature ambient temperature junction temperature −0. microcontroller and USB interface LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134).0 V V V °C °C °C UNIT VDD + 0.6 75 16 V V V mA mA PARAMETER CONDITIONS MIN.3 3. note 1.5 −0.3 V. unless otherwise stated. SYMBOL Supplies VDD VDDD VDDA IDDD(tot) IDDA(tot) VIL VIH VOL VOH Vref VO IO supply voltage supply voltage for digital core analog supply voltage total digital supply current total analog supply current VDD = VDDD = 3.0 3.0 3.3 V ±10%.5 SAA8116HL MAX. −0.8 − 0.0 V − − − V V LDO supply filter reference voltage output voltage on pin LDOUT output current on pin LDOUT V V mA 2000 Apr 13 9 .0 − 3.3 V.0 PARAMETER MIN. MAX.3 − − − − − − 1.5 −55 0 −40 +4. +4. TYP.6 3.5 +150 70 +125 UNIT K/W CHARACTERISTICS VDD = VDDD = VDDA = 3.5VDDA VDDA = 3. Tamb = 25 °C 3.3 3.9VDD at 0. UNIT VDDA = 3.

note 1 A = 0 dB A = 30 dB 7. TYP.85 1.Philips Semiconductors Objective specification Digital PC-camera signal processor. UNIT 1.50 2.98 − − B ζ bandwidth damping − − Audio ADC (∑∆ converter) INPUTS fi Vi(rms) input signal frequency input voltage (RMS value) 1 − − 800 20 − kHz mV 2000 Apr 13 10 .2 − − 2.0 V − − − − 0. microcontroller and USB interface SYMBOL Microphone supply IDDA Vref VO IO supply current reference voltage output voltage on pin MICSUPPLY output current on pin MICSUPPLY at 0.5 − 28 − − − − 5.0 mA V V mA Audio low noise amplifier TRANSFER FUNCTION Ri IDDA A THD Vo(rms) VOO BIASING Iref input resistance supply current amplification total harmonic distortion output voltage (RMS value) output offset voltage note 1 3.2996 − 12.0 − − − 0.85 30 −70 − 0. note 1 A = 30 dB.0 − − − − note 2 − − − 10.0 0.5VDDA VDDA = 3.0 − 1.45 1.2880 − 2.2 32 −60 800 1.3 0.7 − PARAMETER CONDITIONS MIN.0 30 30 −78 −54 − − kΩ mA mV mV dB dB dB µA MHz MHz MHz MHz kHz reference current Audio phase-locked loop clock input frequency clock output frequency 48 8.6 2.5 0.0 14 − −83 −59 10 25 0. SAA8116HL MAX.19200 − 11.0 − kΩ mA dB dB mV mV µA reference current 10 Programmable audio gain amplifier TRANSFER FUNCTION Ri IDDA VOO A THD BIASING Iref fi(clk) fo(clk) input resistance supply current output offset voltage amplification total harmonic distortion A = 0 dB.

− − − − 5.6448 − −55 UNIT dB MHz % dB ATX transceiver full speed mode: pins ATXDP and ATXDN DRIVER CHARACTERISTICS tt(rise) tt(fall) tt(match) Vcr Zo fi(D) tframe Notes 1. 2. input voltage 3. Frequencies depend on PLL settings. TYP.0 42 − − ns ns % V Ω Mbits/s ms RECEIVER CHARACTERISTICS data input frequency rate frame interval 2000 Apr 13 11 .3 30 − − − − − − − 12. Transition time matching: t t ( match ) = -------------.Philips Semiconductors Objective specification Digital PC-camera signal processor.× 100% t f ( fall ) rise transition time fall transition time transition time matching output signal crossover voltage driver output impedance steady state drive CL = 50 pF CL = 50 pF note 4 4 4 90 1. The distortion is measured at HIGH level. SAA8116HL MAX.000 20 20 110 2.00 1. Defined here as: 20 × log -----------------------------------------------------------------------------equivalent input noise voltage t t ( rise ) 4. microcontroller and USB interface SYMBOL TRANSFER FUNCTION N Nbit Nbit(eq) DRi fclk δ THD order of the ∑∆ number of output bits equivalent output resolution (bit) dynamic range at input clock frequency clock frequency duty factor total harmonic distortion note 3 − − − − − − − 3 1 16 96.6 − 50 −70 PARAMETER CONDITIONS MIN. 1 kHz and Vo = 800 mV (RMS).

This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.7 to P0. FV4. .This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. microcontroller and USB interface EPROM (optional) AD14 to AD8 EEPROM P0. FCDS. FV3.0 12 MHz PSEN XOUT ALE SDA SCL XIN PCLK ASCLK PXL9 to PXL0 CCD SENSOR EA TDA8787A SDATA SCLK STROBE SAA8116HL DELAYATT XSEL LED SNAPRES PRIVRES PORE PSEL REF2 REF3 REF1 LNAOUT MICSUPPLY LDOOUT PGAININ MICIN LDOFIL FULLPOWER V-DRIVER FS. FH2.3 V FCE675 Objective specification SAA8116HL Fig. white to force landscape pages to be . BCP LDOIN 12 ATXDP ATXDN 5VBUS LDO USB FH1.. DCP. full pagewidth APPLICATION INFORMATION Philips Semiconductors Digital PC-camera signal processor. FV2.3 CCD sensor application.. RG. ROG LDO FV1.3 V 3. 2000 Apr 13 handbook. CRST SMP 3.

.4 CMOS sensor application.3 V FCE676 Objective specification SAA8116HL Fig. 2000 Apr 13 handbook.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.. full pagewidth Philips Semiconductors Digital PC-camera signal processor. microcontroller and USB interface EPROM (optional) AD14 to AD8 P0.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.0 EEPROM PSEN SDA SCL ALE EA 12 MHz XOUT XIN CMOS SENSOR V ASCLK PCLK PXL7 to PXL0 SAA8116HL DELAYATT XSEL LED SNAPRES PRIVRES PORE PSEL LDOFIL FULLPOWER REF1 LNAOUT PGAININ MICSUPPLY LDOOUT LDOIN REF2 REF3 MICIN 13 ATXDP ATXDN 5VBUS LDO USB LDO 3.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.. white to force landscape pages to be .7 to P0.3 V 3.

9 E (1) 14.15 0.0 Lp 0.15 0.45 v 0. OUTLINE VERSION SOT407-1 REFERENCES IEC 136E20 JEDEC MS-026 EIAJ EUROPEAN PROJECTION ISSUE DATE 00-01-19 00-02-01 2000 Apr 13 14 .6 A1 0.25 bp 0.09 D (1) 14.4 mm SAA8116HL SOT407-1 c y X 75 76 51 50 ZE A e E HE w M bp L pin 1 index 100 1 ZD bp D HD w M B v M B 25 v M A 26 detail X θ Lp A A2 (A 3) A1 e 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 100 leads.15 0.08 y 0.1 13. microcontroller and USB interface PACKAGE OUTLINE LQFP100: plastic low profile quad flat package. 1.85 θ 7 0o o 16.08 Z D (1) Z E (1) 1.9 e 0.05 A2 1.75 0.2 w 0.20 0.75 Note 1.25 15.85 1.27 0.5 HD HE L 1.17 c 0.25 16.25 mm maximum per side are not included.35 A3 0. body 14 x 14 x 1.75 15.1 13.Philips Semiconductors Objective specification Digital PC-camera signal processor. Plastic or metal protrusions of 0.45 1.

as solder bridging and non-wetting can present major problems. Manual soldering SAA8116HL If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several methods exist for reflowing. or for printed-circuit boards with high population densities. The footprint must incorporate solder thieves at the downstream end. pin transfer or syringe dispensing. Typical reflow peak temperatures range from 215 to 250 °C. In these situations reflow soldering is often used. for example. The top-surface temperature of the packages should preferable be kept below 230 °C. During placement and before soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26. microcontroller and USB interface SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles. Wave soldering is not always suitable for surface mount ICs.27 mm. The adhesive can be applied by screen printing. The footprint must incorporate solder thieves downstream and at the side corners. flux and binding agent) to be applied to the printed-circuit board by screen printing. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1. Integrated Circuit Packages” (document order number 9398 652 90011). the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. When using a dedicated tool. soldering and cooling) vary between 100 and 200 seconds depending on heating method. the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. the package must be fixed with a droplet of adhesive. • For packages with leads on four sides.27 mm. – smaller than 1. To overcome these problems the double-wave soldering method was specifically developed. Typical dwell time is 4 seconds at 250 °C. 2000 Apr 13 15 . infrared/convection heating in a conveyor type oven. The package can be soldered after the adhesive is cured. There is no soldering method that is ideal for all surface mount IC packages. Throughput times (preheating. stencilling or pressure-syringe dispensing before package placement. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Fix the component by first soldering two diagonally-opposite end leads. the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board.Philips Semiconductors Objective specification Digital PC-camera signal processor. Contact time must be limited to 10 seconds at up to 300 °C.

SQFP PLCC(3). 4.Philips Semiconductors Objective specification Digital PC-camera signal processor. HSOP. microcontroller and USB interface Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA. 3. HSQFP. SO. QFP. there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0. and as solder may stick to the heatsink (on top version).65 mm. it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0. it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0. Depending upon the moisture content. Wave soldering is only suitable for LQFP. refer to the Drypack information in the “Data Handbook IC26. If wave soldering is considered. TQFP SSOP. the maximum temperature (with respect to time) and body size of the package. VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP. All surface mount (SMD) packages are moisture sensitive. SOJ LQFP. HTSSOP. SMS not SAA8116HL REFLOW(1) 1. Integrated Circuit Packages.8 mm. The package footprint must incorporate solder thieves downstream and at the side corners. 2. Section: Packing Methods”. TSSOP. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved. 2000 Apr 13 16 . 5.65 mm.5 mm. For details. TQFP and QFP packages with a pitch (e) equal to or larger than 0. then the package must be placed at a 45° angle to the solder wave direction.

Stress above one or more of the limiting values may cause permanent damage to the device. 2000 Apr 13 17 .Philips Semiconductors Objective specification Digital PC-camera signal processor. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Exposure to limiting values for extended periods may affect device reliability. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. This data sheet contains preliminary data. Application information Where application information is given. This specification can be ordered using the code 9398 393 40011. or systems where malfunction of these products can reasonably be expected to result in personal injury. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances. it is advisory and does not form part of the specification. devices. microcontroller and USB interface DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values SAA8116HL This data sheet contains target or goal specifications for product development. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). supplementary data may be published later. This data sheet contains final product specifications.

Philips Semiconductors Objective specification Digital PC-camera signal processor. microcontroller and USB interface NOTES SAA8116HL 2000 Apr 13 18 .

microcontroller and USB interface NOTES SAA8116HL 2000 Apr 13 19 .Philips Semiconductors Objective specification Digital PC-camera signal processor.

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PHILIPS Pty Ltd. 96. Tel. Energoproject. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd. +381 11 3341 299.semiconductors... +65 350 2538. 7 Kehilat Saloniki St. 46200 PETALING JAYA. BANGKOK 10260. NSW 2140. Fax. Fax. MUMBAI 400 025. Fax. Tel. PO Box 18053.O. +353 1 7640 000. Tel. Fax. Tel. Fax. +44 208 730 5000. +46 8 5985 2745 Switzerland: Allmendstrasse 140. Blg. +63 2 817 3474 Poland: Al. Tel. 2nd floor. +972 3 645 0444. Taiwan Tel. Kohnan 2-chome. 6. Pasica 5/v. Brazil. 260-199 Itaewon-dong. Tel. SUNNYVALE. Tel. Publication thereof does not convey nor imply any license under patent. +1 800 234 7381. Tel. The Netherlands. P. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd. Tel.+381 11 3342 553 For all other countries apply to: Philips Semiconductors. Fax.P. +66 2 398 0793 Turkey: Yukari Dudullu. Tel. Tel. +27 11 471 5398 South America: Al. Tel. 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Tel. 252042 KIEV. Tel. 5600 MD EINDHOVEN. Trg N. +34 93 301 4107 Sweden: Kottbygatan 7. Fax. TEXAS 79905. +34 93 301 6312. 72 Tat Chee Avenue. Minato-ku. 2000 Internet: http://www. Floor 7. Tel. 28 81260 Umraniye. CA 94088-3409. HOMEBUSH. +33 1 4099 6161. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS. 4 Patrice Lumumba str.. Yongsan-ku. +64 9 849 4160. Fax. AUCKLAND. 6. Semiconductors Division. Fax. +81 3 3740 5130. TEL AVIV 61180. +46 8 5985 2000. +90 216 522 1813 Ukraine: PHILIPS UKRAINE. +353 1 7640 200 Israel: RAPAC Electronics.O. +61 2 9704 8139 Austria: Computerstr. Fax. Box 1041. 04547-130 SÃO PAULO. Printed in The Netherlands 753505/01/pp20 Date of release: 2000 Apr 13 Document order number: 9397 750 06807 . +43 1 60 101 1210 Belarus: Hotel Minsk Business Center.