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An array package with ball pitch < 1.0 mm. Chip sized package = package 1.2 x die size.
Package Acronym: CABGA
Name: Chip Array® Ball Grid Array Description: Die up wire bonded, overmolded configuration with ball pitches ranging from 0.5 mm - 1.0 mm. Lead/Ball Count Range: 8-288 Body Size Range: 5-19 mm2
Package Acronym: MLF
Name: MicroLeadFrame™ Package Description: A leadframe-based, near-chip scale package with solder lands instead of leads or balls. Short lead length and exposed die paddle offer improved thermal and electrical performance. Lead/Ball Count Range: 4-56 Body Size Range: 2-8 mm
Package Acronym: Stacked CSP
Name: S-CSP or Stacked Chip Scale Package Description: Two or more die stacked within a single package assembly. The S-CSP is an organic package that is wire bonded and overmolded in a chip scale package profile. Typical ball pitch range from 0.5 to 0.8 mm. Lead/Ball Count Range: Current Standard 72 Body Size Range: 8 x 10 mm, 8 x 11 mm, 8 x 12 mm
Package Acronym: CTBGA and CVBGA
Name: Thin and Very Thin ChipArray® Ball Grid Array Description: Thin core laminate and thin mold cap provide a 1.2 mm max height package. Allows denser routing for multi-chip packages. Lead/Ball Count Range: 36-208 Body Size Range: 5-15 mm2
Package Acronym: MLF-S
Name: MicroLeadFrame™ Simulated Package Description: An MLF package with the exact same foot print as standard surface mount leadframe packages to enable larger die and enhanced thermal and electrical performance. The body of the MLF-S is the same as the outside dimension including leads of a surface mount package. With few exceptions, MLF-S will have an exposed die attach pad. Manufactured in an array format.
Package Acronym: TQFP
Name: Thin Quad Flat Pack Description: Offers 1.0 mm body thickness with custom leadframe design available. Meets low-profile and portability requirements. Lead/Ball Count Range: 32-176 Body Size Range: 5-20 mm2
Package Acronym: etCSP™
Name: etCSP™ Description: Thinnest available BGA using full sized balls; only 0.5 mm max height. Near chip size; i.e., chip + 3 mm in diameter. Die face down configuration; wire bonding. Lead/Ball Count Range: 48-176 Body Size Range: 4-12 mm2
Package Acronym: PSOP
Name: PowerSOP® (Small Outline Package) Description: IC with 50% greater thermal efficiency than power-constrained SOICs. Low stand-off (.002") slug down and slug up (.003") versions with increased ability to dissipate heat. Lead/Ball Count Range: 8-44 Body Size Range: 150 x 194 mm, 11 x 15.9 mm
Package Acronym: Ultra CSP™
Name: Ultra CSP™ Description: True wafer level chip scale package incorporating a cost-effective thin film redistribution process to route the pads to JEDEC/EIAJ standard pitches and solder bump dimensions. Lead/Ball Count Range: 4-144 Body Size Range: 1.5-10 mm2
advanced package glossary
Flip Chip Technology
Package Acronym: fcMLF
Name: Flip Chip MicroLeadFrame™ Description: Flip chip package on a leadframe. High frequency, low inductance benefits. Also available in exposed pad version. Lead/Ball Count Range: 8-100 Body Size Range: 3-10 mm
Incorporates flip chip vs. wire bonding within current BGA and CSP families for performance and silicon utilization benefits.
Package Acronym: fcCSP
Name: Flip Chip CSP Description: Utilizes HDI thin core laminate. Die + 0.5 mm size. High frequency, low inductance benefits. Lead/Ball Count Range: 49-180 Body Size Range: 3-15 mm2
Package Acronym: SuperFC™
Name: Super Flip Chip Description: Highest routing density available due to state-of-the-art laminate substrates utilizing multi-layer, blind and buried vias, laser drilled build-up structures and ultrafine line/space metallization. Lead/Ball Count Range: 480 - 1932 Body Size Range: 27-45 mm2
Ball Grid Array
Amkor’s Ball Grid Array packages utilize solder balls to attach the package to the printed circuit board
Package Acronym: HPBGA
Name: High Performance BGA Description: High thermal performance, 8 or 10 metal layer, laminate based, cavity down, multi-tiered BGA. Standard ball footprints. Custom substrate designs only. Lead/Ball Count Range: 276-1036 Body Size Range: 35-45 mm2
Package Acronym: PBGA
Name: Plastic Ball Grid Array Description: A plastic overmolded product using a PCB substrate, die-up configuration, and eutectic solder balls as contacts, built in strip form. Lead/Ball Count Range: 119-1156 Body Size Range: 13-40 mm
Package Acronym: MCM-PBGA
Name: Multi Chip Module PBGA Description: A plastic overmolded product using PCB substrate with multiple die and eutectic solder balls as contacts; built-in strip format. Lead/Ball Count Range: 119-1156 Body Size Range: 13-40
Package Acronym: SBGA or SuperBGA®
Name: Super Ball Grid Array Description: High thermal performance, 2 metal layer laminate-based cavity-down BGA. Lead/Ball Count Range: 256-600 Body Size Range: 27-45 mm2
advanced package glossary ExposedPad™ Technology
Uses deep downset die paddle to provide higher power dissipation, low loop inductance and increase in available signal pins.
Package Acronym: ExposedPad™ SOIC
Name: ExposedPad™ Small Outline Integrated Circuit Description: SOIC incorporating ExposedPad™ technology. Lead/Ball Count Range: 8, 16, 24 Body Size Range: .150" x .194", .150" x .391", .300" x .607"
Package Acronym: ExposedPad™ TQFP
Name: ExposedPad™ Thin Quad Flat Pack Description: TQFP incorporating ExposedPad™ technology. Lead/Ball Count Range: 32-176 Body Size Range: 5-20 mm2
Package Acronym: ExposedPad™ SSOP
Name: ExposedPad™ Shrink Version of SOP Description: Shrink version of ExposedPad™ SOIC. Package external leads reduced to 25 mils. Leads: 25-50 Body Size Range: 150 mm2
Package Acronym: ExposedPad™ TSSOP
Name: ExposedPad™ Thin Shrink Small Outline Package Description: A thin, shrink version of SSOP plastic leadframe package using ExposedPad™ technology. Lead/Ball Count Range: 16-80 Body Size Range: 4.4 x 5.0 to 6.1 x 14.0 mm
Amkor’s tape packages utilize a flexible carrier tape to connect the chips to the package, substrate or board.
Package Acronym: TABGA
Name: TapeArray™ Ball Grid Array Description: fleXBGA® manufactured in an array format, typically extending the fleXBGA® to finer pitch and smaller packages. Lead/Ball Count Range: 48-672 Body Size Range: 5-17 mm2
Package Acronym: Tape-SBGA
Name: Tape SuperBGA® Description: Highest thermal performance, 1 metal layer flex based cavity-down BGA, custom substrates only. Lead/Ball Count Range: 168-1036 Body Size Range: 23-45 mm2
Package Acronym: µBGA®
Name: Micro Ball Grid Array Description: A die down, chip scale package using tab lead bonds to a polyimide tape substrate. Back side of die is marked and exposed. Lead/Ball Count Range: 40-54 Body Size Range: Custom = Die + 0.5 mm
Package Acronym: fleXBGA®
Name: fleXBGA® Description: A plastic ball grid array package using a polyimide film (tape) substrate with die up, wire bonded, overmolded configuration and eutectic solder balls. Lead/Ball Count Range: 132-672 Body Size Range: 12-27 mm2
advanced package glossary System in Package
System in Package is the modular design approach offering unprecedented flexibility in product development.
Package Acronym: SiP
Name: System in Package Description: A functional block or module, incorporating ICs, passive components, antennas, etc., used as a standard component in board level manufacturing.
There are many body sizes and lead count ranges available. Please contact your Amkor representative or visit Amkor at www.amkor.com for the most current product information.
is a registered trademark of Tessera, Inc.
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