3-DIMENSIONAL INTEGRATED CIRCUITS

Internal guide Mrs.B.Swapna Rani Assoc. Professor

Seminor co-ordnator Mrs.K.Lavanya Assi.Profssr

By G. Lokeshwar reddy 09k91a0428

OUTLINE:

INTRODUCTION

IDEA FOR 3D IC 3D IC ARCHITECTURE

ADVANTAGES OF 3D ICS PERFORMANCE CHARACTERISTICS APPLICATIONS

PRESENT SCENARIO IN 3D IC INDUSTRY

CONCLUSION

INTRODUCTION:
In electronics, a three-dimensional integrated circuit is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit.

In contrast, a 3D IC is a single chip in which all components on the layers communicate using on-chip signaling, whether vertically or horizontally.

IDEA FOR 3D IC:

The large growth of computer and information technology industry is depending on VLSI circuits with increasing functionality and performance at minimum cost and power dissipation and 2D ICs generate various gate delays and interconnection delay. So to reduce these delays and total power consumption, 3D IC technology is introduced. Intel introduced 80 core chip in 2007 which run on the frequency of 1.4GHz.

What is a 3D IC?

Could be Heterogeneous

Stacked 2D (Conventional) ICs

why 3D:

Reduces chip area

Performance and energy efficient

A scalable solution to multiple-core-on-chip design

Why 3D?

It Reduces Chip Area

Chip stacking brings neighboring circuits closer by exploiting routing in third dimension. As a result the chip area decreases.

Why 3D? It Reduces Communication Related Delay and Power

System power breakdown
Interconnect will occupy a major portion of chip delay and power in future. 3D ICs reduces wire length, thus cutting down wire delay and power.

Processor design and individual core component design in 3D (This work) highlights the above mentioned trends of 3D design.

Intel Corporation, SLIP04

ADVANTAGES OF 3D ICS
Demand of VLSI circuits with features:

1. Increased functionality. 2. low cost. 3. Less power dissipation.

Scaling problems of advanced 2D IC designs

Performance Characteristics
Timing
Energy

Timing
Reducing RC delays and increase chip performance

Energy performance
Wire length reduction has an impact on the cycle time and the energy dissipation
Energy dissipation decreases with the

number of layers used in the design Following graphs are based on the 3D tool described later in the presentation

BENIFITS:
Foot print.
Speed. Power. Design. Cost. Heterogenous integration. Bandwidth. Circuit security.

APPLICATIONS:
Digital cameras.
Digital audio players. PDAs. Smart cellular phones. Gaming devices. Memory cards.

PRESENT SCENARIO IN 3D IC INDUSTRY:

Many companies like MIT (USA), IBM are doing research on 3D IC technology and they are going to introduce cheaper chips for certain applications, like memory used in digital cameras, cell phones, handheld gaming devices etc.

The original cost will be 10 times lesser than the current

ones.

CONCLUSION:

New Generation of small size, less power dissipation,inexpensive chips

New world of design like city skyline Transformed skyscrappers,the world of chips may never look at the same again.

QUERIES???