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Retrieve Pure Component Property Data within Aspen HYSYS

Using Aspen HYSYS V8.0

Revised: November 26, 2012

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Objectives

Learn how to retrieve property data for pure components in Aspen HYSYS

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Background
Pure component data are needed for process design:
Densities of relevant components can tell us whether two liquid phases are easy to separate. The normal boiling point of a component can tell us whether it is a possible candidate as the solvent for an extractive distillation / azeotropic distillation process. Comparing the normal boiling points of two components can give us a rough idea whether it is easy to separate them via distillation.

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Key Teaching Points


The HYSYS Databank contains properties of pure components. This data can be used to make decisions about separation processes.

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Recommended Further Exercises


For extractive distillation, the normal boiling point of the selected solvent is typically much higher than the normal boiling points of the two components to be separated. Phenol is considered a good solvent for separation of the toluene/n-heptane binary mixture. Find out the normal boiling points of the following three components:
Toluene n-heptane Phenol

2012 Aspen Technology, Inc. All rights reserved

Copyright
Copyright 2012 by Aspen Technology, Inc. (AspenTech). All rights reserved. This work may not be reproduced or distributed in any form or by any means without the prior written consent of AspenTech. ASPENTECH MAKES NO WARRANTY OR REPRESENTATION, EITHER EXPRESSED OR IMPLIED, WITH RESPECT TO THIS WORK and assumes no liability for any errors or omissions. In no event will AspenTech be liable to you for damages, including any loss of profits, lost savings, or other incidental or consequential damages arising out of the use of the information contained in, or the digital files supplied with or for use with, this work. This work and its contents are provided for educational purposes only. AspenTech, aspenONE, and the Aspen leaf logo, are trademarks of Aspen Technology, Inc.. Brands and product names mentioned in this documentation are trademarks or service marks of their respective companies.

2012 Aspen Technology, Inc. All rights reserved