You are on page 1of 25

History:

SMT was developed in 1960s &


become popular in 1980s.

This technology was introduced by


IBM.
Surface Mount Technology, is a
method of constructingSMD: Surface Mount
electronic
Devices
circuit in which components(SMC:
surface mounted components) are
mounted directly onto the surface
of printed circuit board.
SMD:

SMD is smaller than its TH (through


hole) counterpart because it has either
smaller leads or no leads.
It may have short pins or leads of
various style.
SMD
terms:
SMD Expanded form
dialect
CC Chip carrier
LCC Leadless chip carrier
PLCC Plastic leadless chip carrier
LCCC Leadless ceramic chip carrier

MELF Metal electrode face bonding

MINI MELF Mini metal electrode face


bonding
MICRO MELF Micro metal electrode face
bonding
Why we need
SMT:

 Self inductance and mutual inductance are


both praportional to area of circuit.
Size of SMT parts is less than size leaded part.
Hence area of SMT circuitry is smaller.
SMT circuit can handle higher frequency than
traditional circuit.

Larger Smaller
area area
Comparison between
SMT & THT:
SMTSMT THT
THT
SMT
 SMD
Ithas canpackage
high be one
THT
TH components
It has are
low package
quarter to one tenth larger than SMT in
density. density.
Noin safty margins
size and for size
weight. It &
provides
weight.strong
SMT THT
mechanical strength of a mechanical connection
solder joint. at joints.
It faces the problem It has no such
of POPCORN effect. problems.
FUJI
SMT
PCB LINE

Surface
mounte
d PCB
Working Process of
SMT:
Screen Inspecti Chip
printer on shooter
Loader conveyo
r

Reflow Fine
oven Inspecti placer
Unloade on
r
Inspecti conveyo
on Rework r
system
station
Loader:

In this section we load the


programm to NC(numerically control)
machine to obtain desired circuit.

We define the position of


components that we want on PCB.
Screen
printing:

In this section we


use camera to take
picture of inserted
PCB.

Solder pad= Plating


of Gold or copper
without hole.

We apply solder


paste (mix. Of
Pb:36%, Sn:62%, flux
Ag/Au:2%) with height
Inspection
conveyor:

We inspect the thichness of


solder paste.

We put the PCB on conveyor


belt.
Chip
shooter:

It picks the SMDs


from plastic tape
and places them
on PCB.
Inspection
conveyor:

In this step we superwise the


position and placing on SMDs is
proper or not .
If the no. Of errors is less then we
mannually improve it, otherwise we
repeat the whole process.
Reflow
process:

In this step we send the PCB in


reflow soldering oven.

Here all the the components are


soldered uniformally.
Need for reflow
proffiling:

High quality and low defect soldering


required uniform and optimum temperature.

Here solder joint needs tobe similerly


heated to achieve identical soldering result.

Heat must be applied in identical to solder


joint.

The solder paste used and no. Of


components on PCB will determine the
Zone 1: Initial Pre-Heating Stage (Room
Temperature to 150°C)

Excess solvent is driven off


PCB & Components are gradually heated up
Temperature gradient shall be < 2.5°C/Sec to avoid:
•Splattering: fast evaporation of solvent and air
expulsion resulting in possible solder ball formation.
•Slump: fast separation of paste flux resulting in
possible bridge formation.
Zone 2: Soak Stage (150-180°C)

Flux components start activation and begin to reduce


the oxides on component leads, PCB pads, and solder
paste powder spheres.
PCB components are brought nearer to temperature
when solder bonding can occur.
Allows different mass components to reach the same
Zone 3: Reflow Stage (180-235°C)

Paste is brought to the alloy's melting point

Activated flux reduces surface tension at the


metal
interface so metallurgical bonding occurs.

Zone 4: Cool Down Stage (180°C to room


temperature)

Assembly is cooled evenly so that neither


excess intermetallics form or excess thermal
shock to the components or PCB occurs.
Rework
station:

Finally we inspect the PCB after


completion of process and if
there is any error is found it is
corrected in rework station.
Main
advantages:

High package density.

Better performance with high frequency


parts.

Lower inductance and reistance at the


connection.

Better mechanical performance under


shake and vibration condition.

Low cost and faster assembly.


Main
disadvantages:

The manufacturing process of SMT is more


sophisticated than THT .

SMDs cannot be used with breadboard.

Mannual component level repairing is very


complicated.
Conclusio
n:
In the era of machine and
technology the electronics
makes everything as simple as
ABC, and SMT is its important
tool which adds the feather to
its cap by reducing the size and
cost, and improving the
efficiency of its product.